FR2968678B1 - Procédés pour former des matériaux a base de nitrure du groupe iii et structures formées par ces procédés - Google Patents
Procédés pour former des matériaux a base de nitrure du groupe iii et structures formées par ces procédésInfo
- Publication number
- FR2968678B1 FR2968678B1 FR1060242A FR1060242A FR2968678B1 FR 2968678 B1 FR2968678 B1 FR 2968678B1 FR 1060242 A FR1060242 A FR 1060242A FR 1060242 A FR1060242 A FR 1060242A FR 2968678 B1 FR2968678 B1 FR 2968678B1
- Authority
- FR
- France
- Prior art keywords
- methods
- group iii
- iii nitride
- structures formed
- formed therefrom
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 150000004767 nitrides Chemical class 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
- C30B29/406—Gallium nitride
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/2003—Nitride compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Chemical Vapour Deposition (AREA)
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1060242A FR2968678B1 (fr) | 2010-12-08 | 2010-12-08 | Procédés pour former des matériaux a base de nitrure du groupe iii et structures formées par ces procédés |
TW100134215A TWI517213B (zh) | 2010-11-23 | 2011-09-22 | 形成第三族氮化物材料之方法及由該方法所形成之結構 |
KR1020137014538A KR20130141575A (ko) | 2010-11-23 | 2011-11-23 | Iii족-질화물을 형성하는 방법 및 이와 같은 방법에 의해 형성되는 구조 |
US13/988,996 US9412580B2 (en) | 2010-11-23 | 2011-11-23 | Methods for forming group III-nitride materials and structures formed by such methods |
JP2013540344A JP2014500219A (ja) | 2010-11-23 | 2011-11-23 | Iii族窒化物材料を形成するための方法およびそうした方法によって形成される構造物 |
PCT/EP2011/070794 WO2012069530A1 (fr) | 2010-11-23 | 2011-11-23 | Procédés pour former des matières de nitrure du groupe iii, et structures formées par de tels procédés |
DE112011103871.2T DE112011103871B4 (de) | 2010-11-23 | 2011-11-23 | Verfahren zum ausbilden von galliumnitrid-material und struktur, die durch ein derartiges verfahren ausgebildet wird |
CN201180056001.2A CN103237929B (zh) | 2010-11-23 | 2011-11-23 | 用于形成iii族氮化物材料的方法以及通过该方法形成的结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1060242A FR2968678B1 (fr) | 2010-12-08 | 2010-12-08 | Procédés pour former des matériaux a base de nitrure du groupe iii et structures formées par ces procédés |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2968678A1 FR2968678A1 (fr) | 2012-06-15 |
FR2968678B1 true FR2968678B1 (fr) | 2015-11-20 |
Family
ID=44153261
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1060242A Active FR2968678B1 (fr) | 2010-11-23 | 2010-12-08 | Procédés pour former des matériaux a base de nitrure du groupe iii et structures formées par ces procédés |
Country Status (8)
Country | Link |
---|---|
US (1) | US9412580B2 (fr) |
JP (1) | JP2014500219A (fr) |
KR (1) | KR20130141575A (fr) |
CN (1) | CN103237929B (fr) |
DE (1) | DE112011103871B4 (fr) |
FR (1) | FR2968678B1 (fr) |
TW (1) | TWI517213B (fr) |
WO (1) | WO2012069530A1 (fr) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014222691A (ja) * | 2013-05-13 | 2014-11-27 | 日立金属株式会社 | 窒化物半導体テンプレートおよびその製造方法、並びに窒化物半導体発光素子 |
JP6375890B2 (ja) | 2014-11-18 | 2018-08-22 | 日亜化学工業株式会社 | 窒化物半導体素子及びその製造方法 |
JP6851017B2 (ja) * | 2016-05-18 | 2021-03-31 | パナソニックIpマネジメント株式会社 | デバイス及びその製造方法 |
WO2019123954A1 (fr) * | 2017-12-21 | 2019-06-27 | パナソニックIpマネジメント株式会社 | Structure de film composite à base de nitrure et procédé pour sa fabrication |
