US2001911A
(en)
|
1932-04-21 |
1935-05-21 |
Carborundum Co |
Abrasive articles
|
US3357598A
(en)
|
1965-09-21 |
1967-12-12 |
Dole Valve Co |
Adjustable liquid dispenser
|
US3741116A
(en)
|
1970-06-25 |
1973-06-26 |
American Screen Process Equip |
Vacuum belt
|
US4459779A
(en)
|
1982-09-16 |
1984-07-17 |
International Business Machines Corporation |
Fixed abrasive grinding media
|
US4575330A
(en)
|
1984-08-08 |
1986-03-11 |
Uvp, Inc. |
Apparatus for production of three-dimensional objects by stereolithography
|
US4836832A
(en)
|
1986-08-11 |
1989-06-06 |
Minnesota Mining And Manufacturing Company |
Method of preparing coated abrasive having radiation curable binder
|
US4841680A
(en)
|
1987-08-25 |
1989-06-27 |
Rodel, Inc. |
Inverted cell pad material for grinding, lapping, shaping and polishing
|
US4942001A
(en)
|
1988-03-02 |
1990-07-17 |
Inc. DeSoto |
Method of forming a three-dimensional object by stereolithography and composition therefore
|
DE3808951A1
(en)
|
1988-03-17 |
1989-10-05 |
Basf Ag |
PHOTOPOLYMERIZABLE PRINTING PLATE SUITABLE FOR PRODUCING PRINTING FORMS
|
US4985340A
(en)
|
1988-06-01 |
1991-01-15 |
Minnesota Mining And Manufacturing Company |
Energy curable compositions: two component curing agents
|
US4844144A
(en)
|
1988-08-08 |
1989-07-04 |
Desoto, Inc. |
Investment casting utilizing patterns produced by stereolithography
|
JPH07102724B2
(en)
|
1988-08-31 |
1995-11-08 |
ジューキ株式会社 |
Printer
|
US5121329A
(en)
|
1989-10-30 |
1992-06-09 |
Stratasys, Inc. |
Apparatus and method for creating three-dimensional objects
|
US5387380A
(en)
|
1989-12-08 |
1995-02-07 |
Massachusetts Institute Of Technology |
Three-dimensional printing techniques
|
DE3942859A1
(en)
|
1989-12-23 |
1991-07-04 |
Basf Ag |
METHOD FOR PRODUCING COMPONENTS
|
US5626919A
(en)
|
1990-03-01 |
1997-05-06 |
E. I. Du Pont De Nemours And Company |
Solid imaging apparatus and method with coating station
|
US5096530A
(en)
|
1990-06-28 |
1992-03-17 |
3D Systems, Inc. |
Resin film recoating method and apparatus
|
JP2929779B2
(en)
|
1991-02-15 |
1999-08-03 |
トヨタ自動車株式会社 |
Water-repellent glass with carbon coating
|
JPH05188528A
(en)
|
1991-06-25 |
1993-07-30 |
Eastman Kodak Co |
Photograph element containing pressure-absorption protecting layer
|
US5212910A
(en)
|
1991-07-09 |
1993-05-25 |
Intel Corporation |
Composite polishing pad for semiconductor process
|
US5193316A
(en)
|
1991-10-29 |
1993-03-16 |
Texas Instruments Incorporated |
Semiconductor wafer polishing using a hydrostatic medium
|
US5287663A
(en)
|
1992-01-21 |
1994-02-22 |
National Semiconductor Corporation |
Polishing pad and method for polishing semiconductor wafers
|
US5178646A
(en)
|
1992-01-22 |
1993-01-12 |
Minnesota Mining And Manufacturing Company |
Coatable thermally curable binder presursor solutions modified with a reactive diluent, abrasive articles incorporating same, and methods of making said abrasive articles
|
US6099394A
(en)
|
1998-02-10 |
2000-08-08 |
Rodel Holdings, Inc. |
Polishing system having a multi-phase polishing substrate and methods relating thereto
|
US6022264A
(en)
*
|
1997-02-10 |
2000-02-08 |
Rodel Inc. |
Polishing pad and methods relating thereto
|
MY114512A
(en)
|
1992-08-19 |
2002-11-30 |
Rodel Inc |
Polymeric substrate with polymeric microelements
|
US6746225B1
(en)
|
1992-11-30 |
2004-06-08 |
Bechtel Bwtx Idaho, Llc |
Rapid solidification processing system for producing molds, dies and related tooling
|
CA2151932A1
(en)
|
1992-12-17 |
1994-06-23 |
Scott R. Culler |
Reduced viscosity slurries, abrasive articles made therefrom, and methods of making said articles
|
US5453312A
(en)
|
1993-10-29 |
1995-09-26 |
Minnesota Mining And Manufacturing Company |
Abrasive article, a process for its manufacture, and a method of using it to reduce a workpiece surface
|
JPH07297195A
(en)
|
1994-04-27 |
1995-11-10 |
Speedfam Co Ltd |
Method and apparatus for flattening semiconductor device
|
US5906863A
(en)
|
1994-08-08 |
1999-05-25 |
Lombardi; John |
Methods for the preparation of reinforced three-dimensional bodies
|
JPH08132342A
(en)
|
1994-11-08 |
1996-05-28 |
Hitachi Ltd |
Manufacturing device for semiconductor integrated circuit device
|
KR100258802B1
(en)
|
1995-02-15 |
2000-06-15 |
전주범 |
Planarization apparatus and method using the same
|
US6719818B1
(en)
|
1995-03-28 |
2004-04-13 |
Applied Materials, Inc. |
Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
|
US5533923A
(en)
|
1995-04-10 |
1996-07-09 |
Applied Materials, Inc. |
Chemical-mechanical polishing pad providing polishing unformity
|
US5645471A
(en)
|
1995-08-11 |
1997-07-08 |
Minnesota Mining And Manufacturing Company |
Method of texturing a substrate using an abrasive article having multiple abrasive natures
|
US5605760A
(en)
|
1995-08-21 |
1997-02-25 |
Rodel, Inc. |
Polishing pads
|
JPH0976353A
(en)
|
1995-09-12 |
1997-03-25 |
Toshiba Corp |
Optical shaping apparatus
|
JP3324643B2
(en)
|
1995-10-25 |
2002-09-17 |
日本電気株式会社 |
Polishing pad
|
US5738574A
(en)
|
1995-10-27 |
1998-04-14 |
Applied Materials, Inc. |
Continuous processing system for chemical mechanical polishing
|
US5905099A
(en)
|
1995-11-06 |
1999-05-18 |
Minnesota Mining And Manufacturing Company |
Heat-activatable adhesive composition
|
US5609517A
(en)
|
1995-11-20 |
1997-03-11 |
International Business Machines Corporation |
Composite polishing pad
|
JP3566430B2
(en)
|
1995-12-20 |
2004-09-15 |
株式会社ルネサステクノロジ |
Method for manufacturing semiconductor device
|
US5624303A
(en)
|
1996-01-22 |
1997-04-29 |
Micron Technology, Inc. |
Polishing pad and a method for making a polishing pad with covalently bonded particles
|
US6095084A
(en)
|
1996-02-02 |
2000-08-01 |
Applied Materials, Inc. |
High density plasma process chamber
|
US5778481A
(en)
|
1996-02-15 |
1998-07-14 |
International Business Machines Corporation |
Silicon wafer cleaning and polishing pads
|
US5690540A
(en)
|
1996-02-23 |
1997-11-25 |
Micron Technology, Inc. |
Spiral grooved polishing pad for chemical-mechanical planarization of semiconductor wafers
|
US6090475A
(en)
|
1996-05-24 |
2000-07-18 |
Micron Technology Inc. |
Polishing pad, methods of manufacturing and use
|
JP3498881B2
(en)
|
1996-05-27 |
2004-02-23 |
セントラル硝子株式会社 |
Manufacturing method of water-repellent glass
|
US5976000A
(en)
|
1996-05-28 |
1999-11-02 |
Micron Technology, Inc. |
Polishing pad with incompressible, highly soluble particles for chemical-mechanical planarization of semiconductor wafers
|
US5748434A
(en)
|
1996-06-14 |
1998-05-05 |
Applied Materials, Inc. |
Shield for an electrostatic chuck
|
GB2316414B
(en)
|
1996-07-31 |
2000-10-11 |
Tosoh Corp |
Abrasive shaped article, abrasive disc and polishing method
|
US5795218A
(en)
|
1996-09-30 |
1998-08-18 |
Micron Technology, Inc. |
Polishing pad with elongated microcolumns
|
US6244575B1
(en)
|
1996-10-02 |
2001-06-12 |
Micron Technology, Inc. |
Method and apparatus for vaporizing liquid precursors and system for using same
|
US5876490A
(en)
|
1996-12-09 |
1999-03-02 |
International Business Machines Corporatin |
Polish process and slurry for planarization
|
WO1998028108A1
(en)
|
1996-12-20 |
1998-07-02 |
Unique Technology International Private Limited |
Manufacture of porous polishing pad
|
KR100210840B1
(en)
|
1996-12-24 |
1999-07-15 |
구본준 |
Chemical mechanical polishing method and apparatus for the same
|
US5876268A
(en)
|
1997-01-03 |
1999-03-02 |
Minnesota Mining And Manufacturing Company |
Method and article for the production of optical quality surfaces on glass
|
WO1998030356A1
(en)
|
1997-01-13 |
1998-07-16 |
Rodel, Inc. |
Polymeric polishing pad having photolithographically induced surface pattern(s) and methods relating thereto
|
US5965460A
(en)
|
1997-01-29 |
1999-10-12 |
Mac Dermid, Incorporated |
Polyurethane composition with (meth)acrylate end groups useful in the manufacture of polishing pads
|
US6231629B1
(en)
*
|
1997-03-07 |
2001-05-15 |
3M Innovative Properties Company |
Abrasive article for providing a clear surface finish on glass
|
US5910471A
(en)
|
1997-03-07 |
1999-06-08 |
Minnesota Mining And Manufacturing Company |
Abrasive article for providing a clear surface finish on glass
|
JPH10249709A
(en)
|
1997-03-14 |
1998-09-22 |
Chiyoda Kk |
Abrasive cloth
|
US5944583A
(en)
|
1997-03-17 |
1999-08-31 |
International Business Machines Corporation |
Composite polish pad for CMP
|
US6648733B2
(en)
*
|
1997-04-04 |
2003-11-18 |
Rodel Holdings, Inc. |
Polishing pads and methods relating thereto
|
US6682402B1
(en)
|
1997-04-04 |
2004-01-27 |
Rodel Holdings, Inc. |
Polishing pads and methods relating thereto
|
US6062958A
(en)
|
1997-04-04 |
2000-05-16 |
Micron Technology, Inc. |
Variable abrasive polishing pad for mechanical and chemical-mechanical planarization
|
US5940674A
(en)
|
1997-04-09 |
1999-08-17 |
Massachusetts Institute Of Technology |
Three-dimensional product manufacture using masks
|
IL132412A0
(en)
|
1997-04-18 |
2001-03-19 |
Cabot Corp |
Polishing pad for a semiconductor substrate
|
US6126532A
(en)
|
1997-04-18 |
2000-10-03 |
Cabot Corporation |
Polishing pads for a semiconductor substrate
|
CA2287404C
(en)
|
1997-04-30 |
2007-10-16 |
David A. Kaisaki |
Method of planarizing the upper surface of a semiconductor wafer
|
US8092707B2
(en)
|
1997-04-30 |
2012-01-10 |
3M Innovative Properties Company |
Compositions and methods for modifying a surface suited for semiconductor fabrication
|
US5945058A
(en)
|
1997-05-13 |
1999-08-31 |
3D Systems, Inc. |
Method and apparatus for identifying surface features associated with selected lamina of a three-dimensional object being stereolithographically formed
|
US6273806B1
(en)
|
1997-05-15 |
2001-08-14 |
Applied Materials, Inc. |
Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
|
US5921855A
(en)
|
1997-05-15 |
1999-07-13 |
Applied Materials, Inc. |
Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
|
US6692338B1
(en)
|
1997-07-23 |
2004-02-17 |
Lsi Logic Corporation |
Through-pad drainage of slurry during chemical mechanical polishing
|
US6736714B2
(en)
|
1997-07-30 |
2004-05-18 |
Praxair S.T. Technology, Inc. |
Polishing silicon wafers
|
US5919082A
(en)
|
1997-08-22 |
1999-07-06 |
Micron Technology, Inc. |
Fixed abrasive polishing pad
|
US6121143A
(en)
|
1997-09-19 |
2000-09-19 |
3M Innovative Properties Company |
Abrasive articles comprising a fluorochemical agent for wafer surface modification
|
US5888121A
(en)
|
1997-09-23 |
1999-03-30 |
Lsi Logic Corporation |
Controlling groove dimensions for enhanced slurry flow
|
US5932040A
(en)
|
1997-10-01 |
1999-08-03 |
Bibielle S.P.A. |
Method for producing a ring of abrasive elements from which to form a rotary brush
|
US6950193B1
(en)
|
1997-10-28 |
2005-09-27 |
Rockwell Automation Technologies, Inc. |
System for monitoring substrate conditions
|
US6039836A
(en)
|
1997-12-19 |
2000-03-21 |
Lam Research Corporation |
Focus rings
|
US6231942B1
(en)
|
1998-01-21 |
2001-05-15 |
Trexel, Inc. |
Method and apparatus for microcellular polypropylene extrusion, and polypropylene articles produced thereby
|
JPH11254542A
(en)
|
1998-03-11 |
1999-09-21 |
Sanyo Electric Co Ltd |
Monitoring system for stereo lithographic apparatus
|
US6228133B1
(en)
|
1998-05-01 |
2001-05-08 |
3M Innovative Properties Company |
Abrasive articles having abrasive layer bond system derived from solid, dry-coated binder precursor particles having a fusible, radiation curable component
|
JPH11347761A
(en)
|
1998-06-12 |
1999-12-21 |
