TWI357653B - - Google Patents

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Publication number
TWI357653B
TWI357653B TW096130265A TW96130265A TWI357653B TW I357653 B TWI357653 B TW I357653B TW 096130265 A TW096130265 A TW 096130265A TW 96130265 A TW96130265 A TW 96130265A TW I357653 B TWI357653 B TW I357653B
Authority
TW
Taiwan
Prior art keywords
package structure
circuit layout
dielectric substrate
semiconductor wafer
circuit
Prior art date
Application number
TW096130265A
Other languages
English (en)
Chinese (zh)
Other versions
TW200910573A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW096130265A priority Critical patent/TW200910573A/zh
Publication of TW200910573A publication Critical patent/TW200910573A/zh
Application granted granted Critical
Publication of TWI357653B publication Critical patent/TWI357653B/zh

Links

Classifications

    • H10W90/00—
    • H10W72/884—
    • H10W74/117—
    • H10W74/15—
    • H10W90/724—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Wire Bonding (AREA)
TW096130265A 2007-08-16 2007-08-16 Stacked semiconductor package structure with metal contact through via TW200910573A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW096130265A TW200910573A (en) 2007-08-16 2007-08-16 Stacked semiconductor package structure with metal contact through via

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096130265A TW200910573A (en) 2007-08-16 2007-08-16 Stacked semiconductor package structure with metal contact through via

Publications (2)

Publication Number Publication Date
TW200910573A TW200910573A (en) 2009-03-01
TWI357653B true TWI357653B (enExample) 2012-02-01

Family

ID=44724402

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096130265A TW200910573A (en) 2007-08-16 2007-08-16 Stacked semiconductor package structure with metal contact through via

Country Status (1)

Country Link
TW (1) TW200910573A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI425718B (zh) * 2011-06-21 2014-02-01 財團法人國家實驗研究院國家晶片系統設計中心 連接座結構組及其連接座結構
US8614502B2 (en) * 2011-08-03 2013-12-24 Bridge Semiconductor Corporation Three dimensional semiconductor assembly board with bump/flange supporting board, coreless build-up circuitry and built-in electronic device
KR102595276B1 (ko) * 2016-01-14 2023-10-31 삼성전자주식회사 반도체 패키지

Also Published As

Publication number Publication date
TW200910573A (en) 2009-03-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees