KR960020637A - 회로 소자 실장 구조물 - Google Patents

회로 소자 실장 구조물 Download PDF

Info

Publication number
KR960020637A
KR960020637A KR1019950039574A KR19950039574A KR960020637A KR 960020637 A KR960020637 A KR 960020637A KR 1019950039574 A KR1019950039574 A KR 1019950039574A KR 19950039574 A KR19950039574 A KR 19950039574A KR 960020637 A KR960020637 A KR 960020637A
Authority
KR
South Korea
Prior art keywords
cap
connection part
portions
cavity
contact
Prior art date
Application number
KR1019950039574A
Other languages
English (en)
Other versions
KR100288520B1 (ko
Inventor
다까오 고이즈미
Original Assignee
가네꼬 히사시
닛본덴기 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가네꼬 히사시, 닛본덴기 가부시끼가이샤 filed Critical 가네꼬 히사시
Publication of KR960020637A publication Critical patent/KR960020637A/ko
Application granted granted Critical
Publication of KR100288520B1 publication Critical patent/KR100288520B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5381—Crossover interconnections, e.g. bridge stepovers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/1627—Disposition stacked type assemblies, e.g. stacked multi-cavities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Waveguides (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

본 발명은 배선 패턴 A(11)를 기판(1); 기판(1)이 표면에 형성된 적어도 하나의 캐비티(16a); 및 캐비티(16a)를 덮기 위한 캡(2)를 포함하는 회로 소자 실장구조에 있어서, 캡(2)은 이 캡 내에 배선 패턴 B(7) 및 배선 패턴 A(11)에 패턴 B(7)을 전기적으로 접속하기 위한 적어도 하나의 접속부 B(5,5a)를 포함하며, 기판(1)은 배선 패턴 A(11)에 접속부 B(5,5a)를 전기적으로 접속하기 위한 접속부 A(10, 10a)를 포함하는 회로 소자 실장 구조를 제공한다. 본 발명에 따라서, 이전 회로에서데드 스페이스였던 캡상에 회로 소자들을 실장할 수 있으므로, 캡 영역을 포함하는 기판 상에 회로 소자들을 고밀도로 실장할 수 있게 된다.

Description

회로 소자 실장 구조물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제5도는 제1실시예에 따라 캡 및 이 캡이 끼워 맞추어질 캐비티에 대한 단면도.

Claims (10)

