CN101434737B - 用于集成电路管芯的封装 - Google Patents

用于集成电路管芯的封装 Download PDF

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CN101434737B
CN101434737B CN2008101886298A CN200810188629A CN101434737B CN 101434737 B CN101434737 B CN 101434737B CN 2008101886298 A CN2008101886298 A CN 2008101886298A CN 200810188629 A CN200810188629 A CN 200810188629A CN 101434737 B CN101434737 B CN 101434737B
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flange
framework
frame
lead
wire
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CN101434737A (zh
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迈克尔·齐默尔曼
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IQLP LLC
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Interplex QLP Inc
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Abstract

一种用于容纳半导体或其它集成电路器件(“管芯”)的电路封装，包括高铜凸缘、一个或多个高铜引线以及模塑到凸缘和引线的液晶聚合物框架。凸缘包括楔形榫形沟槽或其它框架保持部件，该保持部件与模塑的框架机械互锁。在模塑期间，框架的一部分形成冻结在框架保持部分中或其周围的键。引线包括一个或多个引线保持部件以与框架机械互锁。在模塑期间，框架的一部分冻结在这些引线保持部件中或其相邻处。框架包括阻止湿气渗透并使其热膨胀系数(CTE)与引线和凸缘的热膨胀系数相匹配的化合物。将框架设计为能承受管芯附着温度。在将管芯附着到凸缘之后，将盖子超声焊接到框架。

Description

用于集成电路管芯的封装
本申请为分案申请，其原申请是2005年9月27日进入中国国家阶段、国际申请日为2004年1月29日的国际专利申请PCT/US2004/002464，该原申请的中国国家申请号是200480008359.8，发明名称为“用于集成电路管芯的封装”。
相关申请的交叉参考
该申请要求2003年1月29日申请的U.S临时申请No.60/443,470的优先权，将其内容并入这里以作参考。
关于联邦资助研究和开发的声明不适用
发明背景
该申请涉及用于集成电路的电路封装，更具体地讲，涉及包括金属凸缘和高温热塑性框架的电路封装。
半导体和其他集成电路器件(有时称之为“芯片”或“管芯”)通常被安装在电路封装的内部以保护管芯并有助于管芯与印刷电路板、热沉等的电、机械以及热连接。一般的电路封装包括基部(一般称之为“金属小块”或“凸缘(flange)”)、保护性绝缘外壳和穿过外壳延伸的引线。在外壳内侧，引线被直接或更为一般地通过布线电键合到管芯上的接触部分(contact)。
保护性外壳由诸如塑料或陶瓷的电介质材料制成并且附着到凸缘上以密封管芯和布线并保护它们不受水蒸气和其它大气气体的侵扰。尽管一些外壳被模塑成一体组件，但是大部分保护性外壳包括两部分，即一组侧壁(一个“框架”)和一个盖子。框架和管芯附着到凸缘的顺序根据框架的材料而变化，更具体地讲，根据材料在不变形或不以其它方式损伤的情况下能够承受的最高温度来变化。
用于高功率管芯的电路封装一般包括通常通过共熔焊接(eutectic soldering)将管芯附着到其上的金属凸缘。凸缘一般设置安装部件，例如螺丝孔或狭槽，通过安装部件可以将电路封装安装到例如热沉上。在使用中，凸缘从管芯向热沉导热。
用于将管芯附着到凸缘的高温可以损坏塑料或使塑料变形，然而陶瓷材料能够承受该高温。因此，采用陶瓷框架的电路封装可以在附着管芯之前进行组装。然后例如通过环氧树脂将盖子附着到框架上。
