WO2001065601A3 - Vorrichtung zum verpacken elektronischer bauteile mittels spritzgusstechnik - Google Patents

Vorrichtung zum verpacken elektronischer bauteile mittels spritzgusstechnik Download PDF

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Publication number
WO2001065601A3
WO2001065601A3 PCT/DE2001/000778 DE0100778W WO0165601A3 WO 2001065601 A3 WO2001065601 A3 WO 2001065601A3 DE 0100778 W DE0100778 W DE 0100778W WO 0165601 A3 WO0165601 A3 WO 0165601A3
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WO
WIPO (PCT)
Prior art keywords
electronic components
injection moulding
subcarrier
moulding technology
packing electronic
Prior art date
Application number
PCT/DE2001/000778
Other languages
English (en)
French (fr)
Other versions
WO2001065601A2 (de
Inventor
Ulrich Bast
Matthias Oechsner
Georg Ernst
Thomas Zeiler
Original Assignee
Infineon Technologies Ag
Ulrich Bast
Matthias Oechsner
Georg Ernst
Thomas Zeiler
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag, Ulrich Bast, Matthias Oechsner, Georg Ernst, Thomas Zeiler filed Critical Infineon Technologies Ag
Priority to JP2001564393A priority Critical patent/JP3847166B2/ja
Priority to US10/220,752 priority patent/US7215010B2/en
Priority to EP01919152A priority patent/EP1259986A2/de
Publication of WO2001065601A2 publication Critical patent/WO2001065601A2/de
Publication of WO2001065601A3 publication Critical patent/WO2001065601A3/de

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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

Vorrichtung und Verfahren zum Verpacken elektronischer Bauteile (1) mittels Spritzgußtechnik. Dazu ist eine Vielzahl von Bauteilen (1) auf einer ersten Seite (2) eines Zwischenträgers (3) in vorbestimmten Positionen angeordnet, und der Zwischenträger (3) weist Leiterbahnen (5) mit Kontaktanschlußflächen (6) zum Verbinden mit Kontaktflächen (7) der elektronischen Bauteile (1) und Durchkontakte (8) zu Außenkontakten auf einer zweiten Seite (10) des Zwischenträgers (3) auf. Dabei ist der Zwischenträger (3) aus einem Keramiksubstrat (11), das in seinen Randbereichen (12) der ersten Seite (2) eine duktile ringförmig angeordnete Metallschicht (13) aufweist.
PCT/DE2001/000778 2000-03-03 2001-03-02 Vorrichtung zum verpacken elektronischer bauteile mittels spritzgusstechnik WO2001065601A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2001564393A JP3847166B2 (ja) 2000-03-03 2001-03-02 射出成形技術を用いて電子部品をパッケージングするデバイス
US10/220,752 US7215010B2 (en) 2000-03-03 2001-03-02 Device for packing electronic components using injection molding technology
EP01919152A EP1259986A2 (de) 2000-03-03 2001-03-02 Vorrichtung zum verpacken elektronischer bauteile mittels spritzgusstechnik

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WO2009065105A2 (en) * 2007-11-16 2009-05-22 Continental Automotive Systems Us, Inc. Thermal packaging of transmission controller using carbon composite printed circuit board material
JP5481854B2 (ja) * 2008-12-16 2014-04-23 Ｔｄｋ株式会社 電子部品
JP5514559B2 (ja) * 2010-01-12 2014-06-04 新光電気工業株式会社 配線基板及びその製造方法並びに半導体パッケージ
JP5469546B2 (ja) 2010-06-22 2014-04-16 株式会社ジェイデバイス 半導体装置の製造方法
JP5606243B2 (ja) 2010-09-24 2014-10-15 株式会社ジェイデバイス 半導体装置の製造方法
EP2799964A3 (de) * 2013-04-29 2017-04-26 Dyna Image Corporation Bewegungssensor und Verpackungsverfahren dafür
CN104123179A (zh) 2013-04-29 2014-10-29 敦南科技股份有限公司 中断控制方法及其电子系统
JP6365360B2 (ja) * 2015-03-12 2018-08-01 株式会社デンソー 電子装置及びその製造方法
CN108738366B (zh) * 2017-02-20 2022-03-15 新电元工业株式会社 电子装置
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DE10010461A1 (de) 2001-09-13
US7215010B2 (en) 2007-05-08
JP3847166B2 (ja) 2006-11-15
US20030178747A1 (en) 2003-09-25
JP2003526208A (ja) 2003-09-02
WO2001065601A2 (de) 2001-09-07
JP2005354095A (ja) 2005-12-22
EP1259986A2 (de) 2002-11-27

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