TWI448226B - 電源轉換模組 - Google Patents

電源轉換模組 Download PDF

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Publication number
TWI448226B
TWI448226B TW099132089A TW99132089A TWI448226B TW I448226 B TWI448226 B TW I448226B TW 099132089 A TW099132089 A TW 099132089A TW 99132089 A TW99132089 A TW 99132089A TW I448226 B TWI448226 B TW I448226B
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Taiwan
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circuit carrier
module
pins
power conversion
conversion module
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TW099132089A
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English (en)
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TW201215261A (en
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Da Jung Chen
Kai Peng Chiang
Yu Chao Fang
Yi Cheng Lin
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Cyntec Co Ltd
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Priority to TW099132089A priority Critical patent/TWI448226B/zh
Priority to US13/180,292 priority patent/US9111954B2/en
Publication of TW201215261A publication Critical patent/TW201215261A/zh
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Publication of TWI448226B publication Critical patent/TWI448226B/zh

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    • H02M3/00—Conversion of dc power input into dc power output
    • H02M3/02—Conversion of dc power input into dc power output without intermediate conversion into ac
    • H02M3/04—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
    • H02M3/10—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M3/145—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
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Description

電源轉換模組
本案係為一種電源轉換模組，尤指一微型電源轉換模組。
在現今的電子裝置中，直流-直流轉換器(DC-DC converter)是常見的電源轉換模組，而為能有效縮小電路板之面積，現今直流-直流轉換器之結構已朝向立體化的方向來設計。
請參見第一圖(a)、(b)，其係一習用直流-直流轉換器之結構示意圖，其主要是以印刷電路板為載板10，載板10上主要承載有完成有積體電路之半導體晶片11及被動元件12(passive components)等元件，另外，載板10的四個角落上還額外製作有四個柱狀(或球狀)構造101，四個柱狀構造101上用來焊接電感器13。由於四個柱狀構造101承載電感器13後，使電感器13及載板10間有一個空間19，前述半導體晶片11及被動元件12即放置於此空間而形成一個立體結構。
