TWI324626B - Anti-reflective coatings for photolithography and methods of preparation thereof - Google Patents
Anti-reflective coatings for photolithography and methods of preparation thereof Download PDFInfo
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- TWI324626B TWI324626B TW091133495A TW91133495A TWI324626B TW I324626 B TWI324626 B TW I324626B TW 091133495 A TW091133495 A TW 091133495A TW 91133495 A TW91133495 A TW 91133495A TW I324626 B TWI324626 B TW I324626B
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- deionized water
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- 239000006117 anti-reflective coating Substances 0.000 title description 61
- 238000000034 method Methods 0.000 title description 51
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- 238000002360 preparation method Methods 0.000 title description 2
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- 229910000042 hydrogen bromide Inorganic materials 0.000 description 1
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- KUJRRRAEVBRSIW-UHFFFAOYSA-N niobium(5+) pentanitrate Chemical compound [Nb+5].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O KUJRRRAEVBRSIW-UHFFFAOYSA-N 0.000 description 1
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- CHWRSCGUEQEHOH-UHFFFAOYSA-N potassium oxide Chemical compound [O-2].[K+].[K+] CHWRSCGUEQEHOH-UHFFFAOYSA-N 0.000 description 1
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- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
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- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 1
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- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- MRYQZMHVZZSQRT-UHFFFAOYSA-M tetramethylazanium;acetate Chemical compound CC([O-])=O.C[N+](C)(C)C MRYQZMHVZZSQRT-UHFFFAOYSA-M 0.000 description 1
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- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
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- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/006—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character
- C03C17/008—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character comprising a mixture of materials covered by two or more of the groups C03C17/02, C03C17/06, C03C17/22 and C03C17/28
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/22—Absorbing filters
- G02B5/23—Photochromic filters
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/28—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
- C03C17/30—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
- H01L21/0276—Photolithographic processes using an anti-reflective coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Wood Science & Technology (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geochemistry & Mineralogy (AREA)
- General Chemical & Material Sciences (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Composite Materials (AREA)
- Optics & Photonics (AREA)
- Silicon Polymers (AREA)
- Paints Or Removers (AREA)
- Materials For Photolithography (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Surface Treatment Of Optical Elements (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/001,143 US6824879B2 (en) | 1999-06-10 | 2001-11-15 | Spin-on-glass anti-reflective coatings for photolithography |
| PCT/US2001/045306 WO2003044600A1 (en) | 2001-11-15 | 2001-11-15 | Spin-on anti-reflective coatings for photolithography |
Publications (2)
| Publication Number | Publication Date |
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| TW200306342A TW200306342A (en) | 2003-11-16 |
| TWI324626B true TWI324626B (en) | 2010-05-11 |
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|---|---|---|---|
| TW091133495A TWI324626B (en) | 2001-11-15 | 2002-11-15 | Anti-reflective coatings for photolithography and methods of preparation thereof |
| TW091133515A TWI308585B (en) | 2001-11-15 | 2002-11-15 | Spin-on-glass anti-reflective coatings for photolithography |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091133515A TWI308585B (en) | 2001-11-15 | 2002-11-15 | Spin-on-glass anti-reflective coatings for photolithography |
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| Country | Link |
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| US (2) | US6824879B2 (enExample) |
| EP (1) | EP1478683A4 (enExample) |
| JP (3) | JP2005509914A (enExample) |
| KR (2) | KR100897575B1 (enExample) |
| CN (2) | CN1615333A (enExample) |
| AU (1) | AU2002336709A1 (enExample) |
| TW (2) | TWI324626B (enExample) |
| WO (1) | WO2003044079A1 (enExample) |
Families Citing this family (88)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100804873B1 (ko) | 1999-06-10 | 2008-02-20 | 얼라이드시그날 인코퍼레이티드 | 포토리소그래피용 sog 반사방지 코팅 |
| US6824879B2 (en) * | 1999-06-10 | 2004-11-30 | Honeywell International Inc. | Spin-on-glass anti-reflective coatings for photolithography |
| AU2002227106A1 (en) * | 2001-11-15 | 2003-06-10 | Honeywell International Inc. | Spin-on anti-reflective coatings for photolithography |
| DE10227807A1 (de) * | 2002-06-21 | 2004-01-22 | Honeywell Specialty Chemicals Seelze Gmbh | Silylalkylester von Anthracen- und Phenanthrencarbonsäuren |
| CN1774673B (zh) * | 2003-04-17 | 2010-09-29 | 日产化学工业株式会社 | 多孔质下层膜和用于形成多孔质下层膜的形成下层膜的组合物 |
| DE602004009791T2 (de) * | 2003-05-23 | 2008-10-30 | Dow Corning Corp., Midland | Siloxan-harz basierte anti-reflektionsbeschichtung mit hoher nassätzgeschwindigkeit |
| JP4700929B2 (ja) * | 2003-06-03 | 2011-06-15 | 信越化学工業株式会社 | 反射防止膜材料、これを用いた反射防止膜及びパターン形成方法 |
| JP5348843B2 (ja) * | 2003-10-07 | 2013-11-20 | ハネウエル・インターナシヨナル・インコーポレーテツド | 集積回路用途の被覆およびハードマスク組成物、これらの製造方法および使用 |
| US8053159B2 (en) | 2003-11-18 | 2011-11-08 | Honeywell International Inc. | Antireflective coatings for via fill and photolithography applications and methods of preparation thereof |
| JP5102428B2 (ja) * | 2003-11-25 | 2012-12-19 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | 導波路組成物およびこれから形成された導波路 |
| US8901268B2 (en) | 2004-08-03 | 2014-12-02 | Ahila Krishnamoorthy | Compositions, layers and films for optoelectronic devices, methods of production and uses thereof |
| US7507521B2 (en) * | 2004-08-09 | 2009-03-24 | Intel Corporation | Silicon based optically degraded arc for lithographic patterning |
| US7687225B2 (en) * | 2004-09-29 | 2010-03-30 | Intel Corporation | Optical coatings |
| EP1819844B1 (en) | 2004-12-17 | 2008-07-09 | Dow Corning Corporation | Method for forming anti-reflective coating |
| WO2006065310A2 (en) * | 2004-12-17 | 2006-06-22 | Dow Corning Corporation | Siloxane resin coating |
| JP4995096B2 (ja) * | 2004-12-17 | 2012-08-08 | ダウ・コーニング・コーポレイション | 反射防止膜の形成方法、レジスト画像の形成方法、パターンの形成方法、電子デバイスの製造方法及びarc組成物 |
| JP4832955B2 (ja) * | 2005-06-07 | 2011-12-07 | 信越化学工業株式会社 | レジスト下層膜材料並びにそれを用いたパターン形成方法 |
| US7862886B2 (en) * | 2005-08-12 | 2011-01-04 | Fujifilm Corporation | Optical film, antireflection film, processes for producing the same, and polarizing plate and display employing the same |
| NO325797B1 (no) * | 2005-10-14 | 2008-07-21 | Nor X Ind As | Lysbeskyttelsesmiddel basert på organisk/uorganisk hybridpolymer, fremgangsmåte til fremstilling og anvendelse av samme |
| EP1788436B1 (en) * | 2005-11-16 | 2013-01-09 | Shin-Etsu Chemical Company, Ltd. | Rework process for photoresist film |
| CN101371196B (zh) * | 2006-02-13 | 2012-07-04 | 陶氏康宁公司 | 抗反射涂料 |
| JP2008026500A (ja) * | 2006-07-20 | 2008-02-07 | Dainippon Printing Co Ltd | 高ドライエッチング耐性ポリマー層を付加したフォトマスクブランクスおよびそれを用いたフォトマスクの製造方法 |
| JP5193207B2 (ja) | 2007-02-09 | 2013-05-08 | 株式会社日本触媒 | シラン化合物、その製造方法及びシラン化合物を含む樹脂組成物 |
| US8026040B2 (en) | 2007-02-20 | 2011-09-27 | Az Electronic Materials Usa Corp. | Silicone coating composition |
| US8642246B2 (en) | 2007-02-26 | 2014-02-04 | Honeywell International Inc. | Compositions, coatings and films for tri-layer patterning applications and methods of preparation thereof |
| EP2121808A1 (en) | 2007-02-27 | 2009-11-25 | AZ Electronic Materials USA Corp. | Silicon-based antifrelective coating compositions |
| TWI439494B (zh) * | 2007-02-27 | 2014-06-01 | Braggone Oy | 產生有機矽氧烷聚合物的方法 |
| JP5470687B2 (ja) * | 2007-08-10 | 2014-04-16 | 富士通株式会社 | シリコン化合物、紫外線吸収体、多層配線装置の製造方法および多層配線装置 |
| US20090111925A1 (en) * | 2007-10-31 | 2009-04-30 | Burnham Kikue S | Thermal interface materials, methods of production and uses thereof |
| WO2009088600A1 (en) | 2008-01-08 | 2009-07-16 | Dow Corning Toray Co., Ltd. | Silsesquioxane resins |
| EP2238198A4 (en) * | 2008-01-15 | 2011-11-16 | Dow Corning | RESINS BASED ON SILSESQUIOXANE |
| US8304161B2 (en) * | 2008-03-04 | 2012-11-06 | Dow Corning Corporation | Silsesquioxane resins |
| KR101541939B1 (ko) * | 2008-03-05 | 2015-08-04 | 다우 코닝 코포레이션 | 실세스퀴옥산 수지 |
| US8084193B2 (en) * | 2008-07-12 | 2011-12-27 | International Business Machines Corporation | Self-segregating multilayer imaging stack with built-in antireflective properties |
| US7955782B2 (en) * | 2008-09-22 | 2011-06-07 | Honeywell International Inc. | Bottom antireflective coatings exhibiting enhanced wet strip rates, bottom antireflective coating compositions for forming bottom antireflective coatings, and methods for fabricating the same |
| US20110236835A1 (en) * | 2008-12-10 | 2011-09-29 | Peng-Fei Fu | Silsesquioxane Resins |
| EP2373722A4 (en) | 2008-12-10 | 2013-01-23 | Dow Corning | SILSESQUIOXAN RESINS |
| KR101266290B1 (ko) * | 2008-12-30 | 2013-05-22 | 제일모직주식회사 | 레지스트 하층막용 하드마스크 조성물 및 이를 이용한 반도체 집적회로 디바이스의 제조방법 |
| US8557877B2 (en) | 2009-06-10 | 2013-10-15 | Honeywell International Inc. | Anti-reflective coatings for optically transparent substrates |
| US8864898B2 (en) | 2011-05-31 | 2014-10-21 | Honeywell International Inc. | Coating formulations for optical elements |
| US9366964B2 (en) | 2011-09-21 | 2016-06-14 | Dow Global Technologies Llc | Compositions and antireflective coatings for photolithography |
| WO2015157202A1 (en) | 2014-04-09 | 2015-10-15 | Corning Incorporated | Device modified substrate article and methods for making |
