KR100386052B1 - 수지봉지형반도체장치및그제조방법 - Google Patents

수지봉지형반도체장치및그제조방법 Download PDF

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Publication number
KR100386052B1
KR100386052B1 KR1019950020417A KR19950020417A KR100386052B1 KR 100386052 B1 KR100386052 B1 KR 100386052B1 KR 1019950020417 A KR1019950020417 A KR 1019950020417A KR 19950020417 A KR19950020417 A KR 19950020417A KR 100386052 B1 KR100386052 B1 KR 100386052B1
Authority
KR
South Korea
Prior art keywords
element mounting
lead
resin
semiconductor device
conductive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019950020417A
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English (en)
Korean (ko)
Other versions
KR960005972A (ko
Inventor
오오쯔끼데쯔야
Original Assignee
세이코 엡슨 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세이코 엡슨 가부시키가이샤 filed Critical 세이코 엡슨 가부시키가이샤
Publication of KR960005972A publication Critical patent/KR960005972A/ko
Application granted granted Critical
Publication of KR100386052B1 publication Critical patent/KR100386052B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1019950020417A 1994-07-13 1995-07-12 수지봉지형반도체장치및그제조방법 Expired - Fee Related KR100386052B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP18385494 1994-07-13
JP94-183854 1994-07-13
JP95-98127 1995-03-30
JP09812795A JP3509274B2 (ja) 1994-07-13 1995-03-30 樹脂封止型半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
KR960005972A KR960005972A (ko) 1996-02-23
KR100386052B1 true KR100386052B1 (ko) 2003-08-09

Family

ID=26439327

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950020417A Expired - Fee Related KR100386052B1 (ko) 1994-07-13 1995-07-12 수지봉지형반도체장치및그제조방법

Country Status (7)

Country Link
US (1) US5633529A (https=)
EP (1) EP0693779B1 (https=)
JP (1) JP3509274B2 (https=)
KR (1) KR100386052B1 (https=)
DE (1) DE69526543T2 (https=)
SG (1) SG65533A1 (https=)
TW (1) TW293940B (https=)

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JP3309686B2 (ja) * 1995-03-17 2002-07-29 セイコーエプソン株式会社 樹脂封止型半導体装置及びその製造方法
JPH0964244A (ja) * 1995-08-17 1997-03-07 Hitachi Ltd 半導体装置およびその製造方法
US5757070A (en) * 1995-10-24 1998-05-26 Altera Corporation Integrated circuit package
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JPH11274196A (ja) * 1998-03-26 1999-10-08 Seiko Epson Corp 半導体装置の製造方法およびモールドシステム並びに半導体装置
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US6455354B1 (en) 1998-12-30 2002-09-24 Micron Technology, Inc. Method of fabricating tape attachment chip-on-board assemblies
US6212077B1 (en) 1999-01-25 2001-04-03 International Business Machines Corporation Built-in inspection template for a printed circuit
WO2000074131A1 (en) * 1999-05-31 2000-12-07 Infineon Technologies A.G. A method of assembling a semiconductor device package
JP2000349221A (ja) 1999-06-02 2000-12-15 Sharp Corp リードフレームおよびそれを用いた半導体デバイス
MY133357A (en) * 1999-06-30 2007-11-30 Hitachi Ltd A semiconductor device and a method of manufacturing the same
JP2001230360A (ja) * 2000-02-18 2001-08-24 Hitachi Ltd 半導体集積回路装置およびその製造方法
US6688353B1 (en) 2000-03-31 2004-02-10 Bridgestone/Firestone North American Tire, Llc Attachment patch for mounting an electronic monitoring device to the inside of a pneumatic tire
CN1265451C (zh) * 2000-09-06 2006-07-19 三洋电机株式会社 半导体装置及其制造方法
US6838751B2 (en) * 2002-03-06 2005-01-04 Freescale Semiconductor Inc. Multi-row leadframe
US7309447B2 (en) * 2003-02-03 2007-12-18 Tessera, Inc. Method for making a microelectronic package using pre-patterned, reusable mold and method for making the mold
US20050285281A1 (en) * 2004-06-29 2005-12-29 Simmons Asher L Pad-limited integrated circuit
US20070200225A1 (en) * 2006-02-28 2007-08-30 Ruzaini Ibrahim Heat sink for semiconductor package
JP5132070B2 (ja) * 2006-03-31 2013-01-30 オンセミコンダクター・トレーディング・リミテッド 回路装置およびその製造方法
JP2008300492A (ja) * 2007-05-30 2008-12-11 Rohm Co Ltd 半導体装置
US8643172B2 (en) 2007-06-08 2014-02-04 Freescale Semiconductor, Inc. Heat spreader for center gate molding
US20110012257A1 (en) * 2009-07-14 2011-01-20 Freescale Semiconductor, Inc Heat spreader for semiconductor package
JP6111973B2 (ja) * 2013-10-15 2017-04-12 株式会社デンソー 半導体装置

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Also Published As

Publication number Publication date
US5633529A (en) 1997-05-27
EP0693779B1 (en) 2002-05-02
JP3509274B2 (ja) 2004-03-22
TW293940B (https=) 1996-12-21
DE69526543D1 (de) 2002-06-06
JPH0883876A (ja) 1996-03-26
HK1013888A1 (en) 1999-09-10
EP0693779A3 (en) 1997-01-08
KR960005972A (ko) 1996-02-23
EP0693779A2 (en) 1996-01-24
DE69526543T2 (de) 2002-10-31
SG65533A1 (en) 1999-06-22

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