TWI404248B - 封裝環境敏感裝置之方法 - Google Patents

封裝環境敏感裝置之方法 Download PDF

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TWI404248B
TWI404248B TW097101217A TW97101217A TWI404248B TW I404248 B TWI404248 B TW I404248B TW 097101217 A TW097101217 A TW 097101217A TW 97101217 A TW97101217 A TW 97101217A TW I404248 B TWI404248 B TW I404248B
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barrier
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Xi Chu
Steve Shi Lin
Gordon L Graff
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Description

封裝環境敏感裝置之方法
許多裝置易於起因於外界氣體或液體之滲透而劣化，諸如用於處理電子產品之大氣或化學物質中的氧氣及水蒸氣。該等裝置通常是被封裝以防止其劣化。
各種類型之裝置已為大家所知。舉例而言，美國專利第6,268,695號，名稱為"用於有機發光顯示裝置之環境阻障材料及其製造方法"，公告於2001年7月31日；6,522,067號，名稱為"用於有機發光顯示裝置之環境阻障材料及其製造方法"，公告於2003年2月18日；及6,570,325號，名稱為"用於有機發光顯示裝置之環境阻障材料及其製造方法"，公告於2003年5月27日，上述所有專利文獻都是以引用的方式併入本文中，其中描述封裝有機發光裝置(OLEDs)。美國專利第6,573,652號，名稱為"封裝顯示裝置"，公告於2003年6月3日，其是以引用的方式併入本文中，其中描述液晶顯示器(LCDs)、發光二極體(LEDs)、發光聚合物(LEPs)、使用電泳油墨之電子標誌、電致發光裝置(EDs)及磷光性裝置。美國專利第6,548,912號，名稱為"使用熱障塗層之半導體鈍化"，公告於2003年4月15日，其是以引用的方式併入本文中，其中描述封裝微電子裝置，包含積體電路、電荷耦合裝置、發光二極體、發光發射聚合物、有機發光顯示裝置、金屬傳感墊、微碟雷射、電變色裝置、光敏材料裝置、微型機電系統、及太陽能電池。
一般而言，封裝裝置是藉由在鄰近裝置一側或兩側處沉 積阻障堆疊體製造成。該阻障堆疊體一般包含至少一阻障層及至少一解耦層。該處可有一解耦層及一阻障層，該處可有多數個解耦層於一個或一個以上阻障層之一側上，或該處可有一個或一個以上解耦層於一個或一個以上阻障層之兩側上。重點是該阻障堆疊體有至少一阻障層及至少一解耦層。
一封裝顯示裝置之一實施例示於圖1中。該封裝顯示裝置100包含一基板105，一顯示裝置110及一阻障堆疊體115。該阻障堆疊體115包含一阻障層120及一解耦層125。該阻障堆疊體115封裝該顯示裝置110以防止周圍氧氣及水蒸氣劣化該顯示裝置。
阻障堆疊體上之阻障層與解耦層可由同一種材料或一不同材料製成。該阻障層一般大約100－1000厚，該解耦層一般大約1000－10,000厚。
