CN104122991A - 动作感测装置及其封装方法 - Google Patents

动作感测装置及其封装方法 Download PDF

Info

Publication number
CN104122991A
CN104122991A CN201310731621.2A CN201310731621A CN104122991A CN 104122991 A CN104122991 A CN 104122991A CN 201310731621 A CN201310731621 A CN 201310731621A CN 104122991 A CN104122991 A CN 104122991A
Authority
CN
China
Prior art keywords
sensing
fixed bed
substrate
action
sensing cell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310731621.2A
Other languages
English (en)
Inventor
谢明勋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lite On Semiconductor Corp
Original Assignee
Dunnan Science And Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dunnan Science And Tech Co Ltd filed Critical Dunnan Science And Tech Co Ltd
Priority to EP14166259.3A priority Critical patent/EP2799963A3/en
Priority to US14/262,819 priority patent/US9297695B2/en
Publication of CN104122991A publication Critical patent/CN104122991A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
    • G01S17/50—Systems of measurement based on relative movement of target
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G01S7/4811—Constructional features, e.g. arrangements of optical elements common to transmitter and receiver
    • G01S7/4813—Housing arrangements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/14—Handling requests for interconnection or transfer
    • G06F13/20—Handling requests for interconnection or transfer for access to input/output bus
    • G06F13/24—Handling requests for interconnection or transfer for access to input/output bus using interrupt
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/0304—Detection arrangements using opto-electronic means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/033—Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor
    • G06F3/0354—Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor with detection of 2D relative movements between the device, or an operating part thereof, and a plane or surface, e.g. 2D mice, trackballs, pens or pucks
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/033—Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor
    • G06F3/0354—Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor with detection of 2D relative movements between the device, or an operating part thereof, and a plane or surface, e.g. 2D mice, trackballs, pens or pucks
    • G06F3/03547—Touch pads, in which fingers can move on a surface
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T5/00—Image enhancement or restoration
    • G06T5/90—Dynamic range modification of images or parts thereof
    • G06T5/94—Dynamic range modification of images or parts thereof based on local image properties, e.g. for local contrast enhancement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
    • G01J2001/4295—Photometry, e.g. photographic exposure meter using electric radiation detectors using a physical effect not covered by other subgroups of G01J1/42
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Human Computer Interaction (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Bus Control (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Geophysics And Detection Of Objects (AREA)
  • Position Input By Displaying (AREA)
  • User Interface Of Digital Computer (AREA)
  • Light Receiving Elements (AREA)
  • Selective Calling Equipment (AREA)
  • Communication Control (AREA)

Abstract

本发明公开了一种动作感测装置及其封装方法，该装置用于感测红外线光源，包含有一基板；一感测单元，设置于该基板上，用来感测红外线光源；一固定层，覆盖于该感测单元之上，用来固定并保护该感测单元，具有一开口；一防护层，形成于该开口之上；以及一镀膜层，覆盖于该固定层，用来吸收红外线光源，其中，该镀膜层未覆盖于该开口。

