JP5170193B2 - 繊維強化複合材料及びその製造方法並びに配線基板 - Google Patents
繊維強化複合材料及びその製造方法並びに配線基板 Download PDFInfo
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- JP5170193B2 JP5170193B2 JP2010210626A JP2010210626A JP5170193B2 JP 5170193 B2 JP5170193 B2 JP 5170193B2 JP 2010210626 A JP2010210626 A JP 2010210626A JP 2010210626 A JP2010210626 A JP 2010210626A JP 5170193 B2 JP5170193 B2 JP 5170193B2
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- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- LXEJRKJRKIFVNY-UHFFFAOYSA-N terephthaloyl chloride Chemical compound ClC(=O)C1=CC=C(C(Cl)=O)C=C1 LXEJRKJRKIFVNY-UHFFFAOYSA-N 0.000 description 1
- 229950011008 tetrachloroethylene Drugs 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- 239000013306 transparent fiber Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000011882 ultra-fine particle Substances 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229940005605 valeric acid Drugs 0.000 description 1
- HGBOYTHUEUWSSQ-UHFFFAOYSA-N valeric aldehyde Natural products CCCCC=O HGBOYTHUEUWSSQ-UHFFFAOYSA-N 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- C08J5/005—Reinforced macromolecular compounds with nanosized materials, e.g. nanoparticles, nanofibres, nanotubes, nanowires, nanorods or nanolayered materials
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- C—CHEMISTRY; METALLURGY
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- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- G—PHYSICS
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- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
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- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/0242—Shape of an individual particle
- H05K2201/0251—Non-conductive microfibers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Description
従来の基板は不透明であり、受動素子を内蔵したものを、外部から容量の微調整(トリミング)をすることは不可能であった。このため、一旦作成した後、良品・不良品を選別しなければならなかった。これに対して、本発明に係る繊維強化複合材料製透明基板は、透明であるため、内蔵した受動素子の位置を外部から確認でき、更に外部からレーザー等を用いてトリミングが可能である。そのため、作成後、特性に合わせて微調整が可能になり、歩留りを高めることができる。
