US20180304539A1 - Energy delivery system with array of energy sources for an additive manufacturing apparatus - Google Patents
Energy delivery system with array of energy sources for an additive manufacturing apparatus Download PDFInfo
- Publication number
- US20180304539A1 US20180304539A1 US15/809,969 US201715809969A US2018304539A1 US 20180304539 A1 US20180304539 A1 US 20180304539A1 US 201715809969 A US201715809969 A US 201715809969A US 2018304539 A1 US2018304539 A1 US 2018304539A1
- Authority
- US
- United States
- Prior art keywords
- platform
- energy sources
- support
- feed material
- additive manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
- B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/205—Means for applying layers
- B29C64/209—Heads; Nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/227—Driving means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/245—Platforms or substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/264—Arrangements for irradiation
- B29C64/277—Arrangements for irradiation using multiple radiation means, e.g. micromirrors or multiple light-emitting diodes [LED]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/227—Driving means
- B29C64/236—Driving means for motion in a direction within the plane of a layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
- B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Abstract
An additive manufacturing apparatus includes a platform, a support, an actuator coupled to at least one of the platform and the support and configured to create relative motion therebetween along a first axis such that the support scans across the platform, one or more printheads supported on the support above the platform and configured to dispense successive layers of feed material to form a polishing pad, a plurality of individually addressable energy sources supported above the platform, and a controller. The energy sources are arranged in an array that extends at least along a second axis perpendicular to the first axis and are configured to emit radiation toward the platform. The controller is configured to cause the actuator to create relative motion between the support and the platform such that the one or more printheads and the energy sources scan across the platform.
Description
- This application claims priority to U.S. Provisional Application Ser. No. 62/488,408, filed on Apr. 21, 2017, the entire disclosure of which is incorporated by reference.
- This specification relates to energy delivery systems for additive manufacturing apparatuses.
- Additive manufacturing (AM), also known as solid freeform fabrication or 3D printing, refers to a manufacturing process where three-dimensional objects are built up from successive dispensing of raw material (e.g., powders, liquids, suspensions, or molten solids) into two-dimensional layers. In contrast, traditional machining techniques involve subtractive processes in which articles are cut out from a stock material (e.g., a block of wood, plastic, composite or metal).
- A variety of additive processes can be used in additive manufacturing. Some systems use an energy source to deliver energy to feed material, e.g., a powder, to sinter or melt the feed material. Once all the selected locations on the first layer are sintered or melted and then re-solidified, a new layer of feed material is deposited on top of the completed layer, and the process is repeated layer by layer until the desired article is produced. In many of these methods, the energy source is a laser that emits an energy beam to fuse powder to form an article. Some laser-based methods melt or soften material to produce layers, e.g., selective laser melting (SLM) or direct metal laser sintering (DMLS), selective laser sintering (SLS), fused deposition modeling (FDM), while others use energy beams to cure liquid materials using different technologies, e.g. stereolithography (SLA). These processes can differ in the way layers are formed to create the finished objects and in the materials that are compatible for use in the processes.
- In one aspect, an additive manufacturing apparatus includes a platform, a support, an actuator coupled to at least one of the platform and the support and configured to create relative motion therebetween along a first axis such that the support scans across the platform, one or more printheads supported on the support above the platform and configured to dispense successive layers of feed material to form a polishing pad, a plurality of individually addressable energy sources supported above the platform, and a controller. The energy sources are arranged in an array that extends at least along a second axis perpendicular to the first axis and are configured to emit radiation toward the platform. The controller is configured to cause the actuator to create relative motion between the support and the platform such that the one or more printheads and the energy sources scan across the platform, cause the one or more printheads to dispense a layer of feed material on the platform, and operate the energy sources to apply energy to a selected region of the layer of feed material on the platform.
- Implementations may include one or more of the following features.
- Each energy source may correspond to a respective voxel of a topmost layer of feed material above the platform. The array of the energy sources may extend along the first axis. The array may extend along an entire width of a build area of the platform. The array of energy sources may extend across an area above the platform corresponding to a build area for the polishing pad. The energy sources may be supported above the platform by the support.
- The array of the energy sources may be a first array of first energy sources to emit radiation to cure an outer surface of the layer of feed material. The additive manufacturing apparatus may further include a second array of second energy sources to emit radiation to cure an interior of the layer of feed material, and the controller may be configured to operate the first energy sources to apply energy to the selected region and then operate the second energy sources to apply energy to the selected region. The first energy sources may be configured to emit radiation having a first wavelength, and the second energy sources may be configured to emit radiation have a second wavelength that is less than the first wavelength.
- The controller may be configured to control an intensity of radiation emitted by the energy sources. The controller may be configured to determine a current to be delivered to the energy sources to control the intensity of radiation emitted by the energy sources. A photodetector may generate a signal indicative of the intensity of radiation. The controller may be configured to control the intensity of radiation based on the signal such that the intensity of radiation is within a predefined range. The energy sources may include light emitting diodes (LEDs) configured to emit radiation having an intensity dependent on a current delivered to the LEDs.
- The actuator may be configured to move the platform relative to the support. The actuator is configured to move the support relative to the platform. The printhead may be movable along the second axis relative to the support.
- The controller may be configured to move the support and the one or more printheads across the platform and relative to the energy source to dispense another layer of feed material on the layer of feed material, and to operate the energy sources to apply energy to another selected region of the other layer of feed material.
- The controller is may be configured to operate the energy sources after the layer of feed material is dispensed. The controller may be configured to simultaneously activate the energy sources. The energy sources may be fixed relative to the support.
- In another aspect, an additive manufacturing apparatus may include a platform, a support, an actuator coupled to at least one of the platform and the support and configured to create relative motion therebetween along a first axis such that the support scans across the platform, one or more printheads supported on the support above the platform and configured to dispense successive layers of feed material to form a polishing pad, an energy source supported above the platform and configured to emit radiation toward the platform, a selectively addressable mask to receive the emitted radiation, and a controller. The controller is configured to cause the actuator to create relative motion between the support and the platform such that the one or more printheads and the energy sources scan across the platform, cause the one or more printheads to dispense a layer of feed material on the platform, and operate the mask to project an image toward the platform to cure a selected region of the layer of feed material on the platform.
- Advantages of the foregoing may include, but are not limited to, the following. A duration of energy exposure can be controlled at each voxel and decoupled form movement of a gantry. The energy sources form an array that enables the energy sources to emit radiation toward a larger portion of the dispensed feed material, thereby enabling the dispensed feed material to be cured more quickly while still maintaining control over curing of individual voxels.
- Furthermore, the array of energy sources can extend in a direction perpendicular to relative motion between the array and the platform supporting the dispensed material such that relative motion between the array and the platform in the perpendicular direction is not necessary for curing the dispensed feed material. The energy sources can selectively expose a layer of dispensed feed material in a single pass, and can thus increase throughput of articles to be formed by the additive manufacturing apparatus. Alternatively, if the array of energy sources does not extend in the direction perpendicular to the relative motion between the array and the platform, less motion of the energy sources in the perpendicular direction is required to expose an entire width of the layer of dispensed feed material.
- Although the array of the energy sources can emit radiation toward larger portions of the dispensed feed material, each individual energy source can precisely apply energy to a single voxel. Thus, each individual energy source can apply energy to a small number of drops of feed material, e.g., one, two, three, four drops of feed material. The feed material can thus be cured more consistently, thereby improving the resolution of the article and decreasing the likelihood of distortions caused by a single energy source that applies energy in bulk to the feed material. Furthermore, by being formed from individually controllable energy sources, each energy source of the array of the energy sources can be independently controlled to form complex geometry of an article.
- The details of one or more implementations of the subject matter described in this specification are set forth in the accompanying drawings and the description below. Other potential features, aspects, and advantages will become apparent from the description, the drawings, and the claims.
-
FIG. 1 is a schematic perspective view of an additive manufacturing apparatus. -
FIG. 2 is a schematic top view of an additive manufacturing apparatus. -
FIG. 3 is a schematic side view of an additive manufacturing apparatus including a schematic block diagram of a control system for the additive manufacturing apparatus. -
FIG. 4A is a schematic side view of a polishing station. -
FIG. 4B is a schematic side view of a polishing pad. -
FIG. 5 is a schematic front view of an example of an additive manufacturing apparatus in which a first array of energy sources is operated to emit radiation toward a platform. -
FIG. 6 is a schematic front view of the additive manufacturing apparatus ofFIG. 5 in which a second array of energy sources is operated to emit radiation toward the platform. -
FIG. 7 is a flow chart of a process to form one or more articles. -
FIG. 8 is a schematic front view of another example of an additive manufacturing apparatus in which an array of energy sources is operated to emit radiation toward a platform. -
FIG. 9 is a schematic top view of another example of an additive manufacturing apparatus. -
FIG. 10 is a schematic top view of another example of an additive manufacturing apparatus. -
FIG. 11 is a schematic top view of another example of an additive manufacturing apparatus. - Like reference numbers and designations in the various drawings indicate like elements.
- In additive manufacturing apparatuses that include an energy delivery system with a single energy source, the single energy source can be moved in multiple horizontal directions to cure different portions of the dispensed feed material. In particular, the energy source is movable across an entire width and an entire length of the build area at which the feed material is dispensed so that curing can be controlled across the entire build area. However, this movement can result in small throughput and slower process of fabricating the article.
- Multiple energy sources that can each cure a different portion of the dispensed feed material, e.g., an array of the energy sources, can facilitate quicker selective curing of the feed material dispensed on the platform by decreasing the amount of motion of the energy delivery system required to cure feed material across the entire build area, e.g., relative to single energy source energy delivery systems. The array can extending along an axis perpendicular to an axis along which relative motion of the energy sources and the platform occurs.
- Such an additive manufacturing apparatus can dispense feed materials on a platform to form an article, e.g., a polishing pad, having tight tolerances, e.g., good thickness uniformity.
- Articles formed by the additive manufacturing apparatuses described herein can include, for example, a polishing pad used for planarization of a substrate of an integrated circuit. An integrated circuit is typically formed on a substrate by the sequential deposition of conductive, semiconductive, or insulative layers on a silicon wafer. A variety of fabrication processes require planarization of a layer on the substrate. For certain applications, e.g., polishing of a metal layer to form vias, plugs, and lines in the trenches of a patterned layer, an overlying layer is planarized until the top surface of a patterned layer is exposed. In other applications, e.g., planarization of a dielectric layer for photolithography, an overlying layer is polished until a desired thickness remains over the underlying layer.
- Chemical mechanical polishing (CMP) is one accepted method of planarization. This planarization method typically requires that the substrate be mounted on a carrier head. The exposed surface of the substrate is typically placed against a rotating polishing pad. The carrier head provides a controllable load on the substrate to push it against the polishing pad. A polishing liquid, such as slurry with abrasive particles, is typically supplied to the surface of the polishing pad.