JP7157953B2 (ja) * | 2017-12-21 | 2022-10-21 | パナソニックIpマネジメント株式会社 | 窒化物系薄膜複合構造体及びその製造方法 |
TWI698915B (zh) * | 2019-01-18 | 2020-07-11 | 國立交通大學 | 雲母片上異質磊晶半導體材料之製程方法 |
US20220344151A1 (en) * | 2021-04-23 | 2022-10-27 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor Device and Method of Manufacture |
Family Cites Families (67)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2682047B1 (fr) | 1991-10-07 | 1993-11-12 | Commissariat A Energie Atomique | Reacteur de traitement chimique en phase gazeuse. |
FR2682253A1 (fr) | 1991-10-07 | 1993-04-09 | Commissariat Energie Atomique | Sole chauffante destinee a assurer le chauffage d'un objet dispose a sa surface et reacteur de traitement chimique muni de ladite sole. |
US5972790A (en) | 1995-06-09 | 1999-10-26 | Tokyo Electron Limited | Method for forming salicides |
US6121140A (en) | 1997-10-09 | 2000-09-19 | Tokyo Electron Limited | Method of improving surface morphology and reducing resistivity of chemical vapor deposition-metal films |
FR2769924B1 (fr) * | 1997-10-20 | 2000-03-10 | Centre Nat Rech Scient | Procede de realisation d'une couche epitaxiale de nitrure de gallium, couche epitaxiale de nitrure de gallium et composant optoelectronique muni d'une telle couche |
US7560296B2 (en) * | 2000-07-07 | 2009-07-14 | Lumilog | Process for producing an epitalixal layer of galium nitride |
US6090705A (en) | 1998-01-20 | 2000-07-18 | Tokyo Electron Limited | Method of eliminating edge effect in chemical vapor deposition of a metal |
US6179913B1 (en) | 1999-04-16 | 2001-01-30 | Cbl Technologies, Inc. | Compound gas injection system and methods |
JP2001122693A (ja) * | 1999-10-22 | 2001-05-08 | Nec Corp | 結晶成長用下地基板およびこれを用いた基板の製造方法 |
US6841808B2 (en) * | 2000-06-23 | 2005-01-11 | Toyoda Gosei Co., Ltd. | Group III nitride compound semiconductor device and method for producing the same |
JP4374156B2 (ja) * | 2000-09-01 | 2009-12-02 | 日本碍子株式会社 | Iii−v族窒化物膜の製造装置及び製造方法 |
US6613143B1 (en) | 2001-07-06 | 2003-09-02 | Technologies And Devices International, Inc. | Method for fabricating bulk GaN single crystals |
WO2003038957A1 (fr) * | 2001-10-29 | 2003-05-08 | Sharp Kabushiki Kaisha | Dispositif a semi-conducteur au nitrure, son procede de fabrication et appareil optique a semi-conducteur |
JP3749498B2 (ja) * | 2002-03-26 | 2006-03-01 | スタンレー電気株式会社 | 結晶成長用基板およびZnO系化合物半導体デバイス |
WO2003096385A2 (fr) | 2002-05-07 | 2003-11-20 | Asm America, Inc. | Structure silicium sur isolant et procedes correspondants |
AUPS240402A0 (en) * | 2002-05-17 | 2002-06-13 | Macquarie Research Limited | Gallium nitride |
WO2004081986A2 (fr) | 2003-03-12 | 2004-09-23 | Asm America Inc. | Procede de planarisation et de reduction de la densite des defauts du silicium germanium |
CN1791966A (zh) * | 2003-05-21 | 2006-06-21 | 卢米洛格股份有限公司 | 通过掩模用横向过生长来制备氮化镓衬底以及由此制备的器件 |
JP4371202B2 (ja) * | 2003-06-27 | 2009-11-25 | 日立電線株式会社 | 窒化物半導体の製造方法及び半導体ウエハ並びに半導体デバイス |
WO2005013326A2 (fr) | 2003-07-30 | 2005-02-10 | Asm America, Inc. | Croissance epitaxiale de couches de silicium germanium relachees |
US7816236B2 (en) | 2005-02-04 | 2010-10-19 | Asm America Inc. | Selective deposition of silicon-containing films |
KR20060127743A (ko) * | 2005-06-06 | 2006-12-13 | 스미토모덴키고교가부시키가이샤 | 질화물 반도체 기판과 그 제조 방법 |