従来の一般的な基板は樹脂とガラスクロスの組み合わせで、その線熱膨張率は15×10−6〜20×10−6K−1程度である。一方、半導体チップ(シリコン)は3×10−6〜4×10−6K−1で、チップを直接搭載する際、その熱膨張率の差による熱応力を緩和するためアンダーフィル剤を充填している。これに対して、本発明に係る繊維強化複合材料製透明基板は、ガラスの熱膨張率の約1/60という低熱膨張性であり、チップの熱膨張率に近い特性を有するため、チップとの熱膨張の差による熱応力の問題はない。
従来の基板は薄型にすると剛性が十分でなく、片面モールドしたパッケージでは反りが大きくなり、信頼性等に問題があるが、本発明に係る繊維強化複合材料製透明基板の弾性率はガラスに比べて非常に高いため、薄型基板でも非常に剛性が高くなり、片面モールドしたパッケージに適用しても反りを非常に小さくできることができる。
20℃において、サンプルの単位体積当たりの質量を測定して密度を求め、水の密度(1.004g/cm3(20℃))とから、比重を算出した。
<測定装置>
日立ハイテクノロジーズ社製「UV−4100形分光度計」(固体試料測定システム)を使用。
<測定条件>
・6mm×6mmの光源マスク使用
・測定サンプルを積分球開口より22cm離れた位置において測光した。サンプルをこの位置に置くことで、拡散透過光は除去され、積分球内部の受光部に直線透過光のみが届く。
・リファレンスサンプルなし。リファレンス(試料と空気との屈折率差によって生じる反射。フレネル反射が生じる場合は、直線透過率100%ということはあり得ない。)がないため、フレネル反射による透過率のロスが生じている。
・スキャンスピード:300nm/min
・光源:タングステンランプ、重水素ランプ
・光源切り替え:340nm
<試料の作成方法>
バクテリアセルロース:含水バクテリアセルロースを液体窒素で凍結し、減圧乾燥を行
った。
離解バクテリアセルロース:製造例2で作製したグラインダー処理懸濁液を、0.02
重量%懸濁液にして、その懸濁液を液体窒素で凍結し、減
圧乾燥を行った。
<試料の調製及び測定条件>
フリーズドライした各試料に、金蒸着(蒸着膜厚:数nm)を行い、下記条件で電子顕微鏡観察を行った。
測定装置:JEOL 5310(日本電子株式会社製)
加速電圧:10kV
倍率:2000倍
ワーキングディスタンス:20mm
コントラストの調整:AUTO
セイコーインスツルメンツ製「TMA/SS6100」を用い、ASTM D 696に規定された方法に従って下記の測定条件で測定した。
〈測定条件〉
昇温速度:5℃/min
雰囲気:N2中
加熱温度:50〜150℃
荷重:3g
測定回数:3回
試料長:4×15mm
試料厚さ:試料により異なる
モード:引っ張りモード
厚さ約1mmの材料から幅8mm、長さ5mmの試料を作製し、JIS K 7203に規定された方法に従って3点曲げにより測定した。
厚さ約1mmの材料から幅8mm、長さ5mmの試料を作製し、JIS K 7203に規定された方法に従って変形速度5mm/minで測定した。
嵩密度1.2kg/m3で厚さ40μmのBCシートサンプルについてJIS P 8117に規定された方法に従って測定した。
まず、凍結乾燥保存状態の酢酸菌の菌株に培養液を加え、1週間静置培養した(25〜30℃)。培養液表面に生成したバクテリアセルロースのうち、厚さが比較的厚いものを選択し、その株の培養液を少量分取して新しい培養液に加えた。そして、この培養液を大型培養器に入れ、25〜30℃で7〜30日間の静地培養を行った。培養液には、グルコース2重量%、バクトイーストエクストラ0.5重量%、バクトペプトン0.5重量%、リン酸水素二ナトリウム0.27重量%、クエン酸0.115重量%、硫酸マグネシウム七水和物0.1重量%とし、塩酸によりpH5.0に調整した水溶液(SH培地)を用いた。
製造例1において、バクテリアセルロースが産生された後、グラインダー処理できる程度まで家庭料理用ミキサーを用いて小さく離解した。そして、このバクテリアセルロース水懸濁液(1重量%濃度)を、ディスク回転速度:1200rpmで30回繰り返しグラインダー処理した。その後、グラインダー処理した懸濁液をガラスフィルターで濾過し、濾過物をホットプレスを用い、圧締圧力2MPa、温度120℃で完全に水を除去し、嵩密度1.2kg/m3、厚さ40μmのBCシートを得た。この離解BCシートについて、透過度を測定したところ、4650sec/100ccであった。
ミクロフィブリル化セルロース:MFC(高圧ホモジナイザー処理で、針葉樹クラフトパルプ(NBKP)をミクロフィブリル化したもの、平均繊維径1μm)を水に十分に撹拌し、1重量%濃度の水懸濁液を7kg調製し、グラインダー(栗田機械作成所製「ピュアファインミルKMG1−10」)にて、この水懸濁液を、ほぼ接触させた状態の1200rpmで回転するディスク間を、中央から外に向かって通過させる操作を30回(30pass)行った。
製造例3において、MFCのグラインダー処理を行わなかったこと以外は、同様にして、繊維含有率約70%、厚さ50μmのMFCシートを得た。
