WO2003089696A1 - Dislocation reduction in non-polar gallium nitride thin films - Google Patents

Dislocation reduction in non-polar gallium nitride thin films Download PDF

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Publication number
WO2003089696A1
WO2003089696A1 PCT/US2003/011177 US0311177W WO03089696A1 WO 2003089696 A1 WO2003089696 A1 WO 2003089696A1 US 0311177 W US0311177 W US 0311177W WO 03089696 A1 WO03089696 A1 WO 03089696A1
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mask
overgrowth
gallium nitride
polar
dislocations
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French (fr)
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Michael D. Craven
Steven P. Denbaars
James S. Speck
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University of California Berkeley
University of California, San Diego
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University of California Berkeley
University of California, San Diego
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Priority to EP03723982A priority Critical patent/EP1495169B1/en
Priority to AU2003230876A priority patent/AU2003230876A1/en
Priority to KR1020047016456A priority patent/KR101363377B1/ko
Priority to JP2003586403A priority patent/JP5254521B2/ja
Publication of WO2003089696A1 publication Critical patent/WO2003089696A1/en
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    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
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Definitions

  • the invention is related to semiconductor materials, methods, and devices, and more particularly, to dislocation reduction in non-polar gallium nitride (GaN) thin films.
  • polarization-induced electric fields affect the performance of current state-of-the-art optoelectronic and electronic nitride devices.
  • the polarization fields spatially separate electron and hole wave functions in quantum well (QW) structures, thereby reducing carrier recombination efficiencies in QW- based devices such as laser diodes and light emitting diodes (LEDs).
  • QW quantum well
  • the polarization fields induce large mobile sheet charge densities in transistor structures which employ nitride heterostructures. Discontinuities in total polarization result in the formation of fixed sheet charges at the corresponding interfaces or surfaces.
  • non-polar (1120) a- plane GaN films (referred to herein as a-GaN) have been grown on (1 102 ) r-plane sapphire substrates via metalorganic chemical vapor deposition (MOCND).
  • MOCND metalorganic chemical vapor deposition
  • the present invention is a novel application of those methods for a- GaN films. Specifically, the present invention describes a LEO method using a-GaN seed layers that achieves threading dislocation reduction. Low dislocation density a- GaN can be used as a buffer layer for high performance, polarization-induced field free (Al,B,In,Ga)N-based devices.
  • Lateral epitaxial overgrowth of non-polar (1120) a-plane GaN thin films reduces threading dislocations in the GaN films.
  • a thin patterned dielectric mask is applied to the seed layer.
  • a selective epitaxial regrowth is performed to achieve a lateral overgrowth based on the patterned mask.
  • the GaN films initially grow vertically through openings in the dielectric mask before laterally overgrowing the mask in directions perpendicular to the vertical growth direction. Threading dislocations are reduced in the overgrown regions by (1) the mask blocking the propagation of dislocations vertically into the growing film and (2) the bending of dislocations through the transition from vertical to lateral growth.
  • FIG. 1 is a flowchart that illustrates the steps for reducing threading dislocation densities in a-GaN through the lateral overgrowth of a planar heteroepitaxial "seed" layer, according to the preferred embodiment of the present invention
  • FIG. 2 is a plan- view scanning electron microscopy (SEM) image montage showing half of an a-GaN LEO wagon wheel pattern;
  • FIGS. 3(a), (b) and (c) are a series of SEM images with inclined views of the three stripes oriented parallel to [0001], [ 1101 ], and [ 1100 ], respectively;
  • FIGS. 4(a), (b) and (c) are cross-sectional TEM images of a [ 1100 ] stripe; and FIGS. 5(a), (b) and (c) are plan-view panchromatic CL images of stripes oriented parallel to [0001], [TlOl ], and [TlOO ], while FIG. 5(d) illustrates the crystallographic orientation for FIGS. 5(a), (b) and (c).
  • the present invention reduces threading dislocation densities in a-GaN through the lateral overgrowth of a planar heteroepitaxial "seed" layer.
  • Lateral overgrowth techniques require a processing step between two MOCVD growths, an initial heteroepitaxial growth and a regrowth that constitutes the lateral overgrowth.
  • a thin patterned dielectric mask is applied to the seed layer.
  • the GaN initially grows vertically through openings in the dielectric mask before laterally overgrowing the mask in directions perpendicular to the vertical growth direction.
  • dislocation densities are reduced in the laterally overgrown regions as compared to the regions that grow vertically through openings in the mask.