为了与陶瓷框架的热膨胀系数相匹配，用于这些框架的凸缘一般由铜钨合金通过粉末冶金学渗透工艺制成。该工艺非常昂贵，并且最后所得到的合金的导热率受到限制。通过使用通过在叠层工艺之后的渗透工艺制造的铜-钼-铜叠层凸缘可以获得提高的导热率，然而这些工艺非常昂贵。
或者，可以在附着框架和盖子之前将管芯附着到凸缘上。该方法使得低温塑料能够用于框架，然而，用于将框架粘接到凸缘和盖子上的粘合剂表现得并不令人满意。这些粘合剂通常产生有缺陷的密封或允许在使用电路封装期间出现缝隙。此外，电路封装的用户不喜欢在将管芯附着到凸缘之后清点凸缘、框架和盖子并组装这些组件。
发明内容
本发明提供一种件数(piece-count)少、成本低的电路封装，该电路封装可以承受高管芯附着温度并且可以在不使用粘合剂的情况下为管芯提供密封的气腔。该电路封装设计采用大量机械部件和成分以获得该密封性和耐热性。该组合还提供了一种与常规电路封装相比展现出更好的导电性和导热性以及机械完整性的电路封装。
该电路封装包括两部分：凸缘/框架/引线组合以及盖子。引线延伸穿过敞口框架的侧壁。凸缘包括由框架包围的管芯附着区。沿着凸缘与框架之间的边界以及引线与框架之间的边界在框架内侧施加封条(seal)。制定用于框架(热塑性，优选液晶聚合物)和封条(优选环氧树脂)的材料使其承受管芯粘接温度。一旦将管芯附着到凸缘并且将管芯电键合到引线，则将盖子焊接到框架以密封管芯周围的气腔。
电路封装的凸缘、框架和引线包括一个或多个不使用粘合剂而保持电路封装的机械完整性的结构部件。这些部件在它们各自的连接处将凸缘和引线机械地锁定到框架上。
在一个实施例中，凸缘限定包围管芯附着区的框架保持部件。例如，该保持部件可以是包括楔形榫或其它底切横截面形状的沟槽或脊。例如通过注模法将热塑性框架模塑到凸缘上。在模塑期间，框架的一部分形成冻结在保持部件内或周围的键(key)，从而将框架机械地固定到凸缘上。
在另一实施例中，每一引线包括一个或多个引线保持部件以将引线固定到框架上。在模塑操作期间，还将框架模塑在引线周围，该引线从框架外部、穿过框架侧壁延伸到气腔区域中。
一个引线保持部件限定至少一个贯穿引线的孔。在模塑期间，一些框架热塑性流经该孔，然后冻结在该孔内，从而将引线锁定在框架内。
另一引线保持部件在位于气腔区内的引线端部上或在该端部附近设置钩边、脊或其它结构。该结构不与引线共面。在模塑期间，一些框架热塑性靠着该结构面朝外的部分冻结，由此产生防止引线从框架中拉出的机械挡板。
凸缘、框架和引线的成分提供匹配的热膨胀系数(CTE)，由此减小这些部件之间的各连接处的应力。这些成分还通过凸缘提供良好的导热性并通过引线和凸缘提供良好的导电性。在一个实施例中，将凸缘制造成具有高的铜含量，而添加有少量的锆、银或其它材料。在另一实施例中，将引线制造成具有高的铜含量，而添加有少量的铁、磷、锌和/或其它材料。在又一实施例中，框架中的石墨薄片形成湿气阻挡层。这些石墨薄片和其它粘合剂使框架的CTE与凸缘的CTE相匹配。可以在框架和/或盖子的外部或内部涂敷任意的膜以进一步减小渗透到气腔中的湿气。
附图的简要描述
通过下面参考附图而对本发明实施例进行的详细说明，本发明的这些和其它特征、优点、方案和实施例对于本领域技术人员而言将变得显而易见，其中：
图1是根据本发明一个实施例的没有盖子的电路封装的透视图；
图2是图1的电路封装具有粘接到其上的盖子时的透视图；
图3是诸如用于制造图1的电路封装的引线框架条的顶视图；
图4A是在已经将框架和凸缘模塑到其上之后的图3的引线框架条的顶视图；
图4B是图4A中示出的一条中的一个引线框架的透视图；
图5A是图1的电路封装的一部分的剖面图；
图5B是图1的电路封装的选择实施例的一部分的剖面图；
图6A-C是示出其制造的三个阶段的图1的电路封装的凸缘的横截面图；
图7A-D是粘接到图1的电路封装的凸缘的管芯的示意图；
图8A是图1的电路封装的引线的详细透视图；
图8B是图1的电路封装的几个选择实施例的横截面图；
图9是图1的电路封装的一部分框架的示意性横截面图；
图10是示出封条的图1的电路封装的一部分的放大图；
图11A和11B是示出图10的封条的两个实施例的图1的电路封装的横截面图；
图12是示出适合用作图10、11A和11B的封条的材料的一个实施例的粘度与剪切速率之间的关系的曲线图；
图13A是用于图1的电路封装的盖子的透视图；
图13B是根据一个实施例的图13A的盖子的一部分的横截面图；以及
图14是制造图1的电路封装的工艺流程图。
本发明的详细说明
