JPS58446U - 混成集積回路装置 - Google Patents

混成集積回路装置

Info

Publication number
JPS58446U
JPS58446U JP1981094877U JP9487781U JPS58446U JP S58446 U JPS58446 U JP S58446U JP 1981094877 U JP1981094877 U JP 1981094877U JP 9487781 U JP9487781 U JP 9487781U JP S58446 U JPS58446 U JP S58446U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
hybrid integrated
circuit element
semiconductor circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981094877U
Other languages
English (en)
Inventor
赤崎　英彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1981094877U priority Critical patent/JPS58446U/ja
Priority to DE8282303178T priority patent/DE3277427D1/de
Priority to EP82303178A priority patent/EP0068753B1/en
Priority to IE1477/82A priority patent/IE53663B1/en
Publication of JPS58446U publication Critical patent/JPS58446U/ja
Priority to US06/664,931 priority patent/US4539622A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/401—Resistive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図、第２図、および第３図は本考案にかかる混成集
積回路装置の実施例図、第４図はトリミングした厚膜抵
抗基板の平面図である。図中、１はセラミック多層パッ
ケージ、２はＩＣ素子、３はキャップ、４は厚膜抵抗体
、５は厚膜抵抗基板、−６はパッケージ内の導電層、７
はパッケージの外部リード端子を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体回路素子が収納されたセミラック多層パッケージ
    に、厚膜抵抗基板が半田接合され、卵膜抵抗が前記半導
    体回路素子に導通されてなることを特徴とする混成集積
    回路装置。
JP1981094877U 1981-06-25 1981-06-25 混成集積回路装置 Pending JPS58446U (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP1981094877U JPS58446U (ja) 1981-06-25 1981-06-25 混成集積回路装置
DE8282303178T DE3277427D1 (en) 1981-06-25 1982-06-18 Hybrid integrated circuit device
EP82303178A EP0068753B1 (en) 1981-06-25 1982-06-18 Hybrid integrated circuit device
IE1477/82A IE53663B1 (en) 1981-06-25 1982-06-22 Hybrid integrated circuit device
US06/664,931 US4539622A (en) 1981-06-25 1984-10-25 Hybrid integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981094877U JPS58446U (ja) 1981-06-25 1981-06-25 混成集積回路装置

Publications (1)

Publication Number Publication Date
JPS58446U true JPS58446U (ja) 1983-01-05

Family

ID=14122275

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981094877U Pending JPS58446U (ja) 1981-06-25 1981-06-25 混成集積回路装置

Country Status (5)

Country Link
US (1) US4539622A (ja)
EP (1) EP0068753B1 (ja)
JP (1) JPS58446U (ja)
DE (1) DE3277427D1 (ja)
IE (1) IE53663B1 (ja)

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JPS5954249A (ja) * 1982-09-22 1984-03-29 Fujitsu Ltd 半導体装置
JPS59126665A (ja) * 1983-01-10 1984-07-21 Hitachi Ltd 厚膜混成集積回路
FR2550009B1 (fr) * 1983-07-29 1986-01-24 Inf Milit Spatiale Aeronaut Boitier de composant electronique muni d'un condensateur
US4860166A (en) * 1983-09-06 1989-08-22 Raytheon Company Integrated circuit termination device
FR2555394B1 (fr) * 1983-11-22 1986-03-28 Eurofarad Support pour composant rapide, notamment composant hyperfrequence, a elements de decouplage incorpores
US5476970A (en) * 1984-02-16 1995-12-19 Velsicol Chemical Corporation Method for preparing aryl ketones
US5237204A (en) * 1984-05-25 1993-08-17 Compagnie D'informatique Militaire Spatiale Et Aeronautique Electric potential distribution device and an electronic component case incorporating such a device
US4661653A (en) * 1984-12-27 1987-04-28 Seiichiro Aigo Package assembly for semiconductor device
CN1006440B (zh) * 1985-03-04 1990-01-10 奥林公司 混合与多层电路
GB8520907D0 (en) * 1985-08-21 1985-09-25 M O Valve Co Ltd Hybrid circuit packages
US4714981A (en) * 1986-04-09 1987-12-22 Rca Corporation Cover for a semiconductor package
US4774492A (en) * 1986-12-03 1988-09-27 Vtc Inc Slotted integrated circuit resistor
EP0854506A3 (en) * 1987-03-04 1999-03-31 Canon Kabushiki Kaisha Electrically connecting member and electric circuit member
US4827222A (en) * 1987-12-11 1989-05-02 Vtc Incorporated Input offset voltage trimming network and method
US4872088A (en) * 1988-08-29 1989-10-03 Motorola, Inc. Radial mounting for stacked wafer modules with cooling
US5065502A (en) * 1988-09-30 1991-11-19 Lucas Duralith Art Corporation Method for modifying electrical performance characteristics of circuit paths on circuit panels
US4914813A (en) * 1988-11-25 1990-04-10 Innovative Packing Technology Refurbishing of prior used laminated ceramic packages
US4860442A (en) * 1988-11-28 1989-08-29 Kulite Semiconductor Methods for mounting components on convoluted three-dimensional structures
US5081563A (en) * 1990-04-27 1992-01-14 International Business Machines Corporation Multi-layer package incorporating a recessed cavity for a semiconductor chip
US5065277A (en) * 1990-07-13 1991-11-12 Sun Microsystems, Inc. Three dimensional packaging arrangement for computer systems and the like
US5399903A (en) * 1990-08-15 1995-03-21 Lsi Logic Corporation Semiconductor device having an universal die size inner lead layout
US5254493A (en) * 1990-10-30 1993-10-19 Microelectronics And Computer Technology Corporation Method of fabricating integrated resistors in high density substrates
US5120572A (en) * 1990-10-30 1992-06-09 Microelectronics And Computer Technology Corporation Method of fabricating electrical components in high density substrates
US5138436A (en) * 1990-11-16 1992-08-11 Ball Corporation Interconnect package having means for waveguide transmission of rf signals
JP2612106B2 (ja) * 1991-05-07 1997-05-21 三菱電機株式会社 内燃機関用点火装置
JP2766920B2 (ja) * 1992-01-07 1998-06-18 三菱電機株式会社 Ｉｃパッケージ及びその実装方法
US5828126A (en) * 1992-06-17 1998-10-27 Vlsi Technology, Inc. Chip on board package with top and bottom terminals
US5729894A (en) * 1992-07-21 1998-03-24 Lsi Logic Corporation Method of assembling ball bump grid array semiconductor packages
US5280413A (en) * 1992-09-17 1994-01-18 Ceridian Corporation Hermetically sealed circuit modules having conductive cap anchors
US5388327A (en) * 1993-09-15 1995-02-14 Lsi Logic Corporation Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device package
US5360942A (en) * 1993-11-16 1994-11-01 Olin Corporation Multi-chip electronic package module utilizing an adhesive sheet
US5519201A (en) * 1994-04-29 1996-05-21 Us3, Inc. Electrical interconnection for structure including electronic and/or electromagnetic devices
US5579207A (en) * 1994-10-20 1996-11-26 Hughes Electronics Three-dimensional integrated circuit stacking
JP2682477B2 (ja) * 1994-11-16 1997-11-26 日本電気株式会社 回路部品の実装構造
US5542175A (en) * 1994-12-20 1996-08-06 International Business Machines Corporation Method of laminating and circuitizing substrates having openings therein
TW373308B (en) * 1995-02-24 1999-11-01 Agere Systems Inc Thin packaging of multi-chip modules with enhanced thermal/power management
US5641944A (en) * 1995-09-29 1997-06-24 Allen-Bradley Company, Inc. Power substrate with improved thermal characteristics
US5835356A (en) * 1995-09-29 1998-11-10 Allen Bradley Company, Llc Power substrate module
US5670749A (en) * 1995-09-29 1997-09-23 Allen-Bradley Company, Inc. Multilayer circuit board having a window exposing an enhanced conductive layer for use as an insulated mounting area
US5616888A (en) * 1995-09-29 1997-04-01 Allen-Bradley Company, Inc. Rigid-flex circuit board having a window for an insulated mounting area
US6377466B1 (en) * 2000-03-10 2002-04-23 Lucent Technologies Inc. Header, a method of manufacture thereof and an electronic device employing the same
JP2002026187A (ja) * 2000-07-07 2002-01-25 Sony Corp 半導体パッケージ及び半導体パッケージの製造方法
US6606510B2 (en) * 2000-08-31 2003-08-12 Mallinckrodt Inc. Oximeter sensor with digital memory encoding patient data
JP2004165501A (ja) * 2002-11-14 2004-06-10 Alps Electric Co Ltd 回路モジュール
US9731959B2 (en) * 2014-09-25 2017-08-15 Analog Devices, Inc. Integrated device packages having a MEMS die sealed in a cavity by a processor die and method of manufacturing the same
US10804188B2 (en) 2018-09-07 2020-10-13 Intel Corporation Electronic device including a lateral trace

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US3588616A (en) * 1969-01-24 1971-06-28 Sprague Electric Co Compensation substrate for dual in line package
US3665592A (en) * 1970-03-18 1972-05-30 Vernitron Corp Ceramic package for an integrated circuit
US3760090A (en) * 1971-08-19 1973-09-18 Globe Union Inc Electronic circuit package and method for making same
US3882323A (en) * 1973-12-17 1975-05-06 Us Navy Method and apparatus for protecting sensitive information contained in thin-film microelectonic circuitry
US4208698A (en) * 1977-10-26 1980-06-17 Ilc Data Device Corporation Novel hybrid packaging scheme for high density component circuits
US4225900A (en) * 1978-10-25 1980-09-30 Raytheon Company Integrated circuit device package interconnect means
US4342069A (en) * 1979-07-02 1982-07-27 Mostek Corporation Integrated circuit package
JPS5621349A (en) * 1979-07-30 1981-02-27 Fujitsu Ltd Package for integrated circuit
US4288841A (en) * 1979-09-20 1981-09-08 Bell Telephone Laboratories, Incorporated Double cavity semiconductor chip carrier
US4320438A (en) * 1980-05-15 1982-03-16 Cts Corporation Multi-layer ceramic package
US4296456A (en) * 1980-06-02 1981-10-20 Burroughs Corporation Electronic package for high density integrated circuits
JPS5764953A (en) * 1980-10-09 1982-04-20 Oki Electric Ind Co Ltd Semiconductor device
US4439754A (en) * 1981-04-03 1984-03-27 Electro-Films, Inc. Apertured electronic circuit package

Also Published As

Publication number Publication date
US4539622A (en) 1985-09-03
DE3277427D1 (en) 1987-11-05
IE53663B1 (en) 1989-01-04
EP0068753A3 (en) 1984-10-03
EP0068753A2 (en) 1983-01-05
IE821477L (en) 1982-12-25
EP0068753B1 (en) 1987-09-30

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