JP6849731B2 - 付加製造プロセスを使用する、複合材料特性を有するcmpパッド構造 - Google Patents
付加製造プロセスを使用する、複合材料特性を有するcmpパッド構造 Download PDFInfo
- Publication number
- JP6849731B2 JP6849731B2 JP2019081720A JP2019081720A JP6849731B2 JP 6849731 B2 JP6849731 B2 JP 6849731B2 JP 2019081720 A JP2019081720 A JP 2019081720A JP 2019081720 A JP2019081720 A JP 2019081720A JP 6849731 B2 JP6849731 B2 JP 6849731B2
- Authority
- JP
- Japan
- Prior art keywords
- features
- polishing
- polishing pad
- pad
- feature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002131 composite material Substances 0.000 title claims description 73
- 238000004519 manufacturing process Methods 0.000 title description 36
- 238000010276 construction Methods 0.000 title 1
- 238000005498 polishing Methods 0.000 claims description 536
- 239000000463 material Substances 0.000 claims description 267
- 239000000203 mixture Substances 0.000 claims description 69
- 238000000034 method Methods 0.000 claims description 58
- 238000000151 deposition Methods 0.000 claims description 27
- 239000002861 polymer material Substances 0.000 claims description 16
- 238000003860 storage Methods 0.000 claims description 15
- -1 graft chains Substances 0.000 claims description 14
- 229920002635 polyurethane Polymers 0.000 claims description 10
- 239000004814 polyurethane Substances 0.000 claims description 10
- 229920001169 thermoplastic Polymers 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 8
- 229920001577 copolymer Polymers 0.000 claims description 6
- 230000008021 deposition Effects 0.000 claims description 6
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 6
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 5
- 229920000058 polyacrylate Polymers 0.000 claims 1
- 239000010410 layer Substances 0.000 description 124
- 239000002245 particle Substances 0.000 description 41
- 239000000758 substrate Substances 0.000 description 39
- 238000010146 3D printing Methods 0.000 description 30
- 230000008569 process Effects 0.000 description 23
- 238000001723 curing Methods 0.000 description 19
- 235000019589 hardness Nutrition 0.000 description 19
- 239000002243 precursor Substances 0.000 description 18
- 238000007639 printing Methods 0.000 description 18
- 239000002002 slurry Substances 0.000 description 18
- 229920000642 polymer Polymers 0.000 description 10
- 239000012530 fluid Substances 0.000 description 9
- 239000011148 porous material Substances 0.000 description 9
- 229920001187 thermosetting polymer Polymers 0.000 description 9
- 238000002347 injection Methods 0.000 description 7
- 239000007924 injection Substances 0.000 description 7
- 239000002105 nanoparticle Substances 0.000 description 7
- 239000004634 thermosetting polymer Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000011960 computer-aided design Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 229920000728 polyester Polymers 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 5
- 238000010894 electron beam technology Methods 0.000 description 5
- 239000012705 liquid precursor Substances 0.000 description 5
- 239000004810 polytetrafluoroethylene Substances 0.000 description 5
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 5
- 238000009827 uniform distribution Methods 0.000 description 5
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 4
- 239000004721 Polyphenylene oxide Substances 0.000 description 4
- 238000005054 agglomeration Methods 0.000 description 4
- 230000002776 aggregation Effects 0.000 description 4
- 239000008367 deionised water Substances 0.000 description 4
- 229910021641 deionized water Inorganic materials 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 229920000570 polyether Polymers 0.000 description 4
- 230000009257 reactivity Effects 0.000 description 4
- 239000007779 soft material Substances 0.000 description 4
- 239000004416 thermosoftening plastic Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 229920000877 Melamine resin Polymers 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 150000001253 acrylic acids Chemical class 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000013590 bulk material Substances 0.000 description 3
- 238000001311 chemical methods and process Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- 150000002430 hydrocarbons Chemical class 0.000 description 3
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 3
- 238000007517 polishing process Methods 0.000 description 3
- 229920002492 poly(sulfone) Polymers 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 229920002689 polyvinyl acetate Polymers 0.000 description 3
- 239000011118 polyvinyl acetate Substances 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 229920002943 EPDM rubber Polymers 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 229930040373 Paraformaldehyde Natural products 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000004202 carbamide Substances 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 2
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000013013 elastic material Substances 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000011065 in-situ storage Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 229920000609 methyl cellulose Polymers 0.000 description 2
- 239000001923 methylcellulose Substances 0.000 description 2
- 235000010981 methylcellulose Nutrition 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920001084 poly(chloroprene) Polymers 0.000 description 2
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 2
- 229920002239 polyacrylonitrile Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000007781 pre-processing Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 150000003673 urethanes Chemical class 0.000 description 2
- 239000003190 viscoelastic substance Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229920006353 Acrylite® Polymers 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- 239000004801 Chlorinated PVC Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 1
- 239000004354 Hydroxyethyl cellulose Substances 0.000 description 1
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229920000457 chlorinated polyvinyl chloride Polymers 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 229920005570 flexible polymer Polymers 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000006261 foam material Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 description 1
- 239000001863 hydroxypropyl cellulose Substances 0.000 description 1
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 description 1
- 238000002329 infrared spectrum Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000001814 pectin Substances 0.000 description 1
- 229920001277 pectin Polymers 0.000 description 1
- 235000010987 pectin Nutrition 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- 230000008685 targeting Effects 0.000 description 1
- 235000019587 texture Nutrition 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 235000010215 titanium dioxide Nutrition 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000001429 visible spectrum Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0045—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by stacking sheets of abrasive material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Curing Cements, Concrete, And Artificial Stone (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
本書で開示されている実施形態は概して、化学機械研磨(CMP)プロセスで使用される研磨用物品の製造に関する。より具体的には、本書で開示されている実施形態は、複合研磨パッドに関する。
化学機械研磨(CMP)は通常、半導体デバイスの製造中に基板を平坦化するために使用される。CMP中に、処理されている基板は、そのデバイス表面が回転する研磨パッドに接するように置かれた状態で、キャリアヘッドに装着される。キャリアヘッドは、基板に制御可能な負荷をかけて、デバイス表面を研磨パッドに押し付ける。研磨粒子を有するスラリなどの研磨液が、典型的には、研磨パッドの表面に供給される。研磨パッドは、一定量の基板を研磨した後には典型的には摩耗するため、消耗品であり、交換が必要である。
図2Aは、本開示の一実施形態による研磨パッド200の概略的な断面斜視図である。研磨パッド200は、化学機械研磨によって基板を研磨するために、研磨ステーション100などの研磨ステーションにおいて使用されうる。
図12は、本開示による、研磨パッドを製造するための3D印刷ステーション1200の概略断面図である。研磨パッド200は、支持体1202上に印刷されうる。研磨パッド200は、CAD(computer−aided design)プログラムから、液滴噴射プリンタ1206によって形成される。液滴噴射プリンタ1206及び支持体1202は、印刷プロセス中に互いに対して移動しうる。
図14Aから図14Oは、本開示の実施形態による研磨パッド設計の概略図である。図14Aから図14Oの各々は、基板と接触して基板を研磨するための研磨フィーチャ1402a〜1402oを表す白色領域(白色ピクセル内の領域)と、ベースフィーチャ1404a〜1404oを表す黒色領域(黒色ピクセル内の領域)とを有する、ピクセルチャートを含む。研磨フィーチャ1402a〜1402oは、研磨パッド200の硬性フィーチャ204に類似していることがある。ベースフィーチャ1404a〜1404oは、研磨パッド200の弾性フィーチャ206に類似していることがある。白色領域は一般的に、白色領域の間の黒色領域内にチャネルが形成されるように、黒色領域の上方に突き出ている。研磨スラリは、研磨中に、チャネルを通って流れてよく、かつ、チャネル内に保持されうる。図14Aから図14Oに示す研磨パッドは、3Dプリンタを使用して材料の複数の層を堆積させることによって、形成されうる。複数の層の各々は、研磨フィーチャ1402a〜1402o、及びベースフィーチャ1404a〜1404oを形成するための、2つ以上の材料を含みうる。一実施形態では、研磨フィーチャ1402a〜1402oは、研磨パッドの表面上に溝及び/又はチャネルが形成されるように、材料の複数の層に平行な平面に対して直角方向に、ベースフィーチャ1404a〜1404oよりも厚いことがある。
図19には、プラテンアセンブリ1911の上方に配置されたキャリアヘッドアセンブリ1900を有する、例示的なCMPステーション1902の断面図が描かれている。キャリアヘッドアセンブリ1900は一般的に、キャリアヘッド1921に連結された駆動システム1901を備える。駆動システム1901は、キャリアヘッド1921の回転のスピード及び方向を制御するために駆動システム1901に信号を提供するコントローラ(図示せず)に、連結されうる。駆動システム1901は一般的に、キャリアヘッド1921に少なくとも回転運動を提供し、それに加えて、キャリアヘッド1921内に保持された基板1914のフィーチャ側1904が、処理中にCMPステーション1902のパッドアセンブリ1913の処理面1925に接して配置されうるように、プラテンアセンブリ1911に向かって動かされうる。典型的には、基板1914及び処理用パッドアセンブリ1913は、互いに対して回転して、基板1914のフィーチャ側1904から材料を除去する。プロセスパラメータに応じて、キャリアヘッド1921は、プラテンアセンブリ1911の回転スピードよりも速いか、遅いか、又はそれと等しい回転スピードで、回転する。キャリアヘッドアセンブリ1900は、静止したままであることも可能であり、処理中に経路内を移動しる。キャリアヘッドアセンブリ1900は、処理中に、パッドアセンブリ1913の処理面1925全体での、軌道運動又はスイープ運動も提供しうる。パッドアセンブリ1913は、接着層1906を使用してプラテンアセンブリ1911の上面に取外し可能に連結するよう、適合しうる。パッドアセンブリ1913は一般的に、処理面1925と接着層1906を含み、かつ、オプションのバッキング層1907を含みうる。
図22は、図19に記載のパッドアセンブリ1913として、印刷されたパッド2008(図20Aに示す)として、又は、研磨用物品2029(図20Bに示す)として使用されうる、研磨パッド2200の一実施形態の一部分を示している。研磨パッド2200は、図20A及び図20Bのパターニングされた表面2028を形成する研磨面2205を含む。研磨面2205は、研磨材料2270内に形成された複数のポア2232を含む。研磨材料2270は、CMPプロセスで使用される化学的要素及び物理的要素に対する耐性で選ばれる適切な接着剤2219によって、バッキング材料2222に接合されうる。研磨パッド2200内のポア2232は、実質的に円形又は楕円形であるが、円錐又は中空の円錐台(すなわち、実質的に平行な2平面間の円錐)といった、他の環状の幾何形状を含みうる。研磨パッド2200は、また、図14Aから図14Oに示した研磨パッド設計、又は本書に記載の他の設計のいずれにも合致するように、形成されうる。
Claims (14)
- 研磨パッドを形成する方法であって、
ターゲット厚に到達するよう、プリンタを用いて複数の層を堆積させることであって、表面の一又は複数の第1領域の上に第1材料を堆積させることと、前記表面の一又は複数の第2領域の上に第2材料を堆積させることと、を含み、この際、前記一又は複数の第1領域および前記一又は複数の第2領域が前記複数の層の各々の連続した部分を形成する、複数の層を堆積させること、
前記第1材料を含む一又は複数の第1フィーチャと、前記第2材料を含む一又は複数の第2フィーチャとを有する複合パッド本体を形成するために、前記複数の層を固化させることであって、前記一又は複数の第1フィーチャと前記一又は複数の第2フィーチャとが一体化した本体を形成する、前記複数の層を固化させること、
を含み、
前記一又は複数の第1フィーチャは前記一又は複数の第2フィーチャから突出し、前記一又は複数の第1フィーチャの各々の表面は前記研磨パッドの研磨面を形成する、方法。 - 前記第1材料は、第3材料及び第4材料の液滴を堆積させることによって形成される、第1の材料混合物を含む、請求項1に記載の方法。
- 前記第2材料は、第5材料及び第6材料の液滴を堆積させることによって形成される、第2の材料混合物を含む、請求項2に記載の方法。
- 前記第1材料は一又は複数の熱可塑性ポリマーを含み、前記第2材料は前記第1材料より硬い、請求項1に記載の方法。
- 前記第1材料は、ポリウレタン、ポリメチルメタクリレート、又はアクリレートを含む一又は複数の熱可塑性ポリマー、若しくは、それらの共重合体、グラフト鎖、又は混合物を含む、請求項1に記載の方法。
- 研磨パッドを形成する方法であって、
複合研磨パッド本体を形成することを含み、
前記複合研磨パッド本体を形成することが、
第1材料の一又は複数の第1フィーチャであって、前記第1材料が、一又は複数の第1フィーチャの各々の少なくとも一部を形成する複数の層に第2材料及び第3材料の液滴を堆積させることにより形成される第1材料混合物を含む、一又は複数の第1フィーチャと、
第4材料から形成されるベース材料層であって、前記第4材料が、ベース材料層の少なくとも一部を形成する複数の層に第5材料及び第6材料の液滴を堆積させることにより形成される第2材料混合物を含む、ベース材料層と、
を形成することを含み、
前記一又は複数の第1フィーチャは前記ベース材料層から突出し、前記一又は複数の第1フィーチャの各々の表面は前記研磨パッドの研磨面を形成する、方法。 - 前記第1材料は第1硬度を有し、前記第4材料は前記第1硬度とは異なる第2硬度を有する、請求項6に記載の方法。
- 前記第1硬度は前記第2硬度より大きい、請求項7に記載の方法。
- 前記一又は複数の第1フィーチャ及び前記ベース材料層は、前記複合研磨パッド本体全体にわたって所定のヤング率、所定の貯蔵弾性率、又は所定の損失弾性率を実現するように配置されている、請求項6に記載の方法。
- 前記一又は複数の第1フィーチャ又は前記ベース材料層を貫通して及び/又は当接して、一又は複数の観察窓を形成すること、を更に含む、請求項6に記載の方法。
- 複合研磨パッド本体を形成する方法であって、
一又は複数の第1フィーチャ及びベース材料層を形成するために、プリンタを用いて複数の層を堆積させることを含み、
前記一又は複数の第1フィーチャの表面は研磨面を形成し、
前記一又は複数の第1フィーチャは第1材料を含み、
前記第1材料は第1硬度を有し、
前記第1材料は第1ポリマー材料及び第2ポリマー材料を含み、
前記ベース材料層は第2材料を含み、
前記第2材料は、前記第1硬度より小さい第2硬度を有し、
前記第2材料は、前記第1ポリマー材料及び第3ポリマー材料を含み、
前記一又は複数の第1フィーチャは前記ベース材料層から突出し、
前記第1材料中の前記第1ポリマー材料の濃度は、前記第2材料中の前記第1ポリマー材料の濃度よりも大きい、方法。 - 前記一又は複数の第1フィーチャ及び前記ベース材料層は、前記複合研磨パッド本体全体にわたって所定のヤング率、所定の貯蔵弾性率、又は所定の損失弾性率を実現するように配置されている、請求項11に記載の方法。
- 前記一又は複数の第1フィーチャ又は前記ベース材料層を貫通して及び/又は当接して、一又は複数の観察窓を形成すること、を更に含む、請求項11に記載の方法。
- 前記第1ポリマー材料はアクリレートを含む、請求項11に記載の方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021034028A JP2021112819A (ja) | 2014-10-17 | 2021-03-04 | 付加製造プロセスを使用する、複合材料特性を有するcmpパッド構造 |
JP2023114970A JP2023153812A (ja) | 2014-10-17 | 2023-07-13 | 付加製造プロセスを使用する、複合材料特性を有するcmpパッド構造 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201462065270P | 2014-10-17 | 2014-10-17 | |
US201462065193P | 2014-10-17 | 2014-10-17 | |
US62/065,193 | 2014-10-17 | ||
US62/065,270 | 2014-10-17 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017520394A Division JP6545261B2 (ja) | 2014-10-17 | 2015-04-24 | 付加製造プロセスを使用する、複合材料特性を有するcmpパッド構造 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021034028A Division JP2021112819A (ja) | 2014-10-17 | 2021-03-04 | 付加製造プロセスを使用する、複合材料特性を有するcmpパッド構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019166633A JP2019166633A (ja) | 2019-10-03 |
JP6849731B2 true JP6849731B2 (ja) | 2021-03-24 |
Family
ID=55747083
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017520394A Active JP6545261B2 (ja) | 2014-10-17 | 2015-04-24 | 付加製造プロセスを使用する、複合材料特性を有するcmpパッド構造 |
JP2019081720A Active JP6849731B2 (ja) | 2014-10-17 | 2019-04-23 | 付加製造プロセスを使用する、複合材料特性を有するcmpパッド構造 |
JP2021034028A Pending JP2021112819A (ja) | 2014-10-17 | 2021-03-04 | 付加製造プロセスを使用する、複合材料特性を有するcmpパッド構造 |
