CN201261164Y - Grinding pad and grinding device - Google Patents

Grinding pad and grinding device Download PDF

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Publication number
CN201261164Y
CN201261164Y CNU2008201308607U CN200820130860U CN201261164Y CN 201261164 Y CN201261164 Y CN 201261164Y CN U2008201308607 U CNU2008201308607 U CN U2008201308607U CN 200820130860 U CN200820130860 U CN 200820130860U CN 201261164 Y CN201261164 Y CN 201261164Y
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CN
China
Prior art keywords
grinding pad
signal
pressure
grinding
order
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Expired - Lifetime
Application number
CNU2008201308607U
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Chinese (zh)
Inventor
邱汉郎
陈少禹
郑裕隆
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BEDA ADVANCED MATERIAL Co Ltd
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BEDA ADVANCED MATERIAL Co Ltd
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Priority to CNU2008201308607U priority Critical patent/CN201261164Y/en
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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The utility model provides a grinding pad, in particular to a grinding pad with pressure transducers and a grinder of the grinding pad. The grinding pad is used for grinding a semiconductor or other work-pieces and comprises at least one substrate, at least one pressure transducer and at least one signal transfer module, wherein the substrate comprises a grinding surface, a relative bottom surface and at least one groove, the groove is arranged on the bottom surface of the substrate, the pressure transducers are arranged in the groove to be used for supplying a pressure signal, the signal transfer module is arranged in the grinding pad to be used for transferring the pressure signal, the pressure signal shows the value of pressure born by a preset scope of the grinding pad and the distribution state, thus the pressure applied by a machine station in grinding can be monitored, the work-piece damage caused by excessive or uneven grinding is avoided, and the quality and the yield rate of the work-piece can be improved.