Description

动作感测装置及其封装方法
【技术领域】
本发明相关于一种动作感测装置及其封装方法，尤指一种通过侦测红外光感测物体位移及动作的动作感测装置及其封装方法。 
【背景技术】
随着科技的进步，电脑系统在日常生活中所扮演的角色，已从过去单纯的字处理、程序运算，到今天复杂的影音视讯、电玩娱乐，因而成为现代信息社会中最重要的工具之一。而担负起接口控制的输入设备的技术，也推陈出新的不断进化。 
许多电脑系统皆配备有多元化的功能，因此，必须使用各种感测装置来进行周边环境的侦测，以进行相对应的应用。其中，动作感测装置可将用户的动作转换成讯号，提供具有运算能力的电子装置运用，以控制如显示设备上图形光标或指针的移动、搭配图形用户接口在显示设备上选取对象及执行控制的功能等，使得用户可以藉此装置与电脑系统进行直接的互动。在此情形下，如何实现动作感测装置也就成为业界所努力的目标之一。 
【发明内容】
因此，本发明提供一种通过侦测红外光感测物体位移及动作的动作感测装置及其封装方法。 
本发明揭露一种动作感测装置，用于感测红外线光源，包含有一基板；一感测单元，设置于该基板上，用来感测红外线光源；一固定层，覆盖于该感测单元之上，用来固定并保护该感测单元，具有一开口；一防护层，形成于该开口之上；以及一镀膜层，覆盖于该固定层，用来吸收红外线光源，其中，该镀膜层未覆盖于该开口。 
本发明另揭露一种封装方法，用于一动作感测装置，包含有设置一感测单元于一基板上；以复数条连接线接合该感测单元及该基板；形成一固定层，以覆盖该感测单元；进行一半切割程序，以于该固定层形成一开口；于该开口注入一材质，以形成一防护层；以及进行镀膜，以使一镀膜层覆盖于该固定层，其中该镀膜层未覆盖于该开口。 
【附图说明】
图1为本发明实施例一动作感测装置的示意图。 
图2为本发明实施例另一动作感测装置的示意图。 
图3-1为本发明实施例复数个动作感测装置之示意图的俯视图。 
图3-2为本发明实施例复数个动作感测装置之示意图的侧视图。 
图4为本发明实施例一流程的流程图。 
【主要元件符号说明】 
10                                  动作感测装置 
100                                 基板 
102                                 感测单元 
104                                 固定层 
106                                 防护层 
108                                 镀膜层 
110                                 开口 
200                                 透镜单元 
40                                  封装流程 
400～414                            步骤 
BW                                  焊线 
【具体实施方式】
请参考图1，图1为本发明实施例一动作感测装置10的剖面图。动作感测装置10包含一基板100、一感测单元102、一固定层104、一保护层106以及一镀膜层108。感测单元102设置于基板100上，用来接收红外光，以侦测外界物体的移动及位移。固定层104覆盖于感测单元102之上，用来固定并保护感测单元102。此外，固定层104具有一开口110，用来设置保护层106。镀膜层108覆盖于固定层104，用来阻隔额外的红外光入射至感测单元102。值得注意的是，镀膜层108未覆盖于开口110（即未阻挡光线由开口110入射至感测单元102之路径），以确保动作感测装置10正常运作。如此一来，此实施例即可实现用来感测物体位移及动作的动作感测装置10。 
详细来说，基板100可为一印刷电路板（printed circuit board，PCB）或是由导线架（lead frame）所形成的基板，但不限于此。在图1中，感测单元102为一芯片，其通过复数条焊线（Bonding Wire）连接至基板100上的接点（Pad），以进行讯号传输。需注意的是，图1中仅绘示两条焊线BW作为代表。基板100上所有焊线与接点的材 质皆可为金、铜或铝等导电材料。固定层104形成于感测单元102的上方，其系以如硅树脂（Silicone）、环氧化物（Epoxy）或紫外线硬化胶（UV Curable Adhesive）等可通过红外光的透光胶所组成。通过一半切割（half-cutting）程序，固定层104之上方可形成一开口110。防护层106系设置（如注入）于固定层104上的开口110，其可由可通过红外光的透光胶（如硅树脂）所形成。 
