TW293940B - - Google Patents

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Publication number
TW293940B
TW293940B TW084105885A TW84105885A TW293940B TW 293940 B TW293940 B TW 293940B TW 084105885 A TW084105885 A TW 084105885A TW 84105885 A TW84105885 A TW 84105885A TW 293940 B TW293940 B TW 293940B
Authority
TW
Taiwan
Prior art keywords
resin
wire
item
patent application
encapsulated
Prior art date
Application number
TW084105885A
Other languages
English (en)
Chinese (zh)
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Application granted granted Critical
Publication of TW293940B publication Critical patent/TW293940B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW084105885A 1994-07-13 1995-06-09 TW293940B (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP18385494 1994-07-13
JP09812795A JP3509274B2 (ja) 1994-07-13 1995-03-30 樹脂封止型半導体装置およびその製造方法

Publications (1)

Publication Number Publication Date
TW293940B true TW293940B (https=) 1996-12-21

Family

ID=26439327

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084105885A TW293940B (https=) 1994-07-13 1995-06-09

Country Status (7)

Country Link
US (1) US5633529A (https=)
EP (1) EP0693779B1 (https=)
JP (1) JP3509274B2 (https=)
KR (1) KR100386052B1 (https=)
DE (1) DE69526543T2 (https=)
SG (1) SG65533A1 (https=)
TW (1) TW293940B (https=)

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JP3542677B2 (ja) * 1995-02-27 2004-07-14 セイコーエプソン株式会社 樹脂封止型半導体装置およびその製造方法
JP3309686B2 (ja) * 1995-03-17 2002-07-29 セイコーエプソン株式会社 樹脂封止型半導体装置及びその製造方法
JPH0964244A (ja) * 1995-08-17 1997-03-07 Hitachi Ltd 半導体装置およびその製造方法
US5757070A (en) * 1995-10-24 1998-05-26 Altera Corporation Integrated circuit package
EP0848423B1 (en) * 1996-07-03 2006-03-01 Seiko Epson Corporation Resin-encapsulated semiconductor device and method of manufacturing the same
JPH11274196A (ja) * 1998-03-26 1999-10-08 Seiko Epson Corp 半導体装置の製造方法およびモールドシステム並びに半導体装置
US6977214B2 (en) * 1998-12-11 2005-12-20 Micron Technology, Inc. Die paddle clamping method for wire bond enhancement
US6455354B1 (en) 1998-12-30 2002-09-24 Micron Technology, Inc. Method of fabricating tape attachment chip-on-board assemblies
US6212077B1 (en) 1999-01-25 2001-04-03 International Business Machines Corporation Built-in inspection template for a printed circuit
WO2000074131A1 (en) * 1999-05-31 2000-12-07 Infineon Technologies A.G. A method of assembling a semiconductor device package
JP2000349221A (ja) 1999-06-02 2000-12-15 Sharp Corp リードフレームおよびそれを用いた半導体デバイス
MY133357A (en) * 1999-06-30 2007-11-30 Hitachi Ltd A semiconductor device and a method of manufacturing the same
JP2001230360A (ja) * 2000-02-18 2001-08-24 Hitachi Ltd 半導体集積回路装置およびその製造方法
US6688353B1 (en) 2000-03-31 2004-02-10 Bridgestone/Firestone North American Tire, Llc Attachment patch for mounting an electronic monitoring device to the inside of a pneumatic tire
CN1265451C (zh) * 2000-09-06 2006-07-19 三洋电机株式会社 半导体装置及其制造方法
US6838751B2 (en) * 2002-03-06 2005-01-04 Freescale Semiconductor Inc. Multi-row leadframe
US7309447B2 (en) * 2003-02-03 2007-12-18 Tessera, Inc. Method for making a microelectronic package using pre-patterned, reusable mold and method for making the mold
US20050285281A1 (en) * 2004-06-29 2005-12-29 Simmons Asher L Pad-limited integrated circuit
US20070200225A1 (en) * 2006-02-28 2007-08-30 Ruzaini Ibrahim Heat sink for semiconductor package
JP5132070B2 (ja) * 2006-03-31 2013-01-30 オンセミコンダクター・トレーディング・リミテッド 回路装置およびその製造方法
JP2008300492A (ja) * 2007-05-30 2008-12-11 Rohm Co Ltd 半導体装置
US8643172B2 (en) 2007-06-08 2014-02-04 Freescale Semiconductor, Inc. Heat spreader for center gate molding
US20110012257A1 (en) * 2009-07-14 2011-01-20 Freescale Semiconductor, Inc Heat spreader for semiconductor package
JP6111973B2 (ja) * 2013-10-15 2017-04-12 株式会社デンソー 半導体装置

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JPS5812341A (ja) * 1981-07-16 1983-01-24 Toshiba Corp 半導体装置
JPS59207645A (ja) * 1983-05-11 1984-11-24 Toshiba Corp 半導体装置およびリ−ドフレ−ム
EP0164794B1 (en) * 1984-06-14 1990-07-25 Advanced Micro Devices, Inc. Multi-layer heat sinking integrated circuit package
JPS61166051A (ja) * 1985-01-17 1986-07-26 Matsushita Electronics Corp 樹脂封止型半導体装置
JPS6297358A (ja) * 1985-10-23 1987-05-06 Mitsubishi Electric Corp 樹脂封止形半導体集積回路装置
US4684975A (en) * 1985-12-16 1987-08-04 National Semiconductor Corporation Molded semiconductor package having improved heat dissipation
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US5157478A (en) * 1989-04-19 1992-10-20 Mitsubishi Denki Kabushiki Kaisha Tape automated bonding packaged semiconductor device incorporating a heat sink
JPH02307251A (ja) * 1989-05-22 1990-12-20 Nec Corp 樹脂封止型半導体装置
US5278101A (en) * 1989-06-28 1994-01-11 Kabushiki Kaisha Toshiba Semiconductor device and method for manufacturing the same
US5208188A (en) * 1989-10-02 1993-05-04 Advanced Micro Devices, Inc. Process for making a multilayer lead frame assembly for an integrated circuit structure and multilayer integrated circuit die package formed by such process
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JP2517691B2 (ja) * 1990-01-29 1996-07-24 三菱電機株式会社 半導体装置及びその製造方法
JPH0410558A (ja) * 1990-04-27 1992-01-14 Hitachi Ltd 放熱体付き半導体装置
JPH0411758A (ja) * 1990-04-28 1992-01-16 Mitsubishi Electric Corp 半導体装置
JPH0427145A (ja) * 1990-05-22 1992-01-30 Seiko Epson Corp 半導体装置
US5227662A (en) * 1990-05-24 1993-07-13 Nippon Steel Corporation Composite lead frame and semiconductor device using the same
US5202288A (en) * 1990-06-01 1993-04-13 Robert Bosch Gmbh Method of manufacturing an electronic circuit component incorporating a heat sink
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Also Published As

Publication number Publication date
US5633529A (en) 1997-05-27
EP0693779B1 (en) 2002-05-02
JP3509274B2 (ja) 2004-03-22
DE69526543D1 (de) 2002-06-06
JPH0883876A (ja) 1996-03-26
HK1013888A1 (en) 1999-09-10
EP0693779A3 (en) 1997-01-08
KR960005972A (ko) 1996-02-23
KR100386052B1 (ko) 2003-08-09
EP0693779A2 (en) 1996-01-24
DE69526543T2 (de) 2002-10-31
SG65533A1 (en) 1999-06-22

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees
MM4A Annulment or lapse of patent due to non-payment of fees