WO2019188631A1 - β型サイアロン蛍光体及び発光装置 - Google Patents
β型サイアロン蛍光体及び発光装置 Download PDFInfo
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- WO2019188631A1 WO2019188631A1 PCT/JP2019/011620 JP2019011620W WO2019188631A1 WO 2019188631 A1 WO2019188631 A1 WO 2019188631A1 JP 2019011620 W JP2019011620 W JP 2019011620W WO 2019188631 A1 WO2019188631 A1 WO 2019188631A1
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- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/64—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing aluminium
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- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/64—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing aluminium
- C09K11/646—Silicates
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/0883—Arsenides; Nitrides; Phosphides
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- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/77066—Aluminium Nitrides or Aluminium Oxynitrides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
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- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/30—Three-dimensional structures
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/51—Particles with a specific particle size distribution
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/90—Other morphology not specified above
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/11—Powder tap density
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
Definitions
- the present invention relates to a ⁇ -type sialon phosphor that is excited by light having a wavelength ranging from ultraviolet light to blue light and emits green light, and a light-emitting device using the same.
- a white LED is a device that emits pseudo white light by a combination of a semiconductor light-emitting element and a phosphor.
- a combination of a blue LED and a YAG yellow phosphor is known.
- an image display device such as a liquid crystal backlight has a problem of poor color reproducibility. Therefore, a white LED using both a green phosphor and a red phosphor instead of a yellow phosphor has been developed.
- a ⁇ -sialon phosphor is known as a phosphor emitting green light.
- Protent Document 1 When europium (Eu 2+ ) is contained in the crystal structure of ⁇ -sialon, it becomes a phosphor that emits green light of 520 to 550 nm when excited by ultraviolet to blue light, and emits light from a white LED or the like. It can be used as a green luminescent component of the device.
- Patent Document 2 a production method for reducing the oxygen content in order to increase the brightness of the ⁇ -type sialon phosphor (Patent Document 2) and a technique for increasing the brightness by controlling the oxygen content in the raw material are known ( Patent Document 3).
- the present invention makes it possible to more stably produce, for example, a light-emitting element that is a white LED, and in particular, ⁇ -type that can suppress variations between LED products related to chromaticity (also simply referred to as “chromaticity variation” in this specification).
- An object is to provide a sialon phosphor.
- the present inventors can produce a light-emitting element, for example, a white LED, in which chromaticity variation is further suppressed by controlling the bulk density of the ⁇ -type sialon phosphor within a specific range. I found.
- a light-emitting device comprising the ⁇ -type sialon phosphor according to any one of (1) to (5) and a semiconductor light-emitting device capable of exciting the ⁇ -type sialon phosphor.
- a light emitting device having the light emitting element according to (6) has the light emitting element according to (6).
- the ⁇ -type sialon phosphor having a specific range of bulk density that can be provided in the embodiment of the present invention can be combined with a semiconductor light-emitting device capable of exciting the ⁇ -type sialon phosphor to constitute a light-emitting device.
- a semiconductor light-emitting device capable of exciting the ⁇ -type sialon phosphor to constitute a light-emitting device.
- a light-emitting element that suppresses variations in light emission characteristics typified by chromaticity of white LEDs and has more stable light emission characteristics.
- a light-emitting device having the light-emitting element and a tool that houses the light-emitting element can be provided. Examples of such a light emitting device include a lighting device, a backlight device, an image display device, and a signal device.
- the ⁇ -type sialon phosphor according to the embodiment of the present invention is represented by the general formula: Si 6-z Al z O z N 8-z (0 ⁇ z ⁇ 4.2) and is the same as the ⁇ -type sialon crystal phase.
- the crystal structure as a host crystal a bulk density of 0.80 g / cm 3 or more 1.60 g / cm 3 or less is ⁇ -sialon phosphor.
- the ⁇ -type sialon phosphor is a solid solution of ⁇ -type silicon nitride, in which Al is substituted at the Si position of the ⁇ -type silicon nitride crystal and O is substituted at the N position.
- Si 6-z Al z O z N 8-z is used as a general formula.