- One objective of a chemical mechanical polishing process is polishing uniformity. If different areas on the substrate are polished at different rates, then it is possible for some areas of the substrate to have too much material removed (“overpolishing”) or too little material removed (“underpolishing”). In addition to planarization, polishing pads can be used for finishing operations such as buffing.
- Some polishing pads include “standard” pads and fixed-abrasive pads. A standard pad has a polyurethane polishing layer with a durable roughened surface, and can also include a compressible backing layer. In contrast, a fixed-abrasive pad has abrasive particles held in a containment media, and can be supported on a generally incompressible backing layer.
- Polishing pads are typically made by molding, casting or sintering polyurethane materials. In the case of molding, the polishing pads can be made one at a time, e.g., by injection molding. In the case of casting, the liquid precursor is cast and cured into a cake, which is subsequently sliced into individual pad pieces. These pad pieces can then be machined to a final thickness. Grooves can be machined into the polishing surface, or be formed as part of the injection molding process.
- Referring to the examples depicted in
FIGS. 1-3 , anadditive manufacturing apparatus 100 for forming articles, e.g., polishing pads, includes at least oneplatform 102 and a printhead system supported above theplatform 102. Asupport 122 suspends theprinthead system 104 above theplatform 102. For example, as shown inFIG. 3 , theprinthead system 104 supported above theplatform 102 dispenses successive layers offeed material 106 on atop surface 108 of theplatform 102. During a manufacturing operation, the layers offeed material 106 are formed into apolishing pad 110, as shown inFIGS. 4A and 4B . - As shown in
FIG. 2 , in some implementations, theapparatus 100 includesmultiple platforms 102 a-102 c, e.g., three platforms, arranged in a linear array. However, theapparatus 100 could include more than three platforms, and the platforms could be arranged in a two-dimensional array (e.g., a rectangular array) rather than a linear array. In some implementations, theapparatus 100 is configured to produce multiple articles in thescanning direction 126 of theprinthead system 104. Each of theplatforms 102 a-102 c can support one or more articles to be formed. Theapparatus 100 includes, for example, theplatforms single platform 102 is sized to carry multiple articles, e.g., two or more polishing pads, along the X-axis. Furthermore, in some implementations, rather than having threedistinct platforms 102 a-102 c, theapparatus 100 includes a single platform to carry multiple articles. - Referring to
FIG. 2 , theprinthead system 104 includes one or more printheads that together span the build area of theplatform 102. For example, a plurality of printheads can be arranged in two or more columns to form a staggered array. In this case, thesupport 122 to which theprinthead system 104 is mounted can be horizontally movable by anactuator system 124 in only the scanning direction, i.e., along the X-axis but not the Y-axis, so that theprinthead system 104 can dispense thefeed material 106 in any portion of the build area. Thesupport 122 includes, for example, a gantry suspended on supports, e.g., tworails 125 a, that are arranged on opposite sides of theplatform 102. - In some implementations, if the printheads of the
printhead system 104 do not extend along an entire width of theplatform 102, theprinthead system 104 is movable along the Y-axis relative to theplatform 102. Theprinthead system 104 can be movably mounted to thesupport 122 so that the printheads can be repositioned to dispense feed material across the entire width of theplatform 102. Theprinthead system 104 can be moved to desired locations above theplatform 102. In some implementations, alinear actuator 124 c of theactuator system 124 is positioned on thesupport 122. Thelinear actuator 124 c is operable to move thearray 128 a of theprinthead system 104 along the Y-axis relative to thesupport 122 and relative to theplatform 102. - The article is, for example, a
polishing pad 110. The layers offeed material 106 are formed into thepolishing pad 110, for example, through a curing operation. Each layer can be cured before the next layer is dispensed. Referring toFIGS. 2 and 3 , theapparatus 100 includes an energy delivery system includingenergy sources 130 a supported above theplatform 102. In some implementations, theenergy sources 130 a are fixed to thesupport 122. As shown inFIG. 2 , theenergy sources 130 a form anarray 128 a. Theenergy sources 130 a are operated to emit radiation toward the dispensedfeed material 106 to cure selective portions of thefeed material 106, thereby forming portions of thepolishing pad 110. - The
actuator system 124 is operable to create relative motion between thesupport 122 and theplatform 102, e.g., along the X-axis as shown inFIG. 2 . Movement along the X-axis corresponds to a scanning direction of theprinthead system 104 and theenergy sources 130 a. Thesupport 122 and theplatform 102 can be configured to be immobile relative to each other along the Y-axis. Alternatively, theactuator system 124 can be configured to create relative motion between thesupport 122 and theplatform 102 along the Y-axis. - In some implementations, the
support 122 is movable in ascanning direction 126 that is along the direction of the linear array of theplatforms 102 a-102 c, e.g., the X-axis as shown inFIG. 2 . Theactuator system 124 is operable to move thesupport 122 horizontally in thescanning direction 126. For example, thesupport 122 can be coupled to arail 125 a that extends along the X-axis, and alinear actuator 124 a that is part of theactuator system 124 can drive the support along therail 125 a. - In some implementations, the
platform 102 is positioned on a conveyor operable to move the platforms along the X-axis. Theactuator system 124 includes an actuator to generate linear motion of the conveyor along the X-axis, thereby causing relative motion of theplatforms 102 and thesupport 122. Unidirectional motion of thesupport 122 or theplatform 102 along the X-axis can increase the speed of at which feedmaterial 106 is dispensed and cured. - In some implementations, as shown in
FIG. 3 , theapparatus 100 includes asensing system 112 to detect a height of theplatform 102 and/or the height of the top surface of the layers offeed material 106. Thesensing system 112 can include one or more optical sensors that measure a height of a topmost layer offeed material 106 relative to thesupport 122. Theapparatus 100 includes acontroller 116 operably connected to the different systems of theapparatus 100 to control operations of the different systems. - The
controller 116 is configured to selectively operate theactuator system 124 to create relative vertical motion between thesupport 122 and theplatform 102. For example, after each layer is dispensed, theactuator system 124 could be used to lift theprinthead system 104 by a height equal to the thickness of a deposited layer of feed material. In some cases, theactuator system 124 includes a first actuator to move thesupport 122 vertically and a second actuator to move thesupport 122 horizontally. During curing and/or dispensing, motion of thesupport 122 can be incremental or continuous. For example, thesupport 122 can be moved relative to theplatform 102 between sequential dispensing operations, between sequential curing operations, or both. Alternatively, thesupport 122 can be moved continuously while thefeed material 106 is dispensed and is cured. - In some implementations, an
actuator system 118 is operable to lower theplatform 102 after each of the layers offeed material 106 is dispensed. Thecontroller 116 operates theactuator system 118 to lower theplatform 102 by an amount equal to the height of a layer of thefeed material 106. Consequently, theapparatus 100 can maintain a constant height offset between the top surface of thefeed material 106 and theprinthead system 104 from layer-to-layer. - The
energy sources 130 a are operable to emitradiation beams 132 a toward theplatform 102 to cure dispensedfeed material 106 on theplatform 102. In some implementations, theenergy sources 130 a are arranged such that eachradiation beam 132 a is directed toward a different voxel of feed material of a topmost layer of the dispensedfeed material 106. Referring toFIG. 5 , theenergy sources 130 a are positioned such that each energy source cures a corresponding voxel of the article to be formed. Each voxel of the article to be formed can correspond to one or more drops 133 offeed material 106. Such an arrangement of theenergy sources 130 a enables theenergy sources 130 a to be selectively operated to selectively curemultiple drops 133 of thefeed material 106 extending along the Y-axis at once without requiring relative motion between thearray 128 a and theplatform 102 along the Y-axis. - The decoupling of the materials dispensing with traversing gantry motion and curing can avoid asymmetric shape formation of cured materials on each layer. A time delay between deposition and exposure can be timed to allow droplets to ‘reshape’ to semi-spherical morphology before curing energy is applied.