JP2023114970A Pending JP2023153812A (ja) | 2014-10-17 | 2023-07-13 | 付加製造プロセスを使用する、複合材料特性を有するcmpパッド構造 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017520394A Active JP6545261B2 (ja) | 2014-10-17 | 2015-04-24 | 付加製造プロセスを使用する、複合材料特性を有するcmpパッド構造 |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021034028A Pending JP2021112819A (ja) | 2014-10-17 | 2021-03-04 | 付加製造プロセスを使用する、複合材料特性を有するcmpパッド構造 |
JP2023114970A Pending JP2023153812A (ja) | 2014-10-17 | 2023-07-13 | 付加製造プロセスを使用する、複合材料特性を有するcmpパッド構造 |
Country Status (6)
Country | Link |
---|---|
US (2) | US10384330B2 (ja) |
JP (4) | JP6545261B2 (ja) |
KR (4) | KR20240015167A (ja) |
CN (2) | CN107078048B (ja) |
SG (2) | SG10202002601QA (ja) |
WO (1) | WO2016060712A1 (ja) |
Families Citing this family (55)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10041745B2 (en) | 2010-05-04 | 2018-08-07 | Fractal Heatsink Technologies LLC | Fractal heat transfer device |
US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
JP6545261B2 (ja) | 2014-10-17 | 2019-07-17 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 付加製造プロセスを使用する、複合材料特性を有するcmpパッド構造 |
US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
WO2017051182A1 (en) * | 2015-09-25 | 2017-03-30 | Photocentric Limited | Methods for making an object and formulations for use in said methods |
CN112045555B (zh) * | 2015-10-16 | 2022-12-30 | 应用材料公司 | 使用增材制造工艺形成先进抛光垫的方法和设备 |
KR20230169424A (ko) | 2015-10-30 | 2023-12-15 | 어플라이드 머티어리얼스, 인코포레이티드 | 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법 |
US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
JP6941618B2 (ja) | 2016-03-09 | 2021-09-29 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 付加製造で製造される形状の補正 |
WO2017155969A1 (en) | 2016-03-09 | 2017-09-14 | Applied Materials, Inc. | Pad structure and fabrication methods |
WO2018064162A1 (en) * | 2016-09-30 | 2018-04-05 | Applied Materials, Inc. | Additive manufacturing of polishing pads on a conveyor |
BR112019012938A2 (pt) | 2016-12-23 | 2019-12-10 | 3M Innovative Properties Co | artigos abrasivos de ligação de polímero e métodos de fabricação dos mesmos |
US10596763B2 (en) | 2017-04-21 | 2020-03-24 | Applied Materials, Inc. | Additive manufacturing with array of energy sources |
US10967482B2 (en) | 2017-05-25 | 2021-04-06 | Applied Materials, Inc. | Fabrication of polishing pad by additive manufacturing onto mold |
US10882160B2 (en) | 2017-05-25 | 2021-01-05 | Applied Materials, Inc. | Correction of fabricated shapes in additive manufacturing using sacrificial material |
TW202325554A (zh) * | 2017-05-25 | 2023-07-01 | 美商應用材料股份有限公司 | 積層製造系統及使用其製造拋光墊的方法 |
US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
US11072050B2 (en) * | 2017-08-04 | 2021-07-27 | Applied Materials, Inc. | Polishing pad with window and manufacturing methods thereof |
WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
CN108081158A (zh) * | 2017-12-15 | 2018-05-29 | 清华大学 | 砂轮及其制备方法 |
JP6887371B2 (ja) * | 2017-12-20 | 2021-06-16 | 株式会社荏原製作所 | 基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体 |
KR20200108098A (ko) | 2018-02-05 | 2020-09-16 | 어플라이드 머티어리얼스, 인코포레이티드 | 3d 프린트된 cmp 패드들을 위한 압전 엔드포인팅 |
WO2019190676A1 (en) | 2018-03-30 | 2019-10-03 | Applied Materials, Inc. | Integrating 3d printing into multi-process fabrication schemes |
US11167375B2 (en) | 2018-08-10 | 2021-11-09 | The Research Foundation For The State University Of New York | Additive manufacturing processes and additively manufactured products |
KR20210042171A (ko) | 2018-09-04 | 2021-04-16 | 어플라이드 머티어리얼스, 인코포레이티드 | 진보한 폴리싱 패드들을 위한 제형들 |
US20200130139A1 (en) * | 2018-10-31 | 2020-04-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Device for conditioning chemical mechanical polishing |
US20220371274A1 (en) * | 2018-11-19 | 2022-11-24 | Continuous Composites Inc. | System for additively manufacturing composite structure |
US11046615B2 (en) * | 2018-12-19 | 2021-06-29 | Raytheon Technologies Corporation | Self-healing matrix for a ceramic composite |
US20200230781A1 (en) * | 2019-01-23 | 2020-07-23 | Applied Materials, Inc. | Polishing pads formed using an additive manufacturing process and methods related thereto |
US11851570B2 (en) * | 2019-04-12 | 2023-12-26 | Applied Materials, Inc. | Anionic polishing pads formed by printing processes |
US20200373279A1 (en) * | 2019-05-24 | 2020-11-26 | Applied Materials, Inc. | Color Conversion Layers for Light-Emitting Devices |
US12006442B2 (en) * | 2019-09-11 | 2024-06-11 | Applied Materials, Inc. | Additive manufacturing of polishing pads |
US20210069860A1 (en) * | 2019-09-11 | 2021-03-11 | Applied Materials, Inc. | Compositions and Methods of Additive Manufacturing of Polishing Pads |
US11865588B2 (en) * | 2019-11-12 | 2024-01-09 | Alliance Material Co., Ltd. | Probe pin cleaning pad and cleaning method for probe pin |
CN112828760A (zh) * | 2019-11-22 | 2021-05-25 | 夏泰鑫半导体(青岛)有限公司 | 研磨头以及具有该研磨头的化学机械研磨装置 |
US11813712B2 (en) | 2019-12-20 | 2023-11-14 | Applied Materials, Inc. | Polishing pads having selectively arranged porosity |
US11470956B2 (en) | 2020-03-06 | 2022-10-18 | Applied Materials, Inc. | Brush, method of forming a brush, and structure embodied in a machine readable medium used in a design process |
US11787117B2 (en) * | 2020-04-23 | 2023-10-17 | Rtx Corporation | Fabricating ceramic structures |
US11638979B2 (en) | 2020-06-09 | 2023-05-02 | Applied Materials, Inc. | Additive manufacturing of polishing pads |
US11612978B2 (en) | 2020-06-09 | 2023-03-28 | Applied Materials, Inc. | Additive manufacturing of polishing pads |
US11738517B2 (en) | 2020-06-18 | 2023-08-29 | Applied Materials, Inc. | Multi dispense head alignment using image processing |
US11806829B2 (en) | 2020-06-19 | 2023-11-07 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
KR20230041786A (ko) | 2020-07-24 | 2023-03-24 | 어플라이드 머티어리얼스, 인코포레이티드 | Uv-led 경화를 위한 티올계 가교제들을 갖는 양자점 배합물들 |
US11942576B2 (en) | 2020-08-28 | 2024-03-26 | Applied Materials, Inc. | Blue color converter for micro LEDs |
US11404612B2 (en) | 2020-08-28 | 2022-08-02 | Applied Materials, Inc. | LED device having blue photoluminescent material and red/green quantum dots |
US11646397B2 (en) | 2020-08-28 | 2023-05-09 | Applied Materials, Inc. | Chelating agents for quantum dot precursor materials in color conversion layers for micro-LEDs |
US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
US11951590B2 (en) | 2021-06-14 | 2024-04-09 | Applied Materials, Inc. | Polishing pads with interconnected pores |
US11911870B2 (en) * | 2021-09-10 | 2024-02-27 | Applied Materials, Inc. | Polishing pads for high temperature processing |
CN114043380B (zh) * | 2021-11-18 | 2022-11-29 | 北京烁科精微电子装备有限公司 | 一种研磨垫及具有其的研磨装置 |
Family Cites Families (678)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2001911A (en) | 1932-04-21 | 1935-05-21 | Carborundum Co | Abrasive articles |
US3357598A (en) | 1965-09-21 | 1967-12-12 | Dole Valve Co | Adjustable liquid dispenser |
US3741116A (en) | 1970-06-25 | 1973-06-26 | American Screen Process Equip | Vacuum belt |
US4459779A (en) | 1982-09-16 | 1984-07-17 | International Business Machines Corporation | Fixed abrasive grinding media |
US4575330A (en) | 1984-08-08 | 1986-03-11 | Uvp, Inc. | Apparatus for production of three-dimensional objects by stereolithography |
US4836832A (en) | 1986-08-11 | 1989-06-06 | Minnesota Mining And Manufacturing Company | Method of preparing coated abrasive having radiation curable binder |
US4841680A (en) | 1987-08-25 | 1989-06-27 | Rodel, Inc. | Inverted cell pad material for grinding, lapping, shaping and polishing |
US4942001A (en) | 1988-03-02 | 1990-07-17 | Inc. DeSoto | Method of forming a three-dimensional object by stereolithography and composition therefore |
DE3808951A1 (de) | 1988-03-17 | 1989-10-05 | Basf Ag | Photopolymerisierbare, zur herstellung von druckformen geeignete druckplatte |
US4985340A (en) | 1988-06-01 | 1991-01-15 | Minnesota Mining And Manufacturing Company | Energy curable compositions: two component curing agents |
US4844144A (en) | 1988-08-08 | 1989-07-04 | Desoto, Inc. | Investment casting utilizing patterns produced by stereolithography |
JPH07102724B2 (ja) | 1988-08-31 | 1995-11-08 | ジューキ株式会社 | 印字装置 |
US5121329A (en) | 1989-10-30 | 1992-06-09 | Stratasys, Inc. | Apparatus and method for creating three-dimensional objects |
US5387380A (en) | 1989-12-08 | 1995-02-07 | Massachusetts Institute Of Technology | Three-dimensional printing techniques |
DE3942859A1 (de) | 1989-12-23 | 1991-07-04 | Basf Ag | Verfahren zur herstellung von bauteilen |
US5626919A (en) | 1990-03-01 | 1997-05-06 | E. I. Du Pont De Nemours And Company | Solid imaging apparatus and method with coating station |
US5096530A (en) | 1990-06-28 | 1992-03-17 | 3D Systems, Inc. | Resin film recoating method and apparatus |
JP2929779B2 (ja) | 1991-02-15 | 1999-08-03 | トヨタ自動車株式会社 | 炭素被膜付撥水ガラス |
DE69215439T2 (de) | 1991-06-25 | 1997-05-22 | Eastman Kodak Co | Photographisches Element, enthaltend eine Spannung absorbierende, schützende Schicht |
US5212910A (en) | 1991-07-09 | 1993-05-25 | Intel Corporation | Composite polishing pad for semiconductor process |
US5193316A (en) | 1991-10-29 | 1993-03-16 | Texas Instruments Incorporated | Semiconductor wafer polishing using a hydrostatic medium |
US5287663A (en) | 1992-01-21 | 1994-02-22 | National Semiconductor Corporation | Polishing pad and method for polishing semiconductor wafers |
US5178646A (en) | 1992-01-22 | 1993-01-12 | Minnesota Mining And Manufacturing Company | Coatable thermally curable binder presursor solutions modified with a reactive diluent, abrasive articles incorporating same, and methods of making said abrasive articles |
US6022264A (en) * | 1997-02-10 | 2000-02-08 | Rodel Inc. | Polishing pad and methods relating thereto |
US6099394A (en) | 1998-02-10 | 2000-08-08 | Rodel Holdings, Inc. | Polishing system having a multi-phase polishing substrate and methods relating thereto |
MY114512A (en) | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
US6746225B1 (en) | 1992-11-30 | 2004-06-08 | Bechtel Bwtx Idaho, Llc | Rapid solidification processing system for producing molds, dies and related tooling |
WO1994013434A1 (en) | 1992-12-17 | 1994-06-23 | Minnesota Mining And Manufacturing Company | Reduced viscosity slurries, abrasive articles made therefrom, and methods of making said articles |
US5453312A (en) | 1993-10-29 | 1995-09-26 | Minnesota Mining And Manufacturing Company | Abrasive article, a process for its manufacture, and a method of using it to reduce a workpiece surface |
JPH07297195A (ja) | 1994-04-27 | 1995-11-10 | Speedfam Co Ltd | 半導体装置の平坦化方法及び平坦化装置 |
US5906863A (en) | 1994-08-08 | 1999-05-25 | Lombardi; John | Methods for the preparation of reinforced three-dimensional bodies |
JPH08132342A (ja) | 1994-11-08 | 1996-05-28 | Hitachi Ltd | 半導体集積回路装置の製造装置 |
KR100258802B1 (ko) | 1995-02-15 | 2000-06-15 | 전주범 | 평탄화 장치 및 그를 이용한 평탄화 방법 |
US6719818B1 (en) | 1995-03-28 | 2004-04-13 | Applied Materials, Inc. | Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations |
US5533923A (en) | 1995-04-10 | 1996-07-09 | Applied Materials, Inc. | Chemical-mechanical polishing pad providing polishing unformity |
US5645471A (en) | 1995-08-11 | 1997-07-08 | Minnesota Mining And Manufacturing Company | Method of texturing a substrate using an abrasive article having multiple abrasive natures |
US5605760A (en) | 1995-08-21 | 1997-02-25 | Rodel, Inc. | Polishing pads |
JPH0976353A (ja) | 1995-09-12 | 1997-03-25 | Toshiba Corp | 光造形装置 |
JP3324643B2 (ja) | 1995-10-25 | 2002-09-17 | 日本電気株式会社 | 研磨パッド |
US5738574A (en) | 1995-10-27 | 1998-04-14 | Applied Materials, Inc. | Continuous processing system for chemical mechanical polishing |
US5905099A (en) | 1995-11-06 | 1999-05-18 | Minnesota Mining And Manufacturing Company | Heat-activatable adhesive composition |
US5609517A (en) | 1995-11-20 | 1997-03-11 | International Business Machines Corporation | Composite polishing pad |
JP3566430B2 (ja) | 1995-12-20 | 2004-09-15 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
US5624303A (en) | 1996-01-22 | 1997-04-29 | Micron Technology, Inc. | Polishing pad and a method for making a polishing pad with covalently bonded particles |
US6095084A (en) | 1996-02-02 | 2000-08-01 | Applied Materials, Inc. | High density plasma process chamber |
US5778481A (en) | 1996-02-15 | 1998-07-14 | International Business Machines Corporation | Silicon wafer cleaning and polishing pads |
US5690540A (en) | 1996-02-23 | 1997-11-25 | Micron Technology, Inc. | Spiral grooved polishing pad for chemical-mechanical planarization of semiconductor wafers |
US6090475A (en) | 1996-05-24 | 2000-07-18 | Micron Technology Inc. | Polishing pad, methods of manufacturing and use |
JP3498881B2 (ja) | 1996-05-27 | 2004-02-23 | セントラル硝子株式会社 | 撥水性ガラスの製法 |
US5976000A (en) | 1996-05-28 | 1999-11-02 | Micron Technology, Inc. | Polishing pad with incompressible, highly soluble particles for chemical-mechanical planarization of semiconductor wafers |
US5748434A (en) | 1996-06-14 | 1998-05-05 | Applied Materials, Inc. | Shield for an electrostatic chuck |
GB2316414B (en) | 1996-07-31 | 2000-10-11 | Tosoh Corp | Abrasive shaped article, abrasive disc and polishing method |