  1. 배선 패턴 A(11)를 갖는 기판(1); 상기 기판(1)의 표면에 형성된 적어도 하나의 캐비티(16a); 및 상기 캐비티(16a)를 덮기 위한 캡(2)을 포함하는 회로 소자 실장 구조에 있어서, 상기 캡(2)은 (a) 내부의 배선 패턴 B(7) 및 (b) 상기 배선 패턴 A(11)에 상기 배선 패턴 B(7)을 전기적으로 접속하기 위한 적어도 하나의 접속부 B(5,5a,30,30a,40,40a)를 포함하며, 상기 기판(1)은 상기 배선 패턴 A(11)에 접속부 B를 전기적으로 접속하기 위한 적어도 하나의 접속부 A(10, 10a,31,31a,41,41a)를 포함하는 것을 특징으로 하는 회로 소자 실장 구조물.
  2. 제1항에 있어서, 상기 접속부 B는 홈부(recess;5,5a)와 상기 캡(2)이 상기 기판(1)에 접촉하고 있는 철부(convex;10, 10a) 중 하나를 포함하고, 상기 접속부 A는 상기 캐비티(16a) 내에 배치된 하나를 포함하며, 상기 홈부(5,5a) 및 철부(10, 10a)가 서로 맞물림 가능한 구조로 되어 있는 것을 특징으로 하는 회로 소자 실장 구조물.
  3. 제2항에 있어서, 복수의 상기 접속부 A 및 B쌍들이 형성되고, 이들 쌍들 중 한쌍의 상기 접속부 A 및 B는 상기 쌍들 중 다른 쌍의 상기 접속부 A 및 B와는 다른 형태로 홈부(5,5a) 또는 철부(10,10a)를 포함하는 것을 특징으로 하는 회로 소자 실장 구조물.
  4. 제3항에 있어서, 상기 쌍들 중 일부 쌍의 상기 접속부 A는 철부(10,10a) 형상이고 이와 관련된 상기 접속부 B는 홈(5,5a) 형상이며, 상기 쌍들 중 나머지 쌍의 상기 접속부 A는 홈(5,5a) 형상이고 이와 관련된 상기 접속부 B는 철부(10,10a) 형상인 것을 특징으로 하는 회로 소자 실장 구조물.
  5. 제1항에 있어서, 상기 접속부 B는 상기 캡(2)이 상기 기판(1)과 접촉하는 경사면 C(30,30a)를 포함하고, 상기 접속부 A는 상기 표면 C(30,30a)와 동일한 경사도를 갖는 표면 D(31,31a)를 포함하며, 상기 표면 C(30,30a) 및 D(31,31a)는 서로 면하여 접촉되는 구조인 것을 특징으로 하는 회로 소자 실장 구조물.
  6. 제1항에 있어서, 상기 접촉부 B는 상기 캡(2)이 상기 기판(1)에 접촉하게 되는 외향 예각면 E(40,40a)를 포함하고, 상기 접속부 A는 내향 예각면 F(41,41a)를 포함하며, 상기 예각면 E(40,40a) 및 F(41,41a)는 서로 끼워 맞춰지는 구조인 것을 특징으로 하는 회로 소자 실장 구조물.
  7. 제1항에 있어서, 복수 쌍의 상기 접속부 A 및 B가 형성되어 있으며, 상기 접속부 B 각각은 홈부(5,5a) 및 철부(10,10a)중 하나, 경사면 C(30,30a) 및 외향 예각면 E(40,40a)를 포함하고, 상기 접속부 A 각각은 철부(10,10a) 및 홈부(5,5a)중 하나, 상기 표면 C(30,30a)과 동일한 경사도를 갖는 표면 D(31,31a), 및 내향 예각면 F(41,41a)를 포함하며, 상기 홈부(5,5a) 및 철부(10,10a)는 서로 맞물림 가능한 구조이고, 상기 표면 C(30,30a) 및 D(31,31a)는 서로 면하며 접촉되는 구조이며, 상기 예각면 E(40,40a) 및 F(41,41a)는 서로 끼워 맞춰지는 구조인 것을 특징으로 하는 회로 소자 실장 구조물.
  8. 전술한 항 중 어느 한 항에 있어서, 상기 캡(2)은 상기 캐비티(16a)보다 크기가 약간 작아서, 상기 캡(2)과 상기 캐비티(16a)간에 갭(21)이 형성되는 것을 특징으로 하는 회로 소자 실장 구조물.
  9. 제1항 내지 제7항 중 어느 한 항에 있어서, 상기 캡(2)은 상기 캐비티(16a)의 깊이와 같은 치수의 두께를 갖는 것을 특징으로 하는 회로 소자 실장 구조물.
  10. 제1항 내지 제7항 중 어느 한 항에 있어서, 상기 캡(2)은 이 캡(2)와 이 위에 실장될 회로 소자를 전기적으로 접속하기 위한 적어도 하나의 단자(8)을 갖는 표면에 형성되는 것을 특징으로 하는 회로 소자 실장 구조물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950039574A 1994-11-16 1995-11-03 회로 소자 실장 구조물 KR100288520B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6306940A JP2682477B2 (ja) 1994-11-16 1994-11-16 回路部品の実装構造
JP94-306940 1994-11-16

Publications (2)

Publication Number Publication Date
KR960020637A true KR960020637A (ko) 1996-06-17
KR100288520B1 KR100288520B1 (ko) 2001-05-02

Family

ID=17963115

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950039574A KR100288520B1 (ko) 1994-11-16 1995-11-03 회로 소자 실장 구조물

Country Status (8)

Country Link
US (1) US5712767A (ko)
EP (1) EP0713252A3 (ko)
JP (1) JP2682477B2 (ko)
KR (1) KR100288520B1 (ko)
CN (1) CN1133498A (ko)
AU (1) AU699516B2 (ko)
CA (1) CA2161569C (ko)
TW (1) TW343425B (ko)

