JP5687960B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP5687960B2 JP5687960B2 JP2011142710A JP2011142710A JP5687960B2 JP 5687960 B2 JP5687960 B2 JP 5687960B2 JP 2011142710 A JP2011142710 A JP 2011142710A JP 2011142710 A JP2011142710 A JP 2011142710A JP 5687960 B2 JP5687960 B2 JP 5687960B2
- Authority
- JP
- Japan
- Prior art keywords
- transistor
- insulating layer
- layer
- circuit
- memory cell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D88/00—Three-dimensional [3D] integrated devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/20—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/70—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates the floating gate being an electrode shared by two or more components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B99/00—Subject matter not provided for in other groups of this subclass
- H10B99/22—Subject matter not provided for in other groups of this subclass including field-effect components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/201—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates the substrates comprising an insulating layer on a semiconductor body, e.g. SOI
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0408—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
- G11C16/0433—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing a single floating gate transistor and one or more separate select transistors
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/08—Address circuits; Decoders; Word-line control circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/10—Programming or data input circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/26—Sensing or reading circuits; Data output circuits
Landscapes
- Semiconductor Memories (AREA)
- Thin Film Transistor (AREA)
- Dram (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Non-Volatile Memory (AREA)
- Electroluminescent Light Sources (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011142710A JP5687960B2 (ja) | 2010-07-02 | 2011-06-28 | 半導体装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010152021 | 2010-07-02 | ||
| JP2010152021 | 2010-07-02 | ||
| JP2011142710A JP5687960B2 (ja) | 2010-07-02 | 2011-06-28 | 半導体装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014202941A Division JP5841647B2 (ja) | 2010-07-02 | 2014-10-01 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012033906A JP2012033906A (ja) | 2012-02-16 |
| JP2012033906A5 JP2012033906A5 (enExample) | 2014-04-10 |
| JP5687960B2 true JP5687960B2 (ja) | 2015-03-25 |
Family
ID=45399049
Family Applications (9)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011142710A Expired - Fee Related JP5687960B2 (ja) | 2010-07-02 | 2011-06-28 | 半導体装置 |
| JP2014202941A Expired - Fee Related JP5841647B2 (ja) | 2010-07-02 | 2014-10-01 | 半導体装置 |
| JP2015222688A Expired - Fee Related JP6027213B2 (ja) | 2010-07-02 | 2015-11-13 | 半導体装置 |
| JP2016201915A Expired - Fee Related JP6268255B2 (ja) | 2010-07-02 | 2016-10-13 | 半導体装置 |
| JP2017247794A Withdrawn JP2018078317A (ja) | 2010-07-02 | 2017-12-25 | 半導体装置 |
| JP2019101570A Active JP6934912B2 (ja) | 2010-07-02 | 2019-05-30 | 半導体装置 |
| JP2021136245A Active JP7238051B2 (ja) | 2010-07-02 | 2021-08-24 | 半導体装置 |
| JP2023030898A Active JP7627714B2 (ja) | 2010-07-02 | 2023-03-01 | 半導体装置 |
| JP2025011313A Pending JP2025061832A (ja) | 2010-07-02 | 2025-01-27 | 半導体装置 |
Family Applications After (8)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014202941A Expired - Fee Related JP5841647B2 (ja) | 2010-07-02 | 2014-10-01 | 半導体装置 |
| JP2015222688A Expired - Fee Related JP6027213B2 (ja) | 2010-07-02 | 2015-11-13 | 半導体装置 |
| JP2016201915A Expired - Fee Related JP6268255B2 (ja) | 2010-07-02 | 2016-10-13 | 半導体装置 |
| JP2017247794A Withdrawn JP2018078317A (ja) | 2010-07-02 | 2017-12-25 | 半導体装置 |
| JP2019101570A Active JP6934912B2 (ja) | 2010-07-02 | 2019-05-30 | 半導体装置 |
| JP2021136245A Active JP7238051B2 (ja) | 2010-07-02 | 2021-08-24 | 半導体装置 |
| JP2023030898A Active JP7627714B2 (ja) | 2010-07-02 | 2023-03-01 | 半導体装置 |
| JP2025011313A Pending JP2025061832A (ja) | 2010-07-02 | 2025-01-27 | 半導体装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (7) | US8378403B2 (enExample) |
| JP (9) | JP5687960B2 (enExample) |
| TW (5) | TWI575721B (enExample) |
| WO (1) | WO2012002186A1 (enExample) |