US5795218A (en) | 1996-09-30 | 1998-08-18 | Micron Technology, Inc. | Polishing pad with elongated microcolumns |
US6244575B1 (en) | 1996-10-02 | 2001-06-12 | Micron Technology, Inc. | Method and apparatus for vaporizing liquid precursors and system for using same |
US5876490A (en) | 1996-12-09 | 1999-03-02 | International Business Machines Corporatin | Polish process and slurry for planarization |
WO1998028108A1 (en) | 1996-12-20 | 1998-07-02 | Unique Technology International Private Limited | Manufacture of porous polishing pad |
KR100210840B1 (ko) | 1996-12-24 | 1999-07-15 | 구본준 | 기계 화학적 연마 방법 및 그 장치 |
US5876268A (en) | 1997-01-03 | 1999-03-02 | Minnesota Mining And Manufacturing Company | Method and article for the production of optical quality surfaces on glass |
JP4163756B2 (ja) | 1997-01-13 | 2008-10-08 | ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド | ホトリソグラフィーによって形成された表面パターンを有するポリマー研磨パッド及びこれに関する方法 |
US5965460A (en) | 1997-01-29 | 1999-10-12 | Mac Dermid, Incorporated | Polyurethane composition with (meth)acrylate end groups useful in the manufacture of polishing pads |
US6231629B1 (en) * | 1997-03-07 | 2001-05-15 | 3M Innovative Properties Company | Abrasive article for providing a clear surface finish on glass |
US5910471A (en) | 1997-03-07 | 1999-06-08 | Minnesota Mining And Manufacturing Company | Abrasive article for providing a clear surface finish on glass |
JPH10249709A (ja) | 1997-03-14 | 1998-09-22 | Chiyoda Kk | 研磨布 |
US5944583A (en) | 1997-03-17 | 1999-08-31 | International Business Machines Corporation | Composite polish pad for CMP |
US6682402B1 (en) | 1997-04-04 | 2004-01-27 | Rodel Holdings, Inc. | Polishing pads and methods relating thereto |
US6062958A (en) | 1997-04-04 | 2000-05-16 | Micron Technology, Inc. | Variable abrasive polishing pad for mechanical and chemical-mechanical planarization |
US6648733B2 (en) * | 1997-04-04 | 2003-11-18 | Rodel Holdings, Inc. | Polishing pads and methods relating thereto |
US5940674A (en) | 1997-04-09 | 1999-08-17 | Massachusetts Institute Of Technology | Three-dimensional product manufacture using masks |
US6126532A (en) | 1997-04-18 | 2000-10-03 | Cabot Corporation | Polishing pads for a semiconductor substrate |
ES2187960T3 (es) | 1997-04-18 | 2003-06-16 | Cabot Microelectronics Corp | Tampon para pulir para un sustrato semiconductor. |
ATE445230T1 (de) | 1997-04-30 | 2009-10-15 | Minnesota Mining & Mfg | Verfahren zum planarisieren der oberfläche eines halbleiterwafers |
US8092707B2 (en) | 1997-04-30 | 2012-01-10 | 3M Innovative Properties Company | Compositions and methods for modifying a surface suited for semiconductor fabrication |
US5945058A (en) | 1997-05-13 | 1999-08-31 | 3D Systems, Inc. | Method and apparatus for identifying surface features associated with selected lamina of a three-dimensional object being stereolithographically formed |
US5921855A (en) | 1997-05-15 | 1999-07-13 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing system |
US6273806B1 (en) | 1997-05-15 | 2001-08-14 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus |
US6692338B1 (en) | 1997-07-23 | 2004-02-17 | Lsi Logic Corporation | Through-pad drainage of slurry during chemical mechanical polishing |
US6736714B2 (en) | 1997-07-30 | 2004-05-18 | Praxair S.T. Technology, Inc. | Polishing silicon wafers |
US5919082A (en) * | 1997-08-22 | 1999-07-06 | Micron Technology, Inc. | Fixed abrasive polishing pad |
US6121143A (en) | 1997-09-19 | 2000-09-19 | 3M Innovative Properties Company | Abrasive articles comprising a fluorochemical agent for wafer surface modification |
US5888121A (en) | 1997-09-23 | 1999-03-30 | Lsi Logic Corporation | Controlling groove dimensions for enhanced slurry flow |
US5932040A (en) | 1997-10-01 | 1999-08-03 | Bibielle S.P.A. | Method for producing a ring of abrasive elements from which to form a rotary brush |
US6950193B1 (en) | 1997-10-28 | 2005-09-27 | Rockwell Automation Technologies, Inc. | System for monitoring substrate conditions |
US6039836A (en) | 1997-12-19 | 2000-03-21 | Lam Research Corporation | Focus rings |
US6231942B1 (en) | 1998-01-21 | 2001-05-15 | Trexel, Inc. | Method and apparatus for microcellular polypropylene extrusion, and polypropylene articles produced thereby |
JPH11254542A (ja) | 1998-03-11 | 1999-09-21 | Sanyo Electric Co Ltd | 光造形装置のモニタリングシステム |
US6228133B1 (en) | 1998-05-01 | 2001-05-08 | 3M Innovative Properties Company | Abrasive articles having abrasive layer bond system derived from solid, dry-coated binder precursor particles having a fusible, radiation curable component |
JPH11347761A (ja) | 1998-06-12 | 1999-12-21 | Mitsubishi Heavy Ind Ltd | レーザによる3次元造形装置 |
US6122564A (en) | 1998-06-30 | 2000-09-19 | Koch; Justin | Apparatus and methods for monitoring and controlling multi-layer laser cladding |
US6117000A (en) | 1998-07-10 | 2000-09-12 | Cabot Corporation | Polishing pad for a semiconductor substrate |
US6322728B1 (en) | 1998-07-10 | 2001-11-27 | Jeneric/Pentron, Inc. | Mass production of dental restorations by solid free-form fabrication methods |
DE19834559A1 (de) | 1998-07-31 | 2000-02-03 | Friedrich Schiller Uni Jena Bu | Verfahren zur Herstellung von Werkzeugen für die Bearbeitung von Oberflächen |
JP2000061817A (ja) | 1998-08-24 | 2000-02-29 | Nikon Corp | 研磨パッド |
US6095902A (en) | 1998-09-23 | 2000-08-01 | Rodel Holdings, Inc. | Polyether-polyester polyurethane polishing pads and related methods |
US6602380B1 (en) | 1998-10-28 | 2003-08-05 | Micron Technology, Inc. | Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine |
US6325706B1 (en) | 1998-10-29 | 2001-12-04 | Lam Research Corporation | Use of zeta potential during chemical mechanical polishing for end point detection |
US6176992B1 (en) | 1998-11-03 | 2001-01-23 | Nutool, Inc. | Method and apparatus for electro-chemical mechanical deposition |
US6390890B1 (en) | 1999-02-06 | 2002-05-21 | Charles J Molnar | Finishing semiconductor wafers with a fixed abrasive finishing element |
JP3641956B2 (ja) | 1998-11-30 | 2005-04-27 | 三菱住友シリコン株式会社 | 研磨スラリーの再生システム |
US6206759B1 (en) | 1998-11-30 | 2001-03-27 | Micron Technology, Inc. | Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machines |
US7425250B2 (en) | 1998-12-01 | 2008-09-16 | Novellus Systems, Inc. | Electrochemical mechanical processing apparatus |
WO2000043159A1 (en) | 1999-01-21 | 2000-07-27 | Rodel Holdings, Inc. | Improved polishing pads and methods relating thereto |
US6994607B2 (en) | 2001-12-28 | 2006-02-07 | Applied Materials, Inc. | Polishing pad with window |
US6179709B1 (en) | 1999-02-04 | 2001-01-30 | Applied Materials, Inc. | In-situ monitoring of linear substrate polishing operations |
US6641463B1 (en) | 1999-02-06 | 2003-11-04 | Beaver Creek Concepts Inc | Finishing components and elements |
EP1211023B1 (en) | 1999-03-30 | 2008-05-28 | Nikon Corporation | Polishing body, polisher, polishing method, and method for producing semiconductor device |
US6217426B1 (en) | 1999-04-06 | 2001-04-17 | Applied Materials, Inc. | CMP polishing pad |
US6213845B1 (en) | 1999-04-26 | 2001-04-10 | Micron Technology, Inc. | Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same |
US6609113B1 (en) | 1999-05-03 | 2003-08-19 | The Chase Manhattan Bank | Method and system for processing internet payments using the electronic funds transfer network |
US6338901B1 (en) | 1999-05-03 | 2002-01-15 | Guardian Industries Corporation | Hydrophobic coating including DLC on substrate |
US6328634B1 (en) | 1999-05-11 | 2001-12-11 | Rodel Holdings Inc. | Method of polishing |
US6196899B1 (en) | 1999-06-21 | 2001-03-06 | Micron Technology, Inc. | Polishing apparatus |
US6319108B1 (en) | 1999-07-09 | 2001-11-20 | 3M Innovative Properties Company | Metal bond abrasive article comprising porous ceramic abrasive composites and method of using same to abrade a workpiece |
JP2001105329A (ja) | 1999-08-02 | 2001-04-17 | Ebara Corp | 研磨用砥石 |
US6232236B1 (en) | 1999-08-03 | 2001-05-15 | Applied Materials, Inc. | Apparatus and method for controlling plasma uniformity in a semiconductor wafer processing system |
US6328632B1 (en) | 1999-08-31 | 2001-12-11 | Micron Technology, Inc. | Polishing pads and planarizing machines for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies |
US6257973B1 (en) | 1999-11-04 | 2001-07-10 | Norton Company | Coated abrasive discs |
US6201208B1 (en) | 1999-11-04 | 2001-03-13 | Wisconsin Alumni Research Foundation | Method and apparatus for plasma processing with control of ion energy distribution at the substrates |
JP3439402B2 (ja) * | 1999-11-05 | 2003-08-25 | Necエレクトロニクス株式会社 | 半導体装置の製造方法 |
JP2001138212A (ja) * | 1999-11-15 | 2001-05-22 | Toshiro Doi | 精密研磨装置 |
US6399501B2 (en) | 1999-12-13 | 2002-06-04 | Applied Materials, Inc. | Method and apparatus for detecting polishing endpoint with optical monitoring |
US6428586B1 (en) | 1999-12-14 | 2002-08-06 | Rodel Holdings Inc. | Method of manufacturing a polymer or polymer/composite polishing pad |
US6368184B1 (en) | 2000-01-06 | 2002-04-09 | Advanced Micro Devices, Inc. | Apparatus for determining metal CMP endpoint using integrated polishing pad electrodes |
US6241596B1 (en) | 2000-01-14 | 2001-06-05 | Applied Materials, Inc. | Method and apparatus for chemical mechanical polishing using a patterned pad |
US6506097B1 (en) | 2000-01-18 | 2003-01-14 | Applied Materials, Inc. | Optical monitoring in a two-step chemical mechanical polishing process |
WO2001053040A1 (en) | 2000-01-19 | 2001-07-26 | Rodel Holdings, Inc. | Printing of polishing pads |
US7071041B2 (en) | 2000-01-20 | 2006-07-04 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device |
US6746311B1 (en) | 2000-01-24 | 2004-06-08 | 3M Innovative Properties Company | Polishing pad with release layer |
US6309276B1 (en) | 2000-02-01 | 2001-10-30 | Applied Materials, Inc. | Endpoint monitoring with polishing rate change |
US6991528B2 (en) | 2000-02-17 | 2006-01-31 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US20010046834A1 (en) | 2000-02-28 | 2001-11-29 | Anuradha Ramana | Pad surface texture formed by solid phase droplets |
KR100502268B1 (ko) | 2000-03-01 | 2005-07-22 | 가부시끼가이샤 히다치 세이사꾸쇼 | 플라즈마처리장치 및 방법 |
US6797623B2 (en) | 2000-03-09 | 2004-09-28 | Sony Corporation | Methods of producing and polishing semiconductor device and polishing apparatus |
US20030207959A1 (en) | 2000-03-13 | 2003-11-06 | Eduardo Napadensky | Compositions and methods for use in three dimensional model printing |
US8481241B2 (en) | 2000-03-13 | 2013-07-09 | Stratasys Ltd. | Compositions and methods for use in three dimensional model printing |
US7300619B2 (en) | 2000-03-13 | 2007-11-27 | Objet Geometries Ltd. | Compositions and methods for use in three dimensional model printing |
US6569373B2 (en) | 2000-03-13 | 2003-05-27 | Object Geometries Ltd. | Compositions and methods for use in three dimensional model printing |
WO2001068322A1 (en) | 2000-03-15 | 2001-09-20 | Rodel Holdings, Inc. | Window portion with an adjusted rate of wear |
ATE278535T1 (de) | 2000-03-24 | 2004-10-15 | Generis Gmbh | Verfahren und vorrichtung zur herstellung eines strukturbauteils mittels einer mehrschicht- auftragstechnik, und form oder kern herstellbar durch dieses verfahren |
KR20010093677A (ko) | 2000-03-29 | 2001-10-29 | 추후기재 | 향상된 슬러리 분배를 위하여 특수 설계된 연마 패드 |
US6313038B1 (en) | 2000-04-26 | 2001-11-06 | Micron Technology, Inc. | Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates |
WO2001083167A1 (en) | 2000-05-03 | 2001-11-08 | Rodel Holdings, Inc. | Polishing pad with a seam which is reinforced with caulking material |
US6387289B1 (en) | 2000-05-04 | 2002-05-14 | Micron Technology, Inc. | Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies |
US8485862B2 (en) | 2000-05-19 | 2013-07-16 | Applied Materials, Inc. | Polishing pad for endpoint detection and related methods |
US6267641B1 (en) | 2000-05-19 | 2001-07-31 | Motorola, Inc. | Method of manufacturing a semiconductor component and chemical-mechanical polishing system therefor |
US6736709B1 (en) | 2000-05-27 | 2004-05-18 | Rodel Holdings, Inc. | Grooved polishing pads for chemical mechanical planarization |
US6860802B1 (en) | 2000-05-27 | 2005-03-01 | Rohm And Haas Electric Materials Cmp Holdings, Inc. | Polishing pads for chemical mechanical planarization |
US6749485B1 (en) | 2000-05-27 | 2004-06-15 | Rodel Holdings, Inc. | Hydrolytically stable grooved polishing pads for chemical mechanical planarization |
US6454634B1 (en) | 2000-05-27 | 2002-09-24 | Rodel Holdings Inc. | Polishing pads for chemical mechanical planarization |
KR100726303B1 (ko) | 2000-05-31 | 2007-06-13 | 제이에스알 가부시끼가이샤 | 연마체 |
JP3925041B2 (ja) | 2000-05-31 | 2007-06-06 | Jsr株式会社 | 研磨パッド用組成物及びこれを用いた研磨パッド |
US6478914B1 (en) | 2000-06-09 | 2002-11-12 | Micron Technology, Inc. | Method for attaching web-based polishing materials together on a polishing tool |
US6656019B1 (en) | 2000-06-29 | 2003-12-02 | International Business Machines Corporation | Grooved polishing pads and methods of use |
JP2002028849A (ja) * | 2000-07-17 | 2002-01-29 | Jsr Corp | 研磨パッド |
US20020016139A1 (en) | 2000-07-25 | 2002-02-07 | Kazuto Hirokawa | Polishing tool and manufacturing method therefor |