Mitsubishi Heavy Ind Ltd |
Three-dimensional molding device by laser
|
US6122564A
(en)
|
1998-06-30 |
2000-09-19 |
Koch; Justin |
Apparatus and methods for monitoring and controlling multi-layer laser cladding
|
US6322728B1
(en)
|
1998-07-10 |
2001-11-27 |
Jeneric/Pentron, Inc. |
Mass production of dental restorations by solid free-form fabrication methods
|
US6117000A
(en)
|
1998-07-10 |
2000-09-12 |
Cabot Corporation |
Polishing pad for a semiconductor substrate
|
DE19834559A1
(en)
|
1998-07-31 |
2000-02-03 |
Friedrich Schiller Uni Jena Bu |
Surface finishing, especially grinding, lapping and polishing, tool manufacturing method by use of rapid prototyping methods
|
JP2000061817A
(en)
|
1998-08-24 |
2000-02-29 |
Nikon Corp |
Polishing pad
|
US6095902A
(en)
|
1998-09-23 |
2000-08-01 |
Rodel Holdings, Inc. |
Polyether-polyester polyurethane polishing pads and related methods
|
US6602380B1
(en)
|
1998-10-28 |
2003-08-05 |
Micron Technology, Inc. |
Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine
|
US6325706B1
(en)
|
1998-10-29 |
2001-12-04 |
Lam Research Corporation |
Use of zeta potential during chemical mechanical polishing for end point detection
|
US6176992B1
(en)
|
1998-11-03 |
2001-01-23 |
Nutool, Inc. |
Method and apparatus for electro-chemical mechanical deposition
|
US6390890B1
(en)
|
1999-02-06 |
2002-05-21 |
Charles J Molnar |
Finishing semiconductor wafers with a fixed abrasive finishing element
|
US6206759B1
(en)
|
1998-11-30 |
2001-03-27 |
Micron Technology, Inc. |
Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machines
|
JP3641956B2
(en)
|
1998-11-30 |
2005-04-27 |
三菱住友シリコン株式会社 |
Polishing slurry regeneration system
|
US7425250B2
(en)
|
1998-12-01 |
2008-09-16 |
Novellus Systems, Inc. |
Electrochemical mechanical processing apparatus
|
US6354915B1
(en)
|
1999-01-21 |
2002-03-12 |
Rodel Holdings Inc. |
Polishing pads and methods relating thereto
|
US6994607B2
(en)
|
2001-12-28 |
2006-02-07 |
Applied Materials, Inc. |
Polishing pad with window
|
US6179709B1
(en)
|
1999-02-04 |
2001-01-30 |
Applied Materials, Inc. |
In-situ monitoring of linear substrate polishing operations
|
US6641463B1
(en)
|
1999-02-06 |
2003-11-04 |
Beaver Creek Concepts Inc |
Finishing components and elements
|
US6749714B1
(en)
|
1999-03-30 |
2004-06-15 |
Nikon Corporation |
Polishing body, polisher, polishing method, and method for producing semiconductor device
|
US6217426B1
(en)
|
1999-04-06 |
2001-04-17 |
Applied Materials, Inc. |
CMP polishing pad
|
US6213845B1
(en)
|
1999-04-26 |
2001-04-10 |
Micron Technology, Inc. |
Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same
|
US6338901B1
(en)
|
1999-05-03 |
2002-01-15 |
Guardian Industries Corporation |
Hydrophobic coating including DLC on substrate
|
US6609113B1
(en)
|
1999-05-03 |
2003-08-19 |
The Chase Manhattan Bank |
Method and system for processing internet payments using the electronic funds transfer network
|
US6328634B1
(en)
|
1999-05-11 |
2001-12-11 |
Rodel Holdings Inc. |
Method of polishing
|
US6196899B1
(en)
|
1999-06-21 |
2001-03-06 |
Micron Technology, Inc. |
Polishing apparatus
|
US6319108B1
(en)
|
1999-07-09 |
2001-11-20 |
3M Innovative Properties Company |
Metal bond abrasive article comprising porous ceramic abrasive composites and method of using same to abrade a workpiece
|
JP2001105329A
(en)
|
1999-08-02 |
2001-04-17 |
Ebara Corp |
Grinding wheel for polishing
|
US6232236B1
(en)
|
1999-08-03 |
2001-05-15 |
Applied Materials, Inc. |
Apparatus and method for controlling plasma uniformity in a semiconductor wafer processing system
|
US6328632B1
(en)
|
1999-08-31 |
2001-12-11 |
Micron Technology, Inc. |
Polishing pads and planarizing machines for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies
|
US6257973B1
(en)
|
1999-11-04 |
2001-07-10 |
Norton Company |
Coated abrasive discs
|
US6201208B1
(en)
|
1999-11-04 |
2001-03-13 |
Wisconsin Alumni Research Foundation |
Method and apparatus for plasma processing with control of ion energy distribution at the substrates
|
JP3439402B2
(en)
*
|
1999-11-05 |
2003-08-25 |
Necエレクトロニクス株式会社 |
Method for manufacturing semiconductor device
|
JP2001138212A
(en)
*
|
1999-11-15 |
2001-05-22 |
Toshiro Doi |
Precise polishing apparatus
|
US6399501B2
(en)
|
1999-12-13 |
2002-06-04 |
Applied Materials, Inc. |
Method and apparatus for detecting polishing endpoint with optical monitoring
|
KR20020072548A
(en)
|
1999-12-14 |
2002-09-16 |
로델 홀딩스 인코포레이티드 |
Method of manufacturing a polymer or polymer composite polishing pad
|
US6368184B1
(en)
|
2000-01-06 |
2002-04-09 |
Advanced Micro Devices, Inc. |
Apparatus for determining metal CMP endpoint using integrated polishing pad electrodes
|
US6241596B1
(en)
|
2000-01-14 |
2001-06-05 |
Applied Materials, Inc. |
Method and apparatus for chemical mechanical polishing using a patterned pad
|
US6506097B1
(en)
|
2000-01-18 |
2003-01-14 |
Applied Materials, Inc. |
Optical monitoring in a two-step chemical mechanical polishing process
|
US20010041511A1
(en)
|
2000-01-19 |
2001-11-15 |
Lack Craig D. |
Printing of polishing pads
|
US7071041B2
(en)
|
2000-01-20 |
2006-07-04 |
Semiconductor Energy Laboratory Co., Ltd. |
Method of manufacturing a semiconductor device
|
US6746311B1
(en)
|
2000-01-24 |
2004-06-08 |
3M Innovative Properties Company |
Polishing pad with release layer
|
US6309276B1
(en)
|
2000-02-01 |
2001-10-30 |
Applied Materials, Inc. |
Endpoint monitoring with polishing rate change
|
US6991528B2
(en)
|
2000-02-17 |
2006-01-31 |
Applied Materials, Inc. |
Conductive polishing article for electrochemical mechanical polishing
|
WO2001064396A1
(en)
|
2000-02-28 |
2001-09-07 |
Rodel Holdings, Inc. |
Polishing pad surface texture formed by solid phase droplets
|
KR100502268B1
(en)
|
2000-03-01 |
2005-07-22 |
가부시끼가이샤 히다치 세이사꾸쇼 |
Plasma processing apparatus and method
|
US6797623B2
(en)
|
2000-03-09 |
2004-09-28 |
Sony Corporation |
Methods of producing and polishing semiconductor device and polishing apparatus
|
US20030207959A1
(en)
|
2000-03-13 |
2003-11-06 |
Eduardo Napadensky |
Compositions and methods for use in three dimensional model printing
|
US6569373B2
(en)
|
2000-03-13 |
2003-05-27 |
Object Geometries Ltd. |
Compositions and methods for use in three dimensional model printing
|
US8481241B2
(en)
|
2000-03-13 |
2013-07-09 |
Stratasys Ltd. |
Compositions and methods for use in three dimensional model printing
|
US7300619B2
(en)
|
2000-03-13 |
2007-11-27 |
Objet Geometries Ltd. |
Compositions and methods for use in three dimensional model printing
|
WO2001068322A1
(en)
|
2000-03-15 |
2001-09-20 |
Rodel Holdings, Inc. |
Window portion with an adjusted rate of wear
|
EP1268165B1
(en)
|
2000-03-24 |
2004-10-06 |
GENERIS GmbH |
Method and apparatus for manufacturing a structural part by a multi-layer deposition technique, and mold or core as manufactured by the method
|
KR20010093677A
(en)
|
2000-03-29 |
2001-10-29 |
추후기재 |
Engineered polishing pad for improved slurry distribution
|
US6313038B1
(en)
|
2000-04-26 |
2001-11-06 |
Micron Technology, Inc. |
Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates
|
US20020058468A1
(en)
|
2000-05-03 |
2002-05-16 |
Eppert Stanley E. |
Semiconductor polishing pad
|
US6387289B1
(en)
|
2000-05-04 |
2002-05-14 |
Micron Technology, Inc. |
Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies
|
US6267641B1
(en)
|
2000-05-19 |
2001-07-31 |
Motorola, Inc. |
Method of manufacturing a semiconductor component and chemical-mechanical polishing system therefor
|
US8485862B2
(en)
|
2000-05-19 |
2013-07-16 |
Applied Materials, Inc. |
Polishing pad for endpoint detection and related methods
|
US6454634B1
(en)
|
2000-05-27 |
2002-09-24 |
Rodel Holdings Inc. |
Polishing pads for chemical mechanical planarization
|
US6860802B1
(en)
|
2000-05-27 |
2005-03-01 |
Rohm And Haas Electric Materials Cmp Holdings, Inc. |
Polishing pads for chemical mechanical planarization
|
US6749485B1
(en)
|
2000-05-27 |
2004-06-15 |
Rodel Holdings, Inc. |
Hydrolytically stable grooved polishing pads for chemical mechanical planarization
|
US6736709B1
(en)
|
2000-05-27 |
2004-05-18 |
Rodel Holdings, Inc. |
Grooved polishing pads for chemical mechanical planarization
|
US7001252B2
(en)
|
2000-05-31 |
2006-02-21 |
Jsr Corporation |
Abrasive material
|
JP3925041B2
(en)
|
2000-05-31 |
2007-06-06 |
Jsr株式会社 |
Polishing pad composition and polishing pad using the same
|
US6478914B1
(en)
|
2000-06-09 |
2002-11-12 |
Micron Technology, Inc. |
Method for attaching web-based polishing materials together on a polishing tool
|
US6656019B1
(en)
|
2000-06-29 |
2003-12-02 |
International Business Machines Corporation |
Grooved polishing pads and methods of use
|
JP2002028849A
(en)
|
2000-07-17 |
2002-01-29 |
Jsr Corp |
Polishing pad
|
US20020016139A1
(en)
|
2000-07-25 |
2002-02-07 |
Kazuto Hirokawa |
Polishing tool and manufacturing method therefor
|
US6520834B1
(en)
|
2000-08-09 |
2003-02-18 |
Micron Technology, Inc. |
Methods and apparatuses for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates
|
US6776699B2
(en)
|
2000-08-14 |
2004-08-17 |
3M Innovative Properties Company |
Abrasive pad for CMP
|
US6736869B1
(en)
|
2000-08-28 |
2004-05-18 |
Micron Technology, Inc. |
Method for forming a planarizing pad for planarization of microelectronic substrates
|
US6592443B1
(en)
|
2000-08-30 |
2003-07-15 |
Micron Technology, Inc. |
Method and apparatus for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates
|
US6638831B1
(en)
|
2000-08-31 |
2003-10-28 |
Micron Technology, Inc. |
Use of a reference fiducial on a semiconductor package to monitor and control a singulation method
|
JP3886712B2
(en)
|
2000-09-08 |
2007-02-28 |
シャープ株式会社 |
Manufacturing method of semiconductor device
|
US6477926B1
(en)
|
2000-09-15 |
2002-11-12 |
Ppg Industries Ohio, Inc. |
Polishing pad
|
US6641471B1
(en)
|
2000-09-19 |
2003-11-04 |
Rodel Holdings, Inc |
Polishing pad having an advantageous micro-texture and methods relating thereto
|
KR100821747B1
(en)
|
2000-09-29 |
2008-04-11 |
스트라스바흐 |
Polishing pad with built-in optical sensor
|
WO2002038688A2
(en)
|
2000-11-09 |
2002-05-16 |
3M Innovative Properties Company |
Weather resistant, ink jettable, radiation curable, fluid compositions particularly suitable for outdoor applications
|
JP2002151447A
(en)
|
2000-11-13 |
2002-05-24 |
Asahi Kasei Corp |
Polishing pad
|
US6684704B1
(en)
|
2002-09-12 |
2004-02-03 |
Psiloquest, Inc. |
Measuring the surface properties of polishing pads using ultrasonic reflectance
|
EP1345734B1
(en)
|
2000-11-29 |
2006-04-19 |
Psiloquest, Inc. |
Crosslinked polyethylene polishing pad for chemical-mechnical polishing and polishing apparatus
|
KR100892924B1
(en)
|
2000-12-01 |
2009-04-09 |
도요 고무 고교 가부시키가이샤 |
Polishing pad
|
JP2002200555A
(en)
|
2000-12-28 |
2002-07-16 |
Ebara Corp |
Polishing tool and polishing device with polishing tool
|
US6407669B1
(en)
|
2001-02-02 |
2002-06-18 |
3M Innovative Properties Company |
RFID tag device and method of manufacturing
|
GB0103754D0
(en)
|
2001-02-15 |
2001-04-04 |
Vantico Ltd |
Three-dimensional structured printing
|
US20020112632A1
(en)
|
2001-02-21 |
2002-08-22 |
Creo Ltd |
Method for supporting sensitive workpieces during processing
|
WO2002070200A1
(en)
|
2001-03-01 |
2002-09-12 |
Cabot Microelectronics Corporation |
Method for manufacturing a polishing pad having a compressed translucent region
|
US6811680B2
(en)
|
2001-03-14 |
2004-11-02 |
Applied Materials Inc. |