儘管只有一阻障堆疊體被顯示於圖1中，但阻障堆疊體之數量是沒有限制的。阻障堆疊體數量之需要取決於特殊應用需要之水蒸氣及氧氣滲透耐力之標準。一個或兩個阻障堆疊體應為多數申請提供足夠之阻障性能，及三個或四個阻障堆疊體應足夠以提供最多。最嚴格之應用可能要求五個或五個以上阻障堆疊體。
阻障層可使用一真空處理法被沉積成，諸如噴射，化學蒸汽沉積，電漿增強化學蒸汽沉積、揮發、昇華、電子回旋共振電漿增強蒸汽沉積(ECR－PECVD)及其等組合。適合的阻障材料包含，但不限於，金屬物、金屬氧化物、金屬 氮化物、金屬碳化物、金屬氧氮化物、金屬氧碳化物及其等組合。阻障層可被分級混合物阻障層，如若需要。適當的分級混合物阻障層包含，但不限於，此等被描述於美國專利案第7,015,640號，其係以引用的方式併入本文中。
解耦層可使用一真空處理法被沉積成，諸如在真空下之原地聚合之快速蒸發，或電漿沉積及聚合現象，或常壓處理，諸如旋塗、墨噴式印刷、絲網印刷、或噴射。適合的解耦層材料包含，但不限於，有機聚合物、無機聚合物、有機金屬化合物、混合有機/無機聚合物系統、及矽酸鹽。
在環境敏感裝置封裝期間操作為分離片體形式之撓性基板是困難的。分離片體必須相對於用以沉積阻障物、裝置等等之設備之不同部件予以正確安置。舉例而言，使用遮罩之多種沉積步驟必須是被正確地安置及就基板而言是可再生產，以便達到其特有之覆蓋率。為了保持在處理過程期間其位置之正確性，該等分離片體需要放在一剛性基板上或被一夾持系統緊緊地支撐住。然而，由於撓性基板之塑性(例如，在外施應力下之流動及變形)經由機械夾緊保持一聚合物片體並不簡單。此外，封裝處理過程施加一熱度於聚合物基板上，其有兩個不利之影響。隨著薄膜之熱度塑性流動導致變形顯著增加及當達到玻璃轉變溫度(Tg)時其可能會有大變動。雖然熱膨脹係數(TCE)可能不顯得那麼重要，但是在其面積是若干英吋乘以若干英吋時其在x－y面上是重要的。兩個影響都可引起一片在處理過程一 開始之一溫度下其開頭部分被緊緊支撐之薄膜隨著處理加熱該薄膜變的鬆弛及變形。另外，另一普遍之系統無法在真空沉積處理過程中被使用。在該配置中，該薄膜是被安置於一具有連接到真空系統之通道之剛性板上，及一真空汞被用於在薄膜下位於該薄膜與將該薄膜固持在定位之板片的接觸處建立一真空。該薄膜是被在薄膜接觸面上之氣壓所支撐。然而，此在一真空環境下無法實施。
另外，於撓性基板上使用捲軸形式之阻障物係存在一重要問題。不管其等如何被用作裝置之基板，切割該基板於一恰當尺寸之操作以完成裝置會使切割邊緣曝露至滲入污染物。針對此問題已提出之解決方案一般要求附加精確的製造步驟，或者會導致一損失撓性基板之一些或全部優點之構造。
因此，存在一在封裝環境敏感裝置期間處理分離片體之方法之需要。
本發明藉由提供一封裝一環境敏感裝置之方法以符合此需要。該方法包括提供一撓性基板；切割該撓性基板成為分離片體；藉由使用一可逆性黏著劑暫時疊層該撓性基板於一剛性支持物上；選擇性地施加一第一阻障堆疊體鄰接於該撓性基板上，該第一阻障堆疊體包括至少一阻障層及至少一解耦層；施加環境敏感裝置鄰接於該撓性基板上；施加一第二阻障堆疊體鄰接於該環境敏感裝置上，該第二阻障堆疊體包括至少一阻障層及至少一解耦層，該環境敏 感裝置被封裝於該基板與該第二阻障堆疊體之間，該基板與第二阻障堆疊體形成一密封，或者被封裝在該第一阻障堆疊體與該第二阻障堆疊體之間，該第一與第二阻障堆疊體形成一密封；及反轉改性可逆性黏著劑，以將該封裝環境敏感裝置從剛性支持物上移除。
在另一實施例中，該方法包括以分離片體形式提供一撓性基板；暫時疊層該撓性基板於一剛性支持物上；施加一第一阻障堆疊體鄰接於該撓性基板上，該第一阻障堆疊體包括至少一阻障層及至少一解耦層；施加環境敏感裝置鄰接於該撓性基板上；施加一片阻障物材料鄰接於該環境敏感裝置上，以將該環境敏感裝置封裝在該第一阻障堆疊體與該片阻障物材料之間，該第一阻障堆疊體與該片阻障物材料形成一密封；並且將該封裝環境敏感裝置從剛性支持物上移除。
