KR100789663B1 - 연마층에 투명 윈도우 부분을 갖는 연마 패드 - Google Patents
연마층에 투명 윈도우 부분을 갖는 연마 패드 Download PDFInfo
- Publication number
- KR100789663B1 KR100789663B1 KR1020027012055A KR20027012055A KR100789663B1 KR 100789663 B1 KR100789663 B1 KR 100789663B1 KR 1020027012055 A KR1020027012055 A KR 1020027012055A KR 20027012055 A KR20027012055 A KR 20027012055A KR 100789663 B1 KR100789663 B1 KR 100789663B1
- Authority
- KR
- South Korea
- Prior art keywords
- polishing
- window portion
- polishing pad
- wear rate
- pad
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
- B24D13/02—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery
- B24D13/12—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery comprising assemblies of felted or spongy material, e.g. felt, steel wool, foamed latex
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
Abstract
Description
Claims (14)
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 연마 동안 제1 마모 속도로 마모되는 연마 표면; 및연마 패드에 형성되고 연마 표면과 동일 평면으로 형성된 윈도우 표면을 가지는 윈도우 부분;을 포함하되, 윈도우 표면이 연마 중에 제1 마모 속도 보다 큰 제2 마모 속도로 마모되는, 반도체 웨이퍼의 화학기계적 연마용 연마 패드.
- 제7항에 있어서, 제2 마모 속도가 제1 마모 속도보다 5% 내지 25% 큰 연마 패드.
- 제7항에 있어서, 윈도우 부분이 2개의 불혼화성 중합체의 중합된 혼합물을 포함하는 연마 패드.
- 제7항에 있어서, 윈도부 부분이 폴리메틸메타크릴레이트 및 폴리카보네이트 중 적어도 하나를 포함하는 연마 패드.
- 제7항에 있어서, 윈도우 부분이 빛 산란에 상당한 영향을 주지 않으면서 중합체 매트릭스의 마모 속도를 증가시키도록 내부에 형성된 불연속성을 가지는 중합체 매트릭스를 포함하는 연마 패드.
- 제11항에 있어서, 불연속성은 고체 입자, 유체, 가스 및 불혼화성 중합체를 포함하는 불연속성 그룹에서 선택된 적어도 하나를 포함하는 연마 패드.
- 제11항에 있어서, 불연속성은 중합체 매트릭스 보다 작은 내마모성을 가지는 고체 물질을 포함하는 연마 패드.
- 제13항에 있어서, 고체 물질은 실리카, 티타니아, 알루미나, 세리아 및 플라스틱을 포함하는 입자 그룹에서 선택된 적어도 하나의 고체 입자형을 포함하는 연마 패드.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US18938600P | 2000-03-15 | 2000-03-15 | |
US60/189,386 | 2000-03-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20020087076A KR20020087076A (ko) | 2002-11-21 |
KR100789663B1 true KR100789663B1 (ko) | 2007-12-31 |
Family
ID=22697114
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020027012055A KR100789663B1 (ko) | 2000-03-15 | 2001-03-13 | 연마층에 투명 윈도우 부분을 갖는 연마 패드 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6860793B2 (ko) |
EP (1) | EP1263548A1 (ko) |
JP (1) | JP4634688B2 (ko) |
KR (1) | KR100789663B1 (ko) |
TW (1) | TW495419B (ko) |
WO (1) | WO2001068322A1 (ko) |
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US6913517B2 (en) | 2002-05-23 | 2005-07-05 | Cabot Microelectronics Corporation | Microporous polishing pads |
US7435165B2 (en) * | 2002-10-28 | 2008-10-14 | Cabot Microelectronics Corporation | Transparent microporous materials for CMP |
US7267607B2 (en) | 2002-10-28 | 2007-09-11 | Cabot Microelectronics Corporation | Transparent microporous materials for CMP |
US7311862B2 (en) * | 2002-10-28 | 2007-12-25 | Cabot Microelectronics Corporation | Method for manufacturing microporous CMP materials having controlled pore size |
US6832947B2 (en) * | 2003-02-10 | 2004-12-21 | Cabot Microelectronics Corporation | CMP pad with composite transparent window |
US6960120B2 (en) * | 2003-02-10 | 2005-11-01 | Cabot Microelectronics Corporation | CMP pad with composite transparent window |
US7704125B2 (en) | 2003-03-24 | 2010-04-27 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
US9278424B2 (en) | 2003-03-25 | 2016-03-08 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
US8864859B2 (en) | 2003-03-25 | 2014-10-21 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
US7195539B2 (en) * | 2003-09-19 | 2007-03-27 | Cabot Microelectronics Coporation | Polishing pad with recessed window |
US7195544B2 (en) * | 2004-03-23 | 2007-03-27 | Cabot Microelectronics Corporation | CMP porous pad with component-filled pores |
US7204742B2 (en) | 2004-03-25 | 2007-04-17 | Cabot Microelectronics Corporation | Polishing pad comprising hydrophobic region and endpoint detection port |