Planarization of substrates using electrochemical mechanical polishing
|
US7955693B2
(en)
|
2001-04-20 |
2011-06-07 |
Tolland Development Company, Llc |
Foam composition roller brush with embedded mandrel
|
ATE327864T1
(en)
|
2001-04-24 |
2006-06-15 |
Applied Materials Inc |
CONDUCTIVE POLISHING BODY FOR ELECTROCHEMICAL-MECHANICAL POLISHING
|
US6847014B1
(en)
|
2001-04-30 |
2005-01-25 |
Lam Research Corporation |
Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support
|
US6811937B2
(en)
|
2001-06-21 |
2004-11-02 |
Dsm Desotech, Inc. |
Radiation-curable resin composition and rapid prototyping process using the same
|
US6544373B2
(en)
*
|
2001-07-26 |
2003-04-08 |
United Microelectronics Corp. |
Polishing pad for a chemical mechanical polishing process
|
US6586494B2
(en)
|
2001-08-08 |
2003-07-01 |
Spectra Group Limited, Inc. |
Radiation curable inkjet composition
|
KR100646702B1
(en)
|
2001-08-16 |
2006-11-17 |
에스케이씨 주식회사 |
Chemical mechanical polishing pad having holes and/or grooves
|
KR20030020658A
(en)
*
|
2001-09-04 |
2003-03-10 |
삼성전자주식회사 |
Polishing pad conditioning disk of a chemical mechanical polishing apparatus
|
US6866807B2
(en)
|
2001-09-21 |
2005-03-15 |
Stratasys, Inc. |
High-precision modeling filament
|
US6599765B1
(en)
|
2001-12-12 |
2003-07-29 |
Lam Research Corporation |
Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection
|
US6838149B2
(en)
*
|
2001-12-13 |
2005-01-04 |
3M Innovative Properties Company |
Abrasive article for the deposition and polishing of a conductive material
|
JP2003188124A
(en)
|
2001-12-14 |
2003-07-04 |
Rodel Nitta Co |
Polishing cloth
|
EP1326273B1
(en)
|
2001-12-28 |
2012-01-18 |
Semiconductor Energy Laboratory Co., Ltd. |
Semiconductor device
|
US20030134581A1
(en)
|
2002-01-11 |
2003-07-17 |
Wang Hsing Maw |
Device for chemical mechanical polishing
|
KR100442873B1
(en)
|
2002-02-28 |
2004-08-02 |
삼성전자주식회사 |
Chemical mechanical polishing slurry and chemical mechanical polishing method using the same
|
JP2003303793A
(en)
|
2002-04-12 |
2003-10-24 |
Hitachi Ltd |
Polishing equipment and method for manufacturing semiconductor device
|
US6773474B2
(en)
|
2002-04-19 |
2004-08-10 |
3M Innovative Properties Company |
Coated abrasive article
|
JP4693024B2
(en)
|
2002-04-26 |
2011-06-01 |
東洋ゴム工業株式会社 |
Abrasive
|
US20050194681A1
(en)
|
2002-05-07 |
2005-09-08 |
Yongqi Hu |
Conductive pad with high abrasion
|
US6815570B1
(en)
|
2002-05-07 |
2004-11-09 |
Uop Llc |
Shaped catalysts for transalkylation of aromatics for enhanced xylenes production
|
US20050276967A1
(en)
|
2002-05-23 |
2005-12-15 |
Cabot Microelectronics Corporation |
Surface textured microporous polishing pads
|
US6913517B2
(en)
|
2002-05-23 |
2005-07-05 |
Cabot Microelectronics Corporation |
Microporous polishing pads
|
TWI250572B
(en)
|
2002-06-03 |
2006-03-01 |
Jsr Corp |
Polishing pad and multi-layer polishing pad
|
DE10224981B4
(en)
|
2002-06-05 |
2004-08-19 |
Generis Gmbh |
Process for building models in layers
|
CN100445091C
(en)
|
2002-06-07 |
2008-12-24 |
普莱克斯S.T.技术有限公司 |
Controlled penetration subpad
|
US8602851B2
(en)
|
2003-06-09 |
2013-12-10 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Controlled penetration subpad
|
JP3801100B2
(en)
|
2002-06-07 |
2006-07-26 |
Jsr株式会社 |
Photo-curing modeling apparatus, photo-curing modeling method, and photo-curing modeling system
|
EP1375617A1
(en)
|
2002-06-19 |
2004-01-02 |
3M Innovative Properties Company |
Radiation-curable, solvent-free and printable precursor of a pressure-sensitive adhesive
|
US7169014B2
(en)
|
2002-07-18 |
2007-01-30 |
Micron Technology, Inc. |
Apparatuses for controlling the temperature of polishing pads used in planarizing micro-device workpieces
|
KR101016081B1
(en)
|
2002-07-26 |
2011-02-17 |
닛토덴코 가부시키가이샤 |
Adhesive sheet and method for making the sheet, method for using the sheet, and multilayer sheet used in the adhesive sheet and method for making the same
|
TWI228768B
(en)
|
2002-08-08 |
2005-03-01 |
Jsr Corp |
Processing method of polishing pad for semiconductor wafer and polishing pad for semiconductor wafer
|
US7579071B2
(en)
|
2002-09-17 |
2009-08-25 |
Korea Polyol Co., Ltd. |
Polishing pad containing embedded liquid microelements and method of manufacturing the same
|
KR100465649B1
(en)
|
2002-09-17 |
2005-01-13 |
한국포리올 주식회사 |
Integral polishing pad and manufacturing method thereof
|
US6896765B2
(en)
|
2002-09-18 |
2005-05-24 |
Lam Research Corporation |
Method and apparatus for the compensation of edge ring wear in a plasma processing chamber
|
US20040058623A1
(en)
|
2002-09-20 |
2004-03-25 |
Lam Research Corporation |
Polishing media for chemical mechanical planarization (CMP)
|
US7435165B2
(en)
|
2002-10-28 |
2008-10-14 |
Cabot Microelectronics Corporation |
Transparent microporous materials for CMP
|
US7267607B2
(en)
|
2002-10-28 |
2007-09-11 |
Cabot Microelectronics Corporation |
Transparent microporous materials for CMP
|
US7311862B2
(en)
|
2002-10-28 |
2007-12-25 |
Cabot Microelectronics Corporation |
Method for manufacturing microporous CMP materials having controlled pore size
|
WO2004039531A2
(en)
|
2002-10-31 |
2004-05-13 |
Ehsan Toyserkani |
System and method for closed-loop control of laser cladding by powder injection
|
JP2004153193A
(en)
|
2002-11-01 |
2004-05-27 |
Disco Abrasive Syst Ltd |
Processing method for semiconductor wafer
|
JP2004167605A
(en)
*
|
2002-11-15 |
2004-06-17 |
Rodel Nitta Co |
Polishing pad and polishing device
|
DE10253445A1
(en)
|
2002-11-16 |
2004-06-03 |
Adam Opel Ag |
Method and device for sealing and inflating tires in the event of breakdowns, as well as sealant containers and adapters therefor
|
AU2003302299A1
(en)
|
2002-11-27 |
2004-06-18 |
Toyo Boseki Kabushiki Kaisha |
Polishing pad and method for manufacturing semiconductor device
|
JP2004235446A
(en)
|
2003-01-30 |
2004-08-19 |
Toyobo Co Ltd |
Polishing pad
|
JP4659338B2
(en)
|
2003-02-12 |
2011-03-30 |
Hoya株式会社 |
Manufacturing method of glass substrate for information recording medium and polishing pad used therefor
|
WO2004077511A2
(en)
|
2003-02-24 |
2004-09-10 |
The Regents Of The University Of Colorado |
(meth)acrylic and (meth)acrylamide monomers, polymerizable compositions, and polymers obtained
|
DE10310385B4
(en)
|
2003-03-07 |
2006-09-21 |
Daimlerchrysler Ag |
Method for the production of three-dimensional bodies by means of powder-based layer-building methods
|
US7104773B2
(en)
|
2003-03-07 |
2006-09-12 |
Ricoh Printing Systems, Ltd. |
Three-dimensional laminating molding device
|
TW200530378A
(en)
|
2003-03-11 |
2005-09-16 |
Toyo Tire & Rubber Co |
Polishing pad and semiconductor device manufacturing method
|
JP2004281685A
(en)
|
2003-03-14 |
2004-10-07 |
Mitsubishi Electric Corp |
Polishing pad for semiconductor substrate and method for polishing semiconductor substrate
|
US7377840B2
(en)
|
2004-07-21 |
2008-05-27 |
Neopad Technologies Corporation |
Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs
|
US7704125B2
(en)
|
2003-03-24 |
2010-04-27 |
Nexplanar Corporation |
Customized polishing pads for CMP and methods of fabrication and use thereof
|
US8864859B2
(en)
|
2003-03-25 |
2014-10-21 |
Nexplanar Corporation |
Customized polishing pads for CMP and methods of fabrication and use thereof
|
US9278424B2
(en)
|
2003-03-25 |
2016-03-08 |
Nexplanar Corporation |
Customized polishing pads for CMP and methods of fabrication and use thereof
|
CA2519942A1
(en)
|
2003-03-25 |
2004-10-14 |
Neopad Technologies Corporation |
Chip customized polish pads for chemical mechanical planarization (cmp)
|
DE10314075B4
(en)
|
2003-03-28 |
2007-11-22 |
Takata-Petri (Sachsen) Gmbh |
Tire filling device and breakdown set with such
|
US7044836B2
(en)
|
2003-04-21 |
2006-05-16 |
Cabot Microelectronics Corporation |
Coated metal oxide particles for CMP
|
CN100548576C
(en)
|
2003-04-25 |
2009-10-14 |
Jsr株式会社 |
Polishing pad and cmp method
|
US6783436B1
(en)
|
2003-04-29 |
2004-08-31 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Polishing pad with optimized grooves and method of forming same
|
CN100490084C
(en)
|
2003-05-09 |
2009-05-20 |
三洋化成工业株式会社 |
Polishing liquid for CMP process and polishing method
|
EP1628334A4
(en)
|
2003-05-09 |
2006-08-02 |
Sanyo Chemical Ind Ltd |
Polishing liquid for cmp process and polishing method
|
CN100553949C
(en)
|
2003-05-21 |
2009-10-28 |
Z公司 |
Be used for thermoplastic powder material system from the outward appearance mould of three dimensional printing system
|
IL156094A0
(en)
|
2003-05-25 |
2003-12-23 |
J G Systems Inc |
Fixed abrasive cmp pad with built-in additives
|
CN1829587A
(en)
|
2003-06-06 |
2006-09-06 |
应用材料公司 |
Conductive polishing article for electrochemical mechanical polishing
|
US6884156B2
(en)
|
2003-06-17 |
2005-04-26 |
Cabot Microelectronics Corporation |
Multi-layer polishing pad material for CMP
|
US7435161B2
(en)
|
2003-06-17 |
2008-10-14 |
Cabot Microelectronics Corporation |
Multi-layer polishing pad material for CMP
|
US6998166B2
(en)
|
2003-06-17 |
2006-02-14 |
Cabot Microelectronics Corporation |
Polishing pad with oriented pore structure
|
JP4130614B2
(en)
|
2003-06-18 |
2008-08-06 |
株式会社東芝 |
Manufacturing method of semiconductor device
|
US7018560B2
(en)
|
2003-08-05 |
2006-03-28 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Composition for polishing semiconductor layers
|
US20050032464A1
(en)
|
2003-08-07 |
2005-02-10 |
Swisher Robert G. |
Polishing pad having edge surface treatment
|
CN1802237A
(en)
|
2003-08-07 |
2006-07-12 |
Ppg工业俄亥俄公司 |
Polishing pad having edge surface treatment
|
WO2005016599A1
(en)
|
2003-08-08 |
2005-02-24 |
Mykrolys Corporation |
Methods and materials for making a monolithic porous pad cast onto a rotatable base
|
US7120512B2
(en)
|
2003-08-25 |
2006-10-10 |
Hewlett-Packard Development Company, L.P. |
Method and a system for solid freeform fabricating using non-reactive powder
|
US20070007698A1
(en)
|
2003-08-27 |
2007-01-11 |
Shojiro Sano |
Method of producting three-dimensional model
|
KR100590202B1
(en)
*
|
2003-08-29 |
2006-06-15 |
삼성전자주식회사 |
Polishing pad and method for forming the same
|
JP2005074614A
(en)
|
2003-09-03 |
2005-03-24 |
Nitta Haas Inc |
Polishing pad and its manufacturing method
|
JP2005085917A
(en)
|
2003-09-08 |
2005-03-31 |
Sharp Corp |
Plasma treatment apparatus
|
JP2005093785A
(en)
|
2003-09-18 |
2005-04-07 |
Toshiba Corp |
Slurry for cmp, polish method, and method for manufacturing semiconductor device
|
KR100640998B1
(en)
|
2003-09-19 |
2006-11-02 |
엘지.필립스 엘시디 주식회사 |
The bracket structure for Liquid Crystal Display Device
|
US20050060941A1
(en)
|
2003-09-23 |
2005-03-24 |
3M Innovative Properties Company |
Abrasive article and methods of making the same
|
US8066552B2
(en)
*
|
2003-10-03 |
2011-11-29 |
Applied Materials, Inc. |
Multi-layer polishing pad for low-pressure polishing
|
GB0323462D0
(en)
|
2003-10-07 |
2003-11-05 |
Fujifilm Electronic Imaging |
Providing a surface layer or structure on a substrate
|
US6855588B1
(en)
|
2003-10-07 |
2005-02-15 |
United Microelectronics Corp. |
Method of fabricating a double gate MOSFET device
|
US20050109371A1
(en)
|
2003-10-27 |
2005-05-26 |
Applied Materials, Inc. |
Post CMP scrubbing of substrates
|
JP2005131732A
(en)
|
2003-10-30 |
2005-05-26 |
Ebara Corp |
Grinding device
|
WO2005043132A1
(en)
|
2003-10-31 |
2005-05-12 |
Applied Materials, Inc. |
Polishing endpoint detection system and method using friction sensor