| US10543662B2 (en) | 2012-02-08 | 2020-01-28 | Corning Incorporated | Device modified substrate article and methods for making |
| US9327487B2 (en) * | 2012-08-31 | 2016-05-03 | Xerox Corporation | Variable lithographic printing process |
| JP5700003B2 (ja) * | 2012-08-31 | 2015-04-15 | 大日本印刷株式会社 | 高ドライエッチング耐性ポリマー層を付加したフォトマスクブランクスを用いたフォトマスクの製造方法 |
| US10014177B2 (en) | 2012-12-13 | 2018-07-03 | Corning Incorporated | Methods for processing electronic devices |
| JP2016507448A (ja) * | 2012-12-13 | 2016-03-10 | コーニング インコーポレイテッド | ガラスおよびガラス物品の製造方法 |
| US10086584B2 (en) | 2012-12-13 | 2018-10-02 | Corning Incorporated | Glass articles and methods for controlled bonding of glass sheets with carriers |
| US9340443B2 (en) | 2012-12-13 | 2016-05-17 | Corning Incorporated | Bulk annealing of glass sheets |
| US9290623B2 (en) | 2012-12-19 | 2016-03-22 | Nissan Chemical Industries, Ltd. | Composition for forming silicon-containing resist underlayer film having cyclic diester group |
| JP5742903B2 (ja) * | 2013-09-24 | 2015-07-01 | 大日本印刷株式会社 | フォトマスクブランクス |
| US10510576B2 (en) | 2013-10-14 | 2019-12-17 | Corning Incorporated | Carrier-bonding methods and articles for semiconductor and interposer processing |
| US9804493B2 (en) | 2013-11-22 | 2017-10-31 | Samsung Electronics Co., Ltd. | Composition for forming topcoat layer and resist pattern formation method employing the same |
| WO2015112958A1 (en) | 2014-01-27 | 2015-07-30 | Corning Incorporated | Articles and methods for controlled bonding of thin sheets with carriers |
| KR102402923B1 (ko) * | 2014-02-24 | 2022-05-27 | 도쿄엘렉트론가부시키가이샤 | 감광화된 화학적 증폭 레지스트 화학물질을 사용하는 방법과 기술 및 프로세스 |
| KR102402422B1 (ko) | 2014-02-25 | 2022-05-25 | 도쿄엘렉트론가부시키가이샤 | 현상 가능한 하부 반사 방지 코팅 및 염색된 주입물 레지스트를 위한 화학 증폭 방법 및 기술 |
| JP6196194B2 (ja) | 2014-08-19 | 2017-09-13 | 信越化学工業株式会社 | 紫外線吸収剤、レジスト下層膜形成用組成物、及びパターン形成方法 |
| JP5979268B2 (ja) * | 2015-03-06 | 2016-08-24 | 大日本印刷株式会社 | フォトマスクブランクス |
| TWI593753B (zh) * | 2015-03-11 | 2017-08-01 | Taimide Tech Incoporation | Polyimide film and method of forming a radial circuit board from the film |
| US10544329B2 (en) | 2015-04-13 | 2020-01-28 | Honeywell International Inc. | Polysiloxane formulations and coatings for optoelectronic applications |
| EP3297824A1 (en) | 2015-05-19 | 2018-03-28 | Corning Incorporated | Articles and methods for bonding sheets with carriers |
| KR102524620B1 (ko) | 2015-06-26 | 2023-04-21 | 코닝 인코포레이티드 | 시트 및 캐리어를 포함하는 방법들 및 물품들 |
| US10048594B2 (en) | 2016-02-19 | 2018-08-14 | Tokyo Electron Limited | Photo-sensitized chemically amplified resist (PS-CAR) model calibration |
| US10429745B2 (en) | 2016-02-19 | 2019-10-01 | Osaka University | Photo-sensitized chemically amplified resist (PS-CAR) simulation |
| RU2626105C1 (ru) * | 2016-04-11 | 2017-07-21 | Акционерное Общество "Саратовский институт стекла" | Способ получения просветляющего золь-гель покрытия на основе диоксида кремния |
| TWI715765B (zh) * | 2016-04-28 | 2021-01-11 | 日商住友化學股份有限公司 | 組成物 |
| KR102475021B1 (ko) | 2016-05-13 | 2022-12-06 | 도쿄엘렉트론가부시키가이샤 | 감광 화학물질 또는 감광 화학 증폭형 레지스트의 사용에 의한 임계 치수 제어 |
| JP6750155B2 (ja) | 2016-05-13 | 2020-09-02 | 東京エレクトロン株式会社 | 光剤を用いた限界寸法制御 |
| JP6252623B2 (ja) * | 2016-05-20 | 2017-12-27 | 大日本印刷株式会社 | フォトマスクブランクス |
| JP2018012806A (ja) * | 2016-07-22 | 2018-01-25 | Jsr株式会社 | 反転パターン形成用組成物及び反転パターン形成方法 |
| TW202216444A (zh) | 2016-08-30 | 2022-05-01 | 美商康寧公司 | 用於片材接合的矽氧烷電漿聚合物 |
| TWI821867B (zh) | 2016-08-31 | 2023-11-11 | 美商康寧公司 | 具以可控制式黏結的薄片之製品及製作其之方法 |
| TWI613167B (zh) * | 2016-11-18 | 2018-02-01 | 宏益玻璃科技股份有限公司 | 一種抗眩光強化抗菌及抗指紋之玻璃面板製作方法 |
| JP6895317B2 (ja) * | 2017-05-24 | 2021-06-30 | 信越化学工業株式会社 | 多環式芳香族基片末端ポリオルガノシロキサンおよび組成物 |
| KR102659516B1 (ko) | 2017-08-18 | 2024-04-23 | 코닝 인코포레이티드 | 유리 적층체 |
| US10748757B2 (en) * | 2017-09-21 | 2020-08-18 | Honeywell International, Inc. | Thermally removable fill materials for anti-stiction applications |
| WO2019118660A1 (en) | 2017-12-15 | 2019-06-20 | Corning Incorporated | Method for treating a substrate and method for making articles comprising bonded sheets |
| JP7277700B2 (ja) * | 2018-01-15 | 2023-05-19 | セントラル硝子株式会社 | 撥水性保護膜形成用薬液、及びウェハの表面処理方法 |
| US11500290B2 (en) | 2018-11-13 | 2022-11-15 | International Business Machines Corporation | Adhesion promoters |
| JP7307005B2 (ja) | 2019-04-26 | 2023-07-11 | 信越化学工業株式会社 | 硬化触媒の拡散距離を測定する方法 |
| WO2021034567A1 (en) | 2019-08-16 | 2021-02-25 | Tokyo Electron Limited | Method and process for stochastic driven defectivity healing |
| CN111362587B (zh) * | 2020-04-28 | 2022-05-24 | 东莞南玻太阳能玻璃有限公司 | 一种高硬度防潮增透太阳能玻璃及其制备方法 |
| US20230314949A1 (en) * | 2022-03-31 | 2023-10-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for lithography using middle layer with porous top surface |
| CN115404005B (zh) * | 2022-09-01 | 2024-01-05 | 北京星驰恒动科技发展有限公司 | 一种耐高温空间消杂光涂料及其制备方法和应用 |
| KR20250140533A (ko) * | 2023-02-02 | 2025-09-25 | 세키스이가가쿠 고교가부시키가이샤 | 실리콘 조성물 |
| JPWO2024162467A1 (enExample) * | 2023-02-02 | 2024-08-08 | ||
| EP4660247A1 (en) * | 2023-02-02 | 2025-12-10 | Sekisui Chemical Co., Ltd. | Thermally conductive composition and thermally conductive molded body |
| WO2025117606A1 (en) * | 2023-11-27 | 2025-06-05 | Phosio Corporation | Uv-curable aqueous precursor for deposition of low refractive index porous films |
Family Cites Families (476)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA586038A (en) | 1956-03-26 | 1959-10-27 | General Electric Company | Organopolysiloxane resins |
| US5270285A (en) | 1965-02-28 | 1993-12-14 | Dai Nippon Insatsu Kabushiki Kaisha | Sheet for heat transference |
| US3547766A (en) | 1966-11-25 | 1970-12-15 | Du Pont | Laminated article |
| CA993709A (en) | 1971-01-21 | 1976-07-27 | Leo Roos | Composite, mask-forming photohardenable elements |
| US3784378A (en) | 1971-10-18 | 1974-01-08 | Du Pont | Double-exposure method for producing reverse images in photopolymers |
| JPS5125070B2 (enExample) * | 1972-07-11 | 1976-07-28 | ||
| US3884702A (en) | 1972-12-14 | 1975-05-20 | Unitika Ltd | Photosensitive polyamide composition |
| US3929489A (en) | 1973-09-14 | 1975-12-30 | Eastman Kodak Co | Lithographic plates having radiation sensitive elements developable with aqueous alcohol |
| US4043812A (en) | 1973-11-19 | 1977-08-23 | Xerox Corporation | Electrostatographic imaging member and process using anthracene functional polymers |
| US4107133A (en) | 1974-01-14 | 1978-08-15 | Dainippon Ink & Chemicals, Inc. | Colored polyethylene molding compositions |
| US3925077A (en) | 1974-03-01 | 1975-12-09 | Horizons Inc | Photoresist for holography and laser recording with bleachout dyes |
| US4191571A (en) | 1974-04-26 | 1980-03-04 | Hitachi, Ltd. | Method of pattern forming in a photosensitive composition having a reciprocity law failing property |
| US4018607A (en) | 1974-05-03 | 1977-04-19 | Eastman Kodak Company | Crystalline organic pigment sensitizers for photoconductive layers |
| US4018606A (en) | 1974-05-03 | 1977-04-19 | Eastman Kodak Company | Organic azo pigment sensitizers for photoconductive layers |
| US4052367A (en) | 1975-10-14 | 1977-10-04 | Eastman Kodak Company | Radiation sensitive polymers of oxygen-substituted maleimides and elements containing same |
| US4048146A (en) | 1975-10-14 | 1977-09-13 | Eastman Kodak Company | Radiation sensitive polymers of oxygen-substituted maleimides and elements containing same |
| US4102683A (en) | 1977-02-10 | 1978-07-25 | Rca Corp. | Nonreflecting photoresist process |
| US5655947A (en) | 1977-03-17 | 1997-08-12 | Applied Elastomerics, Inc. | Ultra-soft, ultra-elastic gel airfoils |
| US5324222A (en) | 1977-03-17 | 1994-06-28 | Applied Elastomerics, Inc. | Ultra-soft, ultra-elastic airfoils |
| US5508334A (en) | 1977-03-17 | 1996-04-16 | Applied Elastomerics, Inc. | Thermoplastic elastomer gelatinous compositions and articles |
| US5633286B1 (en) | 1977-03-17 | 2000-10-10 | Applied Elastomerics Inc | Gelatinous elastomer articles |
| US5624294A (en) | 1977-03-17 | 1997-04-29 | Applied Elastomerics, Inc. | Humdinger, gel spinner |
| US5336708A (en) | 1977-03-17 | 1994-08-09 | Applied Elastomerics, Inc. | Gelatinous elastomer articles |
| US5153254A (en) | 1977-03-17 | 1992-10-06 | Applied Elastomerics, Inc. | Reusable lint remover |
| US5262468A (en) | 1977-03-17 | 1993-11-16 | Applied Elastomerics, Inc. | Thermoplastic elastomer gelatinous compositions |
| US4369284A (en) | 1977-03-17 | 1983-01-18 | Applied Elastomerics, Incorporated | Thermoplastic elastomer gelatinous compositions |
| US5334646B1 (en) | 1977-03-17 | 1998-09-08 | Applied Elastomerics Inc | Thermoplastic elastomer gelatinous articles |
| US4618213A (en) | 1977-03-17 | 1986-10-21 | Applied Elastomerics, Incorporated | Gelatinous elastomeric optical lens, light pipe, comprising a specific block copolymer and an oil plasticizer |
| US5239723A (en) | 1977-03-17 | 1993-08-31 | Applied Elastomerics, Inc. | Gelatinous elastomer swabs |
| US5475890A (en) | 1977-03-17 | 1995-12-19 | Applied Elastomerics, Inc. | Gelatinous elastomer swabs |
| DE2720559A1 (de) | 1977-05-07 | 1978-11-09 | Basf Ag | Verbesserte photopolymerisierbare massen fuer die herstellung von druckplatten und reliefformen |
| GB1604414A (en) | 1977-07-27 | 1981-12-09 | Raychem Ltd | Silicone resin |
| JPS6058467B2 (ja) | 1977-10-22 | 1985-12-20 | 株式会社リコー | 電子写真用感光体 |
| US4302503A (en) | 1978-05-17 | 1981-11-24 | Libbey-Owens-Ford Company | Architectural spandrel |
| JPS5563335U (enExample) | 1978-10-23 | 1980-04-30 | ||
| JPS55165922A (en) | 1979-06-14 | 1980-12-24 | Daicel Chem Ind Ltd | Production of thermosetting organopolysiloxane |
| US4299938A (en) | 1979-06-19 | 1981-11-10 | Ciba-Geigy Corporation | Photopolymerizable and thermally polymerizable compositions |
| US4349609A (en) | 1979-06-21 | 1982-09-14 | Fujitsu Limited | Electronic device having multilayer wiring structure |
| US4935583A (en) | 1980-05-30 | 1990-06-19 | Kyle James C | Insulated conductor with ceramic-connected elements |
| US4413052A (en) | 1981-02-04 | 1983-11-01 | Ciba-Geigy Corporation | Photopolymerization process employing compounds containing acryloyl group and anthryl group |