上述設計雖然有減少元件面積的優點，但完成四個柱狀構造101卻需要額外的製程才能完成於載板10上，整體的材料成本及製造成本將會增加。而且此一構造也極容易使得載板10上的電子元件會因電感器13的電磁干擾而使其特性及效率不佳。
本案係為一種電源轉換模組，其中包含：一電路載板，其上具有複數個接線墊；一半導體模組，設置於該電路載板之一第一表面上；以及一電感模組，其上完成有向一第一方向延伸之複數根接腳，用以分別與該電路載板上之該等接線墊完成電性連接，並形成一空間來容納該半導體模組。
根據上述構想，本案所述之電源轉換模組，其中該電路載板可為一印刷電路板、一金屬核心印刷電路板、一陶瓷基板或一覆銅陶瓷基板。
根據上述構想，本案所述之電源轉換模組，其中該等接線墊可設置於該第一表面上，用以與該電感模組複數根接腳之直角彎折前端完成焊接。
根據上述構想，本案所述之電源轉換模組，其中該等接線墊可設置於該電路載板之一第二表面上，用以與該電感模組複數根接腳之直角彎折前端完成焊接。
根據上述構想，本案所述之電源轉換模組，其中該電路載板可具有複數個透孔，該等透孔連通於該電路載板之該第一表面與一第二表面間，而該等接線墊設置於該等透孔於該第二表面之開口處，用以與穿過該等透孔之該電感模組複數根接腳完成焊接。
根據上述構想，本案所述之電源轉換模組，其中該等接線墊與該等接腳可以波焊來完成焊接。
根據上述構想，本案所述之電源轉換模組，其中該電感模組緊鄰該空間之一側面上可具有一屏蔽層構造，該屏蔽層構造為一金屬薄片。
根據上述構想，本案所述之電源轉換模組，其中更可包含一屏蔽導熱上蓋，接合至該電路載板與該電感模組，該屏蔽導熱上蓋以導電材質完成，並透過一導熱絕緣膠接著至該電感模組。
根據上述構想，本案所述之電源轉換模組，其中該半導體模組可封膠成型於該電路載板之該第一表面上。
根據上述構想，本案所述之電源轉換模組，其中該半導體模組與該電感模組可封膠成型於該電路載板之該第一表面上。
本案之另一方面係為一種電源轉換模組，其中包含：一電路載板，其上完成有向一第一方向延伸之複數根接腳；一半導體模組，設置於該電路載板之一第一表面上；以及一電感模組，其上完成有複數個接線墊，用以分別與該電路載板上之該等接腳完成電性連接，並形成一空間來容納該半導體模組。
根據上述構想，本案所述之電源轉換模組，其中該電路載板可為一印刷電路板、一金屬核心印刷電路板、一陶瓷基板或一覆銅陶瓷基板。
根據上述構想，本案所述之電源轉換模組，其中該等接腳可為鋸齒狀接腳。
根據上述構想，本案所述之電源轉換模組，其中該等接腳可為梳狀接腳。
根據上述構想，本案所述之電源轉換模組，其中該等接腳上可各具有一孔洞。
根據上述構想，本案所述之電源轉換模組，其中該電感模組緊鄰該空間之一側面上可具有一屏蔽層構造，該屏蔽層構造為一金屬薄片。
根據上述構想，本案所述之電源轉換模組，其中該等接腳與該電感模組側面之該等接線墊係可利用夾合、導電膠材或是雷射來進行接合。
本案係為改善習用技術產生之缺失，進而發展出節省工時、降低電磁干擾的電源轉換模組，本案可適用於電源轉換模組的生產過程，以下將對本案與習知技術之差異處以及細節進行說明。
請參見第二圖，其係本案為改善習用手段缺失所發展出來直流/直流轉換器之第一較佳實施例構造示意圖，其中包含有電路載板20，其上具有複數個接線墊200，另外有包含有半導體模組21與被動元件22，其皆設置於電路載板20之第一表面201上，至於電感模組23上則完成有向第一方向29延伸之複數根接腳231，用以分別與電路載板20上之該等接線墊200完成電性連接，並形成空間28來容納半導體模組21與被動元件22。由於電感模組23所完成有向第一方向29延伸之複數根接腳231，是在製造電感模組23時便一併完成，而接線墊200也是在製造電路載板20時，可與其它元件所需之接線墊一併完成，因此不會有習用手段中需要額外的製程之問題，進而達成改善習用手段之缺失。
而上述半導體模組21可包含有以裸晶(bare die)方式存在之積體電路晶片211與功率電晶體212，並以打線方式(wire bond)與電路載板20完成電性接觸，然後再以封膠成型方式(molding)固定於該電路載板20之該第一表面201上。當然，也可以如第三圖所示之本案第二較佳實施例，積體電路晶片311與功率電晶體312係以各自封裝並設有接腳，而可用表面黏著組裝技術(Surface Mount Technology，簡稱SMT)來將積體電路晶片311與功率電晶體312直接焊接至該電路載板20之該第一表面201上。至於上述之電路載板20係可用印刷電路板(PCB)、金屬核心印刷電路板(Metal Core PCB；MCPCB)、陶瓷基板(Ceramic Substrate)或覆銅陶瓷基板(Direct Bond Cu；DBC)來完成。
再請參見第四圖與第五圖，其主要結構與上述第一較佳實施例與第二較佳實施例大致相同，唯一不同處在於電感模組23緊鄰該空間28之一側面上具有一屏蔽層構造40、50，該屏蔽層構造可用銅、鋁等金屬薄片等具有阻隔電磁波的材料來完成，其目的是阻絕或降低電感模組23對其它電路之電磁干擾。而此屏蔽層構造也可於製造電感模組23時便一併完成，並不會增加組裝的複雜度。