US8075372B2 (en) * | 2004-09-01 | 2011-12-13 | Cabot Microelectronics Corporation | Polishing pad with microporous regions |
US20060089094A1 (en) * | 2004-10-27 | 2006-04-27 | Swisher Robert G | Polyurethane urea polishing pad |
TWI385050B (zh) * | 2005-02-18 | 2013-02-11 | Nexplanar Corp | 用於cmp之特製拋光墊及其製造方法及其用途 |
TW200709892A (en) * | 2005-08-18 | 2007-03-16 | Rohm & Haas Elect Mat | Transparent polishing pad |
WO2009070352A1 (en) * | 2007-11-30 | 2009-06-04 | Innopad, Inc. | Chemical-mechanical planarization pad having end point detection window |
US8257544B2 (en) | 2009-06-10 | 2012-09-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad having a low defect integral window |
US9017140B2 (en) | 2010-01-13 | 2015-04-28 | Nexplanar Corporation | CMP pad with local area transparency |
US9156124B2 (en) | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
US8758659B2 (en) | 2010-09-29 | 2014-06-24 | Fns Tech Co., Ltd. | Method of grooving a chemical-mechanical planarization pad |
US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
CN113579992A (zh) | 2014-10-17 | 2021-11-02 | 应用材料公司 | 使用加成制造工艺的具复合材料特性的cmp衬垫建构 |
US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
US10618141B2 (en) | 2015-10-30 | 2020-04-14 | Applied Materials, Inc. | Apparatus for forming a polishing article that has a desired zeta potential |
US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
US20180304539A1 (en) | 2017-04-21 | 2018-10-25 | Applied Materials, Inc. | Energy delivery system with array of energy sources for an additive manufacturing apparatus |
US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
US11072050B2 (en) | 2017-08-04 | 2021-07-27 | Applied Materials, Inc. | Polishing pad with window and manufacturing methods thereof |
WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
WO2020050932A1 (en) | 2018-09-04 | 2020-03-12 | Applied Materials, Inc. | Formulations for advanced polishing pads |
US11813712B2 (en) | 2019-12-20 | 2023-11-14 | Applied Materials, Inc. | Polishing pads having selectively arranged porosity |
US11806829B2 (en) | 2020-06-19 | 2023-11-07 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
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US5893796A (en) | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
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-
2001
- 2001-03-13 KR KR1020027012055A patent/KR100789663B1/ko active IP Right Grant
- 2001-03-13 EP EP01918622A patent/EP1263548A1/en not_active Withdrawn
- 2001-03-13 JP JP2001566858A patent/JP4634688B2/ja not_active Expired - Lifetime
- 2001-03-13 US US09/805,328 patent/US6860793B2/en not_active Expired - Lifetime
- 2001-03-13 WO PCT/US2001/008026 patent/WO2001068322A1/en not_active Application Discontinuation
- 2001-05-15 TW TW090106066A patent/TW495419B/zh not_active IP Right Cessation
Patent Citations (4)
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EP0829328A2 (en) * | 1992-08-19 | 1998-03-18 | Rodel, Inc. | Polymeric substrate with polymeric microelements |
US5893679A (en) | 1995-03-28 | 1999-04-13 | Colas S.A. | Process and a machine for the implementation of a bonding layer and road-type coating comprising such a layer |
US5893796A (en) | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
US5893760A (en) | 1996-03-27 | 1999-04-13 | Kabushiki Kaisha Toshiba | Method of heat treating a semiconductor wafer to reduce stress |
Also Published As
Publication number | Publication date |
---|---|
JP2003526938A (ja) | 2003-09-09 |
US6860793B2 (en) | 2005-03-01 |
EP1263548A1 (en) | 2002-12-11 |
JP4634688B2 (ja) | 2011-02-16 |
US20010053658A1 (en) | 2001-12-20 |
WO2001068322A9 (en) | 2002-12-19 |
KR20020087076A (ko) | 2002-11-21 |
WO2001068322A1 (en) | 2001-09-20 |
TW495419B (en) | 2002-07-21 |
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