| US4362809A (en) | 1981-03-30 | 1982-12-07 | Hewlett-Packard Company | Multilayer photoresist process utilizing an absorbant dye |
| JPH0350459Y2 (enExample) | 1981-04-29 | 1991-10-28 | ||
| US4348471A (en) | 1981-06-15 | 1982-09-07 | Polychrome Corporation | Positive acting composition yielding pre-development high visibility image after radiation exposure comprising acid free novolak, diazo oxide and acid sensitive dyestuff |
| US4783347A (en) | 1981-12-01 | 1988-11-08 | General Electric Company | Method for primerless coating of plastics |
| US4442197A (en) | 1982-01-11 | 1984-04-10 | General Electric Company | Photocurable compositions |
| US5741623A (en) | 1982-07-30 | 1998-04-21 | Tdk Corporation | Optical recording medium |
| DE3231147A1 (de) | 1982-08-21 | 1984-02-23 | Basf Ag, 6700 Ludwigshafen | Positiv arbeitendes verfahren zur herstellung von reliefbildern oder resistmustern |
| US6194121B1 (en) | 1982-09-25 | 2001-02-27 | Tdk Corp. | Optical recording medium |
| US4910122A (en) | 1982-09-30 | 1990-03-20 | Brewer Science, Inc. | Anti-reflective coating |
| JPH0612452B2 (ja) | 1982-09-30 | 1994-02-16 | ブリュ−ワ−・サイエンス・インコ−ポレイテッド | 集積回路素子の製造方法 |
| US4822718A (en) | 1982-09-30 | 1989-04-18 | Brewer Science, Inc. | Light absorbing coating |
| JPS59109565A (ja) | 1982-12-16 | 1984-06-25 | Fujitsu Ltd | コ−テイング樹脂溶液およびその製造方法 |
| US4590117A (en) * | 1983-03-10 | 1986-05-20 | Toray Industries, Inc. | Transparent material having antireflective coating |
| JPS59226346A (ja) | 1983-06-07 | 1984-12-19 | Fuotopori Ouka Kk | プリント回路の製造方法 |
| US4430153A (en) | 1983-06-30 | 1984-02-07 | International Business Machines Corporation | Method of forming an RIE etch barrier by in situ conversion of a silicon containing alkyl polyamide/polyimide |
| DE3324795A1 (de) | 1983-07-09 | 1985-01-17 | Merck Patent Gmbh, 6100 Darmstadt | Negativ arbeitende fotoresistzusammensetzungen mit strahlungsabsorbierenden zusaetzen |
| GB8333901D0 (en) | 1983-12-20 | 1984-02-01 | Minnesota Mining & Mfg | Radiationsensitive compositions |
| DE3561155D1 (enExample) | 1984-02-10 | 1988-01-21 | Ciba-Geigy Ag | |
| EP0153904B1 (de) | 1984-02-10 | 1988-09-14 | Ciba-Geigy Ag | Verfahren zur Herstellung einer Schutzschicht oder einer Reliefabbildung |
| US4831188A (en) | 1984-02-29 | 1989-05-16 | Bowling Green State University | Perester photoinitiators |
| US4752649A (en) | 1984-02-29 | 1988-06-21 | Bowling Green State University | Perester photoinitiators |
| US4767571A (en) | 1984-06-27 | 1988-08-30 | Fuji Photo Film Co., Ltd. | Infrared absorbent |
| US4705739A (en) | 1984-07-16 | 1987-11-10 | Minnesota Mining And Manufacturing Company | Graphic arts imaging constructions using vapor-deposited colorant and metalloid layers with overlying photosensitive resist layer |
| US4763966A (en) | 1984-07-16 | 1988-08-16 | Fuji Photo Film Co., Ltd. | Infrared absorbent |
| US5674648A (en) | 1984-08-06 | 1997-10-07 | Brewer Science, Inc. | Anti-reflective coating |
| US4594309A (en) | 1984-10-31 | 1986-06-10 | Allied Corporation | α,β Diketone containing polymers as positive photoresist compositions |
| US4587138A (en) | 1984-11-09 | 1986-05-06 | Intel Corporation | MOS rear end processing |
| US4705729A (en) | 1984-11-19 | 1987-11-10 | Hewlett-Packard Company | Method for photochemically enhancing resolution in photolithography processes |
| IT1177373B (it) | 1984-12-06 | 1987-08-26 | Bioresearch Spa | Sali della 5'-metiltio-5'-deossiadenosina con acidi solfonici a lunga catena alchilica |
| US4708925A (en) | 1984-12-11 | 1987-11-24 | Minnesota Mining And Manufacturing Company | Photosolubilizable compositions containing novolac phenolic resin |
| JPS61274497A (ja) | 1985-05-29 | 1986-12-04 | Furuno Electric Co Ltd | 送受波器 |
| JPS6289907A (ja) | 1985-06-19 | 1987-04-24 | Sumitomo Bakelite Co Ltd | 偏光膜一体型透明導電性フイルム |
| US4609614A (en) | 1985-06-24 | 1986-09-02 | Rca Corporation | Process of using absorptive layer in optical lithography with overlying photoresist layer to form relief pattern on substrate |
| US4814578A (en) | 1985-06-24 | 1989-03-21 | The United States Of America As Represented By The Department Of Energy | Planarization of metal films for multilevel interconnects |
| US4681795A (en) | 1985-06-24 | 1987-07-21 | The United States Of America As Represented By The Department Of Energy | Planarization of metal films for multilevel interconnects |
| US4674176A (en) | 1985-06-24 | 1987-06-23 | The United States Of America As Represented By The United States Department Of Energy | Planarization of metal films for multilevel interconnects by pulsed laser heating |
| US4816049A (en) | 1985-07-12 | 1989-03-28 | Hoya Corporation | Process of surface treating laser glass |
| DE3684745D1 (de) | 1985-08-29 | 1992-05-14 | Du Pont | Photopolymerisierbare zusammensetzung mit dizyklopentylacrylat oder methacrylat enthaltenden acrylcopolymeren. |
| US4786569A (en) | 1985-09-04 | 1988-11-22 | Ciba-Geigy Corporation | Adhesively bonded photostructurable polyimide film |
| US4923638A (en) | 1985-09-30 | 1990-05-08 | Fuji Photo Film Co., Ltd. | Near infrared absorbing composition |
| EP0225676B1 (en) | 1985-12-09 | 1994-07-06 | Nippon Paint Co., Ltd. | Photosensitive resin base printing material |
| US4678835A (en) | 1986-01-30 | 1987-07-07 | Ppg Industries, Inc. | Coating composition containing an ungelled reaction product as a curative |
| US4693959A (en) | 1986-03-07 | 1987-09-15 | E.I. Du Pont De Nemours And Company | Adhesion promotion in photoresist lamination and processing |
| JPS63139303A (ja) | 1986-08-05 | 1988-06-11 | Fuji Photo Film Co Ltd | 赤外線吸収性組成物 |
| US4732858A (en) | 1986-09-17 | 1988-03-22 | Brewer Science, Inc. | Adhesion promoting product and process for treating an integrated circuit substrate |
| US4950583A (en) | 1986-09-17 | 1990-08-21 | Brewer Science Inc. | Adhesion promoting product and process for treating an integrated circuit substrate therewith |
| US4731264A (en) | 1986-10-03 | 1988-03-15 | Ppg Industries, Inc. | Sol-gel compositions containing silane and alumina |
| US4863827A (en) | 1986-10-20 | 1989-09-05 | American Hoechst Corporation | Postive working multi-level photoresist |
| US6033283A (en) | 1986-10-21 | 2000-03-07 | Applied Elastomerics, Inc. | Humdinger, string spinning toy |
| JPS63137437U (enExample) | 1987-03-03 | 1988-09-09 | ||
| US5079600A (en) | 1987-03-06 | 1992-01-07 | Schnur Joel M | High resolution patterning on solid substrates |
| US5389496A (en) | 1987-03-06 | 1995-02-14 | Rohm And Haas Company | Processes and compositions for electroless metallization |
| US5077085A (en) | 1987-03-06 | 1991-12-31 | Schnur Joel M | High resolution metal patterning of ultra-thin films on solid substrates |
| US4782009A (en) | 1987-04-03 | 1988-11-01 | General Electric Company | Method of coating and imaging photopatternable silicone polyamic acid |
| US4855199A (en) | 1987-04-03 | 1989-08-08 | General Electric Company | Photopatterned product of silicone polyamic acid on a transparent substrate |
| DE3719844A1 (de) | 1987-06-13 | 1988-12-29 | Basf Ag | Durch photopolymersisation vernetzbares gemisch |
| US4839274A (en) | 1987-06-30 | 1989-06-13 | Eastman Kodak Company | Novel polymethine dyes and UV absorbers containing a triarylborylisocyano group and imaging compositions containing these dyes |
| EP0301641A1 (en) | 1987-07-23 | 1989-02-01 | Koninklijke Philips Electronics N.V. | Master disc and method of manufacturing a matrix |
| JPS6428032U (enExample) | 1987-08-08 | 1989-02-17 | ||
| US4973510A (en) | 1987-09-02 | 1990-11-27 | Teijin Limited | Coated sheet material and process for producing same |
| US5024923A (en) | 1987-09-09 | 1991-06-18 | Fuji Photo Film Co., Ltd. | Infrared absorbent compositions |
| DE3735852A1 (de) | 1987-10-23 | 1989-05-03 | Hoechst Ag | Positiv arbeitendes lichtempfindliches gemisch, enthaltend einen farbstoff, und daraus hergestelltes positiv arbeitendes lichtempfindliches aufzeichnungsmaterial |
| WO1989004004A1 (fr) | 1987-10-24 | 1989-05-05 | Ito Optical Industrial Co., Ltd. | Solution de traitement antireflet de pieces optiques et procede de traitement antireflet utilisant cette solution |
| US4925772A (en) | 1987-11-26 | 1990-05-15 | Siemens Aktiengesellschaft | Anti-radiation covering for electronic components |
| GB8729510D0 (en) | 1987-12-18 | 1988-02-03 | Ucb Sa | Photosensitive compositions containing phenolic resins & diazoquinone compounds |
| US5272026A (en) | 1987-12-18 | 1993-12-21 | Ucb S.A. | Negative image process utilizing photosensitive compositions containing aromatic fused polycyclic sulfonic acid and partial ester or phenolic resin with diazoquinone sulfonic acid or diazoquinone carboxylic acid, and associated imaged article |
| US6040251A (en) | 1988-03-14 | 2000-03-21 | Nextec Applications Inc. | Garments of barrier webs |
| US5194364A (en) | 1988-03-16 | 1993-03-16 | Fujitsu Limited | Process for formation of resist patterns |
| US5391463A (en) | 1988-04-14 | 1995-02-21 | The United States Of America As Represented By The Secretary Of The Navy | Surface modification to create regions resistant to adsorption of biomolecules |
| JP2603291B2 (ja) | 1988-04-19 | 1997-04-23 | 東芝シリコーン株式会社 | 第4級アンモニウム基含有シリコーン樹脂微粉末 |
| US4914143A (en) * | 1988-04-25 | 1990-04-03 | General Electric Company | Flexible silicone coatings for plastic substrates and methods for making thermoformable, abrasion-resistant thermoplastic articles |
| US4942083A (en) | 1988-05-16 | 1990-07-17 | Smith Novis W Jr | Abrasion resistant coatings |
| EP0345219B1 (de) | 1988-05-31 | 1994-02-02 | Ciba-Geigy Ag | Wässrige Dispersion von 2-(2'-Hydroxyphenyl-)benzotriazolen |
| JPH02145511A (ja) | 1988-08-22 | 1990-06-05 | A Baron Nevley | 紫外線吸収眼用軟化剤 |
| US5403680A (en) | 1988-08-30 | 1995-04-04 | Osaka Gas Company, Ltd. | Photolithographic and electron beam lithographic fabrication of micron and submicron three-dimensional arrays of electronically conductive polymers |
| US5173368A (en) | 1988-09-14 | 1992-12-22 | Pilkington Visioncare Holdings, Inc. | Solution-applied antireflective coatings |
