AU2001273136A1 - Fluid pressure imprint lithography - Google Patents

Fluid pressure imprint lithography

Info

Publication number
AU2001273136A1
AU2001273136A1 AU2001273136A AU7313601A AU2001273136A1 AU 2001273136 A1 AU2001273136 A1 AU 2001273136A1 AU 2001273136 A AU2001273136 A AU 2001273136A AU 7313601 A AU7313601 A AU 7313601A AU 2001273136 A1 AU2001273136 A1 AU 2001273136A1
Authority
AU
Australia
Prior art keywords
fluid pressure
imprint lithography
pressure imprint
lithography
fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001273136A
Other languages
English (en)
Inventor
Stephen Y. Chou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanonex Corp
Original Assignee
Nanonex Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanonex Corp filed Critical Nanonex Corp
Publication of AU2001273136A1 publication Critical patent/AU2001273136A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/003—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor characterised by the choice of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B29C2043/023—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
    • B29C2043/025—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves forming a microstructure, i.e. fine patterning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C2043/3205—Particular pressure exerting means for making definite articles
    • B29C2043/3222—Particular pressure exerting means for making definite articles pressurized gas, e.g. air
    • B29C2043/3233—Particular pressure exerting means for making definite articles pressurized gas, e.g. air exerting pressure on mould parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C2043/3205—Particular pressure exerting means for making definite articles
    • B29C2043/3238—Particular pressure exerting means for making definite articles pressurized liquid acting directly or indirectly on the material to be formed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/56—Compression moulding under special conditions, e.g. vacuum
    • B29C2043/566—Compression moulding under special conditions, e.g. vacuum in a specific gas atmosphere, with or without pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking
    • Y10S438/945—Special, e.g. metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
AU2001273136A 2000-07-18 2001-07-02 Fluid pressure imprint lithography Abandoned AU2001273136A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/618,174 US6482742B1 (en) 2000-07-18 2000-07-18 Fluid pressure imprint lithography
US09618174 2000-07-18
PCT/US2001/021005 WO2002007199A1 (en) 2000-07-18 2001-07-02 Fluid pressure imprint lithography

Publications (1)

Publication Number Publication Date
AU2001273136A1 true AU2001273136A1 (en) 2002-01-30

Family

ID=24476613

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001273136A Abandoned AU2001273136A1 (en) 2000-07-18 2001-07-02 Fluid pressure imprint lithography

Country Status (7)

Country Link
US (3) US6482742B1 (enExample)
EP (1) EP1325513A4 (enExample)
JP (1) JP3987795B2 (enExample)
KR (1) KR100873587B1 (enExample)
CN (1) CN1299332C (enExample)
AU (1) AU2001273136A1 (enExample)
WO (1) WO2002007199A1 (enExample)

Families Citing this family (403)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080217813A1 (en) * 1995-11-15 2008-09-11 Chou Stephen Y Release surfaces, particularly for use in nanoimprint lithography
US20040036201A1 (en) * 2000-07-18 2004-02-26 Princeton University Methods and apparatus of field-induced pressure imprint lithography
US8728380B2 (en) * 1995-11-15 2014-05-20 Regents Of The University Of Minnesota Lithographic method for forming a pattern
US6713238B1 (en) * 1998-10-09 2004-03-30 Stephen Y. Chou Microscale patterning and articles formed thereby
AU777237B2 (en) 1998-10-09 2004-10-07 Arborgen Llc Materials and methods for the modification of plant lignin content
US6334960B1 (en) * 1999-03-11 2002-01-01 Board Of Regents, The University Of Texas System Step and flash imprint lithography
US6939474B2 (en) * 1999-07-30 2005-09-06 Formfactor, Inc. Method for forming microelectronic spring structures on a substrate
US7432634B2 (en) 2000-10-27 2008-10-07 Board Of Regents, University Of Texas System Remote center compliant flexure device
US6873087B1 (en) 1999-10-29 2005-03-29 Board Of Regents, The University Of Texas System High precision orientation alignment and gap control stages for imprint lithography processes
SE515607C2 (sv) * 1999-12-10 2001-09-10 Obducat Ab Anordning och metod vid tillverkning av strukturer
US6696220B2 (en) 2000-10-12 2004-02-24 Board Of Regents, The University Of Texas System Template for room temperature, low pressure micro-and nano-imprint lithography
EP2264524A3 (en) 2000-07-16 2011-11-30 The Board of Regents of The University of Texas System High-resolution overlay alignement methods and systems for imprint lithography
US20050160011A1 (en) * 2004-01-20 2005-07-21 Molecular Imprints, Inc. Method for concurrently employing differing materials to form a layer on a substrate
WO2002006902A2 (en) 2000-07-17 2002-01-24 Board Of Regents, The University Of Texas System Method and system of automatic fluid dispensing for imprint lithography processes
US7717696B2 (en) * 2000-07-18 2010-05-18 Nanonex Corp. Apparatus for double-sided imprint lithography
US7635262B2 (en) * 2000-07-18 2009-12-22 Princeton University Lithographic apparatus for fluid pressure imprint lithography
US20100236705A1 (en) * 2000-07-18 2010-09-23 Chou Stephen Y Fluidic and Microdevice Apparatus and Methods For Bonding Components Thereof
US7322287B2 (en) * 2000-07-18 2008-01-29 Nanonex Corporation Apparatus for fluid pressure imprint lithography
US20050037143A1 (en) * 2000-07-18 2005-02-17 Chou Stephen Y. Imprint lithography with improved monitoring and control and apparatus therefor
US20080164638A1 (en) * 2006-11-28 2008-07-10 Wei Zhang Method and apparatus for rapid imprint lithography
KR20030040378A (ko) 2000-08-01 2003-05-22 보드 오브 리전츠, 더 유니버시티 오브 텍사스 시스템 임프린트 리소그래피를 위한 투명한 템플릿과 기판사이의고정확성 갭 및 방향설정 감지 방법
WO2002017383A2 (en) 2000-08-21 2002-02-28 Board Of Regents, The University Of Texas System Flexure based translation stage
DE10059178C2 (de) * 2000-11-29 2002-11-07 Siemens Production & Logistics Verfahren zur Herstellung von Halbleitermodulen sowie nach dem Verfahren hergestelltes Modul
AUPR245201A0 (en) * 2001-01-10 2001-02-01 Silverbrook Research Pty Ltd An apparatus and method (WSM05)
US7019924B2 (en) * 2001-02-16 2006-03-28 Komag, Incorporated Patterned medium and recording head
US6964793B2 (en) 2002-05-16 2005-11-15 Board Of Regents, The University Of Texas System Method for fabricating nanoscale patterns in light curable compositions using an electric field
US9678038B2 (en) 2001-07-25 2017-06-13 The Trustees Of Princeton University Nanochannel arrays and their preparation and use for high throughput macromolecular analysis
SG169225A1 (en) 2001-07-25 2011-03-30 Univ Princeton Nanochannel arrays and their preparation and use for high throughput macromolecular analysis
US20030071016A1 (en) * 2001-10-11 2003-04-17 Wu-Sheng Shih Patterned structure reproduction using nonsticking mold
US6936181B2 (en) * 2001-10-11 2005-08-30 Kovio, Inc. Methods for patterning using liquid embossing
US20030080472A1 (en) * 2001-10-29 2003-05-01 Chou Stephen Y. Lithographic method with bonded release layer for molding small patterns
WO2003106693A2 (en) 2002-01-01 2003-12-24 Princeton University Gradient structures interfacing microfluidics and nanofluidics, methods for fabrication and uses thereof
US6743368B2 (en) * 2002-01-31 2004-06-01 Hewlett-Packard Development Company, L.P. Nano-size imprinting stamp using spacer technique
US20050190253A1 (en) * 2002-02-01 2005-09-01 Duineveld Paulus C. Structured polmer substrate for ink-jet printing of an oled matrix
US6716754B2 (en) * 2002-03-12 2004-04-06 Micron Technology, Inc. Methods of forming patterns and molds for semiconductor constructions
WO2003079416A1 (en) 2002-03-15 2003-09-25 Princeton University Laser assisted direct imprint lithography
US7144539B2 (en) * 2002-04-04 2006-12-05 Obducat Ab Imprint method and device
US7652574B2 (en) * 2002-04-08 2010-01-26 Sayegh Adel O Article surveillance tag having a vial
US7037639B2 (en) 2002-05-01 2006-05-02 Molecular Imprints, Inc. Methods of manufacturing a lithography template
US6897089B1 (en) * 2002-05-17 2005-05-24 Micron Technology, Inc. Method and system for fabricating semiconductor components using wafer level contact printing
JP2005527974A (ja) * 2002-05-24 2005-09-15 ワイ． チョウ，スティーヴン， 界誘導圧力インプリント・リソグラフィの方法および装置
DE60326724D1 (de) * 2002-05-30 2009-04-30 Ibm Strukturierungsverfahren
US6876784B2 (en) * 2002-05-30 2005-04-05 Nanoopto Corporation Optical polarization beam combiner/splitter
US7283571B2 (en) * 2002-06-17 2007-10-16 Jian Wang Method and system for performing wavelength locking of an optical transmission source
US7386205B2 (en) * 2002-06-17 2008-06-10 Jian Wang Optical device and method for making same
WO2003107046A2 (en) 2002-06-18 2003-12-24 Nanoopto Corporation Optical components exhibiting enhanced functionality and method of making same
US20080160129A1 (en) * 2006-05-11 2008-07-03 Molecular Imprints, Inc. Template Having a Varying Thickness to Facilitate Expelling a Gas Positioned Between a Substrate and the Template
US7179079B2 (en) * 2002-07-08 2007-02-20 Molecular Imprints, Inc. Conforming template for patterning liquids disposed on substrates
US6926929B2 (en) 2002-07-09 2005-08-09 Molecular Imprints, Inc. System and method for dispensing liquids
US7019819B2 (en) 2002-11-13 2006-03-28 Molecular Imprints, Inc. Chucking system for modulating shapes of substrates
US6900881B2 (en) 2002-07-11 2005-05-31 Molecular Imprints, Inc. Step and repeat imprint lithography systems
US6932934B2 (en) 2002-07-11 2005-08-23 Molecular Imprints, Inc. Formation of discontinuous films during an imprint lithography process
US7077992B2 (en) 2002-07-11 2006-07-18 Molecular Imprints, Inc. Step and repeat imprint lithography processes
US6908861B2 (en) 2002-07-11 2005-06-21 Molecular Imprints, Inc. Method for imprint lithography using an electric field
US7442336B2 (en) * 2003-08-21 2008-10-28 Molecular Imprints, Inc. Capillary imprinting technique
US6916584B2 (en) * 2002-08-01 2005-07-12 Molecular Imprints, Inc. Alignment methods for imprint lithography
US7070405B2 (en) 2002-08-01 2006-07-04 Molecular Imprints, Inc. Alignment systems for imprint lithography
WO2004013684A2 (en) 2002-08-01 2004-02-12 Nanoopto Corporation Precision phase retardation devices and method of making same
US7027156B2 (en) 2002-08-01 2006-04-11 Molecular Imprints, Inc. Scatterometry alignment for imprint lithography
US6911385B1 (en) * 2002-08-22 2005-06-28 Kovio, Inc. Interface layer for the fabrication of electronic devices
US7071088B2 (en) * 2002-08-23 2006-07-04 Molecular Imprints, Inc. Method for fabricating bulbous-shaped vias
US20040132301A1 (en) * 2002-09-12 2004-07-08 Harper Bruce M. Indirect fluid pressure imprinting
US6939120B1 (en) 2002-09-12 2005-09-06 Komag, Inc. Disk alignment apparatus and method for patterned media production
KR100492851B1 (ko) * 2002-09-26 2005-06-02 주식회사 미뉴타텍 좌굴 현상을 이용한 미세 패턴 형성 방법
US20040065252A1 (en) * 2002-10-04 2004-04-08 Sreenivasan Sidlgata V. Method of forming a layer on a substrate to facilitate fabrication of metrology standards
US8349241B2 (en) 2002-10-04 2013-01-08 Molecular Imprints, Inc. Method to arrange features on a substrate to replicate features having minimal dimensional variability
US20050167894A1 (en) * 2002-10-08 2005-08-04 Wu-Sheng Shih Patterned structure reproduction using nonsticking mold
US7013064B2 (en) * 2002-10-09 2006-03-14 Nanoopto Corporation Freespace tunable optoelectronic device and method
US6920272B2 (en) * 2002-10-09 2005-07-19 Nanoopto Corporation Monolithic tunable lasers and reflectors
US6929762B2 (en) 2002-11-13 2005-08-16 Molecular Imprints, Inc. Method of reducing pattern distortions during imprint lithography processes
US6980282B2 (en) * 2002-12-11 2005-12-27 Molecular Imprints, Inc. Method for modulating shapes of substrates
US7641840B2 (en) 2002-11-13 2010-01-05 Molecular Imprints, Inc. Method for expelling gas positioned between a substrate and a mold
US7147790B2 (en) * 2002-11-27 2006-12-12 Komag, Inc. Perpendicular magnetic discrete track recording disk
US20050036223A1 (en) * 2002-11-27 2005-02-17 Wachenschwanz David E. Magnetic discrete track recording disk
US20040197712A1 (en) * 2002-12-02 2004-10-07 Jacobson Joseph M. System for contact printing
US7750059B2 (en) * 2002-12-04 2010-07-06 Hewlett-Packard Development Company, L.P. Polymer solution for nanoimprint lithography to reduce imprint temperature and pressure
US7365103B2 (en) * 2002-12-12 2008-04-29 Board Of Regents, The University Of Texas System Compositions for dark-field polymerization and method of using the same for imprint lithography processes
US6871558B2 (en) 2002-12-12 2005-03-29 Molecular Imprints, Inc. Method for determining characteristics of substrate employing fluid geometries
US20040112862A1 (en) * 2002-12-12 2004-06-17 Molecular Imprints, Inc. Planarization composition and method of patterning a substrate using the same
MY136129A (en) * 2002-12-13 2008-08-29 Molecular Imprints Inc Magnification correction employing out-of-plane distortion of a substrate
GB0229191D0 (en) * 2002-12-14 2003-01-22 Plastic Logic Ltd Embossing of polymer devices
CN1726428A (zh) * 2002-12-16 2006-01-25 伊英克公司 电光显示器的底板
US7371975B2 (en) * 2002-12-18 2008-05-13 Intel Corporation Electronic packages and components thereof formed by substrate-imprinting
US20040126547A1 (en) * 2002-12-31 2004-07-01 Coomer Boyd L. Methods for performing substrate imprinting using thermoset resin varnishes and products formed therefrom
US6974775B2 (en) * 2002-12-31 2005-12-13 Intel Corporation Method and apparatus for making an imprinted conductive circuit using semi-additive plating
EP1597616A4 (en) * 2003-02-10 2008-04-09 Nanoopto Corp UNIVERSAL BROADBAND POLARIZER, DEVICES COMPRISING THE POLARIZER, AND METHOD FOR MANUFACTURING THE POLARIZER
US7452574B2 (en) 2003-02-27 2008-11-18 Molecular Imprints, Inc. Method to reduce adhesion between a polymerizable layer and a substrate employing a fluorine-containing layer
US7510946B2 (en) * 2003-03-17 2009-03-31 Princeton University Method for filling of nanoscale holes and trenches and for planarizing of a wafer surface
JP4340086B2 (ja) * 2003-03-20 2009-10-07 株式会社日立製作所 ナノプリント用スタンパ、及び微細構造転写方法
US7179396B2 (en) 2003-03-25 2007-02-20 Molecular Imprints, Inc. Positive tone bi-layer imprint lithography method
US7186656B2 (en) 2004-05-21 2007-03-06 Molecular Imprints, Inc. Method of forming a recessed structure employing a reverse tone process
US7122079B2 (en) 2004-02-27 2006-10-17 Molecular Imprints, Inc. Composition for an etching mask comprising a silicon-containing material
WO2004086471A1 (en) * 2003-03-27 2004-10-07 Korea Institute Of Machinery & Materials Uv nanoimprint lithography process using elementwise embossed stamp and selectively additive pressurization
US20040209123A1 (en) * 2003-04-17 2004-10-21 Bajorek Christopher H. Method of fabricating a discrete track recording disk using a bilayer resist for metal lift-off
US7396475B2 (en) 2003-04-25 2008-07-08 Molecular Imprints, Inc. Method of forming stepped structures employing imprint lithography
TW570290U (en) * 2003-05-02 2004-01-01 Ind Tech Res Inst Uniform pressing device for nanometer transfer-print
TW568349U (en) * 2003-05-02 2003-12-21 Ind Tech Res Inst Parallelism adjusting device for nano-transferring
US6926921B2 (en) 2003-05-05 2005-08-09 Hewlett-Packard Development Company, L.P. Imprint lithography for superconductor devices
US6951173B1 (en) 2003-05-14 2005-10-04 Molecular Imprints, Inc. Assembly and method for transferring imprint lithography templates
WO2004103666A2 (en) * 2003-05-14 2004-12-02 Molecular Imprints, Inc. Method, system, holder and assembly for transferring templates during imprint lithography processes
AU2003286423A1 (en) 2003-06-09 2005-01-04 Canon Kabushiki Kaisha Process for producing structure, structure thereof, and magnetic recording medium
CN100526052C (zh) * 2003-06-09 2009-08-12 普林斯顿大学知识产权和技术许可办公室 具有改进的监测和控制的压印光刻术及其设备
JP2005008909A (ja) * 2003-06-16 2005-01-13 Canon Inc 構造体の製造方法
US7307118B2 (en) 2004-11-24 2007-12-11 Molecular Imprints, Inc. Composition to reduce adhesion between a conformable region and a mold
US20040258355A1 (en) * 2003-06-17 2004-12-23 Jian Wang Micro-structure induced birefringent waveguiding devices and methods of making same
US7157036B2 (en) 2003-06-17 2007-01-02 Molecular Imprints, Inc Method to reduce adhesion between a conformable region and a pattern of a mold
US20060108710A1 (en) * 2004-11-24 2006-05-25 Molecular Imprints, Inc. Method to reduce adhesion between a conformable region and a mold
US7150622B2 (en) 2003-07-09 2006-12-19 Molecular Imprints, Inc. Systems for magnification and distortion correction for imprint lithography processes
JP2005045168A (ja) * 2003-07-25 2005-02-17 Tokyo Electron Ltd インプリント方法およびインプリント装置
JP4190371B2 (ja) 2003-08-26 2008-12-03 Ｔｄｋ株式会社 凹凸パターン形成用スタンパー、凹凸パターン形成方法および磁気記録媒体
US7136150B2 (en) 2003-09-25 2006-11-14 Molecular Imprints, Inc. Imprint lithography template having opaque alignment marks
US7588657B2 (en) * 2003-09-29 2009-09-15 Princeton University Pattern-free method of making line gratings
US7090716B2 (en) * 2003-10-02 2006-08-15 Molecular Imprints, Inc. Single phase fluid imprint lithography method
US8211214B2 (en) 2003-10-02 2012-07-03 Molecular Imprints, Inc. Single phase fluid imprint lithography method
US7261830B2 (en) * 2003-10-16 2007-08-28 Molecular Imprints, Inc. Applying imprinting material to substrates employing electromagnetic fields
US7122482B2 (en) 2003-10-27 2006-10-17 Molecular Imprints, Inc. Methods for fabricating patterned features utilizing imprint lithography
US20050098534A1 (en) * 2003-11-12 2005-05-12 Molecular Imprints, Inc. Formation of conductive templates employing indium tin oxide
US20050106321A1 (en) * 2003-11-14 2005-05-19 Molecular Imprints, Inc. Dispense geometery to achieve high-speed filling and throughput
EP1682340A2 (en) * 2003-11-12 2006-07-26 Molecular Imprints, Inc. Dispense geometry and conductive template to achieve high-speed filling and throughput
US20050112505A1 (en) * 2003-11-25 2005-05-26 Huang Wen C. Field-assisted micro- and nano-fabrication method
EP1538482B1 (en) * 2003-12-05 2016-02-17 Obducat AB Device and method for large area lithography
US7153360B2 (en) * 2003-12-16 2006-12-26 Hewlett-Packard Development Company, Lp. Template and methods for forming photonic crystals
KR100572207B1 (ko) * 2003-12-18 2006-04-19 주식회사 디지탈바이오테크놀러지 플라스틱 마이크로 칩의 접합 방법
US7632087B2 (en) * 2003-12-19 2009-12-15 Wd Media, Inc. Composite stamper for imprint lithography
KR100965424B1 (ko) * 2003-12-27 2010-06-24 엘지디스플레이 주식회사 평판 표시 소자의 제조방법 및 장치
US7255805B2 (en) * 2004-01-12 2007-08-14 Hewlett-Packard Development Company, L.P. Photonic structures, devices, and methods
US20050151282A1 (en) * 2004-01-13 2005-07-14 Harper Bruce M. Workpiece handler and alignment assembly
US20050150862A1 (en) * 2004-01-13 2005-07-14 Harper Bruce M. Workpiece alignment assembly
US20050151300A1 (en) * 2004-01-13 2005-07-14 Harper Bruce M. Workpiece isothermal imprinting
KR100566700B1 (ko) * 2004-01-15 2006-04-03 삼성전자주식회사 반도체 공정에서 포토레지스트 패턴 형성 방법,포토레지스트 패턴 형성용 템플레이트 및 이의 제조 방법.
US20050156353A1 (en) * 2004-01-15 2005-07-21 Watts Michael P. Method to improve the flow rate of imprinting material
US20050158419A1 (en) * 2004-01-15 2005-07-21 Watts Michael P. Thermal processing system for imprint lithography
US7686606B2 (en) * 2004-01-20 2010-03-30 Wd Media, Inc. Imprint embossing alignment system
US20050155554A1 (en) * 2004-01-20 2005-07-21 Saito Toshiyuki M. Imprint embossing system
US7329114B2 (en) * 2004-01-20 2008-02-12 Komag, Inc. Isothermal imprint embossing system
US9307648B2 (en) 2004-01-21 2016-04-05 Microcontinuum, Inc. Roll-to-roll patterning of transparent and metallic layers
US9039401B2 (en) 2006-02-27 2015-05-26 Microcontinuum, Inc. Formation of pattern replicating tools
US7462292B2 (en) * 2004-01-27 2008-12-09 Hewlett-Packard Development Company, L.P. Silicon carbide imprint stamp
US7060625B2 (en) * 2004-01-27 2006-06-13 Hewlett-Packard Development Company, L.P. Imprint stamp
KR100821379B1 (ko) * 2004-02-04 2008-04-11 스미도모쥬기가이고교 가부시키가이샤 가압성형장치, 금형 및 가압성형방법
US7056834B2 (en) * 2004-02-10 2006-06-06 Hewlett-Packard Development Company, L.P. Forming a plurality of thin-film devices using imprint lithography
US7019835B2 (en) * 2004-02-19 2006-03-28 Molecular Imprints, Inc. Method and system to measure characteristics of a film disposed on a substrate
US8076386B2 (en) 2004-02-23 2011-12-13 Molecular Imprints, Inc. Materials for imprint lithography
US20050189676A1 (en) * 2004-02-27 2005-09-01 Molecular Imprints, Inc. Full-wafer or large area imprinting with multiple separated sub-fields for high throughput lithography
US7906180B2 (en) 2004-02-27 2011-03-15 Molecular Imprints, Inc. Composition for an etching mask comprising a silicon-containing material
US7730834B2 (en) * 2004-03-04 2010-06-08 Asml Netherlands B.V. Printing apparatus and device manufacturing method
JP4481698B2 (ja) * 2004-03-29 2010-06-16 キヤノン株式会社 加工装置
US8235302B2 (en) * 2004-04-20 2012-08-07 Nanolnk, Inc. Identification features
US7140861B2 (en) 2004-04-27 2006-11-28 Molecular Imprints, Inc. Compliant hard template for UV imprinting
KR101185613B1 (ko) * 2004-04-27 2012-09-24 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 소프트 리소그래피용 복합 패터닝 장치
EP1594001B1 (en) * 2004-05-07 2015-12-30 Obducat AB Device and method for imprint lithography
US20050253307A1 (en) * 2004-05-11 2005-11-17 Molecualr Imprints, Inc. Method of patterning a conductive layer on a substrate
US8025831B2 (en) * 2004-05-24 2011-09-27 Agency For Science, Technology And Research Imprinting of supported and free-standing 3-D micro- or nano-structures
US7504268B2 (en) 2004-05-28 2009-03-17 Board Of Regents, The University Of Texas System Adaptive shape substrate support method
JP4954498B2 (ja) * 2004-06-01 2012-06-13 株式会社半導体エネルギー研究所 半導体装置の作製方法
TWI366218B (en) * 2004-06-01 2012-06-11 Semiconductor Energy Lab Method for manufacturing semiconductor device
US20050270516A1 (en) * 2004-06-03 2005-12-08 Molecular Imprints, Inc. System for magnification and distortion correction during nano-scale manufacturing
EP1768846B1 (en) * 2004-06-03 2010-08-11 Molecular Imprints, Inc. Fluid dispensing and drop-on-demand dispensing for nano-scale manufacturing
JP4574240B2 (ja) * 2004-06-11 2010-11-04 キヤノン株式会社 加工装置、加工方法、デバイス製造方法
US20070228593A1 (en) 2006-04-03 2007-10-04 Molecular Imprints, Inc. Residual Layer Thickness Measurement and Correction
TWI325851B (en) * 2004-06-18 2010-06-11 Hon Hai Prec Ind Co Ltd Method and device of manufacturing optical element
US7320584B1 (en) 2004-07-07 2008-01-22 Komag, Inc. Die set having sealed compliant member
US7785526B2 (en) * 2004-07-20 2010-08-31 Molecular Imprints, Inc. Imprint alignment method, system, and template
US7195950B2 (en) * 2004-07-21 2007-03-27 Hewlett-Packard Development Company, L.P. Forming a plurality of thin-film devices
AU2005266887B2 (en) * 2004-07-22 2011-08-18 Duska Scientific Co. Method of diagnosing, monitoring and treating pulmonary diseases
US20060017876A1 (en) * 2004-07-23 2006-01-26 Molecular Imprints, Inc. Displays and method for fabricating displays
US7105452B2 (en) * 2004-08-13 2006-09-12 Molecular Imprints, Inc. Method of planarizing a semiconductor substrate with an etching chemistry
US7309225B2 (en) * 2004-08-13 2007-12-18 Molecular Imprints, Inc. Moat system for an imprint lithography template
US7939131B2 (en) 2004-08-16 2011-05-10 Molecular Imprints, Inc. Method to provide a layer with uniform etch characteristics
US7282550B2 (en) * 2004-08-16 2007-10-16 Molecular Imprints, Inc. Composition to provide a layer with uniform etch characteristics
US20070164476A1 (en) * 2004-09-01 2007-07-19 Wei Wu Contact lithography apparatus and method employing substrate deformation
US7641468B2 (en) * 2004-09-01 2010-01-05 Hewlett-Packard Development Company, L.P. Imprint lithography apparatus and method employing an effective pressure
DK1789848T3 (da) * 2004-09-08 2010-10-25 Nil Technology Aps Fleksibelt nano-prægende stempel
US7547504B2 (en) 2004-09-21 2009-06-16 Molecular Imprints, Inc. Pattern reversal employing thick residual layers
US7241395B2 (en) * 2004-09-21 2007-07-10 Molecular Imprints, Inc. Reverse tone patterning on surfaces having planarity perturbations
SG147417A1 (en) 2004-09-21 2008-11-28 Molecular Imprints Inc Method of forming an in-situ recessed structure
US7252777B2 (en) * 2004-09-21 2007-08-07 Molecular Imprints, Inc. Method of forming an in-situ recessed structure
US7205244B2 (en) 2004-09-21 2007-04-17 Molecular Imprints Patterning substrates employing multi-film layers defining etch-differential interfaces
US7041604B2 (en) * 2004-09-21 2006-05-09 Molecular Imprints, Inc. Method of patterning surfaces while providing greater control of recess anisotropy
US20060062922A1 (en) 2004-09-23 2006-03-23 Molecular Imprints, Inc. Polymerization technique to attenuate oxygen inhibition of solidification of liquids and composition therefor
US7244386B2 (en) 2004-09-27 2007-07-17 Molecular Imprints, Inc. Method of compensating for a volumetric shrinkage of a material disposed upon a substrate to form a substantially planar structure therefrom
US20060081557A1 (en) * 2004-10-18 2006-04-20 Molecular Imprints, Inc. Low-k dielectric functional imprinting materials
US8721952B2 (en) * 2004-11-16 2014-05-13 International Business Machines Corporation Pneumatic method and apparatus for nano imprint lithography having a conforming mask
CN100395121C (zh) * 2004-11-19 2008-06-18 鸿富锦精密工业（深圳）有限公司 热压印方法
EP1815968A1 (en) * 2004-11-22 2007-08-08 Sumitomo Electric Industries, Ltd. Processing method, processing apparatus, and fine structure produced by the method
US7292326B2 (en) 2004-11-30 2007-11-06 Molecular Imprints, Inc. Interferometric analysis for the manufacture of nano-scale devices
US7630067B2 (en) 2004-11-30 2009-12-08 Molecular Imprints, Inc. Interferometric analysis method for the manufacture of nano-scale devices
US20070231421A1 (en) 2006-04-03 2007-10-04 Molecular Imprints, Inc. Enhanced Multi Channel Alignment
EP1820619A4 (en) 2004-11-30 2010-07-07 Asahi Glass Co Ltd MOLDING TOOL AND METHOD FOR PRODUCING SUBSTRATES WITH TRANSFERRED MICROMUSTERS THEREFOR
WO2006060757A2 (en) 2004-12-01 2006-06-08 Molecular Imprints, Inc. Eliminating printability of sub-resolution defects in imprint lithography
JP5198071B2 (ja) * 2004-12-01 2013-05-15 モレキュラー・インプリンツ・インコーポレーテッド インプリントリソグラフィ・プロセスにおける熱管理のための露光方法
US7281919B2 (en) 2004-12-07 2007-10-16 Molecular Imprints, Inc. System for controlling a volume of material on a mold
JP2006165371A (ja) * 2004-12-09 2006-06-22 Canon Inc 転写装置およびデバイス製造方法
KR100616292B1 (ko) 2004-12-15 2006-08-28 주식회사 디엠에스 식각 영역을 만들기 위한 장치
US7409759B2 (en) * 2004-12-16 2008-08-12 Asml Holding N.V. Method for making a computer hard drive platen using a nano-plate
US7331283B2 (en) * 2004-12-16 2008-02-19 Asml Holding N.V. Method and apparatus for imprint pattern replication
US7363854B2 (en) * 2004-12-16 2008-04-29 Asml Holding N.V. System and method for patterning both sides of a substrate utilizing imprint lithography
US7410591B2 (en) * 2004-12-16 2008-08-12 Asml Holding N.V. Method and system for making a nano-plate for imprint lithography
US7399422B2 (en) * 2005-11-29 2008-07-15 Asml Holding N.V. System and method for forming nanodisks used in imprint lithography and nanodisk and memory disk formed thereby
US8069782B2 (en) * 2004-12-20 2011-12-06 Nanoink, Inc. Stamps with micrometer- and nanometer-scale features and methods of fabrication thereof
US7676088B2 (en) * 2004-12-23 2010-03-09 Asml Netherlands B.V. Imprint lithography
KR100633019B1 (ko) * 2004-12-24 2006-10-12 한국기계연구원 미세 임프린트 리소그래피 공정에서 스탬프와 기판의이격공정 및 그 장치
US7490547B2 (en) * 2004-12-30 2009-02-17 Asml Netherlands B.V. Imprint lithography
US20060144814A1 (en) * 2004-12-30 2006-07-06 Asml Netherlands B.V. Imprint lithography
US20060144274A1 (en) * 2004-12-30 2006-07-06 Asml Netherlands B.V. Imprint lithography
US7686970B2 (en) * 2004-12-30 2010-03-30 Asml Netherlands B.V. Imprint lithography
US7354698B2 (en) * 2005-01-07 2008-04-08 Asml Netherlands B.V. Imprint lithography
KR100632556B1 (ko) * 2005-01-28 2006-10-11 삼성전기주식회사 인쇄회로기판의 제조방법
US7636999B2 (en) 2005-01-31 2009-12-29 Molecular Imprints, Inc. Method of retaining a substrate to a wafer chuck
US20060177535A1 (en) * 2005-02-04 2006-08-10 Molecular Imprints, Inc. Imprint lithography template to facilitate control of liquid movement
US7798801B2 (en) * 2005-01-31 2010-09-21 Molecular Imprints, Inc. Chucking system for nano-manufacturing
US7635263B2 (en) 2005-01-31 2009-12-22 Molecular Imprints, Inc. Chucking system comprising an array of fluid chambers
US20060177532A1 (en) * 2005-02-04 2006-08-10 Molecular Imprints, Inc. Imprint lithography method to control extrusion of a liquid from a desired region on a substrate
KR101117985B1 (ko) * 2005-02-02 2012-03-06 엘지디스플레이 주식회사 평판표시소자의 제조장치 및 제조방법
US7922474B2 (en) * 2005-02-17 2011-04-12 Asml Netherlands B.V. Imprint lithography
US8097400B2 (en) * 2005-02-22 2012-01-17 Hewlett-Packard Development Company, L.P. Method for forming an electronic device
TWI261308B (en) * 2005-03-02 2006-09-01 Ind Tech Res Inst Micro-nanometer transfer printer
CN1831644B (zh) * 2005-03-07 2010-12-22 财团法人工业技术研究院 微纳米转印装置
US7523701B2 (en) * 2005-03-07 2009-04-28 Asml Netherlands B.V. Imprint lithography method and apparatus
KR100729427B1 (ko) * 2005-03-07 2007-06-15 주식회사 디엠에스 미세패턴 형성장치
US7281920B2 (en) * 2005-03-28 2007-10-16 Komag, Inc. Die set utilizing compliant gasket
US7611348B2 (en) * 2005-04-19 2009-11-03 Asml Netherlands B.V. Imprint lithography
US7762186B2 (en) * 2005-04-19 2010-07-27 Asml Netherlands B.V. Imprint lithography
KR101319775B1 (ko) * 2005-04-21 2013-10-17 아사히 가라스 가부시키가이샤 광경화성 조성물, 미세 패턴 형성체 및 그 제조 방법
TWI271777B (en) * 2005-04-27 2007-01-21 Ind Tech Res Inst Uniform pressing micro-nano transfer printing apparatus
JP4736522B2 (ja) * 2005-04-28 2011-07-27 旭硝子株式会社 エッチング処理された処理基板の製造方法
JP4742665B2 (ja) * 2005-04-28 2011-08-10 旭硝子株式会社 エッチング処理された処理基板の製造方法
CN100505147C (zh) * 2005-04-30 2009-06-24 财团法人工业技术研究院 用于微纳米转印的均压装置
CN101198904B (zh) * 2005-05-10 2011-04-13 陶氏康宁公司 亚微米印花转移光刻术
US7767129B2 (en) * 2005-05-11 2010-08-03 Micron Technology, Inc. Imprint templates for imprint lithography, and methods of patterning a plurality of substrates
US7442029B2 (en) * 2005-05-16 2008-10-28 Asml Netherlands B.V. Imprint lithography
US20060266916A1 (en) * 2005-05-25 2006-11-30 Molecular Imprints, Inc. Imprint lithography template having a coating to reflect and/or absorb actinic energy
US7692771B2 (en) * 2005-05-27 2010-04-06 Asml Netherlands B.V. Imprint lithography
US7708924B2 (en) * 2005-07-21 2010-05-04 Asml Netherlands B.V. Imprint lithography
US20060267231A1 (en) * 2005-05-27 2006-11-30 Asml Netherlands B.V. Imprint lithography
US7418902B2 (en) * 2005-05-31 2008-09-02 Asml Netherlands B.V. Imprint lithography including alignment
KR20060127811A (ko) * 2005-06-07 2006-12-13 오브듀캇 아베 분리 장치 및 방법
US7377764B2 (en) * 2005-06-13 2008-05-27 Asml Netherlands B.V. Imprint lithography
US20080202360A1 (en) * 2005-06-13 2008-08-28 Korea Institute Of Machinery & Materials Imprinting Apparatus For Forming Pattern at Uniform Contact by Additional Constant Pressure
KR101048712B1 (ko) * 2005-06-24 2011-07-14 엘지디스플레이 주식회사 소프트 몰드를 이용한 미세패턴 형성방법
US7256131B2 (en) * 2005-07-19 2007-08-14 Molecular Imprints, Inc. Method of controlling the critical dimension of structures formed on a substrate
US7759407B2 (en) 2005-07-22 2010-07-20 Molecular Imprints, Inc. Composition for adhering materials together
US8557351B2 (en) 2005-07-22 2013-10-15 Molecular Imprints, Inc. Method for adhering materials together
US8808808B2 (en) 2005-07-22 2014-08-19 Molecular Imprints, Inc. Method for imprint lithography utilizing an adhesion primer layer
US20070023976A1 (en) * 2005-07-26 2007-02-01 Asml Netherlands B.V. Imprint lithography
EP1920295A2 (en) * 2005-08-10 2008-05-14 The President and Fellows of Harvard College Methods of using a nanotransfer printing stamp having conductively coated sidewalls
US7766640B2 (en) * 2005-08-12 2010-08-03 Hewlett-Packard Development Company, L.P. Contact lithography apparatus, system and method
US20070035717A1 (en) 2005-08-12 2007-02-15 Wei Wu Contact lithography apparatus, system and method
US20070064384A1 (en) * 2005-08-25 2007-03-22 Molecular Imprints, Inc. Method to transfer a template transfer body between a motion stage and a docking plate
US20070074635A1 (en) * 2005-08-25 2007-04-05 Molecular Imprints, Inc. System to couple a body and a docking plate
US7665981B2 (en) 2005-08-25 2010-02-23 Molecular Imprints, Inc. System to transfer a template transfer body between a motion stage and a docking plate
KR100758699B1 (ko) * 2005-08-29 2007-09-14 재단법인서울대학교산학협력재단 고종횡비 나노구조물 형성방법 및 이를 이용한 미세패턴형성방법
US20090039563A1 (en) * 2005-08-30 2009-02-12 Riken Method of forming fine pattern
JP2008294009A (ja) * 2005-09-05 2008-12-04 Scivax Kk 圧力を制御した微細加工方法および微細加工装置
US7670534B2 (en) 2005-09-21 2010-03-02 Molecular Imprints, Inc. Method to control an atmosphere between a body and a substrate
US7491049B2 (en) * 2005-09-30 2009-02-17 Hon Hai Precision Industry Co., Ltd. Apparatus for hot embossing lithography
US8142703B2 (en) * 2005-10-05 2012-03-27 Molecular Imprints, Inc. Imprint lithography method
US20070267764A1 (en) * 2005-10-25 2007-11-22 Dai Nippon Printing Co., Ltd. Mold for photocuring nano-imprint and its fabrication process
US8011915B2 (en) 2005-11-04 2011-09-06 Asml Netherlands B.V. Imprint lithography
US7677877B2 (en) * 2005-11-04 2010-03-16 Asml Netherlands B.V. Imprint lithography
US7878791B2 (en) * 2005-11-04 2011-02-01 Asml Netherlands B.V. Imprint lithography
KR100699270B1 (ko) 2005-11-19 2007-03-28 삼성전자주식회사 패턴형성장치
KR100699092B1 (ko) * 2005-11-22 2007-03-23 삼성전자주식회사 패턴형성방법과 패턴형성장치
US7803308B2 (en) 2005-12-01 2010-09-28 Molecular Imprints, Inc. Technique for separating a mold from solidified imprinting material
US7906058B2 (en) 2005-12-01 2011-03-15 Molecular Imprints, Inc. Bifurcated contact printing technique
US20070125475A1 (en) * 2005-12-05 2007-06-07 Huber Engineered Woods Llc Handheld tape applicator and components thereof, and their methods of use
JP4987012B2 (ja) 2005-12-08 2012-07-25 モレキュラー・インプリンツ・インコーポレーテッド 基板の両面パターニングする方法及びシステム
US7670530B2 (en) 2006-01-20 2010-03-02 Molecular Imprints, Inc. Patterning substrates employing multiple chucks
US20070138699A1 (en) * 2005-12-21 2007-06-21 Asml Netherlands B.V. Imprint lithography
US7517211B2 (en) * 2005-12-21 2009-04-14 Asml Netherlands B.V. Imprint lithography
US7943080B2 (en) * 2005-12-23 2011-05-17 Asml Netherlands B.V. Alignment for imprint lithography
US7377765B2 (en) 2006-02-14 2008-05-27 Hitachi Global Storage Technologies System, method, and apparatus for non-contact and diffuse curing exposure for making photopolymer nanoimprinting stamper
JP2007250685A (ja) * 2006-03-14 2007-09-27 Engineering System Kk ナノインプリント装置の型押し機構
US7862756B2 (en) * 2006-03-30 2011-01-04 Asml Netherland B.V. Imprint lithography
US8001924B2 (en) * 2006-03-31 2011-08-23 Asml Netherlands B.V. Imprint lithography
US7802978B2 (en) 2006-04-03 2010-09-28 Molecular Imprints, Inc. Imprinting of partial fields at the edge of the wafer
US8850980B2 (en) 2006-04-03 2014-10-07 Canon Nanotechnologies, Inc. Tessellated patterns in imprint lithography
US8142850B2 (en) 2006-04-03 2012-03-27 Molecular Imprints, Inc. Patterning a plurality of fields on a substrate to compensate for differing evaporation times
JP5306989B2 (ja) 2006-04-03 2013-10-02 モレキュラー・インプリンツ・インコーポレーテッド 複数のフィールド及びアライメント・マークを有する基板を同時にパターニングする方法
CN101405087A (zh) * 2006-04-03 2009-04-08 分子制模股份有限公司 光刻印刷系统
JP4814682B2 (ja) * 2006-04-18 2011-11-16 株式会社日立ハイテクノロジーズ 微細構造パターンの転写方法及び転写装置
US7547398B2 (en) 2006-04-18 2009-06-16 Molecular Imprints, Inc. Self-aligned process for fabricating imprint templates containing variously etched features