|
US20050101228A1
(en)
|
2003-11-10 |
2005-05-12 |
Cabot Microelectronics Corporation |
Polishing pad comprising biodegradable polymer
|
US7264641B2
(en)
|
2003-11-10 |
2007-09-04 |
Cabot Microelectronics Corporation |
Polishing pad comprising biodegradable polymer
|
JP2005150235A
(en)
|
2003-11-12 |
2005-06-09 |
Three M Innovative Properties Co |
Semiconductor surface protection sheet and method therefor
|
US7125318B2
(en)
|
2003-11-13 |
2006-10-24 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Polishing pad having a groove arrangement for reducing slurry consumption
|
US6984163B2
(en)
|
2003-11-25 |
2006-01-10 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Polishing pad with high optical transmission window
|
JP4555559B2
(en)
|
2003-11-25 |
2010-10-06 |
富士紡ホールディングス株式会社 |
Abrasive cloth and method for producing abrasive cloth
|
KR100576465B1
(en)
|
2003-12-01 |
2006-05-08 |
주식회사 하이닉스반도체 |
Polishing Pad Using an Abrasive-Capsulation Composition
|
US7186164B2
(en)
|
2003-12-03 |
2007-03-06 |
Applied Materials, Inc. |
Processing pad assembly with zone control
|
US6843711B1
(en)
|
2003-12-11 |
2005-01-18 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc |
Chemical mechanical polishing pad having a process-dependent groove configuration
|
US20050153634A1
(en)
|
2004-01-09 |
2005-07-14 |
Cabot Microelectronics Corporation |
Negative poisson's ratio material-containing CMP polishing pad
|
US20050171224A1
(en)
|
2004-02-03 |
2005-08-04 |
Kulp Mary J. |
Polyurethane polishing pad
|
US7132033B2
(en)
|
2004-02-27 |
2006-11-07 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Method of forming a layered polishing pad
|
US20050208234A1
(en)
|
2004-03-19 |
2005-09-22 |
Agfa-Gevaert |
Ink-jet recording material
|
US7195544B2
(en)
|
2004-03-23 |
2007-03-27 |
Cabot Microelectronics Corporation |
CMP porous pad with component-filled pores
|
US7204742B2
(en)
|
2004-03-25 |
2007-04-17 |
Cabot Microelectronics Corporation |
Polishing pad comprising hydrophobic region and endpoint detection port
|
US6955588B1
(en)
|
2004-03-31 |
2005-10-18 |
Lam Research Corporation |
Method of and platen for controlling removal rate characteristics in chemical mechanical planarization
|
JP2004243518A
(en)
|
2004-04-08 |
2004-09-02 |
Toshiba Corp |
Polishing device
|
US20050227590A1
(en)
|
2004-04-09 |
2005-10-13 |
Chien-Min Sung |
Fixed abrasive tools and associated methods
|
TWI293266B
(en)
|
2004-05-05 |
2008-02-11 |
Iv Technologies Co Ltd |
A single-layer polishing pad and a method of producing the same
|
WO2005114323A2
(en)
|
2004-05-12 |
2005-12-01 |
Therics, Inc. |
Manufacturing process of three dimensional printing
|
US20050260939A1
(en)
|
2004-05-18 |
2005-11-24 |
Saint-Gobain Abrasives, Inc. |
Brazed diamond dressing tool
|
JP2007081322A
(en)
*
|
2005-09-16 |
2007-03-29 |
Jsr Corp |
Method for manufacturing chemical-mechanical polishing pad
|
KR20060046093A
(en)
|
2004-05-20 |
2006-05-17 |
제이에스알 가부시끼가이샤 |
Chemical mechanical polishing pad and chemical mechanical polishing method
|
WO2005113220A1
(en)
|
2004-05-20 |
2005-12-01 |
Bridgestone Corporation |
Sealing agent pouring device, sealing agent pouring method, and sealing pump-up device
|
US20050261150A1
(en)
|
2004-05-21 |
2005-11-24 |
Battelle Memorial Institute, A Part Interest |
Reactive fluid systems for removing deposition materials and methods for using same
|
US7438795B2
(en)
|
2004-06-10 |
2008-10-21 |
Cabot Microelectronics Corp. |
Electrochemical-mechanical polishing system
|
US7252871B2
(en)
|
2004-06-16 |
2007-08-07 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Polishing pad having a pressure relief channel
|
US7582127B2
(en)
|
2004-06-16 |
2009-09-01 |
Cabot Microelectronics Corporation |
Polishing composition for a tungsten-containing substrate
|
EP1758711B1
(en)
|
2004-06-21 |
2013-08-07 |
Ebara Corporation |
Polishing apparatus and polishing method
|
JP4133945B2
(en)
|
2004-06-28 |
2008-08-13 |
住友ゴム工業株式会社 |
Tire puncture sealant supply and extraction device
|
US20060014475A1
(en)
|
2004-07-15 |
2006-01-19 |
Disco Corporation |
Grindstone tool
|
US7709053B2
(en)
|
2004-07-29 |
2010-05-04 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Method of manufacturing of polymer-coated particles for chemical mechanical polishing
|
US7939003B2
(en)
|
2004-08-11 |
2011-05-10 |
Cornell Research Foundation, Inc. |
Modular fabrication systems and methods
|
US7153191B2
(en)
|
2004-08-20 |
2006-12-26 |
Micron Technology, Inc. |
Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods
|
US8075372B2
(en)
|
2004-09-01 |
2011-12-13 |
Cabot Microelectronics Corporation |
Polishing pad with microporous regions
|
DE102004042911A1
(en)
|
2004-09-02 |
2006-03-09 |
Michael Stehle |
Device for dispensing air and / or tire sealant
|
US20060079159A1
(en)
|
2004-10-08 |
2006-04-13 |
Markus Naujok |
Chemical mechanical polish with multi-zone abrasive-containing matrix
|
US20060096179A1
(en)
|
2004-11-05 |
2006-05-11 |
Cabot Microelectronics Corporation |
CMP composition containing surface-modified abrasive particles
|
US7530880B2
(en)
|
2004-11-29 |
2009-05-12 |
Semiquest Inc. |
Method and apparatus for improved chemical mechanical planarization pad with pressure control and process monitor
|
US7815778B2
(en)
|
2005-11-23 |
2010-10-19 |
Semiquest Inc. |
Electro-chemical mechanical planarization pad with uniform polish performance
|
US7846008B2
(en)
|
2004-11-29 |
2010-12-07 |
Semiquest Inc. |
Method and apparatus for improved chemical mechanical planarization and CMP pad
|
US8075745B2
(en)
|
2004-11-29 |
2011-12-13 |
Semiquest Inc. |
Electro-method and apparatus for improved chemical mechanical planarization pad with uniform polish performance
|
JP4775881B2
(en)
*
|
2004-12-10 |
2011-09-21 |
東洋ゴム工業株式会社 |
Polishing pad
|
CN102554766B
(en)
|
2004-12-10 |
2014-11-05 |
东洋橡胶工业株式会社 |
Polishing pad and manufacturing method of the same
|
US7059949B1
(en)
|
2004-12-14 |
2006-06-13 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
CMP pad having an overlapping stepped groove arrangement
|
US7059950B1
(en)
|
2004-12-14 |
2006-06-13 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
CMP polishing pad having grooves arranged to improve polishing medium utilization
|
US7182677B2
(en)
|
2005-01-14 |
2007-02-27 |
Applied Materials, Inc. |
Chemical mechanical polishing pad for controlling polishing slurry distribution
|
KR20070108546A
(en)
|
2005-02-18 |
2007-11-12 |
네오패드 테크놀로지즈 코포레이션 |
Customized polishing pads for cmp and methods of fabrication and use thereof
|
TWI385050B
(en)
|
2005-02-18 |
2013-02-11 |
Nexplanar Corp |
Customized polishing pads for cmp and methods of fabrication and use thereof
|
CA2598272A1
(en)
|
2005-02-18 |
2006-08-24 |
Neopad Technologies Corporation |
Customized polishing pads for cmp and methods of fabrication and use thereof
|
US7524345B2
(en)
|
2005-02-22 |
2009-04-28 |
Saint-Gobain Abrasives, Inc. |
Rapid tooling system and methods for manufacturing abrasive articles
|
US7875091B2
(en)
|
2005-02-22 |
2011-01-25 |
Saint-Gobain Abrasives, Inc. |
Rapid tooling system and methods for manufacturing abrasive articles
|
JP2006231464A
(en)
|
2005-02-24 |
2006-09-07 |
Nitta Haas Inc |
Polishing pad
|
US7829000B2
(en)
|
2005-02-25 |
2010-11-09 |
Hewlett-Packard Development Company, L.P. |
Core-shell solid freeform fabrication
|
TWI410314B
(en)
|
2005-04-06 |
2013-10-01 |
羅門哈斯電子材料Cmp控股公司 |
Apparatus for forming a porous reaction injection molded chemical mechanical polishing pad
|
US7427340B2
(en)
|
2005-04-08 |
2008-09-23 |
Applied Materials, Inc. |
Conductive pad
|
EP1710324B1
(en)
|
2005-04-08 |
2008-12-03 |
STMicroelectronics S.r.l. |
PVD process and chamber for the pulsed deposition of a chalcogenide material layer of a phase change memory device
|
US7435364B2
(en)
|
2005-04-11 |
2008-10-14 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Method for forming a porous polishing pad
|
US8393934B2
(en)
|
2006-11-16 |
2013-03-12 |
Chien-Min Sung |
CMP pad dressers with hybridized abrasive surface and related methods
|
US8398466B2
(en)
|
2006-11-16 |
2013-03-19 |
Chien-Min Sung |
CMP pad conditioners with mosaic abrasive segments and associated methods
|
KR101134432B1
(en)
|
2005-05-17 |
2012-04-10 |
도요 고무 고교 가부시키가이샤 |
Polishing pad
|
KR100721196B1
(en)
|
2005-05-24 |
2007-05-23 |
주식회사 하이닉스반도체 |
Polishing pad and using chemical mechanical polishing apparatus
|
CN1897226A
(en)
|
2005-07-11 |
2007-01-17 |
上海华虹Nec电子有限公司 |
Mechamical polisher
|
US8557351B2
(en)
|
2005-07-22 |
2013-10-15 |
Molecular Imprints, Inc. |
Method for adhering materials together
|
KR100727485B1
(en)
|
2005-08-09 |
2007-06-13 |
삼성전자주식회사 |
Polish pad and method for manufacturing the polishing pad, and chemical mechanical polishing apparatus and method
|
US20070049164A1
(en)
|
2005-08-26 |
2007-03-01 |
Thomson Clifford O |
Polishing pad and method for manufacturing polishing pads
|
US7594845B2
(en)
|
2005-10-20 |
2009-09-29 |
3M Innovative Properties Company |
Abrasive article and method of modifying the surface of a workpiece
|
US20070117393A1
(en)
|
2005-11-21 |
2007-05-24 |
Alexander Tregub |
Hardened porous polymer chemical mechanical polishing (CMP) pad
|
CN101500756A
(en)
|
2005-11-30 |
2009-08-05 |
应用材料公司 |
Polishing pad with surface roughness
|
JP4868840B2
(en)
|
2005-11-30 |
2012-02-01 |
Jsr株式会社 |
Manufacturing method of semiconductor device
|
CN1851896A
(en)
|
2005-12-05 |
2006-10-25 |
北京北方微电子基地设备工艺研究中心有限责任公司 |
Electrostatic chuck
|
US20070128991A1
(en)
|
2005-12-07 |
2007-06-07 |
Yoon Il-Young |
Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same
|
US20070149094A1
(en)
|
2005-12-28 |
2007-06-28 |
Choi Jae Y |
Monitoring Device of Chemical Mechanical Polishing Apparatus
|
US7357703B2
(en)
|
2005-12-28 |
2008-04-15 |
Jsr Corporation |
Chemical mechanical polishing pad and chemical mechanical polishing method
|
WO2007086529A1
(en)
|
2006-01-25 |
2007-08-02 |
Jsr Corporation |
Chemical mechanical polishing pad and method for manufacturing same
|
US7935276B2
(en)
|
2006-02-09 |
2011-05-03 |
Headwaters Technology Innovation Llc |
Polymeric materials incorporating carbon nanostructures
|
KR101395393B1
(en)
|
2006-02-23 |
2014-05-15 |
피코데온 리미티드 오와이 |
Coating on a metal substrate and a coated metal product
|
US20070204420A1
(en)
|
2006-03-06 |
2007-09-06 |
Hornby David M |
Polishing pad and method of making
|
US7517488B2
(en)
|
2006-03-08 |
2009-04-14 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Method of forming a chemical mechanical polishing pad utilizing laser sintering
|
US20070212979A1
(en)
*
|
2006-03-09 |
2007-09-13 |
Rimpad Tech Ltd. |
Composite polishing pad
|
WO2007111996A2
(en)
|
2006-03-24 |
2007-10-04 |
Clemson University |
Conducting polymer ink
|
US20070235133A1
(en)
|
2006-03-29 |
2007-10-11 |
Strasbaugh |
Devices and methods for measuring wafer characteristics during semiconductor wafer polishing
|
US20070235904A1
(en)
|
2006-04-06 |
2007-10-11 |
Saikin Alan H |
Method of forming a chemical mechanical polishing pad utilizing laser sintering
|
US7410413B2
(en)
|
2006-04-27 |
2008-08-12 |
3M Innovative Properties Company |
Structured abrasive article and method of making and using the same
|
FR2900411B1
(en)
|
2006-04-27 |
2008-08-29 |
Coatex Sas |
PROCESS FOR THE TREATMENT OF MINERAL MATERIALS BY AMPHOTERIC POLYMERS, THE MINERAL MATERIALS OBTAINED, THEIR USE AS A REDUCING AGENT OF THE QUANTITY OF COLLOIDS IN THE MANUFACTURE OF PAPER.
