JP5198071B2 - インプリントリソグラフィ・プロセスにおける熱管理のための露光方法 - Google Patents
インプリントリソグラフィ・プロセスにおける熱管理のための露光方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 40
- 230000008569 process Effects 0.000 title claims description 14
- 238000001459 lithography Methods 0.000 title claims description 12
- 239000000758 substrate Substances 0.000 claims description 109
- 239000000463 material Substances 0.000 claims description 16
- 230000004907 flux Effects 0.000 claims description 11
- 238000000059 patterning Methods 0.000 claims description 10
- 230000005855 radiation Effects 0.000 claims description 7
- 238000004891 communication Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 230000004044 response Effects 0.000 claims description 4
- 230000001902 propagating effect Effects 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000002861 polymer material Substances 0.000 description 38
- 229920000642 polymer Polymers 0.000 description 13
- 238000004132 cross linking Methods 0.000 description 6
- 238000007711 solidification Methods 0.000 description 6
- 230000008023 solidification Effects 0.000 description 6
- 239000007788 liquid Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- -1 but not limited to Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000000203 droplet dispensing Methods 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
Description
本出願は、Sidlgata V.Sreenivasan及びByung−Jin Choiを発明者として記載した、2004年12月1日に出願された名称「Methods of Exposure for the Purpose of Thermal Management for Imprint Lithography Processes(インプリントリソグラフィ・プロセスにおける熱管理のための露光方法)」の米国特許仮出願60/632,125に対する優先権を主張し、該特許は引用により全体が本明細書に組み込まれる。
合衆国政府は本発明において一括払いライセンスを有し、国立標準技術研究所(NIST)ATP助成金により助成された70NANB4H3012の条件により定められている通り、適切な条件で他者にライセンスすることを特許権者に要求する限定状況での権利を有する。
本発明の分野は、全体的には構造体のナノファブリケーションに関する。より詳細には、本発明は、ナノスケールファブリケーションの間に形成されるパターンのオーバーレイ・アラインメントを行うための技法に関する。
Claims (10)
- 化学線エネルギーに応答して固化するポリマー材料を用いてインプリントリソグラフィ・プロセスを受ける基板のあるフィールドをパターン形成する方法であって、
前記フィールドの小部分を前記化学線エネルギーに曝露する段階と、
前記フィールドの全てを前記化学線エネルギーに曝露する段階と、
を含み、前記化学線エネルギーによる前記基板の加熱に起因するオーバーレイ・アラインメント不良を低減させることを特徴とする方法。 - 前記全てを曝露する段階が、前記フィールドの全てを前記化学線エネルギーに同時に曝露する段階を更に含む請求項1に記載の方法。
- 前記基板が半導体ウェーハであり、前記フィールドが、前記ウェーハの片側の全域と同一の広がりを有する請求項1に記載の方法。
- 前記基板が半導体ウェーハであり、前記フィールドが前記ウェーハの片側の全域の下位要素である請求項1に記載の方法。
- 前記小部分を曝露する段階が、前記小部分よりも大きな断面積を有する前記化学線の流束を経路に沿って伝播させる段階と、
前記経路内に空間フィルタを配置して、前記フィールドに衝突する前記流束を前記小部分に相応する寸法に縮小させる段階と
を更に含む請求項1に記載の方法。 - 前記小部分を曝露する段階が、前記小部分よりも大きな断面積を有する前記化学線の流束を経路に沿って伝播させる段階と、
前記経路内に空間フィルタを配置して、前記領域に衝突する前記流束を前記小部分に相応する大きさに縮小させる段階と、
を更に含み、
前記フィールドの全てを曝露する段階が前記空間フィルタを前記経路から除去する段階を更に含む請求項1に記載の方法。 - 前記基板を支持体と熱的に連通して配置することによって、前記基板内に蓄積する熱エネルギーを前記基板から移動させる段階を更に含む請求項1に記載の方法。