KR100616686B1 (ko) * | 2005-06-10 | 2006-08-28 | 삼성전기주식회사 | 질화물계 반도체 장치의 제조 방법 |
WO2007122669A1 (fr) * | 2006-03-29 | 2007-11-01 | Fujitsu Limited | PLAQUETTE SEMI-CONDUCTRICE COMPOSÉE COMPORTANT UN SUBSTRAT AU SiC POLYCRISTALLIN, DISPOSITIF SEMI-CONDUCTEUR COMPOSÉ, ET LEURS PROCÉDÉS DE PRODUCTION |
US7785995B2 (en) | 2006-05-09 | 2010-08-31 | Asm America, Inc. | Semiconductor buffer structures |
US20080026149A1 (en) | 2006-05-31 | 2008-01-31 | Asm America, Inc. | Methods and systems for selectively depositing si-containing films using chloropolysilanes |
US20100242835A1 (en) | 2006-06-09 | 2010-09-30 | S.O.I.T.E.C. Silicon On Insulator Technologies | High volume delivery system for gallium trichloride |
US7928447B2 (en) * | 2006-07-17 | 2011-04-19 | Sumitomo Electric Industries, Ltd. | GaN crystal substrate, fabricating method of GaN crystal substrate, and light-emitting device |
WO2008130448A2 (fr) | 2006-11-22 | 2008-10-30 | S.O.I.Tec Silicon On Insulator Technologies | Clapet obturateur contrôlé par la température dans une chambre de dépôt chimique en phase vapeur |
JP5575482B2 (ja) | 2006-11-22 | 2014-08-20 | ソイテック | 単結晶iii−v族半導体材料のエピタキシャル堆積法、及び堆積システム |
WO2008064109A2 (fr) | 2006-11-22 | 2008-05-29 | S.O.I.Tec Silicon On Insulator Technologies | Dispositif de fabrication à haut rendement de matériaux à semi-conducteurs du groupe iii-v |
WO2008064077A2 (fr) | 2006-11-22 | 2008-05-29 | S.O.I.Tec Silicon On Insulator Technologies | Procédé de fabrication en grand volume de matériaux semiconducteurs des groupes iii à v |
KR101330156B1 (ko) | 2006-11-22 | 2013-12-20 | 소이텍 | 삼염화 갈륨 주입 구조 |
US20090223441A1 (en) | 2006-11-22 | 2009-09-10 | Chantal Arena | High volume delivery system for gallium trichloride |
JP2008153634A (ja) * | 2006-11-24 | 2008-07-03 | Sony Corp | 発光ダイオードの製造方法、発光ダイオード、光源セルユニット、発光ダイオードバックライト、発光ダイオード照明装置、発光ダイオードディスプレイおよび電子機器 |
WO2008141324A2 (fr) | 2007-05-14 | 2008-11-20 | S.O.I.Tec Silicon On Insulator Technologies | Procédés pour améliorer la qualité de matériaux semi-conducteurs à croissance épitaxiale |
FR2917232B1 (fr) | 2007-06-06 | 2009-10-09 | Soitec Silicon On Insulator | Procede de fabrication d'une structure pour epitaxie sans zone d'exclusion. |
US7732306B2 (en) * | 2007-07-26 | 2010-06-08 | S.O.I.Tec Silicon On Insulator Technologies | Methods for producing improved epitaxial materials |
CN101743618B (zh) | 2007-07-26 | 2012-11-21 | 硅绝缘体技术有限公司 | 外延方法和通过该方法生长的模板 |
JP4631884B2 (ja) * | 2007-08-22 | 2011-02-16 | 日立電線株式会社 | 閃亜鉛鉱型窒化物半導体自立基板、閃亜鉛鉱型窒化物半導体自立基板の製造方法、及び閃亜鉛鉱型窒化物半導体自立基板を用いた発光装置 |
WO2009063288A1 (fr) | 2007-11-15 | 2009-05-22 | S.O.I.Tec Silicon On Insulator Technologies | Structure de semi-conducteur ayant une couche protectrice |
JP5587205B2 (ja) | 2007-12-20 | 2014-09-10 | ソイテック | エピタキシャル成長基板に前駆体ガスを送出するための装置 |
WO2009085561A2 (fr) | 2007-12-20 | 2009-07-09 | S.O.I.Tec Silicon On Insulator Technologies | Procédés pour traitement de nettoyage en chambre in-situ pour la fabrication en gros volume de matériaux semi-conducteurs |
JP2009167053A (ja) * | 2008-01-16 | 2009-07-30 | Sumitomo Electric Ind Ltd | Iii族窒化物結晶の成長方法 |
US8388755B2 (en) | 2008-02-27 | 2013-03-05 | Soitec | Thermalization of gaseous precursors in CVD reactors |
WO2009139793A1 (fr) | 2008-05-14 | 2009-11-19 | S.O.I.Tec Silicon On Insulator Technologies | Procédés d'amélioration de la qualité de matériaux au nitrure de groupe iii et structures produites par ces procédés |
