JP6545261B2 - 付加製造プロセスを使用する、複合材料特性を有するｃｍｐパッド構造 - Google Patents

付加製造プロセスを使用する、複合材料特性を有するｃｍｐパッド構造 Download PDF

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Publication number
JP6545261B2
JP6545261B2 JP2017520394A JP2017520394A JP6545261B2 JP 6545261 B2 JP6545261 B2 JP 6545261B2 JP 2017520394 A JP2017520394 A JP 2017520394A JP 2017520394 A JP2017520394 A JP 2017520394A JP 6545261 B2 JP6545261 B2 JP 6545261B2
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Japan
Prior art keywords
polishing pad
polishing
features
pad
feature
Prior art date
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JP2017520394A
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English (en)
Japanese (ja)
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JP2017533832A5 (enExample
JP2017533832A (ja
Inventor
ラジーブ バジャージ，
ラジーブ バジャージ，
カシラマン クリシュナン，
カシラマン クリシュナン，
マヘンドラ シー． オリラル，
マヘンドラ シー． オリラル，
ダニエル レッドフィールド，
ダニエル レッドフィールド，
フレッド シー． レデカー，
フレッド シー． レデカー，
ナグ ビー． パティバンドラ，
ナグ ビー． パティバンドラ，
グレゴリー イー． メンク，
グレゴリー イー． メンク，
ジェーソン ジー． ファン，
ジェーソン ジー． ファン，
ラッセル エドワード ペリー，
ラッセル エドワード ペリー，
ロバート イー． ダヴェンポート，
ロバート イー． ダヴェンポート，
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Applied Materials Inc
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Applied Materials Inc
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Publication of JP2017533832A5 publication Critical patent/JP2017533832A5/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0045—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by stacking sheets of abrasive material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Curing Cements, Concrete, And Artificial Stone (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
JP2017520394A 2014-10-17 2015-04-24 付加製造プロセスを使用する、複合材料特性を有するｃｍｐパッド構造 Active JP6545261B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462065193P 2014-10-17 2014-10-17
US201462065270P 2014-10-17 2014-10-17
US62/065,193 2014-10-17
US62/065,270 2014-10-17
PCT/US2015/027473 WO2016060712A1 (en) 2014-10-17 2015-04-24 Cmp pad construction with composite material properties using additive manufacturing processes

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019081720A Division JP6849731B2 (ja) 2014-10-17 2019-04-23 付加製造プロセスを使用する、複合材料特性を有するｃｍｐパッド構造

Publications (3)

Publication Number Publication Date
JP2017533832A JP2017533832A (ja) 2017-11-16
JP2017533832A5 JP2017533832A5 (enExample) 2018-06-07
JP6545261B2 true JP6545261B2 (ja) 2019-07-17

Family

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Family Applications (4)

Application Number Title Priority Date Filing Date
JP2017520394A Active JP6545261B2 (ja) 2014-10-17 2015-04-24 付加製造プロセスを使用する、複合材料特性を有するｃｍｐパッド構造
JP2019081720A Active JP6849731B2 (ja) 2014-10-17 2019-04-23 付加製造プロセスを使用する、複合材料特性を有するｃｍｐパッド構造
JP2021034028A Pending JP2021112819A (ja) 2014-10-17 2021-03-04 付加製造プロセスを使用する、複合材料特性を有するｃｍｐパッド構造
JP2023114970A Pending JP2023153812A (ja) 2014-10-17 2023-07-13 付加製造プロセスを使用する、複合材料特性を有するｃｍｐパッド構造

Family Applications After (3)

Application Number Title Priority Date Filing Date
JP2019081720A Active JP6849731B2 (ja) 2014-10-17 2019-04-23 付加製造プロセスを使用する、複合材料特性を有するｃｍｐパッド構造
JP2021034028A Pending JP2021112819A (ja) 2014-10-17 2021-03-04 付加製造プロセスを使用する、複合材料特性を有するｃｍｐパッド構造
JP2023114970A Pending JP2023153812A (ja) 2014-10-17 2023-07-13 付加製造プロセスを使用する、複合材料特性を有するｃｍｐパッド構造

Country Status (6)

Country Link
US (2) US10384330B2 (enExample)
JP (4) JP6545261B2 (enExample)
KR (4) KR102295988B1 (enExample)
CN (2) CN107078048B (enExample)
SG (2) SG11201703114QA (enExample)
WO (1) WO2016060712A1 (enExample)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10041745B2 (en) 2010-05-04 2018-08-07 Fractal Heatsink Technologies LLC Fractal heat transfer device
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
CN107078048B (zh) 2014-10-17 2021-08-13 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
WO2017051182A1 (en) * 2015-09-25 2017-03-30 Photocentric Limited Methods for making an object and formulations for use in said methods
WO2017066077A1 (en) * 2015-10-16 2017-04-20 Applied Materials, Inc. Method and apparatus for forming advanced polishing pads using an additive manufacturing process
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US10773509B2 (en) 2016-03-09 2020-09-15 Applied Materials, Inc. Pad structure and fabrication methods
SG11201806820UA (en) 2016-03-09 2018-09-27 Applied Materials Inc Correction of fabricated shapes in additive manufacturing
US20180093411A1 (en) * 2016-09-30 2018-04-05 Applied Materials, Inc. Additive manufacturing of polishing pads on a conveyor
WO2018118566A1 (en) 2016-12-23 2018-06-28 3M Innovative Properties Company Polymer bond abrasive articles and methods of making them
US10596763B2 (en) 2017-04-21 2020-03-24 Applied Materials, Inc. Additive manufacturing with array of energy sources
US10967482B2 (en) 2017-05-25 2021-04-06 Applied Materials, Inc. Fabrication of polishing pad by additive manufacturing onto mold
US11059149B2 (en) 2017-05-25 2021-07-13 Applied Materials, Inc. Correction of fabricated shapes in additive manufacturing using initial layer
KR102534731B1 (ko) * 2017-05-25 2023-05-18 어플라이드 머티어리얼스, 인코포레이티드 초기 층을 사용한 적층 제조에서 제조된 형상들의 보정
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) * 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
CN108081158A (zh) * 2017-12-15 2018-05-29 清华大学 砂轮及其制备方法
JP6887371B2 (ja) * 2017-12-20 2021-06-16 株式会社荏原製作所 基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体
WO2019152222A1 (en) 2018-02-05 2019-08-08 Applied Materials, Inc. Piezo-electric end-pointing for 3d printed cmp pads
WO2019190676A1 (en) 2018-03-30 2019-10-03 Applied Materials, Inc. Integrating 3d printing into multi-process fabrication schemes
US11167375B2 (en) 2018-08-10 2021-11-09 The Research Foundation For The State University Of New York Additive manufacturing processes and additively manufactured products
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
US12325106B2 (en) * 2018-10-31 2025-06-10 Taiwan Semiconductor Manufacturing Company, Ltd. Device for conditioning chemical mechanical polishing
US20220371274A1 (en) * 2018-11-19 2022-11-24 Continuous Composites Inc. System for additively manufacturing composite structure
US11046615B2 (en) 2018-12-19 2021-06-29 Raytheon Technologies Corporation Self-healing matrix for a ceramic composite
US20200230781A1 (en) * 2019-01-23 2020-07-23 Applied Materials, Inc. Polishing pads formed using an additive manufacturing process and methods related thereto
US11851570B2 (en) * 2019-04-12 2023-12-26 Applied Materials, Inc. Anionic polishing pads formed by printing processes
CN114126803B (zh) * 2019-05-07 2024-07-16 Cmc材料有限责任公司 具有固定沟槽体积的化学机械平坦化垫
US20200373279A1 (en) * 2019-05-24 2020-11-26 Applied Materials, Inc. Color Conversion Layers for Light-Emitting Devices
US20210053179A1 (en) * 2019-08-23 2021-02-25 Taiwan Semiconductor Manufacturing Company, Ltd. Novel CMP Pad Design and Method of Using the Same
US12006442B2 (en) 2019-09-11 2024-06-11 Applied Materials, Inc. Additive manufacturing of polishing pads
US20210069860A1 (en) * 2019-09-11 2021-03-11 Applied Materials, Inc. Compositions and Methods of Additive Manufacturing of Polishing Pads
US11865588B2 (en) * 2019-11-12 2024-01-09 Alliance Material Co., Ltd. Probe pin cleaning pad and cleaning method for probe pin
US20240069069A1 (en) * 2019-11-12 2024-02-29 Alliance Material Co., Ltd. Probe pin cleaning pad and cleaning method for probe pin
CN112828760A (zh) * 2019-11-22 2021-05-25 夏泰鑫半导体(青岛)有限公司 研磨头以及具有该研磨头的化学机械研磨装置
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11470956B2 (en) 2020-03-06 2022-10-18 Applied Materials, Inc. Brush, method of forming a brush, and structure embodied in a machine readable medium used in a design process
US11787117B2 (en) 2020-04-23 2023-10-17 Rtx Corporation Fabricating ceramic structures
US11638979B2 (en) 2020-06-09 2023-05-02 Applied Materials, Inc. Additive manufacturing of polishing pads
US11612978B2 (en) 2020-06-09 2023-03-28 Applied Materials, Inc. Additive manufacturing of polishing pads
US11738517B2 (en) 2020-06-18 2023-08-29 Applied Materials, Inc. Multi dispense head alignment using image processing
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
CN116034117A (zh) 2020-07-24 2023-04-28 应用材料公司 具有用于uv-led固化的基于硫醇的交联剂的量子点配方
US11404612B2 (en) 2020-08-28 2022-08-02 Applied Materials, Inc. LED device having blue photoluminescent material and red/green quantum dots
US11646397B2 (en) 2020-08-28 2023-05-09 Applied Materials, Inc. Chelating agents for quantum dot precursor materials in color conversion layers for micro-LEDs
US11942576B2 (en) 2020-08-28 2024-03-26 Applied Materials, Inc. Blue color converter for micro LEDs
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
US11951590B2 (en) 2021-06-14 2024-04-09 Applied Materials, Inc. Polishing pads with interconnected pores
US11911870B2 (en) 2021-09-10 2024-02-27 Applied Materials, Inc. Polishing pads for high temperature processing
CN114043380B (zh) * 2021-11-18 2022-11-29 北京烁科精微电子装备有限公司 一种研磨垫及具有其的研磨装置
CN119036303B (zh) * 2024-08-05 2025-04-15 上海映智研磨材料有限公司 一种抛光垫及其制备方法和用途

Family Cites Families (678)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2001911A (en) 1932-04-21 1935-05-21 Carborundum Co Abrasive articles
US3357598A (en) 1965-09-21 1967-12-12 Dole Valve Co Adjustable liquid dispenser
US3741116A (en) 1970-06-25 1973-06-26 American Screen Process Equip Vacuum belt
US4459779A (en) 1982-09-16 1984-07-17 International Business Machines Corporation Fixed abrasive grinding media
US4575330A (en) 1984-08-08 1986-03-11 Uvp, Inc. Apparatus for production of three-dimensional objects by stereolithography
US4836832A (en) 1986-08-11 1989-06-06 Minnesota Mining And Manufacturing Company Method of preparing coated abrasive having radiation curable binder
US4841680A (en) 1987-08-25 1989-06-27 Rodel, Inc. Inverted cell pad material for grinding, lapping, shaping and polishing
US4942001A (en) 1988-03-02 1990-07-17 Inc. DeSoto Method of forming a three-dimensional object by stereolithography and composition therefore
DE3808951A1 (de) 1988-03-17 1989-10-05 Basf Ag Photopolymerisierbare, zur herstellung von druckformen geeignete druckplatte
US4985340A (en) 1988-06-01 1991-01-15 Minnesota Mining And Manufacturing Company Energy curable compositions: two component curing agents
US4844144A (en) 1988-08-08 1989-07-04 Desoto, Inc. Investment casting utilizing patterns produced by stereolithography
JPH07102724B2 (ja) 1988-08-31 1995-11-08 ジューキ株式会社 印字装置