術語鄰接於係表示相鄰，但非必然地直接相鄰。在兩相鄰層之間亦可有附加層。
本發明使用一易於反轉改性疊層以便固定撓性基板上之分離片體於剛性支持物上。此提供一結構，其與環境敏感裝置諸如有機發光顯示裝置(OLEDs)的當前製造過程及設備有更好之兼容性。其溫度均勻性與玻璃一樣好，可允許一單體均勻沉積於撓性基板之分離片體上。本發明同樣包含一無溶劑界面損傷處理過程，避免與溶劑使用有關聯之複雜性。
支撐撓性基板於一剛性支持物上之一優點是撓性基板之片體是被曾經安置於剛性支持物上的及經由一在真空環境中生效之黏著劑被固定的。可採用已發展用於在真空環境中被處理之剛性材料的夾持系統，該等剛性材料諸如玻璃塗層工藝、矽晶圓工藝、印刷電路板工藝、晶片等等。亦可採用精確的放置構件。結合柔韌性薄膜於一剛性支持物上提供較多熱度傳輸於薄膜與支持物之間，允許支持物作為針對不必要之製程加熱之一更有效之散熱器。儘管該柔韌性薄膜仍然有一熱膨脹係數(TCE)，黏著劑之細心選擇及剛性支持物可平均化該等差異所導致之關聯的潛在膨脹問題。另外，該黏著劑本身就是塑料的(即，其在加熱時可流動及變形)並可承受熱膨脹。
一般地，本發明之處理過程包含提供一撓性基板；切割該撓性基板成為分離片體；藉由使用一可逆性黏著劑暫時疊層該撓性基板於一剛性支持物上；選擇性地施加一第一阻障堆疊體鄰接該撓性基板上，該第一阻障堆疊體包括至少一阻障層及至少一解耦層；施加環境敏感裝置鄰接該撓性基板上；施加一第二阻障堆疊體鄰接該環境敏感裝置上，該第二阻障堆疊體包括至少一阻障層及至少一解耦層，該環境敏感裝置被封裝於基板與第二阻障堆疊體之間，該基板與第二阻障堆疊體形成一密封，或在第一阻障堆疊體與第二阻障堆疊體之間，第一與第二阻障堆疊體形成一密封；及反轉改性可逆性黏著劑並把該封裝環境敏感裝置從剛性支持物上移除。
適宜之撓性基板包含，但不限於，聚合物薄膜，金屬及金屬箔。
該撓性基板可包含一個或一個以上功能層。適宜之功能層包含但不限於平坦化層、黏著促進層、防刮傷層、有機或無機層、防反射層、防指紋塗層、抗靜電塗層、電子傳導層、電極層、及此等之結合層。
該撓性基板可包含一第一阻障堆疊體，或一第一阻障堆疊體可在處理過程中被添加。該第一阻障堆疊體可經由使用多種途徑被應用，包含但不限於，建立一邊緣密封之處理過程。適宜的邊緣密封處理過程被描述於美國專利案第6,866,901號，其是以引用的方式併入本文中。
在一分離片體是用於傳輸一陣列裝置的情況中，該第一阻障堆疊體可被建構成具有密封邊緣之一恰當尺寸區域陣列。儘管此等陣列之遮罩提供一重大挑戰，但其可提供當前存在之已建構的遮罩性能。
環境敏感裝置包含，但不限於，有機發光裝置、液晶顯示器、使用電泳油墨之顯示器、發光二極體、發光聚合物、電致發光裝置、磷光性裝置、電泳油墨、有機太陽能電池、無機太陽能電池、薄膜電池組、具有通道之薄膜裝置、積體電路、電荷耦合裝置、金屬傳感器、微碟雷射、電致變色裝置、光致變色材料裝置、微型機電系統、及太陽能電池及其等之組合。
該環境敏感裝置是被密封於基板及第二阻障堆疊體之間，或在第一阻障堆疊體與第二阻障堆疊體之間，以用於 封裝該環境敏感裝置。該第二阻障堆疊體可經由形成一邊緣密封之多種處理過程來施加。
圖2顯示根據本發明之一實施例被製造成的封裝裝置。撓性基板210有一預先被施加之一第一阻障堆疊體215。該等阻障堆疊體之單層並未顯示。撓性基板210及阻障堆疊體215是經由使用一可逆性黏著劑225暫時地被疊層鄰接於剛性支持物220上。適宜的可逆性黏著劑包含，但不限於，熱活化黏著劑、壓感黏著劑、紫外線(UV)活化黏著劑、或此等之組合。