| EP0436639B1 (en) | 1988-09-28 | 1998-01-14 | Brewer Science, Inc. | Multifunctional photolithographic compositions |
| US4954414A (en) | 1988-11-08 | 1990-09-04 | The Mead Corporation | Photosensitive composition containing a transition metal coordination complex cation and a borate anion and photosensitive materials employing the same |
| US5199979A (en) | 1988-11-25 | 1993-04-06 | Ppg Industries, Inc. | UV resistant, abrasion resistant coatings |
| US5455145A (en) | 1988-12-24 | 1995-10-03 | Mitsubishi Denki Kabushiki Kaisha | Method of manufacturing double layer resist pattern and double layer resist structure |
| US5747223A (en) | 1988-12-30 | 1998-05-05 | International Business Machines Corporation | Composition for photoimaging |
| US5026624A (en) | 1989-03-03 | 1991-06-25 | International Business Machines Corporation | Composition for photo imaging |
| US5300402A (en) | 1988-12-30 | 1994-04-05 | International Business Machines Corporation | Composition for photo imaging |
| US6180317B1 (en) | 1988-12-30 | 2001-01-30 | International Business Machines Corporation | Composition for photoimaging |
| US4940651A (en) | 1988-12-30 | 1990-07-10 | International Business Machines Corporation | Method for patterning cationic curable photoresist |
| US5439766A (en) | 1988-12-30 | 1995-08-08 | International Business Machines Corporation | Composition for photo imaging |
| DE68908872T2 (de) | 1989-02-03 | 1994-02-10 | Mitsubishi Metal Corp | Verfahren zum Ziehen von Einkristallen. |
| US6210862B1 (en) | 1989-03-03 | 2001-04-03 | International Business Machines Corporation | Composition for photoimaging |
| US5278010A (en) | 1989-03-03 | 1994-01-11 | International Business Machines Corporation | Composition for photo imaging |
| DE69027799T2 (de) | 1989-03-14 | 1997-01-23 | Ibm | Chemisch amplifizierter Photolack |
| US5009809A (en) | 1989-05-16 | 1991-04-23 | J. M. Huber Corporation | High temperature endothermic blowing agents compositions and applications |
| US5317044A (en) | 1989-05-16 | 1994-05-31 | J. M. Huber Corporation | Endothermic blowing agents for surface migration of components in foamed products, compositions and applications |
| US5009810A (en) | 1989-05-16 | 1991-04-23 | J. M. Huber Corporation | Endothermic blowing agents compositions and applications |
| US5302455A (en) | 1989-05-16 | 1994-04-12 | J. M. Huber Corporation | Endothermic blowing agents compositions and applications |
| US5106534A (en) | 1989-05-16 | 1992-04-21 | J. M. Huber Corporation | Endothermic blowing agents compositions and applications |
| US5250224A (en) | 1989-05-16 | 1993-10-05 | J. M. Huber Corporation | Foamed products containing endothermic blowing agents and processes |
| US5306736A (en) | 1989-05-16 | 1994-04-26 | J. M. Huber Corporation | Endothermic blowing agents for surface migration of components in foamed products, compositions and applications |
| US5252618A (en) | 1989-05-16 | 1993-10-12 | J. M. Huber Corporation | Endothermic blowing agents for strengthening weld lines in molded thermoplastic resins and products |
| US5137655A (en) | 1989-05-16 | 1992-08-11 | J. M. Huber Corporation | High temperature endothermic blowing agents compositions and applications |
| US5128232A (en) | 1989-05-22 | 1992-07-07 | Shiply Company Inc. | Photoresist composition with copolymer binder having a major proportion of phenolic units and a minor proportion of non-aromatic cyclic alcoholic units |
| US5013608A (en) | 1989-07-07 | 1991-05-07 | Swedlow, Inc. | Highly tintable abrasion resistant coatings |
| US5102695A (en) | 1989-07-07 | 1992-04-07 | Swedlow, Inc. | Highly tintable abrasion resistant coatings |
| US5112728A (en) | 1989-10-05 | 1992-05-12 | Konica Corporation | Silver halide photographic light-sensitive material |
| US5059512A (en) | 1989-10-10 | 1991-10-22 | International Business Machines Corporation | Ultraviolet light sensitive photoinitiator compositions, use thereof and radiation sensitive compositions |
| US5212046A (en) | 1989-10-17 | 1993-05-18 | Shipley Company Inc. | Near UV photoresist |
| US5190804A (en) * | 1989-11-27 | 1993-03-02 | Toshiba Silicone Co., Ltd. | Coated inorganic hardened product |
| US5252340A (en) | 1989-12-14 | 1993-10-12 | Isolyser Company, Inc. | Method of producing an absorbent composition |
| US5043789A (en) * | 1990-03-15 | 1991-08-27 | International Business Machines Corporation | Planarizing silsesquioxane copolymer coating |
| US5104692A (en) | 1990-04-20 | 1992-04-14 | Pilkington Visioncare Holdings, Inc. | Two-layer antireflective coating applied in solution |
| US5055372A (en) | 1990-04-23 | 1991-10-08 | The Mead Corporation | Photohardenable composition containing borate salts and ketone initiators |
| US5962572A (en) | 1994-04-19 | 1999-10-05 | Applied Elastomerics, Inc. | Oriented gel and oriented gel articles |
| US6333374B1 (en) | 1990-05-21 | 2001-12-25 | Applied Elastomerics, Inc. | Fluffy, strong, solid elastic gels, articles and method of making same |
| US6552109B1 (en) | 1994-04-19 | 2003-04-22 | Applied Elastomerics, Inc. | Gelatinous elastomer compositions and articles |
| US5938499A (en) | 1993-11-15 | 1999-08-17 | Applied Elastomerics, Inc. | Elastic gel toy |
| US5760117A (en) | 1990-05-21 | 1998-06-02 | Applied Elastomerics, Inc. | Gelatinous composition and articles |
| US6117176A (en) | 1993-11-15 | 2000-09-12 | Applied Elastomerics, Inc. | Elastic-crystal gel |
| US5868597A (en) | 1990-05-21 | 1999-02-09 | Applied Elastomerics, Inc. | Ultra-soft, ultra-elastic gel airfoils |
| US5884639A (en) | 1996-03-08 | 1999-03-23 | Applied Elastomerics, Inc. | Crystal gels with improved properties |
| US6148830A (en) | 1994-04-19 | 2000-11-21 | Applied Elastomerics, Inc. | Tear resistant, multiblock copolymer gels and articles |
| US6050871A (en) | 1994-04-19 | 2000-04-18 | Applied Elastomerics, Inc. | Crystal gel airfoils with improved tear resistance and gel airfoils with profiles capable of exhibiting time delay recovery from deformation |
| EP0458651B1 (en) | 1990-05-25 | 1994-03-09 | Matsushita Electric Industrial Co., Ltd. | Photosensitive materials comprising organic photoconductive substances in a binder polymer having aromatic rings, OH groups and bromine joined at the aromatic ring or rings |
| US5126289A (en) | 1990-07-20 | 1992-06-30 | At&T Bell Laboratories | Semiconductor lithography methods using an arc of organic material |
| JP2517785B2 (ja) | 1990-08-02 | 1996-07-24 | 信越化学工業株式会社 | 含浸性防水剤組成物 |
| US5082758A (en) | 1990-08-31 | 1992-01-21 | Xerox Corporation | Toner and developer compositions with charge enhancing additives |
| US5100503A (en) | 1990-09-14 | 1992-03-31 | Ncr Corporation | Silica-based anti-reflective planarizing layer |
| US5152834A (en) | 1990-09-14 | 1992-10-06 | Ncr Corporation | Spin-on glass composition |
| US5527872A (en) | 1990-09-14 | 1996-06-18 | At&T Global Information Solutions Company | Electronic device with a spin-on glass dielectric layer |
| US5472488A (en) | 1990-09-14 | 1995-12-05 | Hyundai Electronics America | Coating solution for forming glassy layers |
| US5302198A (en) | 1990-09-14 | 1994-04-12 | Ncr Corporation | Coating solution for forming glassy layers |
| US5140396A (en) | 1990-10-10 | 1992-08-18 | Polaroid Corporation | Filter and solid state imager incorporating this filter |
| US5059500A (en) | 1990-10-10 | 1991-10-22 | Polaroid Corporation | Process for forming a color filter |
| DE69130280T2 (de) | 1990-10-16 | 1999-04-08 | Mitsui Chemicals, Inc., Tokio/Tokyo | Verwendung eines hochlichtdurchlässigen staubschützenden Films, Verfahren zu dessen Herstellung und staubschützendes Element |
| US5055376A (en) | 1990-11-13 | 1991-10-08 | Eastman Kodak Company | Curable compositions containing onium salt photoinitiators which have a chromophore linked to the onium salt moiety through the 3-position and method of use |
| JP2712817B2 (ja) * | 1990-11-15 | 1998-02-16 | 信越化学工業株式会社 | ポリオルガノシロキサン樹脂の製造方法 |
| ATE127870T1 (de) | 1990-12-13 | 1995-09-15 | Ciba Geigy Ag | Wässrige dispersion schwerlöslicher uv-absorber. |
| US5256510A (en) | 1990-12-21 | 1993-10-26 | Eastman Kodak Company | Photoelectrographic imaging with near-infrared sensitizing dyes |
| US5219788A (en) | 1991-02-25 | 1993-06-15 | Ibm Corporation | Bilayer metallization cap for photolithography |
| JPH05202483A (ja) | 1991-04-25 | 1993-08-10 | Shipley Co Inc | 無電解金属化方法と組成物 |
| US5648201A (en) | 1991-04-25 | 1997-07-15 | The United Sates Of America As Represented By The Secretary Of The Navy | Efficient chemistry for selective modification and metallization of substrates |
| US5166093A (en) | 1991-07-31 | 1992-11-24 | Micron Technology, Inc. | Method to reduce the reflectivity of a semi-conductor metallic surface |
| DE4132697A1 (de) | 1991-10-01 | 1993-04-08 | Wacker Chemie Gmbh | Verfahren zur herstellung von organopolysiloxanharz |
| US5418136A (en) | 1991-10-01 | 1995-05-23 | Biostar, Inc. | Devices for detection of an analyte based upon light interference |
| JPH0597478A (ja) * | 1991-10-04 | 1993-04-20 | Nippon Sheet Glass Co Ltd | 撥水性ガラス物品およびその製造方法 |
| US5212218A (en) | 1991-10-15 | 1993-05-18 | A. B. Chance Company | Hydrophobic, erodiable synthetic resin composition for electrical insulators |
| US6773864B1 (en) | 1991-11-15 | 2004-08-10 | Shipley Company, L.L.C. | Antihalation compositions |
| US6472128B2 (en) | 1996-04-30 | 2002-10-29 | Shipley Company, L.L.C. | Antihalation compositions |
| US6528235B2 (en) | 1991-11-15 | 2003-03-04 | Shipley Company, L.L.C. | Antihalation compositions |
| US6165697A (en) | 1991-11-15 | 2000-12-26 | Shipley Company, L.L.C. | Antihalation compositions |
| WO1993016138A1 (fr) | 1992-02-05 | 1993-08-19 | Toray Industries, Inc. | Couche de fond et article revetu a double couche |
| JP2694097B2 (ja) | 1992-03-03 | 1997-12-24 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 反射防止コーティング組成物 |
| US5457081A (en) | 1992-05-15 | 1995-10-10 | Dai Nippon Printing Co., Ltd. | Thermal transfer image receiving sheet |