WO2009141724A1 (fr) | 2008-05-23 | 2009-11-26 | S.O.I.Tec Silicon On Insulator Technologies | Élaboration de nitrure de gallium d’indium essentiellement sans cratère |
EP2324488B1 (fr) | 2008-08-27 | 2013-02-13 | Soitec | Procédés de fabrication de structures ou de dispositifs semi-conducteurs utilisant des couches de matériau semi-conducteur présentant des paramètres de réseau cristallin sélectionnés ou contrôlés |
EP2329056B1 (fr) | 2008-08-28 | 2012-12-19 | Soitec | Appareil de surveillance basé sur l absorption uv et commande d un courant de gaz de chlorure |
US8367520B2 (en) | 2008-09-22 | 2013-02-05 | Soitec | Methods and structures for altering strain in III-nitride materials |
WO2010036602A1 (fr) | 2008-09-26 | 2010-04-01 | S.O.I.Tec Silicon On Insulator Technologies | Procédé de formation d’un substrat composite pour laser |
CN102203904B (zh) | 2008-10-30 | 2013-11-20 | S.O.I.探测硅绝缘技术公司 | 形成具有减小的晶格应变的半导体材料层、半导体结构、装置的方法及包含具有减小的晶格应变的半导体材料层、半导体结构、装置的工程衬底 |
EP2364504B1 (fr) * | 2008-11-14 | 2019-08-28 | Soitec | Procédés d'amélioration de la qualité de structures comprenant des matériaux semi-conducteurs |
US8329565B2 (en) | 2008-11-14 | 2012-12-11 | Soitec | Methods for improving the quality of structures comprising semiconductor materials |
US20100187568A1 (en) | 2009-01-28 | 2010-07-29 | S.O.I.Tec Silicon On Insulator Technologies, S.A. | Epitaxial methods and structures for forming semiconductor materials |
EP2412006A1 (fr) * | 2009-02-05 | 2012-02-01 | S.O.I.Tec Silicon on Insulator Technologies | Procédés d'épitaxie et structures épitaxiales pour former des matériaux semi-conducteurs |
US20110277681A1 (en) | 2009-03-03 | 2011-11-17 | Chantal Arena | Gas injectors for cvd systems with the same |
US8178427B2 (en) | 2009-03-31 | 2012-05-15 | Commissariat A. L'energie Atomique | Epitaxial methods for reducing surface dislocation density in semiconductor materials |
WO2011004211A1 (fr) | 2009-07-08 | 2011-01-13 | S.O.I.Tec Silicon On Insulator Technologies | Substrat composite à couche de germination cristalline et couche de support à plan de clivage coïncident |
CN102640303A (zh) | 2009-07-17 | 2012-08-15 | 索泰克公司 | 使用基于锌、硅和氧的接合层的接合方法及相应的结构体 |
CN102473744B (zh) | 2009-07-20 | 2015-04-15 | Soitec | 使用量子点结构制造半导体结构和器件的方法及相关结构 |
TWI442455B (zh) | 2010-03-29 | 2014-06-21 | Soitec Silicon On Insulator | Iii-v族半導體結構及其形成方法 |
US20110305835A1 (en) | 2010-06-14 | 2011-12-15 | S.O.I.Tec Silicon On Insulator Technologies | Systems and methods for a gas treatment of a number of substrates |
US8436363B2 (en) | 2011-02-03 | 2013-05-07 | Soitec | Metallic carrier for layer transfer and methods for forming the same |
US8975165B2 (en) | 2011-02-17 | 2015-03-10 | Soitec | III-V semiconductor structures with diminished pit defects and methods for forming the same |
US20130052806A1 (en) | 2011-08-22 | 2013-02-28 | Soitec | Deposition systems having access gates at desirable locations, and related methods |
US20130052333A1 (en) | 2011-08-22 | 2013-02-28 | Soitec | Deposition systems having reaction chambers configured for in-situ metrology and related methods |
-
2010
- 2010-12-08 FR FR1060242A patent/FR2968678B1/fr active Active
-
2011
- 2011-09-22 TW TW100134215A patent/TWI517213B/zh not_active IP Right Cessation