US5121329A (en) 1989-10-30 1992-06-09 Stratasys, Inc. Apparatus and method for creating three-dimensional objects
US5387380A (en) 1989-12-08 1995-02-07 Massachusetts Institute Of Technology Three-dimensional printing techniques
DE3942859A1 (de) 1989-12-23 1991-07-04 Basf Ag Verfahren zur herstellung von bauteilen
US5626919A (en) 1990-03-01 1997-05-06 E. I. Du Pont De Nemours And Company Solid imaging apparatus and method with coating station
US5096530A (en) 1990-06-28 1992-03-17 3D Systems, Inc. Resin film recoating method and apparatus
JP2929779B2 (ja) 1991-02-15 1999-08-03 トヨタ自動車株式会社 炭素被膜付撥水ガラス
JPH05188528A (ja) 1991-06-25 1993-07-30 Eastman Kodak Co 圧力吸収保護層含有写真要素
US5212910A (en) 1991-07-09 1993-05-25 Intel Corporation Composite polishing pad for semiconductor process
US5193316A (en) 1991-10-29 1993-03-16 Texas Instruments Incorporated Semiconductor wafer polishing using a hydrostatic medium
US5287663A (en) 1992-01-21 1994-02-22 National Semiconductor Corporation Polishing pad and method for polishing semiconductor wafers
US5178646A (en) 1992-01-22 1993-01-12 Minnesota Mining And Manufacturing Company Coatable thermally curable binder presursor solutions modified with a reactive diluent, abrasive articles incorporating same, and methods of making said abrasive articles
US6099394A (en) 1998-02-10 2000-08-08 Rodel Holdings, Inc. Polishing system having a multi-phase polishing substrate and methods relating thereto
US6022264A (en) * 1997-02-10 2000-02-08 Rodel Inc. Polishing pad and methods relating thereto
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US6746225B1 (en) 1992-11-30 2004-06-08 Bechtel Bwtx Idaho, Llc Rapid solidification processing system for producing molds, dies and related tooling
WO1994013434A1 (en) 1992-12-17 1994-06-23 Minnesota Mining And Manufacturing Company Reduced viscosity slurries, abrasive articles made therefrom, and methods of making said articles
US5453312A (en) 1993-10-29 1995-09-26 Minnesota Mining And Manufacturing Company Abrasive article, a process for its manufacture, and a method of using it to reduce a workpiece surface
JPH07297195A (ja) 1994-04-27 1995-11-10 Speedfam Co Ltd 半導体装置の平坦化方法及び平坦化装置
US5906863A (en) 1994-08-08 1999-05-25 Lombardi; John Methods for the preparation of reinforced three-dimensional bodies
JPH08132342A (ja) 1994-11-08 1996-05-28 Hitachi Ltd 半導体集積回路装置の製造装置
KR100258802B1 (ko) 1995-02-15 2000-06-15 전주범 평탄화 장치 및 그를 이용한 평탄화 방법
US6719818B1 (en) 1995-03-28 2004-04-13 Applied Materials, Inc. Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US5533923A (en) 1995-04-10 1996-07-09 Applied Materials, Inc. Chemical-mechanical polishing pad providing polishing unformity
US5645471A (en) 1995-08-11 1997-07-08 Minnesota Mining And Manufacturing Company Method of texturing a substrate using an abrasive article having multiple abrasive natures
US5605760A (en) 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
JPH0976353A (ja) 1995-09-12 1997-03-25 Toshiba Corp 光造形装置
JP3324643B2 (ja) 1995-10-25 2002-09-17 日本電気株式会社 研磨パッド
US5738574A (en) 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US5905099A (en) 1995-11-06 1999-05-18 Minnesota Mining And Manufacturing Company Heat-activatable adhesive composition
US5609517A (en) 1995-11-20 1997-03-11 International Business Machines Corporation Composite polishing pad
JP3566430B2 (ja) 1995-12-20 2004-09-15 株式会社ルネサステクノロジ 半導体装置の製造方法
US5624303A (en) 1996-01-22 1997-04-29 Micron Technology, Inc. Polishing pad and a method for making a polishing pad with covalently bonded particles
US6095084A (en) 1996-02-02 2000-08-01 Applied Materials, Inc. High density plasma process chamber
US5778481A (en) 1996-02-15 1998-07-14 International Business Machines Corporation Silicon wafer cleaning and polishing pads
US5690540A (en) 1996-02-23 1997-11-25 Micron Technology, Inc. Spiral grooved polishing pad for chemical-mechanical planarization of semiconductor wafers
US6090475A (en) 1996-05-24 2000-07-18 Micron Technology Inc. Polishing pad, methods of manufacturing and use
JP3498881B2 (ja) 1996-05-27 2004-02-23 セントラル硝子株式会社 撥水性ガラスの製法
US5976000A (en) 1996-05-28 1999-11-02 Micron Technology, Inc. Polishing pad with incompressible, highly soluble particles for chemical-mechanical planarization of semiconductor wafers
US5748434A (en) 1996-06-14 1998-05-05 Applied Materials, Inc. Shield for an electrostatic chuck
GB2316414B (en) 1996-07-31 2000-10-11 Tosoh Corp Abrasive shaped article, abrasive disc and polishing method
US5795218A (en) 1996-09-30 1998-08-18 Micron Technology, Inc. Polishing pad with elongated microcolumns
US6244575B1 (en) 1996-10-02 2001-06-12 Micron Technology, Inc. Method and apparatus for vaporizing liquid precursors and system for using same
US5876490A (en) 1996-12-09 1999-03-02 International Business Machines Corporatin Polish process and slurry for planarization
WO1998028108A1 (en) 1996-12-20 1998-07-02 Unique Technology International Private Limited Manufacture of porous polishing pad
KR100210840B1 (ko) 1996-12-24 1999-07-15 구본준 기계 화학적 연마 방법 및 그 장치
US5876268A (en) * 1997-01-03 1999-03-02 Minnesota Mining And Manufacturing Company Method and article for the production of optical quality surfaces on glass
JP4163756B2 (ja) 1997-01-13 2008-10-08 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド ホトリソグラフィーによって形成された表面パターンを有するポリマー研磨パッド及びこれに関する方法
US5965460A (en) 1997-01-29 1999-10-12 Mac Dermid, Incorporated Polyurethane composition with (meth)acrylate end groups useful in the manufacture of polishing pads
US5910471A (en) 1997-03-07 1999-06-08 Minnesota Mining And Manufacturing Company Abrasive article for providing a clear surface finish on glass
US6231629B1 (en) * 1997-03-07 2001-05-15 3M Innovative Properties Company Abrasive article for providing a clear surface finish on glass
JPH10249709A (ja) 1997-03-14 1998-09-22 Chiyoda Kk 研磨布
US5944583A (en) 1997-03-17 1999-08-31 International Business Machines Corporation Composite polish pad for CMP
US6062958A (en) 1997-04-04 2000-05-16 Micron Technology, Inc. Variable abrasive polishing pad for mechanical and chemical-mechanical planarization
US6682402B1 (en) 1997-04-04 2004-01-27 Rodel Holdings, Inc. Polishing pads and methods relating thereto
US6648733B2 (en) * 1997-04-04 2003-11-18 Rodel Holdings, Inc. Polishing pads and methods relating thereto
US5940674A (en) 1997-04-09 1999-08-17 Massachusetts Institute Of Technology Three-dimensional product manufacture using masks
ES2187960T3 (es) 1997-04-18 2003-06-16 Cabot Microelectronics Corp Tampon para pulir para un sustrato semiconductor.
US6126532A (en) 1997-04-18 2000-10-03 Cabot Corporation Polishing pads for a semiconductor substrate
CA2287404C (en) 1997-04-30 2007-10-16 David A. Kaisaki Method of planarizing the upper surface of a semiconductor wafer
US8092707B2 (en) 1997-04-30 2012-01-10 3M Innovative Properties Company Compositions and methods for modifying a surface suited for semiconductor fabrication
US5945058A (en) 1997-05-13 1999-08-31 3D Systems, Inc. Method and apparatus for identifying surface features associated with selected lamina of a three-dimensional object being stereolithographically formed
US6273806B1 (en) 1997-05-15 2001-08-14 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
US5921855A (en) 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
US6692338B1 (en) 1997-07-23 2004-02-17 Lsi Logic Corporation Through-pad drainage of slurry during chemical mechanical polishing
US6736714B2 (en) 1997-07-30 2004-05-18 Praxair S.T. Technology, Inc. Polishing silicon wafers
US5919082A (en) 1997-08-22 1999-07-06 Micron Technology, Inc. Fixed abrasive polishing pad
US6121143A (en) 1997-09-19 2000-09-19 3M Innovative Properties Company Abrasive articles comprising a fluorochemical agent for wafer surface modification
US5888121A (en) 1997-09-23 1999-03-30 Lsi Logic Corporation Controlling groove dimensions for enhanced slurry flow
US5932040A (en) 1997-10-01 1999-08-03 Bibielle S.P.A. Method for producing a ring of abrasive elements from which to form a rotary brush
US6950193B1 (en) 1997-10-28 2005-09-27 Rockwell Automation Technologies, Inc. System for monitoring substrate conditions
US6039836A (en) 1997-12-19 2000-03-21 Lam Research Corporation Focus rings
US6231942B1 (en) 1998-01-21 2001-05-15 Trexel, Inc. Method and apparatus for microcellular polypropylene extrusion, and polypropylene articles produced thereby
JPH11254542A (ja) 1998-03-11 1999-09-21 Sanyo Electric Co Ltd 光造形装置のモニタリングシステム
US6228133B1 (en) 1998-05-01 2001-05-08 3M Innovative Properties Company Abrasive articles having abrasive layer bond system derived from solid, dry-coated binder precursor particles having a fusible, radiation curable component
JPH11347761A (ja) 1998-06-12 1999-12-21 Mitsubishi Heavy Ind Ltd レーザによる３次元造形装置
US6122564A (en) 1998-06-30 2000-09-19 Koch; Justin Apparatus and methods for monitoring and controlling multi-layer laser cladding
US6322728B1 (en) 1998-07-10 2001-11-27 Jeneric/Pentron, Inc. Mass production of dental restorations by solid free-form fabrication methods
US6117000A (en) 1998-07-10 2000-09-12 Cabot Corporation Polishing pad for a semiconductor substrate
DE19834559A1 (de) 1998-07-31 2000-02-03 Friedrich Schiller Uni Jena Bu Verfahren zur Herstellung von Werkzeugen für die Bearbeitung von Oberflächen
JP2000061817A (ja) 1998-08-24 2000-02-29 Nikon Corp 研磨パッド
US6095902A (en) 1998-09-23 2000-08-01 Rodel Holdings, Inc. Polyether-polyester polyurethane polishing pads and related methods
US6602380B1 (en) 1998-10-28 2003-08-05 Micron Technology, Inc. Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine
US6325706B1 (en) 1998-10-29 2001-12-04 Lam Research Corporation Use of zeta potential during chemical mechanical polishing for end point detection
US6176992B1 (en) 1998-11-03 2001-01-23 Nutool, Inc. Method and apparatus for electro-chemical mechanical deposition
US6390890B1 (en) 1999-02-06 2002-05-21 Charles J Molnar Finishing semiconductor wafers with a fixed abrasive finishing element
US6206759B1 (en) 1998-11-30 2001-03-27 Micron Technology, Inc. Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machines
JP3641956B2 (ja) 1998-11-30 2005-04-27 三菱住友シリコン株式会社 研磨スラリーの再生システム
US7425250B2 (en) 1998-12-01 2008-09-16 Novellus Systems, Inc. Electrochemical mechanical processing apparatus
US6354915B1 (en) 1999-01-21 2002-03-12 Rodel Holdings Inc. Polishing pads and methods relating thereto
US6994607B2 (en) 2001-12-28 2006-02-07 Applied Materials, Inc. Polishing pad with window
US6179709B1 (en) 1999-02-04 2001-01-30 Applied Materials, Inc. In-situ monitoring of linear substrate polishing operations
