DE29921937U1 - Leistungshalbleitermodul - Google Patents

Leistungshalbleitermodul

Info

Publication number
DE29921937U1
DE29921937U1 DE29921937U DE29921937U DE29921937U1 DE 29921937 U1 DE29921937 U1 DE 29921937U1 DE 29921937 U DE29921937 U DE 29921937U DE 29921937 U DE29921937 U DE 29921937U DE 29921937 U1 DE29921937 U1 DE 29921937U1
Authority
DE
Germany
Prior art keywords
power semiconductor
semiconductor module
wall section
module according
plastic frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE29921937U
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Danfoss Silicon Power GmbH
Original Assignee
Danfoss Silicon Power GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Danfoss Silicon Power GmbH filed Critical Danfoss Silicon Power GmbH
Priority to DE29921937U priority Critical patent/DE29921937U1/de
Publication of DE29921937U1 publication Critical patent/DE29921937U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85399—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Description

Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt

Claims (4)

1. Leistungshalbleitermodul mit einem Kunststoffrahmen (1), der ein den Boden des Moduls bildendes, elektroni­ sche Bauelemente (3a, 3b) tragendes Trägersubstrat (2) aufnimmt und wobei durch wenigstens eine von dessen Seitenstreben metallische Anschlußelemente (4) geführt sind, dadurch gekennzeichnet, daß die Anschlußelemente (4) sich in der Ebene des Kunst­ stoffrahmens durch diesen hindurch erstrecken, und daß ein Deckel (8) vorgesehen ist, der mit wenigstens einem umlaufenden, auf den längsseitigen Streben und den Querstreben des Kunststoffrahmens verschließend auflie­ genden Wandungsabschnitt (10) versehen ist.
2. Leistungshalbleitermodul nach Anspruch 1, dadurch gekennzeichnet, daß der Deckel (8) mit einer Einfüll­ ausnehmung (11) versehen ist.
3. Leistungshalbleitermodul nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß ein umlaufender Wandab­ schnitt (10) des Deckel (8) in Richtung auf den Rahmen herabhängt.
4. Leistungshalbleitermodul nach einem der vorangehen­ den Ansprüche, dadurch gekennzeichnet, daß der oder die Wandungsabschnitt(e) (10) mit einer senkrechten Er­ streckung versehen sind, die höher als die maximale Erhebung der Bonddrähte (7) ist.
DE29921937U 1999-12-15 1999-12-15 Leistungshalbleitermodul Expired - Lifetime DE29921937U1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE29921937U DE29921937U1 (de) 1999-12-15 1999-12-15 Leistungshalbleitermodul

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE29921937U DE29921937U1 (de) 1999-12-15 1999-12-15 Leistungshalbleitermodul

Publications (1)

Publication Number Publication Date
DE29921937U1 true DE29921937U1 (de) 2000-03-09

Family

ID=8082932

Family Applications (1)

Application Number Title Priority Date Filing Date
DE29921937U Expired - Lifetime DE29921937U1 (de) 1999-12-15 1999-12-15 Leistungshalbleitermodul

Country Status (1)

Country Link
DE (1) DE29921937U1 (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1291917A2 (de) * 2001-09-10 2003-03-12 Delphi Technologies, Inc. Elektrische Schaltungseinheit, insbesondere Leistungsmodul, und Verfahren zu deren Herstellung
US6885097B2 (en) 2000-04-25 2005-04-26 Kabushiki Kaisha Toyota Jidoshokki Semiconductor device
EP1627419A2 (de) * 2003-01-29 2006-02-22 Quantum Leap Packaging, Inc. Kapselung für einen integrierten schaltungschip

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6885097B2 (en) 2000-04-25 2005-04-26 Kabushiki Kaisha Toyota Jidoshokki Semiconductor device
DE10191585B4 (de) * 2000-04-25 2009-02-26 Kabushiki Kaisha Toyota Jidoshokki, Kariya Halbleitervorrichtung
DE10191585B8 (de) * 2000-04-25 2009-07-02 Kabushiki Kaisha Toyota Jidoshokki, Kariya Halbleitervorrichtung
EP1291917A2 (de) * 2001-09-10 2003-03-12 Delphi Technologies, Inc. Elektrische Schaltungseinheit, insbesondere Leistungsmodul, und Verfahren zu deren Herstellung
EP1291917A3 (de) * 2001-09-10 2005-10-19 Delphi Technologies, Inc. Elektrische Schaltungseinheit, insbesondere Leistungsmodul, und Verfahren zu deren Herstellung
EP1627419A2 (de) * 2003-01-29 2006-02-22 Quantum Leap Packaging, Inc. Kapselung für einen integrierten schaltungschip
EP1627419A4 (de) * 2003-01-29 2011-02-23 Interplex Qlp Inc Kapselung für einen integrierten schaltungschip
US8728606B2 (en) 2003-01-29 2014-05-20 Iqlp, Llc Thermoplastic material

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 20000413

R150 Utility model maintained after payment of first maintenance fee after three years

Effective date: 20021217

R151 Utility model maintained after payment of second maintenance fee after six years

Effective date: 20060117

R152 Utility model maintained after payment of third maintenance fee after eight years

Effective date: 20071030

R071 Expiry of right