| JP2753921B2 (ja) | 1992-06-04 | 1998-05-20 | 富士写真フイルム株式会社 | ポジ型フオトレジスト組成物 |
| US5576247A (en) | 1992-07-31 | 1996-11-19 | Matsushita Electric Industrial Co., Ltd. | Thin layer forming method wherein hydrophobic molecular layers preventing a BPSG layer from absorbing moisture |
| JPH0656560A (ja) | 1992-08-10 | 1994-03-01 | Sony Corp | Sog組成物及びそれを用いた半導体装置の製造方法 |
| US6627275B1 (en) | 1994-04-19 | 2003-09-30 | Applied Elastomerics, Incorporated | Tear resistant elastic crystal gels suitable for inflatable restraint cushions and other uses |
| US6867253B1 (en) | 1994-04-19 | 2005-03-15 | Applied Elastomerics, Inc. | Tear resistant, crystalline midblock copolymer gels and articles |
| US6794440B2 (en) | 1994-04-19 | 2004-09-21 | Applied Elastomerics, Inc. | Tear resistant gelatinous elastomer compositions and articles for use as fishing bait |
| US6909220B2 (en) | 1994-04-19 | 2005-06-21 | Applied Elastomerics, Inc. | High strain tear resistant gels and gel composites for use as artificial muscle actuators |
| US6324703B1 (en) | 1994-04-19 | 2001-12-04 | Applied Elastomerics, Inc. | Strong, soft, tear resistant insulating compositions and composites for extreme cold weather use |
| US6420475B1 (en) | 1994-04-19 | 2002-07-16 | Applied Elastomerics, Inc. | Tear resistant elastic crystal gels gel composites and their uses |
| GB2277095B (en) | 1992-09-24 | 1997-04-16 | Kansai Paint Co Ltd | Topcoating composition and film-forming process by use of the same |
| CA2107715A1 (en) | 1992-10-06 | 1994-04-07 | Hiroyuki Naito | Solvent-free organosiloxane composition and its use |
| US5873931A (en) | 1992-10-06 | 1999-02-23 | Minnesota Mining And Manufacturing Company | Coating composition having anti-reflective and anti-fogging properties |
| JPH06140396A (ja) | 1992-10-23 | 1994-05-20 | Yamaha Corp | 半導体装置とその製法 |
| US5384357A (en) | 1992-11-02 | 1995-01-24 | General Electric Company | Infrared radiation curable organopolysiloxane compositions |
| US5395734A (en) | 1992-11-30 | 1995-03-07 | Minnesota Mining And Manufacturing Company | Shoot and run printing materials |
| US5719249A (en) | 1993-11-29 | 1998-02-17 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Reactive silicon group-containing polyoxyalkylene-polysiloxane copolymer |
| US5349002A (en) * | 1992-12-02 | 1994-09-20 | General Electric Company | Heat curable primerless silicone hardcoat compositions, and thermoplastic composites |
| DE4241727A1 (de) | 1992-12-10 | 1994-06-16 | Wacker Chemie Gmbh | In Wasser selbstdispergierende, Organopolysiloxan anhaltende Zusammensetzungen |
| US5449712A (en) | 1993-01-13 | 1995-09-12 | Thoro System Products, Inc. | Organosilicon emulsions for rendering porous substrates water repellent |
| US5512418A (en) | 1993-03-10 | 1996-04-30 | E. I. Du Pont De Nemours And Company | Infra-red sensitive aqueous wash-off photoimaging element |
| JP3152544B2 (ja) | 1993-06-24 | 2001-04-03 | シャープ株式会社 | スキャナ |
| US5576359A (en) | 1993-07-20 | 1996-11-19 | Wako Pure Chemical Industries, Ltd. | Deep ultraviolet absorbent composition |
| US5498748A (en) | 1993-07-20 | 1996-03-12 | Wako Pure Chemical Industries, Ltd. | Anthracene derivatives |
| JP3064753B2 (ja) | 1993-08-10 | 2000-07-12 | 東亞合成株式会社 | 抗菌性熱可塑性樹脂成形体の製造方法 |
| DE4331162A1 (de) | 1993-09-14 | 1995-03-16 | Bayer Ag | Verfahren zur Herstellung von Cyaninfarbstoffen |
| JP3200257B2 (ja) | 1993-09-13 | 2001-08-20 | キヤノン株式会社 | 画像復号装置 |
| US5467626A (en) | 1993-10-01 | 1995-11-21 | The Boeing Company | Integral forming die system for superplastic metal forming |
| US5382615A (en) | 1993-10-01 | 1995-01-17 | Eastman Chemical Company | Modified polyethylene based hot-melt adhesives for use in packaging |
| US6776094B1 (en) | 1993-10-04 | 2004-08-17 | President & Fellows Of Harvard College | Kit For Microcontact Printing |
| US5460911A (en) | 1994-03-14 | 1995-10-24 | Xerox Corporation | Electrophotographic imaging member free of reflection interference |
| DE69511141T2 (de) | 1994-03-28 | 2000-04-20 | Matsushita Electric Industrial Co., Ltd. | Resistzusammensetzung für tiefe Ultraviolettbelichtung |
| US6161555A (en) | 1994-04-19 | 2000-12-19 | Applied Elastomerics, Inc. | Crystal gels useful as dental floss with improved high tear, high tensile, and resistance to high stress rupture properties |
| US5759625A (en) | 1994-06-03 | 1998-06-02 | E. I. Du Pont De Nemours And Company | Fluoropolymer protectant layer for high temperature superconductor film and photo-definition thereof |
| US5468591A (en) | 1994-06-14 | 1995-11-21 | Eastman Kodak Company | Barrier layer for laser ablative imaging |
| JP3209476B2 (ja) | 1994-06-17 | 2001-09-17 | フジコピアン株式会社 | ファブリックインクリボン |
| FR2721720B1 (fr) | 1994-06-27 | 1996-09-06 | Essilor Int | Lentille ophtalmique en verre organique à intercouche anti-chocs et son procédé de fabrication. |
| US20020034630A1 (en) | 1994-06-27 | 2002-03-21 | Jean-Paul Cano | Ophthalmic lens made of organic glass with a shockproof intermediate layer, and method for making same |
| AU3460095A (en) | 1994-06-30 | 1996-01-25 | Hitachi Chemical Company, Ltd. | Material for forming silica-base coated insulation film, process for producing the material, silica-base insulation film, semiconductor device, and process for producing the device |
| US5910021A (en) | 1994-07-04 | 1999-06-08 | Yamaha Corporation | Manufacture of semiconductor device with fine pattens |
| US5976666A (en) | 1994-08-29 | 1999-11-02 | Sri International | Electromagnetic radiation absorbing devices and associated methods of manufacture and use |
| US5498468A (en) | 1994-09-23 | 1996-03-12 | Kimberly-Clark Corporation | Fabrics composed of ribbon-like fibrous material and method to make the same |
| US5449639A (en) | 1994-10-24 | 1995-09-12 | Taiwan Semiconductor Manufacturing Company Ltd. | Disposable metal anti-reflection coating process used together with metal dry/wet etch |
| KR0129950B1 (ko) | 1994-11-30 | 1998-04-03 | 김광호 | 반사방지막 조성물 |
| US5679128A (en) | 1995-01-31 | 1997-10-21 | Latting; John Alvis | Dry-bonded nonionic adjuvants |
| US5964917A (en) | 1995-01-31 | 1999-10-12 | Latting; John Alvis | Free-flowing fertilizer compositions |
| US5580819A (en) | 1995-03-22 | 1996-12-03 | Ppg Industries, Inc. | Coating composition, process for producing antireflective coatings, and coated articles |
| US5935758A (en) | 1995-04-20 | 1999-08-10 | Imation Corp. | Laser induced film transfer system |
| US5945249A (en) | 1995-04-20 | 1999-08-31 | Imation Corp. | Laser absorbable photobleachable compositions |
| GB9508031D0 (en) | 1995-04-20 | 1995-06-07 | Minnesota Mining & Mfg | UV-absorbing media bleachable by IR-radiation |
| GB9617416D0 (en) | 1996-08-20 | 1996-10-02 | Minnesota Mining & Mfg | Thermal bleaching of infrared dyes |
| US5747553A (en) | 1995-04-26 | 1998-05-05 | Reinforced Polymer Inc. | Low pressure acrylic molding composition with fiber reinforcement |
| US6103779A (en) | 1995-04-26 | 2000-08-15 | Reinforced Polmers, Inc. | Method of preparing molding compositions with fiber reinforcement and products obtained therefrom |
| US6150250A (en) | 1995-07-05 | 2000-11-21 | Yamaha Corporation | Conductive layer forming method using etching mask with direction <200> |
| JP3512911B2 (ja) | 1995-07-11 | 2004-03-31 | 富士写真フイルム株式会社 | 紫外線吸収剤前駆体化合物、それを含有する感光性樹脂組成物及び画像形成方法 |
| JP3824334B2 (ja) * | 1995-08-07 | 2006-09-20 | 東京応化工業株式会社 | シリカ系被膜形成用塗布液及び被膜形成方法 |
| US5583195A (en) | 1995-09-29 | 1996-12-10 | General Electric Company | Photocurable epoxy silicones functionalized with fluorescent or photosensitizing marker dyes |
| JPH09120157A (ja) | 1995-10-25 | 1997-05-06 | Fuji Photo Film Co Ltd | 湿し水不要感光性平版印刷版 |
| US6063714A (en) * | 1995-11-16 | 2000-05-16 | Texas Instruments Incorporated | Nanoporous dielectric thin film surface modification |
| US5672243A (en) | 1995-11-28 | 1997-09-30 | Mosel Vitelic, Inc. | Antireflection coating for highly reflective photolithographic layers comprising chromium oxide or chromium suboxide |
| TW376408B (en) | 1995-12-01 | 1999-12-11 | Nissan Chemical Ind Ltd | Coating film having water repellency and low refractive index |
| JP3930591B2 (ja) | 1995-12-22 | 2007-06-13 | 東陶機器株式会社 | 光触媒性親水性コーティング組成物、親水性被膜の形成方法および被覆物品 |
| AU715653B2 (en) | 1996-02-13 | 2000-02-10 | Sola International Inc. | Color-neutral UV blocking coating for plastic lens |
| US5756257A (en) | 1996-02-14 | 1998-05-26 | Imation Corp. | Color proofing article incorporating novel antihalation dye |
| JP3694703B2 (ja) * | 1996-04-25 | 2005-09-14 | Azエレクトロニックマテリアルズ株式会社 | 反射防止コーティング用組成物 |
| JP3436843B2 (ja) | 1996-04-25 | 2003-08-18 | 東京応化工業株式会社 | リソグラフィー用下地材及びそれを用いたリソグラフィー用レジスト材料 |
| US5994431A (en) | 1996-05-03 | 1999-11-30 | 3M Innovative Properties Company | Amide functional ultraviolet light absorbers for polyolefins |
| US6291586B2 (en) | 1996-05-03 | 2001-09-18 | 3M Innovative Properties Company | Amide functional ultraviolet light absorbers for polyurethanes and polyureas |
| TW354392B (en) * | 1996-07-03 | 1999-03-11 | Du Pont | Photomask blanks |
| TW515926B (en) | 1996-07-10 | 2003-01-01 | Matsushita Electric Industrial Co Ltd | Liquid crystal alignment film and method for producing the same, and liquid crystal display apparatus using the same and method for producing the same |
| JP3222386B2 (ja) | 1996-07-12 | 2001-10-29 | 信越化学工業株式会社 | コーティング剤組成物及びそのコーティング組成物で処理してなる物品 |
| US6040053A (en) | 1996-07-19 | 2000-03-21 | Minnesota Mining And Manufacturing Company | Coating composition having anti-reflective and anti-fogging properties |
| WO1998018855A1 (en) | 1996-10-25 | 1998-05-07 | Blue River International, L.L.C. | Silicon coating compositions and uses thereof |
| EP0844283B1 (en) * | 1996-11-20 | 2002-10-09 | JSR Corporation | Curable resin composition and cured products |
| JPH10161315A (ja) | 1996-12-05 | 1998-06-19 | Nippon Steel Chem Co Ltd | アルカリ可溶性感光性樹脂組成物 |
| US5695551A (en) | 1996-12-09 | 1997-12-09 | Dow Corning Corporation | Water repellent composition |
| EP0887392B1 (en) | 1996-12-13 | 2002-06-12 | Matsushita Electric Works, Ltd. | Silicone emulsion coating composition and processes for the preparation thereof |