US6641463B1 (en) 1999-02-06 2003-11-04 Beaver Creek Concepts Inc Finishing components and elements
WO2000059680A1 (en) 1999-03-30 2000-10-12 Nikon Corporation Polishing body, polisher, polishing method, and method for producing semiconductor device
US6217426B1 (en) 1999-04-06 2001-04-17 Applied Materials, Inc. CMP polishing pad
US6213845B1 (en) 1999-04-26 2001-04-10 Micron Technology, Inc. Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same
US6338901B1 (en) 1999-05-03 2002-01-15 Guardian Industries Corporation Hydrophobic coating including DLC on substrate
US6609113B1 (en) 1999-05-03 2003-08-19 The Chase Manhattan Bank Method and system for processing internet payments using the electronic funds transfer network
US6328634B1 (en) 1999-05-11 2001-12-11 Rodel Holdings Inc. Method of polishing
US6196899B1 (en) 1999-06-21 2001-03-06 Micron Technology, Inc. Polishing apparatus
US6319108B1 (en) 1999-07-09 2001-11-20 3M Innovative Properties Company Metal bond abrasive article comprising porous ceramic abrasive composites and method of using same to abrade a workpiece
JP2001105329A (ja) 1999-08-02 2001-04-17 Ebara Corp 研磨用砥石
US6232236B1 (en) 1999-08-03 2001-05-15 Applied Materials, Inc. Apparatus and method for controlling plasma uniformity in a semiconductor wafer processing system
US6328632B1 (en) 1999-08-31 2001-12-11 Micron Technology, Inc. Polishing pads and planarizing machines for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies
US6257973B1 (en) 1999-11-04 2001-07-10 Norton Company Coated abrasive discs
US6201208B1 (en) 1999-11-04 2001-03-13 Wisconsin Alumni Research Foundation Method and apparatus for plasma processing with control of ion energy distribution at the substrates
JP3439402B2 (ja) * 1999-11-05 2003-08-25 Ｎｅｃエレクトロニクス株式会社 半導体装置の製造方法
JP2001138212A (ja) * 1999-11-15 2001-05-22 Toshiro Doi 精密研磨装置
US6399501B2 (en) 1999-12-13 2002-06-04 Applied Materials, Inc. Method and apparatus for detecting polishing endpoint with optical monitoring
JP2003516872A (ja) 1999-12-14 2003-05-20 ロデール ホールディングス インコーポレイテッド 高分子又は高分子複合材研磨パッドの製造方法
US6368184B1 (en) 2000-01-06 2002-04-09 Advanced Micro Devices, Inc. Apparatus for determining metal CMP endpoint using integrated polishing pad electrodes
US6241596B1 (en) 2000-01-14 2001-06-05 Applied Materials, Inc. Method and apparatus for chemical mechanical polishing using a patterned pad
US6506097B1 (en) 2000-01-18 2003-01-14 Applied Materials, Inc. Optical monitoring in a two-step chemical mechanical polishing process
US20010041511A1 (en) 2000-01-19 2001-11-15 Lack Craig D. Printing of polishing pads
US7071041B2 (en) 2000-01-20 2006-07-04 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device
US6746311B1 (en) 2000-01-24 2004-06-08 3M Innovative Properties Company Polishing pad with release layer
US6309276B1 (en) 2000-02-01 2001-10-30 Applied Materials, Inc. Endpoint monitoring with polishing rate change
US6991528B2 (en) 2000-02-17 2006-01-31 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
WO2001064396A1 (en) 2000-02-28 2001-09-07 Rodel Holdings, Inc. Polishing pad surface texture formed by solid phase droplets
KR100502268B1 (ko) 2000-03-01 2005-07-22 가부시끼가이샤 히다치 세이사꾸쇼 플라즈마처리장치 및 방법
US6797623B2 (en) 2000-03-09 2004-09-28 Sony Corporation Methods of producing and polishing semiconductor device and polishing apparatus
US7300619B2 (en) 2000-03-13 2007-11-27 Objet Geometries Ltd. Compositions and methods for use in three dimensional model printing
US8481241B2 (en) 2000-03-13 2013-07-09 Stratasys Ltd. Compositions and methods for use in three dimensional model printing
US20030207959A1 (en) 2000-03-13 2003-11-06 Eduardo Napadensky Compositions and methods for use in three dimensional model printing
US6569373B2 (en) 2000-03-13 2003-05-27 Object Geometries Ltd. Compositions and methods for use in three dimensional model printing
KR100789663B1 (ko) 2000-03-15 2007-12-31 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 연마층에 투명 윈도우 부분을 갖는 연마 패드
AU2000238145A1 (en) 2000-03-24 2001-10-08 Generis Gmbh Method for manufacturing a structural part by a multi-layer deposition technique
KR20010093677A (ko) 2000-03-29 2001-10-29 추후기재 향상된 슬러리 분배를 위하여 특수 설계된 연마 패드
US6313038B1 (en) 2000-04-26 2001-11-06 Micron Technology, Inc. Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates
WO2001083167A1 (en) 2000-05-03 2001-11-08 Rodel Holdings, Inc. Polishing pad with a seam which is reinforced with caulking material
US6387289B1 (en) 2000-05-04 2002-05-14 Micron Technology, Inc. Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies
US8485862B2 (en) 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
US6267641B1 (en) 2000-05-19 2001-07-31 Motorola, Inc. Method of manufacturing a semiconductor component and chemical-mechanical polishing system therefor
US6454634B1 (en) 2000-05-27 2002-09-24 Rodel Holdings Inc. Polishing pads for chemical mechanical planarization
US6860802B1 (en) 2000-05-27 2005-03-01 Rohm And Haas Electric Materials Cmp Holdings, Inc. Polishing pads for chemical mechanical planarization
US6749485B1 (en) 2000-05-27 2004-06-15 Rodel Holdings, Inc. Hydrolytically stable grooved polishing pads for chemical mechanical planarization
US6736709B1 (en) 2000-05-27 2004-05-18 Rodel Holdings, Inc. Grooved polishing pads for chemical mechanical planarization
JP3925041B2 (ja) 2000-05-31 2007-06-06 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
WO2001091975A1 (en) 2000-05-31 2001-12-06 Jsr Corporation Abrasive material
US6478914B1 (en) 2000-06-09 2002-11-12 Micron Technology, Inc. Method for attaching web-based polishing materials together on a polishing tool
US6656019B1 (en) 2000-06-29 2003-12-02 International Business Machines Corporation Grooved polishing pads and methods of use
JP2002028849A (ja) * 2000-07-17 2002-01-29 Jsr Corp 研磨パッド
US20020016139A1 (en) 2000-07-25 2002-02-07 Kazuto Hirokawa Polishing tool and manufacturing method therefor
US6520834B1 (en) 2000-08-09 2003-02-18 Micron Technology, Inc. Methods and apparatuses for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates
US6776699B2 (en) 2000-08-14 2004-08-17 3M Innovative Properties Company Abrasive pad for CMP
US6736869B1 (en) 2000-08-28 2004-05-18 Micron Technology, Inc. Method for forming a planarizing pad for planarization of microelectronic substrates
US6592443B1 (en) 2000-08-30 2003-07-15 Micron Technology, Inc. Method and apparatus for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates
US6638831B1 (en) 2000-08-31 2003-10-28 Micron Technology, Inc. Use of a reference fiducial on a semiconductor package to monitor and control a singulation method
JP3886712B2 (ja) 2000-09-08 2007-02-28 シャープ株式会社 半導体装置の製造方法
US6477926B1 (en) 2000-09-15 2002-11-12 Ppg Industries Ohio, Inc. Polishing pad
US6641471B1 (en) 2000-09-19 2003-11-04 Rodel Holdings, Inc Polishing pad having an advantageous micro-texture and methods relating thereto
ATE496730T1 (de) 2000-09-29 2011-02-15 Strasbaugh Inc Polierkissen mit eingebautem optischem sensor
WO2002038688A2 (en) 2000-11-09 2002-05-16 3M Innovative Properties Company Weather resistant, ink jettable, radiation curable, fluid compositions particularly suitable for outdoor applications
JP2002151447A (ja) 2000-11-13 2002-05-24 Asahi Kasei Corp 研磨パッド
DE60118963T2 (de) 2000-11-29 2006-12-21 Psiloquest, Inc., Orlando Polierkissen aus vernetztem polyethylen zum chemisch-mechanischen polieren und poliervorrichtung
US6684704B1 (en) 2002-09-12 2004-02-03 Psiloquest, Inc. Measuring the surface properties of polishing pads using ultrasonic reflectance
KR100905266B1 (ko) 2000-12-01 2009-06-29 도요 고무 고교 가부시키가이샤 연마 패드
JP2002200555A (ja) 2000-12-28 2002-07-16 Ebara Corp 研磨工具および該研磨工具を具備したポリッシング装置
US6407669B1 (en) 2001-02-02 2002-06-18 3M Innovative Properties Company RFID tag device and method of manufacturing
GB0103754D0 (en) 2001-02-15 2001-04-04 Vantico Ltd Three-dimensional structured printing
US20020112632A1 (en) 2001-02-21 2002-08-22 Creo Ltd Method for supporting sensitive workpieces during processing
WO2002070200A1 (en) 2001-03-01 2002-09-12 Cabot Microelectronics Corporation Method for manufacturing a polishing pad having a compressed translucent region
US6811680B2 (en) 2001-03-14 2004-11-02 Applied Materials Inc. Planarization of substrates using electrochemical mechanical polishing
US7955693B2 (en) 2001-04-20 2011-06-07 Tolland Development Company, Llc Foam composition roller brush with embedded mandrel
ATE327864T1 (de) 2001-04-24 2006-06-15 Applied Materials Inc Leitender polierkörper zum elektrochemisch- mechanischen polieren
US6847014B1 (en) 2001-04-30 2005-01-25 Lam Research Corporation Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support
US6811937B2 (en) 2001-06-21 2004-11-02 Dsm Desotech, Inc. Radiation-curable resin composition and rapid prototyping process using the same
US6544373B2 (en) * 2001-07-26 2003-04-08 United Microelectronics Corp. Polishing pad for a chemical mechanical polishing process
US6586494B2 (en) 2001-08-08 2003-07-01 Spectra Group Limited, Inc. Radiation curable inkjet composition
KR100646702B1 (ko) 2001-08-16 2006-11-17 에스케이씨 주식회사 홀 및/또는 그루브로 형성된 화학적 기계적 연마패드
KR20030020658A (ko) * 2001-09-04 2003-03-10 삼성전자주식회사 화학적물리적 연마장치의 연마패드 콘디셔닝 디스크
US6866807B2 (en) 2001-09-21 2005-03-15 Stratasys, Inc. High-precision modeling filament
US6599765B1 (en) 2001-12-12 2003-07-29 Lam Research Corporation Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection
US6838149B2 (en) * 2001-12-13 2005-01-04 3M Innovative Properties Company Abrasive article for the deposition and polishing of a conductive material
JP2003188124A (ja) 2001-12-14 2003-07-04 Rodel Nitta Co 研磨布
EP1326273B1 (en) 2001-12-28 2012-01-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US20030134581A1 (en) 2002-01-11 2003-07-17 Wang Hsing Maw Device for chemical mechanical polishing
KR100442873B1 (ko) 2002-02-28 2004-08-02 삼성전자주식회사 화학적 기계적 폴리싱 슬러리 및 이를 사용한 화학적기계적 폴리싱 방법
JP2003303793A (ja) 2002-04-12 2003-10-24 Hitachi Ltd 研磨装置および半導体装置の製造方法
US6773474B2 (en) 2002-04-19 2004-08-10 3M Innovative Properties Company Coated abrasive article
JP4693024B2 (ja) 2002-04-26 2011-06-01 東洋ゴム工業株式会社 研磨材
US6815570B1 (en) 2002-05-07 2004-11-09 Uop Llc Shaped catalysts for transalkylation of aromatics for enhanced xylenes production
US20050194681A1 (en) 2002-05-07 2005-09-08 Yongqi Hu Conductive pad with high abrasion
US20050276967A1 (en) 2002-05-23 2005-12-15 Cabot Microelectronics Corporation Surface textured microporous polishing pads