- 化学線エネルギーに応答して固化するポリマー材料を用いてインプリントリソグラフィ・プロセスを受ける基板のあるフィールドをパターン形成する方法であって、
前記フィールドの第1の小部分を前記化学線エネルギーに曝露する段階と、
前記フィールドの第2の小部分を前記化学線に曝露する段階と、
を含み、
前記第1及び第2の小部分を合わせた広がりは前記フィールドの広がりと同一であり、
前記第1の小部分に関連付けられる前記フィールドの領域が、前記第2の小部分に関連付けられる前記フィールドの領域とは異なり、前記化学線による前記基板の加熱に起因するオーバーレイ・アラインメント不良を低減することを特徴とする方法。 - 前記フィールドよりも大きな断面積を有する前記化学線の流束を経路に沿って伝播させる段階と、を含み、前記第1の小部分を曝露する段階が、前記経路内に第1の空間フィルタを配置して、前記領域に衝突する前記流束を前記第1の小部分に相応する大きさに縮小させる段階を更に含み、前記第2の小部分を曝露する段階が、前記経路内に第2の空間フィルタを配置して、前記領域に衝突する前記流束を前記第2の小部分に相応する大きさに縮小させる段階を更に含む請求項8に記載の方法。
- 前記フィールドと同一の広がりを有する断面積を有する前記化学線の流束を経路に沿って伝播させる段階と、を含み、前記第1の小部分を曝露する段階が、前記経路内に第1の空間フィルタを配置して、前記領域に衝突する前記流束を前記第1の小部分に相応する大きさに縮小させる段階を更に含み、前記第2の小部分を曝露する段階が、前記経路内に第2の空間フィルタを配置して、前記領域に衝突する前記流束を前記第2の小部分に相応する大きさに縮小させる段階を更に含む請求項8に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US63212504P | 2004-12-01 | 2004-12-01 | |
US60/632,125 | 2004-12-01 | ||
PCT/US2005/043872 WO2006060758A2 (en) | 2004-12-01 | 2005-11-30 | Methods of exposure for the purpose of thermal management for imprint lithography processes |
Publications (2)
Publication Number | Publication Date |
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JP2008522448A JP2008522448A (ja) | 2008-06-26 |
JP5198071B2 true JP5198071B2 (ja) | 2013-05-15 |
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JP2007544581A Active JP5198071B2 (ja) | 2004-12-01 | 2005-11-30 | インプリントリソグラフィ・プロセスにおける熱管理のための露光方法 |
Country Status (6)
Country | Link |
---|---|
US (2) | US20060115999A1 (ja) |
EP (1) | EP1825502A4 (ja) |
JP (1) | JP5198071B2 (ja) |
KR (1) | KR20070086766A (ja) |
TW (1) | TW200627082A (ja) |
WO (1) | WO2006060758A2 (ja) |
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-
2005
- 2005-11-30 JP JP2007544581A patent/JP5198071B2/ja active Active
- 2005-11-30 KR KR1020077014800A patent/KR20070086766A/ko not_active Application Discontinuation
- 2005-11-30 WO PCT/US2005/043872 patent/WO2006060758A2/en active Application Filing
- 2005-11-30 US US11/292,402 patent/US20060115999A1/en not_active Abandoned
- 2005-11-30 EP EP05852934A patent/EP1825502A4/en not_active Withdrawn
- 2005-12-01 TW TW094142252A patent/TW200627082A/zh unknown
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US20080153312A1 (en) | 2008-06-26 |
US8609326B2 (en) | 2013-12-17 |
JP2008522448A (ja) | 2008-06-26 |
WO2006060758A3 (en) | 2007-01-04 |
KR20070086766A (ko) | 2007-08-27 |
US20060115999A1 (en) | 2006-06-01 |
EP1825502A4 (en) | 2008-01-23 |
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EP1825502A2 (en) | 2007-08-29 |
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