KR101037616B1 - 형광체와 그 제조방법, 조명기구, 및 화상표시장치 - Google Patents

형광체와 그 제조방법, 조명기구, 및 화상표시장치 Download PDF

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KR101037616B1
KR101037616B1 KR1020067018045A KR20067018045A KR101037616B1 KR 101037616 B1 KR101037616 B1 KR 101037616B1 KR 1020067018045 A KR1020067018045 A KR 1020067018045A KR 20067018045 A KR20067018045 A KR 20067018045A KR 101037616 B1 KR101037616 B1 KR 101037616B1
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phosphor
light
lighting fixtures
wavelength
crystal
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KR20070021140A (ko
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나오토 히로사키
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도쿠리츠교세이호징 붓시쯔 자이료 겐큐키코
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Families Citing this family (162)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3837588B2 (ja) 2003-11-26 2006-10-25 独立行政法人物質・材料研究機構 蛍光体と蛍光体を用いた発光器具
JP3931239B2 (ja) * 2004-02-18 2007-06-13 独立行政法人物質・材料研究機構 発光素子及び照明器具
JP3921545B2 (ja) * 2004-03-12 2007-05-30 独立行政法人物質・材料研究機構 蛍光体とその製造方法
EP2113549B1 (en) 2004-04-27 2011-12-28 Panasonic Corporation Phosphor composition and light-emitting device using the same
JP4128564B2 (ja) * 2004-04-27 2008-07-30 松下電器産業株式会社 発光装置
JP4583076B2 (ja) * 2004-06-11 2010-11-17 スタンレー電気株式会社 発光素子
JP2006282872A (ja) * 2005-03-31 2006-10-19 Dowa Mining Co Ltd 窒化物蛍光体または酸窒化物蛍光体、及びその製造方法、並びに当該蛍光体を用いた発光装置
JP4104013B2 (ja) * 2005-03-18 2008-06-18 株式会社フジクラ 発光デバイス及び照明装置
US8269410B2 (en) 2005-03-18 2012-09-18 Mitsubishi Chemical Corporation Light-emitting device, white light-emitting device, illuminator, and image display
US7846351B2 (en) 2005-03-22 2010-12-07 National Institute For Materials Science Fluorescent substance, process for producing the same, and luminescent device
EP1867698B1 (en) 2005-03-22 2010-06-30 National Institute for Materials Science Phosphor and process for producing the same
JP2006273929A (ja) * 2005-03-28 2006-10-12 Futaba Corp 電子線励起用蛍光体及び電子線励起蛍光発光素子
KR100899401B1 (ko) * 2005-05-12 2009-05-26 도쿠리츠교세이호징 붓시쯔 자이료 겐큐키코 β형 사이알론 형광체
CN101175835B (zh) 2005-05-24 2012-10-10 三菱化学株式会社 荧光体及其应用
JP2007049114A (ja) 2005-05-30 2007-02-22 Sharp Corp 発光装置とその製造方法
KR101201266B1 (ko) 2005-06-14 2012-11-14 덴끼 가가꾸 고교 가부시키가이샤 형광체 함유 수지 조성물 및 시트, 그것들을 사용한 발광소자
JP2007088248A (ja) * 2005-09-22 2007-04-05 Fujikura Ltd 有色発光ダイオードランプ、装飾用照明装置及びカラーディスプレイサイン装置
JP4879567B2 (ja) * 2005-11-25 2012-02-22 電気化学工業株式会社 サイアロン蛍光体の製造方法、それで得られた蛍光体を用いた照明器具
JP4769132B2 (ja) * 2005-11-30 2011-09-07 シャープ株式会社 発光装置
