KR970072371A - Ic 카드 및 그 제조방법 - Google Patents

Ic 카드 및 그 제조방법 Download PDF

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Publication number
KR970072371A
KR970072371A KR1019960012945A KR19960012945A KR970072371A KR 970072371 A KR970072371 A KR 970072371A KR 1019960012945 A KR1019960012945 A KR 1019960012945A KR 19960012945 A KR19960012945 A KR 19960012945A KR 970072371 A KR970072371 A KR 970072371A
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KR
South Korea
Prior art keywords
cavity
metal core
core layer
card
module
Prior art date
Application number
KR1019960012945A
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English (en)
Other versions
KR100209259B1 (ko
Inventor
류재철
Original Assignee
이대원
삼성항공산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 이대원, 삼성항공산업 주식회사 filed Critical 이대원
Priority to KR1019960012945A priority Critical patent/KR100209259B1/ko
Priority to JP10318597A priority patent/JP4289689B2/ja
Priority to US08/842,211 priority patent/US5877941A/en
Publication of KR970072371A publication Critical patent/KR970072371A/ko
Application granted granted Critical
Publication of KR100209259B1 publication Critical patent/KR100209259B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

본 발명은 캐비티가 형성되어 있는 카드 기체, 상기 캐비티에 내장되는 IC 모듈, 상기 카드 기체의 양면에 적층되어 있는 오버시트층을 구비하는 IC 카드에 있어서, 상기 카드 기체가 메탈코어층으로 형성되어 있는 것을 특징으로 하는 IC 카드 및 그 제조방법을 개시한다. 본 발명에 따르면, 열적, 전기적 및 기계적인 안정성이 향상된 IC 카드를 얻을 수 있다.

Description

IC 카드 및 그 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도, 제3도 및 제4도는 본 발명의 바람직한 일 실시예에 따른 제조된 IC 카드를 도시한 도면이다.

Claims (11)

  1. 캐비티가 형성되어 있는 카드 기체, 상기 캐비티에 내장되는 IC 모듈, 상기 카드 기체의 양면에 적층되어 있는 오버시트층을 구비하는 IC 카드에 있어서, 상기 카드 기체가 메탈코어층으로 형성되어 있는 것을 특징으로 하는 IC 카드.
  2. 제1항에 있어서, 상기 메탈코어층의 표면이 흑화처리된 것을 특징으로 하는 IC 카드.
  3. 제1항에 있어서, 상기 메탈코어층이 알루미늄 및 구리중에서 선택된 물질로 형성되는 것을 특징으로 하는 IC카드.
  4. 제1항에 있어서, 상기 IC 모듈에 접지 패턴이 형성되어 있는 것을 특징으로 하는 IC 카드.
  5. 제1항에 있어서, 상기 메탈코어층의 캐비티가 상기 IC 모듈을 밀봉시키는 몰딩 컴파운드의 크기와 모양에 맞게 형성되어 있는 것을 특징으로 하는 IC 카드.
  6. 제1항에 있어서, 상기 메탈코어층의 캐비티가 오버시트층의 캐비티와 동일한 크기와 모양인 것을 특징으로 하는 IC 카드.
  7. 카드기체인 메탈코어층에 캐비티를 형성하는 단계; 상기 메탈코어층의 표면을 흑화처리하는 단계; 상기 메탈코어층의 캐비티에 IC 모듈을 내장하는 단계; 오버 시트층에 캐비티를 형성하는 단계; 상기 메탈코어층의 상부에 캐비티가 형성된 오버시트층을 적충한 다음, 상기 메탈코어층의 하부에 오버시트층을 적충하는 단계를 포함하는 것을 특징으로 하는 IC 카드의 제조방법.
  8. 제7항에 있어서, 상기 메탈코어층이 구리 및 알루미늄중에서 선택된 물질로 형성되는 것을 특징으로 하는 IC 카드의 제조방법.
  9. 제7항에 있어서, 상기 IC 모듈에 접지 패턴이 형성되는 것을 특징으로 하는 IC 카드의 제조방법.
  10. 제7항에 있어서, 상기 메탈코어층의 캐비티를 상기 IC 모듈을 밀봉시키는 몰딩 컴파운드의 크기와 모양에 맞게 형성시키는 것을 특징으로 하는 IC 카드의 제조방법.
  11. 제7항에 있어서, 상기 메탈코어층의 캐비티가 오버시트층의 캐비티와 동일한 크기와 모양인 것을 특징으로 하는 IC 카드의 제조방법.
    ※ 참고사항:최초출원 내용에 의하여 공개하는 것임.
KR1019960012945A 1996-04-25 1996-04-25 Ic 카드 및 그 제조방법 KR100209259B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1019960012945A KR100209259B1 (ko) 1996-04-25 1996-04-25 Ic 카드 및 그 제조방법
JP10318597A JP4289689B2 (ja) 1996-04-25 1997-04-21 Ｉｃカード及びその製造方法
US08/842,211 US5877941A (en) 1996-04-25 1997-04-24 IC card and method of fabricating the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960012945A KR100209259B1 (ko) 1996-04-25 1996-04-25 Ic 카드 및 그 제조방법

Publications (2)

Publication Number Publication Date
KR970072371A true KR970072371A (ko) 1997-11-07
KR100209259B1 KR100209259B1 (ko) 1999-07-15

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Country Status (3)

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US (1) US5877941A (ko)
JP (1) JP4289689B2 (ko)
KR (1) KR100209259B1 (ko)

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JPH1035164A (ja) 1998-02-10
US5877941A (en) 1999-03-02
KR100209259B1 (ko) 1999-07-15
JP4289689B2 (ja) 2009-07-01

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