FR2968678B1 - Procédés pour former des matériaux a base de nitrure du groupe iii et structures formées par ces procédés - Google Patents

Procédés pour former des matériaux a base de nitrure du groupe iii et structures formées par ces procédés

Info

Publication number
FR2968678B1
FR2968678B1 FR1060242A FR1060242A FR2968678B1 FR 2968678 B1 FR2968678 B1 FR 2968678B1 FR 1060242 A FR1060242 A FR 1060242A FR 1060242 A FR1060242 A FR 1060242A FR 2968678 B1 FR2968678 B1 FR 2968678B1
Authority
FR
France
Prior art keywords
methods
group iii
iii nitride
structures formed
formed therefrom
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1060242A
Other languages
English (en)
Other versions
FR2968678A1 (fr
Inventor
Chantal Arena
Jr Ronald Thomas Bertram
Ed Lindow
Subhash Mahajan
Fanyu Meng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Arizona Board Of Regents For And On Behalf Of Us
Soitec SA
Original Assignee
Soitec SA
University of Arizona
Arizona State University ASU
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soitec SA, University of Arizona, Arizona State University ASU filed Critical Soitec SA
Priority to FR1060242A priority Critical patent/FR2968678B1/fr
Priority to TW100134215A priority patent/TWI517213B/zh
Priority to JP2013540344A priority patent/JP2014500219A/ja
Priority to KR1020137014538A priority patent/KR20130141575A/ko
Priority to US13/988,996 priority patent/US9412580B2/en
Priority to PCT/EP2011/070794 priority patent/WO2012069530A1/fr
Priority to DE112011103871.2T priority patent/DE112011103871B4/de
Priority to CN201180056001.2A priority patent/CN103237929B/zh
Publication of FR2968678A1 publication Critical patent/FR2968678A1/fr
Application granted granted Critical
Publication of FR2968678B1 publication Critical patent/FR2968678B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
    • C30B29/406Gallium nitride
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/20Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
    • H01L29/2003Nitride compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Chemical Vapour Deposition (AREA)
FR1060242A 2010-11-23 2010-12-08 Procédés pour former des matériaux a base de nitrure du groupe iii et structures formées par ces procédés Active FR2968678B1 (fr)

Priority Applications (8)

Application Number Priority Date Filing Date Title
FR1060242A FR2968678B1 (fr) 2010-12-08 2010-12-08 Procédés pour former des matériaux a base de nitrure du groupe iii et structures formées par ces procédés
TW100134215A TWI517213B (zh) 2010-11-23 2011-09-22 形成第三族氮化物材料之方法及由該方法所形成之結構
KR1020137014538A KR20130141575A (ko) 2010-11-23 2011-11-23 Iii족-질화물을 형성하는 방법 및 이와 같은 방법에 의해 형성되는 구조
US13/988,996 US9412580B2 (en) 2010-11-23 2011-11-23 Methods for forming group III-nitride materials and structures formed by such methods
JP2013540344A JP2014500219A (ja) 2010-11-23 2011-11-23 Iii族窒化物材料を形成するための方法およびそうした方法によって形成される構造物
PCT/EP2011/070794 WO2012069530A1 (fr) 2010-11-23 2011-11-23 Procédés pour former des matières de nitrure du groupe iii, et structures formées par de tels procédés
DE112011103871.2T DE112011103871B4 (de) 2010-11-23 2011-11-23 Verfahren zum ausbilden von galliumnitrid-material und struktur, die durch ein derartiges verfahren ausgebildet wird
CN201180056001.2A CN103237929B (zh) 2010-11-23 2011-11-23 用于形成iii族氮化物材料的方法以及通过该方法形成的结构

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1060242A FR2968678B1 (fr) 2010-12-08 2010-12-08 Procédés pour former des matériaux a base de nitrure du groupe iii et structures formées par ces procédés

Publications (2)

Publication Number Publication Date
FR2968678A1 FR2968678A1 (fr) 2012-06-15
FR2968678B1 true FR2968678B1 (fr) 2015-11-20

Family

ID=44153261

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1060242A Active FR2968678B1 (fr) 2010-11-23 2010-12-08 Procédés pour former des matériaux a base de nitrure du groupe iii et structures formées par ces procédés