本发明提供一种件数少的电路封装，其可以承受高管芯附着温度并且可以在不使用粘合剂的情况下为管芯提供密封的气腔。图1示出根据本发明一个实施例的示例性的电路封装100。为了清晰，示出没有盖子的电路封装100。电路封装100包括：凸缘102、框架104以及两条引线106和108。框架104将引线106和108与凸缘102彼此电绝缘。例如通过低熔点焊料114，将管芯110附着到管芯附着区112。虽然通常可以将两个或多个管芯附着到管芯附着区112中，但是为了清晰，图1仅示出一个管芯。
低熔点焊料114将管芯110电键合到凸缘102。低熔点焊料114还从管芯110向凸缘102导热。在使用中，一般通过穿过狭槽116和118延伸的螺栓(未示出)将凸缘102安装到热沉(未示出)。例如通过布线120和122将管芯110电键合到引线106和108。优选将这些布线120和122超声键合到引线106和108。虽然示出一个管芯和两条引线106和108，但是可以使用更多的管芯和/或引线。图2示出在将盖子200附着到其上之后的电路封装100，如下面更为详细地说明。
电路封装体100采用大量的机械部件和成分以将管芯密封在气腔内并承受高温。如先前所述，该结合还能够使电路封装100展现出提高的导电性和导热性以及机械完整性。下面的说明首先综述电路封装100的制造工艺。然后是凸缘102及其制造的详细说明。随后是引线106和108、用于框架104的液晶聚合物的成分、施加在框架104内侧的封条、盖子200以及电路封装100的制造工艺的详细说明。
制造综述
与常规电路封装相似，将根据本发明的电路封装100优选制造成条状或制造在卷轴上。图3示出诸如引线框架302和304的引线框架条300。每一引线框架包括两个引线，例如在306和308处示出的那些。在一个实施例中，当引线框架条300被冲压或蚀刻时，产生贯穿引线306和308的孔。这些孔的例子在310处示出。这些孔310用于将框架锁定到引线306和308，如下所述。
在制作引线框架条300之后，优选通过注模法将框架模塑到引线框架条的每一个引线框架。图4A示出在已经将诸如框架400的框架模塑到引线框架之后的引线框架条300A。图4B示出一个完整的引线框架404。可以将引线框架单独地或以带状或卷状的形式提供给随后的制造者，该制造者将管芯附着到所述引线框架上。
凸缘
凸缘102形成基部，将本电路封装的其它部件附着到其上。另外，凸缘102一般从管芯向热沉导热并将管芯的一个端子电键合到电路板。凸缘102优选由高铜合金(至少大约50％的铜)制成，以提供高导电性和导热性并承受在管芯附着温度下的退火。合金优选包括至少一种痕量金属。虽然其它的高铜比率是可以接受的，但是凸缘102优选包括至少大约98％的铜和大约0.05％与大约1.5％之间的锆。凸缘102更为优选地包括大约99.9％的铜和大约0.1％的锆。凸缘102优选电镀有大约100微英寸的镍以形成扩散阻挡层以及大约65微英寸的金以有助于将管芯110焊接到凸缘。
或者，凸缘102包括至少大约99.5％的铜和大约0.085％的银，尽管其它高铜比率也是可以接受的。锆优于银，因为使用锆制造的合金比使用银制造的合金含有更高的铜含量且因此提供更好的导热性和导电性。铜锆合金为凸缘提供的导热性优于现有技术的铜钨和铜-钼-铜凸缘的导热性，这使得采用这种凸缘或附着到这种凸缘的管芯的电路封装能够比现有技术的封装消耗更多的功率。另外，铜锆合金具有高于大部分高铜合金的退火温度，并且经受更小的由于加热到管芯附着温度而引起的翘曲。
如先前所述，优选通过注模法将框架104模塑到凸缘102。作为该模塑的结果，将框架附着到凸缘102上，尽管该附着一般有缺陷并且由于焊接和管芯操作的加热而断裂。为了克服该问题，凸缘102优选机械部件以便使框架104和凸缘机械互锁。
该部件在图5A中示出，图5A是上面参考图1所讨论的电路封装100的一部分的剖面图。凸缘102限定用于使框架104和凸缘机械互锁的框架保持部件500。当将框架104模塑到凸缘102时，一些框架材料流入到框架保持部件500中，然后在其中冻结，形成键502。框架保持部件500具有一种横截面轮廓，而键502具有互补的轮廓。这样，冻结的键502机械地与框架保持部件500互锁，由此防止将框架104从凸缘102拉出，而不需要在框架与凸缘之间添加粘合剂。
框架保持部件500包括至少一个底切部分。在横截面中，保持部件500优选为楔形榫形状，其限定两个底切部分504和506。其它诸如T、L或棒棒糖形状等横截面形状是可以接受的。
虽然图5A中示出的框架保持部件500被压在凸缘102的相邻表面下方，但是框架保持部件可以选择地处于相邻表面之上，如图5B中所示。可选择的凸缘102A限定处于相邻表面之上的框架保持部件500A。当将框架104A模塑到凸缘102A时，一些框架材料流到框架保持部件500A的底切部分504A和506A的周围并在其下方冻结。在这种情况下，框架104A限定处于框架104A内的键502A。