熱活化黏著劑是被加熱的以活化及逆轉改性該黏著劑。適宜的熱活化黏著劑包含，但不限於，聚醯胺、乙烯－乙烯醇共聚物、乙烯－醋酸乙烯共聚物、烴類樹脂、丙烯酸及丙烯酸共聚物。該熱活化黏著劑可包含附加成份以改變其性質，包含活化溫度控制、吸著力(tack)、熔體黏度、熱穩定性、及針對特殊基板之黏性。該附加成份可理想地被選定，以便該黏著劑不會有在真空環境中會漂流之成份。該黏著劑在不會夾帶過剩空氣情況下是可被適當地應用。
壓感黏著劑是以控制黏著強度為基準地以便該壓感黏著劑可黏合一第一基板，在第一基板上壓感黏著劑是經由壓力下之接觸點被安置於第二基板一表面上，但該黏著強度是受限的以便其在移除力超過黏著強度時允許第一基板可被從第二基板上移除。當適當地闡述時，該等黏著劑有相當強之黏合性於該第一基板上以便在被移除時可仍然固定 於第一基板上。該壓感黏著劑可被應用於剛性支持物上，其可允許撓性基板上之封裝裝置移除而不需要把黏著劑層從撓性基板上清除。舉例而言，一批剛性支持物可被一預先被施加之壓感黏著劑及一分離片體調配以防止碎片黏合於黏著劑表面。此等剛性支持物可被供應給一撓性基板定線及附著點。一批預切柔韌性薄膜基板，或有或沒有一裝置，可被供應給該定線及附著點，被安置及連接以製造分層薄片。此類選擇及沉積點及處理過程是被用來安置晶片於板體上的。
紫外線活化黏著劑提供一黏著表面作為被施加。此允許撓性基板可被附著於剛性支持物上。紫外線照射導致黏著力損失及因此，分離該撓性基板。不同之機械裝置可提供此結果。一方法是併入一組件於塗層結構內，其降低回應紫外線照射從而減少及/或消除塗層之黏著劑性能。另一方法是包含一組件於塗層內，其經受相當大的交叉耦合(聚合現象)回應於紫外線照射。交叉耦合及伴隨交叉耦合之收縮經常導致一黏著力之減少，當機械裝置被涉及不包含與交叉耦合塗層連接的表面之反應。當起初被施加，該塗層有黏著劑性能，但當被曝露於紫外線輻射時，交叉耦合發生，導致黏著劑性能之損失。
另一考慮事項是施加之方法。一普遍之途徑涉及加熱該黏著劑以形成一可被塗敷及"凝固"在適當位置之熔體。一替化方式係用於在一溶劑內消融黏著劑成分及利用傳統常壓處理過程施加該混合劑。此處理過程有一優越能力之優 勢以控制存儲黏著劑數量及均一性。利用傳統塗層處理過程以施加該混合劑作為預成形體之一混合物，在施加之後起作用(部分地交鍵結合)以形成一黏著劑層是可行的。壓敏丙烯酸和氨基甲酸乙酯黏著劑通常利用此途徑被施加之。活性的預成形體混合物可在本質上是100%固態的。若該等成份經選定係具有低蒸汽壓力，則其等可被施加於真空中，如若需要。換言之，其等可被與一溶劑結合以簡單化該施加，且該溶劑在施加之後及固化開始之前可被揮發掉。後一途徑一般使用低聚合成份，其是自我交鍵耦合以避免把其分配給形成於低分子量預成形體與用於塗敷之溶劑間之共沸混合物。
另一考慮事項是被塗敷於可逆性黏著劑之表面。比起一分離片體其是相當容易塗敷一網體的。然而，操作阻障塗層薄膜需要特殊注意以防止損壞，積累碎片，或過早曝露於周圍污染物中。因此，可能是理想地施加黏著劑於剛性支持物上，幫助最小化阻障塗層薄膜之操作。
環境敏感裝置230之後被施加鄰接於撓性基板210上之第一阻障堆疊體215上。該環境敏感裝置可經由直接沉積被施加，或其可被先製造而後被安置鄰接於第一阻障堆疊體上。
一包含一邊緣密封之第二阻障堆疊體235是被施加鄰接環境敏感裝置230，並且被密封於第一阻障堆疊體215與第二阻障堆疊體235之間。
在環境敏感裝置230被封裝之後，黏著劑225是經由使用 一適合於可逆性黏著劑類型之方法被反轉改性。