Country Status (8)

Country Link
US (1) US9412580B2 (fr)
JP (1) JP2014500219A (fr)
KR (1) KR20130141575A (fr)
CN (1) CN103237929B (fr)
DE (1) DE112011103871B4 (fr)
FR (1) FR2968678B1 (fr)
TW (1) TWI517213B (fr)
WO (1) WO2012069530A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014222691A (ja) * 2013-05-13 2014-11-27 日立金属株式会社 窒化物半導体テンプレートおよびその製造方法、並びに窒化物半導体発光素子
JP6375890B2 (ja) 2014-11-18 2018-08-22 日亜化学工業株式会社 窒化物半導体素子及びその製造方法
JP6851017B2 (ja) * 2016-05-18 2021-03-31 パナソニックIpマネジメント株式会社 デバイス及びその製造方法
WO2019123954A1 (fr) * 2017-12-21 2019-06-27 パナソニックIpマネジメント株式会社 Structure de film composite à base de nitrure et procédé pour sa fabrication
JP7157953B2 (ja) * 2017-12-21 2022-10-21 パナソニックIpマネジメント株式会社 窒化物系薄膜複合構造体及びその製造方法
TWI698915B (zh) * 2019-01-18 2020-07-11 國立交通大學 雲母片上異質磊晶半導體材料之製程方法
US20220344151A1 (en) * 2021-04-23 2022-10-27 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor Device and Method of Manufacture