  • Dislocations are reduced in the overgrown regions by (1) the mask blocking the propagation of dislocations vertically into the growing film and (2) the bending of dislocations through the transition from vertical to lateral growth.
  • FIG. 1 is a flowchart that illustrates the steps for reducing threading dislocation densities in a-GaN through the lateral overgrowth of a planar heteroepitaxial "seed" layer, according to the preferred embodiment of the present invention.
  • Block 100 represents growing non-polar (1120) a-plane GaN thin films on a
  • heteroepitaxially-grown non-polar (1120) a-plane GaN thin film comprises a "seed layer" for the lateral overgrowth of the present invention.
  • Block 102 represents depositing a dielectric regrowth mask on the non-polar (1120) a-plane GaN film via plasma-enhanced chemical vapor deposition (PECVD).
  • the mask is comprised of, but is not limited to, 200 nanometers (nm) of SiO .
  • Block 104 represents patterning the deposited mask, wherein the pattern is transferred to the SiO2 using conventional photolithographic techniques and wet etching with buffered hydrofluoric acid.
  • the deposited mask is patterned with long, narrow stripe openings oriented in a variety of crystallographic directions.
  • Block 106 represents cleaning the sample using solvents.
  • Block 108 represents performing a selective epitaxial regrowth to achieve the lateral overgrowth based on the patterned mask, wherein the gallium nitride initially grows vertically through openings in the mask before laterally overgrowing the mask in directions perpendicular to a vertical growth direction. Dislocation densities are reduced in the laterally overgrown regions as compared to regions that grow vertically through openings in the mask. Moreover, dislocations are reduced in the overgrown regions by the mask blocking propagation of dislocations vertically into the growing film and by bending of dislocations through a transition from vertical to lateral growth.
  • Block 108 uses the same reactor conditions employed for the heteroepitaxial growth on the sapphire substrate, i.e., ⁇ 1100°C growth temperature, -1300 V/III ratio, and -0.1 atmospheric (atm) growth pressure, although modified conditions could be used.
  • Block 110 represents the resulting lateral overgrowth, wherein the lateral overgrowth comprises laterally overgrown GaN formed stripes, as determined by the underlying mask pattern.
  • the overgrown stripe morphology is dependent on the crystallographic orientation of the mask stripe. For example, stripes aligned to [ 1 100 ]GaN have rectangular cross-sections and exhibit substantial dislocation reduction in the overgrown regions.
  • LDs laser diodes
  • LEDs light emitting diodes
  • RC-LEDs resonant cavity LEDs
  • VCSELs vertical cavity surface emitting lasers
  • HEMTs high electron mobility transistors
  • HBTs heterojunction bipolar transistors
  • HFETs heterojunction field effect transistors
  • TEM transmission electron microscopy
  • CL Cathodoluminescence
  • the stripe morphology was observed using a JEOL 6300TM field emission scanning electron microscope (FE-SEM) operating at 5 kV.
  • FE-SEM field emission scanning electron microscope
  • the microstructure of the lateral overgrowth was studied in cross-section using a JEOL 2000FXTM transmission electron microscope (TEM) operating at 200 kV.
  • TEM transmission electron microscope
  • Cathodoluminescence (CL) images were obtained at room temperature using a Gatan MonoCLTM attached to the JEOL 6300TM FE-SEM and provided spatial maps of the luminescence from the laterally overgrown stripes.
  • the crystallographic orientation of the mask stripe openings dictate the facets that form and, hence, the characteristics of the lateral overgrowth. See Reference 14.
  • the SiO2 mask was patterned with an array of rectangular mask openings (windows) which formed a "wagon wheel" design.
  • the windows that made up the wagon wheel pattern were 5 ⁇ m wide and oriented in 5° intervals so that a range of crystallographic mask orientations could be analyzed in a single MOCVD growth run.
  • This experimental design is similar to that employed for the initial investigations of laterally overgrown c-plane GaN from linear mask openings. See References 14 and 15.
  • FIG. 2 is a plan-view scanning electron microscopy (SEM) image montage showing half of an a-GaN LEO wagon wheel pattern. The angles are included to facilitate reference to the wagon wheel pattern where 0° corresponds to the GaN c- axis [0001].
  • the reduced symmetry of the a-GaN surface (with respect to the c-GaN surface) is apparent in the stripe orientation dependence shown in FIG. 2, which is a 180° view of a single wagon wheel pattern.
  • this plan- view SEM image shows that lateral overgrowth occurred for all possible stripe orientations.