Families Citing this family (68)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101913111B1 (ko) | 2009-12-18 | 2018-10-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| WO2012002186A1 (en) | 2010-07-02 | 2012-01-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| WO2012008304A1 (en) * | 2010-07-16 | 2012-01-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US8422272B2 (en) | 2010-08-06 | 2013-04-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and driving method thereof |
| US8582348B2 (en) | 2010-08-06 | 2013-11-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for driving semiconductor device |
| JP2012256821A (ja) | 2010-09-13 | 2012-12-27 | Semiconductor Energy Lab Co Ltd | 記憶装置 |
| TWI539453B (zh) | 2010-09-14 | 2016-06-21 | 半導體能源研究所股份有限公司 | 記憶體裝置和半導體裝置 |
| KR101924231B1 (ko) | 2010-10-29 | 2018-11-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 기억 장치 |
| US8772849B2 (en) * | 2011-03-10 | 2014-07-08 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor memory device |
| JP6013682B2 (ja) | 2011-05-20 | 2016-10-25 | 株式会社半導体エネルギー研究所 | 半導体装置の駆動方法 |
| CN103022012B (zh) | 2011-09-21 | 2017-03-01 | 株式会社半导体能源研究所 | 半导体存储装置 |
| WO2013042562A1 (en) * | 2011-09-22 | 2013-03-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US8981367B2 (en) | 2011-12-01 | 2015-03-17 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US9076505B2 (en) | 2011-12-09 | 2015-07-07 | Semiconductor Energy Laboratory Co., Ltd. | Memory device |
| US10002968B2 (en) | 2011-12-14 | 2018-06-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device including the same |
| JP6105266B2 (ja) | 2011-12-15 | 2017-03-29 | 株式会社半導体エネルギー研究所 | 記憶装置 |
| US9112037B2 (en) * | 2012-02-09 | 2015-08-18 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US9312257B2 (en) | 2012-02-29 | 2016-04-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP6013084B2 (ja) * | 2012-08-24 | 2016-10-25 | ルネサスエレクトロニクス株式会社 | 半導体装置及び半導体装置の製造方法 |
| JP5960000B2 (ja) * | 2012-09-05 | 2016-08-02 | ルネサスエレクトロニクス株式会社 | 半導体装置及び半導体装置の製造方法 |
| TWI671910B (zh) | 2012-09-24 | 2019-09-11 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
| JP2014195243A (ja) * | 2013-02-28 | 2014-10-09 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| TWI618058B (zh) * | 2013-05-16 | 2018-03-11 | 半導體能源研究所股份有限公司 | 半導體裝置 |
| JP5776728B2 (ja) * | 2013-06-03 | 2015-09-09 | トヨタ自動車株式会社 | 半導体装置 |
| JP6570817B2 (ja) * | 2013-09-23 | 2019-09-04 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| EP2884542A3 (en) * | 2013-12-10 | 2015-09-02 | IMEC vzw | Integrated circuit device with power gating switch in back end of line |
| WO2015121771A1 (en) | 2014-02-14 | 2015-08-20 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and electronic device |
| JP6607681B2 (ja) | 2014-03-07 | 2019-11-20 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| TWI767772B (zh) | 2014-04-10 | 2022-06-11 | 日商半導體能源研究所股份有限公司 | 記憶體裝置及半導體裝置 |
| WO2015170220A1 (en) | 2014-05-09 | 2015-11-12 | Semiconductor Energy Laboratory Co., Ltd. | Memory device and electronic device |
| KR102398950B1 (ko) * | 2014-05-30 | 2022-05-17 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치, 이의 제조 방법, 및 전자 장치 |
| JP6570417B2 (ja) | 2014-10-24 | 2019-09-04 | 株式会社半導体エネルギー研究所 | 撮像装置および電子機器 |
| WO2016092416A1 (en) * | 2014-12-11 | 2016-06-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, memory device, and electronic device |
| US10522693B2 (en) | 2015-01-16 | 2019-12-31 | Semiconductor Energy Laboratory Co., Ltd. | Memory device and electronic device |
| US9905700B2 (en) | 2015-03-13 | 2018-02-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device or memory device and driving method thereof |
| EP3298296A4 (en) * | 2015-05-20 | 2019-02-27 | Eaton Corporation | MODULAR AND MAINTAINABLE ELECTROMAGNETIC COUPLING ARRANGEMENT |
| JP2016225613A (ja) * | 2015-05-26 | 2016-12-28 | 株式会社半導体エネルギー研究所 | 半導体装置及び半導体装置の駆動方法 |
| JP6773453B2 (ja) * | 2015-05-26 | 2020-10-21 | 株式会社半導体エネルギー研究所 | 記憶装置及び電子機器 |
| JP6901831B2 (ja) | 2015-05-26 | 2021-07-14 | 株式会社半導体エネルギー研究所 | メモリシステム、及び情報処理システム |
| US10340275B2 (en) | 2015-06-23 | 2019-07-02 | Intel Corporation | Stackable thin film memory |
| US10019025B2 (en) * | 2015-07-30 | 2018-07-10 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and electronic device |
| WO2017068478A1 (en) | 2015-10-22 | 2017-04-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device or memory device including the semiconductor device |
| US9741400B2 (en) | 2015-11-05 | 2017-08-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, memory device, electronic device, and method for operating the semiconductor device |
| CN114361180A (zh) | 2015-12-28 | 2022-04-15 | 株式会社半导体能源研究所 | 半导体装置、包括该半导体装置的显示装置 |
| JP6822853B2 (ja) | 2016-01-21 | 2021-01-27 | 株式会社半導体エネルギー研究所 | 記憶装置及び記憶装置の駆動方法 |