各個封裝環境敏感裝置經由切割柔韌性支持物210及第一阻障堆疊體215而被分離。然而，經由切割通過第一阻障堆疊體會將第一阻障堆疊體之多層體曝露至污染物。
製造封裝環境敏感裝置之另一方法被顯示於圖3。在此實例中，撓性基板310是經由使用一可逆性黏著劑325暫時被疊層於剛性支持物320上。第一阻障堆疊體315，其包含一邊緣密封，邊緣密封在撓性基板310被疊層鄰接於剛性支持物320之後被施加的。阻障堆疊體之各個層體並未顯示。第一阻障堆疊體315是被施加在位於撓性基板310之使用遮罩的分離區域上。環境敏感裝置330是經由第二阻障堆疊體335被封裝的，其有一邊緣密封。可逆性黏著劑325可被反轉改性，且剛性支持物320可被移除。
各個封裝環境敏感裝置可經由切割通過撓性基板310被分離。在此實施例中，因為第一阻障堆疊體315是被施加位於撓性基板310之分離區域上的，該各個封裝環境敏感裝置不需要經由切割通過第一阻障堆疊體315即可被分離。此避免了當阻障堆疊體總成被切割時經常被注意到的損害。
圖4顯示製造封裝環境敏感裝置之另一方法。撓性基板410有一預先被應用之第一阻障堆疊體415。阻障堆疊體之各個層體並未顯示。撓性基板410被切割成尺寸適合於環境敏感裝置430之分離片體以便被應用。撓性基板410之分離片體及預先被施加之第一阻障堆疊體415是經由一可逆 性黏著劑425被暫時的疊層鄰接剛性支持物420上的。環境敏感裝置430是被施加鄰接於第一阻障堆疊體415，及經由包含一邊緣密封之第二阻障堆疊體435被封裝的。該黏著劑可被反轉改性，且剛性支持物420可被移除。各個封裝環境敏感裝置是經由移除剛性支持物420被分離的；分離不需要切割。此途徑允許當撓性基板410與第一阻障堆疊體415被切割成分離片體時一邊緣密封之生成以便阻障堆疊體邊緣被曝露。
黏著層425在每一循環之後都可被替換，如若需要。此有助於消除污染物及碎片將被滯留於黏著劑內之問題。
另一方法被顯示於圖5中。在此方案中，撓性基板510是被切割成有一適合於環境敏感裝置530之尺寸之分離片體。撓性基板510之分離片體是經由一可逆性黏著劑525被暫時的疊層於剛性支持物520上的。第一阻障堆疊體515，其有一邊緣密封，是被沉積鄰接於撓性基板510的。阻障堆疊體之各個層體並未顯示。環境敏感裝置530被製造鄰接於第一阻障堆疊體515，及有一邊緣密封以封裝該裝置之第二阻障堆疊體535。黏著劑525是可反轉改性的，及剛性支持物520是可移除的。剛性支持物520之移除分離該各個封裝環境敏感裝置；不需要切割。
還有另一方法被顯示於圖6。撓性基板610有一預先被施加之第一阻障堆疊體615。該撓性基板610被切割成尺寸適合於環境敏感裝置630之分離片體。撓性基板610及阻障堆疊體615是經由一可逆性黏著劑625被暫時的疊層於剛性支 持物620上的。阻障堆疊體之各個層體並未顯示。在此方案中，阻障堆疊體615面向黏著劑625，而並非像撓性基板610面向黏著劑625一樣。一隨意功能層640，諸如一防刮傷層，可被包含於阻障堆疊體615上及可被作為阻障堆疊體615與黏著劑625間之交界面。環境敏感裝置630被製造鄰接於撓性基板610，及被第二阻障堆疊體635封裝，其有一邊緣密封。此方案允許第二阻障堆疊體635保護第一阻障堆疊體615上之邊緣，其在當撓性基板610與第一阻障堆疊體615被切割成分離片體時被曝露。