- the composition z is more than 0 and less than 4.2, and the solid solution range is very wide.
- the molar ratio of (Si, Al) / (N, O) must be maintained at 3/4.
- the crystal structure of ⁇ -type silicon nitride is defined as a structure having symmetry of P6 3 or P6 3 / m and having an ideal atomic position.
- a method of producing a ⁇ -type sialon phosphor generally, as a raw material, in addition to silicon nitride, silicon oxide and aluminum nitride, or aluminum oxide, aluminum nitride, and europium oxide are added and heated.
- a ⁇ -type sialon phosphor is obtained.
- the crystal structure of the phosphor can be confirmed by powder X-ray diffraction.
- the crystal phase present in the phosphor is preferably a ⁇ -type sialon single phase, but may contain a different phase from the ⁇ -type sialon as long as the emission characteristics and reliability are not greatly affected.
- ⁇ -sialon phosphors are extremely useful as phosphors for LEDs, for example, and are used for LEDs that absorb excitation light in the wavelength range of 420 to 480 nm and emit light having a wavelength greater than 480 nm and less than 800 nm. can do.
- ⁇ -sialon phosphor of the present invention has a bulk density of 0.80 g / cm 3 or more 1.60 g / cm 3 or less. Less bulk density of 0.80 g / cm 3, or a 1.60 g / cm 3 greater than the chromaticity variations in LED that is created using this phosphor is increased.
- the bulk density of a powder is determined by measuring the volume of a powder sample of a known weight placed in a graduated cylinder (Method 1) or the mass of a powder sample of a known volume placed in a container through a volume meter. It can be determined by a method of measuring (Method 2) or a method of measuring using a dedicated measuring container (Method 3). Hereinafter, the method 3 will be described in detail.
- Method 1 a sufficient amount of sample is prepared for measurement. Attach the auxiliary cylinder to a dry cylindrical measuring container with a constant volume, and put the required amount of sample. Tap a measuring container with an auxiliary cylinder multiple times at 50-60 times / min.
- the mass of the powder is measured by subtracting the mass of the empty cylindrical container that has been measured in advance.
- the bulk density is determined by calculating the weight of the sample per unit volume. This bulk density is preferably measured repeatedly, more preferably measured multiple times, and more preferably obtained as an average value of the measured values.
- the bulk density of the powder can be generally controlled by the particle diameter, particle size distribution and surface state of the powder.
- the ⁇ -sialon phosphor provided in the embodiment of the present invention preferably has a mass median diameter (D50) of 30 ⁇ m or less measured by a laser diffraction scattering method.
- D50 mass median diameter
- the mass median diameter is 30 ⁇ m or less, the bulk density falls within a specific range, and the chromaticity variation of the LED produced using this phosphor can be reduced. Further, it is preferable that the mass median diameter is 5 ⁇ m or more because the light emission characteristics of the phosphor are improved.
- the mass median diameter is a value calculated by conversion from a volume median diameter obtained from a cumulative distribution curve measured by a laser diffraction scattering method according to JIS R1622: 1995 and R1629: 1997.
- the ⁇ -sialon phosphor according to the embodiment of the present invention preferably has a span value of 1.7 or less, more preferably 0.1 or more and 1.6 or less.
- the span value means a value calculated by (D90 ⁇ D10) / D50, where D10 and D90 are obtained from a mass-based cumulative distribution curve measured in the same manner as the mass median diameter. 10% diameter and 90% diameter.
- the span value is an index representing the distribution width of the particle size distribution, that is, the variation in the size of the particles of the ⁇ -type sialon phosphor. When the span value is small, the bulk density tends to fall within a specific range, and the chromaticity variation of the LED produced using the phosphor can be reduced.
- the surface state of the powder can vary depending on the post-treatment method at the time of manufacture.
- the post-treatment method for the ⁇ -type sialon phosphor include washing and surface coating of phosphor particles, but washing is preferred from the viewpoint of improving productivity and bulk density.
- cleaning method It is preferable to wash
- the angle of repose is preferably 60 ° or less, and more preferably 50 ° or less.