US6913517B2 (en) 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
KR100669301B1 (ko) 2002-06-03 2007-01-16 제이에스알 가부시끼가이샤 연마 패드 및 복층형 연마 패드
DE10224981B4 (de) 2002-06-05 2004-08-19 Generis Gmbh Verfahren zum schichtweisen Aufbau von Modellen
US8602851B2 (en) 2003-06-09 2013-12-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Controlled penetration subpad
WO2003103959A1 (en) 2002-06-07 2003-12-18 Praxair S.T. Technology, Inc. Controlled penetration subpad
JP3801100B2 (ja) 2002-06-07 2006-07-26 Ｊｓｒ株式会社 光硬化造形装置、光硬化造形方法及び光硬化造形システム
EP1375617A1 (en) 2002-06-19 2004-01-02 3M Innovative Properties Company Radiation-curable, solvent-free and printable precursor of a pressure-sensitive adhesive
US7169014B2 (en) 2002-07-18 2007-01-30 Micron Technology, Inc. Apparatuses for controlling the temperature of polishing pads used in planarizing micro-device workpieces
KR101016081B1 (ko) 2002-07-26 2011-02-17 닛토덴코 가부시키가이샤 점착 시트와 그의 제조방법, 상기 점착 시트의 사용방법,및 상기 점착 시트에 사용되는 다층 시트와 그의 제조방법
TWI228768B (en) 2002-08-08 2005-03-01 Jsr Corp Processing method of polishing pad for semiconductor wafer and polishing pad for semiconductor wafer
KR100465649B1 (ko) 2002-09-17 2005-01-13 한국포리올 주식회사 일체형 연마 패드 및 그 제조 방법
US7579071B2 (en) 2002-09-17 2009-08-25 Korea Polyol Co., Ltd. Polishing pad containing embedded liquid microelements and method of manufacturing the same
US6896765B2 (en) 2002-09-18 2005-05-24 Lam Research Corporation Method and apparatus for the compensation of edge ring wear in a plasma processing chamber
US20040058623A1 (en) 2002-09-20 2004-03-25 Lam Research Corporation Polishing media for chemical mechanical planarization (CMP)
US7267607B2 (en) 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7435165B2 (en) 2002-10-28 2008-10-14 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7311862B2 (en) 2002-10-28 2007-12-25 Cabot Microelectronics Corporation Method for manufacturing microporous CMP materials having controlled pore size
US7043330B2 (en) 2002-10-31 2006-05-09 Ehsan Toyserkani System and method for closed-loop control of laser cladding by powder injection
JP2004153193A (ja) 2002-11-01 2004-05-27 Disco Abrasive Syst Ltd 半導体ウエーハの処理方法
JP2004167605A (ja) * 2002-11-15 2004-06-17 Rodel Nitta Co 研磨パッドおよび研磨装置
DE10253445A1 (de) 2002-11-16 2004-06-03 Adam Opel Ag Verfahren und Vorrichtung zum Abdichten und Aufpumpen von Reifen bei Pannen sowie Dichtmittelbehälter als auch Adapter hierfür
US8845852B2 (en) 2002-11-27 2014-09-30 Toyo Tire & Rubber Co., Ltd. Polishing pad and method of producing semiconductor device
JP2004235446A (ja) 2003-01-30 2004-08-19 Toyobo Co Ltd 研磨パッド
JP4659338B2 (ja) 2003-02-12 2011-03-30 Ｈｏｙａ株式会社 情報記録媒体用ガラス基板の製造方法並びにそれに使用する研磨パッド
WO2004077511A2 (en) 2003-02-24 2004-09-10 The Regents Of The University Of Colorado (meth)acrylic and (meth)acrylamide monomers, polymerizable compositions, and polymers obtained
US7104773B2 (en) 2003-03-07 2006-09-12 Ricoh Printing Systems, Ltd. Three-dimensional laminating molding device
DE10310385B4 (de) 2003-03-07 2006-09-21 Daimlerchrysler Ag Verfahren zur Herstellung von dreidimensionalen Körpern mittels pulverbasierter schichtaufbauender Verfahren
JP2004281685A (ja) 2003-03-14 2004-10-07 Mitsubishi Electric Corp 半導体基板の研磨用パッドおよび半導体基板の研磨方法
US7377840B2 (en) 2004-07-21 2008-05-27 Neopad Technologies Corporation Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs
US7704125B2 (en) 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US8864859B2 (en) 2003-03-25 2014-10-21 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US9278424B2 (en) 2003-03-25 2016-03-08 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
SG185141A1 (en) 2003-03-25 2012-11-29 Neopad Technologies Corp Customized polish pads for chemical mechanical planarization
DE10314075B4 (de) 2003-03-28 2007-11-22 Takata-Petri (Sachsen) Gmbh Reifenfülleinrichtung und Pannenset mit einer solchen
US7044836B2 (en) 2003-04-21 2006-05-16 Cabot Microelectronics Corporation Coated metal oxide particles for CMP
DE602004001268T2 (de) 2003-04-25 2007-06-06 Jsr Corp. Polierkissen und chemisch-mechanisches Polierverfahren
US6783436B1 (en) 2003-04-29 2004-08-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with optimized grooves and method of forming same
JPWO2004100242A1 (ja) 2003-05-09 2006-07-13 三洋化成工業株式会社 Ｃｍｐプロセス用研磨液及び研磨方法
CN100490084C (zh) 2003-05-09 2009-05-20 三洋化成工业株式会社 Cmp方法用研磨液及研磨方法
JP4662942B2 (ja) 2003-05-21 2011-03-30 ズィー コーポレイション ３ｄ印刷システムから外観モデルを形成するための熱可塑性粉末材料系
IL156094A0 (en) 2003-05-25 2003-12-23 J G Systems Inc Fixed abrasive cmp pad with built-in additives
CN1829587A (zh) 2003-06-06 2006-09-06 应用材料公司 用于电化学机械抛光的导电抛光物件
US6998166B2 (en) 2003-06-17 2006-02-14 Cabot Microelectronics Corporation Polishing pad with oriented pore structure
US7435161B2 (en) 2003-06-17 2008-10-14 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
US6884156B2 (en) 2003-06-17 2005-04-26 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
JP4130614B2 (ja) 2003-06-18 2008-08-06 株式会社東芝 半導体装置の製造方法
US7018560B2 (en) 2003-08-05 2006-03-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Composition for polishing semiconductor layers
US20050032464A1 (en) 2003-08-07 2005-02-10 Swisher Robert G. Polishing pad having edge surface treatment
CN1802237A (zh) 2003-08-07 2006-07-12 Ppg工业俄亥俄公司 具有边缘表面处理的抛光垫片
KR101158137B1 (ko) 2003-08-08 2012-06-19 엔테그리스, 아이엔씨. 회전식 기부 상에 주조된 일체형 다공성 패드를 제조하기위한 방법 및 재료
US7120512B2 (en) 2003-08-25 2006-10-10 Hewlett-Packard Development Company, L.P. Method and a system for solid freeform fabricating using non-reactive powder
WO2005021248A1 (ja) 2003-08-27 2005-03-10 Fuji Photo Film Co., Ltd. 三次元造形物の製造方法
KR100590202B1 (ko) * 2003-08-29 2006-06-15 삼성전자주식회사 연마 패드 및 그 형성방법
JP2005074614A (ja) 2003-09-03 2005-03-24 Nitta Haas Inc 研磨パッドの製造方法および研磨パッド
JP2005085917A (ja) 2003-09-08 2005-03-31 Sharp Corp プラズマプロセス装置
JP2005093785A (ja) 2003-09-18 2005-04-07 Toshiba Corp Ｃｍｐ用スラリー、研磨方法、および半導体装置の製造方法
KR100640998B1 (ko) 2003-09-19 2006-11-02 엘지.필립스 엘시디 주식회사 액정표시장치용 브라켓 구조
US20050060941A1 (en) 2003-09-23 2005-03-24 3M Innovative Properties Company Abrasive article and methods of making the same
US8066552B2 (en) * 2003-10-03 2011-11-29 Applied Materials, Inc. Multi-layer polishing pad for low-pressure polishing
GB0323462D0 (en) 2003-10-07 2003-11-05 Fujifilm Electronic Imaging Providing a surface layer or structure on a substrate
US6855588B1 (en) 2003-10-07 2005-02-15 United Microelectronics Corp. Method of fabricating a double gate MOSFET device
US20050109371A1 (en) 2003-10-27 2005-05-26 Applied Materials, Inc. Post CMP scrubbing of substrates
JP2005131732A (ja) 2003-10-30 2005-05-26 Ebara Corp 研磨装置
US7513818B2 (en) 2003-10-31 2009-04-07 Applied Materials, Inc. Polishing endpoint detection system and method using friction sensor
US7264641B2 (en) 2003-11-10 2007-09-04 Cabot Microelectronics Corporation Polishing pad comprising biodegradable polymer
US20050101228A1 (en) 2003-11-10 2005-05-12 Cabot Microelectronics Corporation Polishing pad comprising biodegradable polymer
JP2005150235A (ja) 2003-11-12 2005-06-09 Three M Innovative Properties Co 半導体表面保護シート及び方法
US7125318B2 (en) 2003-11-13 2006-10-24 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad having a groove arrangement for reducing slurry consumption
JP4555559B2 (ja) 2003-11-25 2010-10-06 富士紡ホールディングス株式会社 研磨布及び研磨布の製造方法
US6984163B2 (en) 2003-11-25 2006-01-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with high optical transmission window
KR100576465B1 (ko) 2003-12-01 2006-05-08 주식회사 하이닉스반도체 연마입자 함침 조성물을 이용한 연마 패드
US7186164B2 (en) 2003-12-03 2007-03-06 Applied Materials, Inc. Processing pad assembly with zone control
US6843711B1 (en) 2003-12-11 2005-01-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc Chemical mechanical polishing pad having a process-dependent groove configuration
US20050153634A1 (en) 2004-01-09 2005-07-14 Cabot Microelectronics Corporation Negative poisson's ratio material-containing CMP polishing pad
US20050171224A1 (en) 2004-02-03 2005-08-04 Kulp Mary J. Polyurethane polishing pad
US7132033B2 (en) 2004-02-27 2006-11-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a layered polishing pad
CN1926666A (zh) 2004-03-11 2007-03-07 东洋橡胶工业株式会社 研磨垫及半导体器件的制造方法
US20050208234A1 (en) 2004-03-19 2005-09-22 Agfa-Gevaert Ink-jet recording material
US7195544B2 (en) 2004-03-23 2007-03-27 Cabot Microelectronics Corporation CMP porous pad with component-filled pores
US7204742B2 (en) 2004-03-25 2007-04-17 Cabot Microelectronics Corporation Polishing pad comprising hydrophobic region and endpoint detection port
US6955588B1 (en) 2004-03-31 2005-10-18 Lam Research Corporation Method of and platen for controlling removal rate characteristics in chemical mechanical planarization
JP2004243518A (ja) 2004-04-08 2004-09-02 Toshiba Corp 研摩装置
US20050227590A1 (en) 2004-04-09 2005-10-13 Chien-Min Sung Fixed abrasive tools and associated methods
TWI293266B (en) 2004-05-05 2008-02-11 Iv Technologies Co Ltd A single-layer polishing pad and a method of producing the same
WO2005114323A2 (en) 2004-05-12 2005-12-01 Therics, Inc. Manufacturing process of three dimensional printing
US20050260939A1 (en) 2004-05-18 2005-11-24 Saint-Gobain Abrasives, Inc. Brazed diamond dressing tool
US7926521B2 (en) 2004-05-20 2011-04-19 Bridgestone Corporation Sealing agent injecting apparatus, sealing agent injecting method and sealing pump up apparatus
US20050260929A1 (en) 2004-05-20 2005-11-24 Jsr Corporation Chemical mechanical polishing pad and chemical mechanical polishing method
JP2007081322A (ja) * 2005-09-16 2007-03-29 Jsr Corp 化学機械研磨パッドの製造方法
US20050261150A1 (en) 2004-05-21 2005-11-24 Battelle Memorial Institute, A Part Interest Reactive fluid systems for removing deposition materials and methods for using same
US7438795B2 (en) 2004-06-10 2008-10-21 Cabot Microelectronics Corp. Electrochemical-mechanical polishing system
US7582127B2 (en) 2004-06-16 2009-09-01 Cabot Microelectronics Corporation Polishing composition for a tungsten-containing substrate
US7252871B2 (en) 2004-06-16 2007-08-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad having a pressure relief channel
WO2005123335A1 (en) 2004-06-21 2005-12-29 Ebara Corporation Polishing apparatus and polishing method
JP4133945B2 (ja) 2004-06-28 2008-08-13 住友ゴム工業株式会社 タイヤのパンクシーリング剤送給、抜取り装置
TW200610615A (en) 2004-07-15 2006-04-01 Disco Corp Grindstone tool
US7709053B2 (en) 2004-07-29 2010-05-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing of polymer-coated particles for chemical mechanical polishing
US7625198B2 (en) 2004-08-11 2009-12-01 Cornell Research Foundation, Inc. Modular fabrication systems and methods
