CN104123179A - 中断控制方法及其电子系统 - Google Patents
中断控制方法及其电子系统 Download PDFInfo
- Publication number
- CN104123179A CN104123179A CN201310444355.5A CN201310444355A CN104123179A CN 104123179 A CN104123179 A CN 104123179A CN 201310444355 A CN201310444355 A CN 201310444355A CN 104123179 A CN104123179 A CN 104123179A
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- Prior art keywords
- control module
- send
- look
- main computer
- computer unit
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- 238000000034 method Methods 0.000 title claims abstract description 37
- 230000008054 signal transmission Effects 0.000 claims description 52
- 238000009434 installation Methods 0.000 claims description 27
- 230000003287 optical effect Effects 0.000 claims description 5
- 230000007423 decrease Effects 0.000 abstract description 3
- 230000005540 biological transmission Effects 0.000 description 8
- 230000008569 process Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 2
- 241001269238 Data Species 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
- G01S17/50—Systems of measurement based on relative movement of target
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
- G01S7/4811—Constructional features, e.g. arrangements of optical elements common to transmitter and receiver
- G01S7/4813—Housing arrangements
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/14—Handling requests for interconnection or transfer
- G06F13/20—Handling requests for interconnection or transfer for access to input/output bus
- G06F13/24—Handling requests for interconnection or transfer for access to input/output bus using interrupt
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/0304—Detection arrangements using opto-electronic means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/033—Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor
- G06F3/0354—Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor with detection of 2D relative movements between the device, or an operating part thereof, and a plane or surface, e.g. 2D mice, trackballs, pens or pucks
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/033—Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor
- G06F3/0354—Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor with detection of 2D relative movements between the device, or an operating part thereof, and a plane or surface, e.g. 2D mice, trackballs, pens or pucks
- G06F3/03547—Touch pads, in which fingers can move on a surface
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- G06T5/94—
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
- G01J2001/4295—Photometry, e.g. photographic exposure meter using electric radiation detectors using a physical effect not covered by other subgroups of G01J1/42
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
Description
Claims (16)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/156,453 US9677930B2 (en) | 2013-04-29 | 2014-01-16 | Method of interrupt control and electronic system using the same |
EP14157572.0A EP2800001B1 (en) | 2013-04-29 | 2014-03-04 | Method of interrupt control and electronic system using the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361817306P | 2013-04-29 | 2013-04-29 | |
US61/817,306 | 2013-04-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN104123179A true CN104123179A (zh) | 2014-10-29 |
Family
ID=51768433
Family Applications (7)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310444355.5A Pending CN104123179A (zh) | 2013-04-29 | 2013-09-23 | 中断控制方法及其电子系统 |
CN201310459599.0A Pending CN104122987A (zh) | 2013-04-29 | 2013-09-29 | 光感测模块及系统 |
CN201310501209.1A Expired - Fee Related CN104122988B (zh) | 2013-04-29 | 2013-10-22 | 动作传感装置及其动作传感系统 |
CN201310501008.1A Pending CN104123180A (zh) | 2013-04-29 | 2013-10-22 | 中断控制方法及其电子系统 |