- Between sequential operations of the
energy sources 130 a, theenergy sources 130 a are repositioned to cure a different set of voxels. For example, theenergy sources 130 a can be operated to cure a first set ofdrops 133, and then can be repositioned to cure a second set of voxels offset from the first set ofdrops 133 along the X-axis. As described herein, theenergy sources 130 a can be moved relative to theplatform 102 along the X-axis and, in some implementations, along the Y-axis. In this regard, the second set of voxels alternatively can be offset from the first set ofdrops 133 along the Y-axis. - The
array 128 a of theenergy sources 130 a extends along the Y-axis, e.g., in a direction perpendicular to the direction of relative motion of theplatform 102 and thesupport 122. In some implementation, thearray 128 a of theenergy sources 130 a is a linear array, e.g., it extend only along the Y-axis. - In some implementations, referring to
FIGS. 2 and 5 , thearray 128 a of theenergy sources 130 a extends across an entire width of ausable build area 131 on theplatform 102. Thesupport 122 is scanned along the X-axis so that theenergy sources 130 a can selectively cure thefeed material 106 across the entireusable build area 131 of theplatform 102. - In some implementations, the
energy sources 130 a are mounted on and movable with thesupport 122 as thesupport 122 is moved along a horizontal plane above theplatform 102. For example, theenergy sources 130 a can be fixed to thesupport 122. In this regard, theprinthead system 104 and thearray 128 a ofenergy sources 130 a are movable relative to theplatform 102 together when thelinear actuator 124 a is operated to drive thesupport 122. - Alternatively, in some cases, the
energy sources 130 a are mounted to a support separate from thesupport 122. For example, theenergy sources 130 a can be mounted on a wall of theapparatus 100 and remain fixed as thesupport 122 is moved. If theenergy sources 130 a are supported on thesupport 122 supporting theprinthead system 104, thesupport 122 is movable along the X-axis to generate the motion of theenergy sources 130 a in thescanning direction 126. If theenergy sources 130 a are separately mounted, theactuator system 124 includes an actuator, in addition to thelinear actuator 124 a, configured to cause theenergy sources 130 a to scan in thescanning direction 126. - Alternatively, the
array 128 a of theenergy sources 130 a extends across a portion of an entire width of theplatform 102. If theenergy sources 130 a do not extend along an entire width of theplatform 102, thearray 128 a of theenergy sources 130 a are movable along the Y-axis so that theenergy sources 130 a can be repositioned to cure feed material dispensed along any portion of the entire width of the build area or theplatform 102. In some implementations, alinear actuator 124 b of theactuator system 124 is positioned on thesupport 122. Thelinear actuator 124 b is operable to move thearray 128 a of theenergy sources 130 a along the Y-axis relative to thesupport 122 and relative to theplatform 102. - During the curing process, the
linear actuator 124 b is operated to advance thearray 128 a of theenergy sources 130 a along the Y-axis a distance equal to a length of thedrops 133 offeed material 106 that can be simultaneously cured by theenergy sources 130 a. For example, if eachenergy source 130 a cures acorresponding drop 133 offeed material 106, the number ofdrops 133 defining the distance that thearray 128 a is advanced along the Y-axis is substantially equal to the number ofenergy sources 130 a. In some cases, eachenergy source 130 a cures two ormore drop 133. In such examples, the distance that the array 128 is advanced along the Y-axis between sequential emitting operations of theenergy sources 130 a is equal to the number ofdrops 133 cured by eachenergy source 130 a times the number ofenergy sources 130 a extending along the Y-axis. Theenergy sources 130 a emit radiation to cure a first set of drops offeed material 106, advance along the Y-axis, emit radiation to cure a second set of drops offeed material 106, and continue these steps until thearray 128 a of the energy sources scans across an entire width of thebuild area 131. - In some implementations, the
array 128 a of theenergy sources 130 a extends along a direction of motion of theplatform 102, e.g., along the X-axis. If each of theenergy sources 130 a corresponds to a single different voxel, theenergy sources 130 a are thus capable of curing multiple voxels extending along the X-axis. As a result, a number of increments of relative motion between thesupport 122 and theplatform 102 along the X-axis to cause theenergy sources 130 a to scan across an entire length of theplatform 102 can be decreased. - In some implementations, the
array 128 a extends along both the X-axis and Y-axis. For example, thearray 128 a can form a rectangular array in which theenergy sources 130 a are arranged in parallel rows and columns. Alternatively, adjacent columns ofenergy sources 130 a are staggered relative to one another, or adjacent rows ofenergy sources 130 a are staggered relative to one another. - In some implementations, the
array 128 a extends along the X-axis and Y-axis such that thearray 128 a extends across the entireusable build area 131 for the article. During relative motion of theplatform 102 and thesupport 122, theplatform 102 is positioned relative to thearray 128 a such that thebuild area 131 is beneath thearray 128 a ofenergy sources 130 a and such that theenergy sources 130 a can direct radiation toward any portion of thebuild area 131. Theenergy sources 130 a can then be selectively operated to selectively cure portions of thefeed material 106 dispensed in any portion of thebuild area 131. In such examples, thearray 128 a can selectively cure the feed material in an entire layer. - Referring to
FIGS. 2, 5, and 6 , in some implementations, thearray 128 a of theenergy sources 130 a corresponds to afirst array 128 a offirst energy sources 130 a, and theapparatus 100 further includes asecond array 128 b ofsecond energy sources 130 b. Thesecond array 128 b can have an arrangement of thesecond energy sources 130 b similar to the arrangement of thefirst array 128 a described herein. During dispensing operations, the controller 116 (shown inFIG. 3 ) operates theprinthead system 104 to dispense, referring toFIG. 5 , thedrops 133 offeed material 106 on theplatform 102. - As shown in
FIG. 5 , thedrops 133 offeed material 106 each includes anexterior surface 148 and aninterior volume 150. After operating theprinthead system 104 to dispense thedrops 133 offeed material 106, thecontroller 116 operates theenergy sources 130 a to emit the radiation beams 132 a toward thedrop 133 offeed material 106 to initiate curing of theexterior surfaces 148 of thedrops 133 offeed material 106. This initial curing of theexterior surface 148 can stabilize the drop offeed material 106 corresponding to adrop 133 so as to inhibit motion of thefeed material 106. - Referring to
FIG. 6 , thecontroller 116 then operates theenergy sources 130 b to emit the radiation beams 132 b toward thedrops 133 offeed material 106. The radiation beams 132 b cure theinterior volumes 150 of thedrops 133 offeed material 106. In this regard, thesecond energy sources 130 b differ from thefirst energy sources 130 a in that thefirst energy sources 130 a are operated to cure theexterior surfaces 148 of thedrops 133 while thesecond energy sources 130 b are operated to cure theinterior volumes 150 of thedrops 133 offeed material 106. Theenergy sources 130 b can emitradiation beams 132 b to complete the curing process of the drop offeed material 106 by curing theinterior volume 150 of thedrops 133 offeed material 106. - In some implementations, the radiation beams 132 a emitted by the
first energy sources 130 a have a wavelength less than a wavelength of the radiation beams 132 b emitted by thesecond energy sources 130 b. Theenergy sources radiation beam 132 a is, for example, a shorter UV wavelength between 250 nm and 365 nm, while the wavelength of theradiation beam 132 b is a longer UV wavelength between 365 nm and 450 nm. The high energy of the short UV wavelength of theradiation beam 132 a enables it to quickly cure theexterior surface 148 of thedrop 133 of feed material to stabilize thefeed material 106. In contrast, the lower energy of the longer UV wavelength of theradiation beam 132 b enables it to more uniformly cure theinterior volume 150 of thedrop 133 of feed material. - In some implementations, the
controller 116 operates theenergy sources drops 133 offeed material 106 are simultaneously exposed to both of the radiation beams 132 a, 132 b. Theenergy sources support 122 such that theenergy sources feed material 106 to both the radiation beams 132 a, 132 b. - If the
printhead system 104 is movable across theplatform 102, e.g., theprinthead system 104 is mounted on the horizontallymovable support 122, theenergy sources printhead system 104 in thescanning direction 126. In this regard, during a manufacturing operation, thecontroller 116 operates theprinthead system 104 to dispense feed material. Thecontroller 116 then operates theactuator system 124 to scan thesupport 122 holding theprinthead system 104 and theenergy sources scanning direction 126. The increment is sufficiently large to reposition theenergy sources printhead system 104. In this regard, theenergy sources - In some implementations, the
drops 133 offeed material 106 are exposed to the radiation beams 132 a, 132 b sequentially. Theenergy source 130 b is, for example, positioned behind theenergy source 130 a along the scanning direction (i.e., the X-axis). Theenergy sources drops 133 offeed material 106 are exposed to only one of the radiation beams 132 a, 132 b at a time. In this regard, theenergy sources feed material 106, in some cases, are exposed to theradiation beam 132 a first such that thedrops 133 offeed material 106 are stabilized and then are exposed to theradiation beam 132 b to complete the curing process of theinterior volume 150. -
FIG. 7 illustrates anexample process 300 to form an article, e.g., a polishing pad. For example, theapparatus 100, including thecontroller 116, can execute operations of theprocess 300. - At an
operation 302, relative motion between thesupport 122 and theplatform 102 is generated. For example, one or more linear actuators, e.g., of theactuator system 124, can be operated by thecontroller 116 to generate the relative motion. The relative motion is controlled so that theprinthead system 104 can be repositioned to a target location wherefeed material 106 is to be dispensed and so that thearray 128 a of theenergy sources 130 a can be repositioned to a target location where thefeed material 106 is to be cured. - At
operation 304, referring also toFIG. 5 , alayer 140 offeed material 106 is dispensed on theplatform 102. For example, theprinthead system 104 can be operated by thecontroller 116 to dispense thefeed material 106. If theprinthead system 104 does not extend across an entire width of thebuild area 131 and is movable relative to thesupport 122, in some implementations, atoperation 304, theprinthead system 104 scans along the Y-axis to dispensefeed material 106 along the entire width of thebuild area 131. - At
operation 306, as shown inFIG. 5 , energy is applied to one or more selectedregions 142 of the layer offeed material 106. For example, the energy can be applied by theenergy sources 130 a. Thecontroller 116 is configured to individually address each of theenergy sources 130 a such that theenergy sources 130 a can be selectively operated to apply energy to the selectedregions 142. - If the
array 128 a extends across an entirety of thebuild area 131, e.g., an entire width and an entire length of thebuild area 131, the selective curing of thelayer 140 is complete after theoperation 306, and a subsequent layer can be dispensed on top of thelayer 140.Operations process 300 can be repeated to form a new article. For example, atoperation 302, the relative motion between thesupport 122 and theplatform 102 is generated to advance thesupport 122 relative to the platform 102 a to another build area, e.g., of theplatform 102 b, for the new article to be fabricated.Operations feed material 106 to form the new article on theplatform 102 b. - In some implementations, prior to application of the energy to the selected
region 142, further relative motion between thesupport 122 and theplatform 102 is generated. For example, theprinthead system 104 can be positioned relative to thearray 128 a ofenergy sources 130 a such that thearray 128 a is positioned to direct radiation toward a set of drops offeed material 106 offset from the drops of feed material dispensed atoperation 304. Further relative motion between thesupport 122 and theplatform 102 enables thearray 128 a to direct radiation toward the most recently dispensedfeed material 106. - In some implementations, rather than an entire layer being dispensed on the
platform 102 atoperation 304, a portion of thelayer 140 is dispensed. For example, a line offeed material 106 can be dispensed on theplatform 102, and then theenergy sources 130 a can apply energy to the line offeed material 106 dispensed. Whileoperation 304 is being performed to dispense thelayer 140 offeed material 106 on theplatform 102,operation 306 is being performed to apply the energy to selected portions of dispensed feed material. Between sequential dispensing operations, theplatform 102 and thesupport 122 are moved relative to one another to enable thefeed material 106 to be dispensed at a new location on theplatform 102 and to enable the energy to be applied to a new selected portion of the dispensedfeed material 106. Theplatform 102 and thesupport 122 are incrementally moved relative to one another such that thefeed material 106 is dispensed and thefeed material 106 is cured when the motion has stopped. The selected portions, when combined, form the selectedregions 142 of cured feed material. - Alternatively, rather than being moved relative to one another between sequential dispensing operations, the
platform 102 and thesupport 122 are moved relative to one another continuously during the dispensing offeed material 106 and applying of energy inoperations feed material 106 is dispensed and the energy is applied while theplatform 102 and thesupport 122 are continuously in motion to advance theplatform 102 relative to thesupport 122. - Alternatively, the
array 128 a can be positioned such that no further movement is required to cure thefeed material 106 dispensed atoperation 304. Theprinthead system 104 can be moved about theplatform 102 to dispense thefeed material 106, and theenergy sources 130 a cure thefeed material 106 after an entire layer is dispensed. - In some implementations, the energy applied to the selected