回到图5A，通过一系列渐进性冲压在凸缘102中形成框架保持部件500。图6A-C示出框架保持部件500在制造的各个阶段中的横截面。图6A示出在制造框架保持部件500之前的凸缘坯体(blank)102B。
图6B示出在凸缘坯体中精压(coin)出第一矩形截面沟槽600之后的凸缘坯体102C。该精压操作在沟槽600中产生壁602和604。沟槽600优选为大约0.02英寸宽(尺寸A)且优选为大约0.02英寸深(尺寸B)。
图6C示出在第一沟槽600上精压出第二矩形截面沟槽606之后的凸缘102。第二精压操作使壁602和604(图6B)变形，导致它们在沟槽顶部附近轻微塌陷。变形的壁602A和604A形成上述底切504和506，参考图5A。第二沟槽600优选为大约0.05英寸宽(尺寸D)且优选为0.01英寸深(尺寸C)。最终的楔形榫形状具有大约0.007英寸(尺寸E)的较小尺寸，留出大约0.0065英寸(尺寸F)的突出部分。对于用于框架104的(下面说明的)液晶聚合物，该突出部分(F)优选为至少大约0.005英寸。
所有这些尺寸可以根据凸缘102的大小、材料和温度、框架104的大小、材料和温度、凸缘与框架之间的连接处的期望强度、成本或本领域普通技术人员熟知的其它因素来改变。
凸缘102还包括机械部件以确保凸缘与热沉之间的良好的传热连接。通常用机器将热沉加工成在一个表面上是平的。为了在电路封装与热沉之间提供良好的导热连接，应该紧挨着该平面平放电路封装，其间没有间隙。
(上述)所执行的用来制造框架保持部件500的冲压操作可以使凸缘102的底部变形，由此阻碍电路封装紧挨着热沉平放。为了改善该变形，优选在冲压操作之后研磨(lap)凸缘102的底部。另外或可选择地，增加厚度(图5A中的尺寸G)优选至大约0.125英寸，可以减小由冲压操作引起的变形量并可以消除对研磨凸缘102的底部的需要。
当将管芯焊接到凸缘时，管芯110与凸缘102之间的热膨胀系数(CTE)的不同可以使凸缘变形。图7A-D示意性地示出这一情况。图7A示出具有平底700的凸缘102D和还没有焊接到凸缘上的管芯110。焊料114A还没有被熔化。铜/锆凸缘的CTE近似为17ppm/℃，而硅管芯的CTE近似为2.8ppm/℃。随着加热管芯110和凸缘102D以便将管芯焊接到凸缘，管芯和凸缘膨胀。
稍后，在图7B中示出，随着管芯110和凸缘102D冷却，低熔点焊料114B突然变硬，但是凸缘和管芯继续冷却并收缩。低熔点焊料114B非常硬且不十分柔软。因此，凸缘102D的顶表面702的收缩受管芯110的约束，该管芯110具有远远小于凸缘的CTE。结果，凸缘102D的顶表面702比底表面700收缩得要少，导致底表面具有凹形，这会在将凸缘安装到热沉时留下间隙。
为了抵消在焊接之后凸缘102具有凹形的趋势，优选使凸缘在焊接之前为轻微凸的形状。图7C示出在将管芯110焊接到凸缘之前的凸缘。假定凸缘102的底表面704为其凸度(尺寸H)大于将由焊接引入的凹度的量的形状。在一个实施例中，底表面704在凸缘的长度上凸起至少大约0.0001英寸。在另一实施例中，底表面704凸起在大约0.0005英寸与大约0.0010英寸之间。该量根据各种因素而被改变，例如使用的焊接技术、焊接到凸缘的管芯的数量、大小和设置、凸缘的长度、宽度和厚度以及凸缘的成分。常规的凸缘一般为大约0.040或0.062英寸厚。优选为大约0.125英寸的凸缘厚度(图5A中的尺寸G)可以减小由焊接引起的变形量。尽管诸如砂纸打磨、弯曲、铸造或锻造等其它工艺是可以接受的，但是优选通过精压工艺来赋予底表面凸度。
图7D示出在将管芯已经焊接到凸缘且二者冷却之后的凸缘102。底表面704优选具有略微凸起的形状。当将凸缘102安装到热沉上时，通过向凸缘安装螺丝而施加的力(如箭头706和708所表示的)使凸缘紧挨着热沉变平并在凸缘与热沉之间产生良好的传热连接。
如先前所述，凸缘102包括一般为平面的管芯附着区112，将管芯110焊接、环氧或以别的方式附着到该管芯附着区112上。管芯附着区112优选平坦至每英寸在大约0.001英寸内，且更为优选地每英寸在大约0.0005英寸内，以有助于管芯110与管芯附着区之间的良好的低熔点焊料连接。另外，为了共熔焊接，管芯附着区表面粗糙度优选小于大约30微英寸。凸缘102的底部的表面粗糙度优选小于大约64微英寸，以便有助于形成与热沉的良好的导热接触。如果使用诸如环氧树脂的粘合剂来将管芯110粘着到管芯附着区112，则管芯附着区优选平坦至在大约每英寸0.005英寸内并平滑至在大约64微英寸内。