US7153191B2 (en) 2004-08-20 2006-12-26 Micron Technology, Inc. Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods
US8075372B2 (en) 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
DE102004042911A1 (de) 2004-09-02 2006-03-09 Michael Stehle Vorrichtung zum Ausbringen von Luft- und/oder Reifendichtmittel
US20060079159A1 (en) 2004-10-08 2006-04-13 Markus Naujok Chemical mechanical polish with multi-zone abrasive-containing matrix
US20060096179A1 (en) 2004-11-05 2006-05-11 Cabot Microelectronics Corporation CMP composition containing surface-modified abrasive particles
WO2006057713A2 (en) 2004-11-29 2006-06-01 Rajeev Bajaj Electro-method and apparatus for improved chemical mechanical planarization pad with uniform polish performance
WO2006057720A1 (en) 2004-11-29 2006-06-01 Rajeev Bajaj Method and apparatus for improved chemical mechanical planarization pad with pressure control and process monitor
US7815778B2 (en) 2005-11-23 2010-10-19 Semiquest Inc. Electro-chemical mechanical planarization pad with uniform polish performance
US7846008B2 (en) 2004-11-29 2010-12-07 Semiquest Inc. Method and apparatus for improved chemical mechanical planarization and CMP pad
JP4775881B2 (ja) * 2004-12-10 2011-09-21 東洋ゴム工業株式会社 研磨パッド
US7871309B2 (en) 2004-12-10 2011-01-18 Toyo Tire & Rubber Co., Ltd. Polishing pad
US7059950B1 (en) 2004-12-14 2006-06-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP polishing pad having grooves arranged to improve polishing medium utilization
US7059949B1 (en) 2004-12-14 2006-06-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having an overlapping stepped groove arrangement
US7182677B2 (en) 2005-01-14 2007-02-27 Applied Materials, Inc. Chemical mechanical polishing pad for controlling polishing slurry distribution
EP1848569B1 (en) 2005-02-18 2016-11-23 NexPlanar Corporation Customized polishing pads for cmp and method of using the same
TWI385050B (zh) 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
KR20070108546A (ko) 2005-02-18 2007-11-12 네오패드 테크놀로지즈 코포레이션 화학적 기계적인 평탄화를 위해 적합화된 연마 패드와 그연마 패드의 제조 및 사용 방법
US7524345B2 (en) * 2005-02-22 2009-04-28 Saint-Gobain Abrasives, Inc. Rapid tooling system and methods for manufacturing abrasive articles
US7875091B2 (en) 2005-02-22 2011-01-25 Saint-Gobain Abrasives, Inc. Rapid tooling system and methods for manufacturing abrasive articles
JP2006231464A (ja) 2005-02-24 2006-09-07 Nitta Haas Inc 研磨パッド
US7829000B2 (en) 2005-02-25 2010-11-09 Hewlett-Packard Development Company, L.P. Core-shell solid freeform fabrication
TWI410314B (zh) 2005-04-06 2013-10-01 羅門哈斯電子材料Ｃｍｐ控股公司 藉由反應-射出成形製造多孔化學機械研磨墊之裝置
EP1710324B1 (en) 2005-04-08 2008-12-03 STMicroelectronics S.r.l. PVD process and chamber for the pulsed deposition of a chalcogenide material layer of a phase change memory device
US7427340B2 (en) 2005-04-08 2008-09-23 Applied Materials, Inc. Conductive pad
US7435364B2 (en) 2005-04-11 2008-10-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for forming a porous polishing pad
US8393934B2 (en) 2006-11-16 2013-03-12 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US8398466B2 (en) 2006-11-16 2013-03-19 Chien-Min Sung CMP pad conditioners with mosaic abrasive segments and associated methods
KR101134058B1 (ko) 2005-05-17 2012-04-16 도요 고무 고교 가부시키가이샤 연마 패드
KR100721196B1 (ko) 2005-05-24 2007-05-23 주식회사 하이닉스반도체 연마패드 및 이를 이용한 화학적기계적연마장치
CN1897226A (zh) 2005-07-11 2007-01-17 上海华虹Nec电子有限公司 一种化学机械抛光机
US8557351B2 (en) 2005-07-22 2013-10-15 Molecular Imprints, Inc. Method for adhering materials together
KR100727485B1 (ko) 2005-08-09 2007-06-13 삼성전자주식회사 연마 패드 및 이를 제조하는 방법, 그리고 화학적 기계적 연마 장치 및 방법
US20070049164A1 (en) 2005-08-26 2007-03-01 Thomson Clifford O Polishing pad and method for manufacturing polishing pads
US7594845B2 (en) 2005-10-20 2009-09-29 3M Innovative Properties Company Abrasive article and method of modifying the surface of a workpiece
US20070117393A1 (en) 2005-11-21 2007-05-24 Alexander Tregub Hardened porous polymer chemical mechanical polishing (CMP) pad
JP4868840B2 (ja) 2005-11-30 2012-02-01 Ｊｓｒ株式会社 半導体装置の製造方法
CN101500756A (zh) 2005-11-30 2009-08-05 应用材料公司 具有表面粗糙度的抛光垫
CN1851896A (zh) 2005-12-05 2006-10-25 北京北方微电子基地设备工艺研究中心有限责任公司 一种静电卡盘
US20070128991A1 (en) 2005-12-07 2007-06-07 Yoon Il-Young Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same
KR20070070094A (ko) 2005-12-28 2007-07-03 제이에스알 가부시끼가이샤 화학 기계 연마 패드 및 화학 기계 연마 방법
US20070149094A1 (en) 2005-12-28 2007-06-28 Choi Jae Y Monitoring Device of Chemical Mechanical Polishing Apparatus
WO2007086529A1 (ja) 2006-01-25 2007-08-02 Jsr Corporation 化学機械研磨パッドおよびその製造方法
US7935276B2 (en) 2006-02-09 2011-05-03 Headwaters Technology Innovation Llc Polymeric materials incorporating carbon nanostructures
KR101395513B1 (ko) 2006-02-23 2014-05-15 피코데온 리미티드 오와이 플라스틱 기재 상의 코팅 및 코팅된 플라스틱 제품
US20070204420A1 (en) 2006-03-06 2007-09-06 Hornby David M Polishing pad and method of making
US7517488B2 (en) 2006-03-08 2009-04-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a chemical mechanical polishing pad utilizing laser sintering
US20070212979A1 (en) * 2006-03-09 2007-09-13 Rimpad Tech Ltd. Composite polishing pad
WO2007111996A2 (en) 2006-03-24 2007-10-04 Clemson University Conducting polymer ink
US20070235133A1 (en) 2006-03-29 2007-10-11 Strasbaugh Devices and methods for measuring wafer characteristics during semiconductor wafer polishing
US20070235904A1 (en) 2006-04-06 2007-10-11 Saikin Alan H Method of forming a chemical mechanical polishing pad utilizing laser sintering
US7410413B2 (en) 2006-04-27 2008-08-12 3M Innovative Properties Company Structured abrasive article and method of making and using the same
FR2900411B1 (fr) 2006-04-27 2008-08-29 Coatex Sas Procede de traitement de matieres minerales par des polymeres amphoteres,matieres minerales obtenues,leur utilisation comme agent reducteur de la quantite de colloides dans la fabrication de papier.
US7445847B2 (en) 2006-05-25 2008-11-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US7169030B1 (en) 2006-05-25 2007-01-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
DE602007006307D1 (de) 2006-06-20 2010-06-17 Univ Leuven Kath Verfahren und vorrichtung zur in-situ-überwachung und rückkopplungssteuerung selektiver laserpulverbearbeitung
US7840305B2 (en) 2006-06-28 2010-11-23 3M Innovative Properties Company Abrasive articles, CMP monitoring system and method
US20080220702A1 (en) 2006-07-03 2008-09-11 Sang Fang Chemical Industry Co., Ltd. Polishing pad having surface texture
JP5186738B2 (ja) 2006-07-10 2013-04-24 富士通セミコンダクター株式会社 研磨パッドの製造方法及び被研磨体の研磨方法
TWI409136B (zh) 2006-07-19 2013-09-21 Innopad Inc 表面具微溝槽之化學機械平坦化墊
KR100804275B1 (ko) 2006-07-24 2008-02-18 에스케이씨 주식회사 고분자 쉘로 둘러싸인 액상 유기물 코어를 포함하는 ｃｍｐ연마패드 및 그 제조방법
KR101276962B1 (ko) 2006-07-28 2013-06-19 도레이 카부시키가이샤 상호 침입 고분자 그물형 구조체의 제조 방법 및 이를 이용한 연마 패드의 제조 방법
US7267610B1 (en) 2006-08-30 2007-09-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having unevenly spaced grooves
US7300340B1 (en) 2006-08-30 2007-11-27 Rohm and Haas Electronics Materials CMP Holdings, Inc. CMP pad having overlaid constant area spiral grooves
US8337282B2 (en) 2006-09-06 2012-12-25 Nitta Haas Incorporated Polishing pad
JP2008084504A (ja) 2006-09-29 2008-04-10 Hitachi Ltd 光ディスク装置および光ディスクの再生方法
US7382959B1 (en) 2006-10-13 2008-06-03 Hrl Laboratories, Llc Optically oriented three-dimensional polymer microstructures
KR100842486B1 (ko) 2006-10-30 2008-07-01 동부일렉트로닉스 주식회사 Ｃｍｐ 장비의 폴리싱패드와 이의 제조장치
US7234224B1 (en) 2006-11-03 2007-06-26 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Curved grooving of polishing pads
US7648645B2 (en) 2006-11-08 2010-01-19 3M Innovative Properties Company Pre-polymer formulations for liquid crystal displays
CN101199994A (zh) 2006-12-15 2008-06-18 湖南大学 智能化激光熔覆成型金属零件
US7371160B1 (en) 2006-12-21 2008-05-13 Rohm And Haas Electronic Materials Cmp Holdings Inc. Elastomer-modified chemical mechanical polishing pad
WO2008077850A2 (en) 2006-12-21 2008-07-03 Agfa Graphics Nv 3d-inkjet printing methods
US7438636B2 (en) 2006-12-21 2008-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US7497885B2 (en) 2006-12-22 2009-03-03 3M Innovative Properties Company Abrasive articles with nanoparticulate fillers and method for making and using them
US8083820B2 (en) 2006-12-22 2011-12-27 3M Innovative Properties Company Structured fixed abrasive articles including surface treated nano-ceria filler, and method for making and using the same
US7520798B2 (en) 2007-01-31 2009-04-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with grooves to reduce slurry consumption
US7311590B1 (en) 2007-01-31 2007-12-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with grooves to retain slurry on the pad texture
JP5204502B2 (ja) 2007-02-01 2013-06-05 株式会社クラレ 研磨パッド及び研磨パッドの製造方法
EP2123400B1 (en) 2007-02-01 2012-10-10 Kuraray Co., Ltd. Polishing pad and process for production of polishing pad
US20080202577A1 (en) 2007-02-16 2008-08-28 Henry Hieslmair Dynamic design of solar cell structures, photovoltaic modules and corresponding processes
JP2008258574A (ja) * 2007-03-14 2008-10-23 Jsr Corp 化学機械研磨パッドおよび化学機械研磨方法
JP5021669B2 (ja) 2007-03-20 2012-09-12 株式会社クラレ 研磨パッド用クッションおよびそれを用いた研磨パッド
JP4798713B2 (ja) 2007-03-26 2011-10-19 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 研磨パッドの製造方法
JP4954762B2 (ja) 2007-03-27 2012-06-20 東洋ゴム工業株式会社 ポリウレタン発泡体の製造方法
US9536711B2 (en) 2007-03-30 2017-01-03 Lam Research Corporation Method and apparatus for DC voltage control on RF-powered electrode
WO2008120183A1 (en) 2007-04-01 2008-10-09 Objet Geometries Ltd. Method and system for three-dimensional fabrication
US20090011679A1 (en) 2007-04-06 2009-01-08 Rajeev Bajaj Method of removal profile modulation in cmp pads
FR2915016B1 (fr) 2007-04-10 2009-06-05 Siemens Vdo Automotive Sas Systeme de creation automatisee d'une interface logicielle
US8067814B2 (en) 2007-06-01 2011-11-29 Panasonic Corporation Semiconductor device and method of manufacturing the same
US8562389B2 (en) 2007-06-08 2013-10-22 Applied Materials, Inc. Thin polishing pad with window and molding process
US7455571B1 (en) 2007-06-20 2008-11-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Window polishing pad
US20080314878A1 (en) 2007-06-22 2008-12-25 General Electric Company Apparatus and method for controlling a machining system
US7758764B2 (en) 2007-06-28 2010-07-20 Lam Research Corporation Methods and apparatus for substrate processing
US8563619B2 (en) 2007-06-28 2013-10-22 Lam Research Corporation Methods and arrangements for plasma processing system with tunable capacitance