region 142 includes energy in the form of first radiation beams emitted by thefirst energy sources 130 a and energy in the form of second radiation beams emitted by thesecond energy sources 130 b. - In some implementations, the
controller 116 is configured to control an intensity of radiation emitted by theenergy sources 130 a. Rather than selectively controlling activation of deactivation of theenergy sources 130 a, thecontroller 116 modulates the intensity of emitted radiation such that the amount of the energy imparted to thedrops 133 offeed material 106 can be precisely controlled. For example, the amount of the energy to be imparted to thefeed material 106 to cure the feed material can depend on the type offeed material 106 being dispensed. - In some implementations, the
controller 116 determines an amount of current to be delivered to theenergy sources 130 a and/or theenergy sources 130 b to control the intensity of the radiation emitted by theenergy sources 130 a and/or theenergy sources 130 b. The amount of current can be proportional the intensity of the radiation. The energy sources can include, for example, light emitting diodes (LEDs), configured to emit radiation having an intensity dependent on a current delivered to the LEDs. The energy sources can also include, for example, an array of lasers, e.g., laser diodes. - In some implementations, the
controller 116 controls the intensity of the radiation using feedback control. Thecontroller 116 receives a signal indicative of the intensity of the radiation being delivered and implements a feedback control process to ensure that the intensity is within a predefined desired range. The signal is generated by, for example, a photodetector positioned along a path of the radiation beam. In some cases, each of theenergy sources 130 a emits radiation received by a corresponding photodetector such that the radiation emitted by each of theenergy sources 130 a can be precisely controlled. - Referring to
FIG. 8 , in some implementations, rather than selectively operating theenergy sources energy sources region 142 is cured. In some cases, abulk energy source 146 is operated to generate radiation directed toward theplatform 102. Thebulk energy source 146 can include, for example, a lamp or LED array. Theapparatus 100 includes a selectivelyaddressable mask 144 to block the radiation from theenergy sources bulk energy source 146. Themask 144 is selectively controlled so that an image corresponding to the selectedregion 142 is projected through the mask. Thecontroller 116 operates themask 144 in a manner to allow the radiation to pass through some portions of themask 144 and to prevent the radiation from passing through other portions of themask 144, thereby causing the selectedregion 142 of thelayer 140 offeed material 106 to be cured. Thebulk energy source 146 can be a first bulk energy source configured to emit radiation to cure theexterior surfaces 148 of thedrops 133 offeed material 106, and a second bulk energy source is configured to emit radiation to cure theinterior volumes 150 of thedrops 133 offeed material 106. - The
polishing pad 110 is formed from a predetermined number of layers of feed material being dispensed and cured. In an example of apolishing pad 110 depicted inFIG. 3B , thepolishing pad 110 is a multi-layer pad. Thepolishing pad 110, for example, includes apolishing layer 156 and abacking layer 158. Thepolishing layer 156 is formed of a material that is, for instance, inert when thepolishing pad 110 is used to polish a substrate. The material of thepolishing layer 156 can be a plastic, e.g., a polyurethane. In some implementations, thepolishing layer 156 is a relative durable and hard material. Thepolishing layer 156 has a hardness of, for example, about 40 to 80, e.g., 50 to 65, on the Shore D scale. - In some implementations, the
polishing layer 156 is layer of homogeneous composition. Thepolishing layer 156 can includepores 157 suspended in amatrix 159 of plastic material, e.g., polyurethane. Thepores 157 can be provided by hollow micro-spheres suspended in thematrix 159, or by voids in thematrix 159 itself. - In some implementations the
polishing layer 156 includes abrasive particles held in thematrix 159 of plastic material, e.g., within thepores 157. The abrasive particles are harder than the material of thematrix 159. The material of the abrasive particles can be a metal oxide, such as ceria, alumina, silica or a combination thereof. - In some implementations, the
polishing layer 156 has a thickness D1 of 80 mils or less, e.g., 50 mils or less, e.g., 25 mils or less. Because the conditioning process tends to wear away the cover layer, the thickness of thepolishing layer 156 can be selected to provide thepolishing pad 110 with a useful lifetime, e.g., 1000 polishing and conditioning cycles. - In some implementations, the
polishing layer 156 includesgrooves 160 for carrying slurry. Thegrooves 160 form a pattern, such as, for example, concentric circles, straight lines, a cross-hatched, spirals, and the like. If grooves are present, the plateaus between thegrooves 160 are, for example, approximately 25-90% of the total horizontal surface area of thepolishing pad 110. Thegrooves 160 occupy, for example, approximately 10%-75% of the total horizontal surface area of thepolishing pad 110. The plateaus between thegrooves 160 can have a lateral width of about 0.1 to 2.5 mm. - In some implementations, e.g., if there is a
backing layer 158, thegrooves 160 extend entirely through thepolishing layer 156. In some implementations, thegrooves 160 extend through about 20-80%, e.g., 40%, of the thickness of thepolishing layer 156. The depth of thegrooves 160 is, for example, 0.25 to 1 mm. In some cases, for example, in apolishing pad 110 having apolishing layer 156 that is 50 mils thick, thegrooves 160 have a depth D2 of about 20 mils. - In some implementations, the
backing layer 158 are softer and more compressible than thepolishing layer 156. Thebacking layer 158 has, for instance, a hardness of 80 or less on the Shore A scale, e.g., a hardness of about have a hardness of 60 Shore A. Thebacking layer 158, in some cases, is thicker or thinner or the same thickness as thepolishing layer 156. - The
polishing pad 110 can be used to polish one or more substrates at a polishing apparatus. A description of a suitable polishing apparatus can be found in U.S. Pat. No. 5,738,574. In some implementations, referring toFIG. 4A , apolishing system 200 includes arotatable platen 204 on which thepolishing pad 110 is placed. During a polishing operation, a polishingliquid 206, e.g., an abrasive slurry, is dispensed on the surface of thepolishing pad 110 by a polishing liquid supply port, which can be combined with a rinsearm 208. The polishingliquid 206, in some cases, contains abrasive particles, a pH adjuster, or chemically active components. - In some implementations, to polish a
substrate 210, thesubstrate 210 is held against thepolishing pad 110 by acarrier head 212. Thecarrier head 212 is suspended from a support structure, such as a carousel, and is connected by acarrier drive shaft 214 to a carrier head rotation motor so that the carrier head can rotate about anaxis 216. The relative motion of thepolishing pad 110 and thesubstrate 210 in the presence of the polishing liquid 206 results in polishing of thesubstrate 210. - The controller, e.g., the
controller 116, can be implemented in digital electronic circuitry, or in computer software, firmware, or hardware, or in combinations of them. The controller can include one or more computer program products, i.e., one or more computer programs tangibly embodied in an information carrier, e.g., in a non-transitory machine readable storage medium or in a propagated signal, for execution by, or to control the operation of, data processing apparatus, e.g., a programmable processor, a computer, or multiple processors or computers. A computer program (also known as a program, software, software application, or code) can be written in any form of programming language, including compiled or interpreted languages, and it can be deployed in any form, including as a standalone program or as a module, component, subroutine, or other unit suitable for use in a computing environment. A computer program can be deployed to be executed on one computer or on multiple computers at one site or distributed across multiple sites and interconnected by a communication network. - The processes and logic flows described in this specification can be performed by one or more programmable processors executing one or more computer programs to perform functions by operating on input data and generating output. The processes and logic flows can also be performed by, and apparatus can also be implemented as, special purpose logic circuitry, e.g., an FPGA (field programmable gate array) or an ASIC (application specific integrated circuit).
- The
controller 116 and other computing devices part of systems described can include non-transitory computer readable medium to store a data object, e.g., a computer aided design (CAD)-compatible file that identifies the pattern in which the feed material should be formed for each layer. For example, the data object could be a STL-formatted file, a 3D Manufacturing Format (3MF) file, or an Additive Manufacturing File Format (AMF) file. In addition, the data object could be other formats such as multiple files or a file with multiple layer in tiff, jpeg, or bitmap format. For example, the controller could receive the data object from a remote computer. A processor in thecontroller 116, e.g., as controlled by firmware or software, can interpret the data object received from the computer to generate the set of signals necessary to control the components of theapparatus 100 to deposit and/or cure each layer in the desired pattern. - A number of implementations have been described. Nevertheless, it will be understood that various modifications may be made.
- Thickness of each layer of the layers of feed material and size of each of the voxels may vary from implementation to implementation. In some implementations, when dispensed on the
platform 102, each voxel can have a width of, for example, 10 μm to 50 μm (e.g., 10 μm to 30 μm, 20 μm to 40 μm, 30 μm to 50 μm, approximately 20 μm, approximately 30 μm, or approximately 50 μm). Each layer can have a predetermined thickness. The thickness can be, for example, 0.10 μm to 125 μm (e.g., 0.1 μm to 1 μm, 1 μm to 10 μm, 10 μm to 20 μm, 10 μm to 40 μm, 40 μm to 80 μm, 80 μm to 125 μm, approximately 15 μm, approximately 25 μm, approximately 60 μm, or approximately 100 μm). - In some examples, the
additive manufacturing apparatus 100 includes 1, 2, or 3 printheads have been described. Alternatively, theapparatus 100 includes four or more printheads. Each of the printheads is, for example, mounted onto thesupport 122. The printheads are thus movable as a unit across theplatform 102. In some cases, theapparatus 100 includes 8 or more printheads, e.g., 8 printheads, 12 printheads, etc. that are aligned along thescanning direction 126. In one example, 4 of the printheads dispense a first feed material, e.g., feed material A, 2 of the printheads dispense a second feed material, e.g., feed material B, and 2 of the printheads dispense a third feed material, e.g., feed material C. - While columns of the
energy sources 130 a are shown as alternating with columns of theenergy sources 130 b, in some implementations, thearray 128 a and thearray 130 a do not overlap. Thearray 128 a of theenergy sources 130 a is positioned between theprinthead system 104 and thearray 130 a. In this regard, theprinthead system 104 dispenses thefeed material 106, relative motion between thesupport 122 and theplatform 102 is generated, and theenergy sources 130 a then cure theouter surfaces 148 of thefeed material 106. Further relative motion between thesupport 122 and theplatform 102 is generated, and then theenergy sources 130 b cure theinterior volumes 150 of thefeed material 106. - Although
FIG. 2 illustrates the array 128 ofenergy sources 130 extending along the Y-axis and spanning the width of the useable build area, as shown inFIG. 9 it would also be possible for the array of energy sources to extend along the X-axis, i.e., parallel to the direction along which theplatforms 102 are arranged. In this case, the array 128 of energy sources can span the length (along the X-axis) of the usable build platform or region where the object is to be fabricated. In addition, the array 128 ofenergy sources 130 can be positioned on a sub-support 122 a that is mounted on thesupport 122, e.g., below thesupport 122. The sub-support 122 a can be configured to move along the Y-axis, e.g., by theactuator 124 c, so as to scan the energy sources along the Y-axis direction. In this case, after each layer of deposition, array 128 ofenergy sources 130 will move in the Y-axis direction (front to back or back to front) to selectively cure the deposited layer. - In addition, although
FIG. 2 illustrates thesecond array 128 b ofsecond energy sources 130 b as secured to thesupport 122 and in a fixed position relative to thefirst array 128 a (e.g., moving with thefirst array 128 a as the support moves), this is not necessary. For example, as shown inFIG. 10 , thefirst array 128 a can extend along the Y-axis (and be moved by the gantry along the Y-axis). Thesecond array 128 b can extend along the X-axis (and be moved along the Y-axis on the sub-support 122 a). Alternatively, thesecond array 128 b could be on a separate support from thegantry 122. Again, thesecond array 128 b could extend along the X-axis (and be moved along the Y-axis on by the separate support 122). - Referring to
FIG. 11 , As yet another alternative, thesecond array 128 b is a 2-dimensional array that spans the entire usable width and length of the platform, but is immobile relative to the platform. Thesecond array 128 b can be held on asupport 122 b positioned above the location where thesupport 122 will scan. - In these various implementations, the shorter wavelength energy source can ride with printhead array, e.g., on the
support 122, whereas the longer wavelength source can span the entire platform or rides along the Y-axis direction. This permits the shorter wavelength energy source to be in close proximity and/or driven with the dispenser such that deposited droplets can be fixed onto the underlying layer or platform to provide a controlled cured morphology surface texture. In contrast, bulk cure can be performed by a different curing source within the system. - Although the apparatus has been described in the context of fabrication of a polishing pad, the apparatus can be adapted for fabrication of other articles by additive manufacturing.