換言之在圖2－6中，第二阻障可堆疊體疊層可是一阻障材料片，諸如一片金屬或金屬箔，其可被疊層於環境敏感裝置上。圖7顯示製造封裝環境敏感裝置之另一方法。在此方案中，撓性基板710包含一預先被施加之三維阻障層745。撓性基板710是經由一可逆性黏著劑725被暫時的疊層於剛性支持物720上。環境敏感裝置730被製造成鄰接於撓性基板710。一第二三維阻障層750封裝環境敏感裝置730。黏著劑725是可被反轉改性的，及剛性支持物720是可被移除的。撓性基板710可被切割以便分離各個封裝環境敏感裝置。三維第一及第二阻障層之一優點是其等在切割阻障層時不包括該阻障層。一製造一三維阻障層之一方法是被描述於美國申請案第11/627583號(代理人檔案號VIT 0064 PA)，同時由此主張之，被命名"三維多層阻障層及其製造方法"，其是以引用的方式併入本文中。另一方法被顯示於圖8。在此實施例中，撓性基板810上是無阻障 堆疊體的。舉例而言，撓性基板可為一金屬或金屬箔。撓性基板810經由一可逆性黏著劑825被暫時的疊層於剛性支持物820上。一第二阻障堆疊體835是被施加鄰接於環境敏感裝置830的。該第二阻障堆疊體835經由使用一黏著劑845疊層一預先被施加的第二阻障堆疊體835之可彎曲薄膜840可被施加。其它疊層方法可被使用包含，但不限於，使用加熱。一吸氣材料可被包含於黏著劑825與環境敏感裝置830之間。
一覆蓋片體可被疊層於一陣列環境敏感裝置上。黏著劑/密封劑(及任意吸氣劑)經由使用一遮罩或一印刷技術諸如噴墨可被覆蓋以環繞撓性基板上之裝置陣列之每一者。另一方法是黏著劑/密封劑層被施加於整個表面(裝置以及裝置之間區域)之使用。一第三方法是使用選擇及沉積裝配以施加各個覆蓋層於每一裝置上。在此情況下，黏著劑/密封劑可被如先前描述之頭兩個途徑一樣被施加。
換言之，第二阻障堆疊體835可經由使用真空或大氣處理過程被沉積鄰接於環境敏感裝置830。在此情況下，可彎曲薄膜840及黏著劑845將不會被使用。
該處可有一個或一個以上第一及/或第二阻障堆疊體。該等阻障堆疊體可包含至少一解耦層及至少一阻障層。舉例而言，封裝環境敏感裝置之一適宜的配置被顯示於圖9中。撓性基板910經由使用一可逆性黏著劑925被暫時的疊層於剛性支持物920上。第一阻障堆疊體915是鄰接於撓性基板910的。封裝環境敏感裝置930是鄰接於第一阻障堆疊 體915。第二阻障堆疊體935是鄰接於封裝環境敏感裝置930。第一及第二阻障堆疊體915，935是藉由替換解耦層940及阻障層945被製造的。該處有5個替換解耦層及阻障層之第一阻障堆疊體915，及7個第二阻障堆疊體935。在第二阻障堆疊體935中，鄰接環境敏感裝置的阻障層可比其它阻障層厚，且最後的解耦層(頂層)可比其它解耦層厚，如若需要。圖9僅顯示不同層體之序列；其並未顯示阻障堆疊體之邊緣密封。
實例1
圖10顯示被測試之一結構實施例。撓性基板1005是聚乙烯環烷酸鹽。其兩側具有一硬塗層[二乙基二硫代氨基甲酸鈉工藝(SDC Technology)，晶體塗層MP 101]1010。其同樣有預先被施加之阻障堆疊體1015其含有5排氧化鋁交互層1020及丙烯酸酯聚合物1025及一附加氧化鋁層1020。撓性基板及阻障堆疊體是經由使用一可逆性黏著劑(3M 668 Thermo Bond)1035被暫時的疊層於剛性玻璃支持物1030上的。一鈣層1040，其是被用於測試阻障性能的，其後被沉積於第一阻障堆疊體1015上。該鈣式測試被描述於Nisato等，"有機發光顯示裝置(OLEDs)之薄膜封裝：使用鈣式測試的多層阻障層之鑒定，"2003年SID第3摘要之550－553頁，其是以引用的方式併入本文的。第二阻障堆疊體1045而後被沉積。第二阻障堆疊體是7排氧化鋁交互層1050及丙烯酸酯聚合物1055。第一氧化層(鄰接鈣層1040)及最後之聚合物層(頂層)比剩下的層體厚。此等樣品 有相當短的使用期，一般而言在60℃及90%電阻加熱時大約為25小時。最好的結果大約為100小時，但其對阻障塗層撓性基板有相當大的損害。