US6520834B1 (en) | 2000-08-09 | 2003-02-18 | Micron Technology, Inc. | Methods and apparatuses for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates |
US6776699B2 (en) | 2000-08-14 | 2004-08-17 | 3M Innovative Properties Company | Abrasive pad for CMP |
US6736869B1 (en) | 2000-08-28 | 2004-05-18 | Micron Technology, Inc. | Method for forming a planarizing pad for planarization of microelectronic substrates |
US6592443B1 (en) | 2000-08-30 | 2003-07-15 | Micron Technology, Inc. | Method and apparatus for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates |
US6638831B1 (en) | 2000-08-31 | 2003-10-28 | Micron Technology, Inc. | Use of a reference fiducial on a semiconductor package to monitor and control a singulation method |
JP3886712B2 (ja) | 2000-09-08 | 2007-02-28 | シャープ株式会社 | 半導体装置の製造方法 |
US6477926B1 (en) | 2000-09-15 | 2002-11-12 | Ppg Industries Ohio, Inc. | Polishing pad |
US6641471B1 (en) | 2000-09-19 | 2003-11-04 | Rodel Holdings, Inc | Polishing pad having an advantageous micro-texture and methods relating thereto |
AU2002211387A1 (en) | 2000-09-29 | 2002-04-08 | Strasbaugh, Inc. | Polishing pad with built-in optical sensor |
MXPA03003997A (es) | 2000-11-09 | 2004-02-12 | 3M Innovative Properties Co | Composiciones fluidas de tinta, eyectables, curables por radiacion, resistentes a la intemperie, particularmente adecuadas para aplicaciones exteriores. |
JP2002151447A (ja) | 2000-11-13 | 2002-05-24 | Asahi Kasei Corp | 研磨パッド |
US6684704B1 (en) | 2002-09-12 | 2004-02-03 | Psiloquest, Inc. | Measuring the surface properties of polishing pads using ultrasonic reflectance |
EP1345734B1 (en) | 2000-11-29 | 2006-04-19 | Psiloquest, Inc. | Crosslinked polyethylene polishing pad for chemical-mechnical polishing and polishing apparatus |
KR100867339B1 (ko) | 2000-12-01 | 2008-11-06 | 도요 고무 고교 가부시키가이샤 | 연마 패드 및 그 제조 방법 |
JP2002200555A (ja) | 2000-12-28 | 2002-07-16 | Ebara Corp | 研磨工具および該研磨工具を具備したポリッシング装置 |
US6407669B1 (en) | 2001-02-02 | 2002-06-18 | 3M Innovative Properties Company | RFID tag device and method of manufacturing |
GB0103754D0 (en) | 2001-02-15 | 2001-04-04 | Vantico Ltd | Three-dimensional structured printing |
US20020112632A1 (en) | 2001-02-21 | 2002-08-22 | Creo Ltd | Method for supporting sensitive workpieces during processing |
US6840843B2 (en) | 2001-03-01 | 2005-01-11 | Cabot Microelectronics Corporation | Method for manufacturing a polishing pad having a compressed translucent region |
US6811680B2 (en) | 2001-03-14 | 2004-11-02 | Applied Materials Inc. | Planarization of substrates using electrochemical mechanical polishing |
US7955693B2 (en) | 2001-04-20 | 2011-06-07 | Tolland Development Company, Llc | Foam composition roller brush with embedded mandrel |
CN100398261C (zh) | 2001-04-24 | 2008-07-02 | 应用材料有限公司 | 用于电化学机械抛光的导电抛光部件 |
US6847014B1 (en) | 2001-04-30 | 2005-01-25 | Lam Research Corporation | Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support |
US6811937B2 (en) | 2001-06-21 | 2004-11-02 | Dsm Desotech, Inc. | Radiation-curable resin composition and rapid prototyping process using the same |
US6544373B2 (en) * | 2001-07-26 | 2003-04-08 | United Microelectronics Corp. | Polishing pad for a chemical mechanical polishing process |
US6586494B2 (en) | 2001-08-08 | 2003-07-01 | Spectra Group Limited, Inc. | Radiation curable inkjet composition |
KR100646702B1 (ko) | 2001-08-16 | 2006-11-17 | 에스케이씨 주식회사 | 홀 및/또는 그루브로 형성된 화학적 기계적 연마패드 |
KR20030020658A (ko) * | 2001-09-04 | 2003-03-10 | 삼성전자주식회사 | 화학적물리적 연마장치의 연마패드 콘디셔닝 디스크 |
US6866807B2 (en) | 2001-09-21 | 2005-03-15 | Stratasys, Inc. | High-precision modeling filament |
US6599765B1 (en) | 2001-12-12 | 2003-07-29 | Lam Research Corporation | Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection |
US6838149B2 (en) * | 2001-12-13 | 2005-01-04 | 3M Innovative Properties Company | Abrasive article for the deposition and polishing of a conductive material |
JP2003188124A (ja) | 2001-12-14 | 2003-07-04 | Rodel Nitta Co | 研磨布 |
EP1326273B1 (en) | 2001-12-28 | 2012-01-18 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US20030134581A1 (en) | 2002-01-11 | 2003-07-17 | Wang Hsing Maw | Device for chemical mechanical polishing |
KR100442873B1 (ko) | 2002-02-28 | 2004-08-02 | 삼성전자주식회사 | 화학적 기계적 폴리싱 슬러리 및 이를 사용한 화학적기계적 폴리싱 방법 |
JP2003303793A (ja) | 2002-04-12 | 2003-10-24 | Hitachi Ltd | 研磨装置および半導体装置の製造方法 |
US6773474B2 (en) | 2002-04-19 | 2004-08-10 | 3M Innovative Properties Company | Coated abrasive article |
JP4693024B2 (ja) | 2002-04-26 | 2011-06-01 | 東洋ゴム工業株式会社 | 研磨材 |
US20050194681A1 (en) | 2002-05-07 | 2005-09-08 | Yongqi Hu | Conductive pad with high abrasion |
US6815570B1 (en) | 2002-05-07 | 2004-11-09 | Uop Llc | Shaped catalysts for transalkylation of aromatics for enhanced xylenes production |
US20050276967A1 (en) | 2002-05-23 | 2005-12-15 | Cabot Microelectronics Corporation | Surface textured microporous polishing pads |
US6913517B2 (en) | 2002-05-23 | 2005-07-05 | Cabot Microelectronics Corporation | Microporous polishing pads |
TWI250572B (en) | 2002-06-03 | 2006-03-01 | Jsr Corp | Polishing pad and multi-layer polishing pad |
DE10224981B4 (de) | 2002-06-05 | 2004-08-19 | Generis Gmbh | Verfahren zum schichtweisen Aufbau von Modellen |
CN100445091C (zh) | 2002-06-07 | 2008-12-24 | 普莱克斯S.T.技术有限公司 | 控制渗透子垫 |
JP3801100B2 (ja) | 2002-06-07 | 2006-07-26 | Jsr株式会社 | 光硬化造形装置、光硬化造形方法及び光硬化造形システム |
US8602851B2 (en) | 2003-06-09 | 2013-12-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Controlled penetration subpad |
EP1375617A1 (en) | 2002-06-19 | 2004-01-02 | 3M Innovative Properties Company | Radiation-curable, solvent-free and printable precursor of a pressure-sensitive adhesive |
US7169014B2 (en) | 2002-07-18 | 2007-01-30 | Micron Technology, Inc. | Apparatuses for controlling the temperature of polishing pads used in planarizing micro-device workpieces |
KR101016081B1 (ko) | 2002-07-26 | 2011-02-17 | 닛토덴코 가부시키가이샤 | 점착 시트와 그의 제조방법, 상기 점착 시트의 사용방법,및 상기 점착 시트에 사용되는 다층 시트와 그의 제조방법 |
TWI228768B (en) | 2002-08-08 | 2005-03-01 | Jsr Corp | Processing method of polishing pad for semiconductor wafer and polishing pad for semiconductor wafer |
US7579071B2 (en) | 2002-09-17 | 2009-08-25 | Korea Polyol Co., Ltd. | Polishing pad containing embedded liquid microelements and method of manufacturing the same |
KR100465649B1 (ko) | 2002-09-17 | 2005-01-13 | 한국포리올 주식회사 | 일체형 연마 패드 및 그 제조 방법 |
US6896765B2 (en) | 2002-09-18 | 2005-05-24 | Lam Research Corporation | Method and apparatus for the compensation of edge ring wear in a plasma processing chamber |
US20040058623A1 (en) | 2002-09-20 | 2004-03-25 | Lam Research Corporation | Polishing media for chemical mechanical planarization (CMP) |
US7311862B2 (en) | 2002-10-28 | 2007-12-25 | Cabot Microelectronics Corporation | Method for manufacturing microporous CMP materials having controlled pore size |
US7435165B2 (en) | 2002-10-28 | 2008-10-14 | Cabot Microelectronics Corporation | Transparent microporous materials for CMP |
US7267607B2 (en) | 2002-10-28 | 2007-09-11 | Cabot Microelectronics Corporation | Transparent microporous materials for CMP |
AU2003278047A1 (en) | 2002-10-31 | 2004-05-25 | Stephen F. Corbin | System and method for closed-loop control of laser cladding by powder injection |
JP2004153193A (ja) | 2002-11-01 | 2004-05-27 | Disco Abrasive Syst Ltd | 半導体ウエーハの処理方法 |
JP2004167605A (ja) * | 2002-11-15 | 2004-06-17 | Rodel Nitta Co | 研磨パッドおよび研磨装置 |
DE10253445A1 (de) | 2002-11-16 | 2004-06-03 | Adam Opel Ag | Verfahren und Vorrichtung zum Abdichten und Aufpumpen von Reifen bei Pannen sowie Dichtmittelbehälter als auch Adapter hierfür |
AU2003302299A1 (en) | 2002-11-27 | 2004-06-18 | Toyo Boseki Kabushiki Kaisha | Polishing pad and method for manufacturing semiconductor device |
JP2004235446A (ja) | 2003-01-30 | 2004-08-19 | Toyobo Co Ltd | 研磨パッド |
JP4659338B2 (ja) | 2003-02-12 | 2011-03-30 | Hoya株式会社 | 情報記録媒体用ガラス基板の製造方法並びにそれに使用する研磨パッド |
US7498394B2 (en) | 2003-02-24 | 2009-03-03 | The Regents Of The University Of Colorado | (Meth)acrylic and (meth)acrylamide monomers, polymerizable compositions, and polymers obtained |
US7104773B2 (en) | 2003-03-07 | 2006-09-12 | Ricoh Printing Systems, Ltd. | Three-dimensional laminating molding device |
DE10310385B4 (de) | 2003-03-07 | 2006-09-21 | Daimlerchrysler Ag | Verfahren zur Herstellung von dreidimensionalen Körpern mittels pulverbasierter schichtaufbauender Verfahren |
JP2004281685A (ja) | 2003-03-14 | 2004-10-07 | Mitsubishi Electric Corp | 半導体基板の研磨用パッドおよび半導体基板の研磨方法 |
US7704125B2 (en) | 2003-03-24 | 2010-04-27 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
US7377840B2 (en) | 2004-07-21 | 2008-05-27 | Neopad Technologies Corporation | Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs |
TWI286964B (en) | 2003-03-25 | 2007-09-21 | Neopad Technologies Corp | Customized polish pads for chemical mechanical planarization |
US9278424B2 (en) | 2003-03-25 | 2016-03-08 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
US8864859B2 (en) | 2003-03-25 | 2014-10-21 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
DE10314075B4 (de) | 2003-03-28 | 2007-11-22 | Takata-Petri (Sachsen) Gmbh | Reifenfülleinrichtung und Pannenset mit einer solchen |
US7044836B2 (en) | 2003-04-21 | 2006-05-16 | Cabot Microelectronics Corporation | Coated metal oxide particles for CMP |
TWI264454B (en) | 2003-04-25 | 2006-10-21 | Jsr Corp | Polishing pad and chemical mechanical polishing method |
US6783436B1 (en) | 2003-04-29 | 2004-08-31 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with optimized grooves and method of forming same |
WO2004100242A1 (ja) | 2003-05-09 | 2004-11-18 | Sanyo Chemical Industries, Ltd. | Cmpプロセス用研磨液及び研磨方法 |
CN100490084C (zh) | 2003-05-09 | 2009-05-20 | 三洋化成工业株式会社 | Cmp方法用研磨液及研磨方法 |
JP4662942B2 (ja) | 2003-05-21 | 2011-03-30 | ズィー コーポレイション | 3d印刷システムから外観モデルを形成するための熱可塑性粉末材料系 |
IL156094A0 (en) | 2003-05-25 | 2003-12-23 | J G Systems Inc | Fixed abrasive cmp pad with built-in additives |
CN1829587A (zh) | 2003-06-06 | 2006-09-06 | 应用材料公司 | 用于电化学机械抛光的导电抛光物件 |
US6884156B2 (en) | 2003-06-17 | 2005-04-26 | Cabot Microelectronics Corporation | Multi-layer polishing pad material for CMP |
US7435161B2 (en) | 2003-06-17 | 2008-10-14 | Cabot Microelectronics Corporation | Multi-layer polishing pad material for CMP |
US6998166B2 (en) | 2003-06-17 | 2006-02-14 | Cabot Microelectronics Corporation | Polishing pad with oriented pore structure |
JP4130614B2 (ja) | 2003-06-18 | 2008-08-06 | 株式会社東芝 | 半導体装置の製造方法 |
US7018560B2 (en) | 2003-08-05 | 2006-03-28 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Composition for polishing semiconductor layers |
US20050032464A1 (en) | 2003-08-07 | 2005-02-10 | Swisher Robert G. | Polishing pad having edge surface treatment |
CN1802237A (zh) | 2003-08-07 | 2006-07-12 | Ppg工业俄亥俄公司 | 具有边缘表面处理的抛光垫片 |
CN1863645B (zh) | 2003-08-08 | 2011-11-30 | 安格斯公司 | 用于制作浇注在可旋转基体上的整体式多孔垫的方法和材料 |
US7120512B2 (en) | 2003-08-25 | 2006-10-10 | Hewlett-Packard Development Company, L.P. | Method and a system for solid freeform fabricating using non-reactive powder |
EP1661690A4 (en) | 2003-08-27 | 2009-08-12 | Fujifilm Corp | METHOD FOR PRODUCING A THREE-DIMENSIONAL MODEL |
KR100590202B1 (ko) * | 2003-08-29 | 2006-06-15 | 삼성전자주식회사 | 연마 패드 및 그 형성방법 |
JP2005074614A (ja) | 2003-09-03 | 2005-03-24 | Nitta Haas Inc | 研磨パッドの製造方法および研磨パッド |
JP2005085917A (ja) | 2003-09-08 | 2005-03-31 | Sharp Corp | プラズマプロセス装置 |
JP2005093785A (ja) | 2003-09-18 | 2005-04-07 | Toshiba Corp | Cmp用スラリー、研磨方法、および半導体装置の製造方法 |
KR100640998B1 (ko) | 2003-09-19 | 2006-11-02 | 엘지.필립스 엘시디 주식회사 | 액정표시장치용 브라켓 구조 |
US20050060941A1 (en) | 2003-09-23 | 2005-03-24 | 3M Innovative Properties Company | Abrasive article and methods of making the same |
US8066552B2 (en) * | 2003-10-03 | 2011-11-29 | Applied Materials, Inc. | Multi-layer polishing pad for low-pressure polishing |
US6855588B1 (en) | 2003-10-07 | 2005-02-15 | United Microelectronics Corp. | Method of fabricating a double gate MOSFET device |
GB0323462D0 (en) | 2003-10-07 | 2003-11-05 | Fujifilm Electronic Imaging | Providing a surface layer or structure on a substrate |
US20050109371A1 (en) | 2003-10-27 | 2005-05-26 | Applied Materials, Inc. | Post CMP scrubbing of substrates |
JP2005131732A (ja) | 2003-10-30 | 2005-05-26 | Ebara Corp | 研磨装置 |
KR101152747B1 (ko) | 2003-10-31 | 2012-06-18 | 어플라이드 머티어리얼스, 인코포레이티드 | 마찰 센서를 이용한 폴리싱 종료점 탐지 시스템 및 방법 |
US7264641B2 (en) | 2003-11-10 | 2007-09-04 | Cabot Microelectronics Corporation | Polishing pad comprising biodegradable polymer |
US20050101228A1 (en) | 2003-11-10 | 2005-05-12 | Cabot Microelectronics Corporation | Polishing pad comprising biodegradable polymer |
JP2005150235A (ja) | 2003-11-12 | 2005-06-09 | Three M Innovative Properties Co | 半導体表面保護シート及び方法 |
US7125318B2 (en) | 2003-11-13 | 2006-10-24 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad having a groove arrangement for reducing slurry consumption |
US6984163B2 (en) | 2003-11-25 | 2006-01-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with high optical transmission window |
JP4555559B2 (ja) | 2003-11-25 | 2010-10-06 | 富士紡ホールディングス株式会社 | 研磨布及び研磨布の製造方法 |