US7862320B2 (en) 2007-07-17 2011-01-04 Seiko Epson Corporation Three-dimensional object forming apparatus and method for forming three dimensional object
US8047899B2 (en) 2007-07-26 2011-11-01 Macronix International Co., Ltd. Pad and method for chemical mechanical polishing
US7635290B2 (en) 2007-08-15 2009-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Interpenetrating network for chemical mechanical polishing
US7517277B2 (en) 2007-08-16 2009-04-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Layered-filament lattice for chemical mechanical polishing
US7828634B2 (en) 2007-08-16 2010-11-09 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Interconnected-multi-element-lattice polishing pad
CN101376234B (zh) 2007-08-28 2013-05-29 侯家祥 一种研磨工具磨料颗粒有序排列的方法
WO2009032768A2 (en) 2007-09-03 2009-03-12 Semiquest, Inc. Polishing pad
KR101232442B1 (ko) 2007-09-21 2013-02-12 캐보트 마이크로일렉트로닉스 코포레이션 아미노실란으로 처리된 연마제 입자를 이용한 연마 조성물 및 방법
US8142869B2 (en) 2007-09-27 2012-03-27 Toyoda Gosei Co., Ltd. Coated base fabric for airbags
JP5078527B2 (ja) 2007-09-28 2012-11-21 富士紡ホールディングス株式会社 研磨布
FR2921667B1 (fr) 2007-10-01 2012-11-09 Saint Gobain Abrasives Inc Composition resinique liquide pour articles abrasifs
JP5143528B2 (ja) 2007-10-25 2013-02-13 株式会社クラレ 研磨パッド
US8491360B2 (en) 2007-10-26 2013-07-23 Innopad, Inc. Three-dimensional network in CMP pad
US20090133716A1 (en) 2007-10-29 2009-05-28 Wai Mun Lee Methods of post chemical mechanical polishing and wafer cleaning using amidoxime compositions
US8388410B2 (en) 2007-11-05 2013-03-05 P.R. Hoffman Machine Products, Inc. RFID-containing carriers used for silicon wafer quality
JP2009129970A (ja) 2007-11-20 2009-06-11 Ebara Corp 研磨装置及び研磨方法
JP5881948B2 (ja) 2007-11-27 2016-03-09 スリーディー システムズ インコーポレーテッド 高透明性を有する三次元物品を製造するための光硬化型樹脂組成物
DE102007056984A1 (de) 2007-11-27 2009-05-28 Eos Gmbh Electro Optical Systems Verfahren zum Herstellen eines dreidimensionalen Objekts mittels Lasersintern
WO2009088945A1 (en) 2007-12-31 2009-07-16 Innopad, Inc. Chemical-mechanical planarization pad
US8444458B2 (en) 2007-12-31 2013-05-21 3M Innovative Properties Company Plasma treated abrasive article and method of making same
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
WO2009119317A1 (ja) 2008-03-25 2009-10-01 住友ゴム工業株式会社 タイヤのパンク修理装置
JP5226359B2 (ja) 2008-04-02 2013-07-03 株式会社クラレ 研磨パッド用クッションおよびそれを用いた研磨パッド
JP2011517111A (ja) 2008-04-11 2011-05-26 イノパッド，インコーポレイテッド ボイドネットワークを有する化学機械的平坦化パッド
US8177603B2 (en) 2008-04-29 2012-05-15 Semiquest, Inc. Polishing pad composition
WO2009145069A1 (ja) 2008-05-26 2009-12-03 ソニー株式会社 造形装置および造形方法
TW201005825A (en) 2008-05-30 2010-02-01 Panasonic Corp Plasma processing apparatus and method
US20090308739A1 (en) 2008-06-17 2009-12-17 Applied Materials, Inc. Wafer processing deposition shielding components
TWM347669U (en) 2008-06-19 2008-12-21 Bestac Advanced Material Co Ltd Polishing pad and polishing device
CN101612722A (zh) 2008-06-25 2009-12-30 三芳化学工业股份有限公司 抛光垫及其制造方法
CN102131618A (zh) 2008-06-26 2011-07-20 3M创新有限公司 具有多孔单元的抛光垫以及制造和使用该抛光垫的方法
US8282866B2 (en) 2008-06-30 2012-10-09 Seiko Epson Corporation Method and device for forming three-dimensional model, sheet material processing method, and sheet material processing device
US20100011672A1 (en) 2008-07-16 2010-01-21 Kincaid Don H Coated abrasive article and method of making and using the same
US20110183583A1 (en) 2008-07-18 2011-07-28 Joseph William D Polishing Pad with Floating Elements and Method of Making and Using the Same
US20140069584A1 (en) 2008-07-23 2014-03-13 Applied Materials, Inc. Differential counter electrode tuning in a plasma reactor with an rf-driven ceiling electrode
US20100018648A1 (en) 2008-07-23 2010-01-28 Applied Marterials, Inc. Workpiece support for a plasma reactor with controlled apportionment of rf power to a process kit ring
US20140034239A1 (en) 2008-07-23 2014-02-06 Applied Materials, Inc. Differential counter electrode tuning in a plasma reactor with an rf-driven workpiece support electrode
US8734664B2 (en) 2008-07-23 2014-05-27 Applied Materials, Inc. Method of differential counter electrode tuning in an RF plasma reactor
CN101642898B (zh) 2008-08-06 2011-09-14 财团法人工业技术研究院 抛光垫及其形成方法以及抛光方法
KR101410116B1 (ko) 2008-08-08 2014-06-25 가부시키가이샤 구라레 연마 패드 및 연마 패드의 제조 방법
KR20100028294A (ko) 2008-09-04 2010-03-12 주식회사 코오롱 연마패드 및 그의 제조방법
JP5632378B2 (ja) 2008-09-26 2014-11-26 ロディア オペレーションズＲｈｏｄｉａ Ｏｐｅｒａｔｉｏｎｓ 化学機械研磨用研磨剤組成物及びその使用法
JP2010077288A (ja) 2008-09-26 2010-04-08 Toray Ind Inc 相互侵入高分子網目構造体、研磨パッドおよび相互侵入高分子網目構造体の製造方法
US8118641B2 (en) 2009-03-04 2012-02-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having window with integral identification feature
TW201016387A (en) 2008-10-22 2010-05-01 jian-min Song CMP Pad Dressers with Hybridized abrasive surface and related methods
US20100112919A1 (en) 2008-11-03 2010-05-06 Applied Materials, Inc. Monolithic linear polishing sheet
US8292692B2 (en) 2008-11-26 2012-10-23 Semiquest, Inc. Polishing pad with endpoint window and systems and method using the same
DE102008060046A1 (de) 2008-12-02 2010-06-10 Eos Gmbh Electro Optical Systems Verfahren zum Bereitstellen einer identifizierbaren Pulvermenge und Verfahren zur Herstellung eines Objekts
US20100140850A1 (en) 2008-12-04 2010-06-10 Objet Geometries Ltd. Compositions for 3D printing
DE102008061311A1 (de) 2008-12-11 2010-06-24 Doukas Ag Vorrichtung zum Fördern eines Gases
US8062103B2 (en) 2008-12-23 2011-11-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High-rate groove pattern
US8057282B2 (en) 2008-12-23 2011-11-15 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High-rate polishing method
US8435099B2 (en) 2009-01-27 2013-05-07 Innopad, Inc. Chemical-mechanical planarization pad including patterned structural domains
US8053487B2 (en) 2009-01-30 2011-11-08 The United States Of America As Represented By The Secretary Of The Navy Multifunctional acrylates used as cross-linkers in dental and biomedical self-etching bonding adhesives
EP2398577A2 (en) 2009-02-19 2011-12-28 Bonner, Alex Garfield Porous interpenetrating polymer network
WO2010116486A1 (ja) 2009-04-07 2010-10-14 トヨタ自動車株式会社 ステータおよびその製造方法
WO2010123744A2 (en) 2009-04-23 2010-10-28 Cabot Microelectronics Corporation Cmp porous pad with particles in a polymeric matrix
KR101352235B1 (ko) 2009-05-27 2014-01-15 로저스코포레이션 연마 패드, 이를 위한 폴리우레탄층, 및 규소 웨이퍼의 연마 방법
JP5357639B2 (ja) 2009-06-24 2013-12-04 株式会社日立ハイテクノロジーズ プラズマ処理装置およびプラズマ処理方法
KR101750775B1 (ko) 2009-06-29 2017-06-26 디아이씨 가부시끼가이샤 연마 패드용 2액형 우레탄 수지 조성물, 폴리우레탄 연마 패드, 및 폴리우레탄 연마 패드의 제조 방법
WO2011008918A2 (en) 2009-07-16 2011-01-20 Cabot Microelectronics Corporation Grooved cmp polishing pad
TWI535527B (zh) 2009-07-20 2016-06-01 智勝科技股份有限公司 研磨方法、研磨墊與研磨系統
US8676537B2 (en) 2009-08-07 2014-03-18 Taiwan Semiconductor Manufacturing Company, Ltd. Portable wireless sensor
US8712571B2 (en) 2009-08-07 2014-04-29 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for wireless transmission of diagnostic information
US8889232B2 (en) 2009-08-20 2014-11-18 Electronics For Imaging, Inc. Radiation curable ink compositions
TWI410299B (zh) 2009-08-24 2013-10-01 Bestac Advanced Material Co Ltd 研磨墊與其應用及其製造方法
US8546717B2 (en) 2009-09-17 2013-10-01 Sciaky, Inc. Electron beam layer manufacturing
EP2489699B1 (en) 2009-10-16 2014-07-16 Posco Radiation curable resin composition, and fingerprint-resistant resin composition containing same
RU2012116583A (ru) * 2009-11-12 2013-12-20 3М Инновейтив Пропертиз Компани Вращающаяся полировальная подушка
WO2011059621A1 (en) 2009-11-13 2011-05-19 Sciaky, Inc. Electron beam layer manufacturing using scanning electron monitored closed loop control
JP5496630B2 (ja) 2009-12-10 2014-05-21 東京エレクトロン株式会社 静電チャック装置
US20130012108A1 (en) 2009-12-22 2013-01-10 Naichao Li Polishing pad and method of making the same
CN102686693A (zh) 2009-12-28 2012-09-19 日立化成工业株式会社 Cmp用研磨液及使用其的研磨方法
KR20120112662A (ko) 2009-12-30 2012-10-11 쓰리엠 이노베이티브 프로퍼티즈 컴파니 유기 미립자 로딩된 폴리싱 패드 및 이를 제조 및 사용하는 방법
CN102686362A (zh) 2009-12-30 2012-09-19 3M创新有限公司 包括分相共混聚合物的抛光垫及其制备和使用方法
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US9089943B2 (en) 2010-01-29 2015-07-28 Ronald Lipson Composite pads for buffing and polishing painted vehicle body surfaces and other applications
DE102010007401A1 (de) 2010-02-03 2011-08-04 Kärcher Futuretech GmbH, 71364 Vorrichtung und Verfahren zum automatisierten Formen und Abfüllen von Behältern
US20130048018A1 (en) 2010-02-22 2013-02-28 Entegris, Inc. Post-cmp cleaning brush
KR20110100080A (ko) 2010-03-03 2011-09-09 삼성전자주식회사 화학적 기계적 연마 공정용 연마 패드 및 이를 포함하는 화학적 기계적 연마 설비
DE102010011059A1 (de) 2010-03-11 2011-09-15 Global Beam Technologies Ag Verfahren und Vorrichtung zur Herstellung eines Bauteils
JP5551479B2 (ja) 2010-03-19 2014-07-16 ニッタ・ハース株式会社 研磨装置、研磨パッドおよび研磨情報管理システム
JP5620141B2 (ja) 2010-04-15 2014-11-05 東洋ゴム工業株式会社 研磨パッド
JP5697889B2 (ja) 2010-04-19 2015-04-08 帝人コードレ株式会社 平滑加工用シート
CN102892553B (zh) 2010-05-11 2016-04-27 3M创新有限公司 用于化学机械平面化的具有表面活性剂的固定磨料垫片
EP2585541B1 (en) 2010-06-25 2016-06-08 3M Innovative Properties Company Semi-interpenetrating polymer network
US20120000887A1 (en) 2010-06-30 2012-01-05 Kabushiki Kaisha Toshiba Plasma treatment apparatus and plasma treatment method
BR112013000098A2 (pt) 2010-07-02 2016-05-17 3M Innovative Properties Co artigos abrasivos revestidos
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
JP5635957B2 (ja) 2010-09-09 2014-12-03 日本碍子株式会社 被研磨物の研磨方法、及び研磨パッド
WO2012040212A2 (en) 2010-09-22 2012-03-29 Interfacial Solutions Ip, Llc Methods of producing microfabricated particles for composite materials
US8257545B2 (en) 2010-09-29 2012-09-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with light stable polymeric endpoint detection window and method of polishing therewith
US8702479B2 (en) 2010-10-15 2014-04-22 Nexplanar Corporation Polishing pad with multi-modal distribution of pore diameters
KR20130138294A (ko) 2010-12-16 2013-12-18 쓰리엠 이노베이티브 프로퍼티즈 컴파니 상호침투 중합체 층
US8758663B2 (en) 2011-01-26 2014-06-24 Zydex Pty Ltd Device for making objects by applying material over a surface
US9211628B2 (en) 2011-01-26 2015-12-15 Nexplanar Corporation Polishing pad with concentric or approximately concentric polygon groove pattern
JP5893479B2 (ja) 2011-04-21 2016-03-23 東洋ゴム工業株式会社 積層研磨パッド
CN103492504B (zh) 2011-04-27 2017-06-23 汉高知识产权控股有限责任公司 具有低温密封能力的可固化的弹性体组合物
US8968058B2 (en) 2011-05-05 2015-03-03 Nexplanar Corporation Polishing pad with alignment feature
