FR2984923B1 - Systèmes de dépôt comprenant des chambres de réaction configurées pour réaliser des opérations de métrologie in situ et procédés connexes - Google Patents

Systèmes de dépôt comprenant des chambres de réaction configurées pour réaliser des opérations de métrologie in situ et procédés connexes

Info

Publication number
FR2984923B1
FR2984923B1 FR1162463A FR1162463A FR2984923B1 FR 2984923 B1 FR2984923 B1 FR 2984923B1 FR 1162463 A FR1162463 A FR 1162463A FR 1162463 A FR1162463 A FR 1162463A FR 2984923 B1 FR2984923 B1 FR 2984923B1
Authority
FR
France
Prior art keywords
realizing
related methods
reaction chambers
deposition systems
situ metrology
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1162463A
Other languages
English (en)
Other versions
FR2984923A1 (fr
Inventor
Ed Lindow
Ronald Thomas Bertram Jr
Claudio Canizares
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soitec SA
Original Assignee
Soitec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soitec SA filed Critical Soitec SA
Priority to FR1162463A priority Critical patent/FR2984923B1/fr
Priority to TW101141375A priority patent/TWI570285B/zh
Priority to DE112012005276.5T priority patent/DE112012005276T5/de
Priority to KR1020147017180A priority patent/KR20140103291A/ko
Priority to JP2014546661A priority patent/JP6133888B2/ja
Priority to PCT/IB2012/002388 priority patent/WO2013088213A1/fr
Priority to CN201280061724.6A priority patent/CN103987877B/zh
Priority to SG11201402877YA priority patent/SG11201402877YA/en
Publication of FR2984923A1 publication Critical patent/FR2984923A1/fr
Application granted granted Critical
Publication of FR2984923B1 publication Critical patent/FR2984923B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/48—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
    • C23C16/482—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation using incoherent light, UV to IR, e.g. lamps
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/301—AIII BV compounds, where A is Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C23C16/303—Nitrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
FR1162463A 2011-12-15 2011-12-27 Systèmes de dépôt comprenant des chambres de réaction configurées pour réaliser des opérations de métrologie in situ et procédés connexes Expired - Fee Related FR2984923B1 (fr)

Priority Applications (8)

Application Number Priority Date Filing Date Title
FR1162463A FR2984923B1 (fr) 2011-12-27 2011-12-27 Systèmes de dépôt comprenant des chambres de réaction configurées pour réaliser des opérations de métrologie in situ et procédés connexes
TW101141375A TWI570285B (zh) 2011-12-15 2012-11-07 具有被組構成可原地計量之反應腔之沉積系統及相關方法
KR1020147017180A KR20140103291A (ko) 2011-12-15 2012-11-12 인 시투 계측을 위해 구성된 반응 체임버를 가지는 침착 시스템 및 관련 방법
JP2014546661A JP6133888B2 (ja) 2011-12-15 2012-11-12 その場でのメトロロジ用に構成された反応チャンバを有する堆積システムおよび関連の方法
DE112012005276.5T DE112012005276T5 (de) 2011-12-15 2012-11-12 Abscheidungssysteme mit Reaktionskammern, die zur In-Situ Metrologie ausgebildet sind, und verwandte Verfahren
PCT/IB2012/002388 WO2013088213A1 (fr) 2011-12-15 2012-11-12 Système de dépôt ayant une chambre de réaction configurée pour la métrologie in situ et procédé associé
CN201280061724.6A CN103987877B (zh) 2011-12-15 2012-11-12 具有为原位方法配置的反应室的淀积系统以及相关方法
SG11201402877YA SG11201402877YA (en) 2011-12-15 2012-11-12 Deposition system having a reaction chamber configured for in situ metrology and related method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1162463A FR2984923B1 (fr) 2011-12-27 2011-12-27 Systèmes de dépôt comprenant des chambres de réaction configurées pour réaliser des opérations de métrologie in situ et procédés connexes

Publications (2)

Publication Number Publication Date
FR2984923A1 FR2984923A1 (fr) 2013-06-28
FR2984923B1 true FR2984923B1 (fr) 2014-11-07

Family

ID=45815784

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1162463A Expired - Fee Related FR2984923B1 (fr) 2011-12-15 2011-12-27 Systèmes de dépôt comprenant des chambres de réaction configurées pour réaliser des opérations de métrologie in situ et procédés connexes

Country Status (8)

Country Link
JP (1) JP6133888B2 (fr)
KR (1) KR20140103291A (fr)
CN (1) CN103987877B (fr)
DE (1) DE112012005276T5 (fr)
FR (1) FR2984923B1 (fr)
SG (1) SG11201402877YA (fr)
TW (1) TWI570285B (fr)
WO (1) WO2013088213A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9812342B2 (en) * 2015-12-08 2017-11-07 Watlow Electric Manufacturing Company Reduced wire count heater array block
US11823964B2 (en) * 2021-04-16 2023-11-21 Taiwan Semiconductor Manufacturing Co., Ltd. Deposition system and method

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01268120A (ja) * 1988-04-20 1989-10-25 Fujitsu Ltd 半導体装置用ウェハの温度測定方法
GB2238868A (en) * 1989-11-22 1991-06-12 Res Corp Technologies Inc Silicon wafer temperature measurement by optical transmission monitoring.
JP3058658B2 (ja) * 1990-06-21 2000-07-04 国際電気株式会社 半導体製造装置
JPH062147A (ja) * 1992-06-16 1994-01-11 Babcock Hitachi Kk 気相化学反応装置
JP2884556B2 (ja) * 1994-06-10 1999-04-19 信越石英株式会社 枚葉式ウェーハ熱処理装置
JPH0897167A (ja) * 1994-09-28 1996-04-12 Tokyo Electron Ltd 処理装置及び熱処理装置
JP3011866B2 (ja) * 1994-11-30 2000-02-21 信越石英株式会社 枚葉式ウエーハ熱処理装置
JP3218164B2 (ja) * 1995-05-31 2001-10-15 東京エレクトロン株式会社 被処理体の支持ボート、熱処理装置及び熱処理方法
JP3551609B2 (ja) * 1996-02-23 2004-08-11 東京エレクトロン株式会社 熱処理装置
WO1999049101A1 (fr) * 1998-03-23 1999-09-30 Mattson Technology, Inc. Appareil et procede de depot chimique en phase vapeur et de traitement thermique de substrats a semiconducteurs
US6179913B1 (en) 1999-04-16 2001-01-30 Cbl Technologies, Inc. Compound gas injection system and methods
JPWO2005017988A1 (ja) * 2003-08-15 2006-10-12 株式会社日立国際電気 基板処理装置および半導体デバイスの製造方法
JP2007005399A (ja) * 2005-06-21 2007-01-11 Hitachi Kokusai Electric Inc 基板処理装置
KR101330156B1 (ko) * 2006-11-22 2013-12-20 소이텍 삼염화 갈륨 주입 구조
WO2008064077A2 (fr) 2006-11-22 2008-05-29 S.O.I.Tec Silicon On Insulator Technologies Procédé de fabrication en grand volume de matériaux semiconducteurs des groupes iii à v
KR20100106608A (ko) * 2008-01-31 2010-10-01 어플라이드 머티어리얼스, 인코포레이티드 폐쇄 회로 ｍｏｃｖｄ 증착 제어
US8388755B2 (en) * 2008-02-27 2013-03-05 Soitec Thermalization of gaseous precursors in CVD reactors
JP5314134B2 (ja) * 2008-06-30 2013-10-16 ソイテック モジュール式化学気相成長（ｃｖｄ）反応器サブシステム及びその形成方法並びに独立機能モジュール
EP2329056B1 (fr) * 2008-08-28 2012-12-19 Soitec Appareil de surveillance basé sur l absorption uv et commande d un courant de gaz de chlorure

Also Published As

Publication number Publication date
TW201323670A (zh) 2013-06-16
DE112012005276T5 (de) 2014-10-09
KR20140103291A (ko) 2014-08-26
JP6133888B2 (ja) 2017-05-24
CN103987877B (zh) 2016-08-17
CN103987877A (zh) 2014-08-13
FR2984923A1 (fr) 2013-06-28
WO2013088213A1 (fr) 2013-06-20
TWI570285B (zh) 2017-02-11
JP2015502055A (ja) 2015-01-19
SG11201402877YA (en) 2014-07-30

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