KR100576465B1 (ko) | 2003-12-01 | 2006-05-08 | 주식회사 하이닉스반도체 | 연마입자 함침 조성물을 이용한 연마 패드 |
US7186164B2 (en) | 2003-12-03 | 2007-03-06 | Applied Materials, Inc. | Processing pad assembly with zone control |
US6843711B1 (en) | 2003-12-11 | 2005-01-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc | Chemical mechanical polishing pad having a process-dependent groove configuration |
US20050153634A1 (en) | 2004-01-09 | 2005-07-14 | Cabot Microelectronics Corporation | Negative poisson's ratio material-containing CMP polishing pad |
US20050171224A1 (en) | 2004-02-03 | 2005-08-04 | Kulp Mary J. | Polyurethane polishing pad |
US7132033B2 (en) | 2004-02-27 | 2006-11-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of forming a layered polishing pad |
US7731568B2 (en) | 2004-03-11 | 2010-06-08 | Toyo Tire & Rubber Co., Ltd. | Polishing pad and semiconductor device manufacturing method |
US20050208234A1 (en) | 2004-03-19 | 2005-09-22 | Agfa-Gevaert | Ink-jet recording material |
US7195544B2 (en) | 2004-03-23 | 2007-03-27 | Cabot Microelectronics Corporation | CMP porous pad with component-filled pores |
US7204742B2 (en) | 2004-03-25 | 2007-04-17 | Cabot Microelectronics Corporation | Polishing pad comprising hydrophobic region and endpoint detection port |
US6955588B1 (en) | 2004-03-31 | 2005-10-18 | Lam Research Corporation | Method of and platen for controlling removal rate characteristics in chemical mechanical planarization |
JP2004243518A (ja) | 2004-04-08 | 2004-09-02 | Toshiba Corp | 研摩装置 |
US20050227590A1 (en) | 2004-04-09 | 2005-10-13 | Chien-Min Sung | Fixed abrasive tools and associated methods |
TWI293266B (en) | 2004-05-05 | 2008-02-11 | Iv Technologies Co Ltd | A single-layer polishing pad and a method of producing the same |
US20070009606A1 (en) | 2004-05-12 | 2007-01-11 | Serdy James G | Manufacturing process, such as three dimensional printing, including binding of water-soluble material followed by softening and flowing and forming films of organic-solvent-soluble material |
US20050260939A1 (en) | 2004-05-18 | 2005-11-24 | Saint-Gobain Abrasives, Inc. | Brazed diamond dressing tool |
US7926521B2 (en) | 2004-05-20 | 2011-04-19 | Bridgestone Corporation | Sealing agent injecting apparatus, sealing agent injecting method and sealing pump up apparatus |
KR20060046093A (ko) | 2004-05-20 | 2006-05-17 | 제이에스알 가부시끼가이샤 | 화학 기계 연마 패드 및 화학 기계 연마 방법 |
JP2007081322A (ja) * | 2005-09-16 | 2007-03-29 | Jsr Corp | 化学機械研磨パッドの製造方法 |
US20050261150A1 (en) | 2004-05-21 | 2005-11-24 | Battelle Memorial Institute, A Part Interest | Reactive fluid systems for removing deposition materials and methods for using same |
US7438795B2 (en) | 2004-06-10 | 2008-10-21 | Cabot Microelectronics Corp. | Electrochemical-mechanical polishing system |
US7252871B2 (en) | 2004-06-16 | 2007-08-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad having a pressure relief channel |
US7582127B2 (en) | 2004-06-16 | 2009-09-01 | Cabot Microelectronics Corporation | Polishing composition for a tungsten-containing substrate |
KR101078007B1 (ko) | 2004-06-21 | 2011-10-28 | 가부시키가이샤 에바라 세이사꾸쇼 | 폴리싱장치 및 폴리싱방법 |
JP4133945B2 (ja) | 2004-06-28 | 2008-08-13 | 住友ゴム工業株式会社 | タイヤのパンクシーリング剤送給、抜取り装置 |
US20060014475A1 (en) | 2004-07-15 | 2006-01-19 | Disco Corporation | Grindstone tool |
US7709053B2 (en) | 2004-07-29 | 2010-05-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of manufacturing of polymer-coated particles for chemical mechanical polishing |
US7625198B2 (en) | 2004-08-11 | 2009-12-01 | Cornell Research Foundation, Inc. | Modular fabrication systems and methods |
US7153191B2 (en) | 2004-08-20 | 2006-12-26 | Micron Technology, Inc. | Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods |
US8075372B2 (en) | 2004-09-01 | 2011-12-13 | Cabot Microelectronics Corporation | Polishing pad with microporous regions |
DE102004042911A1 (de) | 2004-09-02 | 2006-03-09 | Michael Stehle | Vorrichtung zum Ausbringen von Luft- und/oder Reifendichtmittel |
US20060079159A1 (en) | 2004-10-08 | 2006-04-13 | Markus Naujok | Chemical mechanical polish with multi-zone abrasive-containing matrix |
US20060096179A1 (en) | 2004-11-05 | 2006-05-11 | Cabot Microelectronics Corporation | CMP composition containing surface-modified abrasive particles |
US7530880B2 (en) | 2004-11-29 | 2009-05-12 | Semiquest Inc. | Method and apparatus for improved chemical mechanical planarization pad with pressure control and process monitor |
WO2006057713A2 (en) | 2004-11-29 | 2006-06-01 | Rajeev Bajaj | Electro-method and apparatus for improved chemical mechanical planarization pad with uniform polish performance |
US7815778B2 (en) | 2005-11-23 | 2010-10-19 | Semiquest Inc. | Electro-chemical mechanical planarization pad with uniform polish performance |
US7846008B2 (en) | 2004-11-29 | 2010-12-07 | Semiquest Inc. | Method and apparatus for improved chemical mechanical planarization and CMP pad |
WO2006062158A1 (ja) | 2004-12-10 | 2006-06-15 | Toyo Tire & Rubber Co., Ltd. | 研磨パッド及び研磨パッドの製造方法 |
JP4775881B2 (ja) * | 2004-12-10 | 2011-09-21 | 東洋ゴム工業株式会社 | 研磨パッド |
US7059950B1 (en) | 2004-12-14 | 2006-06-13 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | CMP polishing pad having grooves arranged to improve polishing medium utilization |
US7059949B1 (en) | 2004-12-14 | 2006-06-13 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | CMP pad having an overlapping stepped groove arrangement |
US7182677B2 (en) | 2005-01-14 | 2007-02-27 | Applied Materials, Inc. | Chemical mechanical polishing pad for controlling polishing slurry distribution |
KR20070108546A (ko) | 2005-02-18 | 2007-11-12 | 네오패드 테크놀로지즈 코포레이션 | 화학적 기계적인 평탄화를 위해 적합화된 연마 패드와 그연마 패드의 제조 및 사용 방법 |
TWI385050B (zh) * | 2005-02-18 | 2013-02-11 | Nexplanar Corp | 用於cmp之特製拋光墊及其製造方法及其用途 |
EP1848569B1 (en) | 2005-02-18 | 2016-11-23 | NexPlanar Corporation | Customized polishing pads for cmp and method of using the same |
US7524345B2 (en) * | 2005-02-22 | 2009-04-28 | Saint-Gobain Abrasives, Inc. | Rapid tooling system and methods for manufacturing abrasive articles |
US7875091B2 (en) | 2005-02-22 | 2011-01-25 | Saint-Gobain Abrasives, Inc. | Rapid tooling system and methods for manufacturing abrasive articles |
JP2006231464A (ja) | 2005-02-24 | 2006-09-07 | Nitta Haas Inc | 研磨パッド |
US7829000B2 (en) | 2005-02-25 | 2010-11-09 | Hewlett-Packard Development Company, L.P. | Core-shell solid freeform fabrication |
TWI410314B (zh) | 2005-04-06 | 2013-10-01 | 羅門哈斯電子材料Cmp控股公司 | 藉由反應-射出成形製造多孔化學機械研磨墊之裝置 |
US7427340B2 (en) | 2005-04-08 | 2008-09-23 | Applied Materials, Inc. | Conductive pad |
EP1710324B1 (en) | 2005-04-08 | 2008-12-03 | STMicroelectronics S.r.l. | PVD process and chamber for the pulsed deposition of a chalcogenide material layer of a phase change memory device |
US7435364B2 (en) | 2005-04-11 | 2008-10-14 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method for forming a porous polishing pad |
US8393934B2 (en) | 2006-11-16 | 2013-03-12 | Chien-Min Sung | CMP pad dressers with hybridized abrasive surface and related methods |
US8398466B2 (en) | 2006-11-16 | 2013-03-19 | Chien-Min Sung | CMP pad conditioners with mosaic abrasive segments and associated methods |
KR101134058B1 (ko) | 2005-05-17 | 2012-04-16 | 도요 고무 고교 가부시키가이샤 | 연마 패드 |
KR100721196B1 (ko) | 2005-05-24 | 2007-05-23 | 주식회사 하이닉스반도체 | 연마패드 및 이를 이용한 화학적기계적연마장치 |
CN1897226A (zh) | 2005-07-11 | 2007-01-17 | 上海华虹Nec电子有限公司 | 一种化学机械抛光机 |
US8557351B2 (en) | 2005-07-22 | 2013-10-15 | Molecular Imprints, Inc. | Method for adhering materials together |
KR100727485B1 (ko) | 2005-08-09 | 2007-06-13 | 삼성전자주식회사 | 연마 패드 및 이를 제조하는 방법, 그리고 화학적 기계적 연마 장치 및 방법 |
US20070049164A1 (en) | 2005-08-26 | 2007-03-01 | Thomson Clifford O | Polishing pad and method for manufacturing polishing pads |
US7594845B2 (en) | 2005-10-20 | 2009-09-29 | 3M Innovative Properties Company | Abrasive article and method of modifying the surface of a workpiece |
US20070117393A1 (en) | 2005-11-21 | 2007-05-24 | Alexander Tregub | Hardened porous polymer chemical mechanical polishing (CMP) pad |
CN101500756A (zh) | 2005-11-30 | 2009-08-05 | 应用材料公司 | 具有表面粗糙度的抛光垫 |
JP4868840B2 (ja) | 2005-11-30 | 2012-02-01 | Jsr株式会社 | 半導体装置の製造方法 |
CN1851896A (zh) | 2005-12-05 | 2006-10-25 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 一种静电卡盘 |
US20070128991A1 (en) | 2005-12-07 | 2007-06-07 | Yoon Il-Young | Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same |
US20070149094A1 (en) | 2005-12-28 | 2007-06-28 | Choi Jae Y | Monitoring Device of Chemical Mechanical Polishing Apparatus |
TW200744786A (en) | 2005-12-28 | 2007-12-16 | Jsr Corp | Chemical mechanical polishing pad and chemical mechanical polishing method |
WO2007086529A1 (ja) | 2006-01-25 | 2007-08-02 | Jsr Corporation | 化学機械研磨パッドおよびその製造方法 |
US7935276B2 (en) | 2006-02-09 | 2011-05-03 | Headwaters Technology Innovation Llc | Polymeric materials incorporating carbon nanostructures |
JP5414279B2 (ja) | 2006-02-23 | 2014-02-12 | ピコデオン エルティーディー オイ | 半導体ならびに半導体を生産する装置および方法 |
US20070204420A1 (en) | 2006-03-06 | 2007-09-06 | Hornby David M | Polishing pad and method of making |
US7517488B2 (en) | 2006-03-08 | 2009-04-14 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of forming a chemical mechanical polishing pad utilizing laser sintering |
US20070212979A1 (en) * | 2006-03-09 | 2007-09-13 | Rimpad Tech Ltd. | Composite polishing pad |
US8691116B2 (en) | 2006-03-24 | 2014-04-08 | Clemson University | Conducting polymer ink |
US20070235133A1 (en) | 2006-03-29 | 2007-10-11 | Strasbaugh | Devices and methods for measuring wafer characteristics during semiconductor wafer polishing |
US20070235904A1 (en) | 2006-04-06 | 2007-10-11 | Saikin Alan H | Method of forming a chemical mechanical polishing pad utilizing laser sintering |
FR2900411B1 (fr) | 2006-04-27 | 2008-08-29 | Coatex Sas | Procede de traitement de matieres minerales par des polymeres amphoteres,matieres minerales obtenues,leur utilisation comme agent reducteur de la quantite de colloides dans la fabrication de papier. |
US7410413B2 (en) | 2006-04-27 | 2008-08-12 | 3M Innovative Properties Company | Structured abrasive article and method of making and using the same |
US7445847B2 (en) | 2006-05-25 | 2008-11-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
US7169030B1 (en) | 2006-05-25 | 2007-01-30 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
ATE466720T1 (de) | 2006-06-20 | 2010-05-15 | Univ Leuven Kath | Verfahren und vorrichtung zur in-situ-überwachung und rückkopplungssteuerung selektiver laserpulverbearbeitung |
US7840305B2 (en) | 2006-06-28 | 2010-11-23 | 3M Innovative Properties Company | Abrasive articles, CMP monitoring system and method |
US20080220702A1 (en) | 2006-07-03 | 2008-09-11 | Sang Fang Chemical Industry Co., Ltd. | Polishing pad having surface texture |
JP5186738B2 (ja) | 2006-07-10 | 2013-04-24 | 富士通セミコンダクター株式会社 | 研磨パッドの製造方法及び被研磨体の研磨方法 |
TWI409136B (zh) | 2006-07-19 | 2013-09-21 | Innopad Inc | 表面具微溝槽之化學機械平坦化墊 |
KR100804275B1 (ko) | 2006-07-24 | 2008-02-18 | 에스케이씨 주식회사 | 고분자 쉘로 둘러싸인 액상 유기물 코어를 포함하는 cmp연마패드 및 그 제조방법 |
EP2062932B1 (en) | 2006-07-28 | 2013-09-11 | Toray Industries, Inc. | Processes for producing an interpenetrating polymer network structure and a polishing pad |
US7300340B1 (en) | 2006-08-30 | 2007-11-27 | Rohm and Haas Electronics Materials CMP Holdings, Inc. | CMP pad having overlaid constant area spiral grooves |
US7267610B1 (en) | 2006-08-30 | 2007-09-11 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | CMP pad having unevenly spaced grooves |
WO2008029725A1 (fr) | 2006-09-06 | 2008-03-13 | Nitta Haas Incorporated | Tampon de polissage |
JP2008084504A (ja) | 2006-09-29 | 2008-04-10 | Hitachi Ltd | 光ディスク装置および光ディスクの再生方法 |
US7382959B1 (en) | 2006-10-13 | 2008-06-03 | Hrl Laboratories, Llc | Optically oriented three-dimensional polymer microstructures |
KR100842486B1 (ko) | 2006-10-30 | 2008-07-01 | 동부일렉트로닉스 주식회사 | Cmp 장비의 폴리싱패드와 이의 제조장치 |
US7234224B1 (en) | 2006-11-03 | 2007-06-26 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Curved grooving of polishing pads |
US7648645B2 (en) | 2006-11-08 | 2010-01-19 | 3M Innovative Properties Company | Pre-polymer formulations for liquid crystal displays |
CN101199994A (zh) | 2006-12-15 | 2008-06-18 | 湖南大学 | 智能化激光熔覆成型金属零件 |
US7371160B1 (en) | 2006-12-21 | 2008-05-13 | Rohm And Haas Electronic Materials Cmp Holdings Inc. | Elastomer-modified chemical mechanical polishing pad |
WO2008077850A2 (en) | 2006-12-21 | 2008-07-03 | Agfa Graphics Nv | 3d-inkjet printing methods |
US7438636B2 (en) | 2006-12-21 | 2008-10-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
US8083820B2 (en) | 2006-12-22 | 2011-12-27 | 3M Innovative Properties Company | Structured fixed abrasive articles including surface treated nano-ceria filler, and method for making and using the same |
US7497885B2 (en) | 2006-12-22 | 2009-03-03 | 3M Innovative Properties Company | Abrasive articles with nanoparticulate fillers and method for making and using them |
US7520798B2 (en) | 2007-01-31 | 2009-04-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with grooves to reduce slurry consumption |