US8012395B2 (en) 2006-04-18 2011-09-06 Molecular Imprints, Inc. Template having alignment marks formed of contrast material
US7854867B2 (en) * 2006-04-21 2010-12-21 Molecular Imprints, Inc. Method for detecting a particle in a nanoimprint lithography system
US7998651B2 (en) * 2006-05-15 2011-08-16 Asml Netherlands B.V. Imprint lithography
JP4830170B2 (ja) * 2006-05-15 2011-12-07 学校法人早稲田大学 転写装置
US8215946B2 (en) 2006-05-18 2012-07-10 Molecular Imprints, Inc. Imprint lithography system and method
KR100857521B1 (ko) * 2006-06-13 2008-09-08 엘지디스플레이 주식회사 박막트랜지스터 제조용 몰드의 제조방법 및 그 제조장비
US8015939B2 (en) * 2006-06-30 2011-09-13 Asml Netherlands B.V. Imprintable medium dispenser
US8318253B2 (en) * 2006-06-30 2012-11-27 Asml Netherlands B.V. Imprint lithography
KR20080004983A (ko) * 2006-07-07 2008-01-10 삼성전자주식회사 도광판 패턴 형성 장치 및 도광판의 제조 방법
JP4996150B2 (ja) * 2006-07-07 2012-08-08 株式会社日立ハイテクノロジーズ 微細構造転写装置および微細構造転写方法
US20080020303A1 (en) * 2006-07-24 2008-01-24 Wei Wu Alignment for contact lithography
JP5002207B2 (ja) * 2006-07-26 2012-08-15 キヤノン株式会社 パターンを有する構造体の製造方法
WO2008014519A2 (en) * 2006-07-28 2008-01-31 Microcontinuum, Inc. Addressable flexible patterns
US8629986B2 (en) * 2006-08-09 2014-01-14 Biozoom Technologies, Inc. Optical filter and method for the production of the same, and device for the examination of electromagnetic radiation
JP4654299B2 (ja) * 2006-09-15 2011-03-16 株式会社日立ハイテクノロジーズ 走査型電子顕微鏡点収差計測アライメントチップ
US7830498B2 (en) * 2006-10-10 2010-11-09 Hewlett-Packard Development Company, L.P. Hydraulic-facilitated contact lithography apparatus, system and method
US7618752B2 (en) * 2006-10-12 2009-11-17 Hewlett-Packard Development Company, L.P. Deformation-based contact lithography systems, apparatus and methods
KR100772441B1 (ko) * 2006-10-12 2007-11-01 삼성전기주식회사 임프린팅용 스탬퍼 제조방법
US7768628B2 (en) * 2006-10-12 2010-08-03 Hewlett-Packard Development Company, L.P. Contact lithography apparatus and method
US20080089470A1 (en) * 2006-10-13 2008-04-17 Walmsley Robert G Alignment for contact lithography
US20080090160A1 (en) * 2006-10-13 2008-04-17 Jason Blackstock Alignment for contact lithography
KR100846510B1 (ko) * 2006-12-22 2008-07-17 삼성전자주식회사 자구벽 이동을 이용한 정보 저장 장치 및 그 제조방법
US7957175B2 (en) * 2006-12-22 2011-06-07 Samsung Electronics Co., Ltd. Information storage devices using movement of magnetic domain walls and methods of manufacturing the same
KR101319325B1 (ko) * 2006-12-29 2013-10-16 엘지디스플레이 주식회사 패턴의 형성 방법
KR100930925B1 (ko) 2006-12-30 2009-12-10 고려대학교 산학협력단 복합 임프린팅 스탬프 및 그 제조방법
CN101675174A (zh) 2007-02-13 2010-03-17 耶鲁大学 压印和擦除非晶态金属合金的方法
US8940117B2 (en) 2007-02-27 2015-01-27 Microcontinuum, Inc. Methods and systems for forming flexible multilayer structures
JP4985946B2 (ja) * 2007-03-08 2012-07-25 セイコーエプソン株式会社 電子装置の製造方法
US8722327B2 (en) * 2007-03-28 2014-05-13 Bionano Genomics, Inc. Methods of macromolecular analysis using nanochannel arrays
JP5064078B2 (ja) * 2007-03-30 2012-10-31 株式会社日立産機システム 微細パターン転写用金型およびそれを用いた樹脂製転写物の製造方法
JP2009001002A (ja) 2007-05-24 2009-01-08 Univ Waseda モールド、その製造方法および転写微細パターンを有する基材の製造方法
US20090115094A1 (en) * 2007-05-29 2009-05-07 Chou Stephen Y Methods for making continuous nanochannels
US8557082B2 (en) * 2007-07-18 2013-10-15 Watlow Electric Manufacturing Company Reduced cycle time manufacturing processes for thick film resistive devices
US20090038636A1 (en) * 2007-08-09 2009-02-12 Asml Netherlands B.V. Cleaning method
US7854877B2 (en) 2007-08-14 2010-12-21 Asml Netherlands B.V. Lithography meandering order
KR101289337B1 (ko) * 2007-08-29 2013-07-29 시게이트 테크놀로지 엘엘씨 양면 임프린트 리소그래피 장치
US8144309B2 (en) * 2007-09-05 2012-03-27 Asml Netherlands B.V. Imprint lithography
US20100215794A1 (en) * 2007-09-06 2010-08-26 Entire Technology Co., Ltd. Diffusion film molding tool & manufacturing process thereof
KR100856559B1 (ko) 2007-09-20 2008-09-04 국민대학교산학협력단 나노 임프린트 장비의 온도환경 제어기 및 이를 구비한나노 임프린트 장비
JP4885816B2 (ja) * 2007-09-27 2012-02-29 富士フイルム株式会社 機能性膜の製造方法および製造装置
JP2009083125A (ja) * 2007-09-27 2009-04-23 Fujifilm Corp 機能性膜の製造方法および製造装置
US8278047B2 (en) 2007-10-01 2012-10-02 Nabsys, Inc. Biopolymer sequencing by hybridization of probes to form ternary complexes and variable range alignment
TWI444282B (zh) 2007-10-19 2014-07-11 Showa Denko Kk 樹脂壓模（ｓｔａｍｐｅｒ）之製造方法及製造裝置及壓印（ｉｍｐｒｉｎｔ）方法、以及磁性記錄媒體及磁性記錄再生裝置
US20100297228A1 (en) * 2007-10-29 2010-11-25 Nanolnk, Inc. Universal coating for imprinting identification features
CN101889325B (zh) * 2007-12-06 2014-05-07 因特瓦克公司 用于衬底的两侧溅射蚀刻的系统和方法
KR100887529B1 (ko) 2007-12-20 2009-03-06 주식회사 디엠에스 스탬프 표면처리 장치 및 방법
JP4578517B2 (ja) * 2007-12-26 2010-11-10 Ｓｃｉｖａｘ株式会社 インプリント装置およびインプリント方法
TW200932502A (en) * 2008-01-18 2009-08-01 Univ Nat Taiwan An improved embossing apparatus
TW201001624A (en) * 2008-01-24 2010-01-01 Soligie Inc Silicon thin film transistors, systems, and methods of making same
TWI342862B (en) 2008-01-31 2011-06-01 Univ Nat Taiwan Method of micro/nano imprinting
JPWO2009110596A1 (ja) 2008-03-07 2011-07-14 昭和電工株式会社 Ｕｖナノインプリント方法、樹脂製レプリカモールド及びその製造方法、磁気記録媒体及びその製造方法、並びに磁気記録再生装置
US20090244762A1 (en) * 2008-03-31 2009-10-01 Fujifilm Corporation Resist pattern forming method, mold structure producing method, magnetic recording medium producing method, magnetic transfer method and magnetic recording medium
WO2010004006A2 (de) * 2008-07-10 2010-01-14 Singulus Technologies Ag Vorrichtung und verfahren zum prägen von strukturen in einem substrat, insbesondere in optischen datenträgern, halbleiterstrukturen und mikrostrukturen
US20100015270A1 (en) * 2008-07-15 2010-01-21 Molecular Imprints, Inc. Inner cavity system for nano-imprint lithography
US8882980B2 (en) 2008-09-03 2014-11-11 Nabsys, Inc. Use of longitudinally displaced nanoscale electrodes for voltage sensing of biomolecules and other analytes in fluidic channels
US9650668B2 (en) 2008-09-03 2017-05-16 Nabsys 2.0 Llc Use of longitudinally displaced nanoscale electrodes for voltage sensing of biomolecules and other analytes in fluidic channels
US8262879B2 (en) 2008-09-03 2012-09-11 Nabsys, Inc. Devices and methods for determining the length of biopolymers and distances between probes bound thereto
US20100096764A1 (en) * 2008-10-20 2010-04-22 Molecular Imprints, Inc. Gas Environment for Imprint Lithography
US8309003B2 (en) * 2008-10-30 2012-11-13 Lg Display Co., Ltd. In-plane printing resin material and method of manufacturing liquid crystal display device using the same
EP2194428A1 (en) * 2008-12-08 2010-06-09 Jung-Chung Hung Uniform pressing apparatus for use in a micro-nano imprint process
TWI384287B (zh) * 2008-12-15 2013-02-01 Taiwan Name Plate Co Ltd Hot pressing light guide plate device
TWI395655B (zh) * 2009-01-16 2013-05-11 Chenming Mold Ind Corp Microstructure forming device and method thereof
KR101336532B1 (ko) 2009-02-27 2013-12-03 미쓰이 가가쿠 가부시키가이샤 전사체 및 그의 제조방법
US8715515B2 (en) * 2009-03-23 2014-05-06 Intevac, Inc. Process for optimization of island to trench ratio in patterned media
WO2010151886A2 (en) * 2009-06-26 2010-12-29 The Arizona Board Of Regents On Behalf Of The University Of Arizona Nano-architectured carbon structures and methods for fabricating same
NL2004685A (en) 2009-07-27 2011-01-31 Asml Netherlands Bv Imprint lithography apparatus and method.
CN102482364B (zh) 2009-08-26 2013-08-28 三井化学株式会社 含氟环状烯烃聚合物组合物、由该组合物获得的转印体及其制造方法
JP5540628B2 (ja) * 2009-09-28 2014-07-02 大日本印刷株式会社 ナノインプリントパターン形成方法
DK2483744T3 (en) 2009-10-02 2016-07-18 Univ Danmarks Tekniske INJECTION MOLDING TOOL WITH micro / nano-METER PATTERNS
US9330685B1 (en) * 2009-11-06 2016-05-03 WD Media, LLC Press system for nano-imprinting of recording media with a two step pressing method
US8402638B1 (en) 2009-11-06 2013-03-26 Wd Media, Inc. Press system with embossing foil free to expand for nano-imprinting of recording media
US8496466B1 (en) 2009-11-06 2013-07-30 WD Media, LLC Press system with interleaved embossing foil holders for nano-imprinting of recording media
US8747092B2 (en) * 2010-01-22 2014-06-10 Nanonex Corporation Fast nanoimprinting apparatus using deformale mold
DE102010007970A1 (de) * 2010-02-15 2011-08-18 Suss MicroTec Lithography GmbH, 85748 Verfahren und Vorrichtung zum aktiven Keilfehlerausgleich zwischen zwei im wesentlichen zueinander parallel positionierbaren Gegenständen
US20110203656A1 (en) * 2010-02-24 2011-08-25 Iowa State University Research Foundation, Inc. Nanoscale High-Aspect-Ratio Metallic Structure and Method of Manufacturing Same
JP5833636B2 (ja) * 2010-04-27 2015-12-16 モレキュラー・インプリンツ・インコーポレーテッド ナノインプリント・リソグラフィのテンプレート製作方法およびそのシステム
US20110291330A1 (en) 2010-05-27 2011-12-01 Mircea Despa Replication method and articles of the method
JP5504054B2 (ja) * 2010-05-27 2014-05-28 株式会社東芝 インプリントマスク、その製造方法、及び半導体装置の製造方法
JP5539113B2 (ja) * 2010-08-30 2014-07-02 キヤノン株式会社 インプリント装置及び物品の製造方法
US8715933B2 (en) 2010-09-27 2014-05-06 Nabsys, Inc. Assay methods using nicking endonucleases
US8859201B2 (en) 2010-11-16 2014-10-14 Nabsys, Inc. Methods for sequencing a biomolecule by detecting relative positions of hybridized probes
US8845912B2 (en) 2010-11-22 2014-09-30 Microcontinuum, Inc. Tools and methods for forming semi-transparent patterning masks
US11274341B2 (en) 2011-02-11 2022-03-15 NABsys, 2.0 LLC Assay methods using DNA binding proteins
FR2972298B1 (fr) * 2011-03-04 2015-07-31 Commissariat Energie Atomique Procede de metallisation de surfaces texturees
JP2012190877A (ja) 2011-03-09 2012-10-04 Fujifilm Corp ナノインプリント方法およびそれに用いられるナノインプリント装置
US8979523B2 (en) * 2011-07-08 2015-03-17 Xtek Ltd. Process for the manufacture of multilayer articles
US9064808B2 (en) 2011-07-25 2015-06-23 Synopsys, Inc. Integrated circuit devices having features with reduced edge curvature and methods for manufacturing the same
RU2476917C1 (ru) * 2011-08-12 2013-02-27 Открытое акционерное общество "НИИ молекулярной электроники и завод "Микрон" Способ изготовления штампа для наноимпринт литографии
US8609550B2 (en) * 2011-09-08 2013-12-17 Synopsys, Inc. Methods for manufacturing integrated circuit devices having features with reduced edge curvature
KR20140069207A (ko) * 2011-09-23 2014-06-09 1366 테크놀로지 인코포레이티드 기판 수송, 공구 레이다운, 공구 텐셔닝 및 공구 철수를 포함한, 열유동성 재료 피복에서 공구에 의해 패턴을 형성하는 기판의 취급, 가열 및 냉각 방법 및 장치
JP5203493B2 (ja) 2011-09-29 2013-06-05 シャープ株式会社 成形装置および成形方法
FR2990384B1 (fr) * 2012-05-14 2015-05-15 Saint Gobain Procede de texturation sur un substrat de grande surface
US20130337176A1 (en) * 2012-06-19 2013-12-19 Seagate Technology Llc Nano-scale void reduction
US20140239529A1 (en) * 2012-09-28 2014-08-28 Nanonex Corporation System and Methods For Nano-Scale Manufacturing
JP5949430B2 (ja) 2012-10-18 2016-07-06 富士通株式会社 インプリント装置及びインプリント方法
US8834146B2 (en) 2012-10-24 2014-09-16 Massachusetts Institute Of Technology System for passive alignment of surfaces
US9914966B1 (en) 2012-12-20 2018-03-13 Nabsys 2.0 Llc Apparatus and methods for analysis of biomolecules using high frequency alternating current excitation
US10294516B2 (en) 2013-01-18 2019-05-21 Nabsys 2.0 Llc Enhanced probe binding
WO2014145360A1 (en) * 2013-03-15 2014-09-18 Nanonex Corporation Imprint lithography system and method for manufacturing
US10108086B2 (en) 2013-03-15 2018-10-23 Nanonex Corporation System and methods of mold/substrate separation for imprint lithography
US9728802B2 (en) * 2013-05-14 2017-08-08 Giner, Inc. Micromold methods for fabricating perforated substrates and for preparing solid polymer electrolyte composite membranes
US9589797B2 (en) 2013-05-17 2017-03-07 Microcontinuum, Inc. Tools and methods for producing nanoantenna electronic devices
JP2017010962A (ja) 2015-06-16 2017-01-12 株式会社東芝 デバイス基板およびデバイス基板の製造方法並びに半導体装置の製造方法
CN106597811B (zh) * 2015-10-16 2019-03-08 中芯国际集成电路制造(上海)有限公司 用于监测光刻机成像平面异常的方法
JP2019510540A (ja) 2016-02-05 2019-04-18 ハヴィ グローバル ソリューションズ、エルエルシー 改善された断熱および結露耐性を有する微細構造の表面
US10687642B2 (en) 2016-02-05 2020-06-23 Havi Global Solutions, Llc Microstructured packaging surfaces for enhanced grip
CN109475465A (zh) 2016-04-07 2019-03-15 哈维全球解决方案有限责任公司 具有内部微结构的流体囊
JP6220918B2 (ja) * 2016-04-22 2017-10-25 株式会社写真化学 電子デバイス用の転写装置および電子デバイス用の転写方法
KR102336560B1 (ko) 2016-05-25 2021-12-08 다이니폰 인사츠 가부시키가이샤 템플릿 및 템플릿 블랭크, 그리고 임프린트용 템플릿 기판의 제조 방법, 임프린트용 템플릿의 제조 방법 및 템플릿
TWI672212B (zh) * 2016-08-25 2019-09-21 國立成功大學 奈米壓印組合體及其壓印方法
US10895806B2 (en) * 2017-09-29 2021-01-19 Canon Kabushiki Kaisha Imprinting method and apparatus
FR3073322B1 (fr) * 2017-11-07 2021-12-03 Commissariat Energie Atomique Procede de realisation d'au moins un circuit electronique courbe
CN112041744B (zh) * 2018-05-04 2024-08-13 Ev集团E·索尔纳有限责任公司 印模和用于压印的方法
US11139402B2 (en) 2018-05-14 2021-10-05 Synopsys, Inc. Crystal orientation engineering to achieve consistent nanowire shapes
DE102018215939A1 (de) * 2018-09-19 2020-03-19 Profol GmbH Werkzeug zum Aufbringen einer Folie
US11264458B2 (en) 2019-05-20 2022-03-01 Synopsys, Inc. Crystal orientation engineering to achieve consistent nanowire shapes
WO2020246457A1 (ja) * 2019-06-05 2020-12-10 Ｓｃｉｖａｘ株式会社 貼り合わせ体製造方法、貼り合わせ体および微細構造形成方法
KR20220120579A (ko) * 2019-12-25 2022-08-30 싸이백스 가부시키가이샤 임프린트 장치 및 임프린트 방법
CN111640651A (zh) * 2020-01-19 2020-09-08 中国科学技术大学 基于离子轰击技术的亚波长表面纳米结构及其制备方法
CN111562719B (zh) * 2020-06-15 2022-06-21 京东方科技集团股份有限公司 纳米压印模板及其制造方法和脱模方法
CN115812179A (zh) * 2020-07-06 2023-03-17 Ev 集团 E·索尔纳有限责任公司 制造微结构及/或奈米结构之方法及装置

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3922134A (en) * 1973-12-17 1975-11-25 Robintech Inc Pipe bending mandrel
US4268238A (en) * 1978-03-13 1981-05-19 Clint, Inc. Flow molding
US4325779A (en) * 1979-04-17 1982-04-20 Beatrice Foods Co. Method for shaping and finishing a workpiece
US4504341A (en) 1982-09-20 1985-03-12 Ppg Industries, Inc. Fabricating shaped laminated transparencies
DE3484876D1 (de) 1983-02-04 1991-09-12 Solar Control France Schlagfeste und kugelsichere verbundscheiben und verfahren zur deren herstellung.
US4642255A (en) 1984-12-20 1987-02-10 Frank C. Dlubak Laminated article and process for making same
NL8600809A (nl) * 1986-03-28 1987-10-16 Philips Nv Methode om een matrijs te voorzien van een loslaag.
DE3643817A1 (de) * 1986-12-20 1988-06-30 Agfa Gevaert Ag Kontaktkopiergeraet
US5079057A (en) 1986-12-29 1992-01-07 Owens-Illinois Plastic Products Inc. Plastic container with multilayer label applied by in-mold labeling
US4731155A (en) * 1987-04-15 1988-03-15 General Electric Company Process for forming a lithographic mask
DE3719200A1 (de) * 1987-06-09 1988-12-29 Ibm Deutschland Optische speicherplatte und verfahren zu ihrer herstellung
JPH01196749A (ja) * 1988-01-30 1989-08-08 Hoya Corp 光情報記録媒体用基板の製造方法
US5234717A (en) * 1990-06-14 1993-08-10 Nippon Sheet Glass Co., Ltd. Process for producing a minute-patterned substrate
CA2052273C (en) * 1990-09-29 1995-02-14 Katsumi Kohama Sheet for molding fiber-reinforced resin and method for producing it
JPH0818336B2 (ja) * 1991-02-06 1996-02-28 松下電器産業株式会社 成形用部材およびその製造方法
CN2128495Y (zh) * 1991-07-22 1993-03-24 徐建明 冬夏两用褥自动输能器
US5466146A (en) * 1992-06-29 1995-11-14 Fritz; Michael L. Hydroforming platen and seal
JP2976717B2 (ja) * 1992-09-29 1999-11-10 株式会社村田製作所 積層セラミック電子部品の製造方法
FR2722303B1 (fr) * 1994-07-07 1996-09-06 Corning Inc Procede et dispositif de fabrication de reseaux de microlentilles optiques
US5643522A (en) * 1994-12-12 1997-07-01 Park; James F. Method and system for curing fiber reinforced composite structures
US5648109A (en) * 1995-05-03 1997-07-15 Massachusetts Institute Of Technology Apparatus for diaphragm forming
US5997273A (en) * 1995-08-01 1999-12-07 Laquer; Henry Louis Differential pressure HIP forging in a controlled gaseous environment
US5824418A (en) 1995-09-05 1998-10-20 Northrop Grumman Corporation Optically transparent, electrically conductive semiconductor windows
US5772905A (en) * 1995-11-15 1998-06-30 Regents Of The University Of Minnesota Nanoimprint lithography
US5669303A (en) * 1996-03-04 1997-09-23 Motorola Apparatus and method for stamping a surface
JPH09312361A (ja) 1996-05-22 1997-12-02 Hitachi Metals Ltd 電子部品用複合材料およびその製造方法
IT1287480B1 (it) * 1996-09-24 1998-08-06 Unifill Int Ag Apparato per il riscaldamento di una coppia di fogli di materiale termoformabile
SE508968C2 (sv) * 1996-12-19 1998-11-23 Ericsson Telefon Ab L M Förfarande för att göra elastiska kulor
US5863452A (en) * 1997-04-17 1999-01-26 Northrop Grumman Corporation Isostatic pressure resin transfer molding
US6048411A (en) 1997-05-12 2000-04-11 Silicon Genesis Corporation Silicon-on-silicon hybrid wafer assembly
US6425972B1 (en) 1997-06-18 2002-07-30 Calipher Technologies Corp. Methods of manufacturing microfabricated substrates
US6099940A (en) * 1997-07-16 2000-08-08 The Procter & Gamble Company Selectively-activatible three-dimensional sheet material having multi-stage progressive activation to deliver a substance to a target surface
JP3403016B2 (ja) * 1997-08-04 2003-05-06 住友化学工業株式会社 中空部を有する合成樹脂成形体の製造方法
US5958326A (en) * 1997-09-05 1999-09-28 Caferro; Ronald N. Process for producing a lighting louver
US5947027A (en) * 1998-09-08 1999-09-07 Motorola, Inc. Printing apparatus with inflatable means for advancing a substrate towards the stamping surface
KR100378078B1 (ko) * 1999-07-20 2003-03-29 주식회사 미뉴타텍 직접 가압 공정을 이용한 금속 배선층 형성 방법
US6190929B1 (en) * 1999-07-23 2001-02-20 Micron Technology, Inc. Methods of forming semiconductor devices and methods of forming field emission displays
SE515607C2 (sv) * 1999-12-10 2001-09-10 Obducat Ab Anordning och metod vid tillverkning av strukturer
US6533986B1 (en) * 2000-02-16 2003-03-18 Howmet Research Corporation Method and apparatus for making ceramic cores and other articles
US6365059B1 (en) * 2000-04-28 2002-04-02 Alexander Pechenik Method for making a nano-stamp and for forming, with the stamp, nano-size elements on a substrate
US6319745B1 (en) 2000-05-31 2001-11-20 International Business Machines Corporation Formation of charge-coupled-device with image pick-up array

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US20020132482A1 (en) 2002-09-19
EP1325513A1 (en) 2003-07-09
CN1457505A (zh) 2003-11-19
KR100873587B1 (ko) 2008-12-11
US6946360B2 (en) 2005-09-20
US6482742B1 (en) 2002-11-19
KR20030064370A (ko) 2003-07-31
WO2002007199A1 (en) 2002-01-24
EP1325513A4 (en) 2006-05-03
US20020177319A1 (en) 2002-11-28
JP3987795B2 (ja) 2007-10-10
CN1299332C (zh) 2007-02-07
US7137803B2 (en) 2006-11-21

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