Family Cites Families (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2682047B1 (fr) 1991-10-07 1993-11-12 Commissariat A Energie Atomique Reacteur de traitement chimique en phase gazeuse.
FR2682253A1 (fr) 1991-10-07 1993-04-09 Commissariat Energie Atomique Sole chauffante destinee a assurer le chauffage d'un objet dispose a sa surface et reacteur de traitement chimique muni de ladite sole.
US5972790A (en) 1995-06-09 1999-10-26 Tokyo Electron Limited Method for forming salicides
US6121140A (en) 1997-10-09 2000-09-19 Tokyo Electron Limited Method of improving surface morphology and reducing resistivity of chemical vapor deposition-metal films
FR2769924B1 (fr) * 1997-10-20 2000-03-10 Centre Nat Rech Scient Procede de realisation d'une couche epitaxiale de nitrure de gallium, couche epitaxiale de nitrure de gallium et composant optoelectronique muni d'une telle couche
US7560296B2 (en) * 2000-07-07 2009-07-14 Lumilog Process for producing an epitalixal layer of galium nitride
US6090705A (en) 1998-01-20 2000-07-18 Tokyo Electron Limited Method of eliminating edge effect in chemical vapor deposition of a metal
US6179913B1 (en) 1999-04-16 2001-01-30 Cbl Technologies, Inc. Compound gas injection system and methods
JP2001122693A (ja) * 1999-10-22 2001-05-08 Nec Corp 結晶成長用下地基板およびこれを用いた基板の製造方法
US6841808B2 (en) * 2000-06-23 2005-01-11 Toyoda Gosei Co., Ltd. Group III nitride compound semiconductor device and method for producing the same
JP4374156B2 (ja) * 2000-09-01 2009-12-02 日本碍子株式会社 Iii−v族窒化物膜の製造装置及び製造方法
US6613143B1 (en) 2001-07-06 2003-09-02 Technologies And Devices International, Inc. Method for fabricating bulk GaN single crystals
WO2003038957A1 (fr) * 2001-10-29 2003-05-08 Sharp Kabushiki Kaisha Dispositif a semi-conducteur au nitrure, son procede de fabrication et appareil optique a semi-conducteur
JP3749498B2 (ja) * 2002-03-26 2006-03-01 スタンレー電気株式会社 結晶成長用基板およびZnO系化合物半導体デバイス
WO2003096385A2 (fr) 2002-05-07 2003-11-20 Asm America, Inc. Structure silicium sur isolant et procedes correspondants
AUPS240402A0 (en) * 2002-05-17 2002-06-13 Macquarie Research Limited Gallium nitride
WO2004081986A2 (fr) 2003-03-12 2004-09-23 Asm America Inc. Procede de planarisation et de reduction de la densite des defauts du silicium germanium
CN1791966A (zh) * 2003-05-21 2006-06-21 卢米洛格股份有限公司 通过掩模用横向过生长来制备氮化镓衬底以及由此制备的器件
JP4371202B2 (ja) * 2003-06-27 2009-11-25 日立電線株式会社 窒化物半導体の製造方法及び半導体ウエハ並びに半導体デバイス
WO2005013326A2 (fr) 2003-07-30 2005-02-10 Asm America, Inc. Croissance epitaxiale de couches de silicium germanium relachees
US7816236B2 (en) 2005-02-04 2010-10-19 Asm America Inc. Selective deposition of silicon-containing films
KR20060127743A (ko) * 2005-06-06 2006-12-13 스미토모덴키고교가부시키가이샤 질화물 반도체 기판과 그 제조 방법
KR100616686B1 (ko) * 2005-06-10 2006-08-28 삼성전기주식회사 질화물계 반도체 장치의 제조 방법
WO2007122669A1 (fr) * 2006-03-29 2007-11-01 Fujitsu Limited PLAQUETTE SEMI-CONDUCTRICE COMPOSÉE COMPORTANT UN SUBSTRAT AU SiC POLYCRISTALLIN, DISPOSITIF SEMI-CONDUCTEUR COMPOSÉ, ET LEURS PROCÉDÉS DE PRODUCTION
US7785995B2 (en) 2006-05-09 2010-08-31 Asm America, Inc. Semiconductor buffer structures
US20080026149A1 (en) 2006-05-31 2008-01-31 Asm America, Inc. Methods and systems for selectively depositing si-containing films using chloropolysilanes
US20100242835A1 (en) 2006-06-09 2010-09-30 S.O.I.T.E.C. Silicon On Insulator Technologies High volume delivery system for gallium trichloride
US7928447B2 (en) * 2006-07-17 2011-04-19 Sumitomo Electric Industries, Ltd. GaN crystal substrate, fabricating method of GaN crystal substrate, and light-emitting device
WO2008130448A2 (fr) 2006-11-22 2008-10-30 S.O.I.Tec Silicon On Insulator Technologies Clapet obturateur contrôlé par la température dans une chambre de dépôt chimique en phase vapeur
JP5575482B2 (ja) 2006-11-22 2014-08-20 ソイテック 単結晶iii−v族半導体材料のエピタキシャル堆積法、及び堆積システム
WO2008064109A2 (fr) 2006-11-22 2008-05-29 S.O.I.Tec Silicon On Insulator Technologies Dispositif de fabrication à haut rendement de matériaux à semi-conducteurs du groupe iii-v
WO2008064077A2 (fr) 2006-11-22 2008-05-29 S.O.I.Tec Silicon On Insulator Technologies Procédé de fabrication en grand volume de matériaux semiconducteurs des groupes iii à v
KR101330156B1 (ko) 2006-11-22 2013-12-20 소이텍 삼염화 갈륨 주입 구조
US20090223441A1 (en) 2006-11-22 2009-09-10 Chantal Arena High volume delivery system for gallium trichloride
