TWI303096B - - Google Patents

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Publication number
TWI303096B
TWI303096B TW095106813A TW95106813A TWI303096B TW I303096 B TWI303096 B TW I303096B TW 095106813 A TW095106813 A TW 095106813A TW 95106813 A TW95106813 A TW 95106813A TW I303096 B TWI303096 B TW I303096B
Authority
TW
Taiwan
Prior art keywords
semiconductor
substrate
wafer
wiring
connection
Prior art date
Application number
TW095106813A
Other languages
English (en)
Chinese (zh)
Other versions
TW200636972A (en
Inventor
Masaki Hatano
Yuji Takaoka
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of TW200636972A publication Critical patent/TW200636972A/zh
Application granted granted Critical
Publication of TWI303096B publication Critical patent/TWI303096B/zh

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Classifications

    • H10W90/00—
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04C—STRUCTURAL ELEMENTS; BUILDING MATERIALS
    • E04C2/00—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels
    • E04C2/02—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials
    • E04C2/26—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials composed of materials covered by two or more of groups E04C2/04, E04C2/08, E04C2/10 or of materials covered by one of these groups with a material not specified in one of the groups
    • E04C2/284—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials composed of materials covered by two or more of groups E04C2/04, E04C2/08, E04C2/10 or of materials covered by one of these groups with a material not specified in one of the groups at least one of the materials being insulating
    • E04C2/292—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials composed of materials covered by two or more of groups E04C2/04, E04C2/08, E04C2/10 or of materials covered by one of these groups with a material not specified in one of the groups at least one of the materials being insulating composed of insulating material and sheet metal
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
    • E04B1/00—Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
    • E04B1/38—Connections for building structures in general
    • E04B1/61—Connections for building structures in general of slab-shaped building elements with each other
    • E04B1/6108—Connections for building structures in general of slab-shaped building elements with each other the frontal surfaces of the slabs connected together
    • E04B1/612—Connections for building structures in general of slab-shaped building elements with each other the frontal surfaces of the slabs connected together by means between frontal surfaces
    • E04B1/6125—Connections for building structures in general of slab-shaped building elements with each other the frontal surfaces of the slabs connected together by means between frontal surfaces with protrusions on the one frontal surface co-operating with recesses in the other frontal surface
    • H10W70/614—
    • H10W70/618—
    • H10W70/63—
    • H10W70/655—
    • H10W70/681—
    • H10W70/682—
    • H10W72/07252—
    • H10W72/227—
    • H10W72/923—
    • H10W72/926—
    • H10W72/9415—
    • H10W72/952—
    • H10W74/15—
    • H10W90/722—
    • H10W90/724—
    • H10W90/732—
    • H10W90/734—

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW095106813A 2005-03-16 2006-03-01 Semiconductor device and method of manufacturing semiconductor device TW200636972A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005075165A JP4581768B2 (ja) 2005-03-16 2005-03-16 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
TW200636972A TW200636972A (en) 2006-10-16
TWI303096B true TWI303096B (enExample) 2008-11-11

Family

ID=37002912

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095106813A TW200636972A (en) 2005-03-16 2006-03-01 Semiconductor device and method of manufacturing semiconductor device

Country Status (5)

Country Link
US (2) US7402901B2 (enExample)
JP (1) JP4581768B2 (enExample)
KR (1) KR101210140B1 (enExample)
CN (1) CN100470793C (enExample)
TW (1) TW200636972A (enExample)

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* Cited by examiner, † Cited by third party
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