US7311590B1 (en) | 2007-01-31 | 2007-12-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with grooves to retain slurry on the pad texture |
JP5204502B2 (ja) | 2007-02-01 | 2013-06-05 | 株式会社クラレ | 研磨パッド及び研磨パッドの製造方法 |
CN101600540B (zh) | 2007-02-01 | 2011-10-05 | 可乐丽股份有限公司 | 抛光垫及抛光垫的制造方法 |
WO2008103293A1 (en) | 2007-02-16 | 2008-08-28 | Nanogram Corporation | Solar cell structures, photovoltaic modules and corresponding processes |
JP2008258574A (ja) * | 2007-03-14 | 2008-10-23 | Jsr Corp | 化学機械研磨パッドおよび化学機械研磨方法 |
EP2135707A4 (en) | 2007-03-20 | 2013-10-09 | Kuraray Co | CUSHION FOR POLISHING DISC AND CUSHIONING POLISHING DISC |
JP4798713B2 (ja) | 2007-03-26 | 2011-10-19 | ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド | 研磨パッドの製造方法 |
JP4954762B2 (ja) | 2007-03-27 | 2012-06-20 | 東洋ゴム工業株式会社 | ポリウレタン発泡体の製造方法 |
US9536711B2 (en) | 2007-03-30 | 2017-01-03 | Lam Research Corporation | Method and apparatus for DC voltage control on RF-powered electrode |
US8784723B2 (en) | 2007-04-01 | 2014-07-22 | Stratasys Ltd. | Method and system for three-dimensional fabrication |
US20090011679A1 (en) | 2007-04-06 | 2009-01-08 | Rajeev Bajaj | Method of removal profile modulation in cmp pads |
FR2915016B1 (fr) | 2007-04-10 | 2009-06-05 | Siemens Vdo Automotive Sas | Systeme de creation automatisee d'une interface logicielle |
US8067814B2 (en) | 2007-06-01 | 2011-11-29 | Panasonic Corporation | Semiconductor device and method of manufacturing the same |
US8562389B2 (en) * | 2007-06-08 | 2013-10-22 | Applied Materials, Inc. | Thin polishing pad with window and molding process |
US7455571B1 (en) | 2007-06-20 | 2008-11-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Window polishing pad |
US20080314878A1 (en) | 2007-06-22 | 2008-12-25 | General Electric Company | Apparatus and method for controlling a machining system |
US7758764B2 (en) | 2007-06-28 | 2010-07-20 | Lam Research Corporation | Methods and apparatus for substrate processing |
US8563619B2 (en) | 2007-06-28 | 2013-10-22 | Lam Research Corporation | Methods and arrangements for plasma processing system with tunable capacitance |
US7862320B2 (en) | 2007-07-17 | 2011-01-04 | Seiko Epson Corporation | Three-dimensional object forming apparatus and method for forming three dimensional object |
US8047899B2 (en) | 2007-07-26 | 2011-11-01 | Macronix International Co., Ltd. | Pad and method for chemical mechanical polishing |
US7635290B2 (en) | 2007-08-15 | 2009-12-22 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Interpenetrating network for chemical mechanical polishing |
US7517277B2 (en) | 2007-08-16 | 2009-04-14 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Layered-filament lattice for chemical mechanical polishing |
US7828634B2 (en) | 2007-08-16 | 2010-11-09 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Interconnected-multi-element-lattice polishing pad |
CN101376234B (zh) | 2007-08-28 | 2013-05-29 | 侯家祥 | 一种研磨工具磨料颗粒有序排列的方法 |
WO2009032768A2 (en) | 2007-09-03 | 2009-03-12 | Semiquest, Inc. | Polishing pad |
EP2188344B1 (en) | 2007-09-21 | 2016-04-27 | Cabot Microelectronics Corporation | Polishing composition and method utilizing abrasive particles treated with an aminosilane |
US8142869B2 (en) | 2007-09-27 | 2012-03-27 | Toyoda Gosei Co., Ltd. | Coated base fabric for airbags |
JP5078527B2 (ja) | 2007-09-28 | 2012-11-21 | 富士紡ホールディングス株式会社 | 研磨布 |
FR2921667B1 (fr) | 2007-10-01 | 2012-11-09 | Saint Gobain Abrasives Inc | Composition resinique liquide pour articles abrasifs |
JP5143528B2 (ja) | 2007-10-25 | 2013-02-13 | 株式会社クラレ | 研磨パッド |
US8491360B2 (en) | 2007-10-26 | 2013-07-23 | Innopad, Inc. | Three-dimensional network in CMP pad |
US20090133716A1 (en) | 2007-10-29 | 2009-05-28 | Wai Mun Lee | Methods of post chemical mechanical polishing and wafer cleaning using amidoxime compositions |
US8388410B2 (en) | 2007-11-05 | 2013-03-05 | P.R. Hoffman Machine Products, Inc. | RFID-containing carriers used for silicon wafer quality |
JP2009129970A (ja) | 2007-11-20 | 2009-06-11 | Ebara Corp | 研磨装置及び研磨方法 |
JP5881948B2 (ja) | 2007-11-27 | 2016-03-09 | スリーディー システムズ インコーポレーテッド | 高透明性を有する三次元物品を製造するための光硬化型樹脂組成物 |
DE102007056984A1 (de) | 2007-11-27 | 2009-05-28 | Eos Gmbh Electro Optical Systems | Verfahren zum Herstellen eines dreidimensionalen Objekts mittels Lasersintern |
CN101925441B (zh) | 2007-12-31 | 2013-08-14 | 3M创新有限公司 | 经等离子处理的磨料制品及其制造方法 |
EP2242615A4 (en) | 2007-12-31 | 2013-10-30 | Innopad Inc | CHIMIOMECHANICAL FLOOD BUFFER |
US9180570B2 (en) | 2008-03-14 | 2015-11-10 | Nexplanar Corporation | Grooved CMP pad |
US20110011217A1 (en) | 2008-03-25 | 2011-01-20 | Yoshihide Kojima | Tire puncture repair apparatus |
JP5226359B2 (ja) | 2008-04-02 | 2013-07-03 | 株式会社クラレ | 研磨パッド用クッションおよびそれを用いた研磨パッド |
CN102015212A (zh) | 2008-04-11 | 2011-04-13 | 音诺帕德股份有限公司 | 具有孔隙网络的化学机械平坦化垫 |
CN102083586B (zh) | 2008-04-29 | 2015-08-12 | 塞米奎斯特股份有限公司 | 抛光垫片组合物与制造和使用方法 |
EP2305454B1 (en) | 2008-05-26 | 2017-03-22 | Sony Corporation | Shaping apparatus and shaping method |
TW201005825A (en) | 2008-05-30 | 2010-02-01 | Panasonic Corp | Plasma processing apparatus and method |
US20090308739A1 (en) | 2008-06-17 | 2009-12-17 | Applied Materials, Inc. | Wafer processing deposition shielding components |
TWM347669U (en) | 2008-06-19 | 2008-12-21 | Bestac Advanced Material Co Ltd | Polishing pad and polishing device |
CN101612722A (zh) | 2008-06-25 | 2009-12-30 | 三芳化学工业股份有限公司 | 抛光垫及其制造方法 |
US8821214B2 (en) | 2008-06-26 | 2014-09-02 | 3M Innovative Properties Company | Polishing pad with porous elements and method of making and using the same |
US8282866B2 (en) | 2008-06-30 | 2012-10-09 | Seiko Epson Corporation | Method and device for forming three-dimensional model, sheet material processing method, and sheet material processing device |
US20100011672A1 (en) | 2008-07-16 | 2010-01-21 | Kincaid Don H | Coated abrasive article and method of making and using the same |
JP5450622B2 (ja) | 2008-07-18 | 2014-03-26 | スリーエム イノベイティブ プロパティズ カンパニー | 浮遊要素を備えた研磨パッド、その製造方法及び使用方法 |
US8734664B2 (en) | 2008-07-23 | 2014-05-27 | Applied Materials, Inc. | Method of differential counter electrode tuning in an RF plasma reactor |
US20140069584A1 (en) | 2008-07-23 | 2014-03-13 | Applied Materials, Inc. | Differential counter electrode tuning in a plasma reactor with an rf-driven ceiling electrode |
US20100018648A1 (en) | 2008-07-23 | 2010-01-28 | Applied Marterials, Inc. | Workpiece support for a plasma reactor with controlled apportionment of rf power to a process kit ring |
US20140034239A1 (en) | 2008-07-23 | 2014-02-06 | Applied Materials, Inc. | Differential counter electrode tuning in a plasma reactor with an rf-driven workpiece support electrode |
CN101642898B (zh) | 2008-08-06 | 2011-09-14 | 财团法人工业技术研究院 | 抛光垫及其形成方法以及抛光方法 |
EP2316614B1 (en) | 2008-08-08 | 2019-07-17 | Kuraray Co., Ltd. | Polishing pad and method for manufacturing the polishing pad |
KR20100028294A (ko) | 2008-09-04 | 2010-03-12 | 주식회사 코오롱 | 연마패드 및 그의 제조방법 |
JP2010077288A (ja) | 2008-09-26 | 2010-04-08 | Toray Ind Inc | 相互侵入高分子網目構造体、研磨パッドおよび相互侵入高分子網目構造体の製造方法 |
WO2010036358A1 (en) | 2008-09-26 | 2010-04-01 | Rhodia Operations | Abrasive compositions for chemical mechanical polishing and methods for using same |
US8118641B2 (en) | 2009-03-04 | 2012-02-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad having window with integral identification feature |
TW201016387A (en) | 2008-10-22 | 2010-05-01 | jian-min Song | CMP Pad Dressers with Hybridized abrasive surface and related methods |
US20100112919A1 (en) | 2008-11-03 | 2010-05-06 | Applied Materials, Inc. | Monolithic linear polishing sheet |
US8292692B2 (en) | 2008-11-26 | 2012-10-23 | Semiquest, Inc. | Polishing pad with endpoint window and systems and method using the same |
DE102008060046A1 (de) | 2008-12-02 | 2010-06-10 | Eos Gmbh Electro Optical Systems | Verfahren zum Bereitstellen einer identifizierbaren Pulvermenge und Verfahren zur Herstellung eines Objekts |
US20100140850A1 (en) | 2008-12-04 | 2010-06-10 | Objet Geometries Ltd. | Compositions for 3D printing |
DE102008061311A1 (de) | 2008-12-11 | 2010-06-24 | Doukas Ag | Vorrichtung zum Fördern eines Gases |
US8062103B2 (en) | 2008-12-23 | 2011-11-22 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | High-rate groove pattern |
US8057282B2 (en) | 2008-12-23 | 2011-11-15 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | High-rate polishing method |
JP5543494B2 (ja) | 2009-01-27 | 2014-07-09 | イノパッド,インコーポレイテッド | パターン化された構造ドメインを含む化学機械平坦化パッド |
US8053487B2 (en) | 2009-01-30 | 2011-11-08 | The United States Of America As Represented By The Secretary Of The Navy | Multifunctional acrylates used as cross-linkers in dental and biomedical self-etching bonding adhesives |
EP2398577A2 (en) | 2009-02-19 | 2011-12-28 | Bonner, Alex Garfield | Porous interpenetrating polymer network |
WO2010116486A1 (ja) | 2009-04-07 | 2010-10-14 | トヨタ自動車株式会社 | ステータおよびその製造方法 |
US9951054B2 (en) | 2009-04-23 | 2018-04-24 | Cabot Microelectronics Corporation | CMP porous pad with particles in a polymeric matrix |
JP2012528487A (ja) | 2009-05-27 | 2012-11-12 | ロジャーズ コーポレーション | 研磨パッド、それを用いた組成物および、その製造と使用方法 |
JP5357639B2 (ja) | 2009-06-24 | 2013-12-04 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置およびプラズマ処理方法 |
WO2011001755A1 (ja) | 2009-06-29 | 2011-01-06 | Dic株式会社 | 研磨パッド用2液型ウレタン樹脂組成物、ポリウレタン研磨パッド、及びポリウレタン研磨パッドの製造方法 |
SG177625A1 (en) | 2009-07-16 | 2012-02-28 | Cabot Microelectronics Corp | Grooved cmp polishing pad |
TWI535527B (zh) | 2009-07-20 | 2016-06-01 | 智勝科技股份有限公司 | 研磨方法、研磨墊與研磨系統 |
US8676537B2 (en) | 2009-08-07 | 2014-03-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Portable wireless sensor |
US8712571B2 (en) | 2009-08-07 | 2014-04-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for wireless transmission of diagnostic information |
US8889232B2 (en) | 2009-08-20 | 2014-11-18 | Electronics For Imaging, Inc. | Radiation curable ink compositions |
TWI410299B (zh) | 2009-08-24 | 2013-10-01 | Bestac Advanced Material Co Ltd | 研磨墊與其應用及其製造方法 |
US8546717B2 (en) | 2009-09-17 | 2013-10-01 | Sciaky, Inc. | Electron beam layer manufacturing |
CN102762657B (zh) | 2009-10-16 | 2015-02-18 | Posco公司 | 可辐射固化的树脂组合物和包括其的耐指纹树脂组合物 |
CN102639299A (zh) * | 2009-11-12 | 2012-08-15 | 3M创新有限公司 | 旋转抛光垫 |
EP2498935B1 (en) | 2009-11-13 | 2015-04-15 | Sciaky Inc. | Process for layer manufacturing a three-dimensional work piece using scanning electron monitored with closed loop control |
JP5496630B2 (ja) | 2009-12-10 | 2014-05-21 | 東京エレクトロン株式会社 | 静電チャック装置 |
KR101855073B1 (ko) | 2009-12-22 | 2018-05-09 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 연마 패드 및 그의 제조 방법 |
KR101419156B1 (ko) | 2009-12-28 | 2014-07-11 | 히타치가세이가부시끼가이샤 | Cmp용 연마액 및 이것을 사용한 연마 방법 |
WO2011082155A2 (en) | 2009-12-30 | 2011-07-07 | 3M Innovative Properties Company | Polishing pads including phase-separated polymer blend and method of making and using the same |
CN102686361A (zh) | 2009-12-30 | 2012-09-19 | 3M创新有限公司 | 填充有机颗粒的抛光垫及其制造和使用方法 |
US9017140B2 (en) | 2010-01-13 | 2015-04-28 | Nexplanar Corporation | CMP pad with local area transparency |
US9089943B2 (en) | 2010-01-29 | 2015-07-28 | Ronald Lipson | Composite pads for buffing and polishing painted vehicle body surfaces and other applications |
DE102010007401A1 (de) | 2010-02-03 | 2011-08-04 | Kärcher Futuretech GmbH, 71364 | Vorrichtung und Verfahren zum automatisierten Formen und Abfüllen von Behältern |
SG183419A1 (en) | 2010-02-22 | 2012-09-27 | Entegris Inc | Post-cmp cleaning brush |
KR20110100080A (ko) | 2010-03-03 | 2011-09-09 | 삼성전자주식회사 | 화학적 기계적 연마 공정용 연마 패드 및 이를 포함하는 화학적 기계적 연마 설비 |
DE102010011059A1 (de) | 2010-03-11 | 2011-09-15 | Global Beam Technologies Ag | Verfahren und Vorrichtung zur Herstellung eines Bauteils |
JP5551479B2 (ja) | 2010-03-19 | 2014-07-16 | ニッタ・ハース株式会社 | 研磨装置、研磨パッドおよび研磨情報管理システム |
JP5620141B2 (ja) | 2010-04-15 | 2014-11-05 | 東洋ゴム工業株式会社 | 研磨パッド |
JP5697889B2 (ja) | 2010-04-19 | 2015-04-08 | 帝人コードレ株式会社 | 平滑加工用シート |
US20130059506A1 (en) | 2010-05-11 | 2013-03-07 | 3M Innovative Properties Company | Fixed abrasive pad with surfactant for chemical mechanical planarization |
JP5814360B2 (ja) | 2010-06-25 | 2015-11-17 | スリーエム イノベイティブ プロパティズ カンパニー | 半相互貫入ポリマー網状組織 |
US20120000887A1 (en) | 2010-06-30 | 2012-01-05 | Kabushiki Kaisha Toshiba | Plasma treatment apparatus and plasma treatment method |
EP2588275B1 (en) | 2010-07-02 | 2017-12-27 | 3M Innovative Properties Company | Coated abrasive articles |
US9156124B2 (en) | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
JP5635957B2 (ja) | 2010-09-09 | 2014-12-03 | 日本碍子株式会社 | 被研磨物の研磨方法、及び研磨パッド |
WO2012040212A2 (en) | 2010-09-22 | 2012-03-29 | Interfacial Solutions Ip, Llc | Methods of producing microfabricated particles for composite materials |
US8257545B2 (en) | 2010-09-29 | 2012-09-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with light stable polymeric endpoint detection window and method of polishing therewith |
US8702479B2 (en) | 2010-10-15 | 2014-04-22 | Nexplanar Corporation | Polishing pad with multi-modal distribution of pore diameters |
