TWM347669U - Polishing pad and polishing device - Google Patents

Polishing pad and polishing device

Info

Publication number
TWM347669U
TWM347669U TW97210872U TW97210872U TWM347669U TW M347669 U TWM347669 U TW M347669U TW 97210872 U TW97210872 U TW 97210872U TW 97210872 U TW97210872 U TW 97210872U TW M347669 U TWM347669 U TW M347669U
Authority
TW
Taiwan
Prior art keywords
polishing
device
pad
polishing pad
polishing device
Prior art date
Application number
TW97210872U
Inventor
Allen Chiu
shao-yu Chen
Yu-Lung Jeng
Original Assignee
Bestac Advanced Material Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bestac Advanced Material Co Ltd filed Critical Bestac Advanced Material Co Ltd
Priority to TW97210872U priority Critical patent/TWM347669U/en
Publication of TWM347669U publication Critical patent/TWM347669U/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
TW97210872U 2008-06-19 2008-06-19 Polishing pad and polishing device TWM347669U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW97210872U TWM347669U (en) 2008-06-19 2008-06-19 Polishing pad and polishing device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW97210872U TWM347669U (en) 2008-06-19 2008-06-19 Polishing pad and polishing device
US12/261,666 US20090318062A1 (en) 2008-06-19 2008-10-30 Polishing pad and polishing device

Publications (1)

Publication Number Publication Date
TWM347669U true TWM347669U (en) 2008-12-21

Family

ID=41431730

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97210872U TWM347669U (en) 2008-06-19 2008-06-19 Polishing pad and polishing device

Country Status (2)

Country Link
US (1) US20090318062A1 (en)
TW (1) TWM347669U (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102485424B (en) * 2010-12-03 2015-01-21 中芯国际集成电路制造(北京)有限公司 Polishing device and abnormality treatment method thereof
US9427818B2 (en) * 2014-01-20 2016-08-30 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor processing boat design with pressure sensor
US20170133252A1 (en) * 2015-11-06 2017-05-11 Applied Materials, Inc. Techniques for combining cmp process tracking data with 3d printed cmp consumables

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5081796A (en) * 1990-08-06 1992-01-21 Micron Technology, Inc. Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer
US5433651A (en) * 1993-12-22 1995-07-18 International Business Machines Corporation In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing
US5893769A (en) * 1995-01-04 1999-04-13 Lin; Chiu-Chen Bulb socket with fastening structure for electric connectors
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US5637724A (en) * 1995-06-05 1997-06-10 Neurogen Corporation Substituted aryl and cycloalkyl imidazolones; a new class of GABA brain receptor ligands
US5838447A (en) * 1995-07-20 1998-11-17 Ebara Corporation Polishing apparatus including thickness or flatness detector
KR100218309B1 (en) * 1996-07-09 1999-09-01 구본준 Apparatus and method for leveling detecting semiconductor wafer in cmp apparatus
US5868896A (en) * 1996-11-06 1999-02-09 Micron Technology, Inc. Chemical-mechanical planarization machine and method for uniformly planarizing semiconductor wafers
JP3705670B2 (en) * 1997-02-19 2005-10-12 株式会社荏原製作所 Polishing apparatus and method
US6722962B1 (en) * 1997-04-22 2004-04-20 Sony Corporation Polishing system, polishing method, polishing pad, and method of forming polishing pad
US6106662A (en) * 1998-06-08 2000-08-22 Speedfam-Ipec Corporation Method and apparatus for endpoint detection for chemical mechanical polishing
US6352466B1 (en) * 1998-08-31 2002-03-05 Micron Technology, Inc. Method and apparatus for wireless transfer of chemical-mechanical planarization measurements
US6322422B1 (en) * 1999-01-19 2001-11-27 Nec Corporation Apparatus for accurately measuring local thickness of insulating layer on semiconductor wafer during polishing and polishing system using the same
US6190234B1 (en) * 1999-01-25 2001-02-20 Applied Materials, Inc. Endpoint detection with light beams of different wavelengths
US6146242A (en) * 1999-06-11 2000-11-14 Strasbaugh, Inc. Optical view port for chemical mechanical planarization endpoint detection
TW522500B (en) * 1999-07-28 2003-03-01 Winbond Electronics Corp Measurement of surface pressure distribution of whole wafer surface and feedback method
US6454630B1 (en) * 1999-09-14 2002-09-24 Applied Materials, Inc. Rotatable platen having a transparent window for a chemical mechanical polishing apparatus and method of making the same
US6485354B1 (en) * 2000-06-09 2002-11-26 Strasbaugh Polishing pad with built-in optical sensor
US6447369B1 (en) * 2000-08-30 2002-09-10 Micron Technology, Inc. Planarizing machines and alignment systems for mechanical and/or chemical-mechanical planarization of microelectronic substrates
US6257953B1 (en) * 2000-09-25 2001-07-10 Center For Tribology, Inc. Method and apparatus for controlled polishing
TW469210B (en) * 2000-10-30 2001-12-21 United Microelectronics Corp Pressure detecting system for chemical-mechanical polishing
US6726528B2 (en) * 2002-05-14 2004-04-27 Strasbaugh Polishing pad with optical sensor
JP2004140313A (en) * 2002-08-22 2004-05-13 Jsr Corp Method for forming bump on electrode pad using bilayer multilayer film
US7011566B2 (en) * 2002-08-26 2006-03-14 Micron Technology, Inc. Methods and systems for conditioning planarizing pads used in planarizing substrates
WO2005104199A1 (en) * 2004-04-23 2005-11-03 Jsr Corporation Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor wafer
WO2006057720A1 (en) * 2004-11-29 2006-06-01 Rajeev Bajaj Method and apparatus for improved chemical mechanical planarization pad with pressure control and process monitor
WO2006057713A2 (en) * 2004-11-29 2006-06-01 Rajeev Bajaj Electro-method and apparatus for improved chemical mechanical planarization pad with uniform polish performance
US7722434B2 (en) * 2005-03-29 2010-05-25 Kla-Tencor Corporation Apparatus for measurement of parameters in process equipment
JP2007290111A (en) * 2006-03-29 2007-11-08 Ebara Corp Polishing method and polishing device

Also Published As

Publication number Publication date
US20090318062A1 (en) 2009-12-24

Similar Documents

Publication Publication Date Title
TWI418443B (en) Chemical mechanical polishing pad
TWI402334B (en) Chemical mechanical polishing pad
TWI356449B (en) Cmp pad conditioners and associated methods
EP2314090A4 (en) Portable device association
PL2365848T3 (en) Personal hygiene device
PT2148594E (en) Carrying device
EP2276570A4 (en) Microfluidic chip devices and their use
EP2262048A4 (en) Battery device and battery unit
EP2267746A4 (en) Contact device
GB0922165D0 (en) Human interface device and related methods
EP2348906A4 (en) Headband with pivotal pad
EP2106814A4 (en) Treatment device
EP2380515A4 (en) Treatment device and treatment tool
EP2380516A4 (en) Treatment device and treatment tool
ZA201101896B (en) Frizzled-binding agents and uses thereof
EP2447004A4 (en) Polishing pad, manufacturing method therefor, and polishing method
IL218020D0 (en) Devices and methods for dressing applicators
HRP20171133T1 (en) Psma-binding agents and uses thereof
IL215160D0 (en) Slip chip device and methods
EP2494427A4 (en) Display device and semiconductor device
HK1209626A1 (en) Nanochanneled device and related methods
BRPI0905905A2 (en) Devices and Methods for Enhanced Pad Positioning
EP2493566A4 (en) Device for personal use in phototherapy
TWI390447B (en) Card-type peripheral device
IL212994D0 (en) Medical device comprising adhesive pad

Legal Events

Date Code Title Description
MK4K Expiration of patent term of a granted utility model