TW200636972A - Semiconductor device and method of manufacturing semiconductor device - Google Patents
Semiconductor device and method of manufacturing semiconductor deviceInfo
- Publication number
- TW200636972A TW200636972A TW095106813A TW95106813A TW200636972A TW 200636972 A TW200636972 A TW 200636972A TW 095106813 A TW095106813 A TW 095106813A TW 95106813 A TW95106813 A TW 95106813A TW 200636972 A TW200636972 A TW 200636972A
- Authority
- TW
- Taiwan
- Prior art keywords
- chip
- semiconductor device
- semiconductor
- semiconductor chips
- connection pads
- Prior art date
Links
Classifications
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04C—STRUCTURAL ELEMENTS; BUILDING MATERIALS
- E04C2/00—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels
- E04C2/02—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials
- E04C2/26—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials composed of materials covered by two or more of groups E04C2/04, E04C2/08, E04C2/10 or of materials covered by one of these groups with a material not specified in one of the groups
- E04C2/284—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials composed of materials covered by two or more of groups E04C2/04, E04C2/08, E04C2/10 or of materials covered by one of these groups with a material not specified in one of the groups at least one of the materials being insulating
- E04C2/292—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by specified materials composed of materials covered by two or more of groups E04C2/04, E04C2/08, E04C2/10 or of materials covered by one of these groups with a material not specified in one of the groups at least one of the materials being insulating composed of insulating material and sheet metal
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- E04B1/00—Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
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- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- 2006-03-02 US US11/366,123 patent/US7402901B2/en active Active
- 2006-03-15 CN CNB2006100592086A patent/CN100470793C/zh not_active Expired - Fee Related
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KR101210140B1 (ko) | 2012-12-07 |
US7402901B2 (en) | 2008-07-22 |
CN100470793C (zh) | 2009-03-18 |
US20060226527A1 (en) | 2006-10-12 |
US20080138932A1 (en) | 2008-06-12 |
JP2006261311A (ja) | 2006-09-28 |
TWI303096B (zh) | 2008-11-11 |
KR20060100263A (ko) | 2006-09-20 |
JP4581768B2 (ja) | 2010-11-17 |
CN1835229A (zh) | 2006-09-20 |
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