JP2012501089A - 塩化物ガス流の紫外線吸収によるモニタおよび制御 - Google Patents
塩化物ガス流の紫外線吸収によるモニタおよび制御 Download PDFInfo
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- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 title claims abstract description 124
- 238000010521 absorption reaction Methods 0.000 title claims abstract description 35
- 238000012544 monitoring process Methods 0.000 title 1
- 230000005855 radiation Effects 0.000 claims abstract description 183
- 239000004065 semiconductor Substances 0.000 claims abstract description 103
- 230000004044 response Effects 0.000 claims abstract description 61
- 239000000126 substance Substances 0.000 claims abstract description 57
- 238000006243 chemical reaction Methods 0.000 claims abstract description 36
- 230000005670 electromagnetic radiation Effects 0.000 claims abstract description 25
- 239000000178 monomer Substances 0.000 claims description 73
- 150000001805 chlorine compounds Chemical class 0.000 claims description 49
- 238000000034 method Methods 0.000 claims description 33
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 6
- 229910052733 gallium Inorganic materials 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052738 indium Inorganic materials 0.000 claims description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 205
- 230000003993 interaction Effects 0.000 description 71
- 239000002243 precursor Substances 0.000 description 55
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 51
- 230000003287 optical effect Effects 0.000 description 49
- 238000002835 absorbance Methods 0.000 description 41
- UPWPDUACHOATKO-UHFFFAOYSA-K gallium trichloride Chemical compound Cl[Ga](Cl)Cl UPWPDUACHOATKO-UHFFFAOYSA-K 0.000 description 35
- 239000013626 chemical specie Substances 0.000 description 29
- 239000000758 substrate Substances 0.000 description 27
- 229910001510 metal chloride Inorganic materials 0.000 description 25
- 239000000460 chlorine Substances 0.000 description 23
- 238000001514 detection method Methods 0.000 description 21
- 239000000539 dimer Substances 0.000 description 18
- 229910002601 GaN Inorganic materials 0.000 description 14
- 239000000463 material Substances 0.000 description 14
- 238000004847 absorption spectroscopy Methods 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 9
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 8
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 8
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 8
- PSCMQHVBLHHWTO-UHFFFAOYSA-K indium(iii) chloride Chemical compound Cl[In](Cl)Cl PSCMQHVBLHHWTO-UHFFFAOYSA-K 0.000 description 8
- 230000007423 decrease Effects 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 239000013078 crystal Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 150000004767 nitrides Chemical class 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- -1 InCl) Chemical compound 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 238000011066 ex-situ storage Methods 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 238000004611 spectroscopical analysis Methods 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000004993 emission spectroscopy Methods 0.000 description 3
- 150000004678 hydrides Chemical class 0.000 description 3
- 238000011065 in-situ storage Methods 0.000 description 3
- APHGZSBLRQFRCA-UHFFFAOYSA-M indium(1+);chloride Chemical compound [In]Cl APHGZSBLRQFRCA-UHFFFAOYSA-M 0.000 description 3
- 238000001451 molecular beam epitaxy Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- YZCKVEUIGOORGS-OUBTZVSYSA-N Deuterium Chemical compound [2H] YZCKVEUIGOORGS-OUBTZVSYSA-N 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- NWAIGJYBQQYSPW-UHFFFAOYSA-N azanylidyneindigane Chemical compound [In]#N NWAIGJYBQQYSPW-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 229910052805 deuterium Inorganic materials 0.000 description 2
- 239000005350 fused silica glass Substances 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 230000006335 response to radiation Effects 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 238000000927 vapour-phase epitaxy Methods 0.000 description 2
- 229910002704 AlGaN Inorganic materials 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 1
- 238000001069 Raman spectroscopy Methods 0.000 description 1