| US5939236A (en) | 1997-02-07 | 1999-08-17 | Shipley Company, L.L.C. | Antireflective coating compositions comprising photoacid generators |
| US6174631B1 (en) | 1997-02-10 | 2001-01-16 | E. I. Du Pont De Nemours And Company | Attenuating phase shift photomasks |
| US6491840B1 (en) | 2000-02-14 | 2002-12-10 | The Procter & Gamble Company | Polymer compositions having specified PH for improved dispensing and improved stability of wrinkle reducing compositions and methods of use |
| DE19710461A1 (de) | 1997-03-13 | 1998-09-17 | Wacker Chemie Gmbh | Farbstoffreste aufweisende Organopolysiloxane |
| WO1998051752A1 (fr) | 1997-05-13 | 1998-11-19 | Kirin Beer Kabushiki Kaisha | Materiau de revetement permettant d'obtenir un film de revetement vitreux, procede de formation d'un revetement a l'aide de celui-ci, et dispositif d'application de revetement |
| TW473653B (en) | 1997-05-27 | 2002-01-21 | Clariant Japan Kk | Composition for anti-reflective film or photo absorption film and compound used therein |
| US5883011A (en) | 1997-06-18 | 1999-03-16 | Vlsi Technology, Inc. | Method of removing an inorganic antireflective coating from a semiconductor substrate |
| JP4012600B2 (ja) | 1997-06-23 | 2007-11-21 | 富士通株式会社 | 酸感応性重合体、レジスト組成物、レジストパターン形成方法、および半導体装置の製造方法 |
| JP3473887B2 (ja) | 1997-07-16 | 2003-12-08 | 東京応化工業株式会社 | 反射防止膜形成用組成物及びそれを用いたレジストパターンの形成方法 |
| JP4053631B2 (ja) | 1997-10-08 | 2008-02-27 | Azエレクトロニックマテリアルズ株式会社 | 反射防止膜又は光吸収膜用組成物及びこれに用いる重合体 |
| US6190839B1 (en) | 1998-01-15 | 2001-02-20 | Shipley Company, L.L.C. | High conformality antireflective coating compositions |
| WO1999037272A1 (de) | 1998-01-22 | 1999-07-29 | A. Kettenbach Fabrik Chemischer Erzeugnisse Dental-Spezialitäten Gmbh Und Co. Kg | Unterfütterung für prothesen und verfahren zur herstellung |
| US6190955B1 (en) | 1998-01-27 | 2001-02-20 | International Business Machines Corporation | Fabrication of trench capacitors using disposable hard mask |
| US6565813B1 (en) | 1998-02-04 | 2003-05-20 | Merck & Co., Inc. | Virtual wells for use in high throughput screening assays |
| US5972616A (en) | 1998-02-20 | 1999-10-26 | The Board Of Trustees Of The University Of Arkansas | TADG-15: an extracellular serine protease overexpressed in breast and ovarian carcinomas |
| US7022821B1 (en) | 1998-02-20 | 2006-04-04 | O'brien Timothy J | Antibody kit for the detection of TADG-15 protein |
| US6503586B1 (en) | 1998-02-25 | 2003-01-07 | Arteva North America S.A.R.L. | Title improved infrared absorbing polyester packaging polymer |
| US6962727B2 (en) | 1998-03-20 | 2005-11-08 | Honeywell International Inc. | Organosiloxanes |
| US5985444A (en) | 1998-04-03 | 1999-11-16 | 3M Innovative Properties Company | Amide functional ultraviolet light absorbers for fluoropolymers |
| DE69939244D1 (de) * | 1998-04-10 | 2008-09-18 | Matsushita Electric Works Ltd | Verfahren zur herstellung eines hydrophilen anorganischen beschichtungsfilms und eine zusammensetzung für anorganische beschichtungen |
| US5986344A (en) | 1998-04-14 | 1999-11-16 | Advanced Micro Devices, Inc. | Anti-reflective coating layer for semiconductor device |
| DE19817069A1 (de) | 1998-04-17 | 1999-10-21 | Clariant Gmbh | Infrarotstrahlung reflektierende Farbmittel |
| WO1999056178A1 (en) | 1998-04-29 | 1999-11-04 | Brewer Science, Inc. | Fast-etching, thermosetting anti-reflective coatings derived from cellulosic binders |
| US6576408B2 (en) | 1998-04-29 | 2003-06-10 | Brewer Science, Inc. | Thermosetting anti-reflective coatings comprising aryl urethanes of hydroxypropyl cellulose |
| US6461970B1 (en) | 1998-06-10 | 2002-10-08 | Micron Technology, Inc. | Method of reducing defects in anti-reflective coatings and semiconductor structures fabricated thereby |
| KR20010023776A (ko) | 1998-07-10 | 2001-03-26 | 잔디해머,한스루돌프하우스 | 저면 반사 방지막용 조성물 및 이에 사용하기 위한 신규중합체 염료 |
| US6444584B1 (en) | 1998-07-16 | 2002-09-03 | Taiwan Semiconductor Manufacturing Company | Plasma etch method for forming composite silicon/dielectric/silicon stack layer |
| US6103456A (en) | 1998-07-22 | 2000-08-15 | Siemens Aktiengesellschaft | Prevention of photoresist poisoning from dielectric antireflective coating in semiconductor fabrication |
| DE19834745A1 (de) | 1998-08-01 | 2000-02-03 | Agfa Gevaert Ag | Strahlungsempfindliches Gemisch mit IR-absorbierenden, anionischen Cyaninfarbstoffen und damit hergestelltes Aufzeichnungsmaterial |
| US6152906A (en) | 1998-08-25 | 2000-11-28 | Kimberly-Clark Worldwide, Inc. | Absorbent article having improved breathability |
| US6238379B1 (en) | 1998-08-25 | 2001-05-29 | Kimberly-Clark Worldwide, Inc. | Absorbent article with increased wet breathability |
| US6448464B1 (en) | 1999-07-30 | 2002-09-10 | Kimberly-Clark Worldwide, Inc. | Absorbent article which maintains skin temperature when wet |
| US6217890B1 (en) | 1998-08-25 | 2001-04-17 | Susan Carol Paul | Absorbent article which maintains or improves skin health |
| US6497893B1 (en) | 1999-06-30 | 2002-12-24 | Kimberly-Clark Worldwide, Inc. | Silk protein treatment composition and treated substrate for transfer to skin |
| US6149934A (en) | 1999-04-23 | 2000-11-21 | Kimberly-Clark Worldwide, Inc. | Absorbent article having a lotionized bodyside liner |
| US6287286B1 (en) | 1998-08-25 | 2001-09-11 | Kimberly-Clark Worldwide, Inc. | Absorbent article having a reduced viability of candida albicans |
| US20020102483A1 (en) | 1998-09-15 | 2002-08-01 | Timothy Adams | Antireflective coating compositions |
| US6190830B1 (en) | 1998-09-29 | 2001-02-20 | Kodak Polychrome Graphics Llc | Processless direct write printing plate having heat sensitive crosslinked vinyl polymer with organoonium group and methods of imaging and printing |
| US6503233B1 (en) | 1998-10-02 | 2003-01-07 | Kimberly-Clark Worldwide, Inc. | Absorbent article having good body fit under dynamic conditions |
| US6667424B1 (en) | 1998-10-02 | 2003-12-23 | Kimberly-Clark Worldwide, Inc. | Absorbent articles with nits and free-flowing particles |
| US6673982B1 (en) | 1998-10-02 | 2004-01-06 | Kimberly-Clark Worldwide, Inc. | Absorbent article with center fill performance |
| US6562192B1 (en) | 1998-10-02 | 2003-05-13 | Kimberly-Clark Worldwide, Inc. | Absorbent articles with absorbent free-flowing particles and methods for producing the same |
| JP3702108B2 (ja) | 1998-10-07 | 2005-10-05 | 株式会社東芝 | レジストパターン形成方法 |
| JP2000129073A (ja) | 1998-10-26 | 2000-05-09 | Toyo Ink Mfg Co Ltd | 常温硬化性樹脂組成物および該樹脂組成物を塗工した基材 |
| DE19852852A1 (de) | 1998-11-11 | 2000-05-18 | Inst Halbleiterphysik Gmbh | Lithographieverfahren zur Emitterstrukturierung von Bipolartransistoren |
| US6251973B1 (en) | 1998-11-23 | 2001-06-26 | Akzo Nobel N.V. | Coatings and coating compositions of a reactive group-containing polymer, a hydrazide and a silane |
| US5981675A (en) | 1998-12-07 | 1999-11-09 | Bausch & Lomb Incorporated | Silicone-containing macromonomers and low water materials |
| US6326231B1 (en) | 1998-12-08 | 2001-12-04 | Advanced Micro Devices, Inc. | Use of silicon oxynitride ARC for metal layers |
| US6235456B1 (en) | 1998-12-09 | 2001-05-22 | Advanced Micros Devices, Inc. | Graded anti-reflective barrier films for ultra-fine lithography |
| US6635281B2 (en) | 1998-12-23 | 2003-10-21 | Alza Corporation | Gastric retaining oral liquid dosage form |
| US6342249B1 (en) | 1998-12-23 | 2002-01-29 | Alza Corporation | Controlled release liquid active agent formulation dosage forms |
| KR100363695B1 (ko) | 1998-12-31 | 2003-04-11 | 주식회사 하이닉스반도체 | 유기난반사방지중합체및그의제조방법 |
| US6210856B1 (en) | 1999-01-27 | 2001-04-03 | International Business Machines Corporation | Resist composition and process of forming a patterned resist layer on a substrate |
| TW476865B (en) | 1999-01-28 | 2002-02-21 | Tokyo Ohka Kogyo Co Ltd | Undercoating composition for photolithographic resist |
| US6544717B2 (en) | 1999-01-28 | 2003-04-08 | Tokyo Ohka Kogyo Co., Ltd. | Undercoating composition for photolithographic resist |
| US6187505B1 (en) | 1999-02-02 | 2001-02-13 | International Business Machines Corporation | Radiation sensitive silicon-containing resists |
| EP1031579B1 (en) | 1999-02-26 | 2005-07-27 | Showa Denko Kabushiki Kaisha | Photopolymerization initiator for color filter, photosensitive coloring composition, and color filter |
| US6316165B1 (en) * | 1999-03-08 | 2001-11-13 | Shipley Company, L.L.C. | Planarizing antireflective coating compositions |
| JP4270632B2 (ja) | 1999-03-12 | 2009-06-03 | 株式会社東芝 | ドライエッチングを用いた半導体装置の製造方法 |
| US6849923B2 (en) | 1999-03-12 | 2005-02-01 | Kabushiki Kaisha Toshiba | Semiconductor device and manufacturing method of the same |
| US6426125B1 (en) | 1999-03-17 | 2002-07-30 | General Electric Company | Multilayer article and method of making by ARC plasma deposition |
| US6409883B1 (en) | 1999-04-16 | 2002-06-25 | Kimberly-Clark Worldwide, Inc. | Methods of making fiber bundles and fibrous structures |
| KR100804873B1 (ko) * | 1999-06-10 | 2008-02-20 | 얼라이드시그날 인코퍼레이티드 | 포토리소그래피용 sog 반사방지 코팅 |
| US6824879B2 (en) | 1999-06-10 | 2004-11-30 | Honeywell International Inc. | Spin-on-glass anti-reflective coatings for photolithography |
| US6268457B1 (en) * | 1999-06-10 | 2001-07-31 | Allied Signal, Inc. | Spin-on glass anti-reflective coatings for photolithography |
| US6890448B2 (en) | 1999-06-11 | 2005-05-10 | Shipley Company, L.L.C. | Antireflective hard mask compositions |
| US6329118B1 (en) | 1999-06-21 | 2001-12-11 | Intel Corporation | Method for patterning dual damascene interconnects using a sacrificial light absorbing material |
| US6623791B2 (en) | 1999-07-30 | 2003-09-23 | Ppg Industries Ohio, Inc. | Coating compositions having improved adhesion, coated substrates and methods related thereto |
| AU770696B2 (en) | 1999-07-30 | 2004-02-26 | Ppg Industries Ohio, Inc. | Cured coatings having improved scratch resistance, coated substrates and methods related thereto |
| US6107167A (en) | 1999-08-02 | 2000-08-22 | Advanced Micro Devices, Inc. | Simplified method of patterning polysilicon gate in a semiconductor device |