  • FIG. 2 shows that as the stripe orientation changed from [0001] to [ 1100 ], the stripe width increased until a maximum width was reached for stripes aligned 70° off the c-axis. After reaching this maximum, the stripe width decreased until it reached [ 1100 ]. Note that specific crystallographic indexing is consistently used throughout this description due to the reduced symmetry of this film/substrate system in comparison to c-GaN.
  • FIGS. 3(a), (b) and (c) are a series of SEM images with inclined views of the three stripes oriented parallel to [0001], [ 1101 ], and [ 1100 ], respectively, wherein the images correspond to the 0°, 45°, and 90° orientation labeling in FIG. 2 (and having a scale bar representing 55 ⁇ m).
  • [0001] and [ 1101 ] stripes had various combinations of inclined and vertical sidewalls. Specifically, symmetric morphologies were observed for the [0001] stripes, while the [ 1101 ] stripes had asymmetric morphologies with one microfaceted vertical (1 102) sidewall and one inclined (1 102) sidewall. The [0001] stripes had coexisting vertical and inclined facets from the same crystallographic family of ⁇ 1010 ⁇ planes. Conversely, [ 1100 ] stripes had rectangular cross-sections with vertical (0001) basal plane sidewalls. Overall, [0001] and [ 1100 ] stripe orientations yielded uniform, symmetric morphologies.
  • FIGS. 4(a), (b) and (c) are cross-sectional TEM images of a [ 1100] stripe, wherein FIG. 4(a) shows threading dislocation reduction in the asymmetric overgrowth regions.
  • Magnified views of the mask edge region defined by the dashed box in FIG. 4(a) are shown for FIG. 4(b) [TlOO ] and FIG. 4(c) [0001] stripes.
  • the dislocation lines bend from the window region into the overgrowth region for stripes aligned along [0001], while no dislocation bending is observed for [ 1100 ] stripes.
  • Threading dislocation (TD) reduction was observed for LEO stripes aligned along [ 1100 ], as shown in the cross-section TEM image in FIG. 4(a).
  • Mask blocking is the primary dislocation reduction mechanism since no dislocations were observed to bend in the direction of the lateral overgrowth, as shown in FIG. 4(b).
  • FIG. 4(c) shows that dislocations propagated into the overgrown regions of stripes aligned along [0001]. Although the precise origin of this dislocation bending is not yet known, the stability of inclined facets for the [0001] stripe orientation might play a key role.
  • FIG. 4(a) reveals an asymmetry in lateral overgrowth rates for [ 1100 ] stripes.
  • the existence of polar c-plane sidewalls explains this asymmetry.
  • one sidewall is the +c plane or Ga-face while the opposing sidewall is the -c plane or N- face.
  • the Ga-face sidewall grew faster than the N-face sidewall by a factor of -10 depending on the growth conditions.
  • the polarity of a-GaN on r-sapphire was previously determined using convergent beam electron diffraction measurements. See Reference 13. Since polarity had such a significant effect on the lateral overgrowth of the [ 1100 ] stripes, the asymmetric morphologies observed in FIGS. 2 and 3 may be related to the low symmetry of the structure.
  • FIGS. 5(a), (b) and (c) are plan- view panchromatic CL images of stripes oriented parallel to [0001], [TlOl ], and [TlOO ], while FIG. 5(d) illustrates the crystallographic orientation for FIGS. 5(a), (b) and (c).
  • the CL images shown in FIGS. 5(a)-(c) directly correspond to the stripes imaged by SEM in FIGS. 3(a), (b) and (c) (and having a scale bar representing 55 ⁇ m).
  • the mottled regions within each stripe orientation define the windows in the SiO 2 mask where TDs have extended unimpeded to the top surface of the LEO stripe.
  • This CL characteristic has been observed in polar GaN LEO stripes. See References 16-18.
  • the mottled area extends across the entire width of the [0001] stripe, which corresponds to the TEM observation of dislocation bending into the laterally overgrown regions for this stripe orientation.
  • CL measurements of wider stripes grown under similar conditions confirmed the dislocation bending observed in FIG. 4(c).
  • the uniform luminescence from the overgrown regions of [ 1100 ] stripes confirms that those areas are relatively free of TDs.
  • the effects of polarity on the lateral overgrowth rates of [ 1100 ] stripes are also clearly observed.
  • lateral overgrowth techniques are the dielectric mask specifications and the MOCVD regrowth conditions.
