WO2016060712A1 - Cmp pad construction with composite material properties using additive manufacturing processes - Google Patents

Cmp pad construction with composite material properties using additive manufacturing processes Download PDF

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Publication number
WO2016060712A1
WO2016060712A1 PCT/US2015/027473 US2015027473W WO2016060712A1 WO 2016060712 A1 WO2016060712 A1 WO 2016060712A1 US 2015027473 W US2015027473 W US 2015027473W WO 2016060712 A1 WO2016060712 A1 WO 2016060712A1
Authority
WO
WIPO (PCT)
Prior art keywords
features
polishing
polishing pad
pad
depositing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2015/027473
Other languages
English (en)
French (fr)
Inventor
Rajeev Bajaj
Kasiraman Krishnan
Mahendra C. Orilall
Daniel REDFIELD
Fred C. Redeker
Nag B. Patibandla
Gregory E. Menk
Jason G. Fung
Russell Edward Perry
Robert E. Davenport
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to JP2017520394A priority Critical patent/JP6545261B2/ja
Priority to SG11201703114QA priority patent/SG11201703114QA/en
Priority to KR1020217027084A priority patent/KR102436416B1/ko
Priority to KR1020177013366A priority patent/KR102295988B1/ko
Priority to KR1020247002717A priority patent/KR20240015167A/ko
Priority to KR1020227028958A priority patent/KR102630261B1/ko
Priority to CN201580060603.3A priority patent/CN107078048B/zh
Publication of WO2016060712A1 publication Critical patent/WO2016060712A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0045—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by stacking sheets of abrasive material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing

Definitions

  • One embodiment provides a polishing pad including a composite pad body.
  • the composite pad body includes one or more first features formed from a first material or first composition of materials, and one or more second features formed from a second material or second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.
  • Figure 7 is a schematic sectional view of a polishing pad having multiple zones, according to an embodiment of the present disclosure.
  • Figure 21 A is a schematic view of a 3D printing station according to an embodiment of the present disclosure.
  • FIG. 3A is a schematic perspective sectional view of a polishing pad 300 according to one embodiment of the present disclosure.
  • the polishing pad 300 includes a plurality of surface features 302 extending from a base material layer 304. Upper surfaces 306 of the surface features 302 form a polishing surface for contacting with the substrate during polishing.
  • the surface features 302 and the base material layer 304 have different properties.
  • the surface features 302 may be formed from a hard material, such as materials for the hard feature 204 of the polishing pad 200, while the base material layers 304 may be formed from an elastic material, such as materials for the elastic features 206 of the polishing pad 200.
  • the polishing pad 300 may be formed by 3D printing, similar to the polishing pad 200.
  • the surface features 302 are shown to be circular columns protruding from the base material layer 304.
  • the surface features 302 may be of any suitable shape, for example columns with oval, square, rectangle, triangle, polygonal, or irregular sectionals.
  • the surface features 302 may be of different shapes to tune hardness of the polishing pad 300.
  • FIG. 3C is a schematic partial sectional view of a polishing pad 300c according to one embodiment of the present disclosure.
  • the polishing pad 300c is similar to the polishing pad 300 of Figure 3A except that the polishing pad 300c includes a plurality of surface features 302c that interlock with base material layer 304c.
  • each of the plurality of surface features 302c may include protruding horizontal ridges 314 and the base material layer 304c may include horizontal recesses 316 for receiving the horizontal ridges 314.
  • the base material layer 304c may include protruding ridges while the surface features 302c include recesses.
  • FIG. 5 is a schematic perspective sectional view of a polishing pad 500 having one or more observation windows 510.
  • the polishing pad 500 may have a pad body 502.
  • the pad body 502 may include one or more elastic features 506 and a plurality of hard features 504 extending from the elastic features 506 for polishing.
  • the elastic features 506 and the hard features 504 may be formed from materials similar to those for the elastic features 206 and hard features 204 of the polishing pad 200.
  • the hard features 504 may be arranged in any suitable patterns according to the present disclosure.
  • FIG. 6 is a schematic perspective sectional view of a polishing pad 600 including a backing layer 606.
  • the polishing pad 600 includes a base material layer 604 and a plurality of surface features 602 protruding from the base material layer 604.
  • the polishing pad 600 may be similar to the polishing pads 200, 300, 400, 500 described above except having the backing layer 606 attached to the base material layer 604.
  • the backing layer 606 may provide a desired compressibility to the polishing pad 600.
  • the backing layer 606 may also be used to alter the overall mechanical properties of the polishing pad 600 to achieve a desired hardness and/or have desired dynamic material properties (e.g., storage modulus and elastic modulus).
  • the backing layer 606 may have a hardness value of less than 80 Shore A scale.
  • Figure 14N is a schematic pixel chart of a polishing pad design 1400n having a plurality of discrete polishing features 1402n formed in base features 1404n.
  • the polishing pad of Figure 14N is similar to the polishing pad of Figure 14M except that some polishing features 1402n in Figure 14N may be connected to form one or more spiral chains.
  • the one or more spiral chains may guide the fluid flow of the polishing slurry to assist polishing slurry retention and polishing pad cleaning.
  • Figure 140 is a schematic pixel chart of a polishing pad design 1400o having a plurality of discrete polishing features 1402o and base features 1404o.
  • the polishing pad of Figure 140 is similar to the polishing pad of Figure 14K except that each of the discrete polishing features 1402o in Figure 140 is in the shape of the logo of Applied Materials, Inc.
  • Figure 140 demonstrates that embodiments of the present disclosure encompass polishing pads having polishing features with any suitable design, pattern and/or arrangement.
  • Gradients in the material composition and/or material properties of the stacked 3D printed layers can vary from a high concentration to a low concentration in one direction, or vice versa.
  • one or more regions with polishing pad may include more complex concentration gradients, such as a high/low/high or low/high/low concentration gradient.
  • a gradient in concentration can be formed by varying the position and/or amount of a first printed component to a second printed component in each successive layer of a formed polishing pad.
  • the platen assembly 191 1 is rotationally disposed on a base 1908 and is typically supported above the base 1908 by a bearing 1938 so that the platen assembly 191 1 may be rotated relative to the base 1908.
  • the platen assembly 191 1 may be fabricated from a rigid material, such as a metal or rigid plastic, and in one embodiment the platen assembly 191 1 has an upper surface that is fabricated from or coated with a dielectric material, such as CPVC.
  • the platen assembly 191 1 may have a circular, rectangular or other plane form.
  • Figure 20A is a schematic isometric view of one embodiment of a pad manufacturing system 2000A for preparing a pad assembly that may be used on a platen assembly, for example the pad assembly 1913 used in the platen assembly 191 1 of Figure 19.
  • the pad manufacturing system 2000A generally includes a feed section 2002, a print section 2004 and a curing section 2006.
  • the pad manufacturing system 2000A is utilized to produce a plurality of printed pads 2008 that may be used as the pad assembly 1913 in the platen assembly 191 1 of Figure 19. While not shown, the pad manufacturing system 2000A may also be modified to print a pad for use in a roll-to-roll polishing system.
  • Figure 21 A is a schematic cross-sectional view of one embodiment of a 3D printing station 2024A that may be used in the pad manufacturing system 2000A of Figure 20A or the pad manufacturing system 2000B of Figure 20B.
  • Figure 21 A shows a portion of one embodiment of a polishing pad 2102 manufactured using a 3D printing process.
  • the polishing pad 2102 may be the pad assembly 1913 described in Figure 19, the printed pad 2008 (shown in Figure 20A) or the polishing article 2029 (shown in Figure 20B).
  • 3D printing offers a convenient and highly controllable process for producing polishing articles with abrasives embedded in specific locations within the polishing layer.
  • the polishing pad 2102 may be printed on a support 2100, which may be the backing material 2017 of Figure 20A or the web 2012 of Figure 20B.
  • the 3D printing approach allows tight tolerances to be achieved in patterns of the polishing layer 2105 and high tolerances in the distribution of abrasive particles 2145 that are embedded in the polishing layer 2105 due to the layer-by- layer printing approach.
  • the first material 2210 may have a different reactivity with electromagnetic energy, such as a beam or beams of energy from the electromagnetic energy source 1958 (shown in Figure 19) when compared with the second material 2212.
  • the different reactivity may be used to form a micro texture on the polishing surface 2205.
  • the different reactivity between the first material 2210 and the second material 2212 may provide that the first material 2210 will be ablated at a greater rate than the second material 2212, or vice versa.
  • the pores 2232 may be micron sized or nano sized materials that form micron sized or nano sized domains within the polishing surface 2205 of the polishing pad 2200.
  • the pores 2232 may include a mean diameter which is less than about 150 microns to about 10 microns, or less.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Curing Cements, Concrete, And Artificial Stone (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
PCT/US2015/027473 2014-10-17 2015-04-24 Cmp pad construction with composite material properties using additive manufacturing processes Ceased WO2016060712A1 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2017520394A JP6545261B2 (ja) 2014-10-17 2015-04-24 付加製造プロセスを使用する、複合材料特性を有するｃｍｐパッド構造
SG11201703114QA SG11201703114QA (en) 2014-10-17 2015-04-24 Cmp pad construction with composite material properties using additive manufacturing processes
KR1020217027084A KR102436416B1 (ko) 2014-10-17 2015-04-24 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성
KR1020177013366A KR102295988B1 (ko) 2014-10-17 2015-04-24 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성
KR1020247002717A KR20240015167A (ko) 2014-10-17 2015-04-24 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성
KR1020227028958A KR102630261B1 (ko) 2014-10-17 2015-04-24 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성
CN201580060603.3A CN107078048B (zh) 2014-10-17 2015-04-24 使用加成制造工艺的具复合材料特性的cmp衬垫建构

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201462065193P 2014-10-17 2014-10-17
US201462065270P 2014-10-17 2014-10-17
US62/065,193 2014-10-17
US62/065,270 2014-10-17

Publications (1)

Publication Number Publication Date
WO2016060712A1 true WO2016060712A1 (en) 2016-04-21

Family

ID=55747083

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2015/027473 Ceased WO2016060712A1 (en) 2014-10-17 2015-04-24 Cmp pad construction with composite material properties using additive manufacturing processes

Country Status (6)

Country Link
US (2) US10384330B2 (enExample)
JP (4) JP6545261B2 (enExample)
KR (4) KR20240015167A (enExample)
CN (2) CN107078048B (enExample)
SG (2) SG11201703114QA (enExample)
WO (1) WO2016060712A1 (enExample)

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WO2018064162A1 (en) * 2016-09-30 2018-04-05 Applied Materials, Inc. Additive manufacturing of polishing pads on a conveyor
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