- Accordingly, other implementations are within the scope of the claims.
Claims (20)
1. An additive manufacturing apparatus comprising:
a platform;
a support;
an actuator coupled to at least one of the platform and the support and configured to create relative motion therebetween along a first axis such that the support scans across the platform;
one or more printheads supported on the support above the platform and configured to dispense successive layers of feed material to form a polishing pad;
a plurality of individually addressable energy sources supported above the platform, the energy sources arranged in an array that extends at least along a second axis perpendicular to the first axis and configured to emit radiation toward the platform; and
a controller configured to
cause the actuator to create relative motion between the support and the platform such that the one or more printheads and the energy sources scan across the platform,
cause the one or more printheads to dispense a layer of feed material on the platform, and
operate the energy sources to apply energy to a selected region of the layer of feed material on the platform.
2. The additive manufacturing apparatus of claim 1 , wherein the energy sources each correspond to a voxel of a topmost layer of feed material above the platform.
3. The additive manufacturing apparatus of claim 1 , wherein the array of the energy sources extends along the first axis.
4. The additive manufacturing apparatus of claim 1 , wherein the array extends along an entire width of a build area of the platform.
5. The additive manufacturing apparatus of claim 1 , wherein the array of the energy sources extends across an area above the platform corresponding to a build area for the polishing pad.
6. The additive manufacturing apparatus of claim 1 , wherein the energy sources are supported above the platform by the support.
7. The additive manufacturing apparatus of claim 1 , wherein:
the array of the energy sources is a first array of first energy sources to emit radiation to cure an outer surface of the layer of feed material,
the additive manufacturing apparatus further comprises a second array of second energy sources to emit radiation to cure an interior of the layer of feed material, and
the controller is configured to operate the first energy sources to apply energy to the selected region and then operate the second energy sources to apply energy to the selected region.
8. The additive manufacturing apparatus of claim 7 , wherein the first energy sources are configured to emit radiation having a first wavelength, and the second energy sources are configured to emit radiation have a second wavelength, the second wavelength being less than the first wavelength.
9. The additive manufacturing apparatus of claim 1 , wherein the controller is configured to control an intensity of radiation emitted by the energy sources.
10. The additive manufacturing apparatus of claim 9 , wherein the controller is configured to determine a current to be delivered to the energy sources to control the intensity of radiation emitted by the energy sources.
11. The additive manufacturing apparatus of claim 9 , further comprising a photodetector to generate a signal indicative of the intensity of radiation, wherein the controller is configured to control the intensity of radiation based on the signal such that the intensity of radiation is within a predefined range.
12. The additive manufacturing apparatus of claim 1 , wherein the energy sources include light emitting diodes (LEDs) configured to emit radiation having an intensity dependent on a current delivered to the LEDs.
13. The additive manufacturing apparatus of claim 1 , wherein the actuator is configured to move the platform relative to the support.
14. The additive manufacturing apparatus of claim 1 , wherein the actuator is configured to move the support relative to the platform.
15. The additive manufacturing apparatus of claim 1 , wherein the printhead is movable along the second axis relative to the support.
16. The additive manufacturing apparatus of claim 1 , wherein the controller is configured to
move the support and the one or more printheads across the platform and relative to the energy source to dispense another layer of feed material on the layer of feed material, and
operate the energy sources to apply energy to another selected region of the other layer of feed material.
17. The additive manufacturing apparatus of claim 1 , wherein the controller is configured to operate the energy sources after the layer of feed material is dispensed.
18. The additive manufacturing apparatus of claim 1 , wherein the controller is configured to simultaneously activate the energy sources.
19. The additive manufacturing apparatus of claim 1 , wherein the energy sources are fixed relative to the support.
20. An additive manufacturing apparatus comprising:
a platform;
a support;
an actuator coupled to at least one of the platform and the support and configured to create relative motion therebetween along a first axis such that the support scans across the platform;
one or more printheads supported on the support above the platform and configured to dispense successive layers of feed material to form a polishing pad;
an energy source supported above the platform, the energy source being configured to emit radiation toward the platform;
a selectively addressable mask to receive the emitted radiation; and
a controller configured to
cause the actuator to create relative motion between the support and the platform such that the one or more printheads and the energy sources scan across the platform,
cause the one or more printheads to dispense a layer of feed material on the platform, and
operate the mask to project an image toward the platform to cure a selected region of the layer of feed material on the platform.
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/809,969 US20180304539A1 (en) | 2017-04-21 | 2017-11-10 | Energy delivery system with array of energy sources for an additive manufacturing apparatus |
TW107112496A TW201841775A (en) | 2017-04-21 | 2018-04-12 | Energy delivery system with array of energy sources for an additive manufacturing apparatus |
CN201880026468.4A CN110545987A (en) | 2017-04-21 | 2018-04-13 | Energy transfer system with array of energy sources for additive manufacturing apparatus |
JP2019556803A JP7086101B2 (en) | 2017-04-21 | 2018-04-13 | Energy delivery system with an array of energy sources for additional manufacturing equipment |
PCT/US2018/027619 WO2018194935A1 (en) | 2017-04-21 | 2018-04-13 | Energy delivery system with array of energy sources for an additive manufacturing apparatus |
DE112018002088.6T DE112018002088T5 (en) | 2017-04-21 | 2018-04-13 | Power supply system with an arrangement of energy sources for an additive manufacturing device |
KR1020197033948A KR102450927B1 (en) | 2017-04-21 | 2018-04-13 | Energy Delivery System with Array of Energy Sources for Additive Manufacturing Apparatus |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762488408P | 2017-04-21 | 2017-04-21 | |
US15/809,969 US20180304539A1 (en) | 2017-04-21 | 2017-11-10 | Energy delivery system with array of energy sources for an additive manufacturing apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
US20180304539A1 true US20180304539A1 (en) | 2018-10-25 |
Family
ID=63852975
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/809,965 Expired - Fee Related US10596763B2 (en) | 2017-04-21 | 2017-11-10 | Additive manufacturing with array of energy sources |
US15/809,969 Abandoned US20180304539A1 (en) | 2017-04-21 | 2017-11-10 | Energy delivery system with array of energy sources for an additive manufacturing apparatus |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/809,965 Expired - Fee Related US10596763B2 (en) | 2017-04-21 | 2017-11-10 | Additive manufacturing with array of energy sources |
Country Status (7)
Country | Link |
---|---|
US (2) | US10596763B2 (en) |
JP (1) | JP7086101B2 (en) |
KR (1) | KR102450927B1 (en) |
CN (1) | CN110545987A (en) |
DE (1) | DE112018002088T5 (en) |
TW (1) | TW201841775A (en) |
WO (1) | WO2018194935A1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10596763B2 (en) | 2017-04-21 | 2020-03-24 | Applied Materials, Inc. | Additive manufacturing with array of energy sources |
CN111347674A (en) * | 2020-03-30 | 2020-06-30 | 上海市黄浦区劳动技术教育中心 | Electromagnetic matrix printer |
WO2021108634A1 (en) * | 2019-11-26 | 2021-06-03 | Lubbe Steven | Devices, systems, and methods for 3d printing |
US11931824B2 (en) * | 2019-01-23 | 2024-03-19 | Vulcanforms Inc. | Laser control systems for additive manufacturing |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111531880A (en) * | 2020-04-03 | 2020-08-14 | 湖南大学 | Multimode multi-material photocuring 3D printing equipment |
CN112238606A (en) * | 2020-09-30 | 2021-01-19 | 武汉岩硕科技有限公司 | Multi-nozzle 3D printing control system and method |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070182782A1 (en) * | 2003-01-16 | 2007-08-09 | Silverbrook Research Pty Ltd | Printer system for developing a 3-d product |
US20160236279A1 (en) * | 2013-09-23 | 2016-08-18 | Renishaw Plc | Additive manufacturing apparatus and method |
US20170008126A1 (en) * | 2014-02-06 | 2017-01-12 | United Technologies Corporation | An additive manufacturing system with a multi-energy beam gun and method of operation |
US20190001570A1 (en) * | 2015-10-16 | 2019-01-03 | Hewlett-Packard Development Company, L.P. | Build material supply for additive manufacturing |
Family Cites Families (207)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3741116A (en) | 1970-06-25 | 1973-06-26 | American Screen Process Equip | Vacuum belt |
US4575330A (en) | 1984-08-08 | 1986-03-11 | Uvp, Inc. | Apparatus for production of three-dimensional objects by stereolithography |
US4942001A (en) | 1988-03-02 | 1990-07-17 | Inc. DeSoto | Method of forming a three-dimensional object by stereolithography and composition therefore |