EP2652020A1 (en) | 2010-12-16 | 2013-10-23 | 3M Innovative Properties Company | Interpenetrated polymer layer |
EP2668021B1 (en) | 2011-01-26 | 2020-08-19 | Zydex Pty Ltd | A device for making an object |
US9211628B2 (en) | 2011-01-26 | 2015-12-15 | Nexplanar Corporation | Polishing pad with concentric or approximately concentric polygon groove pattern |
JP5893479B2 (ja) | 2011-04-21 | 2016-03-23 | 東洋ゴム工業株式会社 | 積層研磨パッド |
JP2014517857A (ja) | 2011-04-27 | 2014-07-24 | ヘンケル・ユーエス・アイピー・リミテッド・ライアビリティ・カンパニー | 低温シーリング機能を備える硬化性エラストマー組成物 |
US8968058B2 (en) | 2011-05-05 | 2015-03-03 | Nexplanar Corporation | Polishing pad with alignment feature |
US20120302148A1 (en) * | 2011-05-23 | 2012-11-29 | Rajeev Bajaj | Polishing pad with homogeneous body having discrete protrusions thereon |
JP5851124B2 (ja) | 2011-06-13 | 2016-02-03 | スリーエム イノベイティブ プロパティズ カンパニー | 研磨用構造体 |
EP2537675B1 (en) | 2011-06-21 | 2013-12-11 | Agfa Graphics N.V. | A curable jettable fluid for making a flexographic printing master |
US10388493B2 (en) | 2011-09-16 | 2019-08-20 | Lam Research Corporation | Component of a substrate support assembly producing localized magnetic fields |
US8801949B2 (en) | 2011-09-22 | 2014-08-12 | Dow Global Technologies Llc | Method of forming open-network polishing pads |
US8894799B2 (en) | 2011-09-22 | 2014-11-25 | Dow Global Technologies Llc | Method of forming layered-open-network polishing pads |
US9108291B2 (en) | 2011-09-22 | 2015-08-18 | Dow Global Technologies Llc | Method of forming structured-open-network polishing pads |
JP2014534615A (ja) | 2011-09-26 | 2014-12-18 | インテグリス・インコーポレーテッド | Cmp後クリーニング装置および方法 |
US20130107415A1 (en) | 2011-10-28 | 2013-05-02 | Applied Materials, Inc. | Electrostatic chuck |
TWI462797B (zh) | 2011-11-24 | 2014-12-01 | Univ Nat Taiwan Science Tech | Electric field assisted chemical mechanical polishing system and its method |
KR101825734B1 (ko) * | 2011-11-29 | 2018-02-05 | 캐보트 마이크로일렉트로닉스 코포레이션 | 기초 레이어 및 연마면 레이어를 가진 연마 패드 |
US9067297B2 (en) | 2011-11-29 | 2015-06-30 | Nexplanar Corporation | Polishing pad with foundation layer and polishing surface layer |
US9067298B2 (en) | 2011-11-29 | 2015-06-30 | Nexplanar Corporation | Polishing pad with grooved foundation layer and polishing surface layer |
WO2013079146A1 (en) | 2011-11-30 | 2013-06-06 | Merck Patent Gmbh | Particles for electrophoretic displays |
US10825708B2 (en) | 2011-12-15 | 2020-11-03 | Applied Materials, Inc. | Process kit components for use with an extended and independent RF powered cathode substrate for extreme edge tunability |
KR20130084932A (ko) | 2012-01-18 | 2013-07-26 | 삼성전자주식회사 | 반도체 소자의 제조 방법 |
US8721833B2 (en) | 2012-02-05 | 2014-05-13 | Tokyo Electron Limited | Variable capacitance chamber component incorporating ferroelectric materials and methods of manufacturing and using thereof |
US8486798B1 (en) | 2012-02-05 | 2013-07-16 | Tokyo Electron Limited | Variable capacitance chamber component incorporating a semiconductor junction and methods of manufacturing and using thereof |
KR20130095430A (ko) | 2012-02-20 | 2013-08-28 | 케이피엑스케미칼 주식회사 | 연마패드 및 그 제조방법 |
WO2013128452A1 (en) | 2012-03-01 | 2013-09-06 | Stratasys Ltd. | Cationic polymerizable compositions and methods of use thereof |
DE102012203639A1 (de) | 2012-03-08 | 2013-09-12 | Evonik Industries Ag | Additiv zur Einstellung der Glasübergangstemperatur von viskoelastischen Polyurethanweichschaumstoffen |
US8709114B2 (en) | 2012-03-22 | 2014-04-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of manufacturing chemical mechanical polishing layers |
US8986585B2 (en) | 2012-03-22 | 2015-03-24 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of manufacturing chemical mechanical polishing layers having a window |
JP2013201046A (ja) * | 2012-03-26 | 2013-10-03 | Toppan Printing Co Ltd | 凹型欠陥の修正方法及びそれを用いた有機el素子の製造方法 |
DE102012007791A1 (de) | 2012-04-20 | 2013-10-24 | Universität Duisburg-Essen | Verfahren und Vorrichtung zur Herstellung von Bauteilen in einer Strahlschmelzanlage |
US9067299B2 (en) * | 2012-04-25 | 2015-06-30 | Applied Materials, Inc. | Printed chemical mechanical polishing pad |
US9412579B2 (en) | 2012-04-26 | 2016-08-09 | Applied Materials, Inc. | Methods and apparatus for controlling substrate uniformity |
US9993873B2 (en) | 2012-05-22 | 2018-06-12 | General Electric Company | System and method for three-dimensional printing |
US9481134B2 (en) | 2012-06-08 | 2016-11-01 | Makerbot Industries, Llc | Build platform leveling with tactile feedback |
CN104395425A (zh) | 2012-06-11 | 2015-03-04 | 嘉柏微电子材料股份公司 | 用于抛光钼的组合物和方法 |
US8778211B2 (en) | 2012-07-17 | 2014-07-15 | Cabot Microelectronics Corporation | GST CMP slurries |
US9174388B2 (en) | 2012-08-16 | 2015-11-03 | Stratasys, Inc. | Draw control for extrusion-based additive manufacturing systems |
US8888480B2 (en) | 2012-09-05 | 2014-11-18 | Aprecia Pharmaceuticals Company | Three-dimensional printing system and equipment assembly |
CN104640686B (zh) | 2012-09-05 | 2018-01-30 | 阿普雷奇亚制药公司 | 三维打印系统和设备组件 |
JP6196858B2 (ja) | 2012-09-24 | 2017-09-13 | 株式会社荏原製作所 | 研磨方法および研磨装置 |
US9718975B2 (en) | 2012-09-25 | 2017-08-01 | 3M Innovative Properties Company | Radiation curable ink composition |
WO2014058887A1 (en) | 2012-10-11 | 2014-04-17 | Dow Corning Corporation | Aqueous silicone polyether microemulsions |
CN202825512U (zh) | 2012-10-11 | 2013-03-27 | 中芯国际集成电路制造(北京)有限公司 | 研磨垫及化学机械研磨机台 |
US9233504B2 (en) | 2012-10-29 | 2016-01-12 | Makerbot Industries, Llc | Tagged build material for three-dimensional printing |
JP6342912B2 (ja) | 2012-11-08 | 2018-06-13 | ディーディーエム システムズ, インコーポレイテッド | 金属構成要素の加法的製造および修復 |
US9718129B2 (en) | 2012-12-17 | 2017-08-01 | Arcam Ab | Additive manufacturing method and apparatus |
US10357435B2 (en) | 2012-12-18 | 2019-07-23 | Dentca, Inc. | Photo-curable resin compositions and method of using the same in three-dimensional printing for manufacturing artificial teeth and denture base |
US11673155B2 (en) | 2012-12-27 | 2023-06-13 | Kateeva, Inc. | Techniques for arrayed printing of a permanent layer with improved speed and accuracy |
US9630249B2 (en) | 2013-01-17 | 2017-04-25 | Ehsan Toyserkani | Systems and methods for additive manufacturing of heterogeneous porous structures and structures made therefrom |
US9649742B2 (en) | 2013-01-22 | 2017-05-16 | Nexplanar Corporation | Polishing pad having polishing surface with continuous protrusions |
US9587127B2 (en) | 2013-02-06 | 2017-03-07 | Sun Chemical Corporation | Digital printing inks |
DK2956823T4 (da) | 2013-02-12 | 2019-09-23 | Carbon3D Inc | Kontinuerlig trykning med væskemellemlag |
CN105209241B (zh) | 2013-03-14 | 2018-07-13 | 斯特塔西有限公司 | 基于聚合物的模具和其制造方法 |
US9152340B2 (en) | 2013-05-28 | 2015-10-06 | Netapp, Inc. | System and method for managing and producing a dataset image across multiple storage systems |
JP5955275B2 (ja) | 2013-06-12 | 2016-07-20 | 富士フイルム株式会社 | 画像形成方法、加飾シートの製造方法、成形加工方法、加飾シート成形物の製造方法、インモールド成形品の製造方法 |
US20140370788A1 (en) | 2013-06-13 | 2014-12-18 | Cabot Microelectronics Corporation | Low surface roughness polishing pad |
US10183329B2 (en) | 2013-07-19 | 2019-01-22 | The Boeing Company | Quality control of additive manufactured parts |
US20150038066A1 (en) | 2013-07-31 | 2015-02-05 | Nexplanar Corporation | Low density polishing pad |
GB201313841D0 (en) | 2013-08-02 | 2013-09-18 | Rolls Royce Plc | Method of Manufacturing a Component |
KR101905158B1 (ko) | 2013-08-06 | 2018-10-08 | 어플라이드 머티어리얼스, 인코포레이티드 | 국부적으로 가열되는 다-구역 기판 지지부 |
US9855698B2 (en) | 2013-08-07 | 2018-01-02 | Massachusetts Institute Of Technology | Automatic process control of additive manufacturing device |
JP5992375B2 (ja) | 2013-08-08 | 2016-09-14 | 株式会社東芝 | 静電チャック、載置プレート支持台及び静電チャックの製造方法 |
CN105453232B (zh) | 2013-08-10 | 2019-04-05 | 应用材料公司 | 具有促进受控的调节的材料组成的cmp垫 |
CN105518832B (zh) | 2013-08-22 | 2018-06-08 | 嘉柏微电子材料股份公司 | 具有多孔界面及实心核心的抛光垫、以及相关的装置和方法 |
US20150056895A1 (en) | 2013-08-22 | 2015-02-26 | Cabot Microelectronics Corporation | Ultra high void volume polishing pad with closed pore structure |
DE102013217422A1 (de) | 2013-09-02 | 2015-03-05 | Carl Zeiss Industrielle Messtechnik Gmbh | Koordinatenmessgerät und Verfahren zur Vermessung und mindestens teilweisen Erzeugung eines Werkstücks |
CN103465155B (zh) * | 2013-09-06 | 2016-05-11 | 蓝思科技股份有限公司 | 一种环氧树脂型金刚石研磨垫及其制备方法 |
US9425121B2 (en) | 2013-09-11 | 2016-08-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated fan-out structure with guiding trenches in buffer layer |
KR101405333B1 (ko) | 2013-09-12 | 2014-06-11 | 유비머트리얼즈주식회사 | 연마 입자, 연마 슬러리 및 이를 이용한 반도체 소자의 제조 방법 |
US9308620B2 (en) | 2013-09-18 | 2016-04-12 | Texas Instruments Incorporated | Permeated grooving in CMP polishing pads |
US9053908B2 (en) | 2013-09-19 | 2015-06-09 | Lam Research Corporation | Method and apparatus for controlling substrate DC-bias and ion energy and angular distribution during substrate etching |
GB201316815D0 (en) | 2013-09-23 | 2013-11-06 | Renishaw Plc | Additive manufacturing apparatus and method |
EP3050082B1 (en) | 2013-09-25 | 2021-05-05 | 3M Innovative Properties Company | System for polishing a substrate |
CN105764653B (zh) | 2013-09-30 | 2020-09-11 | 圣戈本陶瓷及塑料股份有限公司 | 成形磨粒及其形成方法 |
WO2015055550A1 (en) | 2013-10-17 | 2015-04-23 | Luxexcel Holding B.V. | Device for printing a three-dimensional structure |
CN203542340U (zh) | 2013-10-21 | 2014-04-16 | 中芯国际集成电路制造(北京)有限公司 | 一种化学机械研磨垫 |
US9830456B2 (en) | 2013-10-21 | 2017-11-28 | Cisco Technology, Inc. | Trust transference from a trusted processor to an untrusted processor |
US9831074B2 (en) | 2013-10-24 | 2017-11-28 | Applied Materials, Inc. | Bipolar collimator utilized in a physical vapor deposition chamber |
US8980749B1 (en) | 2013-10-24 | 2015-03-17 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method for chemical mechanical polishing silicon wafers |
EP3063591B1 (en) | 2013-10-30 | 2018-04-04 | Anocoil Corporation | Lithographic printing plate precursors and coating |
US9421666B2 (en) | 2013-11-04 | 2016-08-23 | Applied Materials, Inc. | Printed chemical mechanical polishing pad having abrasives therein |
US9481069B2 (en) | 2013-11-06 | 2016-11-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical mechanical polishing apparatus and polishing method using the same |
CN104625945B (zh) | 2013-11-07 | 2017-03-01 | 三芳化学工业股份有限公司 | 抛光垫及其制造方法 |
US9352443B2 (en) | 2013-11-13 | 2016-05-31 | Taiwan Semiconductor Manufacturing Co., Ltd. | Platen assembly, chemical-mechanical polisher, and method for polishing substrate |
US9850402B2 (en) | 2013-12-09 | 2017-12-26 | Cabot Microelectronics Corporation | CMP compositions and methods for selective removal of silicon nitride |
US9993907B2 (en) | 2013-12-20 | 2018-06-12 | Applied Materials, Inc. | Printed chemical mechanical polishing pad having printed window |
CN104742007B (zh) | 2013-12-30 | 2017-08-25 | 中芯国际集成电路制造(北京)有限公司 | 化学机械研磨装置和化学机械研磨方法 |
RU2016134047A (ru) | 2014-01-23 | 2018-03-05 | Рикох Компани, Лтд. | Трехмерный объект и способ для его формирования |
US20160346997A1 (en) | 2014-02-10 | 2016-12-01 | President And Fellows Of Harvard College | Three-dimensional (3d) printed composite structure and 3d printable composite ink formulation |
WO2015120430A1 (en) | 2014-02-10 | 2015-08-13 | President And Fellows Of Harvard College | 3d-printed polishing pad for chemical-mechanical planarization (cmp) |
EP3105040B1 (en) | 2014-02-10 | 2023-10-18 | Stratasys Ltd. | Composition and method for additive manufacturing of an object |
US9472410B2 (en) | 2014-03-05 | 2016-10-18 | Applied Materials, Inc. | Pixelated capacitance controlled ESC |
JP2015174272A (ja) | 2014-03-14 | 2015-10-05 | セイコーエプソン株式会社 | 三次元造形物の製造方法、三次元造形物製造装置および三次元造形物 |
US9259820B2 (en) | 2014-03-28 | 2016-02-16 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with polishing layer and window |
WO2015153601A1 (en) | 2014-04-03 | 2015-10-08 | 3M Innovative Properties Company | Polishing pads and systems and methods of making and using the same |
WO2015161210A1 (en) | 2014-04-17 | 2015-10-22 | Cabot Microelectronics Corporation | Cmp polishing pad with columnar structure and methods related thereto |
US9333620B2 (en) | 2014-04-29 | 2016-05-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with clear endpoint detection window |
US9314897B2 (en) | 2014-04-29 | 2016-04-19 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with endpoint detection window |
US10144198B2 (en) | 2014-05-02 | 2018-12-04 | Corning Incorporated | Strengthened glass and compositions therefor |
CN104400998B (zh) | 2014-05-31 | 2016-10-05 | 福州大学 | 一种基于红外光谱分析的3d打印检测方法 |
US20150375361A1 (en) | 2014-06-25 | 2015-12-31 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing method |
US9259821B2 (en) | 2014-06-25 | 2016-02-16 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing layer formulation with conditioning tolerance |
JP2016023209A (ja) | 2014-07-17 | 2016-02-08 | 日立化成株式会社 | 研磨剤、研磨剤セット及び基体の研磨方法 |
US9731398B2 (en) | 2014-08-22 | 2017-08-15 | Rohm And Haas Electronic Materials Cmp Holding, Inc. | Polyurethane polishing pad |
US9826630B2 (en) | 2014-09-04 | 2017-11-21 | Nxp Usa, Inc. | Fan-out wafer level packages having preformed embedded ground plane connections and methods for the fabrication thereof |
