JP6500014B2 - 蒸着用前駆体およびその作製方法 - Google Patents
蒸着用前駆体およびその作製方法 Download PDFInfo
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- JP6500014B2 JP6500014B2 JP2016517387A JP2016517387A JP6500014B2 JP 6500014 B2 JP6500014 B2 JP 6500014B2 JP 2016517387 A JP2016517387 A JP 2016517387A JP 2016517387 A JP2016517387 A JP 2016517387A JP 6500014 B2 JP6500014 B2 JP 6500014B2
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- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 239000002638 heterogeneous catalyst Substances 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 239000012433 hydrogen halide Substances 0.000 description 1
- 229910000039 hydrogen halide Inorganic materials 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 150000002475 indoles Chemical class 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000004491 isohexyl group Chemical group C(CCC(C)C)* 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- DIOQZVSQGTUSAI-UHFFFAOYSA-N n-butylhexane Natural products CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 239000012038 nucleophile Substances 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 150000003053 piperidines Chemical class 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001467 poly(styrenesulfonates) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000003217 pyrazoles Chemical class 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 125000004076 pyridyl group Chemical group 0.000 description 1
- 150000003233 pyrroles Chemical class 0.000 description 1
- 150000003235 pyrrolidines Chemical class 0.000 description 1
- 125000002943 quinolinyl group Chemical group N1=C(C=CC2=CC=CC=C12)* 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical class [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 238000010189 synthetic method Methods 0.000 description 1
- 229910052713 technetium Inorganic materials 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- VEDJZFSRVVQBIL-UHFFFAOYSA-N trisilane Chemical compound [SiH3][SiH2][SiH3] VEDJZFSRVVQBIL-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 239000006200 vaporizer Substances 0.000 description 1
- PXXNTAGJWPJAGM-UHFFFAOYSA-N vertaline Natural products C1C2C=3C=C(OC)C(OC)=CC=3OC(C=C3)=CC=C3CCC(=O)OC1CC1N2CCCC1 PXXNTAGJWPJAGM-UHFFFAOYSA-N 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
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- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
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- B01J23/24—Chromium, molybdenum or tungsten
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- B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
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- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
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Description
は遷移金属触媒により触媒される。触媒は不均一であってもよいし、又は均一であってもよい。第二級アミンの一般反応を方程式1に示す。一般反応を方程式1に示す。方程式1の反応は発熱性である。反応は溶媒中で行ってもよいし、又は溶媒を使わずに行ってもよい。反応はバッチ式反応器又は連続流式反応器中で行うことができる。バッチ式反応器を使用した場合、反応器はクライオトラップに接続した凝縮器に取り付けてもよい(図2)。この集成装置では、反応が起こる際に形成された水素を排気することができる。圧力は凝縮器とクライオトラップとの間に取り付けた背圧制御弁により制御することができる。クライオトラップは、反応中及び/又は反応後に水素を系の外に送ることを可能とする排気ラインに接続してもよい。フィルターを有する浸漬管により容器からの生成物の取り出しが容易になる。
(式中、n=1〜3であり、m=0〜3であり、k=0〜3であり、R1、R3、及びR5は独立してH、直鎖若しくは分岐C1〜C6アルキル、直鎖若しくは分岐C1〜C8アルケニル、直鎖若しくは分岐C1〜C8アルキニル、C6〜C10アリール、直鎖若しくは分岐C1〜C6アルキルエーテル、シリル、トリメチルシリル、又は直鎖若しくは分岐C1〜C6アルキル置換シリルの群から選択され、R1R2N、R3R4N及びR5R6Nはアジリジン、アゼチジン、ピペリジン、ピロリジン、ピロール、イミダゾール、ピラゾール、インドールを含む環状第二級アミン又は該環状第二級アミンの任意のC置換誘導体とすることができ、R2、R4、及びR6は独立して直鎖若しくは分岐C1〜C6アルキル、直鎖若しくは分岐C1〜C8アルケニル、直鎖若しくは分岐C1〜C8アルキニル、C6〜C10アリール、直鎖若しくは分岐C1〜C6アルキルエーテル、シリル、トリメチルシリル、又は直鎖若しくは分岐C1〜C6アルキル置換シリル、アジリジン、アゼチジン、ピペリジン、ピロリジン、ピロール、イミダゾール、ピラゾール、インドールを含む環状第二級アミン又は該環状第二級アミンの任意のC置換誘導体の群から選択される)。
a)反応物TSA及びnR1R2NH及びmR3R4NH及びkR5R6NHを遷移金属触媒の存在下で接触させ、反応混合物を形成することと、
b)任意に上記反応混合物に溶媒を添加することと、
c)約0℃〜約250℃の温度に上記反応混合物を維持することと、
d)反応を進行させて、(R1R2N)n(R3R4N)m(R5R6N)k(NSi3H(9−n−m−k))を形成することと、
e)上記(R1R2N)n(R3R4N)m(R5R6N)k(NSi3H(9−n−m−k))を上記反応混合物から分離することと、
を含み、上記反応混合物の温度は合成中に変動し得るが、該反応混合物の温度が約0℃を下回らず、約250℃を超えないように維持される、方法。
(式中、n=1〜3であり、m=0〜3であり、k=0〜3であり、R1、R3、及びR5は独立してH、直鎖若しくは分岐C1〜C6アルキル、直鎖若しくは分岐C1〜C8アルケニル、直鎖若しくは分岐C1〜C8アルキニル、C6〜C10アリール、直鎖若しくは分岐C1〜C6アルキルエーテル、シリル、トリメチルシリル、又は直鎖若しくは分岐C1〜C6アルキル置換シリルの群から選択され、R2、R4、及びR6は独立して直鎖若しくは分岐C1〜C6アルキル、直鎖若しくは分岐C1〜C8アルケニル、直鎖若しくは分岐C1〜C8アルキニル、C6〜C10アリール、直鎖若しくは分岐C1〜C6アルキルエーテル、シリル、トリメチルシリル、又は直鎖若しくは分岐C1〜C6アルキル置換シリルの群から選択され、R1R2N、R3R4N及びR5R6Nは独立してアジリジン、アゼチジン、ピペリジン、ピロリジン、ピロール、イミダゾール、ピラゾール、インドールを含む環状第二級アミン又は該環状第二級アミンの任意のC置換誘導体とすることができる)を有する化合物を作製する方法であって、
a)反応物TDSA及びnR1R2NH及びmR3R4NH及びkR5R6NHを遷移金属触媒の存在下で接触させ、反応混合物を形成することと、
b)任意に上記反応混合物に溶媒を添加することと、
c)約0℃〜約250℃の温度に上記反応混合物を維持することと、
d)反応を進行させて、(R1R2N)n(R3R4N)k(R5R6N)m(NSi6H(15−n−m−k))を形成することと、
e)上記生成物(R1R2N)n(R3R4N)k(R5R6N)m(NSi6H(15−n−m−k))を上記反応混合物から分離することと、
を含み、上記反応の温度は合成中に変動し得るが、上記反応混合物の温度が約0℃を下回らず、約250℃を超えないように維持される、方法。
a)反応物N[(SiH2R3)(SiH2R4)(SiH2R5)]及びHNR1R2を遷移金属触媒の存在下で接触させ、反応混合物を形成することと、
b)任意に上記反応混合物に溶媒を添加することと、
c)約0℃〜約250℃の温度に上記反応混合物を維持することと、
d)反応を進行させて、N[(SiH2R3)(SiH2R4)(SiHR5NR1R2)]を形成することと、
e)上記生成物N[(SiH2R3)(SiH2R4)(SiHR5NR1R2)]を上記反応混合物から分離することと、
を含み、上記反応混合物の温度は合成中に変動し得るが、該反応混合物の温度が約0℃を下回らず、約250℃を超えないように維持される、方法。
a)反応物TSA及びHN(CH2CH3)2を遷移金属触媒の存在下で接触させ、反応混合物を形成することと、
b)任意に溶媒を反応混合物に添加することと、
c)反応混合物を約0℃〜約250℃の温度に維持することと、
d)反応を進行させ、H8Si3N(CH2CH3)2を形成することと、
e)H8Si3N(CH2CH3)2を反応混合物から分離することと、
を含み、反応温度は合成中に変動し得るが、反応混合物の温度が約0℃を下回らず、約250℃を超えないように維持される、方法。
a)アミン及びTSA反応物を遷移金属触媒の存在下で接触させ、反応混合物を形成することと、
b)任意に上記反応混合物に溶媒を添加することと、
c)約0℃〜約250℃の温度に上記反応混合物を維持することと、
d)反応を進行させて、生成物を形成することと、
e)上記生成物を上記反応混合物から分離することと、
を含むアミノ−トリシリルアミンの合成が示される。
リストとしては、ヘリウム、アルゴン及び窒素が挙げられる。好ましいガスはヘリウムである。
a)アミン置換TSA化合物は、加圧反応器中で遷移金属触媒により触媒されるトリシリルアミン(TSA)とアミンとの間の反応により合成される:機械撹拌器、熱電対、圧力計及び圧力変換器並びに3つの絞り弁を備えたオートクレーブ又は同様な加圧反応容器に遷移金属触媒を投入する。その後反応器を動的真空下で約125℃において3時間加熱し、触媒を活性化する。触媒を反応槽に添加する前に、又は反応槽中で反応物を添加する前
に活性化してもよい。触媒を反応槽に添加する前に活性化した場合は、触媒を活性化するための事前の約125℃、動的真空下での3時間の加熱工程を省く。室温に冷却後、アミンを反応器に添加し、引き続き反応器を液体窒素浴中で−130℃に冷却する。適切な量のトリシリルアミンを反応器に移す。反応器の温度を約0℃より下がらないように、また約250℃を超えないように維持する。約5分〜約2日撹拌することにより、反応器の圧力は反応が完了するまで増加する。圧力は形成される水素(及び生成物)の量に比例して増加する。したがって、反応器の圧力は各反応物の規模、量と、反応の規模、量と、反応器の大きさとによって異なってくる。反応は、圧力が増加しなくなった時に完了する。反応が完了した後、反応器をRTに冷却する。揮発性物質をSSLB中の液体窒素温度のクライオトラップ中で集め、反応器の圧力は約40Torr〜約100Torrに減少する。TSA/アミンモル比は、一置換TSA/アミン化合物を作製するために約0.5〜約5、より好ましくは約1〜約3である。TSA/アミンモル比は、多置換TSA/アミン化合物を作製するために約0.1〜約0.9である。比が小さければ小さいほど、TSA化合物におけるアミンの置換度は大きくなる。
a)アミン置換TDSA化合物は、加圧反応器中で遷移金属触媒により触媒されるトリジシリルアミン(TDSA)とアミンとの間の反応により合成される:機械撹拌器、熱電対、圧力計及び圧力変換器並びに3つの絞り弁を備えたオートクレーブ又は同様な加圧反応容器に遷移金属触媒を投入する。その後反応器を動的真空下で約125℃において3時間加熱し、触媒を活性化する。触媒を反応槽に添加する前に、又は反応槽中で反応物を添加する前に活性化してもよい。触媒を反応槽に添加する前に活性化した場合は、触媒を活性化するための事前の約125℃、動的真空下での3時間の加熱工程を省く。室温に冷却後、アミンを反応器に添加し、引き続き反応器を液体窒素浴中で−130℃に冷却する。適切な量のトリシリルアミンを反応器に移す。反応器の温度を約0℃より下がらないように、また約250℃を超えないように維持する。約5分〜約2日撹拌することにより、反応器の圧力は反応が完了するまで増加する。圧力は形成される水素(及び生成物)の量に比例して増加する。したがって、反応器の圧力は各反応物の規模、量と、反応の規模、量と、反応器の大きさとによって異なってくる。反応は、圧力が増加しなくなった時に完了する。反応が完了した後、反応器をRTに冷却する。揮発性物質をSSLB中の液体窒素温度のクライオトラップ中で集め、反応器の圧力は約40Torr〜約100Torrに減少する。TSA/アミンモル比は、一置換TDSA/アミン化合物を作製するために約0.5〜約5、より好ましくは約1〜約3である。TSA/アミンモル比は、多置換TDSA/アミン化合物を作製するために約0.1〜約0.9である。比が小さければ小さいほど、TDSA化合物におけるアミンの置換度は大きくなる。
して使用する。開示の前駆体を蒸着法に使用する方法を本明細書に開示する。開示の方法はケイ素含有膜の堆積への前駆体の使用をもたらす。開示の方法は半導体、光起電、LCD−TFT又はフラットパネル型のデバイスの製造に有用であり得る。この方法は、開示の前駆体の蒸気を少なくとも1つの基板が中に配置された反応器に導入することと、蒸着プロセスを用いて開示の前駆体の少なくとも一部を基板上に堆積させ、Si含有層を形成することと、を含む。
るために単なる実験により温度を最適化することができることが当業者に認識される。
Claims (12)
- 式:
NR 1 R 2 が炭素数3〜8個の飽和環状アミン又は不飽和環状アミンであるか、
又は、
R1、R2は独立してH、メチル、エチル、イソプロピル、及びt−ブチルからなる群から選択され、R1がHの場合は、R2がメチル又はエチルではなく、
R3、R4、及びR5はHである)を有する蒸着用前駆体。 - 式:
- R1、R2がイソプロピルである、請求項1に記載の蒸着用前駆体。
- 請求項1に記載の蒸着用前駆体を作製する方法であって、
a)反応物N[(SiH2R3)(SiH2R4)(SiH2R5)]及びHNR1R2を遷移金属触媒の存在下で接触させ、反応混合物を形成することと、
b)任意に前記反応混合物に溶媒を添加することと、
c)約0℃〜約250℃の温度に前記反応混合物を維持することと、
d)反応を進行させて、生成物N[(SiH2R3)(SiH2R4)(SiH2R5NR1R2)]を形成することと、
e)前記生成物N[(SiH2R3)(SiH2R4)(SiH2R5NR1R2)]を前記反応混合物から分離することと、
を含み、
前記反応混合物の温度は合成中に変動し得るが、該反応混合物の温度が約0℃を下回らず、約250℃を超えないように維持される、方法。 - 前記遷移金属触媒がRu、Pd、Rh、Ir、Fe、Ni、Pt、Cr、Cu及びAuからなる群から選択される、請求項4に記載の方法。
- 5ppm未満のハロゲンを含む、請求項1に記載の蒸着用前駆体。
- 前駆体が請求項1〜3のいずれか一項に記載の蒸着用前駆体又は[(SiH3)2N]2SiH2から選択される、Si含有薄膜を蒸着法により堆積する方法。
- 前記蒸着法がALD、PEALD又はFCVDから選択される、請求項7に記載の方法。
- 5ppm未満のハロゲンを含む、請求項2に記載の蒸着用前駆体。
- 5ppm未満のハロゲンを含む、請求項3に記載の蒸着用前駆体。
- R1がHであり、R2がt−ブチルである、請求項1に記載の蒸着用前駆体。
- 5ppm未満のハロゲンを含む、請求項11に記載の蒸着用前駆体。
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