- 2011-11-23 WO PCT/EP2011/070794 patent/WO2012069530A1/fr active Application Filing
- 2011-11-23 DE DE112011103871.2T patent/DE112011103871B4/de active Active
- 2011-11-23 JP JP2013540344A patent/JP2014500219A/ja active Pending
- 2011-11-23 US US13/988,996 patent/US9412580B2/en active Active
- 2011-11-23 CN CN201180056001.2A patent/CN103237929B/zh active Active
- 2011-11-23 KR KR1020137014538A patent/KR20130141575A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
US20130234157A1 (en) | 2013-09-12 |
FR2968678A1 (fr) | 2012-06-15 |
DE112011103871T5 (de) | 2013-08-22 |
JP2014500219A (ja) | 2014-01-09 |
TW201222633A (en) | 2012-06-01 |
US9412580B2 (en) | 2016-08-09 |
CN103237929B (zh) | 2017-07-11 |
DE112011103871B4 (de) | 2024-02-08 |
KR20130141575A (ko) | 2013-12-26 |
TWI517213B (zh) | 2016-01-11 |
WO2012069530A1 (fr) | 2012-05-31 |
CN103237929A (zh) | 2013-08-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FR2968678B1 (fr) | Procédés pour former des matériaux a base de nitrure du groupe iii et structures formées par ces procédés | |
CY2019025I1 (el) | Φαρμακευτικη συνθεση η οποια περιλαμβανει εναν μη νουκλεοσιδικο αναστολεα αναστροφης μεταγραφασης | |
FR2966305B1 (fr) | Structure acoustique heterogene formee a partir d'un materiau homogene | |
FI20095079A0 (fi) | Menetelmä olefiinisten monomeerien tuottamiseksi | |
DK2151429T3 (da) | Fremgangsmåde til fremstilling af agomelatin | |
FR2967164B1 (fr) | Procede de preparation de compositions a base de polypentosides | |
FI20116234A (fi) | Menetelmä alusmateriaalin valmistamiseksi sekä alusmateriaali | |
IT1400223B1 (it) | Macchina di formatura e procedimento per la fabbricazione di un imballaggio per pezzi formati | |
FR2953784B1 (fr) | Arrangement d'un support de haut parleur d'aigu sur un support haut-parleur | |
FR2963159B1 (fr) | Procedes de formation de structures semi-conductrices liees, et structures semi-conductrices formees par ces procedes | |
TH108209B (th) | เครื่องจักรสร้างสุญญากาศและวิธีของการทำผลิตภัณฑ์ที่ถูกสร้างแบบสุญญากาศ | |
TH108208B (th) | เครื่องจักรสร้างสุญญากาศและวิธีของการทำผลิตภัณฑ์ที่ถูกสร้างแบบสุญญากาศ | |
HU1000085D0 (en) | Production of base material for sanitary articles | |
TH126327B (th) | กระบวนการสำหรับการเตรียมเอไมด์ | |
FI20090157A0 (fi) | Rakennuksen pinnoittaminen | |
FI20090158A0 (fi) | Rakennuksen pinnoittaminen | |
TH131540B (th) | วิธีการสำหรับการผลิต Chromobotia macracanthus จำนวนมาก | |
TH109096B (th) | กระบวนการของสารอาหารหลัก | |
UA19572S (uk) | Розгортка упаковки | |
UA19784S (uk) | Розгортка упаковки | |
UA20113S (uk) | Розгортка упаковки | |
UA19956S (uk) | Розгортка упаковки | |
UA20434S (uk) | Розгортка упаковки | |
UA20114S (uk) | Розгортка упаковки | |
UA20115S (uk) | Розгортка упаковки |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
CD | Change of name or company name |
Owner name: SOITEC, FR Effective date: 20130109 Owner name: ARIZONA BOARD OF REGENTS FOR AND ON BEHALF OF , US Effective date: 20130109 |
|
PLFP | Fee payment |
Year of fee payment: 6 |
|
PLFP | Fee payment |
Year of fee payment: 7 |
|
PLFP | Fee payment |
Year of fee payment: 8 |
|
PLFP | Fee payment |
Year of fee payment: 10 |
|
PLFP | Fee payment |
Year of fee payment: 11 |
|
PLFP | Fee payment |
Year of fee payment: 12 |
|
PLFP | Fee payment |
Year of fee payment: 13 |
|
PLFP | Fee payment |
Year of fee payment: 14 |