- the angle of repose is preferably 30 ° or more. Since the angle of repose indicates the fluidity of the phosphor, it becomes an index representing the degree of dispersion when the phosphor is used in an LED. When the angle of repose is 30 ° or more and 60 ° or less, the chromaticity variation of the manufactured LED can be reduced.
- the angle of repose is measured by measuring the angle of the powder when the sample is naturally dropped into a container and deposited on a horizontal surface (injection method).
- injection method There are a method for measuring the angle at which the powder is made (discharge method) and a method for measuring the angle at which the powder is made by putting the powder in a container and tilting the container (tilt method).
- discharge method a method for measuring the angle at which the powder is made
- tilt method tilt method for measuring the angle at which the powder is made by putting the powder in a container and tilting the container.
- the injection method will be described in detail below.
- the sample is dropped from a fixed height funnel onto a horizontal substrate, a low angle is calculated from the diameter and height of the generated conical deposit, and this low angle is taken as the repose angle.
- This angle of repose is preferably measured repeatedly, more preferably measured multiple times, and more preferably obtained as an average value of the measured values.
- the production method of the ⁇ -type sialon phosphor is not particularly limited.
- a method of firing the raw material mixed powder capable of constituting the compound represented by the general formula in a predetermined temperature range in a nitrogen atmosphere is exemplified.
- nitrides and oxides of constituent elements that is, silicon nitride, aluminum nitride, europium nitride, silicon oxide, aluminum oxide, and europium oxide are preferably used as raw materials.
- the method of mixing the above-mentioned raw materials is not particularly limited, it is appropriate to handle europium nitride that reacts violently with moisture and oxygen in the air in a glove box replaced with an inert atmosphere.
- the firing powder is filled with the mixed powder of the raw materials described above.
- the firing container is preferably made of a material that is stable in a high-temperature nitrogen atmosphere and hardly reacts with the raw material mixed powder and its reaction product, and examples thereof include boron nitride, a refractory metal container, and carbon.
- a firing container filled with the raw material mixed powder is set in a firing furnace and fired at 1800 ° C. or higher and 2100 ° C. or lower in a nitrogen atmosphere. If the heating temperature is high, Eu 2+ can enter the ⁇ -sialon crystal, and a ⁇ -sialon having sufficient emission intensity can be obtained. However, if the firing temperature is too low, the unreacted residual amount increases.
- the firing time a time range in which a large amount of unreacted substances are present, grain growth is insufficient, or a disadvantage that productivity is lowered does not occur is selected, and it is preferably 2 hours or more and 24 hours or less.
- the pressure of the firing atmosphere is selected according to the firing temperature.
- the ⁇ -sialon phosphor of the present invention can exist stably at atmospheric pressure at a temperature up to about 1800 ° C., but at a temperature higher than this, it is necessary to use a pressurized atmosphere in order to suppress the decomposition of the phosphor. There is.
- the state of the fired product varies depending on the raw material composition and firing conditions, such as powder, lump, and sintered body.
- the baked product is made into a powder of a predetermined size by combining crushing, grinding and / or classification operations.
- a heat treatment step may be provided after the pulverization step.
- a ⁇ sialon phosphor with higher luminous efficiency can be obtained.
- the heat treatment temperature in the heat treatment step is preferably 1400 ° C. or higher and 2100 ° C. or lower.
- the atmosphere of the heat treatment step is preferably a nitrogen atmosphere, a reducing atmosphere, or a rare gas atmosphere, and the atmospheric pressure is preferably less than 1 MPa in view of industrial productivity.
- the aqueous solution used in the washing step is preferably an acidic, alkaline, or polar aqueous solution.
- the washing step is a step in which the ⁇ -sialon phosphor is dispersed in the aqueous solution described above and stirred for several minutes to several hours. It can be obtained by dissolving and removing the impurity element derived from the firing container, the foreign phase generated in the firing process, the impurity element contained in the raw material, and the impurity element mixed in the pulverization process, and cleaning the surface of the phosphor.
- the bulk density of the phosphor powder can be improved.
- the present ⁇ -sialon phosphor can be combined with a semiconductor light emitting element capable of exciting the phosphor to form a light emitting element, and a light emitting device having the light emitting element can be obtained.
- a ⁇ -type sialon phosphor that emits green light or ultraviolet light containing a wavelength of 350 nm to 500 nm in particular from a semiconductor light emitting device, and further, if necessary, further yellow phosphor and red fluorescence.
- a white light emitting element (white LED) can be obtained by irradiating a phosphor obtained by combining a body and / or a blue phosphor.
- Table 1 shows D10, D50, D90, the span value, the bulk density, and the angle of repose of the phosphors of Examples and Comparative Examples.
- Example 1 ⁇ -type silicon nitride powder (SN-E10 grade, manufactured by Ube Industries) 98.06 wt%, aluminum nitride powder (E grade, manufactured by Tokuyama) 1.34 wt%, europium oxide (RU grade, manufactured by Shin-Etsu Chemical Co.) 60 wt% was mixed using a V-type mixer. The mixture was completely passed through a sieve having an opening of 250 ⁇ m to remove agglomeration, thereby obtaining a raw material mixed powder.
- the raw material mixed powder that passed through the sieve was filled in a cylindrical boron nitride container with a lid (N-1 grade, manufactured by Denka Co., Ltd.) in an amount of 250 g. Heat treatment was carried out at 15 ° C. for 15 hours.
- the sample collected from the furnace was a green lump, crushed by a mortar, and finally passed through a sieve having an opening of 150 ⁇ m.
- the obtained phosphor sample was subjected to powder X-ray diffraction using CuK ⁇ rays using an X-ray diffractometer (Ultrama IV manufactured by Rigaku Corporation).
- the obtained X-ray diffraction pattern was found to have the same diffraction pattern as the ⁇ -type sialon crystal phase.
- the powder that passed through the sieve was filled in a cylindrical boron nitride container, and held at 1500 ° C. for 8 hours in an atmospheric pressure argon flow atmosphere in a carbon heater electric furnace to obtain ⁇ -sialon heat-treated powder.
- the obtained ⁇ -sialon heat-treated powder was immersed in a mixed acid of hydrofluoric acid and nitric acid. Thereafter, decantation to remove the supernatant and fine powder is repeated until the solution becomes neutral, and the finally obtained precipitate is filtered and dried, and further passed through a sieve having an opening of 150 ⁇ m, and the ⁇ -sialon of Example 1 A phosphor was obtained.
- the mass median diameter and span value are D10 based on the volume average diameter measured by a laser diffraction scattering method according to JIS R1622: 1995 and R1629: 1997 using a particle size distribution measuring device (Microtrack MT3000II manufactured by Microtrack Bell Co., Ltd.). , D50 (mass median diameter) and D90 were calculated, and the span value ((D90 ⁇ D10) / D50) was determined.
- the bulk density was measured by the following method.
- a constant-volume container (25 cc) cylindrical container was used as the measurement container, and the mass was weighed with a scale.
- An auxiliary cylinder was attached to the measurement container, the sample was filled until it overflowed, and the measurement container with the auxiliary cylinder was tapped 50 times at a speed of 50 to 60 times / minute, and the auxiliary cylinder was removed.
- the sample raised from the upper end surface of the measurement container was ground using a scraping plate. At this time, the grinding plate was used by being inclined backward from the direction of grinding so as not to compress the powder.
- the mass of the measurement container was weighed with a scale, and the mass of the sample was calculated by subtracting the mass of the measurement container. This measurement was performed three times. The average value of values obtained by dividing the mass of the sample calculated in each measurement by the volume of the measurement container was calculated as the bulk density.
- ⁇ Measurement method of repose angle The angle of repose was measured by the following method. A 20 g sample was dropped from a height of 2 to 4 cm on the upper edge of a commercially available glass funnel having an inner diameter of 10 mm onto the substrate through the funnel at a rate of 20 to 60 g per minute. The low angle was calculated from the diameter and height. This measurement was performed three times, and the average value of the low angles was taken as the repose angle.
- Examples 2 to 4 Comparative Example 1> The phosphor powders of Examples 2 to 4 and Comparative Example 1 were prepared under the same conditions as in Example 1 except that the pulverization and classification conditions were changed to D10, D50 (mass median diameter) and D90 shown in Table 1. The properties of the phosphors obtained in Examples 2 to 4 and Comparative Example 1 are shown in Table 1 together with the results of Example 1.
- Example 5 The conditions of Example 5 were changed under the same conditions as in Example 1 except that the conditions for pulverization and classification were changed to D10, D50 (mass median diameter), and D90 shown in Table 1, and the acid cleaning was followed by washing with an aqueous ethanol solution. A phosphor powder was prepared. The characteristics of the phosphor obtained in Example 5 are also shown in Table 1.
- Example 6> Using the ⁇ -sialon phosphor particles obtained in Example 1, an LED was produced. That is, the phosphor particles are added in an amount of 10% by mass to thermosetting and fluid silicone resin (trade name: KER6150, manufactured by Shin-Etsu Chemical Co., Ltd.), and the mixture is stirred and mixed to obtain a slurry. It was adjusted. Next, 6 mg of the slurry was injected into a top view type package on which a blue LED chip having a peak at a wavelength of 450 to 460 nm was mounted, and then the slurry was cured by heating at a temperature of 150 ° C. for 2 hours.
- thermosetting and fluid silicone resin trade name: KER6150, manufactured by Shin-Etsu Chemical Co., Ltd.
- Example 7 An LED was produced under the same conditions as in Example 6 except that the ⁇ -type sialon phosphor particles obtained in Example 2 were used.
- Example 8 An LED was produced under the same conditions as in Example 6 except that the ⁇ -type sialon phosphor particles obtained in Example 3 were used.
- Example 9 An LED was produced under the same conditions as in Example 6 except that the ⁇ -type sialon phosphor particles obtained in Example 4 were used.
- Example 10 An LED was produced under the same conditions as in Example 6 except that the ⁇ -type sialon phosphor particles obtained in Example 5 were used.
- the ⁇ -sialon phosphor of the present invention is excited by blue light to emit green light, and an LED having a smaller chromaticity variation than the conventional one can be obtained. That is, the ⁇ -type sialon phosphor of the present invention is a light emitting device using the phosphor, for example, a phosphor for a white LED configured by combining a phosphor that can be excited to emit blue light and a phosphor,
- the light-emitting element can be preferably used in light-emitting devices such as lighting equipment and image display devices.
Abstract
Description
β型サイアロン蛍光体の製造方法は特に制限されない。ここでは、前記一般式で表される化合物を構成しうる原料混合粉末を窒素雰囲気中において所定の温度範囲で焼成する方法を例示する。
α型窒化ケイ素粉末(SN-E10グレード、宇部興産社製)98.06wt%、窒化アルミニウム粉末(Eグレード、トクヤマ社製)1.34wt%、酸化ユーロピウム(RUグレード、信越化学社製)0.60wt%を、V型混合機を用いて混合した。目開き250μmの篩に混合物を全通させて凝集を取り除き、原料混合粉末を得た。
質量メジアン径及びスパン値は、粒度分布測定装置(マイクロトラック・ベル株式会社製マイクロトラックMT3000II)を用いJIS R1622:1995及びR1629:1997に準じて、レーザー回折散乱法で測定した体積平均径よりD10、D50(質量メジアン径)、D90を算出し、またスパン値((D90-D10)/D50)を求めた。
嵩密度は、以下の方法で測定した。測定用容器に定容容器(25cc)の円筒型容器を用いて、その質量をはかりによって量りとった。測定用容器に補助円筒を装着し、試料をあふれるまで入れ、補助円筒付きの測定用容器を50~60回/分の速さで50回タップを行い、補助円筒を取り外した。測定用容器の上端面から盛り上がった試料を、すり切り板を使ってすり切った。このときすり切り板は、粉末を圧縮しないようすりきる方向から後ろへ傾斜させて使用した。測定用容器ごと質量をはかりで量り、測定用容器の質量を差し引いて試料の質量を計算した。この測定を3回行った。各測定で計算した試料の質量を、測定用容器の容積で除した値の平均値を嵩密度として算出した。
安息角は、以下の方法で測定した。試料20gをノズル内径10mmの市販のガラス製ロートの上縁2~4cmの高さから、毎分20~60gの速さで該ロートを介して基板上に落下させ、生成した円錐状の堆積物の直径及び高さから、低角を算出した。この測定を3回行い、低角の平均値を安息角とした。
表1に示すD10、D50(質量メジアン径)、D90になるよう粉砕、分級条件を変更した以外実施例1と同じ条件で実施例2~4、比較例1の蛍光体粉末を作製した。実施例2~4、比較例1で得られた蛍光体の特性を実施例1の結果と合わせて表1に示す。
表1に示すD10、D50(質量メジアン径)、D90になるよう粉砕、分級条件を変更し、酸洗浄の後に、エタノール水溶液による洗浄を加えたこと以外実施例1と同じ条件で実施例5の蛍光体粉末を作製した。実施例5で得られた蛍光体の特性も合わせて表1に示す。
酸洗浄の後に、エタノール水溶液による洗浄を実施しないこと以外実施例5と同じ条件で比較例2の蛍光体粉末を作製した。比較例2で得られた蛍光体の特性を実施例1~5、比較例1の結果と合わせて表1に示す。
<実施例6>
上記実施例1で得られたβ型サイアロン蛍光体の粒子を用いて、LEDを作製した。即ち、蛍光体粒子を、熱硬化性を有し且つ常温で流動性を有するシリコーン樹脂(信越化学工業株式会社製、商品名:KER6150)に対して10質量%添加し、撹拌混合してスラリーを調整した。次に、波長450~460nmにピークを有する青色LEDチップが実装されているトップビュータイプパッケージに、上記スラリー6mgを注入した後、150℃の温度で2時間加熱してスラリーを硬化させた。このようにして、実施例1であるβ型サイアロン蛍光体粒子を備えていて、波長420~480nmの範囲の光を吸収し、且つ480nmを超え800nm以下の範囲の光を放出するLEDを作製した。
実施例2で得られたβ型サイアロン蛍光体粒子を使用した以外は、実施例6と同じ条件でLEDを作製した。
実施例3で得られたβ型サイアロン蛍光体粒子を使用した以外は、実施例6と同じ条件でLEDを作製した。
実施例4で得られたβ型サイアロン蛍光体粒子を使用した以外は、実施例6と同じ条件でLEDを作製した。
実施例5で得られたβ型サイアロン蛍光体粒子を使用した以外は、実施例6と同じ条件でLEDを作製した。
比較例1で得られたβ型サイアロン蛍光体粒子を使用した以外は、実施例6と同じ条件でLEDを作製した。
比較例2で得られたβ型サイアロン蛍光体粒子を使用した以外は、実施例6と同じ条件でLEDを作製した。
上記実施例6~10、比較例3~4で作製のそれぞれについて、各50個のLEDを作製し、LED測定装置(Instrument System社製、商品名:CAS140B)を用いて、色度評価を測定した。その結果を以下に示す表2にまとめた。なお、色度評価は、CIE色度座標の一つ、XYZ表色系のx値とy値の各標準偏差σを示す。
Claims (7)
- 一般式:Si6-zAlzOzN8-z(0<z<4.2)で示され、β型サイアロン結晶相と同一の結晶構造を母体結晶とし、嵩密度が0.80g/cm3以上1.60g/cm3以下であるβ型サイアロン蛍光体。
- 発光中心元素としてEu2+を有する、請求項1記載のβ型サイアロン蛍光体。
- 安息角が60°以下である、請求項1または2記載のβ型サイアロン蛍光体。
- 安息角が30°以上である、請求項1~3いずれか一項記載のβ型サイアロン蛍光体。
- 安息角が50°以下である、請求項1~4いずれか一項記載のβ型サイアロン蛍光体。
- 請求項1~5いずれか一項記載のβ型サイアロン蛍光体と、前記β型サイアロン蛍光体の励起が可能な半導体発光素子とを有する発光素子。
- 請求項6記載の発光素子を有する発光装置。
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