JP2008153634A (ja) * 2006-11-24 2008-07-03 Sony Corp 発光ダイオードの製造方法、発光ダイオード、光源セルユニット、発光ダイオードバックライト、発光ダイオード照明装置、発光ダイオードディスプレイおよび電子機器
WO2008141324A2 (fr) 2007-05-14 2008-11-20 S.O.I.Tec Silicon On Insulator Technologies Procédés pour améliorer la qualité de matériaux semi-conducteurs à croissance épitaxiale
FR2917232B1 (fr) 2007-06-06 2009-10-09 Soitec Silicon On Insulator Procede de fabrication d'une structure pour epitaxie sans zone d'exclusion.
US7732306B2 (en) * 2007-07-26 2010-06-08 S.O.I.Tec Silicon On Insulator Technologies Methods for producing improved epitaxial materials
CN101743618B (zh) 2007-07-26 2012-11-21 硅绝缘体技术有限公司 外延方法和通过该方法生长的模板
JP4631884B2 (ja) * 2007-08-22 2011-02-16 日立電線株式会社 閃亜鉛鉱型窒化物半導体自立基板、閃亜鉛鉱型窒化物半導体自立基板の製造方法、及び閃亜鉛鉱型窒化物半導体自立基板を用いた発光装置
WO2009063288A1 (fr) 2007-11-15 2009-05-22 S.O.I.Tec Silicon On Insulator Technologies Structure de semi-conducteur ayant une couche protectrice
JP5587205B2 (ja) 2007-12-20 2014-09-10 ソイテック エピタキシャル成長基板に前駆体ガスを送出するための装置
WO2009085561A2 (fr) 2007-12-20 2009-07-09 S.O.I.Tec Silicon On Insulator Technologies Procédés pour traitement de nettoyage en chambre in-situ pour la fabrication en gros volume de matériaux semi-conducteurs
JP2009167053A (ja) * 2008-01-16 2009-07-30 Sumitomo Electric Ind Ltd Iii族窒化物結晶の成長方法
US8388755B2 (en) 2008-02-27 2013-03-05 Soitec Thermalization of gaseous precursors in CVD reactors
WO2009139793A1 (fr) 2008-05-14 2009-11-19 S.O.I.Tec Silicon On Insulator Technologies Procédés d'amélioration de la qualité de matériaux au nitrure de groupe iii et structures produites par ces procédés
WO2009141724A1 (fr) 2008-05-23 2009-11-26 S.O.I.Tec Silicon On Insulator Technologies Élaboration de nitrure de gallium d’indium essentiellement sans cratère
EP2324488B1 (fr) 2008-08-27 2013-02-13 Soitec Procédés de fabrication de structures ou de dispositifs semi-conducteurs utilisant des couches de matériau semi-conducteur présentant des paramètres de réseau cristallin sélectionnés ou contrôlés
EP2329056B1 (fr) 2008-08-28 2012-12-19 Soitec Appareil de surveillance basé sur l absorption uv et commande d un courant de gaz de chlorure
US8367520B2 (en) 2008-09-22 2013-02-05 Soitec Methods and structures for altering strain in III-nitride materials
WO2010036602A1 (fr) 2008-09-26 2010-04-01 S.O.I.Tec Silicon On Insulator Technologies Procédé de formation d’un substrat composite pour laser
CN102203904B (zh) 2008-10-30 2013-11-20 S.O.I.探测硅绝缘技术公司 形成具有减小的晶格应变的半导体材料层、半导体结构、装置的方法及包含具有减小的晶格应变的半导体材料层、半导体结构、装置的工程衬底
EP2364504B1 (fr) * 2008-11-14 2019-08-28 Soitec Procédés d'amélioration de la qualité de structures comprenant des matériaux semi-conducteurs
US8329565B2 (en) 2008-11-14 2012-12-11 Soitec Methods for improving the quality of structures comprising semiconductor materials
US20100187568A1 (en) 2009-01-28 2010-07-29 S.O.I.Tec Silicon On Insulator Technologies, S.A. Epitaxial methods and structures for forming semiconductor materials
EP2412006A1 (fr) * 2009-02-05 2012-02-01 S.O.I.Tec Silicon on Insulator Technologies Procédés d'épitaxie et structures épitaxiales pour former des matériaux semi-conducteurs
US20110277681A1 (en) 2009-03-03 2011-11-17 Chantal Arena Gas injectors for cvd systems with the same
US8178427B2 (en) 2009-03-31 2012-05-15 Commissariat A. L'energie Atomique Epitaxial methods for reducing surface dislocation density in semiconductor materials
WO2011004211A1 (fr) 2009-07-08 2011-01-13 S.O.I.Tec Silicon On Insulator Technologies Substrat composite à couche de germination cristalline et couche de support à plan de clivage coïncident
CN102640303A (zh) 2009-07-17 2012-08-15 索泰克公司 使用基于锌、硅和氧的接合层的接合方法及相应的结构体
CN102473744B (zh) 2009-07-20 2015-04-15 Soitec 使用量子点结构制造半导体结构和器件的方法及相关结构
TWI442455B (zh) 2010-03-29 2014-06-21 Soitec Silicon On Insulator Iii-v族半導體結構及其形成方法
US20110305835A1 (en) 2010-06-14 2011-12-15 S.O.I.Tec Silicon On Insulator Technologies Systems and methods for a gas treatment of a number of substrates
US8436363B2 (en) 2011-02-03 2013-05-07 Soitec Metallic carrier for layer transfer and methods for forming the same
US8975165B2 (en) 2011-02-17 2015-03-10 Soitec III-V semiconductor structures with diminished pit defects and methods for forming the same
US20130052806A1 (en) 2011-08-22 2013-02-28 Soitec Deposition systems having access gates at desirable locations, and related methods
US20130052333A1 (en) 2011-08-22 2013-02-28 Soitec Deposition systems having reaction chambers configured for in-situ metrology and related methods

Also Published As

Publication number Publication date
US20130234157A1 (en) 2013-09-12
FR2968678A1 (fr) 2012-06-15
DE112011103871T5 (de) 2013-08-22
JP2014500219A (ja) 2014-01-09
TW201222633A (en) 2012-06-01
US9412580B2 (en) 2016-08-09
CN103237929B (zh) 2017-07-11
DE112011103871B4 (de) 2024-02-08
KR20130141575A (ko) 2013-12-26
TWI517213B (zh) 2016-01-11
WO2012069530A1 (fr) 2012-05-31
CN103237929A (zh) 2013-08-07

Similar Documents

Publication Publication Date Title
FR2968678B1 (fr) Procédés pour former des matériaux a base de nitrure du groupe iii et structures formées par ces procédés
CY2019025I1 (el) Φαρμακευτικη συνθεση η οποια περιλαμβανει εναν μη νουκλεοσιδικο αναστολεα αναστροφης μεταγραφασης
FR2966305B1 (fr) Structure acoustique heterogene formee a partir d'un materiau homogene
FI20095079A0 (fi) Menetelmä olefiinisten monomeerien tuottamiseksi
DK2151429T3 (da) Fremgangsmåde til fremstilling af agomelatin
FR2967164B1 (fr) Procede de preparation de compositions a base de polypentosides
FI20116234A (fi) Menetelmä alusmateriaalin valmistamiseksi sekä alusmateriaali
IT1400223B1 (it) Macchina di formatura e procedimento per la fabbricazione di un imballaggio per pezzi formati
FR2953784B1 (fr) Arrangement d'un support de haut parleur d'aigu sur un support haut-parleur
FR2963159B1 (fr) Procedes de formation de structures semi-conductrices liees, et structures semi-conductrices formees par ces procedes
TH108209B (th) เครื่องจักรสร้างสุญญากาศและวิธีของการทำผลิตภัณฑ์ที่ถูกสร้างแบบสุญญากาศ
TH108208B (th) เครื่องจักรสร้างสุญญากาศและวิธีของการทำผลิตภัณฑ์ที่ถูกสร้างแบบสุญญากาศ
HU1000085D0 (en) Production of base material for sanitary articles
TH126327B (th) กระบวนการสำหรับการเตรียมเอไมด์
FI20090157A0 (fi) Rakennuksen pinnoittaminen
FI20090158A0 (fi) Rakennuksen pinnoittaminen
TH131540B (th) วิธีการสำหรับการผลิต Chromobotia macracanthus จำนวนมาก
TH109096B (th) กระบวนการของสารอาหารหลัก
UA19572S (uk) Розгортка упаковки
UA19784S (uk) Розгортка упаковки
UA20113S (uk) Розгортка упаковки
UA19956S (uk) Розгортка упаковки
UA20434S (uk) Розгортка упаковки
UA20114S (uk) Розгортка упаковки
UA20115S (uk) Розгортка упаковки

Legal Events

Date Code Title Description
CD Change of name or company name

Owner name: SOITEC, FR

Effective date: 20130109

Owner name: ARIZONA BOARD OF REGENTS FOR AND ON BEHALF OF , US

Effective date: 20130109

PLFP Fee payment

Year of fee payment: 6

PLFP Fee payment

Year of fee payment: 7

PLFP Fee payment

Year of fee payment: 8

PLFP Fee payment

Year of fee payment: 10

PLFP Fee payment

Year of fee payment: 11

PLFP Fee payment

Year of fee payment: 12

PLFP Fee payment

Year of fee payment: 13

PLFP Fee payment

Year of fee payment: 14