如前所述，凸缘102还包括安装狭槽116和118。或者，凸缘可以包括带有螺纹或没有螺纹的安装孔。在这些情况下，可以通过穿过这些开口延伸的螺栓或其它扣件将凸缘102安装到热沉或其它基板上。或者，可以将凸缘焊接到热沉或其它基板上，避免了对安装孔的需要。
引线
如上面参考图1所述，优选通过注模法将框架104模塑到凸缘102以及引线106和108。在模塑操作期间，优选将框架104模塑在引线106和108的周围，所述引线106和108从框架外部、穿过框架侧壁延伸到气腔区中。作为该模塑的结果，框架附着到引线106和108，尽管该附着通常是有缺陷的并且会由于焊接和管芯操作的加热而断裂。为了克服该问题，各引线106和108优选包括一个或多个引线保持部件以便将引线固定到框架104上。
一个引线保持部件限定至少一个贯穿各引线的孔310，如图8中所示。如前所述，当冲压或蚀刻引线框架300(图3)时，孔310形成在引线106和108中。优选，各引线106和108包括设置成直线的多个优选为矩形的孔310，其中框架104将接触引线。在模塑期间，一些框架热塑性流进孔310中，然后冻结在其中，由此将引线106或108机械锁定在框架104内并防止引线从框架拉出，而不需要在引线与框架之间添加粘结剂。如图5A所示，孔310优选由框架104完全覆盖。
引线106和108的导电性有助于电路封装100的总体性能。引线106或108的导电率与引线的横向、即近似垂直于电流流经引线的方向的横截面面积成比例。由于孔310减小该横截面面积(参见图8中的线B-B)，所以可以选择孔的数量、设置、大小和形状以便最小化引线106和108的有效导电率的损耗。如果最终得到的引线满足设计标准，优选地，孔310最多可以将引线的横截面面积减小大约25％，尽管该减小可以更大。
矩形孔310最大化可以冻结和锁定引线106和108的框架热塑性的量，同时最小化引线导电率的减小。优选调整矩形孔310的较长尺寸使其与电流流经引线106和108的方向平行。取决于框架104的侧壁厚度，孔310可以为正方形。
图8中示出的另一引线保持部件在位于气腔区中的引线的端部上或在该端部附近设置钩状或弯曲(下文共同称作“钩状”)边缘800、脊、凹陷或其它结构。该结构与引线不共面。如可以在图5A中看到的那样，在模塑期间，一些热塑性冻结在该结构的面朝外的部分中或靠着该结构的面朝外的部分冻结，由此产生防止引线106从框架104拉出的机械挡板。在冲压引线框架300(图3)时，在引线106和108中形成钩状边缘800、脊或其它结构。虽然钩状边缘800对于该引线保持部件为优选实施例，但是可以采用其他的形状。在图8B中的800A-F横截面中示出一些可接受的形状的例子。
如先前参考图1所讨论的那样，引线106和108用于将管芯110电连接到电路板等。引线106和108由高铜合金(至少50％的铜)制成，以提供良好的导电性并与框架104的CTE相匹配。高铜引线提供高于现有技术引线的导电率，现有技术的引线一般包括42％的镍和55％的铁(通常称之为合金42)。另外，引线106和108优选被电镀大约100微英寸的镍以形成扩散阻挡层和大约65微英寸的金以有助于布线键合或引线焊接引线。
引线106和108优选由大约2.1％与大约2.6％之间的铁、大约0.015％与大约0.15％之间的磷、大约0.05％与大约0.2％之间的锌与余量(balance)铜的合金构成。然而，这些材料的其他比率是可以接受的。更加优选地，引线106和108由大约97.5％的铜、大约2.35％的铁、大约0.3％的磷以及大约0.12％的锌构成。可以从Olin Corporation获得UNS编号为C19400的这种合金。
对于引线106和108，许多选择成分是可以接受的。一种这样的选择包括大约99.9％的铜和大约0.1％的锆。可以从Olin Corporation获得UNS编号为C15100的这种合金。然而，这些材料的其他比率是可以接受的。例如，由大约0.05％与大约0.15％之间的锆与余量铜构成的合金也是可以接受的。
用于引线106和108的另一种选择成分包括大约1％与大约2％之间的铁、大约0.01％与大约0.035％之间的磷、大约0.3％与大约1.3％之间的钴、大约0.1％与大约1％之间的锡以及余量铜。在该成分中铜的优选量为97％。可以从Olin Corporation获得UNS编号为C19500的这种合金。