  • a variety of dielectric materials, deposition techniques, and patterning methods can be employed to fabricate effective masks for lateral overgrowth, h addition, modifying the orientation, design, and dimensions of the mask pattern will ultimately determine the characteristics of the subsequent lateral overgrowth.
  • Sufficient control of the lateral overgrowth is required in order to achieve dislocation reduction and to completely overgrow the mask such that a planar film is re-formed.
  • the specific details of the lateral overgrowth including lateral-to-vertical growth rate ratio and sidewall facet stability, are controlled via the MOCVD regrowth conditions.
  • MOCVD growth conditions are reactor dependent and may vary between specific reactor designs.
  • dislocation reduction can also be achieved using alternative overgrowth methods.
  • cantilever epitaxy, double lateral epitaxial overgrowth (double LEO), .and SiN nanomasking techniques could be used as alternatives to lateral epitaxial overgrowth.
  • non-polar a-plan GaN thin films are described herein, the , same techniques are applicable to non-polar m-plane GaN thin films.
  • non-polar InN, A1N, and AlInGaN thin films could be used instead of GaN thin films.
  • substrates other than sapphire substrate could be employed for non- polar GaN growth. These substrates include silicon carbide, gallium nitride, silicon, zinc oxide, boron nitride, lithium aluminate, lithium niobate, germanium, aluminum nitride, and lithium gallate.
  • the present invention describes lateral epitaxial overgrowth of non-polar (1120) a-plane GaN seed layers which results in threading dislocation reduction.
  • a thin patterned dielectric mask is applied to the seed layer.
  • a selective epitaxial regrowth is performed to achieve lateral overgrowth of the patterned mask.
  • the GaN films initially grow vertically through openings in the dielectric mask before laterally overgrowing the mask in directions pe ⁇ endicular to the vertical growth direction. Threading dislocations are reduced in the overgrown regions by (1) the mask blocking the propagation of dislocations vertically into the growing film and (2) the bending of dislocations through the transition from vertical to lateral growth.

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PCT/US2003/011177 2002-04-15 2003-04-15 Dislocation reduction in non-polar gallium nitride thin films Ceased WO2003089696A1 (en)

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US8502246B2 (en) 2004-05-10 2013-08-06 The Regents Of The University Of California Fabrication of nonpolar indium gallium nitride thin films, heterostructures and devices by metalorganic chemical vapor deposition
JP2007537600A (ja) * 2004-05-10 2007-12-20 独立行政法人科学技術振興機構 有機金属気相成長法による非極性窒化インジウムガリウム薄膜、ヘテロ構造物およびデバイスの製作
US8882935B2 (en) 2004-05-10 2014-11-11 The Regents Of The University Of California Fabrication of nonpolar indium gallium nitride thin films, heterostructures, and devices by metalorganic chemical vapor deposition
KR101365604B1 (ko) 2004-05-10 2014-02-20 더 리전트 오브 더 유니버시티 오브 캘리포니아 유기금속 화학기상증착법을 이용한 비극성 질화인듐갈륨 박막들, 이중 구조들 및 소자들의 제조
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US7998773B2 (en) 2006-02-06 2011-08-16 Seoul Semiconductor Co., Ltd. Method of growing semiconductor heterostructures based on gallium nitride
CN103215648A (zh) * 2006-02-06 2013-07-24 弗拉季米尔·西蒙诺维奇·阿布拉莫夫 基于氮化镓生长半导体异质结构的方法
US8546830B2 (en) 2006-02-06 2013-10-01 Seoul Semiconductor Co., Ltd. Method of growing semiconductor heterostructures based on gallium nitride
US8174042B2 (en) 2006-02-06 2012-05-08 Seoul Semiconductor Co., Ltd. Method of growing semiconductor heterostructures based on gallium nitride
RU2315135C2 (ru) * 2006-02-06 2008-01-20 Владимир Семенович Абрамов Метод выращивания неполярных эпитаксиальных гетероструктур на основе нитридов элементов iii группы
CN103215648B (zh) * 2006-02-06 2016-01-20 弗拉季米尔·西蒙诺维奇·阿布拉莫夫 基于氮化镓生长半导体异质结构的方法
US9324913B2 (en) 2012-10-05 2016-04-26 Panasonic Intellectual Property Management Co., Ltd. Nitride semiconductor structure, multilayer structure, and nitride semiconductor light-emitting element
US10224201B2 (en) 2015-02-23 2019-03-05 Mitsubishi Chemical Corporation C-plane GaN substrate

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