SG157957A1 - Package for integrated circuit die - Google Patents

Package for integrated circuit die

Info

Publication number
SG157957A1
SG157957A1 SG200604978-7A SG2006049787A SG157957A1 SG 157957 A1 SG157957 A1 SG 157957A1 SG 2006049787 A SG2006049787 A SG 2006049787A SG 157957 A1 SG157957 A1 SG 157957A1
Authority
SG
Singapore
Prior art keywords
frame
flange
leads
integrated circuit
cte
Prior art date
Application number
SG200604978-7A
Other languages
English (en)
Inventor
Michael Zimmerman
Original Assignee
Interplex Qlp Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Interplex Qlp Inc filed Critical Interplex Qlp Inc
Publication of SG157957A1 publication Critical patent/SG157957A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4817—Conductive parts for containers, e.g. caps
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    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
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    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
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    • Y10T428/00—Stock material or miscellaneous articles
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    • Y10T428/24132—Structurally defined web or sheet [e.g., overall dimension, etc.] including grain, strips, or filamentary elements in different layers or components parallel

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
SG200604978-7A 2003-01-29 2004-01-28 Package for integrated circuit die SG157957A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US44347003P 2003-01-29 2003-01-29

Publications (1)

Publication Number Publication Date
SG157957A1 true SG157957A1 (en) 2010-01-29

Family

ID=32825334

Family Applications (4)

Application Number Title Priority Date Filing Date
SG200604978-7A SG157957A1 (en) 2003-01-29 2004-01-28 Package for integrated circuit die
SG200604976-1A SG158738A1 (en) 2003-01-29 2004-01-29 Package for integrated circuit die
SG200604977-9A SG157956A1 (en) 2003-01-29 2004-01-29 Package for integrated circuit die
SG200604979A SG160192A1 (en) 2003-01-29 2004-01-29 Package for integrated circuit die

Family Applications After (3)

Application Number Title Priority Date Filing Date
SG200604976-1A SG158738A1 (en) 2003-01-29 2004-01-29 Package for integrated circuit die
SG200604977-9A SG157956A1 (en) 2003-01-29 2004-01-29 Package for integrated circuit die
SG200604979A SG160192A1 (en) 2003-01-29 2004-01-29 Package for integrated circuit die

Country Status (8)

Country Link
US (6) US6867367B2 (zh)
EP (1) EP1627419A4 (zh)
JP (3) JP4780718B2 (zh)
KR (1) KR101025079B1 (zh)
CN (4) CN101447439A (zh)
CA (1) CA2514515C (zh)
SG (4) SG157957A1 (zh)
WO (1) WO2004068558A2 (zh)

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US7298046B2 (en) * 2003-01-10 2007-11-20 Kyocera America, Inc. Semiconductor package having non-ceramic based window frame
SG157957A1 (en) * 2003-01-29 2010-01-29 Interplex Qlp Inc Package for integrated circuit die
US20070164424A1 (en) * 2003-04-02 2007-07-19 Nancy Dean Thermal interconnect and interface systems, methods of production and uses thereof
KR20060025155A (ko) * 2003-06-06 2006-03-20 허니웰 인터내셔날 인코포레이티드 열적 상호접속 시스템, 그 제조 방법 및 사용법
JP2005129735A (ja) * 2003-10-23 2005-05-19 Fujitsu Media Device Kk 電子部品
US7259460B1 (en) * 2004-06-18 2007-08-21 National Semiconductor Corporation Wire bonding on thinned portions of a lead-frame configured for use in a micro-array integrated circuit package
US20060145317A1 (en) * 2004-12-31 2006-07-06 Brennan John M Leadframe designs for plastic cavity transistor packages
DE102005006281B4 (de) * 2005-02-10 2014-07-17 Infineon Technologies Ag Hochfrequenzleistungsbauteil mit Goldbeschichtungen und Verfahren zur Herstellung desselben
WO2007050101A2 (en) * 2005-03-02 2007-05-03 Georgia Tech Research Corporation Packaging systems incorporating thin film liquid crystal polymer (lcp) and methods of manufacture
US7280181B2 (en) * 2005-06-30 2007-10-09 Intel Corporation Liquid crystal polymer optical filter carrier
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