JP2011091414A (ja) * 2005-11-30 2011-05-06 Sharp Corp 発光装置
JP5206941B2 (ja) * 2005-12-08 2013-06-12 独立行政法人物質・材料研究機構 蛍光体とその製造方法および発光器具
WO2007066732A1 (ja) 2005-12-08 2007-06-14 National Institute For Materials Science 蛍光体とその製造方法および発光器具
KR100735453B1 (ko) * 2006-02-22 2007-07-04 삼성전기주식회사 백색 발광 장치
JP5234781B2 (ja) 2006-02-24 2013-07-10 独立行政法人物質・材料研究機構 蛍光体とその製造方法および発光器具
JP4762248B2 (ja) 2006-03-10 2011-08-31 株式会社東芝 蛍光体
EP2022835B1 (en) 2006-05-10 2018-04-11 Denka Company Limited Sialon phosphor, process for producing the same, and illuminator and luminescent element employing the same
JP5122765B2 (ja) * 2006-06-09 2013-01-16 電気化学工業株式会社 蛍光体の製造方法、蛍光体と照明器具
JP2008019407A (ja) * 2006-06-12 2008-01-31 Sharp Corp 蛍光体の製造方法、蛍光体、半導体発光装置および画像表示装置
CN101501874B (zh) * 2006-08-14 2012-04-04 株式会社藤仓 发光器件及照明装置
JP4785711B2 (ja) * 2006-11-14 2011-10-05 シャープ株式会社 蛍光体およびそれを用いた発光装置
JP2008120938A (ja) * 2006-11-14 2008-05-29 Sharp Corp 蛍光体およびその製造方法、ならびに半導体発光装置および画像表示装置
TWI357927B (en) * 2006-11-20 2012-02-11 Denki Kagaku Kogyo Kk Fluorescent substance and manufacturing method the
JP5367218B2 (ja) 2006-11-24 2013-12-11 シャープ株式会社 蛍光体の製造方法および発光装置の製造方法
US7902564B2 (en) * 2006-12-22 2011-03-08 Koninklijke Philips Electronics N.V. Multi-grain luminescent ceramics for light emitting devices
EP2135919B1 (en) * 2007-01-12 2013-10-30 National Institute for Materials Science Fluorescent material, process for producing the same, and luminescent device
JP2008208238A (ja) * 2007-02-27 2008-09-11 Showa Denko Kk 蛍光体及びその製造方法、並びにそれを備えた照明器具と画像表示装置
JP2008244468A (ja) * 2007-02-28 2008-10-09 Toshiba Lighting & Technology Corp 発光装置
US20110006168A1 (en) * 2007-03-20 2011-01-13 Spectrum Metal Solutions, LLC Support rails
JP2007262417A (ja) * 2007-05-18 2007-10-11 National Institute For Materials Science 蛍光体
JP2009010315A (ja) * 2007-05-30 2009-01-15 Sharp Corp 蛍光体の製造方法、発光装置および画像表示装置
US9279079B2 (en) 2007-05-30 2016-03-08 Sharp Kabushiki Kaisha Method of manufacturing phosphor, light-emitting device, and image display apparatus
CN103215036B (zh) * 2007-07-09 2014-11-05 夏普株式会社 荧光体粒子组以及使用其的发光装置
EP2172983B1 (en) * 2007-07-19 2014-11-19 Sharp Kabushiki Kaisha Light emitting device
US20100213822A1 (en) * 2007-08-01 2010-08-26 Satoshi Shimooka Phosphor and production method thereof, crystalline silicon nitride and production method thereof, phosphor-containing composition, and light emitting device, display and illuminating device using the phosphor
TW200910287A (en) * 2007-08-31 2009-03-01 Ledtech Electronics Corp Array type light-emitting device with high color rendering index