US4844144A (en) | 1988-08-08 | 1989-07-04 | Desoto, Inc. | Investment casting utilizing patterns produced by stereolithography |
US5121329A (en) | 1989-10-30 | 1992-06-09 | Stratasys, Inc. | Apparatus and method for creating three-dimensional objects |
US5387380A (en) | 1989-12-08 | 1995-02-07 | Massachusetts Institute Of Technology | Three-dimensional printing techniques |
DE3942859A1 (en) | 1989-12-23 | 1991-07-04 | Basf Ag | METHOD FOR PRODUCING COMPONENTS |
US5626919A (en) | 1990-03-01 | 1997-05-06 | E. I. Du Pont De Nemours And Company | Solid imaging apparatus and method with coating station |
US5257478A (en) | 1990-03-22 | 1993-11-02 | Rodel, Inc. | Apparatus for interlayer planarization of semiconductor material |
US5096530A (en) | 1990-06-28 | 1992-03-17 | 3D Systems, Inc. | Resin film recoating method and apparatus |
US5212910A (en) | 1991-07-09 | 1993-05-25 | Intel Corporation | Composite polishing pad for semiconductor process |
US6099394A (en) | 1998-02-10 | 2000-08-08 | Rodel Holdings, Inc. | Polishing system having a multi-phase polishing substrate and methods relating thereto |
MY114512A (en) | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
US5906863A (en) | 1994-08-08 | 1999-05-25 | Lombardi; John | Methods for the preparation of reinforced three-dimensional bodies |
JPH0950974A (en) | 1995-08-07 | 1997-02-18 | Sony Corp | Polishing cloth and manufacture of semiconductor device |
US5605760A (en) | 1995-08-21 | 1997-02-25 | Rodel, Inc. | Polishing pads |
JPH0976353A (en) | 1995-09-12 | 1997-03-25 | Toshiba Corp | Optical shaping apparatus |
US5738574A (en) | 1995-10-27 | 1998-04-14 | Applied Materials, Inc. | Continuous processing system for chemical mechanical polishing |
US6244575B1 (en) | 1996-10-02 | 2001-06-12 | Micron Technology, Inc. | Method and apparatus for vaporizing liquid precursors and system for using same |
EP0984846B1 (en) | 1997-01-13 | 2004-11-24 | Rodel, Inc. | Method of manufacturing a polymeric polishing pad having photolithographically induced surface pattern |
US6682402B1 (en) | 1997-04-04 | 2004-01-27 | Rodel Holdings, Inc. | Polishing pads and methods relating thereto |
US5940674A (en) | 1997-04-09 | 1999-08-17 | Massachusetts Institute Of Technology | Three-dimensional product manufacture using masks |
US5945058A (en) | 1997-05-13 | 1999-08-31 | 3D Systems, Inc. | Method and apparatus for identifying surface features associated with selected lamina of a three-dimensional object being stereolithographically formed |
US5921855A (en) | 1997-05-15 | 1999-07-13 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing system |
US6273806B1 (en) | 1997-05-15 | 2001-08-14 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus |
US5919082A (en) | 1997-08-22 | 1999-07-06 | Micron Technology, Inc. | Fixed abrasive polishing pad |
JPH11254542A (en) | 1998-03-11 | 1999-09-21 | Sanyo Electric Co Ltd | Monitoring system for stereo lithographic apparatus |
JPH11347761A (en) | 1998-06-12 | 1999-12-21 | Mitsubishi Heavy Ind Ltd | Three-dimensional molding device by laser |
US6122564A (en) | 1998-06-30 | 2000-09-19 | Koch; Justin | Apparatus and methods for monitoring and controlling multi-layer laser cladding |
DE19834559A1 (en) | 1998-07-31 | 2000-02-03 | Friedrich Schiller Uni Jena Bu | Surface finishing, especially grinding, lapping and polishing, tool manufacturing method by use of rapid prototyping methods |
US6095902A (en) | 1998-09-23 | 2000-08-01 | Rodel Holdings, Inc. | Polyether-polyester polyurethane polishing pads and related methods |
US6204875B1 (en) | 1998-10-07 | 2001-03-20 | Barco Graphics, Nv | Method and apparatus for light modulation and exposure at high exposure levels with high resolution |
US6602380B1 (en) | 1998-10-28 | 2003-08-05 | Micron Technology, Inc. | Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine |
JP2002535843A (en) | 1999-01-21 | 2002-10-22 | ロデール ホールディングス インコーポレイテッド | Improved polishing pad and associated method |
US6217426B1 (en) | 1999-04-06 | 2001-04-17 | Applied Materials, Inc. | CMP polishing pad |
US6328634B1 (en) | 1999-05-11 | 2001-12-11 | Rodel Holdings Inc. | Method of polishing |
US6241596B1 (en) | 2000-01-14 | 2001-06-05 | Applied Materials, Inc. | Method and apparatus for chemical mechanical polishing using a patterned pad |
US20010046834A1 (en) | 2000-02-28 | 2001-11-29 | Anuradha Ramana | Pad surface texture formed by solid phase droplets |
US6569373B2 (en) | 2000-03-13 | 2003-05-27 | Object Geometries Ltd. | Compositions and methods for use in three dimensional model printing |
US8481241B2 (en) | 2000-03-13 | 2013-07-09 | Stratasys Ltd. | Compositions and methods for use in three dimensional model printing |
US7300619B2 (en) | 2000-03-13 | 2007-11-27 | Objet Geometries Ltd. | Compositions and methods for use in three dimensional model printing |
US20030207959A1 (en) | 2000-03-13 | 2003-11-06 | Eduardo Napadensky | Compositions and methods for use in three dimensional model printing |
US6860793B2 (en) | 2000-03-15 | 2005-03-01 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Window portion with an adjusted rate of wear |
WO2001072502A1 (en) | 2000-03-24 | 2001-10-04 | Generis Gmbh | Method for manufacturing a structural part by deposition technique |
US8485862B2 (en) | 2000-05-19 | 2013-07-16 | Applied Materials, Inc. | Polishing pad for endpoint detection and related methods |
US6860802B1 (en) | 2000-05-27 | 2005-03-01 | Rohm And Haas Electric Materials Cmp Holdings, Inc. | Polishing pads for chemical mechanical planarization |
US6454634B1 (en) | 2000-05-27 | 2002-09-24 | Rodel Holdings Inc. | Polishing pads for chemical mechanical planarization |
US6749485B1 (en) | 2000-05-27 | 2004-06-15 | Rodel Holdings, Inc. | Hydrolytically stable grooved polishing pads for chemical mechanical planarization |
US6736709B1 (en) | 2000-05-27 | 2004-05-18 | Rodel Holdings, Inc. | Grooved polishing pads for chemical mechanical planarization |
JP2002028849A (en) | 2000-07-17 | 2002-01-29 | Jsr Corp | Polishing pad |
US6736869B1 (en) | 2000-08-28 | 2004-05-18 | Micron Technology, Inc. | Method for forming a planarizing pad for planarization of microelectronic substrates |
US6641471B1 (en) | 2000-09-19 | 2003-11-04 | Rodel Holdings, Inc | Polishing pad having an advantageous micro-texture and methods relating thereto |
KR100905266B1 (en) | 2000-12-01 | 2009-06-29 | 도요 고무 고교 가부시키가이샤 | Polishing pad |
US20020111707A1 (en) | 2000-12-20 | 2002-08-15 | Zhimin Li | Droplet deposition method for rapid formation of 3-D objects from non-cross-linking reactive polymers |
GB0103754D0 (en) | 2001-02-15 | 2001-04-04 | Vantico Ltd | Three-dimensional structured printing |
US20020112632A1 (en) | 2001-02-21 | 2002-08-22 | Creo Ltd | Method for supporting sensitive workpieces during processing |
US6811937B2 (en) | 2001-06-21 | 2004-11-02 | Dsm Desotech, Inc. | Radiation-curable resin composition and rapid prototyping process using the same |
US6544373B2 (en) | 2001-07-26 | 2003-04-08 | United Microelectronics Corp. | Polishing pad for a chemical mechanical polishing process |
KR20030020658A (en) | 2001-09-04 | 2003-03-10 | 삼성전자주식회사 | Polishing pad conditioning disk of a chemical mechanical polishing apparatus |
GB0122281D0 (en) | 2001-09-14 | 2001-11-07 | Ici Plc | A container for roller-applied paint and its use in coating procedures for rough surfaces |
US6866807B2 (en) | 2001-09-21 | 2005-03-15 | Stratasys, Inc. | High-precision modeling filament |
DE10224981B4 (en) | 2002-06-05 | 2004-08-19 | Generis Gmbh | Process for building models in layers |
WO2003103959A1 (en) | 2002-06-07 | 2003-12-18 | Praxair S.T. Technology, Inc. | Controlled penetration subpad |
JP3801100B2 (en) | 2002-06-07 | 2006-07-26 | Jsr株式会社 | Photo-curing modeling apparatus, photo-curing modeling method, and photo-curing modeling system |
US7169014B2 (en) | 2002-07-18 | 2007-01-30 | Micron Technology, Inc. | Apparatuses for controlling the temperature of polishing pads used in planarizing micro-device workpieces |
AU2003260938A1 (en) | 2002-09-12 | 2004-04-30 | Objet Geometries Ltd. | Device, system and method for calibration in three-dimensional model printing |
WO2004039531A2 (en) | 2002-10-31 | 2004-05-13 | Ehsan Toyserkani | System and method for closed-loop control of laser cladding by powder injection |
US8615828B2 (en) | 2003-02-10 | 2013-12-31 | Ferdinand Schermel | Multi-position reclining bed |
DE10310385B4 (en) | 2003-03-07 | 2006-09-21 | Daimlerchrysler Ag | Method for the production of three-dimensional bodies by means of powder-based layer-building methods |
US7704125B2 (en) | 2003-03-24 | 2010-04-27 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
US7377840B2 (en) | 2004-07-21 | 2008-05-27 | Neopad Technologies Corporation | Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs |
AU2004225931A1 (en) | 2003-03-25 | 2004-10-14 | Neopad Technologies Corporation | Chip customized polish pads for chemical mechanical planarization (CMP) |
US9278424B2 (en) | 2003-03-25 | 2016-03-08 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
US8864859B2 (en) | 2003-03-25 | 2014-10-21 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
IL156094A0 (en) | 2003-05-25 | 2003-12-23 | J G Systems Inc | Fixed abrasive cmp pad with built-in additives |
US20050012247A1 (en) | 2003-07-18 | 2005-01-20 | Laura Kramer | Systems and methods for using multi-part curable materials |
US7120512B2 (en) | 2003-08-25 | 2006-10-10 | Hewlett-Packard Development Company, L.P. | Method and a system for solid freeform fabricating using non-reactive powder |
WO2005021248A1 (en) | 2003-08-27 | 2005-03-10 | Fuji Photo Film Co., Ltd. | Method of producing three-dimensional model |
GB0323462D0 (en) | 2003-10-07 | 2003-11-05 | Fujifilm Electronic Imaging | Providing a surface layer or structure on a substrate |
US6984163B2 (en) | 2003-11-25 | 2006-01-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with high optical transmission window |
KR100576465B1 (en) | 2003-12-01 | 2006-05-08 | 주식회사 하이닉스반도체 | Polishing Pad Using an Abrasive-Capsulation Composition |