| US10043858B2 (en) | 2016-04-27 | 2018-08-07 | Semiconductor Energy Laboratory Co., Ltd. | Display device and manufacturing method thereof |
| US10586495B2 (en) | 2016-07-22 | 2020-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic device |
| KR102458660B1 (ko) | 2016-08-03 | 2022-10-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 및 전자 기기 |
| US10147722B2 (en) * | 2016-08-12 | 2018-12-04 | Renesas Electronics America Inc. | Isolated circuit formed during back end of line process |
| US10475869B2 (en) | 2016-08-23 | 2019-11-12 | Semiconductor Energy Laboratory Co., Ltd. | Display device including display element and transistor |
| US10403627B2 (en) * | 2016-10-11 | 2019-09-03 | Imec Vzw | Memory device for a dynamic random access memory |
| US10223194B2 (en) | 2016-11-04 | 2019-03-05 | Semiconductor Energy Laboratory Co., Ltd. | Storage device, semiconductor device, electronic device, and server system |
| US10074602B2 (en) * | 2016-11-11 | 2018-09-11 | Advanced Semiconductor Engineering, Inc. | Substrate, semiconductor package structure and manufacturing process |
| JP7200096B2 (ja) * | 2017-05-19 | 2023-01-06 | 株式会社半導体エネルギー研究所 | 半導体装置及び電子機器 |
| JP7191820B2 (ja) | 2017-06-02 | 2022-12-19 | 株式会社半導体エネルギー研究所 | 半導体装置、電子部品及び電子機器 |
| JP7213803B2 (ja) | 2017-06-08 | 2023-01-27 | 株式会社半導体エネルギー研究所 | 半導体装置及び半導体装置の駆動方法 |
| US10593693B2 (en) | 2017-06-16 | 2020-03-17 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
| JP7224282B2 (ja) | 2017-06-27 | 2023-02-17 | 株式会社半導体エネルギー研究所 | 半導体装置、半導体ウェハ、記憶装置、及び電子機器 |
| US10665604B2 (en) | 2017-07-21 | 2020-05-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, semiconductor wafer, memory device, and electronic device |
| US10535659B2 (en) | 2017-09-29 | 2020-01-14 | Samsung Electronics Co., Ltd. | Semiconductor memory devices |
| WO2019106479A1 (en) | 2017-11-30 | 2019-06-06 | Semiconductor Energy Laboratory Co., Ltd. | Memory device |
| US10734474B2 (en) | 2018-07-30 | 2020-08-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Metal-insulator-metal structure and methods of fabrication thereof |
| KR102554712B1 (ko) | 2019-01-11 | 2023-07-14 | 삼성전자주식회사 | 반도체 소자 |
| US12156396B2 (en) | 2019-01-29 | 2024-11-26 | Semiconductor Energy Laboratory Co., Ltd. | Memory device, semiconductor device, and electronic device |
| US12015012B2 (en) | 2019-06-07 | 2024-06-18 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP7325552B2 (ja) | 2019-06-28 | 2023-08-14 | 長江存儲科技有限責任公司 | 高記憶密度化3次元フラッシュメモリデバイス |
| CN114097083A (zh) | 2019-06-28 | 2022-02-25 | 株式会社半导体能源研究所 | 显示装置 |
| US20220190035A1 (en) * | 2020-12-10 | 2022-06-16 | Intel Corporation | Deck select transistor for three-dimensional cross point memory |
Family Cites Families (224)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0053878B1 (en) | 1980-12-08 | 1985-08-14 | Kabushiki Kaisha Toshiba | Semiconductor memory device |
| JPS6034199B2 (ja) | 1980-12-20 | 1985-08-07 | 株式会社東芝 | 半導体記憶装置 |
| JPS60198861A (ja) | 1984-03-23 | 1985-10-08 | Fujitsu Ltd | 薄膜トランジスタ |
| JPH0612799B2 (ja) | 1986-03-03 | 1994-02-16 | 三菱電機株式会社 | 積層型半導体装置およびその製造方法 |
| JPS62254462A (ja) * | 1986-04-28 | 1987-11-06 | Sony Corp | メモリ装置 |
| JPS62274773A (ja) * | 1986-05-23 | 1987-11-28 | Hitachi Ltd | 半導体記憶装置 |
| JPH0244256B2 (ja) | 1987-01-28 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn2o5deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPS63210023A (ja) | 1987-02-24 | 1988-08-31 | Natl Inst For Res In Inorg Mater | InGaZn↓4O↓7で示される六方晶系の層状構造を有する化合物およびその製造法 |
| JPH0244260B2 (ja) | 1987-02-24 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn5o8deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPH0244258B2 (ja) | 1987-02-24 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn3o6deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPH0244262B2 (ja) | 1987-02-27 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn6o9deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| JPH0244263B2 (ja) | 1987-04-22 | 1990-10-03 | Kagaku Gijutsucho Mukizaishitsu Kenkyushocho | Ingazn7o10deshimesarerurotsuhoshokeinosojokozoojusurukagobutsuoyobisonoseizoho |
| US5366922A (en) | 1989-12-06 | 1994-11-22 | Seiko Instruments Inc. | Method for producing CMOS transistor |
| DE69023765T2 (de) | 1990-07-31 | 1996-06-20 | Ibm | Verfahren zur Herstellung von Bauelementen mit übereinander angeordneten Feldeffekttransistoren mit Wolfram-Gitter und sich daraus ergebende Struktur. |
| US5930608A (en) | 1992-02-21 | 1999-07-27 | Semiconductor Energy Laboratory Co., Ltd. | Method of fabricating a thin film transistor in which the channel region of the transistor consists of two portions of differing crystallinity |
| JP2775040B2 (ja) | 1991-10-29 | 1998-07-09 | 株式会社 半導体エネルギー研究所 | 電気光学表示装置およびその駆動方法 |
| JPH05251705A (ja) | 1992-03-04 | 1993-09-28 | Fuji Xerox Co Ltd | 薄膜トランジスタ |
| US6808965B1 (en) | 1993-07-26 | 2004-10-26 | Seiko Epson Corporation | Methodology for fabricating a thin film transistor, including an LDD region, from amorphous semiconductor film deposited at 530° C. or less using low pressure chemical vapor deposition |
| KR0128826B1 (ko) | 1993-12-31 | 1998-04-08 | 김주용 | 디램셀 제조방법 |
| JP3126630B2 (ja) | 1994-06-20 | 2001-01-22 | キヤノン株式会社 | ディスプレイ |
| JP3479375B2 (ja) | 1995-03-27 | 2003-12-15 | 科学技術振興事業団 | 亜酸化銅等の金属酸化物半導体による薄膜トランジスタとpn接合を形成した金属酸化物半導体装置およびそれらの製造方法 |
| WO1997006554A2 (en) | 1995-08-03 | 1997-02-20 | Philips Electronics N.V. | Semiconductor device provided with transparent switching element |
| US5675185A (en) * | 1995-09-29 | 1997-10-07 | International Business Machines Corporation | Semiconductor structure incorporating thin film transistors with undoped cap oxide layers |
| JP3625598B2 (ja) | 1995-12-30 | 2005-03-02 | 三星電子株式会社 | 液晶表示装置の製造方法 |
| JP4103968B2 (ja) | 1996-09-18 | 2008-06-18 | 株式会社半導体エネルギー研究所 | 絶縁ゲイト型半導体装置 |
| US5770483A (en) * | 1996-10-08 | 1998-06-23 | Advanced Micro Devices, Inc. | Multi-level transistor fabrication method with high performance drain-to-gate connection |
| KR100234700B1 (ko) | 1996-11-27 | 1999-12-15 | 김영환 | 반도체 소자의 제조방법 |
| US5796650A (en) | 1997-05-19 | 1998-08-18 | Lsi Logic Corporation | Memory circuit including write control unit wherein subthreshold leakage may be reduced |
| JPH1140772A (ja) * | 1997-07-22 | 1999-02-12 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
| JPH11126491A (ja) | 1997-08-20 | 1999-05-11 | Fujitsu Ltd | 半導体記憶装置 |
| JP4085459B2 (ja) * | 1998-03-02 | 2008-05-14 | セイコーエプソン株式会社 | 3次元デバイスの製造方法 |
| JP4170454B2 (ja) | 1998-07-24 | 2008-10-22 | Hoya株式会社 | 透明導電性酸化物薄膜を有する物品及びその製造方法 |
| JP2000150861A (ja) | 1998-11-16 | 2000-05-30 | Tdk Corp | 酸化物薄膜 |
| JP3276930B2 (ja) | 1998-11-17 | 2002-04-22 | 科学技術振興事業団 | トランジスタ及び半導体装置 |
| JP3410976B2 (ja) * | 1998-12-08 | 2003-05-26 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 薄膜及びバルク・シリコン・トランジスタを組み合わせる併合化論理及びメモリ集積回路チップとその形成方法 |
| JP3174852B2 (ja) | 1999-03-05 | 2001-06-11 | 東京大学長 | しきい値電圧を制御しうるmosトランジスタを有する回路及びしきい値電圧制御方法 |
| JP2001093988A (ja) | 1999-07-22 | 2001-04-06 | Sony Corp | 半導体記憶装置 |
| JP4654471B2 (ja) | 1999-07-29 | 2011-03-23 | ソニー株式会社 | 半導体装置 |
| JP2001053164A (ja) * | 1999-08-04 | 2001-02-23 | Sony Corp | 半導体記憶装置 |
| JP2001053166A (ja) | 1999-08-09 | 2001-02-23 | Sony Corp | 半導体装置およびその製造方法 |
| TW460731B (en) | 1999-09-03 | 2001-10-21 | Ind Tech Res Inst | Electrode structure and production method of wide viewing angle LCD |
| TW587252B (en) | 2000-01-18 | 2004-05-11 | Hitachi Ltd | Semiconductor memory device and data processing device |
| JP3735855B2 (ja) | 2000-02-17 | 2006-01-18 | 日本電気株式会社 | 半導体集積回路装置およびその駆動方法 |
| JP3713418B2 (ja) * | 2000-05-30 | 2005-11-09 | 光正 小柳 | 3次元画像処理装置の製造方法 |
| US6266269B1 (en) | 2000-06-07 | 2001-07-24 | Xilinx, Inc. | Three terminal non-volatile memory element |
| JP2002026283A (ja) | 2000-06-30 | 2002-01-25 | Seiko Epson Corp | 多層構造のメモリ装置及びその製造方法 |
| US6628551B2 (en) | 2000-07-14 | 2003-09-30 | Infineon Technologies Aktiengesellschaft | Reducing leakage current in memory cells |
| US6429484B1 (en) * | 2000-08-07 | 2002-08-06 | Advanced Micro Devices, Inc. | Multiple active layer structure and a method of making such a structure |
| JP4089858B2 (ja) | 2000-09-01 | 2008-05-28 | 国立大学法人東北大学 | 半導体デバイス |
| JP2002093171A (ja) * | 2000-09-13 | 2002-03-29 | Sony Corp | 半導体記憶装置および読み出し方法 |
| JP3749101B2 (ja) | 2000-09-14 | 2006-02-22 | 株式会社ルネサステクノロジ | 半導体装置 |
| KR20020038482A (ko) | 2000-11-15 | 2002-05-23 | 모리시타 요이찌 | 박막 트랜지스터 어레이, 그 제조방법 및 그것을 이용한표시패널 |
| US6625057B2 (en) | 2000-11-17 | 2003-09-23 | Kabushiki Kaisha Toshiba | Magnetoresistive memory device |
| JP2002203913A (ja) * | 2000-12-28 | 2002-07-19 | Hitachi Ltd | 半導体記憶装置の製造方法および半導体記憶装置 |
| JP3997731B2 (ja) | 2001-03-19 | 2007-10-24 | 富士ゼロックス株式会社 | 基材上に結晶性半導体薄膜を形成する方法 |
| JP2002289859A (ja) | 2001-03-23 | 2002-10-04 | Minolta Co Ltd | 薄膜トランジスタ |
| JP4306142B2 (ja) | 2001-04-24 | 2009-07-29 | 株式会社日立製作所 | 画像表示装置及びその製造方法 |
| JP2002368226A (ja) * | 2001-06-11 | 2002-12-20 | Sharp Corp | 半導体装置、半導体記憶装置及びその製造方法、並びに携帯情報機器 |
| JP4090716B2 (ja) | 2001-09-10 | 2008-05-28 | 雅司 川崎 | 薄膜トランジスタおよびマトリクス表示装置 |