JP5578597B2 (ja) 2007-09-03 2014-08-27 独立行政法人物質・材料研究機構 蛍光体及びその製造方法、並びにそれを用いた発光装置
JP2009076656A (ja) * 2007-09-20 2009-04-09 Sharp Corp 発光装置、画像表示装置および液晶ディスプレイ
JP2009081187A (ja) * 2007-09-25 2009-04-16 Sharp Corp 半導体発光装置および画像表示装置
WO2009048150A1 (ja) 2007-10-10 2009-04-16 Ube Industries, Ltd. β－サイアロン蛍光体粉末およびその製造方法
US8335037B2 (en) * 2007-10-24 2012-12-18 The University Of Tokyo Millimeter wave band nonreciprocal device
JP5000479B2 (ja) * 2007-12-27 2012-08-15 シャープ株式会社 面光源、表示装置及びその製造方法
US8237348B2 (en) 2008-03-03 2012-08-07 Sharp Kabushiki Kaisha Light-emitting device
JP5832713B2 (ja) * 2008-04-14 2015-12-16 日亜化学工業株式会社 蛍光体及びこれを用いた発光装置並びに蛍光体の製造方法
JP5592602B2 (ja) 2008-07-31 2014-09-17 株式会社東芝 蛍光体およびそれを用いた発光装置
DE112009001977T5 (de) 2008-08-12 2012-01-26 Samsung Led Co.,Ltd. Verfahren zur Herstellung eines ß-SiAION-Leuchtstoffs
GB2474413B8 (en) * 2008-08-12 2013-02-13 Samsung Led Co Ltd Method for producing a ß-SiA1ON phosphor
US8158026B2 (en) * 2008-08-12 2012-04-17 Samsung Led Co., Ltd. Method for preparing B-Sialon phosphor
JP4879950B2 (ja) * 2008-10-29 2012-02-22 シャープ株式会社 蛍光体の製造方法
JP5641384B2 (ja) 2008-11-28 2014-12-17 独立行政法人物質・材料研究機構 表示装置用照明装置及び表示装置
JP4772105B2 (ja) * 2008-12-10 2011-09-14 シャープ株式会社 半導体発光装置およびそれを用いた画像表示装置
WO2010098141A1 (ja) 2009-02-26 2010-09-02 日亜化学工業株式会社 蛍光体及びその製造方法並びにこれを用いた発光装置
JPWO2010116953A1 (ja) * 2009-04-06 2012-10-18 シャープ株式会社 蛍光体粒子群およびそれを用いた発光装置、液晶テレビ
JP5368557B2 (ja) * 2009-06-09 2013-12-18 電気化学工業株式会社 β型サイアロン蛍光体、その用途及びその製造方法
JP5450625B2 (ja) * 2009-07-02 2014-03-26 シャープ株式会社 発光装置
JP5517037B2 (ja) * 2009-08-06 2014-06-11 独立行政法人物質・材料研究機構 蛍光体及びその製造方法、並びにそれを用いた発光装置
US20120162573A1 (en) 2009-08-31 2012-06-28 Kohsei Takahashi Liquid crystal display
JP2012003073A (ja) * 2010-06-17 2012-01-05 Sharp Corp 液晶表示装置
KR101565988B1 (ko) 2009-10-23 2015-11-05 삼성전자주식회사 적색형광체, 그 제조방법, 이를 이용한 발광소자 패키지, 조명장치
JP5508817B2 (ja) * 2009-11-05 2014-06-04 電気化学工業株式会社 β型サイアロン蛍光体の製造方法
JP5737693B2 (ja) * 2009-11-10 2015-06-17 電気化学工業株式会社 β型サイアロン、その製造方法及びそれを用いた発光装置
JP5589002B2 (ja) 2010-01-08 2014-09-10 シャープ株式会社 蛍光体、発光装置およびそれを用いた液晶表示装置
KR101077990B1 (ko) * 2010-02-12 2011-10-31 삼성엘이디 주식회사 형광체, 발광장치, 면광원장치, 디스플레이 장치 및 조명장치
JP5190475B2 (ja) 2010-02-19 2013-04-24 株式会社東芝 蛍光体およびそれを用いた発光装置
JP4740379B1 (ja) * 2010-02-25 2011-08-03 電気化学工業株式会社 β型サイアロン蛍光体、その用途及びβ型サイアロン蛍光体の製造方法
JP5791034B2 (ja) 2010-02-26 2015-10-07 国立研究開発法人物質・材料研究機構 発光装置
JP4930649B1 (ja) 2011-02-25 2012-05-16 三菱化学株式会社 ハロリン酸塩蛍光体、及び白色発光装置
JP2011225823A (ja) 2010-02-26 2011-11-10 Mitsubishi Chemicals Corp 白色発光装置
KR101717668B1 (ko) 2010-03-26 2017-03-17 삼성전자주식회사 복합 결정 형광체, 발광장치, 디스플레이 장치 및 조명장치