該試驗藉由疊層預先被施加之阻障堆疊體之撓性基板於剛性玻璃支持物上被重複。三個層體，一快速處理過程氧化鋁，丙烯酸酯聚合物，及氧化鋁在鈣式測試修補沉積及封裝之前被安置於阻障堆疊體上。此作法用以解決被認為由於來自撓性基板及阻障堆疊體之運輸及/或操作的碎片之問題。此試驗被顯示有優良之結果，大約90%鈣樣品在60℃及90%電阻加熱500小時之後可通過。
雖然已顯示意在說明本發明之特定代表性實施例及細節，然而熟習此項技術者應可明瞭，在不違背本發明之範圍的情況下，可對本文中所揭示之結構及方法施行各種變化，本發明之範圍係被定義於後附之請求項。
100‧‧‧封裝顯示裝置
105‧‧‧基板
110‧‧‧顯示裝置
115‧‧‧阻障堆疊體
120‧‧‧阻障層
125‧‧‧解耦層
210‧‧‧撓性基板
215‧‧‧阻障堆疊體
220‧‧‧剛性支持物
225‧‧‧可逆性黏著劑
230‧‧‧環境敏感裝置
235‧‧‧第二阻障堆疊體
310‧‧‧撓性基板
315‧‧‧第一阻障堆疊體
320‧‧‧剛性支持物
325‧‧‧可逆性黏著劑
330‧‧‧環境敏感裝置
335‧‧‧第二阻障堆疊體
410‧‧‧撓性基板
415‧‧‧第一阻障堆疊體
420‧‧‧剛性支持物
425‧‧‧可逆性黏著劑
430‧‧‧環境敏感裝置
435‧‧‧第二阻障堆疊體
510‧‧‧撓性基板
515‧‧‧第一阻障堆疊體
520‧‧‧剛性支持物
525‧‧‧可逆性黏著劑
530‧‧‧環境敏感裝置
535‧‧‧第二阻障堆疊體
610‧‧‧撓性基板
615‧‧‧阻障堆疊體
620‧‧‧剛性支持物
625‧‧‧可逆性黏著劑
630‧‧‧環境敏感裝置
635‧‧‧第二阻障堆疊體
710‧‧‧撓性基板
715‧‧‧三維阻障層
720‧‧‧剛性支持物
725‧‧‧可逆性黏著劑
730‧‧‧環境敏感裝置
750‧‧‧第二三維阻障層
810‧‧‧撓性基板
820‧‧‧剛性支持物
825‧‧‧可逆性黏著劑
830‧‧‧環境敏感裝置
835‧‧‧第二阻障堆疊體
840‧‧‧可彎曲薄膜
845‧‧‧黏著劑
910‧‧‧撓性基板
915‧‧‧第一阻障堆疊體
920‧‧‧剛性支持物
925‧‧‧可逆性黏著劑
930‧‧‧環境敏感裝置
935‧‧‧第二阻障堆疊體
940‧‧‧解耦層
945‧‧‧阻障層
1005‧‧‧撓性基板
1010‧‧‧硬塗層
1015‧‧‧第一阻障堆疊體
1020‧‧‧氧化鋁層
1025‧‧‧丙烯酸酯聚合物
1030‧‧‧剛性玻璃支持物
1035‧‧‧可逆性黏著劑
1040‧‧‧鈣層
1045‧‧‧第二阻障堆疊體
1050‧‧‧氧化鋁交互層
1055‧‧‧丙烯酸酯聚合物
圖1係一封裝環境敏感裝置之視圖。
圖2係一根據本發明之一實施例製造的封裝環境敏感裝置之視圖。
圖3係一根據本發明之另一實施例製造的封裝環境敏感裝置之視圖。
圖4係一根據本發明之另一實施例製造的封裝環境敏感裝置之視圖。
圖5係一根據本發明之另一實施例製造的封裝環境敏感裝置之視圖。
圖6係一根據本發明之另一實施例製造的封裝環境敏感裝置之視圖。
圖7係一根據本發明之另一實施例製造的封裝環境敏感裝置之視圖。
圖8係一根據本發明之另一實施例製造的封裝環境敏感裝置之視圖。
圖9係本發明之第一及第二阻障堆疊體之一實施例的結構視圖。
圖10係本發明之第一及第二阻障堆疊體之一實施例的結構視圖。
210‧‧‧撓性基板
215‧‧‧阻障堆疊體
220‧‧‧剛性支持物
225‧‧‧可逆性黏著劑
230‧‧‧環境敏感裝置
235‧‧‧第二阻障堆疊體