最后，由于感测单元102进行物体感测之运作系通过红外光的侦测来完成，因此感测单元102对于周围任何红外光的变化皆十分敏感。在此状况下，须使用包含有阻挡红外光的成分的镀膜层108覆盖于固定层104，以阻挡位于特定频率范围的红外光进入，从而避免影响感测单元102的感测结果。需注意的是，镀膜层108未覆盖于防护层106（即开口110），以确保红外光入射至感测单元102的路径。此外，形成镀膜层108之方式亦未有所限。举例来说，镀膜层108可经由旋转镀膜（spin coating）程序而形成于固定层104之外围。如此一来，感测单元102可接收经由开口110入射的红外光，从而感测外界物体的位移及动作。举例来说，由于外界物体的位置和形状的不同，外界物体反射的光线也会有所不同。因此，动作感测装置10可通过感测物体反射的红外光，得知物体的位移及动作。其中，感测单元102所接收的红外光可由一红外光发射单元（未绘示于图1）所产生，但不限于此。 
值得注意的是，本发明提供一种通过简洁程序实现的动作感测装置。根据不同应用及设计理念，本领域具通常知识者应可实施合适的更动及修改。举例来说，感测单元102可改为通过接收如紫外光、可见光等不同频率范围的光线，来进行感测物体的运作。需注意的是，当感测单元102接收的光线的频率范围改变时，镀膜层108吸收的光线的频率范围亦需被相对应修改，以避免影响感测单元102的感测结果。 
请参考图2，图2为本发明实施例一动作感测装置20的示意图。动作感测装置20类似于图1所示的动作感测装置10，因此具有相似功能的元件沿用相同的符号。不同于动作感测装置10，动作感测装置20于感测单元102之上方（固定层104内）新增一透镜单元200。透镜单元200用来聚集光线，以使感测单元102之运作更有效率。根据不同应用，透镜单元200可为以不同方式形成之透镜元件。举例来说，透镜单元200可为一晶圆级透镜（Wafer Level Lens），从而利用晶圆级制造技术来降低成本。 
在上述实施例中，皆以单颗动作感测装置来描述其架构及封装方式。一般来说， 厂商在制作动作感测装置的封装体时，是一层一层地铺设整片封装材料，同时生产多个封装体，再逐一切割为个别的封装体。请参考图3-1和图3-2，图3-1和图3-2为本发明实施例复数个动作感测装置之上视图及侧视图。。根据不同应用，上述实施例所揭露之动作感测装置可以不同的封装方式进行封装。举例来说，于动作传感器进行封装时，一感测单元首先被设置于一基板上，并通过复数条焊线连接至基板上的接点，从而形成讯号传输路径。接下来，藉由进行封装程序形成覆盖于感测单元上方的一固定层，以保护并固定感测单元。随后，进行一半切割（half-cutting）程序，以于固定层之上方形成一开口。于固定层形成开口之后，接着注入透光胶（如硅树脂），以于开口内形成一保护层。最后，通过执行镀膜程序（如旋转镀膜），可于固定层之外部形成一镀膜层。需注意的是，镀膜层未覆盖于固定层之开口。通过上述步骤，可取得如图3-1和图3-2所示的复数个封装体（即动作感测装置）。在图3-1和图3-2中，每一方格皆为一个封装体，经由切割即可形成个别的动作感测装置。 
关于上述动作感测装置之封装方式可归纳为一封装流程40，如图4所示。封装流程40包含以下步骤： 
步骤400：开始。 
步骤402：设置一感测单元于一基板上。 
步骤404：以复数条连接线接合该感测单元及该基板。 
步骤406：形成一固定层，以覆盖该感测单元。 
步骤408：进行一半切割程序，以于该固定层形成一开口。 
步骤410：于该开口注入一材质，以形成一防护层。 
步骤412：进行镀膜，以使一镀膜层覆盖于该固定层，其中该镀膜层未覆盖于该开口。 
步骤414：结束。 
根据流程40，可取得如图3-1和图3-2所示复数个动作感测装置。于进行封装切割后，即可获得单一的动作感测装置。关于流程40的详细运作过程可参考上述，为求简洁，在此不赘述。 
综上所述，上述实施例所揭露的封装方法利用简洁的制程，实现藉由侦测红外光感测物体位移及动作的动作感测装置。藉此，本发明可以低廉的成本，实现高精准度的动作感测装置。 
以上所述仅为本发明之较佳实施例，凡依本发明申请专利范围所做之均等变化与修饰，皆应属本发明之涵盖范围。 