US20050171224A1 (en) | 2004-02-03 | 2005-08-04 | Kulp Mary J. | Polyurethane polishing pad |
US6955588B1 (en) | 2004-03-31 | 2005-10-18 | Lam Research Corporation | Method of and platen for controlling removal rate characteristics in chemical mechanical planarization |
JP2004243518A (en) | 2004-04-08 | 2004-09-02 | Toshiba Corp | Polishing device |
US7216009B2 (en) | 2004-06-14 | 2007-05-08 | Micron Technology, Inc. | Machine vision systems for use with programmable material consolidation system and associated methods and structures |
US7252871B2 (en) | 2004-06-16 | 2007-08-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad having a pressure relief channel |
US7939003B2 (en) | 2004-08-11 | 2011-05-10 | Cornell Research Foundation, Inc. | Modular fabrication systems and methods |
JP2006095680A (en) | 2004-09-14 | 2006-04-13 | Zhiguo Long | Split grinding sheet and its manufacturing method |
KR100606457B1 (en) | 2004-11-11 | 2006-11-23 | 한국기계연구원 | Three-dimensional printing prototyping system |
US7815778B2 (en) | 2005-11-23 | 2010-10-19 | Semiquest Inc. | Electro-chemical mechanical planarization pad with uniform polish performance |
US7846008B2 (en) | 2004-11-29 | 2010-12-07 | Semiquest Inc. | Method and apparatus for improved chemical mechanical planarization and CMP pad |
WO2006057713A2 (en) | 2004-11-29 | 2006-06-01 | Rajeev Bajaj | Electro-method and apparatus for improved chemical mechanical planarization pad with uniform polish performance |
US7530880B2 (en) | 2004-11-29 | 2009-05-12 | Semiquest Inc. | Method and apparatus for improved chemical mechanical planarization pad with pressure control and process monitor |
US7182677B2 (en) | 2005-01-14 | 2007-02-27 | Applied Materials, Inc. | Chemical mechanical polishing pad for controlling polishing slurry distribution |
TWI385050B (en) | 2005-02-18 | 2013-02-11 | Nexplanar Corp | Customized polishing pads for cmp and methods of fabrication and use thereof |
US7524345B2 (en) | 2005-02-22 | 2009-04-28 | Saint-Gobain Abrasives, Inc. | Rapid tooling system and methods for manufacturing abrasive articles |
US7829000B2 (en) | 2005-02-25 | 2010-11-09 | Hewlett-Packard Development Company, L.P. | Core-shell solid freeform fabrication |
TWI410314B (en) | 2005-04-06 | 2013-10-01 | 羅門哈斯電子材料Cmp控股公司 | Apparatus for forming a porous reaction injection molded chemical mechanical polishing pad |
US20070128991A1 (en) | 2005-12-07 | 2007-06-07 | Yoon Il-Young | Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same |
US7517488B2 (en) | 2006-03-08 | 2009-04-14 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of forming a chemical mechanical polishing pad utilizing laser sintering |
US20070212979A1 (en) | 2006-03-09 | 2007-09-13 | Rimpad Tech Ltd. | Composite polishing pad |
US20070235904A1 (en) | 2006-04-06 | 2007-10-11 | Saikin Alan H | Method of forming a chemical mechanical polishing pad utilizing laser sintering |
US7445847B2 (en) | 2006-05-25 | 2008-11-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
US7169030B1 (en) | 2006-05-25 | 2007-01-30 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
WO2007147221A1 (en) | 2006-06-20 | 2007-12-27 | Katholieke Universiteit Leuven | Procedure and apparatus for in-situ monitoring and feedback control of selective laser powder processing |
JP5186738B2 (en) | 2006-07-10 | 2013-04-24 | 富士通セミコンダクター株式会社 | Manufacturing method of polishing pad and polishing method of object to be polished |
KR100842486B1 (en) | 2006-10-30 | 2008-07-01 | 동부일렉트로닉스 주식회사 | Polishing pad of a chemical-mechanical polisher and apparatus for fabricating by the said |
CN101199994A (en) | 2006-12-15 | 2008-06-18 | 湖南大学 | Intelligent laser cladding forming metal parts |
US7371160B1 (en) | 2006-12-21 | 2008-05-13 | Rohm And Haas Electronic Materials Cmp Holdings Inc. | Elastomer-modified chemical mechanical polishing pad |
US7438636B2 (en) | 2006-12-21 | 2008-10-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
US8784723B2 (en) | 2007-04-01 | 2014-07-22 | Stratasys Ltd. | Method and system for three-dimensional fabrication |
US8562389B2 (en) | 2007-06-08 | 2013-10-22 | Applied Materials, Inc. | Thin polishing pad with window and molding process |
US7455571B1 (en) | 2007-06-20 | 2008-11-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Window polishing pad |
US20080314878A1 (en) | 2007-06-22 | 2008-12-25 | General Electric Company | Apparatus and method for controlling a machining system |
US20090000539A1 (en) | 2007-06-29 | 2009-01-01 | Kamins Theodore I | Apparatus for growing a nanowire and method for controlling position of catalyst material |
US7862320B2 (en) | 2007-07-17 | 2011-01-04 | Seiko Epson Corporation | Three-dimensional object forming apparatus and method for forming three dimensional object |
EP2664443B1 (en) | 2007-07-25 | 2021-08-25 | Stratasys Ltd. | Solid freeform fabrication using a plurality of modeling materials |
US7635290B2 (en) | 2007-08-15 | 2009-12-22 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Interpenetrating network for chemical mechanical polishing |
US7517277B2 (en) | 2007-08-16 | 2009-04-14 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Layered-filament lattice for chemical mechanical polishing |
KR20100082770A (en) | 2007-09-03 | 2010-07-19 | 세미퀘스트, 인코포레이티드 | Polishing pad |
EP2042649B1 (en) | 2007-09-27 | 2012-05-30 | Toyoda Gosei Co., Ltd. | Coated base fabric for airbags |
JP5143528B2 (en) | 2007-10-25 | 2013-02-13 | 株式会社クラレ | Polishing pad |
DE102007056984A1 (en) | 2007-11-27 | 2009-05-28 | Eos Gmbh Electro Optical Systems | Method for producing a three-dimensional object by means of laser sintering |
US9180570B2 (en) | 2008-03-14 | 2015-11-10 | Nexplanar Corporation | Grooved CMP pad |
CN102083586B (en) | 2008-04-29 | 2015-08-12 | 塞米奎斯特股份有限公司 | Polishing pad composition and method of manufacture and use thereof |
US9636870B2 (en) | 2008-05-26 | 2017-05-02 | Sony Corporation | Modeling apparatus and modeling method |
TWI396603B (en) | 2008-06-26 | 2013-05-21 | 3M Innovative Properties Co | Polishing pad with porous elements and method of making and using the same |
US8282866B2 (en) | 2008-06-30 | 2012-10-09 | Seiko Epson Corporation | Method and device for forming three-dimensional model, sheet material processing method, and sheet material processing device |
US8118641B2 (en) | 2009-03-04 | 2012-02-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad having window with integral identification feature |
US8292692B2 (en) | 2008-11-26 | 2012-10-23 | Semiquest, Inc. | Polishing pad with endpoint window and systems and method using the same |
DE102008060046A1 (en) | 2008-12-02 | 2010-06-10 | Eos Gmbh Electro Optical Systems | A method of providing an identifiable amount of powder and method of making an object |
EP2477768B1 (en) | 2009-09-17 | 2019-04-17 | Sciaky Inc. | Electron beam layer manufacturing |
US8598523B2 (en) | 2009-11-13 | 2013-12-03 | Sciaky, Inc. | Electron beam layer manufacturing using scanning electron monitored closed loop control |
SG181678A1 (en) | 2009-12-30 | 2012-07-30 | 3M Innovative Properties Co | Polishing pads including phase-separated polymer blend and method of making and using the same |
US9017140B2 (en) | 2010-01-13 | 2015-04-28 | Nexplanar Corporation | CMP pad with local area transparency |
DE102010007401A1 (en) | 2010-02-03 | 2011-08-04 | Kärcher Futuretech GmbH, 71364 | Apparatus and method for automated forming and filling of containers |
DE102010011059A1 (en) | 2010-03-11 | 2011-09-15 | Global Beam Technologies Ag | Method and device for producing a component |
US9156124B2 (en) | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
WO2012040212A2 (en) | 2010-09-22 | 2012-03-29 | Interfacial Solutions Ip, Llc | Methods of producing microfabricated particles for composite materials |
US8257545B2 (en) | 2010-09-29 | 2012-09-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with light stable polymeric endpoint detection window and method of polishing therewith |
US8702479B2 (en) | 2010-10-15 | 2014-04-22 | Nexplanar Corporation | Polishing pad with multi-modal distribution of pore diameters |
JP2012094559A (en) | 2010-10-22 | 2012-05-17 | Sumco Corp | Planarization processing method for hard brittle wafer and pad for planarization processing |
JP5276642B2 (en) * | 2010-10-29 | 2013-08-28 | 富士フイルム株式会社 | Inkjet recording apparatus and image forming method |
US20120302148A1 (en) | 2011-05-23 | 2012-11-29 | Rajeev Bajaj | Polishing pad with homogeneous body having discrete protrusions thereon |
KR20130013884A (en) | 2011-07-29 | 2013-02-06 | 손준오 | Concrete construction method |
US9067297B2 (en) | 2011-11-29 | 2015-06-30 | Nexplanar Corporation | Polishing pad with foundation layer and polishing surface layer |
CN104487221B (en) | 2012-03-01 | 2017-09-26 | 纳斯达克有限公司 | Cationic polymerizable compositions and its application method |
US8986585B2 (en) | 2012-03-22 | 2015-03-24 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of manufacturing chemical mechanical polishing layers having a window |
US8709114B2 (en) | 2012-03-22 | 2014-04-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of manufacturing chemical mechanical polishing layers |
DE102012007791A1 (en) | 2012-04-20 | 2013-10-24 | Universität Duisburg-Essen | Method and device for producing components in a jet melting plant |
US9067299B2 (en) | 2012-04-25 | 2015-06-30 | Applied Materials, Inc. | Printed chemical mechanical polishing pad |
US9993873B2 (en) | 2012-05-22 | 2018-06-12 | General Electric Company | System and method for three-dimensional printing |
US9481134B2 (en) | 2012-06-08 | 2016-11-01 | Makerbot Industries, Llc | Build platform leveling with tactile feedback |
US9174388B2 (en) | 2012-08-16 | 2015-11-03 | Stratasys, Inc. | Draw control for extrusion-based additive manufacturing systems |
KR101572009B1 (en) | 2012-09-05 | 2015-11-25 | 아프레시아 파마슈티칼스 컴퍼니 | Three-dimensional printing system and equipment assembly |
US8888480B2 (en) | 2012-09-05 | 2014-11-18 | Aprecia Pharmaceuticals Company | Three-dimensional printing system and equipment assembly |
US20140120196A1 (en) | 2012-10-29 | 2014-05-01 | Makerbot Industries, Llc | Quick-release extruder |
CN109937387B (en) | 2012-11-08 | 2022-08-23 | Ddm系统有限责任公司 | Additive manufacturing and repair of metal components |
DE112013006045T5 (en) | 2012-12-17 | 2015-09-17 | Arcam Ab | Additive manufacturing method and device |
US10357435B2 (en) | 2012-12-18 | 2019-07-23 | Dentca, Inc. | Photo-curable resin compositions and method of using the same in three-dimensional printing for manufacturing artificial teeth and denture base |
US9649742B2 (en) | 2013-01-22 | 2017-05-16 | Nexplanar Corporation | Polishing pad having polishing surface with continuous protrusions |
EP3520985B1 (en) | 2013-03-14 | 2022-07-20 | Stratasys Ltd. | Polymer based molds and methods of manufacturing thereof |
JP2016522312A (en) | 2013-03-15 | 2016-07-28 | マターファブ, コーポレイションMatterfab Corp. | Cartridge for additive manufacturing apparatus and method |
US10183329B2 (en) | 2013-07-19 | 2019-01-22 | The Boeing Company | Quality control of additive manufactured parts |
US20150038066A1 (en) | 2013-07-31 | 2015-02-05 | Nexplanar Corporation | Low density polishing pad |
GB201313841D0 (en) | 2013-08-02 | 2013-09-18 | Rolls Royce Plc | Method of Manufacturing a Component |
US9855698B2 (en) | 2013-08-07 | 2018-01-02 | Massachusetts Institute Of Technology | Automatic process control of additive manufacturing device |
DE102013217422A1 (en) | 2013-09-02 | 2015-03-05 | Carl Zeiss Industrielle Messtechnik Gmbh | Coordinate measuring machine and method for measuring and at least partially producing a workpiece |
US10071459B2 (en) | 2013-09-25 | 2018-09-11 | 3M Innovative Properties Company | Multi-layered polishing pads |
EP3057775A1 (en) | 2013-10-17 | 2016-08-24 | LUXeXcel Holding B.V. | Device for printing a three-dimensional structure |
US9421666B2 (en) | 2013-11-04 | 2016-08-23 | Applied Materials, Inc. | Printed chemical mechanical polishing pad having abrasives therein |
WO2015072921A1 (en) | 2013-11-14 | 2015-05-21 | Structo Pte. Ltd | Additive manufacturing device and method |
EP2878409B2 (en) * | 2013-11-27 | 2022-12-21 | SLM Solutions Group AG | Method of and device for controlling an irradiation system |
KR20160110973A (en) | 2014-01-23 | 2016-09-23 | 가부시키가이샤 리코 | Three-dimensional object and method for forming same |
EP3105040B1 (en) | 2014-02-10 | 2023-10-18 | Stratasys Ltd. | Composition and method for additive manufacturing of an object |
WO2015120430A1 (en) | 2014-02-10 | 2015-08-13 | President And Fellows Of Harvard College | 3d-printed polishing pad for chemical-mechanical planarization (cmp) |
US9259820B2 (en) | 2014-03-28 | 2016-02-16 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with polishing layer and window |
JP6510179B2 (en) * | 2014-04-16 | 2019-05-08 | 株式会社ミマキエンジニアリング | Three-dimensional printer and three-dimensional object manufacturing method |
WO2015161210A1 (en) | 2014-04-17 | 2015-10-22 | Cabot Microelectronics Corporation | Cmp polishing pad with columnar structure and methods related thereto |
US9314897B2 (en) | 2014-04-29 | 2016-04-19 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with endpoint detection window |
US9333620B2 (en) | 2014-04-29 | 2016-05-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with clear endpoint detection window |
CN103921444B (en) | 2014-05-04 | 2016-09-14 | 中山市东方博达电子科技有限公司 | Photocuring 3D printer, photocuring 3D Method of printing and device |
CN104400998B (en) | 2014-05-31 | 2016-10-05 | 福州大学 | A kind of 3D based on infrared spectrum analysis prints detection method |
US9259821B2 (en) | 2014-06-25 | 2016-02-16 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing layer formulation with conditioning tolerance |
US9731398B2 (en) | 2014-08-22 | 2017-08-15 | Rohm And Haas Electronic Materials Cmp Holding, Inc. | Polyurethane polishing pad |
JP2016055452A (en) * | 2014-09-05 | 2016-04-21 | シャープ株式会社 | Laminate molding device and laminate molding method |
CN104210108B (en) | 2014-09-15 | 2017-11-28 | 宁波高新区乐轩锐蓝智能科技有限公司 | The print defect of 3D printer makes up method and system |
US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
CN107078048B (en) | 2014-10-17 | 2021-08-13 | 应用材料公司 | CMP pad construction with composite material properties using additive manufacturing process |
US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
TWI689406B (en) | 2014-10-17 | 2020-04-01 | 美商應用材料股份有限公司 | Polishing pad and method of fabricating the same |
US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
CN104385595B (en) | 2014-10-20 | 2017-05-03 | 合肥斯科尔智能科技有限公司 | Three-dimensional printing inferior-quality product repairing system |
CN104607639B (en) | 2015-01-12 | 2016-11-02 | 常州先进制造技术研究所 | A kind of surface reconditioning forming devices printed for metal 3D |
US10946495B2 (en) | 2015-01-30 | 2021-03-16 | Cmc Materials, Inc. | Low density polishing pad |
US10589466B2 (en) * | 2015-02-28 | 2020-03-17 | Xerox Corporation | Systems and methods for implementing multi-layer addressable curing of ultraviolet (UV) light curable inks for three dimensional (3D) printed parts and components |
KR101667522B1 (en) * | 2015-03-10 | 2016-10-19 | 에스팩 주식회사 | 3d printing method using liquid crystal matrix as mask, and 3d printing device |
US9475168B2 (en) | 2015-03-26 | 2016-10-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad window |
KR101694733B1 (en) | 2015-04-10 | 2017-01-12 | 한국광기술원 | Device for manufacturing phantom using 3d printer and manufacturing method thereof |
US20180162051A1 (en) | 2015-05-19 | 2018-06-14 | Addifab Aps | Additive manufacturing arrangement with shared radiation source |
JP2018524178A (en) | 2015-06-10 | 2018-08-30 | アイピージー フォトニクス コーポレーション | Multiple beam additive manufacturing |
US10814387B2 (en) | 2015-08-03 | 2020-10-27 | General Electric Company | Powder recirculating additive manufacturing apparatus and method |
JP6855460B2 (en) | 2015-09-16 | 2021-04-07 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | Adjustable Z-axis printhead module for additive manufacturing systems |
US10189143B2 (en) | 2015-11-30 | 2019-01-29 | Taiwan Semiconductor Manufacturing Company Limited | Polishing pad, method for manufacturing polishing pad, and polishing method |
US20180093411A1 (en) | 2016-09-30 | 2018-04-05 | Applied Materials, Inc. | Additive manufacturing of polishing pads on a conveyor |
US10596763B2 (en) | 2017-04-21 | 2020-03-24 | Applied Materials, Inc. | Additive manufacturing with array of energy sources |
-
2017
- 2017-11-10 US US15/809,965 patent/US10596763B2/en not_active Expired - Fee Related
- 2017-11-10 US US15/809,969 patent/US20180304539A1/en not_active Abandoned
-
2018
- 2018-04-12 TW TW107112496A patent/TW201841775A/en unknown
- 2018-04-13 CN CN201880026468.4A patent/CN110545987A/en active Pending
- 2018-04-13 WO PCT/US2018/027619 patent/WO2018194935A1/en active Application Filing
- 2018-04-13 KR KR1020197033948A patent/KR102450927B1/en active IP Right Grant
- 2018-04-13 DE DE112018002088.6T patent/DE112018002088T5/en not_active Withdrawn
- 2018-04-13 JP JP2019556803A patent/JP7086101B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070182782A1 (en) * | 2003-01-16 | 2007-08-09 | Silverbrook Research Pty Ltd | Printer system for developing a 3-d product |
US20160236279A1 (en) * | 2013-09-23 | 2016-08-18 | Renishaw Plc | Additive manufacturing apparatus and method |
US20170008126A1 (en) * | 2014-02-06 | 2017-01-12 | United Technologies Corporation | An additive manufacturing system with a multi-energy beam gun and method of operation |
US20190001570A1 (en) * | 2015-10-16 | 2019-01-03 | Hewlett-Packard Development Company, L.P. | Build material supply for additive manufacturing |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10596763B2 (en) | 2017-04-21 | 2020-03-24 | Applied Materials, Inc. | Additive manufacturing with array of energy sources |
US11931824B2 (en) * | 2019-01-23 | 2024-03-19 | Vulcanforms Inc. | Laser control systems for additive manufacturing |
WO2021108634A1 (en) * | 2019-11-26 | 2021-06-03 | Lubbe Steven | Devices, systems, and methods for 3d printing |
CN111347674A (en) * | 2020-03-30 | 2020-06-30 | 上海市黄浦区劳动技术教育中心 | Electromagnetic matrix printer |
Also Published As
Publication number | Publication date |
---|---|
US10596763B2 (en) | 2020-03-24 |
KR20190133273A (en) | 2019-12-02 |
US20180304538A1 (en) | 2018-10-25 |
JP2020517491A (en) | 2020-06-18 |
TW201841775A (en) | 2018-12-01 |
WO2018194935A1 (en) | 2018-10-25 |
KR102450927B1 (en) | 2022-10-06 |
JP7086101B2 (en) | 2022-06-17 |
CN110545987A (en) | 2019-12-06 |
DE112018002088T5 (en) | 2020-01-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10596763B2 (en) | Additive manufacturing with array of energy sources | |
US11137243B2 (en) | Two step curing of polishing pad material in additive manufacturing | |
US11642757B2 (en) | Using sacrificial material in additive manufacturing of polishing pads | |
US11154961B2 (en) | Correction of fabricated shapes in additive manufacturing | |
US10967482B2 (en) | Fabrication of polishing pad by additive manufacturing onto mold | |
JP7032543B2 (en) | Addition manufacturing using powder dispensing | |
JP2021107150A (en) | Three-dimensional modeling method and device for objects with high resolution background | |
TWI779796B (en) | Additive manufacturing of polishing pads on a conveyor | |
JP6384826B2 (en) | Three-dimensional additive manufacturing apparatus, three-dimensional additive manufacturing method, and three-dimensional additive manufacturing program | |
TWI780156B (en) | Additive manufacturing apparatus and method | |
KR102534731B1 (en) | Compensation of shapes made in additive manufacturing using an initial layer |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: APPLIED MATERIALS, INC., CALIFORNIA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:NG, HOU T.;PATIBANDLA, NAG B.;GANAPATHIAPPAN, SIVAPACKIA;SIGNING DATES FROM 20180110 TO 20180112;REEL/FRAME:044664/0462 |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: FINAL REJECTION MAILED |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |