CN103796797A - 具有孔口的抛光垫 - Google Patents
具有孔口的抛光垫 Download PDFInfo
- Publication number
- CN103796797A CN103796797A CN201280045294.9A CN201280045294A CN103796797A CN 103796797 A CN103796797 A CN 103796797A CN 201280045294 A CN201280045294 A CN 201280045294A CN 103796797 A CN103796797 A CN 103796797A
- Authority
- CN
- China
- Prior art keywords
- aperture
- groove
- polishing
- main body
- polishing pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 343
- 238000000034 method Methods 0.000 claims abstract description 40
- 239000002002 slurry Substances 0.000 claims description 57
- 239000000463 material Substances 0.000 claims description 41
- 239000000758 substrate Substances 0.000 claims description 38
- 239000000203 mixture Substances 0.000 claims description 30
- 238000003825 pressing Methods 0.000 claims description 24
- 230000003287 optical effect Effects 0.000 claims description 22
- 238000007493 shaping process Methods 0.000 claims description 20
- 239000000126 substance Substances 0.000 claims description 20
- 229920001187 thermosetting polymer Polymers 0.000 claims description 15
- 229920002635 polyurethane Polymers 0.000 claims description 13
- 239000004814 polyurethane Substances 0.000 claims description 13
- 238000012806 monitoring device Methods 0.000 claims description 10
- 238000002156 mixing Methods 0.000 claims description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 8
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 6
- -1 aromatic diamine compound Chemical class 0.000 claims description 6
- 229920001971 elastomer Polymers 0.000 claims description 6
- 238000012544 monitoring process Methods 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 239000012948 isocyanate Substances 0.000 claims description 5
- 150000002513 isocyanates Chemical class 0.000 claims description 5
- 239000010453 quartz Substances 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000000945 filler Substances 0.000 claims description 4
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 claims description 4
- 239000003361 porogen Substances 0.000 claims description 2
- 239000004568 cement Substances 0.000 claims 1
- 210000004027 cell Anatomy 0.000 description 24
- 239000003795 chemical substances by application Substances 0.000 description 20
- 239000011295 pitch Substances 0.000 description 19
- 230000008569 process Effects 0.000 description 14
- 238000000465 moulding Methods 0.000 description 8
- 239000002243 precursor Substances 0.000 description 8
- 235000012431 wafers Nutrition 0.000 description 8
- 238000001514 detection method Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 238000013461 design Methods 0.000 description 5
- 239000004088 foaming agent Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 description 4
- 238000005987 sulfurization reaction Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
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- 239000000314 lubricant Substances 0.000 description 3
- 238000007517 polishing process Methods 0.000 description 3
- 238000009966 trimming Methods 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 150000004984 aromatic diamines Chemical class 0.000 description 2
- 210000005056 cell body Anatomy 0.000 description 2
- QCCDYNYSHILRDG-UHFFFAOYSA-K cerium(3+);trifluoride Chemical compound [F-].[F-].[F-].[Ce+3] QCCDYNYSHILRDG-UHFFFAOYSA-K 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
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- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- ITRNXVSDJBHYNJ-UHFFFAOYSA-N tungsten disulfide Chemical compound S=[W]=S ITRNXVSDJBHYNJ-UHFFFAOYSA-N 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- 239000004821 Contact adhesive Substances 0.000 description 1
- 244000137852 Petrea volubilis Species 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
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- 230000014509 gene expression Effects 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
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- 238000005259 measurement Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
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- 230000000007 visual effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
Description
Claims (57)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/184,395 | 2011-07-15 | ||
US13/184,395 US8920219B2 (en) | 2011-07-15 | 2011-07-15 | Polishing pad with alignment aperture |
PCT/US2012/046037 WO2013012608A2 (en) | 2011-07-15 | 2012-07-10 | Polishing pad with aperture |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103796797A true CN103796797A (zh) | 2014-05-14 |
CN103796797B CN103796797B (zh) | 2017-07-21 |
Family
ID=46516885
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201280045294.9A Active CN103796797B (zh) | 2011-07-15 | 2012-07-10 | 具有孔口的抛光垫 |
Country Status (5)
Country | Link |
---|---|
US (2) | US8920219B2 (zh) |
KR (3) | KR101619100B1 (zh) |
CN (1) | CN103796797B (zh) |
TW (2) | TWI513544B (zh) |
WO (1) | WO2013012608A2 (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108655948A (zh) * | 2018-07-06 | 2018-10-16 | 湖北鼎龙控股股份有限公司 | 抛光垫及研磨设备 |
CN109500728A (zh) * | 2017-09-15 | 2019-03-22 | 罗门哈斯电子材料Cmp控股股份有限公司 | 凸缘光学端点检测窗口和含有其的cmp抛光垫 |
CN113165141A (zh) * | 2018-11-29 | 2021-07-23 | 株式会社大辉 | 抛光垫及其制造方法 |
CN113547450A (zh) * | 2021-09-22 | 2021-10-26 | 湖北鼎汇微电子材料有限公司 | 抛光垫、研磨设备及半导体器件的制造方法 |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9597769B2 (en) | 2012-06-04 | 2017-03-21 | Nexplanar Corporation | Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer |
US9649742B2 (en) * | 2013-01-22 | 2017-05-16 | Nexplanar Corporation | Polishing pad having polishing surface with continuous protrusions |
US10160092B2 (en) | 2013-03-14 | 2018-12-25 | Cabot Microelectronics Corporation | Polishing pad having polishing surface with continuous protrusions having tapered sidewalls |
US9238294B2 (en) * | 2014-06-18 | 2016-01-19 | Nexplanar Corporation | Polishing pad having porogens with liquid filler |
WO2017156342A1 (en) | 2016-03-09 | 2017-09-14 | Applied Materials, Inc. | Correction of fabricated shapes in additive manufacturing |
TWI629297B (zh) * | 2016-07-05 | 2018-07-11 | 智勝科技股份有限公司 | 研磨層及其製造方法以及研磨方法 |
JP7227137B2 (ja) * | 2017-01-20 | 2023-02-21 | アプライド マテリアルズ インコーポレイテッド | Cmp用途向けの薄いプラスチック研磨物品 |
JP6985587B2 (ja) * | 2017-03-30 | 2021-12-22 | 富士紡ホールディングス株式会社 | 研磨パッド |
JP6989752B2 (ja) * | 2017-03-30 | 2022-02-03 | 富士紡ホールディングス株式会社 | 研磨パッド |
US10882160B2 (en) | 2017-05-25 | 2021-01-05 | Applied Materials, Inc. | Correction of fabricated shapes in additive manufacturing using sacrificial material |
US10967482B2 (en) | 2017-05-25 | 2021-04-06 | Applied Materials, Inc. | Fabrication of polishing pad by additive manufacturing onto mold |
US10861702B2 (en) | 2017-06-14 | 2020-12-08 | Rohm And Haas Electronic Materials Cmp Holdings | Controlled residence CMP polishing method |
US10586708B2 (en) * | 2017-06-14 | 2020-03-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Uniform CMP polishing method |
US10857648B2 (en) | 2017-06-14 | 2020-12-08 | Rohm And Haas Electronic Materials Cmp Holdings | Trapezoidal CMP groove pattern |
US10857647B2 (en) | 2017-06-14 | 2020-12-08 | Rohm And Haas Electronic Materials Cmp Holdings | High-rate CMP polishing method |
US10777418B2 (en) | 2017-06-14 | 2020-09-15 | Rohm And Haas Electronic Materials Cmp Holdings, I | Biased pulse CMP groove pattern |
US11298794B2 (en) * | 2019-03-08 | 2022-04-12 | Applied Materials, Inc. | Chemical mechanical polishing using time share control |
KR102570825B1 (ko) * | 2020-07-16 | 2023-08-28 | 한국생산기술연구원 | 다공성 돌출 패턴을 포함하는 연마 패드 및 이를 포함하는 연마 장치 |
KR102636521B1 (ko) * | 2020-07-16 | 2024-02-15 | 한국생산기술연구원 | 다공성 돌출 패턴을 포함하는 화학-기계적 연마 패드 및 그 제조 방법 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002001652A (ja) * | 2000-06-22 | 2002-01-08 | Nikon Corp | 研磨パッド及び研磨装置及び素子製造方法 |
TW550693B (en) * | 2001-06-15 | 2003-09-01 | Ebara Corp | Polishing apparatus and polishing pad and method of manufacturing same |
US20060068088A1 (en) * | 2004-09-28 | 2006-03-30 | Hae-Do Jeong | Chemical mechanical polishing pad with micro-mold and production method thereof |
TWI276504B (en) * | 2003-09-19 | 2007-03-21 | Cabot Microelectronics Corp | Polishing pad with recessed window |
JP2007118106A (ja) * | 2005-10-26 | 2007-05-17 | Toyo Tire & Rubber Co Ltd | 研磨パッド及びその製造方法 |
TWI311512B (en) * | 2005-04-25 | 2009-07-01 | Cabot Microelectronics Corporatio | Multi-layer polishing pad material for cmp |
TWI321141B (en) * | 2005-01-26 | 2010-03-01 | Applied Materials Inc | Multi-layer polishing pad for low-pressure polishing |
TW201100196A (en) * | 2009-04-30 | 2011-01-01 | Applied Materials Inc | Method of making and apparatus having windowless polishing pad and protected fiber |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20040093402A (ko) * | 2003-04-22 | 2004-11-05 | 제이에스알 가부시끼가이샤 | 연마 패드 및 반도체 웨이퍼의 연마 방법 |
US7086932B2 (en) * | 2004-05-11 | 2006-08-08 | Freudenberg Nonwovens | Polishing pad |
US7264536B2 (en) * | 2003-09-23 | 2007-09-04 | Applied Materials, Inc. | Polishing pad with window |
US7182670B2 (en) * | 2004-09-22 | 2007-02-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | CMP pad having a streamlined windowpane |
US7534162B2 (en) * | 2005-09-06 | 2009-05-19 | Freescale Semiconductor, Inc. | Grooved platen with channels or pathway to ambient air |
JP5110677B2 (ja) * | 2006-05-17 | 2012-12-26 | 東洋ゴム工業株式会社 | 研磨パッド |
US7942724B2 (en) * | 2006-07-03 | 2011-05-17 | Applied Materials, Inc. | Polishing pad with window having multiple portions |
US9180570B2 (en) | 2008-03-14 | 2015-11-10 | Nexplanar Corporation | Grooved CMP pad |
US8083570B2 (en) * | 2008-10-17 | 2011-12-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad having sealed window |
US8662957B2 (en) * | 2009-06-30 | 2014-03-04 | Applied Materials, Inc. | Leak proof pad for CMP endpoint detection |
US9017140B2 (en) * | 2010-01-13 | 2015-04-28 | Nexplanar Corporation | CMP pad with local area transparency |
-
2011
- 2011-07-15 US US13/184,395 patent/US8920219B2/en active Active
-
2012
- 2012-07-10 KR KR1020157020491A patent/KR101619100B1/ko active IP Right Grant
- 2012-07-10 KR KR1020167011455A patent/KR101744581B1/ko active IP Right Grant
- 2012-07-10 CN CN201280045294.9A patent/CN103796797B/zh active Active
- 2012-07-10 KR KR1020147002650A patent/KR101576054B1/ko active IP Right Grant
- 2012-07-10 WO PCT/US2012/046037 patent/WO2013012608A2/en active Application Filing
- 2012-07-13 TW TW101125451A patent/TWI513544B/zh active
- 2012-07-13 TW TW104129817A patent/TWI586484B/zh active
-
2014
- 2014-11-21 US US14/550,129 patent/US9597770B2/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002001652A (ja) * | 2000-06-22 | 2002-01-08 | Nikon Corp | 研磨パッド及び研磨装置及び素子製造方法 |
TW550693B (en) * | 2001-06-15 | 2003-09-01 | Ebara Corp | Polishing apparatus and polishing pad and method of manufacturing same |
TWI276504B (en) * | 2003-09-19 | 2007-03-21 | Cabot Microelectronics Corp | Polishing pad with recessed window |
US20060068088A1 (en) * | 2004-09-28 | 2006-03-30 | Hae-Do Jeong | Chemical mechanical polishing pad with micro-mold and production method thereof |
TWI321141B (en) * | 2005-01-26 | 2010-03-01 | Applied Materials Inc | Multi-layer polishing pad for low-pressure polishing |
TWI311512B (en) * | 2005-04-25 | 2009-07-01 | Cabot Microelectronics Corporatio | Multi-layer polishing pad material for cmp |
JP2007118106A (ja) * | 2005-10-26 | 2007-05-17 | Toyo Tire & Rubber Co Ltd | 研磨パッド及びその製造方法 |
TW201100196A (en) * | 2009-04-30 | 2011-01-01 | Applied Materials Inc | Method of making and apparatus having windowless polishing pad and protected fiber |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109500728A (zh) * | 2017-09-15 | 2019-03-22 | 罗门哈斯电子材料Cmp控股股份有限公司 | 凸缘光学端点检测窗口和含有其的cmp抛光垫 |
CN108655948A (zh) * | 2018-07-06 | 2018-10-16 | 湖北鼎龙控股股份有限公司 | 抛光垫及研磨设备 |
CN108655948B (zh) * | 2018-07-06 | 2024-02-23 | 湖北鼎龙控股股份有限公司 | 抛光垫及研磨设备 |
CN113165141A (zh) * | 2018-11-29 | 2021-07-23 | 株式会社大辉 | 抛光垫及其制造方法 |
CN113547450A (zh) * | 2021-09-22 | 2021-10-26 | 湖北鼎汇微电子材料有限公司 | 抛光垫、研磨设备及半导体器件的制造方法 |
CN113547450B (zh) * | 2021-09-22 | 2022-01-07 | 湖北鼎汇微电子材料有限公司 | 抛光垫、研磨设备及半导体器件的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
TW201545837A (zh) | 2015-12-16 |
KR20150092362A (ko) | 2015-08-12 |
TWI513544B (zh) | 2015-12-21 |
KR101744581B1 (ko) | 2017-06-08 |
KR101619100B1 (ko) | 2016-05-10 |
TWI586484B (zh) | 2017-06-11 |
US20130017764A1 (en) | 2013-01-17 |
KR20140028140A (ko) | 2014-03-07 |
TW201313398A (zh) | 2013-04-01 |
US9597770B2 (en) | 2017-03-21 |
US8920219B2 (en) | 2014-12-30 |
WO2013012608A2 (en) | 2013-01-24 |
WO2013012608A3 (en) | 2013-05-10 |
KR20160056325A (ko) | 2016-05-19 |
US20150079878A1 (en) | 2015-03-19 |
CN103796797B (zh) | 2017-07-21 |
KR101576054B1 (ko) | 2015-12-09 |
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