Families Citing this family (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19728993C1 (de) * 1997-07-07 1998-09-03 Siemens Ag Chipkarte und Verfahren zur Herstellung einer Chipkarte mit einer eingebetteten Antenne
SE513352C2 (sv) 1998-10-26 2000-08-28 Ericsson Telefon Ab L M Kretskort och förfarande för framställning av kretskortet
SE9803670L (sv) * 1998-10-26 2000-04-27 Ericsson Telefon Ab L M Förfarande vid framställning av kretskort
JP3538045B2 (ja) 1998-12-09 2004-06-14 三菱電機株式会社 Ｒｆ回路モジュール
US6222737B1 (en) * 1999-04-23 2001-04-24 Dense-Pac Microsystems, Inc. Universal package and method of forming the same
US6323060B1 (en) 1999-05-05 2001-11-27 Dense-Pac Microsystems, Inc. Stackable flex circuit IC package and method of making same
US6239977B1 (en) * 1999-05-17 2001-05-29 3Com Corporation Technique for mounting electronic components on printed circuit boards
SE514426C2 (sv) * 1999-06-17 2001-02-19 Ericsson Telefon Ab L M Anordning för chipmontering i kavitet i flerlagers mönsterkort
JP4154806B2 (ja) * 1999-06-29 2008-09-24 三菱電機株式会社 高周波モジュール
US6255899B1 (en) 1999-09-01 2001-07-03 International Business Machines Corporation Method and apparatus for increasing interchip communications rates
US6392298B1 (en) * 2000-02-28 2002-05-21 Ericsson Inc. Functional lid for RF power package
US6660561B2 (en) 2000-06-15 2003-12-09 Dpac Technologies Corp. Method of assembling a stackable integrated circuit chip
US6404043B1 (en) * 2000-06-21 2002-06-11 Dense-Pac Microsystems, Inc. Panel stacking of BGA devices to form three-dimensional modules
US6445591B1 (en) * 2000-08-10 2002-09-03 Nortel Networks Limited Multilayer circuit board
US6368146B2 (en) 2000-08-23 2002-04-09 Russell Abbott Alignment mechanism for a high density electrical connector
JP3612031B2 (ja) * 2001-03-29 2005-01-19 Ｔｄｋ株式会社 高周波モジュール
US20030002267A1 (en) * 2001-06-15 2003-01-02 Mantz Frank E. I/O interface structure
US20020190367A1 (en) * 2001-06-15 2002-12-19 Mantz Frank E. Slice interconnect structure
CA2470094C (en) * 2001-12-18 2007-12-04 Digimarc Id Systems, Llc Multiple image security features for identification documents and methods of making same
US6856010B2 (en) * 2002-12-05 2005-02-15 Staktek Group L.P. Thin scale outline package
US20050030723A1 (en) * 2003-02-19 2005-02-10 Miks Jeffrey Alan Fully-molded or lidded circuit module assembly having edge-stiffening interlock features
US20040207990A1 (en) * 2003-04-21 2004-10-21 Rose Andrew C. Stair-step signal routing
WO2005050708A2 (en) * 2003-11-13 2005-06-02 Silicon Pipe, Inc. Stair step printed circuit board structures for high speed signal transmissions
JP2005197800A (ja) * 2003-12-26 2005-07-21 Kyocera Kinseki Corp 圧電部品とその製造方法
US7781041B2 (en) 2004-11-19 2010-08-24 Beekley Corporation Tattoo cover and related method
JP2006270013A (ja) * 2004-11-26 2006-10-05 Kyocera Corp 電子部品収納用パッケージおよび電子装置
USD590949S1 (en) 2005-06-30 2009-04-21 Beekley Corporation Temporary tattoo cover
JP5082835B2 (ja) * 2007-12-27 2012-11-28 大日本印刷株式会社 プリント配線板の製造方法、プリント配線板
US11278740B2 (en) 2008-11-03 2022-03-22 Berkley Corporation Temporary tattoo cover and related method
JP5369827B2 (ja) * 2009-03-31 2013-12-18 Ｔｄｋ株式会社 電子部品内蔵モジュール
JP5099063B2 (ja) * 2009-03-31 2012-12-12 Ｔｄｋ株式会社 電子部品モジュール
US8116090B2 (en) * 2009-04-09 2012-02-14 Bae Systems Information And Electronic Systems Integration Inc. Low temperature co-fired ceramic (LTCC) transmit/receive (T/R) assembly utilizing ball grid array (BGA) technology
USD612202S1 (en) * 2009-05-27 2010-03-23 Solo Cup Operating Corporation Cup
JP5072124B2 (ja) * 2009-10-30 2012-11-14 パナソニック株式会社 回路基板および電子機器
JP4983906B2 (ja) * 2009-12-25 2012-07-25 Ｔｄｋ株式会社 電子部品内蔵モジュール
JP5105106B2 (ja) * 2009-12-25 2012-12-19 Ｔｄｋ株式会社 電子部品内蔵モジュール
US20120325537A1 (en) * 2010-03-08 2012-12-27 Nec Corporation Circuit board, electronic apparatus, and noise blocking method
USD649396S1 (en) 2010-04-30 2011-11-29 Pactiv Corporation Sidewall for a cup
USD649397S1 (en) 2010-04-30 2011-11-29 Pactiv Corporation Sidewall for a cup
USD670598S1 (en) 2012-01-19 2012-11-13 Scott Eben Dunn Rectangle display holder for a cord
USD666124S1 (en) 2012-01-19 2012-08-28 Scott Eben Dunn Star display holder for a cord
USD666937S1 (en) 2012-01-19 2012-09-11 Scott Eben Dunn Elephant display holder for a cord
USD666938S1 (en) 2012-01-19 2012-09-11 Scott Eben Dunn Ribbon display holder for a cord
USD688595S1 (en) 2012-01-19 2013-08-27 Scott Eben Dunn Oval display holder for a cord
USD666939S1 (en) 2012-01-19 2012-09-11 Scott Eben Dunn Wedge display holder for a cord
USD663238S1 (en) 2012-01-19 2012-07-10 Scott Eben Dunn Donkey display holder for a cord
USD665701S1 (en) 2012-01-19 2012-08-21 Scott Eben Dunn Cross display holder for a cord
USD663237S1 (en) 2012-01-19 2012-07-10 Scott Eben Dunn Banner display holder for a cord
USD688975S1 (en) 2012-01-19 2013-09-03 Scott Eben Dunn Cross display holder for a cord
USD670196S1 (en) 2012-01-19 2012-11-06 Scott Eben Dunn Triangle display holder for a cord
USD688594S1 (en) 2012-01-19 2013-08-27 Scott Eben Dunn Cross display holder for a cord
USD669392S1 (en) 2012-01-19 2012-10-23 Scott Eben Dunn Rectangle display holder for a cord
USD668995S1 (en) 2012-01-19 2012-10-16 Scott Eben Dunn Pennant display holder for a cord
USD666940S1 (en) * 2012-01-19 2012-09-11 Scott Eben Dunn Circle display holder for a cord
USD666125S1 (en) 2012-01-19 2012-08-28 Scott Eben Dunn Football display holder for a cord
USD667751S1 (en) 2012-01-19 2012-09-25 Scott Eben Dunn Gem display holder for a cord
USD667337S1 (en) 2012-01-19 2012-09-18 Scott Eben Dunn Flag display holder for a cord
USD688596S1 (en) 2012-01-19 2013-08-27 Scott Eben Dunn Square display holder for a cord
USD688976S1 (en) 2012-08-31 2013-09-03 Scott E. Dunn Square display holder for a cord
USD693731S1 (en) 2012-08-31 2013-11-19 Scott E. Dunn Oval display holder for a cord
USD693732S1 (en) 2012-08-31 2013-11-19 Scott E. Dunn Flag display holder for a cord
USD747957S1 (en) * 2013-11-27 2016-01-26 Science Media, Llc Cord holder
USD769144S1 (en) * 2014-04-22 2016-10-18 Mark L. Anderson Heat detector
USD776664S1 (en) * 2015-05-20 2017-01-17 Chaya Coleena Hendrick Smart card
USD791221S1 (en) * 2015-11-10 2017-07-04 Guitar Center, Inc. Guitar tuner
CN106028649B (zh) * 2016-07-28 2019-02-12 Oppo广东移动通信有限公司 移动终端的电路板和具有其的移动终端
USD824470S1 (en) * 2017-03-27 2018-07-31 Rodney D. Bragg Above ground swimming pool patch panel
CN109121293B (zh) * 2018-09-30 2020-05-15 西安易朴通讯技术有限公司 印刷电路板组件及电子设备
USD943730S1 (en) * 2018-11-28 2022-02-15 Broan-Nutone Llc Ventilation grille
USD896330S1 (en) * 2018-12-05 2020-09-15 New Swarm Sports Llc Athletic stick
USD906010S1 (en) * 2019-01-30 2020-12-29 Allan Wendling Set of corner devices for a floor covering
USD917204S1 (en) 2019-01-30 2021-04-27 Allan Wendling Pair of corner devices for a floor covering
USD917925S1 (en) 2019-09-16 2021-05-04 Allan Wendling Corner device for a floor covering
USD932799S1 (en) 2019-09-16 2021-10-12 Just Fur Love, LLC Corner device for a floor covering

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5193677U (ko) * 1975-01-24 1976-07-27
US4285002A (en) * 1978-01-19 1981-08-18 International Computers Limited Integrated circuit package
JPS58446U (ja) * 1981-06-25 1983-01-05 富士通株式会社 混成集積回路装置
US5237204A (en) * 1984-05-25 1993-08-17 Compagnie D'informatique Militaire Spatiale Et Aeronautique Electric potential distribution device and an electronic component case incorporating such a device
JPS60263452A (ja) * 1984-06-12 1985-12-26 Nec Corp 集積回路パツケ−ジ
JPS60263451A (ja) * 1984-06-12 1985-12-26 Nec Corp 集積回路パツケ−ジ
US4661886A (en) * 1985-10-03 1987-04-28 Burroughs Corporation Magnetically sealed multichip integrated circuit package
US4903120A (en) * 1985-11-22 1990-02-20 Texas Instruments Incorporated Chip carrier with interconnects on lid
US4924353A (en) * 1985-12-20 1990-05-08 Hughes Aircraft Company Connector system for coupling to an integrated circuit chip
JPS63226948A (ja) * 1987-03-16 1988-09-21 New Japan Radio Co Ltd 混成集積装置
JPH0277191A (ja) * 1988-09-13 1990-03-16 Nec Corp パッケージ
US4963279A (en) * 1989-02-28 1990-10-16 Exxon Chemical Patents Inc. C14-carboxylate polymer and viscosity index improver containing oleaginous compositions
US5200810A (en) * 1990-04-05 1993-04-06 General Electric Company High density interconnect structure with top mounted components
JPH0473720A (ja) * 1990-07-16 1992-03-09 Matsushita Electric Ind Co Ltd 非線形光学材料の製造方法
US5138436A (en) * 1990-11-16 1992-08-11 Ball Corporation Interconnect package having means for waveguide transmission of rf signals
JP2973646B2 (ja) * 1991-10-16 1999-11-08 富士通株式会社 ベアチップｌｓｉの実装構造
JPH06232608A (ja) 1992-10-29 1994-08-19 Nec Corp 複合マイクロ波回路モジュール
CA2109441C (en) * 1992-10-29 1997-05-13 Yuhei Kosugi Composite microwave circuit module assembly and its connection structure
JPH0794671A (ja) * 1993-09-22 1995-04-07 Toyota Autom Loom Works Ltd 混成集積回路装置のキャップの接着構造
FR2716281B1 (fr) * 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.

