JP4433947B2 - 高温用cvd装置 - Google Patents
高温用cvd装置 Download PDFInfo
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- JP4433947B2 JP4433947B2 JP2004255404A JP2004255404A JP4433947B2 JP 4433947 B2 JP4433947 B2 JP 4433947B2 JP 2004255404 A JP2004255404 A JP 2004255404A JP 2004255404 A JP2004255404 A JP 2004255404A JP 4433947 B2 JP4433947 B2 JP 4433947B2
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- 239000000758 substrate Substances 0.000 claims description 128
- 239000010409 thin film Substances 0.000 claims description 38
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 27
- 229910052799 carbon Inorganic materials 0.000 claims description 24
- 238000010438 heat treatment Methods 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 13
- 238000001816 cooling Methods 0.000 claims description 8
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 76
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 23
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 19
- 239000002994 raw material Substances 0.000 description 15
- 229910021529 ammonia Inorganic materials 0.000 description 11
- 239000010453 quartz Substances 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 11
- 238000000034 method Methods 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 10
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 150000004767 nitrides Chemical class 0.000 description 8
- 229910001220 stainless steel Inorganic materials 0.000 description 8
- 239000010935 stainless steel Substances 0.000 description 8
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 7
- 239000001257 hydrogen Substances 0.000 description 7
- 229910052739 hydrogen Inorganic materials 0.000 description 7
- 229910052594 sapphire Inorganic materials 0.000 description 7
- 239000010980 sapphire Substances 0.000 description 7
- 239000010408 film Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000007664 blowing Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000006698 induction Effects 0.000 description 3
- 238000010926 purge Methods 0.000 description 3
- IBEFSUTVZWZJEL-UHFFFAOYSA-N trimethylindium Chemical compound C[In](C)C IBEFSUTVZWZJEL-UHFFFAOYSA-N 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- 229910002704 AlGaN Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 125000002524 organometallic group Chemical group 0.000 description 2
- 230000001603 reducing effect Effects 0.000 description 2
- DECCZIUVGMLHKQ-UHFFFAOYSA-N rhenium tungsten Chemical compound [W].[Re] DECCZIUVGMLHKQ-UHFFFAOYSA-N 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- RBFQJDQYXXHULB-UHFFFAOYSA-N arsane Chemical compound [AsH3] RBFQJDQYXXHULB-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010574 gas phase reaction Methods 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
Images
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- Crystals, And After-Treatments Of Crystals (AREA)
- Chemical Vapour Deposition (AREA)
- Led Devices (AREA)
Description
現在用いられているGaN、InGaN成長用MOCVD装置はサファイヤ基板をサセプタの上において、下から基板を加熱し横方向から原料ガス(アンモニア、TMG、TMI、TMA)を流して基板の上にGaN、InGaN、AlGaNなどの薄膜を成長させるものである。InGaN系の発光ダイオードは青色発光できるが、それより短い波長の光を発生することができない。
より高い温度たとえば1800℃程度の高温のMOCVD法で作製するとAlNの良好な薄膜ができるのではないかと期待される。
2 基板ホルダー
3 抵抗加熱ヒータ
4 反射板
5 熱電対
6 サセプタ
7 フローチャネル
8 ガスノズル
20 下地基板
22 基板ホルダー
23 抵抗加熱ヒータ
24 反射板
25 熱電対
26 ヒータケース
27 フローチャネル
28 原料ガスノズル
29 原料ガスノズル
32 水冷ジャケット
33 断熱材
34 窓
35 ノズル先端
36 フローチャネル上流側
37 フローチャネル基板直下
38 フローチャネル下流側
39 フローチャネル出口
S ヒータと基板の間の距離
W ノズルの先端から基板端までの距離
Claims (1)
- カーボン(C)、モリブデン(Mo)、パイロリティックグラファイト(PG)、PGコートカーボン、TaCコートカーボン、或いは導電性BNによって作製され基板を保持するための窓を上壁に有する横型のフローチャネルと、窓に下向きに保持された基板を1300℃〜1900℃の温度まで加熱する窓の上方に昇降可能に設けられたPG、PGコートカーボン、TaCコートカーボン或いは導電性BN製抵抗加熱ヒータと、フローチャネルの側方開口部にあってフローチャネルへ原料ガスを導入するための原料ガスノズルと、原料ガスノズルを冷却する水冷ジャケットとを含み、フローチャネルの窓に下向きに保持され抵抗加熱ヒータで加熱された基板に、フローチャネルを通過してきた原料ガスを接触させて基板の上に薄膜を成長させるようにしたことを特徴とする高温用CVD装置。
Priority Applications (1)
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JP2004255404A JP4433947B2 (ja) | 2004-09-02 | 2004-09-02 | 高温用cvd装置 |
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JP2004255404A JP4433947B2 (ja) | 2004-09-02 | 2004-09-02 | 高温用cvd装置 |
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JP2006070325A JP2006070325A (ja) | 2006-03-16 |
JP4433947B2 true JP4433947B2 (ja) | 2010-03-17 |
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JP2004255404A Expired - Lifetime JP4433947B2 (ja) | 2004-09-02 | 2004-09-02 | 高温用cvd装置 |
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Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5138212B2 (ja) * | 2006-12-25 | 2013-02-06 | 東京エレクトロン株式会社 | 成膜装置 |
JP5039120B2 (ja) * | 2009-12-07 | 2012-10-03 | 東京エレクトロン株式会社 | プラズマ処理装置用のアルミナ部材及びプラズマ処理装置用のアルミナ部材の製造方法 |
JP5648289B2 (ja) * | 2010-01-14 | 2015-01-07 | 豊田合成株式会社 | スパッタリング装置および半導体発光素子の製造方法 |
CN110578135B (zh) * | 2019-08-27 | 2021-11-19 | 广东工业大学 | 一种立方氮化铝薄膜及其制备方法和应用 |
CN114990522B (zh) * | 2022-04-14 | 2023-08-08 | 重庆理工大学 | 一种热分解薄膜制备装置 |
KR102556549B1 (ko) * | 2022-07-29 | 2023-07-18 | 김남수 | GaN 시스템 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6230696A (ja) * | 1985-07-31 | 1987-02-09 | Sharp Corp | 広禁制帯幅半導体結晶の製造方法 |
JP2748700B2 (ja) * | 1991-01-28 | 1998-05-13 | 日本電気株式会社 | 気相成長装置 |
SE9500326D0 (sv) * | 1995-01-31 | 1995-01-31 | Abb Research Ltd | Method for protecting the susceptor during epitaxial growth by CVD and a device for epitaxial growth by CVD |
JP4381489B2 (ja) * | 1997-06-24 | 2009-12-09 | ソニー株式会社 | 化学気相成長装置 |
JP4786782B2 (ja) * | 1999-08-02 | 2011-10-05 | 東京エレクトロン株式会社 | 耐食性に優れたCVD−SiCおよびそれを用いた耐食性部材、ならびに処理装置 |
DE19940033A1 (de) * | 1999-08-24 | 2001-05-17 | Aixtron Ag | Verfahren und Vorrichtung zum Abscheiden von Schichten auf rotierenden Substraten in einem allseits beheizten Strömungskanal |
JP2004055672A (ja) * | 2002-07-17 | 2004-02-19 | Nikko Materials Co Ltd | 化学気相成長装置および化学気相成長方法 |
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- 2004-09-02 JP JP2004255404A patent/JP4433947B2/ja not_active Expired - Lifetime
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