US20160068996A1 (en) | 2014-09-05 | 2016-03-10 | Applied Materials, Inc. | Susceptor and pre-heat ring for thermal processing of substrates |
CN104210108B (zh) | 2014-09-15 | 2017-11-28 | 宁波高新区乐轩锐蓝智能科技有限公司 | 3d打印机的打印缺陷弥补方法和系统 |
CN106716604A (zh) | 2014-10-09 | 2017-05-24 | 应用材料公司 | 具有内部通道的化学机械研磨垫 |
US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
TWI689406B (zh) | 2014-10-17 | 2020-04-01 | 美商應用材料股份有限公司 | 研磨墊及製造其之方法 |
US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
JP6545261B2 (ja) | 2014-10-17 | 2019-07-17 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 付加製造プロセスを使用する、複合材料特性を有するcmpパッド構造 |
US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
CN104385595B (zh) | 2014-10-20 | 2017-05-03 | 合肥斯科尔智能科技有限公司 | 一种三维打印次品修复系统 |
JP6422325B2 (ja) | 2014-12-15 | 2018-11-14 | 花王株式会社 | 半導体基板用研磨液組成物 |
US10086500B2 (en) | 2014-12-18 | 2018-10-02 | Applied Materials, Inc. | Method of manufacturing a UV curable CMP polishing pad |
JP6452449B2 (ja) | 2015-01-06 | 2019-01-16 | 東京エレクトロン株式会社 | 載置台及び基板処理装置 |
CN104607639B (zh) | 2015-01-12 | 2016-11-02 | 常州先进制造技术研究所 | 一种用于金属3d打印的表面修复塑形装置 |
US20170263478A1 (en) | 2015-01-16 | 2017-09-14 | Lam Research Corporation | Detection System for Tunable/Replaceable Edge Coupling Ring |
US10946495B2 (en) | 2015-01-30 | 2021-03-16 | Cmc Materials, Inc. | Low density polishing pad |
US9505952B2 (en) | 2015-03-05 | 2016-11-29 | Cabot Microelectronics Corporation | Polishing composition containing ceria abrasive |
US9475168B2 (en) | 2015-03-26 | 2016-10-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad window |
US10744714B2 (en) | 2015-04-30 | 2020-08-18 | Hewlett-Packard Development Company, L.P. | Misalignment detection for a 3D printing device |
US10017857B2 (en) | 2015-05-02 | 2018-07-10 | Applied Materials, Inc. | Method and apparatus for controlling plasma near the edge of a substrate |
CN106206409B (zh) | 2015-05-08 | 2019-05-07 | 华邦电子股份有限公司 | 堆叠电子装置及其制造方法 |
TWI559026B (zh) | 2015-06-24 | 2016-11-21 | 財團法人工業技術研究院 | 抗反射結構及其製造方法 |
CN205703794U (zh) | 2015-06-29 | 2016-11-23 | 智胜科技股份有限公司 | 研磨垫的研磨层 |
US10163610B2 (en) | 2015-07-13 | 2018-12-25 | Lam Research Corporation | Extreme edge sheath and wafer profile tuning through edge-localized ion trajectory control and plasma operation |
US9761459B2 (en) | 2015-08-05 | 2017-09-12 | Lam Research Corporation | Systems and methods for reverse pulsing |
US9620376B2 (en) | 2015-08-19 | 2017-04-11 | Lam Research Corporation | Self limiting lateral atomic layer etch |
US10406801B2 (en) | 2015-08-21 | 2019-09-10 | Voxel8, Inc. | Calibration and alignment of 3D printing deposition heads |
US9984858B2 (en) | 2015-09-04 | 2018-05-29 | Lam Research Corporation | ALE smoothness: in and outside semiconductor industry |
EP3349971A4 (en) | 2015-09-16 | 2019-05-22 | Applied Materials, Inc. | SELECTIVE OPENING SUPPORT PLATE FOR ADDITIVE MANUFACTURE |
CN105161432A (zh) | 2015-09-17 | 2015-12-16 | 中芯长电半导体(江阴)有限公司 | 一种芯片封装方法 |
US10192751B2 (en) | 2015-10-15 | 2019-01-29 | Lam Research Corporation | Systems and methods for ultrahigh selective nitride etch |
CN112045555B (zh) | 2015-10-16 | 2022-12-30 | 应用材料公司 | 使用增材制造工艺形成先进抛光垫的方法和设备 |
US10124492B2 (en) | 2015-10-22 | 2018-11-13 | Lam Research Corporation | Automated replacement of consumable parts using end effectors interfacing with plasma processing system |
US10062599B2 (en) | 2015-10-22 | 2018-08-28 | Lam Research Corporation | Automated replacement of consumable parts using interfacing chambers |
US20170115657A1 (en) | 2015-10-22 | 2017-04-27 | Lam Research Corporation | Systems for Removing and Replacing Consumable Parts from a Semiconductor Process Module in Situ |
US9881820B2 (en) | 2015-10-22 | 2018-01-30 | Lam Research Corporation | Front opening ring pod |
GB201519187D0 (en) | 2015-10-30 | 2015-12-16 | Knauf Insulation Ltd | Improved binder compositions and uses thereof |
EP3369791A1 (en) | 2015-10-30 | 2018-09-05 | Konica Minolta, Inc. | Active light ray-curable inkjet ink composition and inkjet recording method |
KR20230169424A (ko) | 2015-10-30 | 2023-12-15 | 어플라이드 머티어리얼스, 인코포레이티드 | 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법 |
US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
US10229769B2 (en) | 2015-11-20 | 2019-03-12 | Xerox Corporation | Three phase immiscible polymer-metal blends for high conductivty composites |
US10189143B2 (en) | 2015-11-30 | 2019-01-29 | Taiwan Semiconductor Manufacturing Company Limited | Polishing pad, method for manufacturing polishing pad, and polishing method |
US9601319B1 (en) | 2016-01-07 | 2017-03-21 | Lam Research Corporation | Systems and methods for eliminating flourine residue in a substrate processing chamber using a plasma-based process |
US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
KR102629800B1 (ko) | 2016-01-19 | 2024-01-29 | 어플라이드 머티어리얼스, 인코포레이티드 | 다공성 화학적 기계적 연마 패드들 |
US10685862B2 (en) | 2016-01-22 | 2020-06-16 | Applied Materials, Inc. | Controlling the RF amplitude of an edge ring of a capacitively coupled plasma process device |
US9956314B2 (en) | 2016-01-26 | 2018-05-01 | Modern Ideas LLC | Adhesive for use with bone and bone-like structures |
US10651015B2 (en) | 2016-02-12 | 2020-05-12 | Lam Research Corporation | Variable depth edge ring for etch uniformity control |
US10699878B2 (en) | 2016-02-12 | 2020-06-30 | Lam Research Corporation | Chamber member of a plasma source and pedestal with radially outward positioned lift pins for translation of a substrate c-ring |
US10438833B2 (en) | 2016-02-16 | 2019-10-08 | Lam Research Corporation | Wafer lift ring system for wafer transfer |
US9966231B2 (en) | 2016-02-29 | 2018-05-08 | Lam Research Corporation | Direct current pulsing plasma systems |
JP6941618B2 (ja) | 2016-03-09 | 2021-09-29 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 付加製造で製造される形状の補正 |
WO2017155969A1 (en) | 2016-03-09 | 2017-09-14 | Applied Materials, Inc. | Pad structure and fabrication methods |
KR102535628B1 (ko) | 2016-03-24 | 2023-05-30 | 어플라이드 머티어리얼스, 인코포레이티드 | 화학적 기계적 연마를 위한 조직화된 소형 패드 |
US10269566B2 (en) | 2016-04-29 | 2019-04-23 | Lam Research Corporation | Etching substrates using ale and selective deposition |
KR20170127724A (ko) | 2016-05-12 | 2017-11-22 | 삼성전자주식회사 | 플라즈마 처리 장치 |
US10340171B2 (en) | 2016-05-18 | 2019-07-02 | Lam Research Corporation | Permanent secondary erosion containment for electrostatic chuck bonds |
US9852889B1 (en) | 2016-06-22 | 2017-12-26 | Lam Research Corporation | Systems and methods for controlling directionality of ions in an edge region by using an electrode within a coupling ring |
US10283330B2 (en) | 2016-07-25 | 2019-05-07 | Lam Research Corporation | Systems and methods for achieving a pre-determined factor associated with an edge region within a plasma chamber by synchronizing main and edge RF generators |
JP6791680B2 (ja) | 2016-08-09 | 2020-11-25 | 株式会社フジミインコーポレーテッド | 表面処理組成物およびこれを用いた洗浄方法 |
US20180100074A1 (en) | 2016-10-11 | 2018-04-12 | Xerox Corporation | Ink composition for use in 3d printing |
US10259956B2 (en) | 2016-10-11 | 2019-04-16 | Xerox Corporation | Curable ink composition |
US20180100073A1 (en) | 2016-10-11 | 2018-04-12 | Xerox Corporation | Ink composition for use in 3d printing |
US10930535B2 (en) | 2016-12-02 | 2021-02-23 | Applied Materials, Inc. | RFID part authentication and tracking of processing components |
CN106810215B (zh) * | 2017-01-18 | 2022-08-16 | 重庆摩方科技有限公司 | 一种陶瓷浆料的制备及3d打印光固化成型方法 |
KR20180094428A (ko) | 2017-02-15 | 2018-08-23 | 삼성전자주식회사 | 화학 기계적 연마 장치 |
US20180323042A1 (en) | 2017-05-02 | 2018-11-08 | Applied Materials, Inc. | Method to modulate the wafer edge sheath in a plasma processing chamber |
US10882160B2 (en) | 2017-05-25 | 2021-01-05 | Applied Materials, Inc. | Correction of fabricated shapes in additive manufacturing using sacrificial material |
US10967482B2 (en) | 2017-05-25 | 2021-04-06 | Applied Materials, Inc. | Fabrication of polishing pad by additive manufacturing onto mold |
JP6826955B2 (ja) | 2017-06-14 | 2021-02-10 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
CN213006569U (zh) | 2017-06-21 | 2021-04-20 | 卡本有限公司 | 用于增材制造的系统和对分配用于增材制造的树脂有用的分配系统 |
US10763081B2 (en) | 2017-07-10 | 2020-09-01 | Applied Materials, Inc. | Apparatus and methods for manipulating radio frequency power at an edge ring in plasma process device |
US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
US11072050B2 (en) | 2017-08-04 | 2021-07-27 | Applied Materials, Inc. | Polishing pad with window and manufacturing methods thereof |
WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
JP7033907B2 (ja) | 2017-12-21 | 2022-03-11 | 東京エレクトロン株式会社 | プラズマエッチング装置及びプラズマエッチング方法 |
WO2019143473A1 (en) | 2018-01-22 | 2019-07-25 | Applied Materials, Inc. | Processing with powered edge ring |
KR20200108098A (ko) | 2018-02-05 | 2020-09-16 | 어플라이드 머티어리얼스, 인코포레이티드 | 3d 프린트된 cmp 패드들을 위한 압전 엔드포인팅 |
WO2019190676A1 (en) | 2018-03-30 | 2019-10-03 | Applied Materials, Inc. | Integrating 3d printing into multi-process fabrication schemes |
KR20200140931A (ko) | 2018-05-07 | 2020-12-16 | 어플라이드 머티어리얼스, 인코포레이티드 | 친수성 및 제타 전위 조정가능한 화학적 기계적 연마 패드들 |
US11201037B2 (en) | 2018-05-28 | 2021-12-14 | Applied Materials, Inc. | Process kit with adjustable tuning ring for edge uniformity control |
US10347500B1 (en) | 2018-06-04 | 2019-07-09 | Applied Materials, Inc. | Device fabrication via pulsed plasma |
US10847347B2 (en) | 2018-08-23 | 2020-11-24 | Applied Materials, Inc. | Edge ring assembly for a substrate support in a plasma processing chamber |
KR20210042171A (ko) | 2018-09-04 | 2021-04-16 | 어플라이드 머티어리얼스, 인코포레이티드 | 진보한 폴리싱 패드들을 위한 제형들 |
KR20210076154A (ko) | 2018-11-09 | 2021-06-23 | 어플라이드 머티어리얼스, 인코포레이티드 | 프로세싱 챔버를 위한 라디오 주파수 필터 시스템 |
US11289310B2 (en) | 2018-11-21 | 2022-03-29 | Applied Materials, Inc. | Circuits for edge ring control in shaped DC pulsed plasma process device |
CN113169026B (zh) | 2019-01-22 | 2024-04-26 | 应用材料公司 | 用于控制脉冲电压波形的反馈回路 |
US20200230781A1 (en) | 2019-01-23 | 2020-07-23 | Applied Materials, Inc. | Polishing pads formed using an additive manufacturing process and methods related thereto |
US11530478B2 (en) | 2019-03-19 | 2022-12-20 | Applied Materials, Inc. | Method for forming a hydrophobic and icephobic coating |
US11851570B2 (en) | 2019-04-12 | 2023-12-26 | Applied Materials, Inc. | Anionic polishing pads formed by printing processes |
-
2015
- 2015-04-24 JP JP2017520394A patent/JP6545261B2/ja active Active
- 2015-04-24 SG SG10202002601QA patent/SG10202002601QA/en unknown
- 2015-04-24 KR KR1020247002717A patent/KR20240015167A/ko active Application Filing
- 2015-04-24 CN CN201580060603.3A patent/CN107078048B/zh active Active
- 2015-04-24 KR KR1020217027084A patent/KR102436416B1/ko active IP Right Grant
- 2015-04-24 KR KR1020227028958A patent/KR102630261B1/ko active IP Right Grant
- 2015-04-24 SG SG11201703114QA patent/SG11201703114QA/en unknown
- 2015-04-24 KR KR1020177013366A patent/KR102295988B1/ko active IP Right Grant
- 2015-04-24 WO PCT/US2015/027473 patent/WO2016060712A1/en active Application Filing
- 2015-04-24 CN CN202110880110.1A patent/CN113579992A/zh active Pending
- 2015-10-16 US US14/885,950 patent/US10384330B2/en active Active
-
2019
- 2019-04-23 JP JP2019081720A patent/JP6849731B2/ja active Active
- 2019-08-15 US US16/541,641 patent/US11446788B2/en active Active
-
2021
- 2021-03-04 JP JP2021034028A patent/JP2021112819A/ja active Pending
-
2023
- 2023-07-13 JP JP2023114970A patent/JP2023153812A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
CN113579992A (zh) | 2021-11-02 |
CN107078048B (zh) | 2021-08-13 |
KR102295988B1 (ko) | 2021-09-01 |
JP2021112819A (ja) | 2021-08-05 |
KR102436416B1 (ko) | 2022-08-26 |
KR20240015167A (ko) | 2024-02-02 |
WO2016060712A1 (en) | 2016-04-21 |
US11446788B2 (en) | 2022-09-20 |
JP6545261B2 (ja) | 2019-07-17 |
SG11201703114QA (en) | 2017-06-29 |
KR20220122786A (ko) | 2022-09-02 |
JP2019166633A (ja) | 2019-10-03 |
US20200001433A1 (en) | 2020-01-02 |
JP2017533832A (ja) | 2017-11-16 |
KR102630261B1 (ko) | 2024-01-29 |
SG10202002601QA (en) | 2020-05-28 |
KR20170070210A (ko) | 2017-06-21 |
US20160107295A1 (en) | 2016-04-21 |
KR20210110741A (ko) | 2021-09-08 |
US10384330B2 (en) | 2019-08-20 |
JP2023153812A (ja) | 2023-10-18 |
CN107078048A (zh) | 2017-08-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6849731B2 (ja) | 付加製造プロセスを使用する、複合材料特性を有するcmpパッド構造 | |
US11958162B2 (en) | CMP pad construction with composite material properties using additive manufacturing processes | |
JP6760930B2 (ja) | 研磨用物品、及び、化学機械研磨用物品を製造するための統合型のシステムと方法 | |
TWI838251B (zh) | 研磨墊以及製造其之方法 | |
US12023853B2 (en) | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190516 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190516 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200714 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20201013 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20210202 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20210304 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6849731 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |