KR100873587B1 - 유압 임프린트 리소그래피 - Google Patents
유압 임프린트 리소그래피 Download PDFInfo
- Publication number
- KR100873587B1 KR100873587B1 KR1020037000754A KR20037000754A KR100873587B1 KR 100873587 B1 KR100873587 B1 KR 100873587B1 KR 1020037000754 A KR1020037000754 A KR 1020037000754A KR 20037000754 A KR20037000754 A KR 20037000754A KR 100873587 B1 KR100873587 B1 KR 100873587B1
- Authority
- KR
- South Korea
- Prior art keywords
- mold
- substrate
- layer
- pressure
- mask layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/003—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor characterised by the choice of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
- B29C2043/023—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
- B29C2043/025—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves forming a microstructure, i.e. fine patterning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C2043/3205—Particular pressure exerting means for making definite articles
- B29C2043/3222—Particular pressure exerting means for making definite articles pressurized gas, e.g. air
- B29C2043/3233—Particular pressure exerting means for making definite articles pressurized gas, e.g. air exerting pressure on mould parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C2043/3205—Particular pressure exerting means for making definite articles
- B29C2043/3238—Particular pressure exerting means for making definite articles pressurized liquid acting directly or indirectly on the material to be formed
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/56—Compression moulding under special conditions, e.g. vacuum
- B29C2043/566—Compression moulding under special conditions, e.g. vacuum in a specific gas atmosphere, with or without pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
- B29C2059/023—Microembossing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/942—Masking
- Y10S438/945—Special, e.g. metal
Landscapes
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/618,174 US6482742B1 (en) | 2000-07-18 | 2000-07-18 | Fluid pressure imprint lithography |
| US09/618,174 | 2000-07-18 | ||
| PCT/US2001/021005 WO2002007199A1 (en) | 2000-07-18 | 2001-07-02 | Fluid pressure imprint lithography |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20030064370A KR20030064370A (ko) | 2003-07-31 |
| KR100873587B1 true KR100873587B1 (ko) | 2008-12-11 |
Family
ID=24476613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020037000754A Expired - Fee Related KR100873587B1 (ko) | 2000-07-18 | 2001-07-02 | 유압 임프린트 리소그래피 |
Country Status (7)
| Country | Link |
|---|---|
| US (3) | US6482742B1 (enExample) |
| EP (1) | EP1325513A4 (enExample) |
| JP (1) | JP3987795B2 (enExample) |
| KR (1) | KR100873587B1 (enExample) |
| CN (1) | CN1299332C (enExample) |
| AU (1) | AU2001273136A1 (enExample) |
| WO (1) | WO2002007199A1 (enExample) |
Families Citing this family (403)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080217813A1 (en) * | 1995-11-15 | 2008-09-11 | Chou Stephen Y | Release surfaces, particularly for use in nanoimprint lithography |
| US20040036201A1 (en) * | 2000-07-18 | 2004-02-26 | Princeton University | Methods and apparatus of field-induced pressure imprint lithography |
| US8728380B2 (en) * | 1995-11-15 | 2014-05-20 | Regents Of The University Of Minnesota | Lithographic method for forming a pattern |
| US6713238B1 (en) * | 1998-10-09 | 2004-03-30 | Stephen Y. Chou | Microscale patterning and articles formed thereby |
| AU777237B2 (en) | 1998-10-09 | 2004-10-07 | Arborgen Llc | Materials and methods for the modification of plant lignin content |
| US6334960B1 (en) * | 1999-03-11 | 2002-01-01 | Board Of Regents, The University Of Texas System | Step and flash imprint lithography |
| US6939474B2 (en) * | 1999-07-30 | 2005-09-06 | Formfactor, Inc. | Method for forming microelectronic spring structures on a substrate |
| US7432634B2 (en) | 2000-10-27 | 2008-10-07 | Board Of Regents, University Of Texas System | Remote center compliant flexure device |
| US6873087B1 (en) | 1999-10-29 | 2005-03-29 | Board Of Regents, The University Of Texas System | High precision orientation alignment and gap control stages for imprint lithography processes |
| SE515607C2 (sv) * | 1999-12-10 | 2001-09-10 | Obducat Ab | Anordning och metod vid tillverkning av strukturer |
| US6696220B2 (en) | 2000-10-12 | 2004-02-24 | Board Of Regents, The University Of Texas System | Template for room temperature, low pressure micro-and nano-imprint lithography |
| EP2264524A3 (en) | 2000-07-16 | 2011-11-30 | The Board of Regents of The University of Texas System | High-resolution overlay alignement methods and systems for imprint lithography |
| US20050160011A1 (en) * | 2004-01-20 | 2005-07-21 | Molecular Imprints, Inc. | Method for concurrently employing differing materials to form a layer on a substrate |
| WO2002006902A2 (en) | 2000-07-17 | 2002-01-24 | Board Of Regents, The University Of Texas System | Method and system of automatic fluid dispensing for imprint lithography processes |
| US7717696B2 (en) * | 2000-07-18 | 2010-05-18 | Nanonex Corp. | Apparatus for double-sided imprint lithography |
| US7635262B2 (en) * | 2000-07-18 | 2009-12-22 | Princeton University | Lithographic apparatus for fluid pressure imprint lithography |
| US20100236705A1 (en) * | 2000-07-18 | 2010-09-23 | Chou Stephen Y | Fluidic and Microdevice Apparatus and Methods For Bonding Components Thereof |
| US7322287B2 (en) * | 2000-07-18 | 2008-01-29 | Nanonex Corporation | Apparatus for fluid pressure imprint lithography |
| US20050037143A1 (en) * | 2000-07-18 | 2005-02-17 | Chou Stephen Y. | Imprint lithography with improved monitoring and control and apparatus therefor |
| US20080164638A1 (en) * | 2006-11-28 | 2008-07-10 | Wei Zhang | Method and apparatus for rapid imprint lithography |
| KR20030040378A (ko) | 2000-08-01 | 2003-05-22 | 보드 오브 리전츠, 더 유니버시티 오브 텍사스 시스템 | 임프린트 리소그래피를 위한 투명한 템플릿과 기판사이의고정확성 갭 및 방향설정 감지 방법 |
| WO2002017383A2 (en) | 2000-08-21 | 2002-02-28 | Board Of Regents, The University Of Texas System | Flexure based translation stage |
| DE10059178C2 (de) * | 2000-11-29 | 2002-11-07 | Siemens Production & Logistics | Verfahren zur Herstellung von Halbleitermodulen sowie nach dem Verfahren hergestelltes Modul |
| AUPR245201A0 (en) * | 2001-01-10 | 2001-02-01 | Silverbrook Research Pty Ltd | An apparatus and method (WSM05) |
| US7019924B2 (en) * | 2001-02-16 | 2006-03-28 | Komag, Incorporated | Patterned medium and recording head |
| US6964793B2 (en) | 2002-05-16 | 2005-11-15 | Board Of Regents, The University Of Texas System | Method for fabricating nanoscale patterns in light curable compositions using an electric field |
| US9678038B2 (en) | 2001-07-25 | 2017-06-13 | The Trustees Of Princeton University | Nanochannel arrays and their preparation and use for high throughput macromolecular analysis |
| SG169225A1 (en) | 2001-07-25 | 2011-03-30 | Univ Princeton | Nanochannel arrays and their preparation and use for high throughput macromolecular analysis |
| US20030071016A1 (en) * | 2001-10-11 | 2003-04-17 | Wu-Sheng Shih | Patterned structure reproduction using nonsticking mold |
| US6936181B2 (en) * | 2001-10-11 | 2005-08-30 | Kovio, Inc. | Methods for patterning using liquid embossing |
| US20030080472A1 (en) * | 2001-10-29 | 2003-05-01 | Chou Stephen Y. | Lithographic method with bonded release layer for molding small patterns |
| WO2003106693A2 (en) | 2002-01-01 | 2003-12-24 | Princeton University | Gradient structures interfacing microfluidics and nanofluidics, methods for fabrication and uses thereof |
| US6743368B2 (en) * | 2002-01-31 | 2004-06-01 | Hewlett-Packard Development Company, L.P. | Nano-size imprinting stamp using spacer technique |
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| WO2003079416A1 (en) | 2002-03-15 | 2003-09-25 | Princeton University | Laser assisted direct imprint lithography |
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| US20040126547A1 (en) * | 2002-12-31 | 2004-07-01 | Coomer Boyd L. | Methods for performing substrate imprinting using thermoset resin varnishes and products formed therefrom |
| US6974775B2 (en) * | 2002-12-31 | 2005-12-13 | Intel Corporation | Method and apparatus for making an imprinted conductive circuit using semi-additive plating |
| EP1597616A4 (en) * | 2003-02-10 | 2008-04-09 | Nanoopto Corp | UNIVERSAL BROADBAND POLARIZER, DEVICES COMPRISING THE POLARIZER, AND METHOD FOR MANUFACTURING THE POLARIZER |
| US7452574B2 (en) | 2003-02-27 | 2008-11-18 | Molecular Imprints, Inc. | Method to reduce adhesion between a polymerizable layer and a substrate employing a fluorine-containing layer |
| US7510946B2 (en) * | 2003-03-17 | 2009-03-31 | Princeton University | Method for filling of nanoscale holes and trenches and for planarizing of a wafer surface |
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| DE102018215939A1 (de) * | 2018-09-19 | 2020-03-19 | Profol GmbH | Werkzeug zum Aufbringen einer Folie |
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| WO2020246457A1 (ja) * | 2019-06-05 | 2020-12-10 | Scivax株式会社 | 貼り合わせ体製造方法、貼り合わせ体および微細構造形成方法 |
| KR20220120579A (ko) * | 2019-12-25 | 2022-08-30 | 싸이백스 가부시키가이샤 | 임프린트 장치 및 임프린트 방법 |
| CN111640651A (zh) * | 2020-01-19 | 2020-09-08 | 中国科学技术大学 | 基于离子轰击技术的亚波长表面纳米结构及其制备方法 |
| CN111562719B (zh) * | 2020-06-15 | 2022-06-21 | 京东方科技集团股份有限公司 | 纳米压印模板及其制造方法和脱模方法 |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2004504718A (ja) | 2004-02-12 |
| US20020132482A1 (en) | 2002-09-19 |
| EP1325513A1 (en) | 2003-07-09 |
| CN1457505A (zh) | 2003-11-19 |
| US6946360B2 (en) | 2005-09-20 |
| US6482742B1 (en) | 2002-11-19 |
| KR20030064370A (ko) | 2003-07-31 |
| WO2002007199A1 (en) | 2002-01-24 |
| EP1325513A4 (en) | 2006-05-03 |
| US20020177319A1 (en) | 2002-11-28 |
| AU2001273136A1 (en) | 2002-01-30 |
| JP3987795B2 (ja) | 2007-10-10 |
| CN1299332C (zh) | 2007-02-07 |
| US7137803B2 (en) | 2006-11-21 |
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