Claims (8)

1.一种动作感测装置，用于感测红外线光源，包含有：
一基板；
一感测单元，设置于该基板上，用来感测红外线光源；
一固定层，覆盖于该感测单元之上，用来固定并保护该感测单元，具有一开口；
一防护层，形成于该开口之上；以及
一镀膜层，覆盖于该固定层，用来吸收红外线光源，其中，该镀膜层未覆盖于该开口。
2.如权利要求1所述的动作感测装置，另包含有：
一透镜单元，设置于该感测单元的上方及该固定层之中。
3.如权利要求1所述的动作感测装置，其中该固定层之材质包含有硅树脂、环氧化物及紫外线硬化胶中其中一者。
4.如权利要求1所述的动作感测装置，其中该防护层之材质包含有硅树脂。
5.一种封装方法，用于一动作感测装置，包含有：
设置一感测单元于一基板上；
以复数条连接线接合该感测单元及该基板；
形成一固定层，以覆盖该感测单元；
进行一半切割程序，以于该固定层形成一开口；
于该开口注入一材质，以形成一防护层；以及
进行镀膜，以使一镀膜层覆盖于该固定层，其中该镀膜层未覆盖于该开口。
6.如权利要求5所述的封装方法，其中于以复数条连接线接合该感测单元及该基板后，该封装方法另包含有：
于该感测单元之上方，设置一透镜单元。
7.如权利要求5所述的封装方法，其中该固定层的材质包含有硅树脂、环氧化物及紫外线硬化胶中其中一者。
8.如权利要求5所述的封装方法，其中该材质包含有硅树脂。
CN201310731621.2A 2013-04-29 2013-12-26 动作感测装置及其封装方法 Pending CN104122991A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP14166259.3A EP2799963A3 (en) 2013-04-29 2014-04-28 Motion Sensing Device and Packaging Method thereof
US14/262,819 US9297695B2 (en) 2013-04-29 2014-04-28 Motion sensing device and packaging method thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361817306P 2013-04-29 2013-04-29
US61/817,306 2013-04-29

Publications (1)

Publication Number Publication Date
CN104122991A true CN104122991A (zh) 2014-10-29

Family

ID=51768433

Family Applications (7)

Application Number Title Priority Date Filing Date
CN201310444355.5A Pending CN104123179A (zh) 2013-04-29 2013-09-23 中断控制方法及其电子系统
CN201310459599.0A Pending CN104122987A (zh) 2013-04-29 2013-09-29 光感测模块及系统
CN201310501008.1A Pending CN104123180A (zh) 2013-04-29 2013-10-22 中断控制方法及其电子系统
CN201310501209.1A Expired - Fee Related CN104122988B (zh) 2013-04-29 2013-10-22 动作传感装置及其动作传感系统
CN201310542534.2A Expired - Fee Related CN104122989B (zh) 2013-04-29 2013-11-05 动作感测装置
CN201310727571.0A Pending CN104122990A (zh) 2013-04-29 2013-12-25 动作传感器及其封装方法
CN201310731621.2A Pending CN104122991A (zh) 2013-04-29 2013-12-26 动作感测装置及其封装方法

Family Applications Before (6)

Application Number Title Priority Date Filing Date
CN201310444355.5A Pending CN104123179A (zh) 2013-04-29 2013-09-23 中断控制方法及其电子系统
CN201310459599.0A Pending CN104122987A (zh) 2013-04-29 2013-09-29 光感测模块及系统
CN201310501008.1A Pending CN104123180A (zh) 2013-04-29 2013-10-22 中断控制方法及其电子系统
CN201310501209.1A Expired - Fee Related CN104122988B (zh) 2013-04-29 2013-10-22 动作传感装置及其动作传感系统
CN201310542534.2A Expired - Fee Related CN104122989B (zh) 2013-04-29 2013-11-05 动作感测装置
CN201310727571.0A Pending CN104122990A (zh) 2013-04-29 2013-12-25 动作传感器及其封装方法

Country Status (2)