Also Published As

Publication number Publication date
CN1133498A (zh) 1996-10-16
JPH08148800A (ja) 1996-06-07
JP2682477B2 (ja) 1997-11-26
CA2161569C (en) 2000-01-25
CA2161569A1 (en) 1996-05-17
EP0713252A3 (en) 1998-01-07
US5712767A (en) 1998-01-27
AU699516B2 (en) 1998-12-03
KR100288520B1 (ko) 2001-05-02
TW343425B (en) 1998-10-21
EP0713252A2 (en) 1996-05-22
AU3787695A (en) 1996-05-23

Similar Documents

Publication Publication Date Title
KR960020637A (ko) 회로 소자 실장 구조물
KR960018636A (ko) 가요성구조를 지닌 광모듈용 회로기판
KR900017449A (ko) 전자 어셈블리 및 전자 어셈블리를 형성하는 공정
KR900011053A (ko) 발광다이오드 어레이 헤드의 제조방법
KR920005304A (ko) 반도체집적회로장치의 배선접속구조 및 그 제조방법
KR970072371A (ko) Ic 카드 및 그 제조방법
KR940008026A (ko) 반도체 패키지
KR890005859A (ko) 집적회로 칩 조립품
KR930021040A (ko) 전자회로장치 및 그 제조방법
KR900700302A (ko) Ic카드 및 그 제조방법
KR950013330A (ko) 반도체장치 및 그 제조방법
WO2001065601A3 (de) Vorrichtung zum verpacken elektronischer bauteile mittels spritzgusstechnik
KR960036203A (ko) 장착 포스트를 갖춘 전기 커넥터
KR910013570A (ko) 쇼트키.다이오드
KR930022636A (ko) 전기 컨넥터와 그것과 사용하기 위한 몸체 및 몸체 설치방법
KR970067916A (ko) 접합누설이 적은 저 스트레스 광다이오드
KR920022590A (ko) 기판에 설치되는 고정소자를 갖는 컨넥터
JP2002313463A (ja) ターミナルガイド及び基板用コネクタ
JPH11112112A (ja) プリント基板用シート
US3753048A (en) Multi-channel electrical connector
KR960704278A (ko) 전자 스마트 카드 접속용 전기 커넥터(electric connector for connecting an electronic smart card)
JPH0414865Y2 (ko)
KR920007093A (ko) 하이브리드형 반도체장치
EP0997937A3 (en) Semiconductor device module with a heat sink
HUP9800060A2 (hu) Villamos érintkező szerelvény

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
AMND Amendment
E601 Decision to refuse application
J201 Request for trial against refusal decision
AMND Amendment
B601 Maintenance of original decision after re-examination before a trial
J301 Trial decision

Free format text: TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 19991013

Effective date: 20001128

S901 Examination by remand of revocation
GRNO Decision to grant (after opposition)
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20040120

Year of fee payment: 4

LAPS Lapse due to unpaid annual fee