| US6475892B1 (en) | 1999-08-02 | 2002-11-05 | Aadvanced Micro Devices, Inc. | Simplified method of patterning polysilicon gate in a semiconductor device |
| US6649083B1 (en) * | 1999-08-12 | 2003-11-18 | Board Of Trustees Of Michigan State University | Combined porous organic and inorganic oxide materials prepared by non-ionic surfactant templating route |
| US6335235B1 (en) | 1999-08-17 | 2002-01-01 | Advanced Micro Devices, Inc. | Simplified method of patterning field dielectric regions in a semiconductor device |
| AR025300A1 (es) | 1999-08-23 | 2002-11-20 | Kimberly Clark Co | Un articulo absorbente descartable con capacidad para respirar en humedo incrementada. |
| AR027842A1 (es) | 1999-08-23 | 2003-04-16 | Kimberly Clark Co | Un articulo absorbente el cual mantiene o mejora la salud de la piel |
| JP2001079491A (ja) | 1999-09-10 | 2001-03-27 | Koito Mfg Co Ltd | 塗膜形成方法及び該方法で形成された車両用灯具 |
| EP1757565A3 (en) | 1999-09-13 | 2009-01-07 | Koninklijke Philips Electronics N.V. | Light-absorbing coating and electric lamp therewith |
| JP4248098B2 (ja) | 1999-09-20 | 2009-04-02 | 東京応化工業株式会社 | 反射防止膜形成用組成物及びレジストパターンの形成方法 |
| US6315946B1 (en) | 1999-10-21 | 2001-11-13 | The United States Of America As Represented By The Secretary Of The Navy | Ultra low carbon bainitic weathering steel |
| US6232424B1 (en) | 1999-12-13 | 2001-05-15 | Dow Corning Corporation | Soluble silicone resin compositions having good solution stability |
| US6403464B1 (en) | 1999-11-03 | 2002-06-11 | Taiwan Semiconductor Manufacturing Company | Method to reduce the moisture content in an organic low dielectric constant material |
| US6391524B2 (en) | 1999-11-19 | 2002-05-21 | Kodak Polychrome Graphics Llc | Article having imagable coatings |
| TW468053B (en) | 1999-12-14 | 2001-12-11 | Nissan Chemical Ind Ltd | Antireflection film, process for forming the antireflection film, and antireflection glass |
| EP1257367A4 (en) | 2000-02-08 | 2005-01-26 | Adsil Lc | METHOD FOR INCREASING THE THERMAL EFFICIENCY THROUGH THE USE OF SILANE COATINGS AND COATED ARTICLES |
| WO2001060961A1 (en) | 2000-02-14 | 2001-08-23 | The Procter & Gamble Company | Stable, aqueous compositions for treating surfaces, especially fabrics |
| AU2001233290A1 (en) | 2000-02-22 | 2001-09-03 | Brewer Science, Inc. | Organic polymeric antireflective coatings deposited by chemical vapor deposition |
| DE60138327D1 (de) * | 2000-02-28 | 2009-05-28 | Jsr Corp | Zusammensetzung zur Filmerzeugung, Verfahren zur Filmerzeugung und Filme auf Basis von Siliciumoxid |
| JP2003531924A (ja) * | 2000-02-28 | 2003-10-28 | アドシル・エルシー | シランが基になったコーティング組成物、これから得た被覆製品およびこれの使用方法 |
| US6451420B1 (en) | 2000-03-17 | 2002-09-17 | Nanofilm, Ltd. | Organic-inorganic hybrid polymer and method of making same |
| JP3604007B2 (ja) * | 2000-03-29 | 2004-12-22 | 富士通株式会社 | 低誘電率被膜形成材料、及びそれを用いた被膜と半導体装置の製造方法 |
| WO2001074937A1 (en) | 2000-03-30 | 2001-10-11 | General Electric Company | Transparent, flame retardant poly(arylene ether) blends |
| JP3795333B2 (ja) | 2000-03-30 | 2006-07-12 | 東京応化工業株式会社 | 反射防止膜形成用組成物 |
| US6593388B2 (en) | 2000-04-04 | 2003-07-15 | Renssealer Polytechnic Institute | Oligomeric and polymeric photosensitizers comprising a polynuclear aromatic group |
| US6268294B1 (en) | 2000-04-04 | 2001-07-31 | Taiwan Semiconductor Manufacturing Company | Method of protecting a low-K dielectric material |
| ATE321105T1 (de) | 2000-04-13 | 2006-04-15 | Jsr Corp | Überzugsmittel, verfahren zur herstellung, gehärtetes produkt und beschichtungsfilm |
| US6374738B1 (en) | 2000-05-03 | 2002-04-23 | Presstek, Inc. | Lithographic imaging with non-ablative wet printing members |
| JP3846545B2 (ja) | 2000-06-08 | 2006-11-15 | 信越化学工業株式会社 | コーティング剤組成物、コーティング方法及び被覆物品 |
| US6632535B1 (en) | 2000-06-08 | 2003-10-14 | Q2100, Inc. | Method of forming antireflective coatings |
| US6852766B1 (en) | 2000-06-15 | 2005-02-08 | 3M Innovative Properties Company | Multiphoton photosensitization system |
| US6420088B1 (en) | 2000-06-23 | 2002-07-16 | International Business Machines Corporation | Antireflective silicon-containing compositions as hardmask layer |
| US6323268B1 (en) | 2000-06-27 | 2001-11-27 | Dow Corning Corporation | Organosilicon water repellent compositions |
| US6891237B1 (en) | 2000-06-27 | 2005-05-10 | Lucent Technologies Inc. | Organic semiconductor device having an active dielectric layer comprising silsesquioxanes |
| JP2002023350A (ja) | 2000-07-07 | 2002-01-23 | Fuji Photo Film Co Ltd | ネガ型平版印刷版原版 |
| US6271273B1 (en) | 2000-07-14 | 2001-08-07 | Shipley Company, L.L.C. | Porous materials |
| US6368400B1 (en) | 2000-07-17 | 2002-04-09 | Honeywell International | Absorbing compounds for spin-on-glass anti-reflective coatings for photolithography |
| TW556047B (en) | 2000-07-31 | 2003-10-01 | Shipley Co Llc | Coated substrate, method for forming photoresist relief image, and antireflective composition |
| US6635341B1 (en) | 2000-07-31 | 2003-10-21 | Ppg Industries Ohio, Inc. | Coating compositions comprising silyl blocked components, coating, coated substrates and methods related thereto |
| WO2002016535A2 (en) | 2000-08-18 | 2002-02-28 | The Procter & Gamble Company | Compositions and methods for odor and fungal control of protective garments |
| CN1447981B (zh) | 2000-08-21 | 2013-08-07 | 陶氏环球技术公司 | 微电子装置制造中用于有机聚合物电介质的硬面层的有机硅酸盐树脂 |
| US6645685B2 (en) | 2000-09-06 | 2003-11-11 | Mitsubishi Paper Mills Limited | Process for producing printed wiring board |
| JP3993373B2 (ja) | 2000-09-14 | 2007-10-17 | 信越化学工業株式会社 | ポリオルガノシロキサン化合物及びそれを含有するコーティング組成物 |
| JP3772077B2 (ja) | 2000-09-27 | 2006-05-10 | 株式会社東芝 | パターン形成方法 |
| US6465358B1 (en) | 2000-10-06 | 2002-10-15 | Intel Corporation | Post etch clean sequence for making a semiconductor device |
| EP1197511A1 (en) * | 2000-10-10 | 2002-04-17 | Shipley Company LLC | Antireflective composition |
| US6884568B2 (en) | 2000-10-17 | 2005-04-26 | Kodak Polychrome Graphics, Llc | Stabilized infrared-sensitive polymerizable systems |
| US6864040B2 (en) | 2001-04-11 | 2005-03-08 | Kodak Polychrome Graphics Llc | Thermal initiator system using leuco dyes and polyhalogene compounds |
| US6756520B1 (en) | 2000-10-20 | 2004-06-29 | Kimberly-Clark Worldwide, Inc. | Hydrophilic compositions for use on absorbent articles to enhance skin barrier |
| US6503526B1 (en) | 2000-10-20 | 2003-01-07 | Kimberly-Clark Worldwide, Inc. | Absorbent articles enhancing skin barrier function |
| US6455416B1 (en) | 2000-10-24 | 2002-09-24 | Advanced Micro Devices, Inc. | Developer soluble dyed BARC for dual damascene process |
| CN1245664C (zh) * | 2000-12-11 | 2006-03-15 | 捷时雅株式会社 | 放射线敏感性折射率变化性组合物以及折射率变化法 |
| US6699647B2 (en) | 2000-12-21 | 2004-03-02 | Eastman Kodak Company | High speed photothermographic materials containing tellurium compounds and methods of using same |
| US6749860B2 (en) | 2000-12-22 | 2004-06-15 | Kimberly-Clark Worldwide, Inc. | Absorbent articles with non-aqueous compositions containing botanicals |
| US20020128615A1 (en) | 2000-12-22 | 2002-09-12 | Tyrrell David John | Absorbent articles with non-aqueous compositions containing anionic polymers |
| US6832064B2 (en) | 2000-12-29 | 2004-12-14 | Samsung Electronics Co., Ltd. | Seamless drying belt for electrophotographic process |
| NZ526871A (en) | 2001-01-25 | 2006-01-27 | Bristol Myers Squibb Co | Pharmaceutical dosage forms of epothilones for oral administration |
| US6465889B1 (en) | 2001-02-07 | 2002-10-15 | Advanced Micro Devices, Inc. | Silicon carbide barc in dual damascene processing |
| US6726463B2 (en) | 2001-02-20 | 2004-04-27 | Q2100, Inc. | Apparatus for preparing an eyeglass lens having a dual computer system controller |
| US6875005B2 (en) | 2001-02-20 | 2005-04-05 | Q1200, Inc. | Apparatus for preparing an eyeglass lens having a gating device |
| US6655946B2 (en) | 2001-02-20 | 2003-12-02 | Q2100, Inc. | Apparatus for preparing an eyeglass lens having a controller for conveyor and curing units |
| US6840752B2 (en) | 2001-02-20 | 2005-01-11 | Q2100, Inc. | Apparatus for preparing multiple eyeglass lenses |
| US6612828B2 (en) | 2001-02-20 | 2003-09-02 | Q2100, Inc. | Fill system with controller for monitoring use |
| US6790024B2 (en) | 2001-02-20 | 2004-09-14 | Q2100, Inc. | Apparatus for preparing an eyeglass lens having multiple conveyor systems |
| US6752613B2 (en) | 2001-02-20 | 2004-06-22 | Q2100, Inc. | Apparatus for preparing an eyeglass lens having a controller for initiation of lens curing |
| US6702564B2 (en) | 2001-02-20 | 2004-03-09 | Q2100, Inc. | System for preparing an eyeglass lens using colored mold holders |
| US6676398B2 (en) | 2001-02-20 | 2004-01-13 | Q2100, Inc. | Apparatus for preparing an eyeglass lens having a prescription reader |
| US7139636B2 (en) | 2001-02-20 | 2006-11-21 | Q2100, Inc. | System for preparing eyeglass lenses with bar code reader |
| US6758663B2 (en) | 2001-02-20 | 2004-07-06 | Q2100, Inc. | System for preparing eyeglass lenses with a high volume curing unit |
| US6709257B2 (en) | 2001-02-20 | 2004-03-23 | Q2100, Inc. | Eyeglass lens forming apparatus with sensor |
| US7052262B2 (en) | 2001-02-20 | 2006-05-30 | Q2100, Inc. | System for preparing eyeglasses lens with filling station |
| US6808381B2 (en) | 2001-02-20 | 2004-10-26 | Q2100, Inc. | Apparatus for preparing an eyeglass lens having a controller |
| US6712331B2 (en) | 2001-02-20 | 2004-03-30 | Q2100, Inc. | Holder for mold assemblies with indicia |
| US7011773B2 (en) | 2001-02-20 | 2006-03-14 | Q2100, Inc. | Graphical interface to display mold assembly position in a lens forming apparatus |
| US6893245B2 (en) | 2001-02-20 | 2005-05-17 | Q2100, Inc. | Apparatus for preparing an eyeglass lens having a computer system controller |
| US6717181B2 (en) | 2001-02-22 | 2004-04-06 | Semiconductor Energy Laboratory Co., Ltd. | Luminescent device having thin film transistor |
| US6703462B2 (en) | 2001-08-09 | 2004-03-09 | Dielectric Systems Inc. | Stabilized polymer film and its manufacture |
| US20030198578A1 (en) | 2002-04-18 | 2003-10-23 | Dielectric Systems, Inc. | Multi-stage-heating thermal reactor for transport polymerization |