Claims (20)

  1. 一種封裝一環境敏感裝置之方法，其包括：以分離片體形式提供一撓性基板；暫時地疊層該撓性基板鄰接於一剛性支持物上；選擇性地施加一第一阻障堆疊體鄰接於該撓性基板上，該第一阻障堆疊體包括至少一阻障層及至少一解耦層；施加環境敏感裝置鄰接該撓性基板上；施加一第二阻障堆疊體鄰接該環境敏感裝置上，該第二阻障堆疊體包括至少一阻障層及至少一解耦層，該環境敏感裝置被封裝於該基板與該第二阻障堆疊體之間，該基板與該第二阻障堆疊體形成一密封；將該封裝環境敏感裝置從該剛性支持物上移除；及在該環境敏感裝置被施加之前，施加一薄膜電晶體陣列。
  2. 如請求項1之方法，其中該撓性基板係經由使用一選自熱活化黏著劑、壓感黏著劑、紫外線(UV)活化黏著劑或此等之組合之可逆性黏著劑被暫時地疊層於剛性支持物上。
  3. 如請求項1至2中任一項之方法，其中該撓性基板係在該撓性基板被疊層鄰接於剛性支持物之前被切割成分離片體形狀。
  4. 如請求項1至2中任一項之方法，其中該撓性基板係在該撓性基板被疊層鄰接於剛性支持物之後被切割成分離片 體形狀。
  5. 如請求項1之方法，其中該撓性基板係被切割成分離片體形狀，且其中該第一阻障堆疊體係在該撓性基板被切割成分離片體形狀之前被施加。
  6. 如請求項1之方法，其中該撓性基板係被切割成分離片體形狀，且其中該第一阻障堆疊體係在該撓性基板被切割成分離片體形狀之後被施加。
  7. 如請求項1之方法，其中該第一阻障堆疊體係在該撓性基板被疊層鄰接於該剛性支持物之前被施加。
  8. 如請求項1之方法，其中該第一阻障堆疊體係在該撓性基板被疊層鄰接於該剛性支持物之後被施加。
  9. 如請求項1之方法，其進一步包括將在該撓性基板上的封裝環境敏感裝置從在該撓性基板上的另一封裝環境敏感裝置分離。
  10. 如請求項1之方法，其中該第一阻障堆疊體係經由使用一遮罩被施加。
  11. 如請求項1之方法，其中該第二阻障堆疊體係經由使用一遮罩被施加。
  12. 如請求項1之方法，其中該第一阻障堆疊體係在一邊緣上被密封。
  13. 如請求項1之方法，其中該第二阻障堆疊體係在一邊緣上被密封。
  14. 如請求項1之方法，其進一步包括施加一功能層鄰接於該撓性基板上。
  15. 如請求項1之方法，其中該第一阻障堆疊體係被施加於該環境敏感裝置之與該撓性基板相對置之一側上。
  16. 如請求項1之方法，其中施加一第二阻障堆疊體鄰接於該環境敏感裝置上係包括沉積該第二阻障堆疊體鄰接於該環境敏感裝置。
  17. 如請求項16之方法，其中沉積該第二阻障堆疊體鄰接於該環境敏感裝置上係包括真空沉積該第二阻障堆疊體鄰接於該環境敏感裝置。
  18. 如請求項1之方法，其中施加該第二阻障堆疊體鄰接於該環境敏感裝置上係包括疊層該第二阻障堆疊體鄰接於該環境敏感裝置。
  19. 如請求項18之方法，其中該第二阻障堆疊體係經由使用熱、黏著劑或其等組合被疊層鄰接於該環境敏感裝置。
  20. 一種封裝一環境敏感裝置之方法，其包括：以分離片體形式提供一撓性基板；暫時地疊層該撓性基板鄰接於一剛性支持物上；施加一第一阻障堆疊體鄰接於該撓性基板上，該第一阻障堆疊體包括至少一阻障層及至少一解耦層；施加一環境敏感裝置鄰接該撓性基板上；施加一阻障材料片鄰接於該環境敏感裝置以將該環境敏感裝置封裝於該基板與該阻障材料片之間，該基板與該阻障材料片形成一密封；將該封裝環境敏感裝置從該剛性支持物上移除；及在該環境敏感裝置被施加之前，施加一薄膜電晶體陣列。
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