另外，為能加強裝置之散熱能力，本案更可如第六圖與第七圖所示之第五較佳實施例與第六較佳實施例，於裝置上方加設一屏蔽導熱上蓋60、70，其係接合至該電路載板20與該電感模組23，該屏蔽導熱上蓋60、70可以導電材質完成，用以阻絕或降低外界對電感模組23與其它電路之電磁干擾，並透過一導熱絕緣膠61、71接著至該電感模組23，如此便可增強裝置之散熱能力。
至於第八圖與第九圖所示之第七較佳實施例與第八較佳實施例構造示意圖，則表示出直接用封膠80、90來將電感模組23、半導體模組21與被動元件22一起以封膠成型方式來固定於該電路載板20之該第一表面201上。
但是，利用該電感模組23上複數根接腳之直角彎折前端來與第一表面201上之接線墊200完成焊接時容易產生高溫，因此當固定於該電路載板20第一表面上之電感模組23、半導體模組21與被動元件22中任一元件有不耐高溫的特性時，上述焊接方式將會對電路元件造成破壞。因此，如第十圖與第十一圖所示之第九較佳實施例與第十較佳實施例便被發展出來，其中，電路載板20上具有複數個透孔209，該等透孔209連通於電路載板20之第一表面201與第二表面202間，而複數個接線墊1001設置於該等透孔209於第二表面202之開口處，用以與穿過該等透孔之該電感模組23之複數根接腳231完成焊接。而該等接線墊1001與該等接腳231則可用波焊(wave soldering)來完成焊接，而由於高溫的焊接動作移到第二表面來進行，如此可減少第一表面上之電路元件因高熱所產生之破壞。
當然，若是省去透孔209之製造，則可改用第十二圖與第十三圖所示之第十一較佳實施例與第十二較佳實施例，其中接線墊1202還是設置於該電路載板20之第二表面202上，用以與從電路載板20側面通過之複數根接腳231之直角彎折前端完成焊接，一樣可以減低高溫對第一表面上之電路元件之破壞。
另外，上述第十圖至第十三圖之實施例構造可改為純粹用以增加機械連結強度之用，也就是電路載板20並不需要接線墊與電感模組23達成電性連接，而純粹透過焊接來進行結構固定，而穿過透孔或是從電路載板20側面通過之該等接腳231則可直接與應用端之電路(本圖未示出)進行電性連結，此設計將不需額外於電路載板20上設計電路，並且還可新增一散熱途徑。
再請參見第十四圖(a)、(b)，其係本案為改善習用手段缺失所發展出來直流/直流轉換器之第十三較佳實施例構造示意圖，其與上述較佳實施例之不同處在於電感模組143不具有長接腳，而是具有露出封裝體外之接線墊1431，而電路載板140上則是完成有向箭頭方向延伸之複數根接腳1400，而半導體模組141設置於該電路載板140之第一表面1408上，當電感模組143置放於該電路載板140上時，如第十四圖(b)之所示，稍微將電路載板140上之該等接腳1400向內施壓便可完成夾合。或是再利用導電膠材接合或是雷射接合，便可完成兩者之電性連接，並於其中形成一空間1409來容納該半導體模組141。當然，為能有效降低電磁干擾，電感模組143緊鄰該空間1409之側面上還可具有屏蔽層構造1439，該屏蔽層構造1439可用金屬薄片來完成。
而為能加強接合之強度，本案對於接腳1400之形狀亦提出多種實施例，其分別如第十五圖(a)、(b)、(c)及(d)之所示，其中該接腳1400之斷面可為如第十五圖(a)所示之平面，或如第十五圖(b)所示之鋸齒狀接腳1401，第十五圖(c)所示之梳狀接腳1402，或是如第十五圖(d)所示之具孔洞14030之接腳1403。
由上述實施例可以看出，本案所述之直流/直流轉換器構造可以改善習用手段之許多缺失，而本案之技術手段也可應用至其他類似的電源轉換模組之組裝上，如此可省去習用手段中額外的製程，又可有效降低電磁干擾及可能的熱損壞，進而改善習用技術的缺失，達到本案所欲發展之目的。
本案圖式中所包含之各元件列示如下：
10．．．載板
11．．．半導體晶片
12．．．被動元件
101．．．柱狀構造
13．．．電感器
19．．．空間
20．．．電路載板
200．．．接線墊
21．．．半導體模組
22．．．被動元件
201．．．第一表面
23．．．電感模組
29．．．第一方向
231．．．接腳
28．．．空間
211．．．積體電路晶片
212．．．功率電晶體
311．．．積體電路晶片
312．．．功率電晶體
40、50．．．屏蔽層構造
60、70．．．屏蔽導熱上蓋
61、71．．．導熱絕緣膠
80、90．．．封膠
209．．．透孔
202．．．第二表面
1202．．．接線墊
1001．．．接線墊
143．．．電感模組
1431．．．接線墊
1400．．．接腳
141．．．半導體模組
140．．．電路載板
1408．．．第一表面
1409．．．空間
1439．．．屏蔽層構造
1401．．．鋸齒狀接腳
1402．．．梳狀接腳
14030．．．孔洞
1403．．．接腳
本案得藉由下列圖式及說明，俾得一更深入之了解：
第一圖(a)、(b)，其係一習用直流-直流轉換器之結構示意圖。