JP2011225696A (ja) 2010-04-19 2011-11-10 Sharp Corp 赤色系発光蛍光体、その製造方法および赤色系発光蛍光体を用いた発光装置
CN101872825B (zh) * 2010-04-29 2013-05-15 华侨大学 制备低色温高显色性大功率白光led的方法
CN102939273A (zh) * 2010-05-13 2013-02-20 电气化学工业株式会社 β型赛隆的制造方法、β型赛隆及利用该β型赛隆的产品
JP2012001716A (ja) * 2010-05-20 2012-01-05 Mitsubishi Chemicals Corp 蛍光体及びその製造方法と、その蛍光体を用いた発光装置
JP2013173806A (ja) * 2010-06-14 2013-09-05 Denki Kagaku Kogyo Kk β型サイアロンの製造方法
JP2012060097A (ja) * 2010-06-25 2012-03-22 Mitsubishi Chemicals Corp 白色半導体発光装置
JPWO2012011444A1 (ja) * 2010-07-20 2013-09-09 電気化学工業株式会社 β型サイアロン、β型サイアロンの製造方法及び発光装置
JP5783512B2 (ja) 2010-07-26 2015-09-24 シャープ株式会社 発光装置
CN102376860A (zh) 2010-08-05 2012-03-14 夏普株式会社 发光装置及其制造方法
JP2012036265A (ja) * 2010-08-05 2012-02-23 Sharp Corp 照明装置
KR101762473B1 (ko) * 2010-08-19 2017-07-27 우베 고산 가부시키가이샤 규질화물 형광체용 질화규소 분말 및 그것을 이용한 Sr3Al3Si13O2N21계 형광체, β-사이알론 형광체, 그리고 그들의 제조방법
US8946981B2 (en) 2010-08-27 2015-02-03 National Institute For Materials Science Phosphor, lighting fixture, and image display device
JP5672861B2 (ja) * 2010-08-27 2015-02-18 セイコーエプソン株式会社 プロジェクター
JP2013241478A (ja) * 2010-09-09 2013-12-05 Denki Kagaku Kogyo Kk β型サイアロン及び発光装置
JP2012057071A (ja) * 2010-09-09 2012-03-22 Denki Kagaku Kogyo Kk β型サイアロンの製造方法
JP5697387B2 (ja) * 2010-09-15 2015-04-08 電気化学工業株式会社 β型サイアロンの製造法
CN102959044B (zh) 2010-09-16 2015-05-06 电气化学工业株式会社 β型赛隆及其制备方法和发光装置
KR101215342B1 (ko) 2010-09-20 2012-12-26 삼성전자주식회사 사이알론 형광체, 그 제조방법 및 이를 이용한 발광소자 패키지
KR101214236B1 (ko) * 2010-09-20 2012-12-20 삼성전자주식회사 형광체 및 이의 제조방법
JP5730319B2 (ja) * 2010-09-27 2015-06-10 電気化学工業株式会社 β型サイアロンの製造方法
KR101225002B1 (ko) * 2010-09-27 2013-01-22 삼성전자주식회사 형광체 및 이의 제조방법
KR101871524B1 (ko) 2010-09-28 2018-06-26 미쯔비시 케미컬 주식회사 형광체 및 그것을 이용한 발광 장치
JP5331089B2 (ja) * 2010-11-15 2013-10-30 シャープ株式会社 蛍光体およびそれを用いた発光装置
WO2012077368A1 (ja) 2010-12-10 2012-06-14 電気化学工業株式会社 β型サイアロン、発光装置及びその用途
EP3133135B1 (en) 2011-01-18 2019-03-06 Sharp Kabushiki Kaisha Semiconductor light-emitting device
KR101214234B1 (ko) * 2011-02-14 2012-12-20 삼성전자주식회사 형광체 및 이의 제조방법
JP5325959B2 (ja) * 2011-03-09 2013-10-23 株式会社東芝 蛍光体およびそれを用いた発光装置
JP5360920B2 (ja) * 2011-04-08 2013-12-04 シャープ株式会社 蛍光体
JP2012025956A (ja) * 2011-08-11 2012-02-09 Denki Kagaku Kogyo Kk β型サイアロンの製造方法
JP5866870B2 (ja) * 2011-08-26 2016-02-24 三菱化学株式会社 発光装置
KR101876103B1 (ko) * 2011-10-12 2018-07-06 우베 고산 가부시키가이샤 산질화물 형광체 분말, 산질화물 형광체 분말 제조용 질화규소 분말 및 산질화물 형광체 분말의 제조 방법
EP2784143B1 (en) 2011-11-07 2016-10-05 National Institute for Materials Science Phosphor and production method therefor, and light emission device and image display device using phosphor