CN201310542534.2A Expired - Fee Related CN104122989B (zh) | 2013-04-29 | 2013-11-05 | 动作感测装置 |
CN201310727571.0A Pending CN104122990A (zh) | 2013-04-29 | 2013-12-25 | 动作传感器及其封装方法 |
CN201310731621.2A Pending CN104122991A (zh) | 2013-04-29 | 2013-12-26 | 动作感测装置及其封装方法 |
Family Applications After (6)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310459599.0A Pending CN104122987A (zh) | 2013-04-29 | 2013-09-29 | 光感测模块及系统 |
CN201310501209.1A Expired - Fee Related CN104122988B (zh) | 2013-04-29 | 2013-10-22 | 动作传感装置及其动作传感系统 |
CN201310501008.1A Pending CN104123180A (zh) | 2013-04-29 | 2013-10-22 | 中断控制方法及其电子系统 |
CN201310542534.2A Expired - Fee Related CN104122989B (zh) | 2013-04-29 | 2013-11-05 | 动作感测装置 |
CN201310727571.0A Pending CN104122990A (zh) | 2013-04-29 | 2013-12-25 | 动作传感器及其封装方法 |
CN201310731621.2A Pending CN104122991A (zh) | 2013-04-29 | 2013-12-26 | 动作感测装置及其封装方法 |
Country Status (2)
Country | Link |
---|---|
US (7) | US20140321700A1 (zh) |
CN (7) | CN104123179A (zh) |
Cited By (1)
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---|---|---|---|---|
CN112034468A (zh) * | 2019-05-17 | 2020-12-04 | 敦宏科技股份有限公司 | 光学近接感测装置 |
Families Citing this family (17)
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CN104123179A (zh) * | 2013-04-29 | 2014-10-29 | 敦南科技股份有限公司 | 中断控制方法及其电子系统 |
CA2973953C (en) * | 2015-01-20 | 2020-08-04 | Performance Indicator, Llc | Covert information viewing system and method of covert information processing |
CN105094465B (zh) * | 2015-08-12 | 2018-02-02 | 小米科技有限责任公司 | 环境光测量方法及装置 |
US20170153708A1 (en) * | 2015-11-29 | 2017-06-01 | Tusher Chakraborty | Secured and Noise-suppressed Multidirectional Gesture Recognition |
US9933601B2 (en) * | 2015-12-16 | 2018-04-03 | Intel Corporation | Stacked wafer lens and camera |
CN105527627A (zh) * | 2016-01-18 | 2016-04-27 | 深圳市金立通信设备有限公司 | 激光测距装置、摄像装置及终端 |
TWM520196U (zh) * | 2016-01-27 | 2016-04-11 | 精材科技股份有限公司 | 一種晶片尺寸等級的感測晶片封裝體 |
EP3440998B1 (en) * | 2016-04-04 | 2022-11-16 | Kyocera Corporation | Measurement sensor package and measurement sensor |
US20180017741A1 (en) * | 2016-07-15 | 2018-01-18 | Advanced Semiconductor Engineering, Inc. | Semiconductor package device and method of manufacturing the same |
CN108269796B (zh) * | 2016-12-30 | 2020-09-01 | 菱生精密工业股份有限公司 | 远距离传感器的封装结构及其封装方法 |
WO2018143981A1 (en) | 2017-02-01 | 2018-08-09 | Hewlett-Packard Development Company, L.P. | Intrusion detections with ambient light sensors and super input/output circuits |
CN107273198B (zh) * | 2017-06-16 | 2018-12-18 | 北京得瑞领新科技有限公司 | 一种ssd控制芯片的中断控制方法、装置及ssd设备 |
CN107706703B (zh) * | 2017-09-30 | 2019-07-26 | 维沃移动通信有限公司 | 一种激光光路控制方法、装置和移动终端 |
CN108876964A (zh) * | 2018-07-17 | 2018-11-23 | 深圳市鑫华锋科技有限公司 | 应用于行车记录仪的抓拍方法及系统 |
US11322630B2 (en) * | 2019-09-23 | 2022-05-03 | Apple Inc. | Monolithic infrared transceiver |
US20210109887A1 (en) * | 2020-08-19 | 2021-04-15 | Intel Corporation | I3c pending read with retransmission |
WO2022071683A1 (en) * | 2020-09-29 | 2022-04-07 | Samsung Electronics Co., Ltd. | Method and iot controller device for context-based task management in iot network |
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CN104122987A (zh) | 2014-10-29 |
CN104122990A (zh) | 2014-10-29 |
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CN104122989B (zh) | 2017-06-30 |
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CN104122991A (zh) | 2014-10-29 |
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US20140321700A1 (en) | 2014-10-30 |
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CN104122988A (zh) | 2014-10-29 |
US20140320407A1 (en) | 2014-10-30 |
US9377354B2 (en) | 2016-06-28 |
CN104122989A (zh) | 2014-10-29 |
US20140325108A1 (en) | 2014-10-30 |
CN104123180A (zh) | 2014-10-29 |
US20140325109A1 (en) | 2014-10-30 |
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