Country Link
US (7) US20140321700A1 (zh)
CN (7) CN104123179A (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104123179A (zh) * 2013-04-29 2014-10-29 敦南科技股份有限公司 中断控制方法及其电子系统
US10649199B2 (en) * 2015-01-20 2020-05-12 Bambu Vault Llc Covert information viewing system and method of covert information processing
CN105094465B (zh) * 2015-08-12 2018-02-02 小米科技有限责任公司 环境光测量方法及装置
US20170153708A1 (en) * 2015-11-29 2017-06-01 Tusher Chakraborty Secured and Noise-suppressed Multidirectional Gesture Recognition
US9933601B2 (en) * 2015-12-16 2018-04-03 Intel Corporation Stacked wafer lens and camera
CN105527627A (zh) * 2016-01-18 2016-04-27 深圳市金立通信设备有限公司 激光测距装置、摄像装置及终端
TWM520196U (zh) * 2016-01-27 2016-04-11 精材科技股份有限公司 一種晶片尺寸等級的感測晶片封裝體
WO2017175504A1 (ja) 2016-04-04 2017-10-12 京セラ株式会社 計測センサ用パッケージおよび計測センサ
US20180017741A1 (en) * 2016-07-15 2018-01-18 Advanced Semiconductor Engineering, Inc. Semiconductor package device and method of manufacturing the same
CN108269796B (zh) * 2016-12-30 2020-09-01 菱生精密工业股份有限公司 远距离传感器的封装结构及其封装方法
CN110199290B (zh) 2017-02-01 2024-03-22 惠普发展公司，有限责任合伙企业 利用环境光传感器和超级输入/输出电路的侵入检测系统
CN107273198B (zh) * 2017-06-16 2018-12-18 北京得瑞领新科技有限公司 一种ssd控制芯片的中断控制方法、装置及ssd设备
CN107706703B (zh) * 2017-09-30 2019-07-26 维沃移动通信有限公司 一种激光光路控制方法、装置和移动终端
CN108876964A (zh) * 2018-07-17 2018-11-23 深圳市鑫华锋科技有限公司 应用于行车记录仪的抓拍方法及系统
CN112034468A (zh) * 2019-05-17 2020-12-04 敦宏科技股份有限公司 光学近接感测装置
US11322630B2 (en) * 2019-09-23 2022-05-03 Apple Inc. Monolithic infrared transceiver
US12013806B2 (en) 2020-08-19 2024-06-18 Intel Corporation I3C pending read with retransmission
WO2022071683A1 (en) * 2020-09-29 2022-04-07 Samsung Electronics Co., Ltd. Method and iot controller device for context-based task management in iot network

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1525206A (zh) * 2003-02-26 2004-09-01 台达电子工业股份有限公司 一种投影机的照明系统
CN101039381A (zh) * 2006-03-17 2007-09-19 鸿富锦精密工业（深圳）有限公司 影像感测模块及其制造方法
CN101063742A (zh) * 2006-04-27 2007-10-31 上海乐金广电电子有限公司 影像光拾取器透镜
US20090045498A1 (en) * 2007-08-13 2009-02-19 Braden Jeffrey S Partitioning of electronic packages
CN101539651A (zh) * 2008-03-21 2009-09-23 富港电子（东莞）有限公司 照相模组及其制造方法
CN101901083A (zh) * 2009-05-25 2010-12-01 原相科技股份有限公司 连接光传感器与基板的连接器以及光传感器的制作方法
CN201845786U (zh) * 2010-07-22 2011-05-25 原相科技股份有限公司 感测装置及其影像感测模块
US20110204209A1 (en) * 2009-07-29 2011-08-25 Geoffrey Louis Barrows Low profile camera and vision sensor
US20130026591A1 (en) * 2011-07-27 2013-01-31 Sony Corporation Solid-state image pickup apparatus