第二圖，其係本案所發展出來直流/直流轉換器之第一較佳實施例構造示意圖。
第三圖，其係本案所發展出來直流/直流轉換器之第二較佳實施例構造示意圖。
第四圖，其係本案所發展出來直流/直流轉換器之第三較佳實施例構造示意圖。
第五圖，其係本案所發展出來直流/直流轉換器之第四較佳實施例構造示意圖。
第六圖，其係本案所發展出來直流/直流轉換器之第五較佳實施例構造示意圖。
第七圖，其係本案所發展出來直流/直流轉換器之第六較佳實施例構造示意圖。
第八圖，其係本案所發展出來直流/直流轉換器之第七較佳實施例構造示意圖。
第九圖，其係本案所發展出來直流/直流轉換器之第八較佳實施例構造示意圖。
第十圖，其係本案所發展出來直流/直流轉換器之第九較佳實施例構造示意圖。
第十一圖，其係本案所發展出來直流/直流轉換器之第十較佳實施例構造示意圖。
第十二圖，其係本案所發展出來直流/直流轉換器之第十一較佳實施例構造示意圖。
第十三圖，其係本案所發展出來直流/直流轉換器之第十二較佳實施例構造示意圖。
第十四圖(a)、(b)，其係本案所發展出來直流/直流轉換器之第十三較佳實施例構造示意圖。
第十五圖(a)、(b)、(c)及(d)，其係本案對於接腳之形狀所提出之多種實施例構造示意圖。
20．．．電路載板
200．．．接線墊
21．．．半導體模組
22．．．被動元件
201．．．第一表面
23．．．電感模組
29．．．第一方向
231．．．接腳
28．．．空間
211．．．積體電路晶片
212．．．功率電晶體

Claims (17)

  1. 一種電源轉換模組，其中包含：一電路載板，具有複數個接線墊；一半導體模組，設置於該電路載板之一第一表面上；以及一電感模組，具有由其一第一表面向所述電路載板延伸之複數根接腳，其中，所述複數根接脚一一對應地與所述複數個接線墊电性連接，以及所述複數根接脚、電感模組的第一表面與電路載板的第一表面形成一空間來容納該半導體模組。
  2. 如申請專利範圍第1項所述之電源轉換模組，其中該電路載板係為一印刷電路板、一陶瓷基板或一覆銅陶瓷基板。
  3. 如申請專利範圍第1項所述之電源轉換模組，其中該等接線墊設置於該電路載板之第一表面上，用以與該電感模組複數根接腳之直角彎折前端完成焊接。
  4. 如申請專利範圍第1項所述之電源轉換模組，其中該電感模組緊鄰該空間之一側面上具有一屏蔽層構造，該屏蔽層構造為一金屬薄片。
  5. 如申請專利範圍第1項所述之電源轉換模組，其中更包含一屏蔽導熱上蓋，接合至該電路載板與該電感模組，該屏蔽導熱上蓋以導電材質完成，並透過一導熱絕緣膠接著至該電感模組。
  6. 如申請專利範圍第1項所述之電源轉換模組，其中該半導體模組係封膠成型於該電路載板之該第一表面上。
  7. 如申請專利範圍第1項所述之電源轉換模組，其中該半導體模組與該電感模組係封膠成型於該電路載板之該第一表面上。
  8. 一種電源轉換模組，其中包含：一電路載板，具有複數個透孔，該等透孔連通於該電路載板之一第一表面與一第二表面間；一半導體模組，設置於該電路載板之該第一表面上；以及一電感模組，具有由其一第一表面向所述電路載板延伸之複數根接腳，該複數根接腳穿過該電路載板上之該等透孔來完成組裝，其中所述複數根接脚、電感模組的第一表面與電路載板的第一表面形成一空間來容納該半導體模組。
  9. 一種電源轉換模組，其中包含：一電路載板，其具有一第一表面與一第二表面；一半導體模組，設置於該電路載板之該第一表面上；以及一電感模組，具有由其一第一表面向所述電路載板延伸之複數根接腳，該等接腳皆具有直角彎折前端，用以繞過該電路載板而焊接至該電路載板之第二表面，其中所述複數根接脚、電感模組之第一表面與電路載板之第一表面形成一空間來容納該半導體模組。
  10. 如申請專利範圍第9項所述之電源轉換模組，其中該等接腳係以波焊來焊接至該電路載板之第二表面。
  11. 一種電源轉換模組，其中包含：一電路載板，完成有向一第一方向延伸之複數根接腳；一半導體模組，設置於該電路載板之一第一表面上；以及一電感模組，具有複數個接線墊，用以與該電路載板上之該等接腳完成電性連接，並形成一空間來容納該半導體模組。
  12. 如申請專利範圍第11項所述之電源轉換模組，其中該電路載板係 為一印刷電路板、一金屬核心印刷電路板、一陶瓷基板或一覆銅陶瓷基板。
  13. 如申請專利範圍第11項所述之電源轉換模組，其中該等接腳為鋸齒狀接腳。
  14. 如申請專利範圍第11項所述之電源轉換模組，其中該等接腳為梳狀接腳。
  15. 如申請專利範圍第11項所述之電源轉換模組，其中該等接腳上各具有一孔洞。
  16. 如申請專利範圍第11項所述之電源轉換模組，其中該電感模組緊鄰該空間之一側面上具有一屏蔽層構造，該屏蔽層構造為一金屬薄片。
  17. 如申請專利範圍第11項所述之電源轉換模組，其中該等接腳與該電感模組側面之該等接線墊係利用夾合、導電膠材或是雷射來進行接合。
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