Description

Grinding pad and lapping device
Technical field
The utility model relates to a kind of grinding pad, particularly relates to a kind of grinding pad and lapping device thereof with pressure sensor.
Background technology
Most electronic chip is to form by the stratification different materials, for example semiconductor wafer (silicon) promptly is one of them of stratification material, when each new material layer is coupled with, often need make the step of grinding or milling just remove unnecessary layer material, so that this wafer planarization, or reach other purpose, and the process of this kind grinding often be called as the cmp planarization (ChemicalMechanical Polishing, CMP).Because chip is formed by various thin material layer, therefore must material layer evenly could be removed by the surface of wafer through CMP grinding steps repeatedly.
Yet, along with progressing greatly of wafer fabrication, the lead of being laid on the wafer is quite trickle, also relative more and more small of live width is so when carrying out grinding operation, grinder station institute applied pressure only is 1PSI~2PSI, therefore the grinder station pressure error tolerance of exerting pressure very low of also falling, so guarantee wafer when grinding operation carries out, the pressure size that grinder station is bestowed is set, and has been very important subject under discussion for grinding operation.In addition because can clamping one deck grinding pad between board and the workpiece to be ground, therefore usually board set applied pressure and in fact the suffered pressure of workpiece tend to produce drop, this drop often also can cause the damage in the grinding indirectly.
The utility model content
For solving prior art problems, main purpose of the present utility model is to provide a kind of grinding pad with pressure sensor, can monitor pressure size and distribution situation when grinding.
Another purpose of the present utility model is to provide a kind of grinding pad with pressure sensor, can avoid excessive grinding to cause workpiece to grind away, to improve quality and the yield that grinds.
A purpose more of the present utility model is to provide a kind of grinding pad with pressure sensor, has preferable signal transfer mode, can transmit pressure signal in good time.
According to above-mentioned purpose, the utility model provides a kind of grinding pad with pressure sensor.This grinding pad is used for the grinding processing procedure of semiconductor or other workpiece, it comprises a base material, at least one pressure sensor and at least one signal transmission module, this base material comprises an abradant surface, one opposed bottom surface and at least one groove, and groove is located at the bottom surface of base material, pressure sensor then is located in the groove, in order to a pressure signal to be provided, signal transmission module then is to be located at grinding pad, in order to transmit pressure signal, wherein this pressure signal is size and the distribution situation that grinding pad one preestablishes the suffered force value of scope, can monitor board institute applied pressure when grinding thus, avoid excessive grinding to cause workpiece to grind away, to improve quality and the yield that grinds.
The utility model provides a kind of lapping device, in order to grind a workpiece and to carry a grinding pad, wherein this grinding pad comprises a base material, it comprises an abradant surface, an opposed bottom surface and at least one groove and is located at this bottom surface, it is characterized in that, this grinding pad has at least one pressure sensor and at least one first signal transmission module, this pressure sensor is located in this groove, in order to a pressure signal to be provided, and this first signal transmission module, be arranged at this grinding pad, in order to transmit this pressure signal; This lapping device comprises:
One first platform in order to carrying this grinding pad, and is connected with the bottom surface of this grinding pad;
One drive unit rotates in order to drive this first platform;
One second platform is in order to carry this workpiece;
One device for exerting makes to have a specified pressure between grinding pad on this first platform and the workpiece on second platform;
At least one signal receiving module is in order to receive the pressure signal that this grinding pad provides; And
One display unit is in order to show this pressure signal.
In view of this, the utility model provides a kind of grinding pad and lapping device thereof with pressure sensor, wherein this pressure sensor has preferable set-up mode, can guarantee that sensor is not disturbed and erosion by chemical grinding liquid can, and directly monitor the pressure of workpiece that grinder station is bestowed by pressure sensor, and with initiatively or passive mode pass the signal of force value back, the phenomenon that can avoid board to bestow excessive force value or pressure distribution inequality takes place, can significantly improve the yield of grinding work-piece, be improved at prior art.
Description of drawings
Fig. 1 to Fig. 6 is an embodiment schematic diagram of the utility model grinding pad.
Fig. 7 is an embodiment schematic diagram of the utility model lapping device.
[main element symbol description]
2 grinding pads, 4 lapping devices
21 base materials, 41 first platforms
211 abradant surfaces, 411 drive units
212 bottom surfaces, 42 second platforms
213 grooves, 43 device for exerting
3 pressure sensors, 44 signal receiving modules
31 printed circuit board (PCB)s (PCB), 441 wireless signal receivers
311 circuit, 45 display unit
32 leads, 46 viscoses
33 supplying cells, 47 alarming devices
34 wireless signal transmitters, 5 workpiece
The specific embodiment
Because the utility model discloses a kind of grinding pad device with sensor, some sensors that wherein used or the detailed manufacturing or the processing procedure of grinding pad utilize prior art to reach, so in following explanation, do not do complete description.And graphic in the literary composition in following, also not according to the actual complete drafting of relative dimensions, its effect is only being expressed the schematic diagram relevant with the utility model feature.
Fig. 1 is a preferred embodiment schematic diagram of the utility model grinding pad, and grinding pad 2 is used for the grinding processing procedure of semiconductor or other workpiece, and it comprises at least one base material 21, at least one pressure sensor 3 and at least one signal transmission module (not being shown among the figure).This base material 21 comprises an abradant surface 211, an opposed bottom surface 212 and at least one groove 213, and groove 213 is located at the bottom surface 212 of base material 21, pressure sensor 3 then is located in the groove 213, in order to a pressure signal to be provided, signal transmission module then is located at grinding pad 2, in order to transmit pressure signal, wherein this pressure signal is size and the distribution situation that grinding pad 2 one preestablishes the suffered force value of scope, can monitor board institute applied pressure when grinding thus, avoid excessive grinding to cause workpiece to grind away, to improve quality and the yield that grinds.In addition, as shown in Figure 2, grinding pad 2 comprises two-layer above base material 21, and wherein pressure sensor 3 is located between base material 21 and the base material 21 to form a compound grinding pad.
Fig. 3 is a preferred embodiment schematic diagram of the utility model signal transmission module, and wherein this signal transmission module comprises a printed circuit board (PCB) (PCB) 31, and connects a circuit 311 as the power supply source, with the active transfer signal.
Fig. 4 is another preferred embodiment schematic diagram of the utility model signal transmission module, and wherein this signal transmission module comprises at least one lead 32, and this lead can be used as power supply source and active transfer signal.
Fig. 5 is the another preferred embodiment schematic diagram of the utility model signal transmission module, wherein this signal transmission module comprises at least one supplying cell 33, wherein this supplying cell 33 can be button cell, mercury battery, dry cell, alkaline battery, lead-acid battery, nickel-cadmium cell, Ni-MH battery, serondary lithium battery, lithium ion battery, high-polymer lithium battery, fuel cell and solar cell etc., and this supplying cell 33 is the power supply of active transmission signal.
Fig. 6 is a preferred embodiment schematic diagram again of the utility model signal transmission module, and wherein this signal transmission module comprises at least one wireless signal transmitter 34, and this wireless signal transmitter 34 is the signal transfer mode of passive type.
The utility model provides a preferred embodiment again of a signal transmission module in addition, wherein pressure sensor 3 is an integral body (not being shown among the figure) with signal transmission module, it comprises a chip, one controller, one wireless signal transmitter and at least one supply unit, wherein the frequency range of wireless signal transmitter is approximately 100MHZ~3GHZ, and supply unit can be a shaking generating set, one external magnetic field TRT, perhaps also can be button cell, mercury battery, dry cell, alkaline battery, lead-acid battery, nickel-cadmium cell, Ni-MH battery, serondary lithium battery, lithium ion battery, high-polymer lithium battery, fuel cell and solar cell etc., this kind mode are the signal transfer mode of passive type.
Fig. 7 is a preferred embodiment schematic diagram of the utility model lapping device, wherein lapping device 4 is in order to grind a workpiece 5 and to carry a grinding pad 2, this grinding pad 2 comprises at least one base material 21, at least one pressure sensor 3 and at least the first signal transmission module (not being shown among the figure), wherein, base material 21 comprises an abradant surface 211, one opposed bottom surface 212 and at least one groove 213, and groove 213 is located at the bottom surface 212 of base material 21, pressure sensor 3 then is located in the groove 213, in order to a pressure signal to be provided, this first signal transmission module then is located at grinding pad 2, in order to transmit the pressure signal that pressure sensor 3 is sent, wherein this pressure signal is size and the distribution situation that grinding pad 2 one preestablishes the suffered force value of scope, when pressure signal when one preestablishes outside the scope, can send alarm signal by an alarming device 47, this moment, lapping device 4 can stop automatically.
Wherein, lapping device 4 comprises one first platform 41, one second platform 42, a drive unit 411, a device for exerting 43, at least one signal receiving module 44 and a display unit 45.This first platform 41 is in order to carrying grinding pad 2, and be connected with the bottom surface 212 of grinding pad 2, its ways of connecting is to utilize viscose 46 that grinding pad 2 is engaged and be fixed on first platform 41, and this kind viscose 46 can be a kind of pressure-sensing glue, 411 of drive units rotate in order to drive this first platform 41, this second platform 42 is in order to carrying workpiece 5, device for exerting 43 can make on the platform of winning between 41 grinding pad 2 and the workpiece 5 on second platform 42 has a specified pressure, signal receiving module 44 is in order to receive the pressure signal that grinding pad 2 provides, this signal receiving module 44 can be a wireless signal receiver 441, and 45 of display unit are in order to show this kind pressure signal.
From the above, can comprise in addition a secondary signal transmits between the signal receiving module 44 of module in order to first signal transmission module that is connected in grinding pad 2 and lapping device 4, and this secondary signal transmission module can be a printed circuit board (PCB) (PCB) 31, lead 32 or connector, and this secondary signal transmission module is located at the surface that is connected with grinding pad 2 on first platform 41.
The above is preferred embodiment of the present utility model only, is not in order to limit claim of the present utility model; Simultaneously above description should be understood and be implemented for the special personage who knows the present technique field, so other does not break away from the equivalence of being finished under the spirit that the utility model discloses and change or modification, all should be included in the following claim scope.

Claims (14)

1. grinding pad, the grinding processing procedure that is used for semiconductor or other workpiece, this grinding pad comprises at least one base material, it comprises an abradant surface, an opposed bottom surface and at least one groove and is located at this bottom surface, it is characterized in that, this grinding pad has at least one pressure sensor and at least one signal transmission module, this pressure sensor is located in this groove, in order to a pressure signal to be provided, this signal transmission module is arranged at this grinding pad, in order to transmit this pressure signal.
2. grinding pad as claimed in claim 1 is characterized in that, the pressure signal that this pressure sensor provides comprises the size that this grinding pad one preestablishes the suffered force value of scope.
3. grinding pad as claimed in claim 1 is characterized in that, the pressure signal that this pressure sensor provides comprises the distribution situation that this grinding pad one preestablishes the suffered force value of scope.
4. grinding pad as claimed in claim 1 is characterized in that this signal transmission module comprises a printed circuit board (PCB).
5. grinding pad as claimed in claim 1 is characterized in that this signal transmission module comprises at least one lead.
6. grinding pad as claimed in claim 1 is characterized in that this signal transmission module comprises at least one supplying cell.
7. grinding pad as claimed in claim 1 is characterized in that this signal transmission module comprises a wireless signal transmitter.
8. grinding pad as claimed in claim 1 is characterized in that, this grinding pad comprises two-layer above base material, and wherein this pressure sensor is located between the described base material.
9. lapping device, in order to grind a workpiece and to carry a grinding pad, wherein this grinding pad comprises a base material, and it comprises an abradant surface, an opposed bottom surface and at least one groove and is located at this bottom surface, it is characterized in that, this grinding pad has at least one pressure sensor and at least one first signal transmission module, this pressure sensor is located in this groove, in order to a pressure signal to be provided, and this first signal transmission module, be arranged at this grinding pad, in order to transmit this pressure signal; This lapping device comprises:
One first platform in order to carrying this grinding pad, and is connected with the bottom surface of this grinding pad;
One drive unit rotates in order to drive this first platform;
One second platform is in order to carry this workpiece;
One device for exerting makes to have a specified pressure between grinding pad on this first platform and the workpiece on second platform;
At least one signal receiving module is in order to receive the pressure signal that this grinding pad provides; And
One display unit is in order to show this pressure signal.
10. lapping device as claimed in claim 9 is characterized in that other comprises an alarming device, when this pressure signal when one preestablishes outside the scope, send alarm signal.
11. lapping device as claimed in claim 9 is characterized in that, other comprises a secondary signal and transmits between the signal receiving module of module in order to first signal transmission module that is connected in this grinding pad and this lapping device.
12. lapping device as claimed in claim 11 is characterized in that, this secondary signal is transmitted module and is comprised a printed circuit board (PCB), lead or connector.
13. lapping device as claimed in claim 11 is characterized in that, this secondary signal is transmitted module and is located at the surface that is connected with this grinding pad on this first platform.
14. lapping device as claimed in claim 9 is characterized in that, this signal receiving module comprises a wireless signal receiver.
CNU2008201308607U 2008-07-28 2008-07-28 Grinding pad and grinding device Expired - Lifetime CN201261164Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2008201308607U CN201261164Y (en) 2008-07-28 2008-07-28 Grinding pad and grinding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2008201308607U CN201261164Y (en) 2008-07-28 2008-07-28 Grinding pad and grinding device

Publications (1)

Publication Number Publication Date
CN201261164Y true CN201261164Y (en) 2009-06-24

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Application Number Title Priority Date Filing Date
CNU2008201308607U Expired - Lifetime CN201261164Y (en) 2008-07-28 2008-07-28 Grinding pad and grinding device

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CN (1) CN201261164Y (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101905438A (en) * 2010-07-13 2010-12-08 厦门大学 Polishing pressure detection device for heavy-calibre element
CN102554768A (en) * 2012-02-10 2012-07-11 上海宏力半导体制造有限公司 Method for identifying polishing characteristics of chemical mechanical polishing equipment
CN102615593A (en) * 2012-03-09 2012-08-01 中国科学院长春光学精密机械与物理研究所 Photoprocessing grinding head stress state monitoring device
WO2019000159A1 (en) * 2017-06-26 2019-01-03 周继霞 Polisher, and polisher system
CN110664486A (en) * 2019-09-25 2020-01-10 中国科学院重庆绿色智能技术研究院 Be applied to surgical robot's apparatus and equipment
CN110774163A (en) * 2018-07-31 2020-02-11 台湾积体电路制造股份有限公司 Chemical mechanical polishing system and method thereof

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101905438A (en) * 2010-07-13 2010-12-08 厦门大学 Polishing pressure detection device for heavy-calibre element
CN102554768A (en) * 2012-02-10 2012-07-11 上海宏力半导体制造有限公司 Method for identifying polishing characteristics of chemical mechanical polishing equipment
CN102554768B (en) * 2012-02-10 2018-02-09 上海华虹宏力半导体制造有限公司 The method for identifying the grinding performance of chemical-mechanical grinding device
CN102615593A (en) * 2012-03-09 2012-08-01 中国科学院长春光学精密机械与物理研究所 Photoprocessing grinding head stress state monitoring device
WO2019000159A1 (en) * 2017-06-26 2019-01-03 周继霞 Polisher, and polisher system
CN110774163A (en) * 2018-07-31 2020-02-11 台湾积体电路制造股份有限公司 Chemical mechanical polishing system and method thereof
US11738423B2 (en) 2018-07-31 2023-08-29 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus and method
CN110664486A (en) * 2019-09-25 2020-01-10 中国科学院重庆绿色智能技术研究院 Be applied to surgical robot's apparatus and equipment

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Granted publication date: 20090624