Family Cites Families (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4866571A (en) * 1982-06-21 1989-09-12 Olin Corporation Semiconductor package
US5317149A (en) 1992-11-12 1994-05-31 Hewlett-Packard Company Optical encoder with encapsulated electrooptics
DE10010461A1 (de) 2000-03-03 2001-09-13 Infineon Technologies Ag Vorrichtung zum Verpacken elektronischer Bauteile mittels Spritzgußtechnik
US7348957B2 (en) * 2003-02-14 2008-03-25 Intel Corporation Real-time dynamic design of liquid crystal display (LCD) panel power management through brightness control
JP4016275B2 (ja) * 2003-06-25 2007-12-05 富士電機デバイステクノロジー株式会社 測距装置
JP2006038572A (ja) 2004-07-26 2006-02-09 Sharp Corp 反射型エンコーダおよびこの反射型エンコーダを用いた電子機器
US7103693B2 (en) * 2004-09-30 2006-09-05 International Business Machines Corporation Method for applying interrupt coalescing to incoming messages based on message length
US7617980B2 (en) 2005-04-25 2009-11-17 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Integrated optical module for reflectance sensing
CN100447748C (zh) * 2005-08-31 2008-12-31 上海海尔集成电路有限公司 一种中断系统实现方法
CN101009779B (zh) * 2006-01-24 2010-06-16 采钰科技股份有限公司 高精密度成像控制的影像感应模块
TWM298226U (en) 2006-04-14 2006-09-21 Lite On Semiconductor Corp Encapsulation structure of optically movement detection
US7966263B2 (en) * 2006-05-04 2011-06-21 First Data Corporation Wireless phone RF presentation instrument with sensor control
US8094129B2 (en) * 2006-11-27 2012-01-10 Microsoft Corporation Touch sensing using shadow and reflective modes
US7842957B2 (en) 2007-03-08 2010-11-30 Avago Technologies Ecbu Ip (Singapore) Pte, Ltd. Optical transceiver with reduced height
DE102007023893A1 (de) * 2007-05-23 2008-11-27 Robert Bosch Gmbh Interrupt-Controller, insbesondere für ein ASIC und ASIC mit einem derartigen Interrupt-Controller
TW200907396A (en) 2007-08-03 2009-02-16 Largan Precision Co Ltd Multilayer film vacuum evaporation method for a plastic optic assemble and optical image capture fro the same
US8432372B2 (en) * 2007-11-30 2013-04-30 Microsoft Corporation User input using proximity sensing
EP2227899B1 (en) * 2007-12-17 2015-01-21 Omnivision Technologies, Inc. Reflowable camera module with integrated flash
CN101509787B (zh) 2008-02-14 2011-06-08 敦南科技股份有限公司 电磁波感测装置
KR20090108233A (ko) * 2008-04-11 2009-10-15 삼성전자주식회사 카메라 모듈의 제조 방법, 이에 의해 제작된 카메라 모듈및 상기 카메라 모듈을 포함하는 전자 시스템
TWI398934B (zh) 2008-04-15 2013-06-11 Analog Devices Inc 晶圓級ｃｓｐ感測器
US20110260176A1 (en) * 2008-05-12 2011-10-27 Pioneer Corporation Light-emitting sensor device and method for manufacturing the same
US8971565B2 (en) 2008-05-29 2015-03-03 Hie-D Technologies, Llc Human interface electronic device
US8068641B1 (en) 2008-06-19 2011-11-29 Qualcomm Incorporated Interaction interface for controlling an application
KR20100081052A (ko) * 2009-01-05 2010-07-14 삼성전자주식회사 근접 센서를 이용한 감지 장치 및 이를 구비하는 휴대 단말기
JP5283078B2 (ja) * 2009-01-13 2013-09-04 セイコーインスツル株式会社 検出回路及びセンサ装置
TWM363080U (en) 2009-01-21 2009-08-11 Pixart Imaging Inc Packaging structure
US7763841B1 (en) 2009-05-27 2010-07-27 Microsoft Corporation Optical component for a depth sensor