JP5916410B2 (ja) * 2012-02-09 2016-05-11 デンカ株式会社 蛍光体及び発光装置
JP2015083617A (ja) * 2012-02-09 2015-04-30 電気化学工業株式会社 蛍光体及び発光装置
JP2015083618A (ja) * 2012-02-09 2015-04-30 電気化学工業株式会社 蛍光体及び発光装置
EP2828124B1 (de) * 2012-03-22 2021-02-24 Schott AG Beleuchtungseinrichtung zur erzeugung von licht mit hoher leuchtdichte
CN103843163A (zh) 2012-03-30 2014-06-04 三菱化学株式会社 半导体发光装置和照明装置
EP2801599B1 (en) 2012-05-31 2016-01-13 National Institute for Materials Science Phosphor, method for manufacturing same, light emitting device, and image display device
WO2014003076A1 (ja) 2012-06-27 2014-01-03 独立行政法人物質・材料研究機構 蛍光体、その製造方法、発光装置および画像表示装置
EP2878648B1 (en) 2012-07-25 2016-11-23 National Institute for Materials Science Fluorophore, method for producing same, light-emitting device using fluorophore, image display device, pigment, and ultraviolet absorbent
WO2014115447A1 (ja) 2013-01-23 2014-07-31 シャープ株式会社 発光装置
JP6040500B2 (ja) * 2013-04-25 2016-12-07 国立研究開発法人物質・材料研究機構 蛍光体、その製造方法、発光装置および画像表示装置
US9828547B2 (en) 2013-05-14 2017-11-28 National Institute For Materials Science Phosphor, production method for same, light-emitting device, image display device, pigment, and ultraviolet absorber
CN108305929B (zh) 2013-10-02 2021-02-05 Glbtech株式会社 具有高显色性的白光发光装置
CN105706256B (zh) 2013-11-08 2018-03-13 夏普株式会社 发光装置以及照明装置
KR101922786B1 (ko) 2014-01-28 2018-11-27 샤프 가부시키가이샤 발광 다이오드 구동 장치 및 조명 장치
US9872354B2 (en) 2014-04-08 2018-01-16 Sharp Kabushiki Kaisha LED drive circuit
KR102357584B1 (ko) 2014-12-17 2022-02-04 삼성전자주식회사 질화물 형광체, 백색 발광장치, 디스플레이 장치 및 조명장치
KR102353443B1 (ko) 2014-12-22 2022-01-21 삼성전자주식회사 산질화물계 형광체 및 이를 포함하는 백색 발광 장치
JP6372368B2 (ja) * 2015-01-22 2018-08-15 三菱ケミカル株式会社 蛍光体、発光装置、照明装置及び画像表示装置
JP6020756B1 (ja) 2015-05-29 2016-11-02 日亜化学工業株式会社 βサイアロン蛍光体の製造方法
JP6024849B1 (ja) 2015-06-05 2016-11-16 日亜化学工業株式会社 βサイアロン蛍光体の製造方法
JP6222288B2 (ja) 2015-08-07 2017-11-01 日亜化学工業株式会社 βサイアロン蛍光体の製造方法
CN105295908B (zh) * 2015-12-03 2017-06-16 河北利福光电技术有限公司 一种β‑SiAlON:Eu2+绿色荧光粉及其制备方法
CN105331361B (zh) * 2015-12-03 2017-09-19 河北利福光电技术有限公司 一种β‑SiAlON∶Eu2+绿色荧光粉及其合成方法
US11427758B2 (en) 2015-12-15 2022-08-30 Nichia Corporation Method for producing β-sialon fluorescent material
US10385267B2 (en) 2015-12-15 2019-08-20 Nichia Corporation Method for producing β-sialon fluorescent material
CN105623657B (zh) * 2016-01-29 2017-04-26 江苏博睿光电有限公司 一种含氮发光颗粒及其制备方法、含氮发光体和发光器件
WO2017170453A1 (ja) 2016-03-28 2017-10-05 国立研究開発法人物質・材料研究機構 蛍光体、その製造方法、発光装置、画像表示装置、顔料および紫外線吸収剤
CN107446575B (zh) 2016-05-30 2021-08-31 日亚化学工业株式会社 β赛隆荧光体的制造方法
JP6536622B2 (ja) 2016-05-30 2019-07-03 日亜化学工業株式会社 βサイアロン蛍光体の製造方法
JP6790478B2 (ja) * 2016-06-14 2020-11-25 日亜化学工業株式会社 発光装置の製造方法
US11114591B2 (en) 2016-08-17 2021-09-07 Current Lighting Solutions, Llc Core-shell materials with red-emitting phosphors
US10590342B2 (en) * 2016-08-25 2020-03-17 Nichia Corporation Nitride fluorescent material, method of producing nitride fluorescent material and light emitting device
JP6658690B2 (ja) * 2016-08-25 2020-03-04 日亜化学工業株式会社 窒化物蛍光体、その製造方法および発光装置
JP6985704B2 (ja) * 2016-09-26 2021-12-22 三菱ケミカル株式会社 蛍光体、発光装置、照明装置及び画像表示装置
JP6781921B2 (ja) * 2016-12-15 2020-11-11 国立研究開発法人物質・材料研究機構 蛍光体、その製造方法及びそれを用いた発光装置
JP6867614B2 (ja) 2016-12-15 2021-04-28 国立研究開発法人物質・材料研究機構 蛍光体及び発光装置
JP2018150431A (ja) * 2017-03-10 2018-09-27 デンカ株式会社 緑色蛍光体および発光装置
US11279876B2 (en) 2018-03-27 2022-03-22 Denka Company Limited Phosphor and light-emitting device using same
US11395583B2 (en) * 2018-03-28 2022-07-26 Panasonic Intellectual Property Management Co., Ltd. Endoscope light emitting device, endoscope using same, and fluorescence imaging method
WO2019188631A1 (ja) 2018-03-29 2019-10-03 デンカ株式会社 β型サイアロン蛍光体及び発光装置
CN110387231A (zh) * 2018-04-17 2019-10-29 中国科学院上海硅酸盐研究所 一种β-SiAlON:Eu,M荧光粉及其制备方法
JP6982245B2 (ja) 2018-06-27 2021-12-17 日亜化学工業株式会社 βサイアロン蛍光体の製造方法
WO2020203234A1 (ja) 2019-04-03 2020-10-08 国立研究開発法人物質・材料研究機構 蛍光体、その製造方法および発光素子
CN114008175A (zh) 2019-06-26 2022-02-01 电化株式会社 荧光体、荧光体的制造方法、发光元件、发光装置和图像显示装置
JP6684412B1 (ja) 2019-06-27 2020-04-22 国立研究開発法人物質・材料研究機構 蛍光体、その製造方法および発光装置
JP2021054899A (ja) 2019-09-27 2021-04-08 日亜化学工業株式会社 βサイアロン蛍光体の製造方法
WO2022244523A1 (ja) 2021-05-21 2022-11-24 国立研究開発法人物質・材料研究機構 蛍光体、その製造方法、発光素子および発光装置
EP4293732A4 (en) 2022-01-20 2024-05-15 Mitsubishi Chemical Corporation PHOSPHORUS, LIGHT-EMITTING DEVICE, LIGHTING DEVICE, IMAGE DISPLAY DEVICE AND INDICATOR LAMP FOR VEHICLES
CN116987502B (zh) 2022-01-20 2024-12-31 三菱化学株式会社 荧光体、发光装置、照明装置、图像显示装置和车辆用显示灯
WO2023145774A1 (ja) * 2022-01-26 2023-08-03 国立研究開発法人物質・材料研究機構 蛍光体、その製造方法、および、発光デバイス
WO2024185638A1 (ja) 2023-03-07 2024-09-12 国立大学法人山梨大学 アルミノケイ酸塩系蛍光体の製造方法、アルミノケイ酸塩系蛍光体及び発光装置
KR102886486B1 (ko) 2023-12-20 2025-11-14 주식회사 유제이엘 베타-사이알론 형광체의 합성 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003206481A (ja) 2001-09-25 2003-07-22 Patent Treuhand Ges Elektr Gluehlamp Mbh 光源として少なくとも１つのｌｅｄを備えた照明ユニット
JP2003336059A (ja) 2002-05-23 2003-11-28 National Institute For Materials Science サイアロン系蛍光体

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8400660A (nl) 1984-03-01 1985-10-01 Philips Nv Luminescerend scherm.