| JP3925839B2 (ja) | 2001-09-10 | 2007-06-06 | シャープ株式会社 | 半導体記憶装置およびその試験方法 |
| JP4164562B2 (ja) | 2002-09-11 | 2008-10-15 | 独立行政法人科学技術振興機構 | ホモロガス薄膜を活性層として用いる透明薄膜電界効果型トランジスタ |
| US7061014B2 (en) | 2001-11-05 | 2006-06-13 | Japan Science And Technology Agency | Natural-superlattice homologous single crystal thin film, method for preparation thereof, and device using said single crystal thin film |
| JP4262433B2 (ja) | 2002-02-20 | 2009-05-13 | 株式会社日立製作所 | 半導体装置の製造方法 |
| JP4083486B2 (ja) | 2002-02-21 | 2008-04-30 | 独立行政法人科学技術振興機構 | LnCuO(S,Se,Te)単結晶薄膜の製造方法 |
| US7049190B2 (en) | 2002-03-15 | 2006-05-23 | Sanyo Electric Co., Ltd. | Method for forming ZnO film, method for forming ZnO semiconductor layer, method for fabricating semiconductor device, and semiconductor device |
| JP3933591B2 (ja) | 2002-03-26 | 2007-06-20 | 淳二 城戸 | 有機エレクトロルミネッセント素子 |
| US7339187B2 (en) | 2002-05-21 | 2008-03-04 | State Of Oregon Acting By And Through The Oregon State Board Of Higher Education On Behalf Of Oregon State University | Transistor structures |
| US6787835B2 (en) | 2002-06-11 | 2004-09-07 | Hitachi, Ltd. | Semiconductor memories |
| JP2004022625A (ja) | 2002-06-13 | 2004-01-22 | Murata Mfg Co Ltd | 半導体デバイス及び該半導体デバイスの製造方法 |
| US7105868B2 (en) | 2002-06-24 | 2006-09-12 | Cermet, Inc. | High-electron mobility transistor with zinc oxide |
| JP2004103855A (ja) | 2002-09-10 | 2004-04-02 | Canon Inc | 基板及びその製造方法 |
| US6882010B2 (en) | 2002-10-03 | 2005-04-19 | Micron Technology, Inc. | High performance three-dimensional TFT-based CMOS inverters, and computer systems utilizing such novel CMOS inverters |
| US7067843B2 (en) | 2002-10-11 | 2006-06-27 | E. I. Du Pont De Nemours And Company | Transparent oxide semiconductor thin film transistors |
| TW556303B (en) * | 2002-10-25 | 2003-10-01 | Nanya Technology Corp | Test key of detecting whether the overlay of active area and memory cell structure of DRAM with vertical transistors is normal and test method of the same |
| JP3944455B2 (ja) * | 2003-01-31 | 2007-07-11 | 松下電器産業株式会社 | 半導体装置及びその製造方法 |
| JP4166105B2 (ja) | 2003-03-06 | 2008-10-15 | シャープ株式会社 | 半導体装置およびその製造方法 |
| JP2004273732A (ja) | 2003-03-07 | 2004-09-30 | Sharp Corp | アクティブマトリクス基板およびその製造方法 |
| JP2004362696A (ja) * | 2003-06-05 | 2004-12-24 | Nec Electronics Corp | 半導体記憶装置 |
| JP4108633B2 (ja) | 2003-06-20 | 2008-06-25 | シャープ株式会社 | 薄膜トランジスタおよびその製造方法ならびに電子デバイス |
| US7262463B2 (en) | 2003-07-25 | 2007-08-28 | Hewlett-Packard Development Company, L.P. | Transistor including a deposited channel region having a doped portion |
| US7319633B2 (en) | 2003-12-19 | 2008-01-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US7145174B2 (en) | 2004-03-12 | 2006-12-05 | Hewlett-Packard Development Company, Lp. | Semiconductor device |
| US7297977B2 (en) | 2004-03-12 | 2007-11-20 | Hewlett-Packard Development Company, L.P. | Semiconductor device |
| KR101019337B1 (ko) | 2004-03-12 | 2011-03-07 | 도꾸리쯔교세이호징 가가꾸 기쥬쯔 신꼬 기꼬 | 아몰퍼스 산화물 및 박막 트랜지스터 |
| US7282782B2 (en) | 2004-03-12 | 2007-10-16 | Hewlett-Packard Development Company, L.P. | Combined binary oxide semiconductor device |
| US7211825B2 (en) | 2004-06-14 | 2007-05-01 | Yi-Chi Shih | Indium oxide-based thin film transistors and circuits |
| JP4534132B2 (ja) | 2004-06-29 | 2010-09-01 | エルピーダメモリ株式会社 | 積層型半導体メモリ装置 |
| JP2006100760A (ja) | 2004-09-02 | 2006-04-13 | Casio Comput Co Ltd | 薄膜トランジスタおよびその製造方法 |
| US7285501B2 (en) | 2004-09-17 | 2007-10-23 | Hewlett-Packard Development Company, L.P. | Method of forming a solution processed device |
| US7382421B2 (en) * | 2004-10-12 | 2008-06-03 | Hewlett-Packard Development Company, L.P. | Thin film transistor with a passivation layer |
| US7298084B2 (en) | 2004-11-02 | 2007-11-20 | 3M Innovative Properties Company | Methods and displays utilizing integrated zinc oxide row and column drivers in conjunction with organic light emitting diodes |
| US7863611B2 (en) | 2004-11-10 | 2011-01-04 | Canon Kabushiki Kaisha | Integrated circuits utilizing amorphous oxides |
| US7453065B2 (en) | 2004-11-10 | 2008-11-18 | Canon Kabushiki Kaisha | Sensor and image pickup device |
| CN101057333B (zh) | 2004-11-10 | 2011-11-16 | 佳能株式会社 | 发光器件 |
| US7791072B2 (en) | 2004-11-10 | 2010-09-07 | Canon Kabushiki Kaisha | Display |
| CN101057338B (zh) | 2004-11-10 | 2011-03-16 | 佳能株式会社 | 采用无定形氧化物的场效应晶体管 |
| US7829444B2 (en) | 2004-11-10 | 2010-11-09 | Canon Kabushiki Kaisha | Field effect transistor manufacturing method |
| CA2585190A1 (en) | 2004-11-10 | 2006-05-18 | Canon Kabushiki Kaisha | Amorphous oxide and field effect transistor |
| US7579224B2 (en) | 2005-01-21 | 2009-08-25 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a thin film semiconductor device |
| TWI472037B (zh) | 2005-01-28 | 2015-02-01 | 半導體能源研究所股份有限公司 | 半導體裝置,電子裝置,和半導體裝置的製造方法 |
| TWI569441B (zh) | 2005-01-28 | 2017-02-01 | 半導體能源研究所股份有限公司 | 半導體裝置,電子裝置,和半導體裝置的製造方法 |
| US7858451B2 (en) | 2005-02-03 | 2010-12-28 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device, semiconductor device and manufacturing method thereof |
| US7948171B2 (en) | 2005-02-18 | 2011-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device |
| US20060197092A1 (en) | 2005-03-03 | 2006-09-07 | Randy Hoffman | System and method for forming conductive material on a substrate |
| KR100704784B1 (ko) | 2005-03-07 | 2007-04-10 | 삼성전자주식회사 | 적층된 반도체 장치 및 그 제조방법 |
| US8681077B2 (en) | 2005-03-18 | 2014-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, and display device, driving method and electronic apparatus thereof |
| WO2006105077A2 (en) | 2005-03-28 | 2006-10-05 | Massachusetts Institute Of Technology | Low voltage thin film transistor with high-k dielectric material |
| US7645478B2 (en) | 2005-03-31 | 2010-01-12 | 3M Innovative Properties Company | Methods of making displays |
| JP4849817B2 (ja) | 2005-04-08 | 2012-01-11 | ルネサスエレクトロニクス株式会社 | 半導体記憶装置 |
| US8300031B2 (en) | 2005-04-20 | 2012-10-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device comprising transistor having gate and drain connected through a current-voltage conversion element |
| US7483013B2 (en) | 2005-05-20 | 2009-01-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor circuit, display device, and electronic appliance therewith |
| JP2006344849A (ja) | 2005-06-10 | 2006-12-21 | Casio Comput Co Ltd | 薄膜トランジスタ |
| US7691666B2 (en) | 2005-06-16 | 2010-04-06 | Eastman Kodak Company | Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby |
| US7402506B2 (en) | 2005-06-16 | 2008-07-22 | Eastman Kodak Company | Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby |
| US7507618B2 (en) | 2005-06-27 | 2009-03-24 | 3M Innovative Properties Company | Method for making electronic devices using metal oxide nanoparticles |
| KR100711890B1 (ko) | 2005-07-28 | 2007-04-25 | 삼성에스디아이 주식회사 | 유기 발광표시장치 및 그의 제조방법 |
| JP2007059128A (ja) | 2005-08-23 | 2007-03-08 | Canon Inc | 有機el表示装置およびその製造方法 |
| JP4560502B2 (ja) | 2005-09-06 | 2010-10-13 | キヤノン株式会社 | 電界効果型トランジスタ |
| JP2007073705A (ja) | 2005-09-06 | 2007-03-22 | Canon Inc | 酸化物半導体チャネル薄膜トランジスタおよびその製造方法 |
| JP5116225B2 (ja) | 2005-09-06 | 2013-01-09 | キヤノン株式会社 | 酸化物半導体デバイスの製造方法 |
| JP4280736B2 (ja) | 2005-09-06 | 2009-06-17 | キヤノン株式会社 | 半導体素子 |
| JP4850457B2 (ja) | 2005-09-06 | 2012-01-11 | キヤノン株式会社 | 薄膜トランジスタ及び薄膜ダイオード |
| JP2007081335A (ja) | 2005-09-16 | 2007-03-29 | Renesas Technology Corp | 半導体装置 |
| JP5006598B2 (ja) | 2005-09-16 | 2012-08-22 | キヤノン株式会社 | 電界効果型トランジスタ |
| EP1998374A3 (en) | 2005-09-29 | 2012-01-18 | Semiconductor Energy Laboratory Co, Ltd. | Semiconductor device having oxide semiconductor layer and manufacturing method thereof |
| JP5064747B2 (ja) | 2005-09-29 | 2012-10-31 | 株式会社半導体エネルギー研究所 | 半導体装置、電気泳動表示装置、表示モジュール、電子機器、及び半導体装置の作製方法 |
| JP5037808B2 (ja) | 2005-10-20 | 2012-10-03 | キヤノン株式会社 | アモルファス酸化物を用いた電界効果型トランジスタ、及び該トランジスタを用いた表示装置 |
| KR101358954B1 (ko) | 2005-11-15 | 2014-02-06 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 다이오드 및 액티브 매트릭스 표시장치 |
| TWI292281B (en) | 2005-12-29 | 2008-01-01 | Ind Tech Res Inst | Pixel structure of active organic light emitting diode and method of fabricating the same |
| US7867636B2 (en) | 2006-01-11 | 2011-01-11 | Murata Manufacturing Co., Ltd. | Transparent conductive film and method for manufacturing the same |
| JP4977478B2 (ja) | 2006-01-21 | 2012-07-18 | 三星電子株式会社 | ZnOフィルム及びこれを用いたTFTの製造方法 |
| US7576394B2 (en) | 2006-02-02 | 2009-08-18 | Kochi Industrial Promotion Center | Thin film transistor including low resistance conductive thin films and manufacturing method thereof |
| KR100714401B1 (ko) | 2006-02-08 | 2007-05-04 | 삼성전자주식회사 | 적층된 트랜지스터를 구비하는 반도체 장치 및 그 형성방법 |
| US7977169B2 (en) | 2006-02-15 | 2011-07-12 | Kochi Industrial Promotion Center | Semiconductor device including active layer made of zinc oxide with controlled orientations and manufacturing method thereof |
| US8008137B2 (en) | 2006-03-15 | 2011-08-30 | Marvell World Trade Ltd. | Method for fabricating 1T-DRAM on bulk silicon |
| JP2007250862A (ja) | 2006-03-16 | 2007-09-27 | Seiko Epson Corp | 半導体装置、集積回路、及び電子機器 |
| KR20070101595A (ko) | 2006-04-11 | 2007-10-17 | 삼성전자주식회사 | ZnO TFT |
| US7785938B2 (en) | 2006-04-28 | 2010-08-31 | Semiconductor Energy Laboratory Co., Ltd | Semiconductor integrated circuit, manufacturing method thereof, and semiconductor device using semiconductor integrated circuit |
| JP5227536B2 (ja) * | 2006-04-28 | 2013-07-03 | 株式会社半導体エネルギー研究所 | 半導体集積回路の作製方法 |
| US20070252928A1 (en) | 2006-04-28 | 2007-11-01 | Toppan Printing Co., Ltd. | Structure, transmission type liquid crystal display, reflection type display and manufacturing method thereof |
| KR101014473B1 (ko) | 2006-06-02 | 2011-02-14 | 가시오게산키 가부시키가이샤 | 산화아연의 산화물 반도체 박막층을 포함하는 반도체 장치및 그 제조방법 |
| JP5028033B2 (ja) | 2006-06-13 | 2012-09-19 | キヤノン株式会社 | 酸化物半導体膜のドライエッチング方法 |
| JP4609797B2 (ja) | 2006-08-09 | 2011-01-12 | Nec液晶テクノロジー株式会社 | 薄膜デバイス及びその製造方法 |
| JP4999400B2 (ja) | 2006-08-09 | 2012-08-15 | キヤノン株式会社 | 酸化物半導体膜のドライエッチング方法 |
| JP4332545B2 (ja) | 2006-09-15 | 2009-09-16 | キヤノン株式会社 | 電界効果型トランジスタ及びその製造方法 |
| JP4274219B2 (ja) | 2006-09-27 | 2009-06-03 | セイコーエプソン株式会社 | 電子デバイス、有機エレクトロルミネッセンス装置、有機薄膜半導体装置 |
| JP5164357B2 (ja) | 2006-09-27 | 2013-03-21 | キヤノン株式会社 | 半導体装置及び半導体装置の製造方法 |
| US7622371B2 (en) | 2006-10-10 | 2009-11-24 | Hewlett-Packard Development Company, L.P. | Fused nanocrystal thin film semiconductor and method |
| KR100829570B1 (ko) | 2006-10-20 | 2008-05-14 | 삼성전자주식회사 | 크로스 포인트 메모리용 박막 트랜지스터 및 그 제조 방법 |
| US7772021B2 (en) | 2006-11-29 | 2010-08-10 | Samsung Electronics Co., Ltd. | Flat panel displays comprising a thin-film transistor having a semiconductive oxide in its channel and methods of fabricating the same for use in flat panel displays |
| JP2008140684A (ja) * | 2006-12-04 | 2008-06-19 | Toppan Printing Co Ltd | カラーelディスプレイおよびその製造方法 |
| KR101146574B1 (ko) | 2006-12-05 | 2012-05-16 | 캐논 가부시끼가이샤 | 산화물 반도체를 이용한 박막 트랜지스터의 제조방법 및 표시장치 |
| JP5305630B2 (ja) | 2006-12-05 | 2013-10-02 | キヤノン株式会社 | ボトムゲート型薄膜トランジスタの製造方法及び表示装置の製造方法 |
| US8217435B2 (en) | 2006-12-22 | 2012-07-10 | Intel Corporation | Floating body memory cell having gates favoring different conductivity type regions |
| KR101303578B1 (ko) | 2007-01-05 | 2013-09-09 | 삼성전자주식회사 | 박막 식각 방법 |
| US8207063B2 (en) | 2007-01-26 | 2012-06-26 | Eastman Kodak Company | Process for atomic layer deposition |
| JP5196870B2 (ja) | 2007-05-23 | 2013-05-15 | キヤノン株式会社 | 酸化物半導体を用いた電子素子及びその製造方法 |
| KR100851215B1 (ko) | 2007-03-14 | 2008-08-07 | 삼성에스디아이 주식회사 | 박막 트랜지스터 및 이를 이용한 유기 전계 발광표시장치 |
| JP5525694B2 (ja) * | 2007-03-14 | 2014-06-18 | 株式会社半導体エネルギー研究所 | 半導体装置及び半導体装置の作製方法 |
| US7795613B2 (en) | 2007-04-17 | 2010-09-14 | Toppan Printing Co., Ltd. | Structure with transistor |
| KR101325053B1 (ko) | 2007-04-18 | 2013-11-05 | 삼성디스플레이 주식회사 | 박막 트랜지스터 기판 및 이의 제조 방법 |
| KR20080094300A (ko) | 2007-04-19 | 2008-10-23 | 삼성전자주식회사 | 박막 트랜지스터 및 그 제조 방법과 박막 트랜지스터를포함하는 평판 디스플레이 |
| KR101334181B1 (ko) | 2007-04-20 | 2013-11-28 | 삼성전자주식회사 | 선택적으로 결정화된 채널층을 갖는 박막 트랜지스터 및 그제조 방법 |
| WO2008133345A1 (en) | 2007-04-25 | 2008-11-06 | Canon Kabushiki Kaisha | Oxynitride semiconductor |
| KR101345376B1 (ko) | 2007-05-29 | 2013-12-24 | 삼성전자주식회사 | ZnO 계 박막 트랜지스터 및 그 제조방법 |
| US20080296567A1 (en) | 2007-06-04 | 2008-12-04 | Irving Lyn M | Method of making thin film transistors comprising zinc-oxide-based semiconductor materials |
| US8354674B2 (en) | 2007-06-29 | 2013-01-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device wherein a property of a first semiconductor layer is different from a property of a second semiconductor layer |
| US8232598B2 (en) | 2007-09-20 | 2012-07-31 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
| US7982250B2 (en) | 2007-09-21 | 2011-07-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP5354999B2 (ja) | 2007-09-26 | 2013-11-27 | キヤノン株式会社 | 電界効果型トランジスタの製造方法 |
| JP2009134274A (ja) | 2007-10-30 | 2009-06-18 | Semiconductor Energy Lab Co Ltd | 液晶表示装置の作製方法 |
| KR101452204B1 (ko) | 2007-11-05 | 2014-10-21 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 박막 트랜지스터 및 상기 박막 트랜지스터를 구비하는 표시 장치 |
| TW200921226A (en) | 2007-11-06 | 2009-05-16 | Wintek Corp | Panel structure and manufacture method thereof |
| JP2009122250A (ja) | 2007-11-13 | 2009-06-04 | Seiko Epson Corp | 電気光学装置及び電子機器 |
| JP5430846B2 (ja) | 2007-12-03 | 2014-03-05 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP5366517B2 (ja) | 2007-12-03 | 2013-12-11 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP5213422B2 (ja) | 2007-12-04 | 2013-06-19 | キヤノン株式会社 | 絶縁層を有する酸化物半導体素子およびそれを用いた表示装置 |
| US8202365B2 (en) | 2007-12-17 | 2012-06-19 | Fujifilm Corporation | Process for producing oriented inorganic crystalline film, and semiconductor device using the oriented inorganic crystalline film |
| US7679951B2 (en) | 2007-12-21 | 2010-03-16 | Palo Alto Research Center Incorporated | Charge mapping memory array formed of materials with mutable electrical characteristics |
| JP5213458B2 (ja) | 2008-01-08 | 2013-06-19 | キヤノン株式会社 | アモルファス酸化物及び電界効果型トランジスタ |
| US20100295042A1 (en) | 2008-01-23 | 2010-11-25 | Idemitsu Kosan Co., Ltd. | Field-effect transistor, method for manufacturing field-effect transistor, display device using field-effect transistor, and semiconductor device |
| JP2009206508A (ja) | 2008-01-31 | 2009-09-10 | Canon Inc | 薄膜トランジスタ及び表示装置 |
| JP5121478B2 (ja) | 2008-01-31 | 2013-01-16 | 株式会社ジャパンディスプレイウェスト | 光センサー素子、撮像装置、電子機器、およびメモリー素子 |
| JP5305696B2 (ja) | 2008-03-06 | 2013-10-02 | キヤノン株式会社 | 半導体素子の処理方法 |
| JP4555358B2 (ja) | 2008-03-24 | 2010-09-29 | 富士フイルム株式会社 | 薄膜電界効果型トランジスタおよび表示装置 |
| KR100941850B1 (ko) | 2008-04-03 | 2010-02-11 | 삼성모바일디스플레이주식회사 | 박막 트랜지스터, 그의 제조 방법 및 박막 트랜지스터를구비하는 평판 표시 장치 |
| KR101442175B1 (ko) * | 2008-05-23 | 2014-09-18 | 삼성전자주식회사 | 반도체 메모리 장치 및 이 장치의 메모리 셀 어레이의 배치방법 |
| JP2010003910A (ja) | 2008-06-20 | 2010-01-07 | Toshiba Mobile Display Co Ltd | 表示素子 |
| KR100963027B1 (ko) | 2008-06-30 | 2010-06-10 | 삼성모바일디스플레이주식회사 | 박막 트랜지스터, 그의 제조 방법 및 박막 트랜지스터를구비하는 평판 표시 장치 |
| KR100963026B1 (ko) | 2008-06-30 | 2010-06-10 | 삼성모바일디스플레이주식회사 | 박막 트랜지스터, 그의 제조 방법 및 박막 트랜지스터를구비하는 평판 표시 장치 |
| JP2010021170A (ja) * | 2008-07-08 | 2010-01-28 | Hitachi Ltd | 半導体装置およびその製造方法 |
| JP5480554B2 (ja) | 2008-08-08 | 2014-04-23 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP5345456B2 (ja) | 2008-08-14 | 2013-11-20 | 富士フイルム株式会社 | 薄膜電界効果型トランジスタ |
| JP4623179B2 (ja) | 2008-09-18 | 2011-02-02 | ソニー株式会社 | 薄膜トランジスタおよびその製造方法 |
| KR20100038986A (ko) | 2008-10-07 | 2010-04-15 | 삼성전자주식회사 | 산화물 박막 트랜지스터를 포함하는 적층 메모리 장치 |
| JP5451280B2 (ja) | 2008-10-09 | 2014-03-26 | キヤノン株式会社 | ウルツ鉱型結晶成長用基板およびその製造方法ならびに半導体装置 |
| KR101547325B1 (ko) * | 2008-10-27 | 2015-08-26 | 삼성전자주식회사 | 트랜지스터 및 이를 포함하는 반도체 소자 |
| KR101547326B1 (ko) * | 2008-12-04 | 2015-08-26 | 삼성전자주식회사 | 트랜지스터 및 그 제조방법 |
| JP5781720B2 (ja) | 2008-12-15 | 2015-09-24 | ルネサスエレクトロニクス株式会社 | 半導体装置及び半導体装置の製造方法 |
| JP2010182819A (ja) * | 2009-02-04 | 2010-08-19 | Sony Corp | 薄膜トランジスタおよび表示装置 |
| JP4415062B1 (ja) | 2009-06-22 | 2010-02-17 | 富士フイルム株式会社 | 薄膜トランジスタ及び薄膜トランジスタの製造方法 |
| JP4571221B1 (ja) | 2009-06-22 | 2010-10-27 | 富士フイルム株式会社 | Igzo系酸化物材料及びigzo系酸化物材料の製造方法 |
| JP5500907B2 (ja) | 2009-08-21 | 2014-05-21 | 株式会社日立製作所 | 半導体装置およびその製造方法 |
| WO2011046048A1 (en) * | 2009-10-16 | 2011-04-21 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| CN102668062B (zh) | 2009-10-21 | 2014-12-10 | 株式会社半导体能源研究所 | 半导体器件 |
| KR101996773B1 (ko) | 2009-10-21 | 2019-07-04 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR102748818B1 (ko) | 2009-10-29 | 2024-12-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR101930682B1 (ko) | 2009-10-29 | 2018-12-18 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR101752348B1 (ko) | 2009-10-30 | 2017-06-29 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR101752518B1 (ko) | 2009-10-30 | 2017-06-29 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR101861980B1 (ko) | 2009-11-06 | 2018-05-28 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| CN104600074A (zh) | 2009-11-06 | 2015-05-06 | 株式会社半导体能源研究所 | 半导体装置 |
| WO2011058913A1 (en) | 2009-11-13 | 2011-05-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| KR101928723B1 (ko) | 2009-11-20 | 2018-12-13 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| WO2011065183A1 (en) | 2009-11-24 | 2011-06-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device including memory cell |
| WO2011065258A1 (en) | 2009-11-27 | 2011-06-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| KR101913111B1 (ko) | 2009-12-18 | 2018-10-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR101473684B1 (ko) | 2009-12-25 | 2014-12-18 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR101994632B1 (ko) | 2009-12-25 | 2019-07-02 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| JP2011138934A (ja) | 2009-12-28 | 2011-07-14 | Sony Corp | 薄膜トランジスタ、表示装置および電子機器 |
| CN102714184B (zh) | 2009-12-28 | 2016-05-18 | 株式会社半导体能源研究所 | 半导体器件 |
| WO2011080998A1 (en) | 2009-12-28 | 2011-07-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP2011187506A (ja) | 2010-03-04 | 2011-09-22 | Sony Corp | 薄膜トランジスタおよびその製造方法、並びに表示装置 |
| WO2012002186A1 (en) * | 2010-07-02 | 2012-01-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
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