US8957380B2 (en) 2009-06-30 2015-02-17 Avago Technologies General Ip (Singapore) Pte. Ltd. Infrared attenuating or blocking layer in optical proximity sensor
TWI396113B (zh) 2009-09-10 2013-05-11 Pegatron Corp 光學控制裝置及方法
US8097852B2 (en) 2009-09-10 2012-01-17 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Multiple transfer molded optical proximity sensor and corresponding method
KR101291319B1 (ko) * 2009-09-18 2013-07-30 한국전자통신연구원 테라헤르츠파 발생/검출기 및 그의 제조방법
US8304850B2 (en) 2009-12-22 2012-11-06 Texas Instruments Incorporated Integrated infrared sensors with optical elements, and methods
CN102194835A (zh) * 2010-03-01 2011-09-21 奇景光电股份有限公司 晶圆级镜头模块及其制造方法、晶圆级摄影机
US8384559B2 (en) * 2010-04-13 2013-02-26 Silicon Laboratories Inc. Sensor device with flexible interface and updatable information store
JP2011227574A (ja) * 2010-04-15 2011-11-10 Rohm Co Ltd 演算装置、動き検出装置、電子機器
US20110298708A1 (en) 2010-06-07 2011-12-08 Microsoft Corporation Virtual Touch Interface
KR101691616B1 (ko) * 2010-07-27 2017-01-02 삼성디스플레이 주식회사 표시패널 및 그 제조방법
US8692366B2 (en) 2010-09-30 2014-04-08 Analog Device, Inc. Apparatus and method for microelectromechanical systems device packaging
CN201853708U (zh) 2010-10-22 2011-06-01 菱光科技股份有限公司 影像感测装置
CN102055844B (zh) 2010-11-15 2013-05-15 惠州Tcl移动通信有限公司 一种通过手势识别实现照相机快门功能的方法及手机装置
US8604436B1 (en) 2011-03-24 2013-12-10 Maxim Integrated Products, Inc. Proximity sensor device
TWI416473B (zh) * 2011-04-08 2013-11-21 Quanta Comp Inc 多模式顯示裝置及其省電方法
US9335183B2 (en) * 2011-04-12 2016-05-10 International Business Machines Corporation Method for reliably operating a sensor
TWI472987B (zh) * 2011-04-15 2015-02-11 Pixart Imaging Inc 光學式觸控板及手持式電子裝置
US8713235B2 (en) * 2011-05-02 2014-04-29 Fairchild Semiconductor Corporation Low latency interrupt collector
US9075182B2 (en) * 2011-06-03 2015-07-07 VisEra Technology Company Limited Camera module and spacer of a lens structure in the camera module
JP5794002B2 (ja) * 2011-07-07 2015-10-14 ソニー株式会社 固体撮像装置、電子機器
US8619267B2 (en) 2011-07-08 2013-12-31 Avago Technologies General Ip (Singapore) Pte. Ltd. Proximity sensor with motion detection
TW201310102A (zh) 2011-08-17 2013-03-01 Pixart Imaging Inc 鏡頭模組及其製造方法
CN102999225A (zh) * 2011-09-14 2013-03-27 原相科技股份有限公司 具轨迹检测功能的光学触控系统及方法
FR2980599B1 (fr) 2011-09-27 2014-05-09 Isorg Surface imprimee interactive
US8976135B2 (en) * 2011-10-13 2015-03-10 Autodesk, Inc. Proximity-aware multi-touch tabletop
CN103066080B (zh) * 2011-10-21 2016-02-03 奇景光电股份有限公司 光感测模组的制作方法
JP6338533B2 (ja) 2011-12-22 2018-06-06 ヘプタゴン・マイクロ・オプティクス・プライベート・リミテッドＨｅｐｔａｇｏｎ Ｍｉｃｒｏ Ｏｐｔｉｃｓ Ｐｔｅ． Ｌｔｄ． 光電子モジュール、特にフラッシュモジュールおよびそれらの製造方法
US8735795B2 (en) * 2012-01-20 2014-05-27 Omnivision Technologies, Inc. Image sensor with integrated ambient light detection
TWI453923B (zh) 2012-06-22 2014-09-21 Txc Corp Light sensing chip package structure
US20140014839A1 (en) * 2012-07-11 2014-01-16 Tom Chang Sensor design based on light sensing
US20140118257A1 (en) * 2012-10-29 2014-05-01 Amazon Technologies, Inc. Gesture detection systems
CN104123179A (zh) * 2013-04-29 2014-10-29 敦南科技股份有限公司 中断控制方法及其电子系统
TWI527166B (zh) 2013-07-25 2016-03-21 The package structure of the optical module