用于引线106和108的另一种选择成分包括大约0.3％与大约1.2％之间的铁、大约0.1％与大约0.4％之间的磷、大约0.01％与大约0.2％之间的镁、以及余量铜。在该选择成分中优选配方为大约0.6％的铁、大约0.2％的磷、大约0.05％的镁和大约99％的铜。可以从OlinCorporation公司获得UNS编号为C19700的这种合金。
用于引线106和108的另一种选择成分包括大约1.7％与大约2.3％之间的锡、大约0.1％与大约0.4％之间的镍、高达大约0.15％的磷以及余量铜。可以从Mitsubishi Electric Corporation获得UNS编号为C50710的这种合金。
用于引线106和108的又一种选择成分包括大约0.05％与大约1.5％之间的铁、大约0.025％与大约0.04％之间的磷以及余量铜。可以从Kobe Steel，Ltd.获得UNS编号为C19210的这种合金。
用于引线106和108的再一种选择成分包括大约0.5％与大约0.15％之间的铁、大约0.5％与大约1.5％之间的锡、大约0.01％与大约0.035％之间的磷以及余量铜。可以从Mitsubishi Shinto Company，Ltd.获得UNS编号为C19520的这种合金。
用于引线106和108的另一种选择成分包括在大约0.15％与大约0.4％之间的铬、大约0.01％与大约0.4％之间的钛、大约0.02％与大约0.07％之间的硅以及余量铜。可以从Wieland Werke获得UNS编号为C18070的这种合金。
用于引线106和108的另一种选择成分包括大约0.8％与大约1.8％之间的镍、大约0.15％与大约0.35％之间的硅、大约0.01％与大约0.05％之间的磷以及余量铜。可以从Poong San Metal Corporation获得UNS编号为C19010的这种合金。
用于引线106和108的另一种选择成分包括大约2.0％与大约4.8％之间的镍、大约0.2％与大约1.4％之间的硅、大约0.05％与大约0.45％之间的镁以及余量铜。在该选择成分中优选配方为大约3.0％的镍、大约0.65％的硅、大约0.15％的镁和大约96.2％的铜。可以从OlinCorporation获得UNS编号为C70250的这种合金。
用于引线106和108的另一种选择成分包括大约0.3％与大约0.4％之间的铬、大约0.2％与大约0.3％之间的锡、大约0.15％与大约0.25％之间的锌以及余量铜。可以从Furukawa Electric获得UNS编号为EFTEC-64T的这种合金。
用于引线106和108的另一种选择成分包括大约2.7％与大约3.7％之间的镍、大约0.2％与大约1.2％之间的硅、大约0.1％与大约0.5％之间的锌以及余量铜。可以从Kobe Steel，Ltd.获得UNS编号为KLF-25的这种合金。
用于引线106和108的另一种选择成分包括大约1.9％与大约2.9％之间的镍、大约0.2％与大约0.6％之间的硅、大约0.1％与大约0.2％之间的磷以及余量铜。可以从Mitsubishi Electric Corporation获得UNS编号为MF224的这种合金。
框架
如上所述，参考图5A，框架104由注模的热塑性制成并且模塑到凸缘102以及引线106和108。凸缘102的材料优选包括可以承受管芯附着温度(对于AuSn焊接为280-330℃，或对于AuSi焊接为390-420℃)的液晶聚合物(LCP)。常规的LCP在大约300℃与大约330℃之间的温度下熔化。框架104优选包括基础树脂和化合物以升高其熔化温度、调节其热膨胀系数(CTE)并减小其湿气渗透率。为了简便，这里，将包括树脂和化合物的框架104的材料称为“热塑性配混料(thermoplastic compound)”或“框架材料”。
可接受的树脂的一个例子为包括对羟基苯甲酸、双酚和邻苯二甲酸(phathalic acid)的一种。另一种可接受的成分(formulation)包括p-羟基苯甲酸(HBA)和6-羟基-2-萘甲酸(HNA)的共聚物。其它可接受的成分包括HBA、4-4-双酚(BP)和对苯二酸(TA)的三元聚合物(terapolymer)。
图9是示出热塑性配混料中的一些化合物的框架104的示意性横截面图。优选向LCP中添加填料粒子以改变其CTE以更接近地匹配引线106和108的CTE(近似17ppm/℃)并破坏框架102中的热塑性配混料的各向异性。优选将框架材料的CTE调整在引线106和108的CTE的大约60％内。可以以大约30％至大约40％的浓度，向LCP添加诸如云母的直径优选为大约2至3微米的矿物圆球900。这种合成物具有大约7ppm/℃至22ppm/℃的CTE。
优选向LCP中添加石墨以减小湿气渗透。该石墨优选为通常是平的石墨薄片904(图9中示出的边缘上)，然而，诸如球或大块的其它形式的石墨也是可以接受的。另外，石墨薄片904在注入等期间可以略微弯曲，而不显著改变它们的效果。术语“通常是平的石墨薄片”包括已经变形的这种薄片。
石墨薄片904优选形成层，所述层优选大体平行于框架104的外表面，由此产生用于湿气渗透的曲折路径906。即使所述层不与外表面平行，石墨的存在也阻止湿气渗透。石墨薄片904还调节LCP的CTE以便更加接近地匹配引线106和108的铜合金。框架材料含有大约10％与大约70％之间的石墨薄片，优选在大约40％与50％之间。
作为石墨薄片的替换物，可以向LCP中添加玻璃纤维1202以增加硬度并调整最终得到的热塑性配混料的CPE。在该实施例中，框架材料优选含有大约30％与大约50％之间的玻璃纤维。
作为另一种石墨薄片的替换物，或者与石墨薄片一起，可以向LCP中添加其他的化合物，例如铁粉基吸收剂、分子筛过滤器(沸石)和氧化钙(CaO)。从Sud-Chemie，Inc.获得适合的沸石。
在注模之前，框架材料优选被预干燥，优选小于大约0.008％的湿气含量。另外，注入时间应该保持得较短，优选小于大约0.2秒。压注量(injection shot)规模应该保持得较小，优选小于大约2克，以最小化在注入模桶中的热塑性配混料的滞留时间。在注入位置的闸门优选限制热塑性配混料的流动，由此增加热塑性配混料上的切力(shear)，以便为聚合物链和石墨薄片904定方位。优选将热塑性配混料注入在框架104的拐角处或者在引线106与108之间。为了最小化最终得到的框架上的应力量，在模塑操作期间，优选保持大约250°F的最小模塑温度。
优选向框架104的外表面涂敷湿气阻挡膜，以进一步减小湿气渗透。或者，将该膜涂敷到框架104的内部。可接受的材料包括从PPGIndustries可获得的商标为Bairocade的胺基环氧树脂、聚合物-Al膜和聚合物-陶瓷膜。
封条
框架保持部件500(图5A)和引线保持部件800(图8A)提供良好的阻止湿气和大气渗透的机械连接。另外，框架104优选包括减小该渗透的构件和外部或内部膜。为了进一步减小渗透，如图10中示出，优选将封条1000和1002沿着框架104的边缘施加在框架104内侧，其中框架与引线106和108接触且其中框架与凸缘102接触。如图11A中的横截面所示，封条1002有效地阻止凸缘102与框架104之间的渗透并阻止框架104与引线108之间的渗透。或者，如图11B中所示，可以使用两个封条1002A和1002B来代替一个封条1002。
为了促进密封剂与框架材料的良好粘接，优选在涂敷密封剂之前清洗框架材料。如本领域所公知的，其中氧为主要介质的等离子体清洗产生可接受的结果。或者，可以使用溶剂或通过蚀刻来清洗框架材料。优选使用0.008英寸内径(ID)的针来分配用于封条1000的材料，并且优选使用0.010英寸ID的针来分配用于封条1002的材料。当然，根据所期望的珠子(bead)的尺寸，可以使用其它针尺寸。为了最小化密封剂中的气泡，使用正位移螺旋泵来向针泵压密封剂。
密封剂材料优选在大约0.95每秒的剪切速率下具有大约58Pa.s与大约128Pa.s之间的粘度，而在大约9.5每秒的剪切速率下具有大约12Pa.s与大约30Pa.s之间的粘度。图12包含示出粘度与剪切速率之间的优选关系的曲线1200。在高剪切速率下，优选低粘度，以便于可以快速分配材料。然而，在低剪切速率下优选高粘度，以便于一次性分配材料，而不运转。
该材料优选具有大约3Pa.s与大约7.4Pa.s之间的卡森粘度(casonviscosity)。材料的触变指数优选在大约3.5与大约4.6之间。
用于封条1000和1002的合适材料包括环氧树脂、硅树脂和保形涂料。合适的密封剂包括大约40％与大约60％之间的溶剂(诸如醋酸2-丁酯)和大约40％与大约60％之间的环氧树脂或有机硅树脂。例如，环氧树脂可以为双酚A或环状脂肪族环氧树脂。适合的硬化剂包括胺硬化剂。或者，封条可以由从Cookson Electronics可获得的Paralyne D或Parylene HT制成。
盖子
在将管芯110附着到凸缘102并电键合到引线106和108之后将盖子200附着到框架104。适合的盖子200显示在图13A和13B中。优选使用频率在大约50kHz与大约60kHz之间以及振幅小于大约100微米(更优选小于60微米)的焊接信号将盖子200优选地超声焊接到框架104。或者，盖子200可以被激光焊接或热焊接到框架104。
已经不使用常规的超声塑胶焊接技术来将盖子密封到电路封装上，因为这些常规技术使用较低的焊接频率，这产生会损坏安装在电路封装中的布线键合组件的较高振幅。本发明的较高的焊接频率产生较低的振幅，且因此不损伤布线键合组件。通常，使用环氧树脂粘合剂将盖子粘接到电路封装上。有利的是，可以在远远小于环氧树脂固化时间(近似2小时)的时间(近似250msec.)内完成超声焊接。
优选在盖子200与框架104之间存在干涉配合，以至于盖子和框架的部分在超声焊接期间熔化并熔合在一起。如图13B中的横截面所示，盖子200优选包括与框架104熔化并熔合在一起的边缘1300。盖子200优选由与框架104相同的材料制成，如上所述。另外，优选向盖子200涂敷湿气阻挡膜，如上面关于框架104所述。
制造细节
上面已经详细说明了电路封装100的凸缘102、框架104、引线106与108和盖子200的细节，包括用于制造这些部件的材料和工艺。图14包含示出工艺的简单流程图，可以通过其制造和使用电路封装100。
在1400，制作用于引线106和108的第一高铜合金。在1402，通过在1400制造的第一高铜合金来制作引线框架。在1404，在引线框架300中冲孔、蚀刻或以其它方式制作孔310，以产生一个引线保持部件。在1406，在引线框架300上卷曲、弯曲、冲压或蚀刻引线106和108的端部以产生另一引线保持部件800。
在1408，制作用于凸缘102的第二高铜合金。在1410，通过在1408制造的第二高铜合金制作凸缘102。在1412，通过渐进型冲压工艺在凸缘102中精压框架保持部件500。可选择地，在1414，研磨凸缘102的底部。在1416，使凸缘102的底部变得凸起。
在1418，向液晶聚合物中添加石墨薄片、云母和/或玻璃纤维以制造框架材料。在1420，干燥框架材料。在1422，将框架104模塑到凸缘102以及引线106和108上。
在1424，清洗框架104和凸缘102的内表面，即气腔区。在1426，涂敷密封剂，以密封框架104与凸缘102之间的边界以及框架与引线106和108之间的边界。
在1428，将管芯110附着到凸缘102。在1430，将管芯110超声布线键合到引线106和108。在1432，将盖子200超声焊接到框架104。
虽然已经参考优选实施例说明了本发明，但是本领域技术人员会理解并意识到可以作出各种改变，同时仍保持在本发明的精神和范围内，如在附属权利要求书中所述。例如，可以使用环氧树脂或其它粘合剂将低功率管芯粘接到凸缘上，而不是焊接到其上。此外，如本领域所公知的，合金一般含有少量杂质，以至于本文中所述的组分不必总计为100％。
虽然已经在高铜凸缘102的背景下说明了框架保持部件500和凸缘底部的凸度H，但是这些创新也适用于常规的凸缘和由其它材料制成的凸缘。虽然已经在高铜引线的背景下说明了引线保持部件310、800和它们各自的替换物，但是这些创新也适用于常规的引线和由其它材料制成的引线。虽然在电路封装100的背景下说明了框架材料，但是该材料可以有利地用于其它情况，例如那些需要可以承受高温的材料。框架材料的其它应用的例子包括在印刷电路版(PCB)中的高温绝缘板和用于电子元件、电缆、PCB等的插座。

Claims (10)

1.一种电子元件封装体，包括：
包含如下材料的组合物：
液晶聚合物；
多个石墨薄片；
其中该电子元件封装体具有一个表面，并且所述多个石墨薄片形成曲折路径并被组织成与该表面平行的层。
2.根据权利要求1所述的电子元件封装体，其中所述组合物包括10％与70％之间的石墨薄片。
3.根据权利要求1所述的电子元件封装体，其中所述组合物包括40％与50％之间的石墨薄片。
4.根据权利要求1所述的电子元件封装体，其中所述液晶聚合物包括：
对羟基苯甲酸；
双酚；和
邻苯二甲酸。
5.根据权利要求1所述的电子元件封装体，其中所述液晶聚合物包括：
p-羟基苯甲酸；以及
6-羟基-2-萘甲酸的共聚物。
6.一种用于制造电子元件封装体的方法，包括：
将组合物注入到模具中，该组合物包括：
液晶聚合物；以及
多个石墨薄片；
其中执行对所述组合物的注入使得所述石墨薄片形成曲折路径并被组织成与所述电子元件封装体的表面平行的层。
7.根据权利要求6所述的方法，其中所述组合物包括10％与70％之间的石墨薄片。
8.根据权利要求6所述的方法，其中所述组合物包括40％与50％之间的石墨薄片。
9.根据权利要求6所述的方法，其中所述液晶聚合物包括：
对羟基苯甲酸；
双酚；和
邻苯二甲酸。
10.根据权利要求6所述的方法，其中所述液晶聚合物包括：
p-羟基苯甲酸；以及
6-羟基-2-萘甲酸的共聚物。
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