| US6825303B2 (en) | 2001-02-26 | 2004-11-30 | Dielectric Systems, Inc. | Integration of low ε thin films and Ta into Cu dual damascene |
| US6797343B2 (en) | 2001-12-20 | 2004-09-28 | Dielectric Systems, Inc. | Dielectric thin films from fluorinated precursors |
| US6582861B2 (en) | 2001-03-16 | 2003-06-24 | Applied Materials, Inc. | Method of reshaping a patterned organic photoresist surface |
| US6617257B2 (en) | 2001-03-30 | 2003-09-09 | Lam Research Corporation | Method of plasma etching organic antireflective coating |
| US20040091811A1 (en) | 2002-10-30 | 2004-05-13 | Munnelly Heidi M. | Hetero-substituted aryl acetic acid co-initiators for IR-sensitive compositions |
| US6846614B2 (en) | 2002-02-04 | 2005-01-25 | Kodak Polychrome Graphics Llc | On-press developable IR sensitive printing plates |
| US6893797B2 (en) | 2001-11-09 | 2005-05-17 | Kodak Polychrome Graphics Llc | High speed negative-working thermal printing plates |
| TW576859B (en) | 2001-05-11 | 2004-02-21 | Shipley Co Llc | Antireflective coating compositions |
| US6713643B2 (en) * | 2001-05-24 | 2004-03-30 | Board Of Trustees Of Michigan State University | Ultrastable organofunctional microporous to mesoporous silica compositions |
| JP4146105B2 (ja) | 2001-05-30 | 2008-09-03 | 富士フイルム株式会社 | 紫外線吸収剤及びその製造方法、紫外線吸収剤を含有する組成物、ならびに画像形成方法 |
| US6448185B1 (en) | 2001-06-01 | 2002-09-10 | Intel Corporation | Method for making a semiconductor device that has a dual damascene interconnect |
| CN1332377C (zh) | 2001-06-05 | 2007-08-15 | 自由播放技术公司 | 有限次播放光学设备以及制造该设备的方法 |
| US6558880B1 (en) | 2001-06-06 | 2003-05-06 | Eastman Kodak Company | Thermally developable imaging materials containing heat-bleachable antihalation composition |
| JP4181312B2 (ja) | 2001-06-25 | 2008-11-12 | 富士フイルム株式会社 | ネガ型画像記録材料 |
| JP2003025510A (ja) | 2001-07-16 | 2003-01-29 | Shin Etsu Chem Co Ltd | 反射防止性及び耐擦傷性を有する多層積層体 |
| US6703169B2 (en) | 2001-07-23 | 2004-03-09 | Applied Materials, Inc. | Method of preparing optically imaged high performance photomasks |
| US6649212B2 (en) | 2001-07-30 | 2003-11-18 | Guardian Industries Corporation | Modified silicon-based UV absorbers useful in crosslinkable polysiloxane coatings via sol-gel polymerization |
| US6592999B1 (en) | 2001-07-31 | 2003-07-15 | Ppg Industries Ohio, Inc. | Multi-layer composites formed from compositions having improved adhesion, coating compositions, and methods related thereto |
| JP2003050459A (ja) | 2001-08-07 | 2003-02-21 | Hitachi Chem Co Ltd | 感光性樹脂組成物、感光性エレメント、レジストパターンの製造法およびプリント配線板の製造法 |
| KR100436220B1 (ko) | 2001-08-30 | 2004-06-12 | 주식회사 네패스 | 바닥 반사방지막용 유기 중합체, 그의 제조방법 및 그를함유하는 조성물 |
| US6514677B1 (en) | 2001-08-31 | 2003-02-04 | Eastman Kodak Company | Thermally developable infrared sensitive imaging materials containing heat-bleachable antihalation composition |
| US6824952B1 (en) | 2001-09-13 | 2004-11-30 | Microchem Corp. | Deep-UV anti-reflective resist compositions |
| TW591341B (en) | 2001-09-26 | 2004-06-11 | Shipley Co Llc | Coating compositions for use with an overcoated photoresist |
| DE10151264A1 (de) * | 2001-10-17 | 2003-04-30 | Degussa | Aminoalkylalkoxysiloxanhaltige Gemische, deren Herstellung und deren Verwendung |
| US6730461B2 (en) | 2001-10-26 | 2004-05-04 | Eastman Kodak Company | Thermally developable imaging materials with reduced mottle providing improved image uniformity |
| US6949297B2 (en) | 2001-11-02 | 2005-09-27 | 3M Innovative Properties Company | Hybrid adhesives, articles, and methods |
| AU2002227106A1 (en) | 2001-11-15 | 2003-06-10 | Honeywell International Inc. | Spin-on anti-reflective coatings for photolithography |
| US6573175B1 (en) | 2001-11-30 | 2003-06-03 | Micron Technology, Inc. | Dry low k film application for interlevel dielectric and method of cleaning etched features |
| US20030171729A1 (en) | 2001-12-28 | 2003-09-11 | Kaun James Martin | Multifunctional containment sheet and system for absorbent atricles |
| US6844131B2 (en) | 2002-01-09 | 2005-01-18 | Clariant Finance (Bvi) Limited | Positive-working photoimageable bottom antireflective coating |
| US20030214042A1 (en) | 2002-02-01 | 2003-11-20 | Seiko Epson Corporation | Circuit substrate, electro-optical device and electronic appliances |
| CA2474913A1 (en) | 2002-02-05 | 2003-08-14 | Gencell Corporation | Silane coated metallic fuel cell components and methods of manufacture |
| EP1481282A4 (en) | 2002-03-04 | 2009-10-28 | Shipley Co Llc | NEGATIVE PHOTORESISTS FOR IMAGING WITH SHORT WAVE LENGTH |
| DE10213294B4 (de) | 2002-03-25 | 2015-05-13 | Osram Gmbh | Verwendung eines UV-beständigen Polymers in der Optoelektronik sowie im Außenanwendungsbereich, UV-beständiges Polymer sowie optisches Bauelement |
| US6730454B2 (en) | 2002-04-16 | 2004-05-04 | International Business Machines Corporation | Antireflective SiO-containing compositions for hardmask layer |
| US6787281B2 (en) | 2002-05-24 | 2004-09-07 | Kodak Polychrome Graphics Llc | Selected acid generating agents and their use in processes for imaging radiation-sensitive elements |
| US7307343B2 (en) * | 2002-05-30 | 2007-12-11 | Air Products And Chemicals, Inc. | Low dielectric materials and methods for making same |
| US7897979B2 (en) | 2002-06-07 | 2011-03-01 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device and manufacturing method thereof |
| CN1248556C (zh) | 2002-08-05 | 2006-03-29 | 佳能株式会社 | 电极和布线材料吸收用底层图形形成材料及其应用 |
| US6896821B2 (en) | 2002-08-23 | 2005-05-24 | Dalsa Semiconductor Inc. | Fabrication of MEMS devices with spin-on glass |
| US20040067437A1 (en) | 2002-10-06 | 2004-04-08 | Shipley Company, L.L.C. | Coating compositions for use with an overcoated photoresist |
| US7005390B2 (en) | 2002-10-09 | 2006-02-28 | Intel Corporation | Replenishment of surface carbon and surface passivation of low-k porous silicon-based dielectric materials |
| US7038328B2 (en) | 2002-10-15 | 2006-05-02 | Brewer Science Inc. | Anti-reflective compositions comprising triazine compounds |
| WO2004037866A2 (en) | 2002-10-21 | 2004-05-06 | Shipley Company L.L.C. | Photoresists containing sulfonamide component |
| US6783468B2 (en) | 2002-10-24 | 2004-08-31 | Acushnet Company | Low deformation golf ball |
| US7122384B2 (en) | 2002-11-06 | 2006-10-17 | E. I. Du Pont De Nemours And Company | Resonant light scattering microparticle methods |
| US7465414B2 (en) | 2002-11-14 | 2008-12-16 | Transitions Optical, Inc. | Photochromic article |
| JP2004177952A (ja) | 2002-11-20 | 2004-06-24 | Rohm & Haas Electronic Materials Llc | 多層フォトレジスト系 |
| US7018779B2 (en) | 2003-01-07 | 2006-03-28 | International Business Machines Corporation | Apparatus and method to improve resist line roughness in semiconductor wafer processing |
| US7507783B2 (en) | 2003-02-24 | 2009-03-24 | Brewer Science Inc. | Thermally curable middle layer comprising polyhedral oligomeric silsesouioxanes for 193-nm trilayer resist process |
| US6902861B2 (en) | 2003-03-10 | 2005-06-07 | Kodak Polychrome Graphics, Llc | Infrared absorbing compounds and their use in photoimageable elements |
| KR100857967B1 (ko) | 2003-06-03 | 2008-09-10 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 반사 방지막 재료, 이것을 이용한 반사 방지막 및 패턴형성 방법 |
| KR100882409B1 (ko) | 2003-06-03 | 2009-02-05 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 반사 방지용 실리콘 수지, 반사 방지막 재료, 이것을 이용한 반사 방지막 및 패턴 형성 방법 |
| US7008476B2 (en) | 2003-06-11 | 2006-03-07 | Az Electronic Materials Usa Corp. | Modified alginic acid of alginic acid derivatives and thermosetting anti-reflective compositions thereof |
| US6899988B2 (en) | 2003-06-13 | 2005-05-31 | Kodak Polychrome Graphics Llc | Laser thermal metallic donors |
| JP2005049542A (ja) | 2003-07-31 | 2005-02-24 | Fuji Photo Film Co Ltd | 画像形成方法及び現像液 |
| US7172849B2 (en) | 2003-08-22 | 2007-02-06 | International Business Machines Corporation | Antireflective hardmask and uses thereof |
| US20050074981A1 (en) | 2003-10-06 | 2005-04-07 | Meagley Robert P. | Increasing the etch resistance of photoresists |
| US7270931B2 (en) | 2003-10-06 | 2007-09-18 | International Business Machines Corporation | Silicon-containing compositions for spin-on ARC/hardmask materials |
| US8053159B2 (en) | 2003-11-18 | 2011-11-08 | Honeywell International Inc. | Antireflective coatings for via fill and photolithography applications and methods of preparation thereof |
| TWI367686B (en) | 2004-04-07 | 2012-07-01 | Semiconductor Energy Lab | Light emitting device, electronic device, and television device |
| US20060155594A1 (en) | 2005-01-13 | 2006-07-13 | Jess Almeida | Adaptive step-by-step process with guided conversation logs for improving the quality of transaction data |
| JP4513966B2 (ja) | 2005-03-07 | 2010-07-28 | 信越化学工業株式会社 | プライマー組成物及びそれを用いた電気電子部品 |
-
2001
- 2001-11-15 US US10/001,143 patent/US6824879B2/en not_active Expired - Lifetime
-
2002
- 2002-10-31 CN CNA028271661A patent/CN1615333A/zh active Pending
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- 2002-11-15 TW TW091133495A patent/TWI324626B/zh not_active IP Right Cessation
- 2002-11-15 TW TW091133515A patent/TWI308585B/zh not_active IP Right Cessation
-
2009
- 2009-05-25 JP JP2009125324A patent/JP4703745B2/ja not_active Expired - Fee Related
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| KR20050042069A (ko) | 2005-05-04 |
| AU2002336709A1 (en) | 2003-06-10 |
| EP1478683A1 (en) | 2004-11-24 |
| US9069133B2 (en) | 2015-06-30 |
| US20020095018A1 (en) | 2002-07-18 |
| WO2003044079A1 (en) | 2003-05-30 |
| JP2005509914A (ja) | 2005-04-14 |
| JP2005509913A (ja) | 2005-04-14 |
| TW200306342A (en) | 2003-11-16 |
| US6824879B2 (en) | 2004-11-30 |
| JP2009282524A (ja) | 2009-12-03 |
| CN1615332A (zh) | 2005-05-11 |
| CN1615333A (zh) | 2005-05-11 |
| EP1478683A4 (en) | 2005-06-15 |
| US20140227538A1 (en) | 2014-08-14 |
| KR100897575B1 (ko) | 2009-05-15 |
| KR20050042068A (ko) | 2005-05-04 |
| TWI308585B (en) | 2009-04-11 |
| JP4703745B2 (ja) | 2011-06-15 |
| TW200302259A (en) | 2003-08-01 |
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