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1525206A (zh) * 2003-02-26 2004-09-01 台达电子工业股份有限公司 一种投影机的照明系统
CN101039381A (zh) * 2006-03-17 2007-09-19 鸿富锦精密工业（深圳）有限公司 影像感测模块及其制造方法
CN101063742A (zh) * 2006-04-27 2007-10-31 上海乐金广电电子有限公司 影像光拾取器透镜
US20090045498A1 (en) * 2007-08-13 2009-02-19 Braden Jeffrey S Partitioning of electronic packages
CN101539651A (zh) * 2008-03-21 2009-09-23 富港电子（东莞）有限公司 照相模组及其制造方法
CN101901083A (zh) * 2009-05-25 2010-12-01 原相科技股份有限公司 连接光传感器与基板的连接器以及光传感器的制作方法
US20110204209A1 (en) * 2009-07-29 2011-08-25 Geoffrey Louis Barrows Low profile camera and vision sensor
CN201845786U (zh) * 2010-07-22 2011-05-25 原相科技股份有限公司 感测装置及其影像感测模块
US20130026591A1 (en) * 2011-07-27 2013-01-31 Sony Corporation Solid-state image pickup apparatus

Also Published As

Publication number Publication date
CN104122988A (zh) 2014-10-29
US9377354B2 (en) 2016-06-28
US20140319328A1 (en) 2014-10-30
US9006850B2 (en) 2015-04-14
US20140321700A1 (en) 2014-10-30
CN104122990A (zh) 2014-10-29
CN104122989A (zh) 2014-10-29
US20140319636A1 (en) 2014-10-30
CN104122988B (zh) 2017-04-12
US20140325108A1 (en) 2014-10-30
CN104123179A (zh) 2014-10-29
US20140320407A1 (en) 2014-10-30
CN104122987A (zh) 2014-10-29
CN104122989B (zh) 2017-06-30
US9297695B2 (en) 2016-03-29
US20140325109A1 (en) 2014-10-30
US9677930B2 (en) 2017-06-13
CN104123180A (zh) 2014-10-29
US20140319348A1 (en) 2014-10-30

Similar Documents

Publication Publication Date Title
CN104122991A (zh) 动作感测装置及其封装方法
CN105679753B (zh) 光学模块、其制造方法及电子装置
US10061965B2 (en) Fingerprint sensing unit and fingerprint sensing module
US9934419B2 (en) Package structure, electronic device and method for manufacturing package structure
US9679188B2 (en) Fingerprint sensor packaging module and manufacturing method thereof
CN205427873U (zh) 指纹感测单元及指纹感测模块
CN106558572A (zh) 指纹感测封装模块及其制造方法
TW201403432A (zh) 觸控面板及其製作方法與觸控顯示面板
US10043924B1 (en) Low cost optical sensor package
TW201505132A (zh) 光學模組的封裝結構
CN205248264U (zh) 指纹感测封装模块
US20180217691A1 (en) Flexible Touch Screen, Method For Manufacturing the Same and Touch Device
CN105789065B (zh) 一种芯片封装结构、终端设备及方法
TW201532205A (zh) 微機電晶片封裝及其製造方法
TWI504013B (zh) 感應器單元的製造方法
CN205845930U (zh) 一种芯片封装结构及终端设备
CN114184653A (zh) 一种气体传感器及其封装方法
TWM449351U (zh) 感測器封裝模組
KR20150046598A (ko) 가스센서패키지
TW201812336A (zh) 指紋檢測裝置、使用其之行動裝置以及其製造方法
CN106056032A (zh) 复合基板感测装置及其制造方法
EP2799963A2 (en) Motion Sensing Device and Packaging Method thereof
KR20080093856A (ko) 직물형 반도체 소자 패키지와 그 설치방법 및 제조방법
CN208674109U (zh) 一种光学生物识别芯片封装结构
EP2804077A2 (en) Motion Sensing Device

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Owner name: DYNA TECHNOLOGY CO., LTD.

Free format text: FORMER OWNER: DUNNAN SCIENCE AND TECH. CO., LTD.

Effective date: 20150311

C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20150311

Address after: Chinese Taiwan New Taipei City

Applicant after: Lite-on Semiconductor Corp.

Address before: Chinese Taiwan New Taipei City

Applicant before: Dunnan Science and Tech. Co., Ltd.

WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20141029