JPH05152609A (ja) 1991-11-25 1993-06-18 Nichia Chem Ind Ltd 発光ダイオード
JPH0799345A (ja) 1993-09-28 1995-04-11 Nichia Chem Ind Ltd 発光ダイオード
US5743955A (en) * 1995-10-23 1998-04-28 Phillips; Mark L. F. Method for synthesizing fine-grained phosphor powders of the type (RE1- Lnx)(P1-y Vy)O4
JPH09218149A (ja) 1996-02-15 1997-08-19 Shimadzu Corp 検出計セルおよび光学測定装置
JP2919362B2 (ja) * 1996-06-26 1999-07-12 日本電気株式会社 低速電子線励起蛍光表示装置およびその製造方法
JP2927279B2 (ja) 1996-07-29 1999-07-28 日亜化学工業株式会社 発光ダイオード
EP0887833B1 (en) * 1997-05-22 2006-08-16 Hitachi Chemical Co., Ltd. Process for preparing phosphor pattern for field emission panel and photosensitive element
JP3917110B2 (ja) 2000-06-27 2007-05-23 正 五井野 オークション方法及びサーバ
CN1108212C (zh) * 2000-07-25 2003-05-14 宝山钢铁股份有限公司 含塞隆的滑动水口砖
US6632379B2 (en) * 2001-06-07 2003-10-14 National Institute For Materials Science Oxynitride phosphor activated by a rare earth element, and sialon type phosphor
JP3668770B2 (ja) 2001-06-07 2005-07-06 独立行政法人物質・材料研究機構 希土類元素を付活させた酸窒化物蛍光体
DE10133352A1 (de) * 2001-07-16 2003-02-06 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Beleuchtungseinheit mit mindestens einer LED als Lichtquelle
JP2003208409A (ja) 2002-01-15 2003-07-25 Mitsubishi Electric Corp 認証システム及び認証方法
KR101102304B1 (ko) 2003-08-22 2012-01-03 도쿠리츠교세이호징 붓시쯔 자이료 겐큐키코 산질화물 형광체 및 발광기구
JP4834827B2 (ja) * 2003-10-03 2011-12-14 独立行政法人物質・材料研究機構 酸窒化物蛍光体
JP3837588B2 (ja) 2003-11-26 2006-10-25 独立行政法人物質・材料研究機構 蛍光体と蛍光体を用いた発光器具
JP3921545B2 (ja) * 2004-03-12 2007-05-30 独立行政法人物質・材料研究機構 蛍光体とその製造方法
JP4104013B2 (ja) * 2005-03-18 2008-06-18 株式会社フジクラ 発光デバイス及び照明装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003206481A (ja) 2001-09-25 2003-07-22 Patent Treuhand Ges Elektr Gluehlamp Mbh 光源として少なくとも１つのｌｅｄを備えた照明ユニット
JP2003336059A (ja) 2002-05-23 2003-11-28 National Institute For Materials Science サイアロン系蛍光体

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