- RBFQJDQYXXHULB-UHFFFAOYSA-N arsane Chemical compound [AsH3] RBFQJDQYXXHULB-UHFFFAOYSA-N 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- XOYLJNJLGBYDTH-UHFFFAOYSA-M chlorogallium Chemical compound [Ga]Cl XOYLJNJLGBYDTH-UHFFFAOYSA-M 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000006903 response to temperature Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 1
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 1
- IBEFSUTVZWZJEL-UHFFFAOYSA-N trimethylindium Chemical compound C[In](C)C IBEFSUTVZWZJEL-UHFFFAOYSA-N 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/301—AIII BV compounds, where A is Al, Ga, In or Tl and B is N, P, As, Sb or Bi
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/16—Controlling or regulating
- C30B25/165—Controlling or regulating the flow of the reactive gases
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
Abstract
【選択図】 図5a
Description
Claims (15)
- チャンバと、
電磁放射線源と、
前記チャンバの塩化物系化学物質による前記放射線源からの放射線の吸収を検出するように配置された検出器と、
前記塩化物系化学物質による放射線の前記吸収に応答して、前記チャンバの動作を制御する制御システムと、
を備える半導体成長システム。 - 前記塩化物系化学物質が、一塩化物分子、塩化物単量体、および塩化物二量体の少なくとも1つを含む、請求項1に記載の半導体成長システム。
- 前記塩化物系化学物質が、ガリウム、アルミニウム、およびインジウムの少なくとも1つを含む、請求項2に記載の半導体成長システム。
- 前記制御システムが、前記塩化物系化学物質の一塩化物分子、塩化物単量体、および塩化物二量体の少なくとも1つによる放射線の前記吸収に応答して、前記チャンバの動作を制御する、請求項1に記載の半導体成長システム。
- 前記吸収された放射線の波長が、約100ナノメートル〜400ナノメートルである、請求項4に記載の半導体成長システム。
- 前記制御システムが、前記塩化物系化学物質の一塩化物分子、塩化物単量体、および塩化物二量体のそれぞれの量を調節することによって前記チャンバの動作を制御する、請求項1に記載の半導体成長システム。
- 前記制御システムが、前記チャンバのパラメータを調節することによって、前記チャンバの前記塩化物系化学物質の一塩化物分子、塩化物単量体、および塩化物二量体の量を調節する、請求項6に記載の半導体成長システム。
- チャンバの内部容積を通して電磁放射線を放射するステップと、
前記チャンバの塩化物系化学物質による前記放射線の吸収を検出するステップと、
前記放射線の前記吸収に応答して、前記チャンバの動作を制御するステップと、
を含む半導体の形成方法。 - 前記塩化物系化学物質が、一塩化物分子、塩化物単量体、および塩化物二量体の少なくとも1つを含む、請求項8に記載の半導体の形成方法。
- 前記制御システムで前記チャンバの動作を調節することによって、前記チャンバの成長パラメータを調節するステップをさらに含む、請求項8に記載の半導体の形成方法。
- 前記塩化物系化学物質の一塩化物分子、塩化物単量体、および塩化物二量体の少なくとも1つによる放射線の前記吸収に応答して、前記制御システムで前記チャンバの動作を制御するステップをさらに含む、請求項8に記載の半導体の形成方法。
- 前記制御システムで前記チャンバの動作を調節することによって、前記塩化物系化学物質の一塩化物分子、塩化物単量体、および塩化物二量体の量を調節するステップをさらに含む、請求項8に記載の半導体の形成方法。
- 前記制御システムが、前記反応システムの成長パラメータを調節することによって、前記チャンバの前記塩化物系化学物質の一塩化物分子、塩化物単量体、および塩化物二量体の量を調節する、請求項12に記載の半導体の形成方法。
- 前記吸収された放射線の波長が、約100ナノメートル〜400ナノメートルである、請求項8に記載の半導体の形成方法。
- 前記吸収された放射線の波長が、約185ナノメートル〜210ナノメートルである、請求項8に記載の半導体の形成方法。
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Application Number | Priority Date | Filing Date | Title |
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US9261008P | 2008-08-28 | 2008-08-28 | |
US61/092,610 | 2008-08-28 | ||
PCT/IB2009/006355 WO2010023516A1 (en) | 2008-08-28 | 2009-07-21 | Uv absorption based monitor and control of chloride gas stream |
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JP2012501089A true JP2012501089A (ja) | 2012-01-12 |
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JP2011524467A Pending JP2012501089A (ja) | 2008-08-28 | 2009-07-21 | 塩化物ガス流の紫外線吸収によるモニタおよび制御 |
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US (1) | US8431419B2 (ja) |
EP (1) | EP2329056B1 (ja) |
JP (1) | JP2012501089A (ja) |
KR (1) | KR101324303B1 (ja) |
CN (1) | CN102131957A (ja) |
WO (1) | WO2010023516A1 (ja) |
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US9023721B2 (en) | 2010-11-23 | 2015-05-05 | Soitec | Methods of forming bulk III-nitride materials on metal-nitride growth template layers, and structures formed by such methods |
FR2968678B1 (fr) | 2010-12-08 | 2015-11-20 | Soitec Silicon On Insulator | Procédés pour former des matériaux a base de nitrure du groupe iii et structures formées par ces procédés |
US20130052333A1 (en) * | 2011-08-22 | 2013-02-28 | Soitec | Deposition systems having reaction chambers configured for in-situ metrology and related methods |
US9644285B2 (en) | 2011-08-22 | 2017-05-09 | Soitec | Direct liquid injection for halide vapor phase epitaxy systems and methods |
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US9698386B2 (en) | 2012-04-13 | 2017-07-04 | Oti Lumionics Inc. | Functionalization of a substrate |
US8853070B2 (en) | 2012-04-13 | 2014-10-07 | Oti Lumionics Inc. | Functionalization of a substrate |
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KR101324303B1 (ko) | 2013-10-30 |
CN102131957A (zh) | 2011-07-20 |
EP2329056B1 (en) | 2012-12-19 |
US8431419B2 (en) | 2013-04-30 |
WO2010023516A1 (en) | 2010-03-04 |
EP2329056A1 (en) | 2011-06-08 |
US20110212546A1 (en) | 2011-09-01 |
KR20110028390A (ko) | 2011-03-17 |
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