|
US7445847B2
(en)
|
2006-05-25 |
2008-11-04 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Chemical mechanical polishing pad
|
US7169030B1
(en)
|
2006-05-25 |
2007-01-30 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Chemical mechanical polishing pad
|
ATE466720T1
(en)
|
2006-06-20 |
2010-05-15 |
Univ Leuven Kath |
METHOD AND DEVICE FOR IN-SITU MONITORING AND FEEDBACK CONTROL OF SELECTIVE LASER POWDER PROCESSING
|
US7840305B2
(en)
|
2006-06-28 |
2010-11-23 |
3M Innovative Properties Company |
Abrasive articles, CMP monitoring system and method
|
US20080220702A1
(en)
|
2006-07-03 |
2008-09-11 |
Sang Fang Chemical Industry Co., Ltd. |
Polishing pad having surface texture
|
JP5186738B2
(en)
|
2006-07-10 |
2013-04-24 |
富士通セミコンダクター株式会社 |
Manufacturing method of polishing pad and polishing method of object to be polished
|
TWI409136B
(en)
|
2006-07-19 |
2013-09-21 |
Innopad Inc |
Chemical mechanical planarization pad having micro-grooves on the pad surface
|
KR100804275B1
(en)
|
2006-07-24 |
2008-02-18 |
에스케이씨 주식회사 |
Chemical Mechanical Polishing Pads Comprising Liquid Organic Material Core Encapsulated by Polymer Shell And Methods for Producing The Same
|
US8314192B2
(en)
|
2006-07-28 |
2012-11-20 |
Toray Industries, Inc. |
Interpenetrating polymer network structure and polishing pad, and process for producing the same
|
US7267610B1
(en)
|
2006-08-30 |
2007-09-11 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
CMP pad having unevenly spaced grooves
|
US7300340B1
(en)
|
2006-08-30 |
2007-11-27 |
Rohm and Haas Electronics Materials CMP Holdings, Inc. |
CMP pad having overlaid constant area spiral grooves
|
US8337282B2
(en)
|
2006-09-06 |
2012-12-25 |
Nitta Haas Incorporated |
Polishing pad
|
JP2008084504A
(en)
|
2006-09-29 |
2008-04-10 |
Hitachi Ltd |
Optical disk device and optical disk playback method
|
US7382959B1
(en)
|
2006-10-13 |
2008-06-03 |
Hrl Laboratories, Llc |
Optically oriented three-dimensional polymer microstructures
|
KR100842486B1
(en)
|
2006-10-30 |
2008-07-01 |
동부일렉트로닉스 주식회사 |
Polishing pad of a chemical-mechanical polisher and apparatus for fabricating by the said
|
US7234224B1
(en)
|
2006-11-03 |
2007-06-26 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Curved grooving of polishing pads
|
US7648645B2
(en)
|
2006-11-08 |
2010-01-19 |
3M Innovative Properties Company |
Pre-polymer formulations for liquid crystal displays
|
CN101199994A
(en)
|
2006-12-15 |
2008-06-18 |
湖南大学 |
Intelligent laser cladding forming metal parts
|
US7438636B2
(en)
|
2006-12-21 |
2008-10-21 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Chemical mechanical polishing pad
|
WO2008077850A2
(en)
|
2006-12-21 |
2008-07-03 |
Agfa Graphics Nv |
3d-inkjet printing methods
|
US7371160B1
(en)
|
2006-12-21 |
2008-05-13 |
Rohm And Haas Electronic Materials Cmp Holdings Inc. |
Elastomer-modified chemical mechanical polishing pad
|
US8083820B2
(en)
|
2006-12-22 |
2011-12-27 |
3M Innovative Properties Company |
Structured fixed abrasive articles including surface treated nano-ceria filler, and method for making and using the same
|
US7497885B2
(en)
|
2006-12-22 |
2009-03-03 |
3M Innovative Properties Company |
Abrasive articles with nanoparticulate fillers and method for making and using them
|
US7311590B1
(en)
|
2007-01-31 |
2007-12-25 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Polishing pad with grooves to retain slurry on the pad texture
|
US7520798B2
(en)
|
2007-01-31 |
2009-04-21 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Polishing pad with grooves to reduce slurry consumption
|
JP5204502B2
(en)
|
2007-02-01 |
2013-06-05 |
株式会社クラレ |
Polishing pad and polishing pad manufacturing method
|
TWI432285B
(en)
|
2007-02-01 |
2014-04-01 |
Kuraray Co |
Abrasive pad and process for manufacturing abrasive pad
|
US20080202577A1
(en)
|
2007-02-16 |
2008-08-28 |
Henry Hieslmair |
Dynamic design of solar cell structures, photovoltaic modules and corresponding processes
|
JP2008258574A
(en)
*
|
2007-03-14 |
2008-10-23 |
Jsr Corp |
Chemical-mechanical polishing pad, and chemical-mechanical polishing method
|
EP2135707A4
(en)
|
2007-03-20 |
2013-10-09 |
Kuraray Co |
Cushion for polishing pad and polishing pad using the cushion
|
JP4798713B2
(en)
|
2007-03-26 |
2011-10-19 |
ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド |
Polishing pad manufacturing method
|
JP4954762B2
(en)
|
2007-03-27 |
2012-06-20 |
東洋ゴム工業株式会社 |
Method for producing polyurethane foam
|
US9536711B2
(en)
|
2007-03-30 |
2017-01-03 |
Lam Research Corporation |
Method and apparatus for DC voltage control on RF-powered electrode
|
US8784723B2
(en)
|
2007-04-01 |
2014-07-22 |
Stratasys Ltd. |
Method and system for three-dimensional fabrication
|
US20090011679A1
(en)
|
2007-04-06 |
2009-01-08 |
Rajeev Bajaj |
Method of removal profile modulation in cmp pads
|
FR2915016B1
(en)
|
2007-04-10 |
2009-06-05 |
Siemens Vdo Automotive Sas |
SYSTEM FOR AUTOMATED CREATION OF A SOFTWARE INTERFACE
|
US8067814B2
(en)
|
2007-06-01 |
2011-11-29 |
Panasonic Corporation |
Semiconductor device and method of manufacturing the same
|
US8562389B2
(en)
|
2007-06-08 |
2013-10-22 |
Applied Materials, Inc. |
Thin polishing pad with window and molding process
|
US7455571B1
(en)
|
2007-06-20 |
2008-11-25 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Window polishing pad
|
US20080314878A1
(en)
|
2007-06-22 |
2008-12-25 |
General Electric Company |
Apparatus and method for controlling a machining system
|
US7758764B2
(en)
|
2007-06-28 |
2010-07-20 |
Lam Research Corporation |
Methods and apparatus for substrate processing
|
US8563619B2
(en)
|
2007-06-28 |
2013-10-22 |
Lam Research Corporation |
Methods and arrangements for plasma processing system with tunable capacitance
|
US7862320B2
(en)
|
2007-07-17 |
2011-01-04 |
Seiko Epson Corporation |
Three-dimensional object forming apparatus and method for forming three dimensional object
|
US8047899B2
(en)
|
2007-07-26 |
2011-11-01 |
Macronix International Co., Ltd. |
Pad and method for chemical mechanical polishing
|
US7635290B2
(en)
|
2007-08-15 |
2009-12-22 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Interpenetrating network for chemical mechanical polishing
|
US7828634B2
(en)
|
2007-08-16 |
2010-11-09 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Interconnected-multi-element-lattice polishing pad
|
US7517277B2
(en)
|
2007-08-16 |
2009-04-14 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Layered-filament lattice for chemical mechanical polishing
|
CN101376234B
(en)
|
2007-08-28 |
2013-05-29 |
侯家祥 |
Ordered arrangement method for abrading agent granule on abrading tool and abrading tool
|
KR20100082770A
(en)
|
2007-09-03 |
2010-07-19 |
세미퀘스트, 인코포레이티드 |
Polishing pad
|
SG184772A1
(en)
|
2007-09-21 |
2012-10-30 |
Cabot Microelectronics Corp |
Polishing composition and method utilizing abrasive particles treated with an aminosilane
|
EP2042649B1
(en)
|
2007-09-27 |
2012-05-30 |
Toyoda Gosei Co., Ltd. |
Coated base fabric for airbags
|
JP5078527B2
(en)
|
2007-09-28 |
2012-11-21 |
富士紡ホールディングス株式会社 |
Polishing cloth
|
FR2921667B1
(en)
|
2007-10-01 |
2012-11-09 |
Saint Gobain Abrasives Inc |
LIQUID RESIN COMPOSITION FOR ABRASIVE ARTICLES
|
JP5143528B2
(en)
|
2007-10-25 |
2013-02-13 |
株式会社クラレ |
Polishing pad
|
US8491360B2
(en)
|
2007-10-26 |
2013-07-23 |
Innopad, Inc. |
Three-dimensional network in CMP pad
|
US20090133716A1
(en)
|
2007-10-29 |
2009-05-28 |
Wai Mun Lee |
Methods of post chemical mechanical polishing and wafer cleaning using amidoxime compositions
|
US8388410B2
(en)
|
2007-11-05 |
2013-03-05 |
P.R. Hoffman Machine Products, Inc. |
RFID-containing carriers used for silicon wafer quality
|
JP2009129970A
(en)
|
2007-11-20 |
2009-06-11 |
Ebara Corp |
Polishing apparatus and polishing method
|
DE102007056984A1
(en)
|
2007-11-27 |
2009-05-28 |
Eos Gmbh Electro Optical Systems |
Method for producing a three-dimensional object by means of laser sintering
|
EP2215525B1
(en)
|
2007-11-27 |
2018-01-10 |
3D Systems Incorporated |
Photocurable resin composition for producing three dimensional articles having high clarity
|
EP2240298A4
(en)
|
2007-12-31 |
2014-04-30 |
3M Innovative Properties Co |
Plasma treated abrasive article and method of making same
|
WO2009088945A1
(en)
|
2007-12-31 |
2009-07-16 |
Innopad, Inc. |
Chemical-mechanical planarization pad
|
US9180570B2
(en)
|
2008-03-14 |
2015-11-10 |
Nexplanar Corporation |
Grooved CMP pad
|
EP2261011A4
(en)
|
2008-03-25 |
2014-04-30 |
Sumitomo Rubber Ind |
Tire puncture repair apparatus
|
JP5226359B2
(en)
|
2008-04-02 |
2013-07-03 |
株式会社クラレ |
Polishing pad cushion and polishing pad using the same
|
US8684794B2
(en)
|
2008-04-11 |
2014-04-01 |
Fns Tech Co., Ltd. |
Chemical mechanical planarization pad with void network
|
CN102083586B
(en)
|
2008-04-29 |
2015-08-12 |
塞米奎斯特股份有限公司 |
Polishing pad composition and method of manufacture and use thereof
|
JP5400042B2
(en)
|
2008-05-26 |
2014-01-29 |
ソニー株式会社 |
Modeling equipment
|
TW201005825A
(en)
|
2008-05-30 |
2010-02-01 |
Panasonic Corp |
Plasma processing apparatus and method
|
US20090308739A1
(en)
|
2008-06-17 |
2009-12-17 |
Applied Materials, Inc. |
Wafer processing deposition shielding components
|
TWM347669U
(en)
|
2008-06-19 |
2008-12-21 |
Bestac Advanced Material Co Ltd |
Polishing pad and polishing device
|
CN101612722A
(en)
|
2008-06-25 |
2009-12-30 |
三芳化学工业股份有限公司 |
Polishing pad and manufacture method thereof
|
CN102131618A
(en)
|
2008-06-26 |
2011-07-20 |
3M创新有限公司 |
Polishing pad with porous elements and method of making and using same
|
US8282866B2
(en)
|
2008-06-30 |
2012-10-09 |
Seiko Epson Corporation |
Method and device for forming three-dimensional model, sheet material processing method, and sheet material processing device
|
US20100011672A1
(en)
|
2008-07-16 |
2010-01-21 |
Kincaid Don H |
Coated abrasive article and method of making and using the same
|
WO2010009420A1
(en)
|
2008-07-18 |
2010-01-21 |
3M Innovative Properties Company |
Polishing pad with floating elements and method of making and using the same
|
US20140069584A1
(en)
|
2008-07-23 |
2014-03-13 |
Applied Materials, Inc. |
Differential counter electrode tuning in a plasma reactor with an rf-driven ceiling electrode
|
US20100018648A1
(en)
|
2008-07-23 |
2010-01-28 |
Applied Marterials, Inc. |
Workpiece support for a plasma reactor with controlled apportionment of rf power to a process kit ring
|
US20140034239A1
(en)
|
2008-07-23 |
2014-02-06 |
Applied Materials, Inc. |
Differential counter electrode tuning in a plasma reactor with an rf-driven workpiece support electrode
|
US8734664B2
(en)
|
2008-07-23 |
2014-05-27 |
Applied Materials, Inc. |
Method of differential counter electrode tuning in an RF plasma reactor
|
CN101642898B
(en)
|
2008-08-06 |
2011-09-14 |
财团法人工业技术研究院 |
Polishing pad and forming method and polishing method thereof
|
WO2010016486A1
(en)
|
2008-08-08 |
2010-02-11 |
株式会社クラレ |
Polishing pad and method for manufacturing the polishing pad
|
KR20100028294A
(en)
|
2008-09-04 |
2010-03-12 |
주식회사 코오롱 |
Polishing pad and method of manufacturing the same
|
JP2010077288A
(en)
|
2008-09-26 |
2010-04-08 |
Toray Ind Inc |
Interpenetrating polymer network structure, polishing pad, and method for producing interpenetrating polymer network structure
|
US8366959B2
(en)
|
2008-09-26 |
2013-02-05 |
Rhodia Operations |
Abrasive compositions for chemical mechanical polishing and methods for using same
|
US8118641B2
(en)
|
2009-03-04 |
2012-02-21 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Chemical mechanical polishing pad having window with integral identification feature
|
TW201016387A
(en)
|
2008-10-22 |
2010-05-01 |
jian-min Song |
CMP Pad Dressers with Hybridized abrasive surface and related methods
|
US20100112919A1
(en)
|
2008-11-03 |
2010-05-06 |
Applied Materials, Inc. |
Monolithic linear polishing sheet
|
US8292692B2
(en)
|
2008-11-26 |
2012-10-23 |
Semiquest, Inc. |
Polishing pad with endpoint window and systems and method using the same
|
DE102008060046A1
(en)
|
2008-12-02 |
2010-06-10 |
Eos Gmbh Electro Optical Systems |
A method of providing an identifiable amount of powder and method of making an object
|
US20100140850A1
(en)
|
2008-12-04 |
2010-06-10 |
Objet Geometries Ltd. |
Compositions for 3D printing
|
DE102008061311A1
(en)
|
2008-12-11 |
2010-06-24 |
Doukas Ag |
Device for conveying a gas
|
US8057282B2
(en)
|
2008-12-23 |
2011-11-15 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
High-rate polishing method
|
US8062103B2
(en)
|
2008-12-23 |
2011-11-22 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
High-rate groove pattern
|
CN102301455A
(en)
|
2009-01-27 |
2011-12-28 |
因诺派德公司 |
Chemical-mechanical planarization pad including patterned structural domains
|
US8053487B2
(en)
|
2009-01-30 |
2011-11-08 |
The United States Of America As Represented By The Secretary Of The Navy |
Multifunctional acrylates used as cross-linkers in dental and biomedical self-etching bonding adhesives
|
WO2010096704A2
(en)
|
2009-02-19 |
2010-08-26 |
Alex Garfield Bonner |
Porous interpenetrating polymer network
|
WO2010116486A1
(en)
|
2009-04-07 |
2010-10-14 |
トヨタ自動車株式会社 |
Stator and manufacturing method thereof
|
US9951054B2
(en)
|
2009-04-23 |
2018-04-24 |
Cabot Microelectronics Corporation |
CMP porous pad with particles in a polymeric matrix
|
US9056382B2
(en)
|
2009-05-27 |
2015-06-16 |
Rogers Corporation |
Polishing pad, composition for the manufacture thereof, and method of making and using
|
JP5357639B2
(en)
|
2009-06-24 |
2013-12-04 |
株式会社日立ハイテクノロジーズ |
Plasma processing apparatus and plasma processing method
|
US8545292B2
(en)
|
2009-06-29 |
2013-10-01 |
Dic Corporation |
Two-component urethane resin composition for polishing pad, polyurethane polishing pad, and method for producing polyurethane polishing pad
|
CN102498549A
(en)
|
2009-07-16 |
2012-06-13 |
嘉柏微电子材料股份公司 |
Grooved cmp polishing pad
|
TWI535527B
(en)
|
2009-07-20 |
2016-06-01 |
智勝科技股份有限公司 |
Polishing method, polishing pad and polishing system
|
US8712571B2
(en)
|
2009-08-07 |
2014-04-29 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Method and apparatus for wireless transmission of diagnostic information
|
US8676537B2
(en)
|
2009-08-07 |
2014-03-18 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Portable wireless sensor
|
US8889232B2
(en)
|
2009-08-20 |
2014-11-18 |
Electronics For Imaging, Inc. |
Radiation curable ink compositions
|
TWI410299B
(en)
|
2009-08-24 |
2013-10-01 |
Bestac Advanced Material Co Ltd |
Polishing pad, use thereof and method for making the same
|
US8546717B2
(en)
|
2009-09-17 |
2013-10-01 |
Sciaky, Inc. |
Electron beam layer manufacturing
|
US9068085B2
(en)
|
2009-10-16 |
2015-06-30 |
Posco |
Radiation curable resin composition, and fingerprint-resistant resin composition containing same
|
CN102639299A
(en)
*
|
2009-11-12 |
2012-08-15 |
3M创新有限公司 |
Rotary buffing pad
|
WO2011059621A1
(en)
|
2009-11-13 |
2011-05-19 |
Sciaky, Inc. |
Electron beam layer manufacturing using scanning electron monitored closed loop control
|
JP5496630B2
(en)
|
2009-12-10 |
2014-05-21 |
東京エレクトロン株式会社 |
Electrostatic chuck device
|
US20130012108A1
(en)
|
2009-12-22 |
2013-01-10 |
Naichao Li |
Polishing pad and method of making the same
|
KR101419156B1
(en)
|
2009-12-28 |
2014-07-11 |
히타치가세이가부시끼가이샤 |
Polishing liquid for cmp and polishing method using the same
|
WO2011082156A2
(en)
|
2009-12-30 |
2011-07-07 |
3M Innovative Properties Company |
Organic particulate loaded polishing pads and method of making and using the same
|
JP6004941B2
(en)
|
2009-12-30 |
2016-10-12 |
スリーエム イノベイティブ プロパティズ カンパニー |
Polishing pad containing a phase-separated polymer blend and method for making and using the same
|
US9017140B2
(en)
|
2010-01-13 |
2015-04-28 |
Nexplanar Corporation |
CMP pad with local area transparency
|
US9089943B2
(en)
|
2010-01-29 |
2015-07-28 |
Ronald Lipson |
Composite pads for buffing and polishing painted vehicle body surfaces and other applications
|
DE102010007401A1
(en)
|
2010-02-03 |
2011-08-04 |
Kärcher Futuretech GmbH, 71364 |
Apparatus and method for automated forming and filling of containers
|
SG183419A1
(en)
|
2010-02-22 |
2012-09-27 |
Entegris Inc |
Post-cmp cleaning brush
|
KR20110100080A
(en)
|
2010-03-03 |
2011-09-09 |
삼성전자주식회사 |
Polishing pad for chemical mechanical polishing process and chemical mechanical polishing apparatus having the same
|
DE102010011059A1
(en)
|
2010-03-11 |
2011-09-15 |
Global Beam Technologies Ag |
Method and device for producing a component
|
JP5551479B2
(en)
|
2010-03-19 |
2014-07-16 |
ニッタ・ハース株式会社 |
Polishing apparatus, polishing pad and polishing information management system
|
JP5620141B2
(en)
|
2010-04-15 |
2014-11-05 |
東洋ゴム工業株式会社 |
Polishing pad
|
JP5697889B2
(en)
|
2010-04-19 |
2015-04-08 |
帝人コードレ株式会社 |
Smoothing sheet
|
KR20130081229A
(en)
|
2010-05-11 |
2013-07-16 |
쓰리엠 이노베이티브 프로퍼티즈 컴파니 |
Fixed abrasive pad with surfactant for chemical mechanical planarization
|
EP2585541B1
(en)
|
2010-06-25 |
2016-06-08 |
3M Innovative Properties Company |
Semi-interpenetrating polymer network
|
US20120000887A1
(en)
|
2010-06-30 |
2012-01-05 |
Kabushiki Kaisha Toshiba |
Plasma treatment apparatus and plasma treatment method
|
KR101879883B1
(en)
|
2010-07-02 |
2018-07-18 |
쓰리엠 이노베이티브 프로퍼티즈 컴파니 |
Coated abrasive articles
|
US9156124B2
(en)
|
2010-07-08 |
2015-10-13 |
Nexplanar Corporation |
Soft polishing pad for polishing a semiconductor substrate
|
JP5635957B2
(en)
|
2010-09-09 |
2014-12-03 |
日本碍子株式会社 |
Polishing method of polishing object and polishing pad
|
US20130172509A1
(en)
|
2010-09-22 |
2013-07-04 |
Interfacial Solutions Ip, Llc |
Methods of Producing Microfabricated Particles for Composite Materials
|
US8257545B2
(en)
|
2010-09-29 |
2012-09-04 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Chemical mechanical polishing pad with light stable polymeric endpoint detection window and method of polishing therewith
|
US8702479B2
(en)
|
2010-10-15 |
2014-04-22 |
Nexplanar Corporation |
Polishing pad with multi-modal distribution of pore diameters
|
CN103261291B
(en)
|
2010-12-16 |
2015-01-28 |
3M创新有限公司 |
Interpenetrated polymer layer
|
WO2012100297A1
(en)
|
2011-01-26 |
2012-08-02 |
Zydex Pty Ltd |
A device for making an object
|
US9211628B2
(en)
|
2011-01-26 |
2015-12-15 |
Nexplanar Corporation |
Polishing pad with concentric or approximately concentric polygon groove pattern
|
JP5893479B2
(en)
|
2011-04-21 |
2016-03-23 |
東洋ゴム工業株式会社 |
Laminated polishing pad
|
ES2808700T3
(en)
|
2011-04-27 |
2021-03-01 |
Henkel IP & Holding GmbH |
Curable elastomer compositions with low temperature sealability
|
US8968058B2
(en)
|
2011-05-05 |
2015-03-03 |
Nexplanar Corporation |
Polishing pad with alignment feature
|
US20120302148A1
(en)
|
2011-05-23 |
2012-11-29 |
Rajeev Bajaj |
Polishing pad with homogeneous body having discrete protrusions thereon
|
JP5851124B2
(en)
|
2011-06-13 |
2016-02-03 |
スリーエム イノベイティブ プロパティズ カンパニー |
Polishing structure
|
EP2537675B1
(en)
|
2011-06-21 |
2013-12-11 |
Agfa Graphics N.V. |
A curable jettable fluid for making a flexographic printing master
|
US10388493B2
(en)
|
2011-09-16 |
2019-08-20 |
Lam Research Corporation |
Component of a substrate support assembly producing localized magnetic fields
|
US8801949B2
(en)
|
2011-09-22 |
2014-08-12 |
Dow Global Technologies Llc |
Method of forming open-network polishing pads
|
US9108291B2
(en)
|
2011-09-22 |
2015-08-18 |
Dow Global Technologies Llc |
Method of forming structured-open-network polishing pads
|
US8894799B2
(en)
|
2011-09-22 |
2014-11-25 |
Dow Global Technologies Llc |
Method of forming layered-open-network polishing pads
|
CN103918063A
(en)
|
2011-09-26 |
2014-07-09 |
恩特格里公司 |
Post-cmp cleaning apparatus and method
|
US20130107415A1
(en)
|
2011-10-28 |
2013-05-02 |
Applied Materials, Inc. |
Electrostatic chuck
|
TWI462797B
(en)
|
2011-11-24 |
2014-12-01 |
Univ Nat Taiwan Science Tech |
Electric field assisted chemical mechanical polishing system and its method
|
US9067297B2
(en)
|
2011-11-29 |
2015-06-30 |
Nexplanar Corporation |
Polishing pad with foundation layer and polishing surface layer
|
US9067298B2
(en)
|
2011-11-29 |
2015-06-30 |
Nexplanar Corporation |
Polishing pad with grooved foundation layer and polishing surface layer
|
KR101819539B1
(en)
*
|
2011-11-29 |
2018-01-17 |
캐보트 마이크로일렉트로닉스 코포레이션 |
Polishing pad with foundation layer and polishing surface layer
|
WO2013079146A1
(en)
|
2011-11-30 |
2013-06-06 |
Merck Patent Gmbh |
Particles for electrophoretic displays
|
US8988848B2
(en)
|
2011-12-15 |
2015-03-24 |
Applied Materials, Inc. |
Extended and independent RF powered cathode substrate for extreme edge tunability
|
KR20130084932A
(en)
|
2012-01-18 |
2013-07-26 |
삼성전자주식회사 |
Method of manufacturing semiconductor device
|
US8721833B2
(en)
|
2012-02-05 |
2014-05-13 |
Tokyo Electron Limited |
Variable capacitance chamber component incorporating ferroelectric materials and methods of manufacturing and using thereof
|
US8486798B1
(en)
|
2012-02-05 |
2013-07-16 |
Tokyo Electron Limited |
Variable capacitance chamber component incorporating a semiconductor junction and methods of manufacturing and using thereof
|
KR20130095430A
(en)
|
2012-02-20 |
2013-08-28 |
케이피엑스케미칼 주식회사 |
Polishing pad and manufacturing method thereof
|
WO2013128452A1
(en)
|
2012-03-01 |
2013-09-06 |
Stratasys Ltd. |
Cationic polymerizable compositions and methods of use thereof
|
DE102012203639A1
(en)
|
2012-03-08 |
2013-09-12 |
Evonik Industries Ag |
Additive for adjusting the glass transition temperature of viscoelastic flexible polyurethane foams
|
US8709114B2
(en)
|
2012-03-22 |
2014-04-29 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Method of manufacturing chemical mechanical polishing layers
|
US8986585B2
(en)
|
2012-03-22 |
2015-03-24 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Method of manufacturing chemical mechanical polishing layers having a window
|
JP2013201046A
(en)
*
|
2012-03-26 |
2013-10-03 |
Toppan Printing Co Ltd |
Method for correcting recessed defect and method for manufacturing organic el element using the same
|
DE102012007791A1
(en)
|
2012-04-20 |
2013-10-24 |
Universität Duisburg-Essen |
Method and device for producing components in a jet melting plant
|
US9067299B2
(en)
|
2012-04-25 |
2015-06-30 |
Applied Materials, Inc. |
Printed chemical mechanical polishing pad
|
US9412579B2
(en)
|
2012-04-26 |
2016-08-09 |
Applied Materials, Inc. |
Methods and apparatus for controlling substrate uniformity
|
US9993873B2
(en)
|
2012-05-22 |
2018-06-12 |
General Electric Company |
System and method for three-dimensional printing
|
US9481134B2
(en)
|
2012-06-08 |
2016-11-01 |
Makerbot Industries, Llc |
Build platform leveling with tactile feedback
|
EP2859059B1
(en)
|
2012-06-11 |
2019-12-18 |
Cabot Microelectronics Corporation |
Composition and method for polishing molybdenum
|
US8778211B2
(en)
|
2012-07-17 |
2014-07-15 |
Cabot Microelectronics Corporation |
GST CMP slurries
|
US9174388B2
(en)
|
2012-08-16 |
2015-11-03 |
Stratasys, Inc. |
Draw control for extrusion-based additive manufacturing systems
|
KR101697105B1
(en)
|
2012-09-05 |
2017-01-17 |
아프레시아 파마슈티칼스 컴퍼니 |
Three-dimensional printing system and equipment assembly
|
US8888480B2
(en)
|
2012-09-05 |
2014-11-18 |
Aprecia Pharmaceuticals Company |
Three-dimensional printing system and equipment assembly
|
JP6196858B2
(en)
|
2012-09-24 |
2017-09-13 |
株式会社荏原製作所 |
Polishing method and polishing apparatus
|
WO2014051702A1
(en)
|
2012-09-25 |
2014-04-03 |
3M Innovative Properties Company |
Radiation curable ink composition
|
CN202825512U
(en)
|
2012-10-11 |
2013-03-27 |
中芯国际集成电路制造(北京)有限公司 |
Grinding pad and chemical machinery grinding machine
|
KR102131604B1
(en)
|
2012-10-11 |
2020-07-09 |
다우 실리콘즈 코포레이션 |
Aqueous silicone polyether microemulsions
|
US9233504B2
(en)
|
2012-10-29 |
2016-01-12 |
Makerbot Industries, Llc |
Tagged build material for three-dimensional printing
|
EP2917797B1
(en)
|
2012-11-08 |
2021-06-30 |
DDM Systems, Inc. |
Systems and methods for additive manufacturing and repair of metal components
|
WO2014095200A1
(en)
|
2012-12-17 |
2014-06-26 |
Arcam Ab |
Additive manufacturing method and apparatus
|
US10357435B2
(en)
|
2012-12-18 |
2019-07-23 |
Dentca, Inc. |
Photo-curable resin compositions and method of using the same in three-dimensional printing for manufacturing artificial teeth and denture base
|
US11673155B2
(en)
|
2012-12-27 |
2023-06-13 |
Kateeva, Inc. |
Techniques for arrayed printing of a permanent layer with improved speed and accuracy
|
US9630249B2
(en)
|
2013-01-17 |
2017-04-25 |
Ehsan Toyserkani |
Systems and methods for additive manufacturing of heterogeneous porous structures and structures made therefrom
|
US9649742B2
(en)
|
2013-01-22 |
2017-05-16 |
Nexplanar Corporation |
Polishing pad having polishing surface with continuous protrusions
|
US9587127B2
(en)
|
2013-02-06 |
2017-03-07 |
Sun Chemical Corporation |
Digital printing inks
|
JP6356700B2
(en)
|
2013-02-12 |
2018-07-11 |
カーボン,インコーポレイテッド |
Continuous liquid phase printing
|
EP2969465B1
(en)
|
2013-03-14 |
2019-05-01 |
Stratasys Ltd. |
Polymer based molds and methods of manufacturing there of
|
US9152340B2
(en)
|
2013-05-28 |
2015-10-06 |
Netapp, Inc. |
System and method for managing and producing a dataset image across multiple storage systems
|
JP5955275B2
(en)
|
2013-06-12 |
2016-07-20 |
富士フイルム株式会社 |
Image forming method, decorative sheet manufacturing method, molding method, decorative sheet molded product manufacturing method, in-mold molded product manufacturing method
|
US20140370788A1
(en)
|
2013-06-13 |
2014-12-18 |
Cabot Microelectronics Corporation |
Low surface roughness polishing pad
|
US10183329B2
(en)
|
2013-07-19 |
2019-01-22 |
The Boeing Company |
Quality control of additive manufactured parts
|
US20150038066A1
(en)
|
2013-07-31 |
2015-02-05 |
Nexplanar Corporation |
Low density polishing pad
|
GB201313841D0
(en)
|
2013-08-02 |
2013-09-18 |
Rolls Royce Plc |
Method of Manufacturing a Component
|
CN105408993A
(en)
|
2013-08-06 |
2016-03-16 |
应用材料公司 |
Locally heated multi-zone substrate support
|
US9855698B2
(en)
|
2013-08-07 |
2018-01-02 |
Massachusetts Institute Of Technology |
Automatic process control of additive manufacturing device
|
JP5992375B2
(en)
|
2013-08-08 |
2016-09-14 |
株式会社東芝 |
Electrostatic chuck, mounting plate support, and manufacturing method of electrostatic chuck
|
CN105453232B
(en)
|
2013-08-10 |
2019-04-05 |
应用材料公司 |
CMP pad with the material composition for promoting controlled adjusting
|
JP6595473B2
(en)
|
2013-08-22 |
2019-10-23 |
キャボット マイクロエレクトロニクス コーポレイション |
Polishing pad with porous interface and solid core and apparatus and method thereof
|
US20150056895A1
(en)
|
2013-08-22 |
2015-02-26 |
Cabot Microelectronics Corporation |
Ultra high void volume polishing pad with closed pore structure
|
DE102013217422A1
(en)
|
2013-09-02 |
2015-03-05 |
Carl Zeiss Industrielle Messtechnik Gmbh |
Coordinate measuring machine and method for measuring and at least partially producing a workpiece
|
CN103465155B
(en)
*
|
2013-09-06 |
2016-05-11 |
蓝思科技股份有限公司 |
A kind of epoxide resin type diamond lap pad and preparation method thereof
|
US9425121B2
(en)
|
2013-09-11 |
2016-08-23 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Integrated fan-out structure with guiding trenches in buffer layer
|
KR101405333B1
(en)
|
2013-09-12 |
2014-06-11 |
유비머트리얼즈주식회사 |
Abrasive particles, polishing slurry and method of manufacturing a semiconductor device using the same
|
US9308620B2
(en)
|
2013-09-18 |
2016-04-12 |
Texas Instruments Incorporated |
Permeated grooving in CMP polishing pads
|
US9053908B2
(en)
|
2013-09-19 |
2015-06-09 |
Lam Research Corporation |
Method and apparatus for controlling substrate DC-bias and ion energy and angular distribution during substrate etching
|
GB201316815D0
(en)
|
2013-09-23 |
2013-11-06 |
Renishaw Plc |
Additive manufacturing apparatus and method
|
JP6703939B2
(en)
|
2013-09-25 |
2020-06-03 |
スリーエム イノベイティブ プロパティズ カンパニー |
Polishing system
|
CN111978921A
(en)
|
2013-09-30 |
2020-11-24 |
圣戈本陶瓷及塑料股份有限公司 |
Shaped abrasive particles and methods of forming the same
|
EP3057775A1
(en)
|
2013-10-17 |
2016-08-24 |
LUXeXcel Holding B.V. |
Device for printing a three-dimensional structure
|
CN203542340U
(en)
|
2013-10-21 |
2014-04-16 |
中芯国际集成电路制造(北京)有限公司 |
Chemical mechanical polishing pad
|
US9830456B2
(en)
|
2013-10-21 |
2017-11-28 |
Cisco Technology, Inc. |
Trust transference from a trusted processor to an untrusted processor
|
US8980749B1
(en)
|
2013-10-24 |
2015-03-17 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Method for chemical mechanical polishing silicon wafers
|
US9831074B2
(en)
|
2013-10-24 |
2017-11-28 |
Applied Materials, Inc. |
Bipolar collimator utilized in a physical vapor deposition chamber
|
US10012904B2
(en)
|
2013-10-30 |
2018-07-03 |
Mark'Andy Inc. |
Lithographic printing plate precursors and coating
|
US9421666B2
(en)
|
2013-11-04 |
2016-08-23 |
Applied Materials, Inc. |
Printed chemical mechanical polishing pad having abrasives therein
|
US9481069B2
(en)
|
2013-11-06 |
2016-11-01 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Chemical mechanical polishing apparatus and polishing method using the same
|
CN104625945B
(en)
|
2013-11-07 |
2017-03-01 |
三芳化学工业股份有限公司 |
Polishing pad and its manufacture method
|
US9352443B2
(en)
|
2013-11-13 |
2016-05-31 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Platen assembly, chemical-mechanical polisher, and method for polishing substrate
|
US9850402B2
(en)
|
2013-12-09 |
2017-12-26 |
Cabot Microelectronics Corporation |
CMP compositions and methods for selective removal of silicon nitride
|
US9993907B2
(en)
|
2013-12-20 |
2018-06-12 |
Applied Materials, Inc. |
Printed chemical mechanical polishing pad having printed window
|
CN104742007B
(en)
|
2013-12-30 |
2017-08-25 |
中芯国际集成电路制造(北京)有限公司 |
Chemical mechanical polishing device and chemical and mechanical grinding method
|
WO2015111366A1
(en)
|
2014-01-23 |
2015-07-30 |
Ricoh Company, Ltd. |
Three-dimensional object and method for forming same
|
US20170173865A1
(en)
|
2014-02-10 |
2017-06-22 |
Stratasys Ltd. |
Composition and method for additive manufacturing of an object
|
WO2015120429A1
(en)
|
2014-02-10 |
2015-08-13 |
President And Fellows Of Harvard College |
Three-dimensional (3d) printed composite structure and 3d printable composite ink formulation
|
WO2015120430A1
(en)
|
2014-02-10 |
2015-08-13 |
President And Fellows Of Harvard College |
3d-printed polishing pad for chemical-mechanical planarization (cmp)
|
US9472410B2
(en)
|
2014-03-05 |
2016-10-18 |
Applied Materials, Inc. |
Pixelated capacitance controlled ESC
|
JP2015174272A
(en)
|
2014-03-14 |
2015-10-05 |
セイコーエプソン株式会社 |
Method for producing three-dimensional shaped object, apparatus for producing three-dimensional shaped object, and three-dimensional shaped object
|
US9259820B2
(en)
|
2014-03-28 |
2016-02-16 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Chemical mechanical polishing pad with polishing layer and window
|
EP3126092B1
(en)
|
2014-04-03 |
2022-08-17 |
3M Innovative Properties Company |
Polishing pads and systems and methods of making and using the same
|
WO2015161210A1
(en)
|
2014-04-17 |
2015-10-22 |
Cabot Microelectronics Corporation |
Cmp polishing pad with columnar structure and methods related thereto
|
US9314897B2
(en)
|
2014-04-29 |
2016-04-19 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Chemical mechanical polishing pad with endpoint detection window
|
US9333620B2
(en)
|
2014-04-29 |
2016-05-10 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Chemical mechanical polishing pad with clear endpoint detection window
|
US10144198B2
(en)
|
2014-05-02 |
2018-12-04 |
Corning Incorporated |
Strengthened glass and compositions therefor
|
CN104400998B
(en)
|
2014-05-31 |
2016-10-05 |
福州大学 |
A kind of 3D based on infrared spectrum analysis prints detection method
|
US9259821B2
(en)
|
2014-06-25 |
2016-02-16 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Chemical mechanical polishing layer formulation with conditioning tolerance
|
US20150375361A1
(en)
|
2014-06-25 |
2015-12-31 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Chemical mechanical polishing method
|
JP2016023209A
(en)
|
2014-07-17 |
2016-02-08 |
日立化成株式会社 |
Polisher, polisher set and substrate polishing method
|
US9731398B2
(en)
|
2014-08-22 |
2017-08-15 |
Rohm And Haas Electronic Materials Cmp Holding, Inc. |
Polyurethane polishing pad
|
US9826630B2
(en)
|
2014-09-04 |
2017-11-21 |
Nxp Usa, Inc. |
Fan-out wafer level packages having preformed embedded ground plane connections and methods for the fabrication thereof
|
CN106716607A
(en)
|
2014-09-05 |
2017-05-24 |
应用材料公司 |
Susceptor and pre-heat ring for thermal processing of substrates
|
CN104210108B
(en)
|
2014-09-15 |
2017-11-28 |
宁波高新区乐轩锐蓝智能科技有限公司 |
The print defect of 3D printer makes up method and system
|
US9873180B2
(en)
|
2014-10-17 |
2018-01-23 |
Applied Materials, Inc. |
CMP pad construction with composite material properties using additive manufacturing processes
|
KR20170068534A
(en)
|
2014-10-09 |
2017-06-19 |
어플라이드 머티어리얼스, 인코포레이티드 |
Chemical mechanical polishing pad with internal channels
|
US10821573B2
(en)
|
2014-10-17 |
2020-11-03 |
Applied Materials, Inc. |
Polishing pads produced by an additive manufacturing process
|
US10875145B2
(en)
|
2014-10-17 |
2020-12-29 |
Applied Materials, Inc. |
Polishing pads produced by an additive manufacturing process
|
US10399201B2
(en)
|
2014-10-17 |
2019-09-03 |
Applied Materials, Inc. |
Advanced polishing pads having compositional gradients by use of an additive manufacturing process
|
SG10202002601QA
(en)
|
2014-10-17 |
2020-05-28 |
Applied Materials Inc |
Cmp pad construction with composite material properties using additive manufacturing processes
|
TWI689406B
(en)
|
2014-10-17 |
2020-04-01 |
美商應用材料股份有限公司 |
Polishing pad and method of fabricating the same
|
US10875153B2
(en)
|
2014-10-17 |
2020-12-29 |
Applied Materials, Inc. |
Advanced polishing pad materials and formulations
|
US9776361B2
(en)
|
2014-10-17 |
2017-10-03 |
Applied Materials, Inc. |
Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
|
CN104385595B
(en)
|
2014-10-20 |
2017-05-03 |
合肥斯科尔智能科技有限公司 |
Three-dimensional printing inferior-quality product repairing system
|
JP6422325B2
(en)
|
2014-12-15 |
2018-11-14 |
花王株式会社 |
Polishing liquid composition for semiconductor substrate
|
US10086500B2
(en)
|
2014-12-18 |
2018-10-02 |
Applied Materials, Inc. |
Method of manufacturing a UV curable CMP polishing pad
|
JP6452449B2
(en)
|
2015-01-06 |
2019-01-16 |
東京エレクトロン株式会社 |
Mounting table and substrate processing apparatus
|
CN104607639B
(en)
|
2015-01-12 |
2016-11-02 |
常州先进制造技术研究所 |
A kind of surface reconditioning forming devices printed for metal 3D
|
US20170263478A1
(en)
|
2015-01-16 |
2017-09-14 |
Lam Research Corporation |
Detection System for Tunable/Replaceable Edge Coupling Ring
|
US10946495B2
(en)
|
2015-01-30 |
2021-03-16 |
Cmc Materials, Inc. |
Low density polishing pad
|
US9505952B2
(en)
|
2015-03-05 |
2016-11-29 |
Cabot Microelectronics Corporation |
Polishing composition containing ceria abrasive
|
US9475168B2
(en)
|
2015-03-26 |
2016-10-25 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Polishing pad window
|
WO2016173668A1
(en)
|
2015-04-30 |
2016-11-03 |
Hewlett-Packard Development Company, L.P. |
Misalignment detection for a 3d printing device
|
US10017857B2
(en)
|
2015-05-02 |
2018-07-10 |
Applied Materials, Inc. |
Method and apparatus for controlling plasma near the edge of a substrate
|
CN106206409B
(en)
|
2015-05-08 |
2019-05-07 |
华邦电子股份有限公司 |
Stack electronic device and its manufacturing method
|
TWI559026B
(en)
|
2015-06-24 |
2016-11-21 |
財團法人工業技術研究院 |
Anti-reflection strcuture and method of forming the same
|
CN205703794U
(en)
|
2015-06-29 |
2016-11-23 |
智胜科技股份有限公司 |
Polishing layer of polishing pad
|
US10163610B2
(en)
|
2015-07-13 |
2018-12-25 |
Lam Research Corporation |
Extreme edge sheath and wafer profile tuning through edge-localized ion trajectory control and plasma operation
|
US9761459B2
(en)
|
2015-08-05 |
2017-09-12 |
Lam Research Corporation |
Systems and methods for reverse pulsing
|
US9620376B2
(en)
|
2015-08-19 |
2017-04-11 |
Lam Research Corporation |
Self limiting lateral atomic layer etch
|
US10406801B2
(en)
|
2015-08-21 |
2019-09-10 |
Voxel8, Inc. |
Calibration and alignment of 3D printing deposition heads
|
US9984858B2
(en)
|
2015-09-04 |
2018-05-29 |
Lam Research Corporation |
ALE smoothness: in and outside semiconductor industry
|
US20170072466A1
(en)
|
2015-09-16 |
2017-03-16 |
Applied Materials, Inc. |
Selectively openable support platen for additive manufacturing
|
CN105161432A
(en)
|
2015-09-17 |
2015-12-16 |
中芯长电半导体(江阴)有限公司 |
Chip packaging method
|
US10192751B2
(en)
|
2015-10-15 |
2019-01-29 |
Lam Research Corporation |
Systems and methods for ultrahigh selective nitride etch
|
KR20230145211A
(en)
|
2015-10-16 |
2023-10-17 |
어플라이드 머티어리얼스, 인코포레이티드 |
Method and apparatus for forming advanced polishing pads using an additive manufacturing process
|
US20170115657A1
(en)
|
2015-10-22 |
2017-04-27 |
Lam Research Corporation |
Systems for Removing and Replacing Consumable Parts from a Semiconductor Process Module in Situ
|
US9881820B2
(en)
|
2015-10-22 |
2018-01-30 |
Lam Research Corporation |
Front opening ring pod
|
US10124492B2
(en)
|
2015-10-22 |
2018-11-13 |
Lam Research Corporation |
Automated replacement of consumable parts using end effectors interfacing with plasma processing system
|
US10062599B2
(en)
|
2015-10-22 |
2018-08-28 |
Lam Research Corporation |
Automated replacement of consumable parts using interfacing chambers
|
JPWO2017073654A1
(en)
|
2015-10-30 |
2018-08-16 |
コニカミノルタ株式会社 |
Actinic ray curable inkjet ink composition and inkjet recording method
|
KR20230169424A
(en)
|
2015-10-30 |
2023-12-15 |
어플라이드 머티어리얼스, 인코포레이티드 |
An apparatus and method of forming a polishing article that has a desired zeta potential
|
GB201519187D0
(en)
|
2015-10-30 |
2015-12-16 |
Knauf Insulation Ltd |
Improved binder compositions and uses thereof
|
US10593574B2
(en)
|
2015-11-06 |
2020-03-17 |
Applied Materials, Inc. |
Techniques for combining CMP process tracking data with 3D printed CMP consumables
|
US10229769B2
(en)
|
2015-11-20 |
2019-03-12 |
Xerox Corporation |
Three phase immiscible polymer-metal blends for high conductivty composites
|
US10189143B2
(en)
|
2015-11-30 |
2019-01-29 |
Taiwan Semiconductor Manufacturing Company Limited |
Polishing pad, method for manufacturing polishing pad, and polishing method
|
US9601319B1
(en)
|
2016-01-07 |
2017-03-21 |
Lam Research Corporation |
Systems and methods for eliminating flourine residue in a substrate processing chamber using a plasma-based process
|
US10391605B2
(en)
|
2016-01-19 |
2019-08-27 |
Applied Materials, Inc. |
Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
|
WO2017127221A1
(en)
|
2016-01-19 |
2017-07-27 |
Applied Materials, Inc. |
Porous chemical mechanical polishing pads
|
US10685862B2
(en)
|
2016-01-22 |
2020-06-16 |
Applied Materials, Inc. |
Controlling the RF amplitude of an edge ring of a capacitively coupled plasma process device
|
US9956314B2
(en)
|
2016-01-26 |
2018-05-01 |
Modern Ideas LLC |
Adhesive for use with bone and bone-like structures
|
US10699878B2
(en)
|
2016-02-12 |
2020-06-30 |
Lam Research Corporation |
Chamber member of a plasma source and pedestal with radially outward positioned lift pins for translation of a substrate c-ring
|
US10651015B2
(en)
|
2016-02-12 |
2020-05-12 |
Lam Research Corporation |
Variable depth edge ring for etch uniformity control
|
US10438833B2
(en)
|
2016-02-16 |
2019-10-08 |
Lam Research Corporation |
Wafer lift ring system for wafer transfer
|
US9966231B2
(en)
|
2016-02-29 |
2018-05-08 |
Lam Research Corporation |
Direct current pulsing plasma systems
|
EP3869538A1
(en)
|
2016-03-09 |
2021-08-25 |
Applied Materials, Inc. |
Correction of fabricated shapes in additive manufacturing
|
CN109075057B
(en)
|
2016-03-09 |
2023-10-20 |
应用材料公司 |
Pad structure and method of manufacture
|
US10589399B2
(en)
|
2016-03-24 |
2020-03-17 |
Applied Materials, Inc. |
Textured small pad for chemical mechanical polishing
|
US10269566B2
(en)
|
2016-04-29 |
2019-04-23 |
Lam Research Corporation |
Etching substrates using ale and selective deposition
|
KR20170127724A
(en)
|
2016-05-12 |
2017-11-22 |
삼성전자주식회사 |
Plasma processing apparatus
|
US10340171B2
(en)
|
2016-05-18 |
2019-07-02 |
Lam Research Corporation |
Permanent secondary erosion containment for electrostatic chuck bonds
|
US9852889B1
(en)
|
2016-06-22 |
2017-12-26 |
Lam Research Corporation |
Systems and methods for controlling directionality of ions in an edge region by using an electrode within a coupling ring
|
US10283330B2
(en)
|
2016-07-25 |
2019-05-07 |
Lam Research Corporation |
Systems and methods for achieving a pre-determined factor associated with an edge region within a plasma chamber by synchronizing main and edge RF generators
|
JP6791680B2
(en)
|
2016-08-09 |
2020-11-25 |
株式会社フジミインコーポレーテッド |
Surface treatment composition and cleaning method using it
|
US10259956B2
(en)
|
2016-10-11 |
2019-04-16 |
Xerox Corporation |
Curable ink composition
|
US20180100074A1
(en)
|
2016-10-11 |
2018-04-12 |
Xerox Corporation |
Ink composition for use in 3d printing
|
US20180100073A1
(en)
|
2016-10-11 |
2018-04-12 |
Xerox Corporation |
Ink composition for use in 3d printing
|
US10930535B2
(en)
|
2016-12-02 |
2021-02-23 |
Applied Materials, Inc. |
RFID part authentication and tracking of processing components
|
CN106810215B
(en)
*
|
2017-01-18 |
2022-08-16 |
重庆摩方科技有限公司 |
Preparation of ceramic slurry and 3D printing photocuring forming method
|
KR20180094428A
(en)
|
2017-02-15 |
2018-08-23 |
삼성전자주식회사 |
Chemical Mechanical Polishing (CMP) apparatus
|
US20180323042A1
(en)
|
2017-05-02 |
2018-11-08 |
Applied Materials, Inc. |
Method to modulate the wafer edge sheath in a plasma processing chamber
|
US10882160B2
(en)
|
2017-05-25 |
2021-01-05 |
Applied Materials, Inc. |
Correction of fabricated shapes in additive manufacturing using sacrificial material
|
US10967482B2
(en)
|
2017-05-25 |
2021-04-06 |
Applied Materials, Inc. |
Fabrication of polishing pad by additive manufacturing onto mold
|
JP6826955B2
(en)
|
2017-06-14 |
2021-02-10 |
東京エレクトロン株式会社 |
Plasma processing equipment and plasma processing method
|
WO2018237038A1
(en)
|
2017-06-21 |
2018-12-27 |
Carbon, Inc. |
Method of additive manufacturing
|
US10763081B2
(en)
|
2017-07-10 |
2020-09-01 |
Applied Materials, Inc. |
Apparatus and methods for manipulating radio frequency power at an edge ring in plasma process device
|
US11471999B2
(en)
|
2017-07-26 |
2022-10-18 |
Applied Materials, Inc. |
Integrated abrasive polishing pads and manufacturing methods
|
US11072050B2
(en)
|
2017-08-04 |
2021-07-27 |
Applied Materials, Inc. |
Polishing pad with window and manufacturing methods thereof
|
WO2019032286A1
(en)
|
2017-08-07 |
2019-02-14 |
Applied Materials, Inc. |
Abrasive delivery polishing pads and manufacturing methods thereof
|
JP7033907B2
(en)
|
2017-12-21 |
2022-03-11 |
東京エレクトロン株式会社 |
Plasma etching equipment and plasma etching method
|
CN111095523A
(en)
|
2018-01-22 |
2020-05-01 |
应用材料公司 |
Processing with powered edge rings
|
CN111684571A
(en)
|
2018-02-05 |
2020-09-18 |
应用材料公司 |
Piezoelectric end point indication for CMP pads for 3D printing
|
WO2019190676A1
(en)
|
2018-03-30 |
2019-10-03 |
Applied Materials, Inc. |
Integrating 3d printing into multi-process fabrication schemes
|
SG11202010448TA
(en)
|
2018-05-07 |
2020-11-27 |
Applied Materials Inc |
Hydrophilic and zeta potential tunable chemical mechanical polishing pads
|
US11201037B2
(en)
|
2018-05-28 |
2021-12-14 |
Applied Materials, Inc. |
Process kit with adjustable tuning ring for edge uniformity control
|
US10347500B1
(en)
|
2018-06-04 |
2019-07-09 |
Applied Materials, Inc. |
Device fabrication via pulsed plasma
|
US10847347B2
(en)
|
2018-08-23 |
2020-11-24 |
Applied Materials, Inc. |
Edge ring assembly for a substrate support in a plasma processing chamber
|
JP7299970B2
(en)
|
2018-09-04 |
2023-06-28 |
アプライド マテリアルズ インコーポレイテッド |
Formulations for improved polishing pads
|
JP7455825B2
(en)
|
2018-11-09 |
2024-03-26 |
アプライド マテリアルズ インコーポレイテッド |
High frequency filter system for processing chambers
|
US11289310B2
(en)
|
2018-11-21 |
2022-03-29 |
Applied Materials, Inc. |
Circuits for edge ring control in shaped DC pulsed plasma process device
|
JP7451540B2
(en)
|
2019-01-22 |
2024-03-18 |
アプライド マテリアルズ インコーポレイテッド |
Feedback loop for controlling pulsed voltage waveforms
|
US20200230781A1
(en)
|
2019-01-23 |
2020-07-23 |
Applied Materials, Inc. |
Polishing pads formed using an additive manufacturing process and methods related thereto
|
WO2020190441A1
(en)
|
2019-03-19 |
2020-09-24 |
Applied Materials, Inc. |
Hydrophobic and icephobic coating
|
US11851570B2
(en)
|
2019-04-12 |
2023-12-26 |
Applied Materials, Inc. |
Anionic polishing pads formed by printing processes
|