US20120302148A1 (en) 2011-05-23 2012-11-29 Rajeev Bajaj Polishing pad with homogeneous body having discrete protrusions thereon
JP5851124B2 (ja) 2011-06-13 2016-02-03 スリーエム イノベイティブ プロパティズ カンパニー 研磨用構造体
EP2537675B1 (en) 2011-06-21 2013-12-11 Agfa Graphics N.V. A curable jettable fluid for making a flexographic printing master
US10388493B2 (en) 2011-09-16 2019-08-20 Lam Research Corporation Component of a substrate support assembly producing localized magnetic fields
US8894799B2 (en) 2011-09-22 2014-11-25 Dow Global Technologies Llc Method of forming layered-open-network polishing pads
US8801949B2 (en) 2011-09-22 2014-08-12 Dow Global Technologies Llc Method of forming open-network polishing pads
US9108291B2 (en) 2011-09-22 2015-08-18 Dow Global Technologies Llc Method of forming structured-open-network polishing pads
JP2014534615A (ja) 2011-09-26 2014-12-18 インテグリス・インコーポレーテッド Ｃｍｐ後クリーニング装置および方法
US20130107415A1 (en) 2011-10-28 2013-05-02 Applied Materials, Inc. Electrostatic chuck
TWI462797B (zh) 2011-11-24 2014-12-01 Univ Nat Taiwan Science Tech Electric field assisted chemical mechanical polishing system and its method
US9067297B2 (en) 2011-11-29 2015-06-30 Nexplanar Corporation Polishing pad with foundation layer and polishing surface layer
SG10201508090WA (en) * 2011-11-29 2015-10-29 Nexplanar Corp Polishing pad with foundation layer and polishing surface layer
US9067298B2 (en) 2011-11-29 2015-06-30 Nexplanar Corporation Polishing pad with grooved foundation layer and polishing surface layer
US9152006B2 (en) 2011-11-30 2015-10-06 Merck Patent Gmbh Particles for electrophoretic displays
US10825708B2 (en) 2011-12-15 2020-11-03 Applied Materials, Inc. Process kit components for use with an extended and independent RF powered cathode substrate for extreme edge tunability
KR20130084932A (ko) 2012-01-18 2013-07-26 삼성전자주식회사 반도체 소자의 제조 방법
US8486798B1 (en) 2012-02-05 2013-07-16 Tokyo Electron Limited Variable capacitance chamber component incorporating a semiconductor junction and methods of manufacturing and using thereof
US8721833B2 (en) 2012-02-05 2014-05-13 Tokyo Electron Limited Variable capacitance chamber component incorporating ferroelectric materials and methods of manufacturing and using thereof
KR20130095430A (ko) 2012-02-20 2013-08-28 케이피엑스케미칼 주식회사 연마패드 및 그 제조방법
EP2819822B1 (en) 2012-03-01 2016-09-28 Stratasys Ltd. Cationic polymerizable compositions and methods of use thereof
DE102012203639A1 (de) 2012-03-08 2013-09-12 Evonik Industries Ag Additiv zur Einstellung der Glasübergangstemperatur von viskoelastischen Polyurethanweichschaumstoffen
US8709114B2 (en) 2012-03-22 2014-04-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing chemical mechanical polishing layers
US8986585B2 (en) 2012-03-22 2015-03-24 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing chemical mechanical polishing layers having a window
JP2013201046A (ja) * 2012-03-26 2013-10-03 Toppan Printing Co Ltd 凹型欠陥の修正方法及びそれを用いた有機ｅｌ素子の製造方法
DE102012007791A1 (de) 2012-04-20 2013-10-24 Universität Duisburg-Essen Verfahren und Vorrichtung zur Herstellung von Bauteilen in einer Strahlschmelzanlage
US9067299B2 (en) * 2012-04-25 2015-06-30 Applied Materials, Inc. Printed chemical mechanical polishing pad
US9412579B2 (en) 2012-04-26 2016-08-09 Applied Materials, Inc. Methods and apparatus for controlling substrate uniformity
US9993873B2 (en) 2012-05-22 2018-06-12 General Electric Company System and method for three-dimensional printing
US9481134B2 (en) 2012-06-08 2016-11-01 Makerbot Industries, Llc Build platform leveling with tactile feedback
KR102136432B1 (ko) 2012-06-11 2020-07-21 캐보트 마이크로일렉트로닉스 코포레이션 몰리브덴을 연마하기 위한 조성물 및 방법
US8778211B2 (en) 2012-07-17 2014-07-15 Cabot Microelectronics Corporation GST CMP slurries
US9174388B2 (en) 2012-08-16 2015-11-03 Stratasys, Inc. Draw control for extrusion-based additive manufacturing systems
KR101697105B1 (ko) 2012-09-05 2017-01-17 아프레시아 파마슈티칼스 컴퍼니 3차원 인쇄 시스템 및 장비 어셈블리
US8888480B2 (en) 2012-09-05 2014-11-18 Aprecia Pharmaceuticals Company Three-dimensional printing system and equipment assembly
JP6196858B2 (ja) 2012-09-24 2017-09-13 株式会社荏原製作所 研磨方法および研磨装置
JP6300805B2 (ja) 2012-09-25 2018-03-28 スリーエム イノベイティブ プロパティズ カンパニー 放射線硬化性インク組成物
US9610239B2 (en) 2012-10-11 2017-04-04 Dow Corning Corporation Aqueous silicone polyether microemulsions
CN202825512U (zh) 2012-10-11 2013-03-27 中芯国际集成电路制造(北京)有限公司 研磨垫及化学机械研磨机台
US9233504B2 (en) 2012-10-29 2016-01-12 Makerbot Industries, Llc Tagged build material for three-dimensional printing
WO2014074947A2 (en) 2012-11-08 2014-05-15 Das, Suman Systems and methods for additive manufacturing and repair of metal components
WO2014095200A1 (en) 2012-12-17 2014-06-26 Arcam Ab Additive manufacturing method and apparatus
US10357435B2 (en) 2012-12-18 2019-07-23 Dentca, Inc. Photo-curable resin compositions and method of using the same in three-dimensional printing for manufacturing artificial teeth and denture base
US11673155B2 (en) 2012-12-27 2023-06-13 Kateeva, Inc. Techniques for arrayed printing of a permanent layer with improved speed and accuracy
CA2936015C (en) 2013-01-17 2021-05-25 Ehsan Toyserkani Systems and methods for additive manufacturing of heterogeneous porous structures and structures made therefrom
US9649742B2 (en) 2013-01-22 2017-05-16 Nexplanar Corporation Polishing pad having polishing surface with continuous protrusions
WO2014123706A1 (en) 2013-02-06 2014-08-14 Sun Chemical Corporation Digital printing inks
MY201381A (en) 2013-02-12 2024-02-21 Carbon3D Inc Continuous liquid interphase printing
EP2969465B1 (en) 2013-03-14 2019-05-01 Stratasys Ltd. Polymer based molds and methods of manufacturing there of
US9152340B2 (en) 2013-05-28 2015-10-06 Netapp, Inc. System and method for managing and producing a dataset image across multiple storage systems
JP5955275B2 (ja) 2013-06-12 2016-07-20 富士フイルム株式会社 画像形成方法、加飾シートの製造方法、成形加工方法、加飾シート成形物の製造方法、インモールド成形品の製造方法
US20140370788A1 (en) 2013-06-13 2014-12-18 Cabot Microelectronics Corporation Low surface roughness polishing pad
US10183329B2 (en) 2013-07-19 2019-01-22 The Boeing Company Quality control of additive manufactured parts
US20150038066A1 (en) 2013-07-31 2015-02-05 Nexplanar Corporation Low density polishing pad
GB201313841D0 (en) 2013-08-02 2013-09-18 Rolls Royce Plc Method of Manufacturing a Component
KR20180110213A (ko) 2013-08-06 2018-10-08 어플라이드 머티어리얼스, 인코포레이티드 국부적으로 가열되는 다-구역 기판 지지부
US9855698B2 (en) 2013-08-07 2018-01-02 Massachusetts Institute Of Technology Automatic process control of additive manufacturing device
JP5992375B2 (ja) 2013-08-08 2016-09-14 株式会社東芝 静電チャック、載置プレート支持台及び静電チャックの製造方法
WO2015023442A1 (en) 2013-08-10 2015-02-19 Applied Materials, Inc. Cmp pads having material composition that facilitates controlled conditioning
US20150056895A1 (en) 2013-08-22 2015-02-26 Cabot Microelectronics Corporation Ultra high void volume polishing pad with closed pore structure
SG11201601175WA (en) 2013-08-22 2016-03-30 Cabot Microelectronics Corp Polishing pad with porous interface and solid core, and related apparatus and methods
DE102013217422A1 (de) 2013-09-02 2015-03-05 Carl Zeiss Industrielle Messtechnik Gmbh Koordinatenmessgerät und Verfahren zur Vermessung und mindestens teilweisen Erzeugung eines Werkstücks
CN103465155B (zh) * 2013-09-06 2016-05-11 蓝思科技股份有限公司 一种环氧树脂型金刚石研磨垫及其制备方法
US9425121B2 (en) 2013-09-11 2016-08-23 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated fan-out structure with guiding trenches in buffer layer
KR101405333B1 (ko) 2013-09-12 2014-06-11 유비머트리얼즈주식회사 연마 입자, 연마 슬러리 및 이를 이용한 반도체 소자의 제조 방법
US9308620B2 (en) 2013-09-18 2016-04-12 Texas Instruments Incorporated Permeated grooving in CMP polishing pads
US9053908B2 (en) 2013-09-19 2015-06-09 Lam Research Corporation Method and apparatus for controlling substrate DC-bias and ion energy and angular distribution during substrate etching
GB201316815D0 (en) 2013-09-23 2013-11-06 Renishaw Plc Additive manufacturing apparatus and method
KR102252673B1 (ko) 2013-09-25 2021-05-18 쓰리엠 이노베이티브 프로퍼티즈 컴파니 다층화된 폴리싱 패드
RU2643004C2 (ru) 2013-09-30 2018-01-29 Сен-Гобен Серэмикс Энд Пластикс, Инк. Формованные абразивные частицы и способы их получения
EP3057775A1 (en) 2013-10-17 2016-08-24 LUXeXcel Holding B.V. Device for printing a three-dimensional structure
US9830456B2 (en) 2013-10-21 2017-11-28 Cisco Technology, Inc. Trust transference from a trusted processor to an untrusted processor
CN203542340U (zh) 2013-10-21 2014-04-16 中芯国际集成电路制造(北京)有限公司 一种化学机械研磨垫
US8980749B1 (en) 2013-10-24 2015-03-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for chemical mechanical polishing silicon wafers
US9831074B2 (en) 2013-10-24 2017-11-28 Applied Materials, Inc. Bipolar collimator utilized in a physical vapor deposition chamber
US10012904B2 (en) 2013-10-30 2018-07-03 Mark'Andy Inc. Lithographic printing plate precursors and coating
US9421666B2 (en) 2013-11-04 2016-08-23 Applied Materials, Inc. Printed chemical mechanical polishing pad having abrasives therein
US9481069B2 (en) 2013-11-06 2016-11-01 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus and polishing method using the same
CN104625945B (zh) 2013-11-07 2017-03-01 三芳化学工业股份有限公司 抛光垫及其制造方法
US9352443B2 (en) 2013-11-13 2016-05-31 Taiwan Semiconductor Manufacturing Co., Ltd. Platen assembly, chemical-mechanical polisher, and method for polishing substrate
US9850402B2 (en) 2013-12-09 2017-12-26 Cabot Microelectronics Corporation CMP compositions and methods for selective removal of silicon nitride
US9993907B2 (en) 2013-12-20 2018-06-12 Applied Materials, Inc. Printed chemical mechanical polishing pad having printed window
CN104742007B (zh) 2013-12-30 2017-08-25 中芯国际集成电路制造(北京)有限公司 化学机械研磨装置和化学机械研磨方法
CN106414039B (zh) 2014-01-23 2022-01-18 株式会社理光 三维物体及其形成方法
US20160354896A1 (en) 2014-02-10 2016-12-08 President And Fellows Of Harvard College 3d-printed polishing pad for chemical-mechanical planarization (cmp)
US20170173865A1 (en) 2014-02-10 2017-06-22 Stratasys Ltd. Composition and method for additive manufacturing of an object
WO2015120429A1 (en) 2014-02-10 2015-08-13 President And Fellows Of Harvard College Three-dimensional (3d) printed composite structure and 3d printable composite ink formulation
US9472410B2 (en) 2014-03-05 2016-10-18 Applied Materials, Inc. Pixelated capacitance controlled ESC
JP2015174272A (ja) 2014-03-14 2015-10-05 セイコーエプソン株式会社 三次元造形物の製造方法、三次元造形物製造装置および三次元造形物
US9259820B2 (en) 2014-03-28 2016-02-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with polishing layer and window
KR102347711B1 (ko) 2014-04-03 2022-01-06 쓰리엠 이노베이티브 프로퍼티즈 컴파니 폴리싱 패드 및 시스템과 이의 제조 및 사용 방법
US20170036320A1 (en) 2014-04-17 2017-02-09 Cabot Microelectronics Corporation Cmp polishing pad with columnar structure and methods related thereto
US9333620B2 (en) 2014-04-29 2016-05-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with clear endpoint detection window
US9314897B2 (en) 2014-04-29 2016-04-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US10144198B2 (en) 2014-05-02 2018-12-04 Corning Incorporated Strengthened glass and compositions therefor
CN104400998B (zh) 2014-05-31 2016-10-05 福州大学 一种基于红外光谱分析的3d打印检测方法
US9259821B2 (en) 2014-06-25 2016-02-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing layer formulation with conditioning tolerance
US20150375361A1 (en) 2014-06-25 2015-12-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
JP2016023209A (ja) 2014-07-17 2016-02-08 日立化成株式会社 研磨剤、研磨剤セット及び基体の研磨方法
US9731398B2 (en) 2014-08-22 2017-08-15 Rohm And Haas Electronic Materials Cmp Holding, Inc. Polyurethane polishing pad
US9826630B2 (en) 2014-09-04 2017-11-21 Nxp Usa, Inc. Fan-out wafer level packages having preformed embedded ground plane connections and methods for the fabrication thereof
US20160068996A1 (en) 2014-09-05 2016-03-10 Applied Materials, Inc. Susceptor and pre-heat ring for thermal processing of substrates
CN104210108B (zh) 2014-09-15 2017-11-28 宁波高新区乐轩锐蓝智能科技有限公司 3d打印机的打印缺陷弥补方法和系统
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US20160101500A1 (en) 2014-10-09 2016-04-14 Applied Materials, Inc. Chemical mechanical polishing pad with internal channels
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
CN107078048B (zh) 2014-10-17 2021-08-13 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
TWI689406B (zh) 2014-10-17 2020-04-01 美商應用材料股份有限公司 研磨墊及製造其之方法
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
CN104385595B (zh) 2014-10-20 2017-05-03 合肥斯科尔智能科技有限公司 一种三维打印次品修复系统
JP6422325B2 (ja) 2014-12-15 2018-11-14 花王株式会社 半導体基板用研磨液組成物
US10086500B2 (en) 2014-12-18 2018-10-02 Applied Materials, Inc. Method of manufacturing a UV curable CMP polishing pad
JP6452449B2 (ja) 2015-01-06 2019-01-16 東京エレクトロン株式会社 載置台及び基板処理装置
CN104607639B (zh) 2015-01-12 2016-11-02 常州先进制造技术研究所 一种用于金属3d打印的表面修复塑形装置
US20170263478A1 (en) 2015-01-16 2017-09-14 Lam Research Corporation Detection System for Tunable/Replaceable Edge Coupling Ring
US10946495B2 (en) 2015-01-30 2021-03-16 Cmc Materials, Inc. Low density polishing pad
US9505952B2 (en) 2015-03-05 2016-11-29 Cabot Microelectronics Corporation Polishing composition containing ceria abrasive
US9475168B2 (en) 2015-03-26 2016-10-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad window
WO2016173668A1 (en) 2015-04-30 2016-11-03 Hewlett-Packard Development Company, L.P. Misalignment detection for a 3d printing device
US10017857B2 (en) 2015-05-02 2018-07-10 Applied Materials, Inc. Method and apparatus for controlling plasma near the edge of a substrate
CN106206409B (zh) 2015-05-08 2019-05-07 华邦电子股份有限公司 堆叠电子装置及其制造方法
TWI559026B (zh) 2015-06-24 2016-11-21 財團法人工業技術研究院 抗反射結構及其製造方法
CN205703794U (zh) 2015-06-29 2016-11-23 智胜科技股份有限公司 研磨垫的研磨层
US10163610B2 (en) 2015-07-13 2018-12-25 Lam Research Corporation Extreme edge sheath and wafer profile tuning through edge-localized ion trajectory control and plasma operation
US9761459B2 (en) 2015-08-05 2017-09-12 Lam Research Corporation Systems and methods for reverse pulsing
US9620376B2 (en) 2015-08-19 2017-04-11 Lam Research Corporation Self limiting lateral atomic layer etch
US10406801B2 (en) 2015-08-21 2019-09-10 Voxel8, Inc. Calibration and alignment of 3D printing deposition heads
US9984858B2 (en) 2015-09-04 2018-05-29 Lam Research Corporation ALE smoothness: in and outside semiconductor industry
CN108025496A (zh) 2015-09-16 2018-05-11 应用材料公司 用于增材制造的可选择性打开的支撑工作台
CN105161432A (zh) 2015-09-17 2015-12-16 中芯长电半导体（江阴）有限公司 一种芯片封装方法
US10192751B2 (en) 2015-10-15 2019-01-29 Lam Research Corporation Systems and methods for ultrahigh selective nitride etch
WO2017066077A1 (en) 2015-10-16 2017-04-20 Applied Materials, Inc. Method and apparatus for forming advanced polishing pads using an additive manufacturing process
US10124492B2 (en) 2015-10-22 2018-11-13 Lam Research Corporation Automated replacement of consumable parts using end effectors interfacing with plasma processing system
US20170115657A1 (en) 2015-10-22 2017-04-27 Lam Research Corporation Systems for Removing and Replacing Consumable Parts from a Semiconductor Process Module in Situ
US10062599B2 (en) 2015-10-22 2018-08-28 Lam Research Corporation Automated replacement of consumable parts using interfacing chambers
US9881820B2 (en) 2015-10-22 2018-01-30 Lam Research Corporation Front opening ring pod
GB201519187D0 (en) 2015-10-30 2015-12-16 Knauf Insulation Ltd Improved binder compositions and uses thereof
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US10450474B2 (en) 2015-10-30 2019-10-22 Konica Minolta, Inc. Active light ray-curable inkjet ink composition and inkjet recording method
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10229769B2 (en) 2015-11-20 2019-03-12 Xerox Corporation Three phase immiscible polymer-metal blends for high conductivty composites
US10189143B2 (en) 2015-11-30 2019-01-29 Taiwan Semiconductor Manufacturing Company Limited Polishing pad, method for manufacturing polishing pad, and polishing method
US9601319B1 (en) 2016-01-07 2017-03-21 Lam Research Corporation Systems and methods for eliminating flourine residue in a substrate processing chamber using a plasma-based process
CN113146464A (zh) 2016-01-19 2021-07-23 应用材料公司 多孔化学机械抛光垫
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US10685862B2 (en) 2016-01-22 2020-06-16 Applied Materials, Inc. Controlling the RF amplitude of an edge ring of a capacitively coupled plasma process device
US9956314B2 (en) 2016-01-26 2018-05-01 Modern Ideas LLC Adhesive for use with bone and bone-like structures
US10651015B2 (en) 2016-02-12 2020-05-12 Lam Research Corporation Variable depth edge ring for etch uniformity control
US10699878B2 (en) 2016-02-12 2020-06-30 Lam Research Corporation Chamber member of a plasma source and pedestal with radially outward positioned lift pins for translation of a substrate c-ring
US10438833B2 (en) 2016-02-16 2019-10-08 Lam Research Corporation Wafer lift ring system for wafer transfer
US9966231B2 (en) 2016-02-29 2018-05-08 Lam Research Corporation Direct current pulsing plasma systems
US10773509B2 (en) 2016-03-09 2020-09-15 Applied Materials, Inc. Pad structure and fabrication methods
SG11201806820UA (en) 2016-03-09 2018-09-27 Applied Materials Inc Correction of fabricated shapes in additive manufacturing
KR102535628B1 (ko) 2016-03-24 2023-05-30 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마를 위한 조직화된 소형 패드
US10269566B2 (en) 2016-04-29 2019-04-23 Lam Research Corporation Etching substrates using ale and selective deposition
KR20170127724A (ko) 2016-05-12 2017-11-22 삼성전자주식회사 플라즈마 처리 장치
US10340171B2 (en) 2016-05-18 2019-07-02 Lam Research Corporation Permanent secondary erosion containment for electrostatic chuck bonds
US9852889B1 (en) 2016-06-22 2017-12-26 Lam Research Corporation Systems and methods for controlling directionality of ions in an edge region by using an electrode within a coupling ring
US10283330B2 (en) 2016-07-25 2019-05-07 Lam Research Corporation Systems and methods for achieving a pre-determined factor associated with an edge region within a plasma chamber by synchronizing main and edge RF generators
JP6791680B2 (ja) 2016-08-09 2020-11-25 株式会社フジミインコーポレーテッド 表面処理組成物およびこれを用いた洗浄方法
US20180100073A1 (en) 2016-10-11 2018-04-12 Xerox Corporation Ink composition for use in 3d printing
US10259956B2 (en) 2016-10-11 2019-04-16 Xerox Corporation Curable ink composition
US20180100074A1 (en) 2016-10-11 2018-04-12 Xerox Corporation Ink composition for use in 3d printing
US10930535B2 (en) 2016-12-02 2021-02-23 Applied Materials, Inc. RFID part authentication and tracking of processing components
CN106810215B (zh) * 2017-01-18 2022-08-16 重庆摩方科技有限公司 一种陶瓷浆料的制备及3d打印光固化成型方法
KR102683416B1 (ko) 2017-02-15 2024-07-23 삼성전자주식회사 화학 기계적 연마 장치
US20180323042A1 (en) 2017-05-02 2018-11-08 Applied Materials, Inc. Method to modulate the wafer edge sheath in a plasma processing chamber
US11059149B2 (en) 2017-05-25 2021-07-13 Applied Materials, Inc. Correction of fabricated shapes in additive manufacturing using initial layer
US10967482B2 (en) 2017-05-25 2021-04-06 Applied Materials, Inc. Fabrication of polishing pad by additive manufacturing onto mold
JP6826955B2 (ja) 2017-06-14 2021-02-10 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
US11458673B2 (en) 2017-06-21 2022-10-04 Carbon, Inc. Resin dispenser for additive manufacturing
US10763081B2 (en) 2017-07-10 2020-09-01 Applied Materials, Inc. Apparatus and methods for manipulating radio frequency power at an edge ring in plasma process device
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
JP7033907B2 (ja) 2017-12-21 2022-03-11 東京エレクトロン株式会社 プラズマエッチング装置及びプラズマエッチング方法
WO2019143473A1 (en) 2018-01-22 2019-07-25 Applied Materials, Inc. Processing with powered edge ring
WO2019152222A1 (en) 2018-02-05 2019-08-08 Applied Materials, Inc. Piezo-electric end-pointing for 3d printed cmp pads
WO2019190676A1 (en) 2018-03-30 2019-10-03 Applied Materials, Inc. Integrating 3d printing into multi-process fabrication schemes
JP7373503B2 (ja) 2018-05-07 2023-11-02 アプライド マテリアルズ インコーポレイテッド 親水性及びゼータ電位の調節可能な化学機械研磨パッド
US10600623B2 (en) 2018-05-28 2020-03-24 Applied Materials, Inc. Process kit with adjustable tuning ring for edge uniformity control
US10347500B1 (en) 2018-06-04 2019-07-09 Applied Materials, Inc. Device fabrication via pulsed plasma
US10847347B2 (en) 2018-08-23 2020-11-24 Applied Materials, Inc. Edge ring assembly for a substrate support in a plasma processing chamber
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
CN112913140B (zh) 2018-11-09 2024-09-03 应用材料公司 用于处理腔室的射频滤波器系统
US11289310B2 (en) 2018-11-21 2022-03-29 Applied Materials, Inc. Circuits for edge ring control in shaped DC pulsed plasma process device
JP7451540B2 (ja) 2019-01-22 2024-03-18 アプライド マテリアルズ インコーポレイテッド パルス状電圧波形を制御するためのフィードバックループ
US20200230781A1 (en) 2019-01-23 2020-07-23 Applied Materials, Inc. Polishing pads formed using an additive manufacturing process and methods related thereto
KR102655348B1 (ko) 2019-03-19 2024-04-04 어플라이드 머티어리얼스, 인코포레이티드 소수성 및 아이스포빅 코팅
US11851570B2 (en) 2019-04-12 2023-12-26 Applied Materials, Inc. Anionic polishing pads formed by printing processes

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