製造例1で得られたBCシートを、表2に示す樹脂に減圧下(0.08MPa)で12時間浸漬処理した後、紫外線硬化タイプの場合には、取り出したシートを8分間紫外線照射して樹脂を硬化させ(照射後、加熱なし。)、また、熱硬化タイプの場合には、取り出したシートを数時間風乾後、150℃、50MPaで10分間加熱プレスして硬化させることにより、それぞれ樹脂複合BCシートを得た。
製造例3で得られたNano MFCシートを、実施例3と同様にしてアクリル樹脂Bに含浸させて紫外線照射により硬化させることによりアクリル樹脂複合Nano MFCシートを得た。
製造例2で得られた離解BCシートを、実施例3と同様にアクリル樹脂Bに含浸させて紫外線照射により硬化させることにより、アクリル樹脂含浸離解BCシートを得た。
製造例4で得られたMFCシートを、実施例3と同様にアクリル樹脂Bに含浸させて紫外線照射により硬化させることにより、アクリル樹脂含浸MFCシートを得た。
下記表3に示すシートをサンプルとして光線透過率を測定し、結果を図3〜5に示すと共に、50μm厚可視光透過率を算出し、結果を表3に示した。
(1)ベースのアクリル樹脂シート材のみ:0.3W/mK(面内)
(2)アクリル樹脂複合BCシート:1W/mK(面内)
であった。
製造例1と同様にして、厚さ約50μmのBCシートを得、このBCシートを無水酢酸へ投入し、120℃、21時間加熱した後、直ちに水中へ投入し、反応を停止させた。次いで、2日間流水洗浄し、その後、温水中70℃で1時間放置した。これを濾紙に挟み、軽くおもりをのせ、乾燥した濾紙を交換し、50℃で減圧乾燥した。このBCシートは、赤外分光法(IRスペクトル法)により、アセチル基がセルロースの水酸基に導入されたアセチル化BCシートであることが確認された。
ココナッツミルク(全窒素分0.7重量%、脂質28重量%)7重量%、ショ糖8重量%を含有し、酢酸でpHを3.0に調製した培養液に、アセトバクター キシリナム(Acetobacter xylinum)FF−88を植菌し、30℃で5日間、静置培養を行って一次培養液を得た。
製造例5で得られたBCシートを、50重量%のUV硬化型エポキシ樹脂(NTTアドバンステクロノジ(株)製:非フッ素系屈折率制御接着剤(型番:AS−4、nD=1.52))のメタノール溶液に浸漬し、減圧下(0.8Torr)で12時間放置し、次いで、常圧に戻して、20℃で1日間浸漬した。
<Nano MFCシートの作製>
製造例3と同様にして繊維含有率70%で、厚さ55μmのNano MFCシートを作製した。得られたNano MFCシートを更にプレスして厚さ50μmまで加圧圧縮した。圧力は30kgf/cm2(2.9MPa)とした。
得られたNano MFCシートにエポキシ樹脂を含んだワニスを以下のようにして含浸塗工して、樹脂含浸Nano MFCシート(プリプレグ)を製造した。
上記で得られたプリプレグの両面に銅箔(18μm厚、日本電解社製)を設置してプレスで加熱圧着することにより銅張積層板を得た。プレスの条件は圧力30kgf/cm2(2.9MPa)で、室温から10℃/分で170℃まで昇温させ、更に170℃で60分圧着した。
基板の上下の電気的導通をとるため、所定の部分に穴を明け、更に穴の内壁部分にめっきを施しスルーホールを形成した。更に、両面の導体部分に所定の配線回路をレジスト露光現像、エッチング工程により形成して内層用両面配線基板を得た。
上記の内層用配線基板を複数枚(ここでは3枚)と最外層の銅箔2枚を用いて、プリプレグを接着層としてプレスによる加熱圧着で多層板を形成した。プレスの条件は圧力15kgf/cm2(1.5MPa)で、室温から10℃/分で170℃まで昇温させ、更に170℃で60分圧着した。得られた多層板の各層間の電気的接続をとるため、所定部分に貫通の穴を明け、更に穴の内壁部分にめっきを施しスルーホールを形成した。更に最外層の導体部分に所定の配線回路をレジスト露光現像、エッチング工程により形成して最終的に多層配線基板を得た。
<BCシートの作製>
バクテリアセルロース(平均繊維径50nm)を含んだナタデココのシート(厚さ1cm)をコールドプレスで厚さ100μmまで加圧圧縮した。圧力は3kgf/cm2(2.9MPa)とした。圧縮後70℃で15時間乾燥して繊維含有率70%、厚さ50μmのBCシートを得た。
上記BCシートを用い、実施例7と同様にして、プリプレグ(樹脂含有量70重量%、50μm厚可視光透過率75%)、銅張積層板、内層配線基板の作製を行った後、内蔵コンデンサを形成するために、絶縁層に高誘電率の樹脂を用いた内層配線基板を上記基板とは別個に作製した。
上記の内層用配線基板2枚、内蔵コンデンサ用内層基板2枚と最外層の銅箔2枚を用いて、プリプレグを接着層としてプレスによる加熱圧着で多層板を形成した。プレスの条件は圧力15kgf/cm2(1.5MPa)で、室温から10℃/分で170℃まで昇温させ、更に170℃で60分圧着した。得られた多層板の各層間の電気的接続をとるため、所定部分に貫通の穴を明け、更に穴の内壁部分にめっきを施しスルーホールを形成した。更に最外層の導体部分に所定の配線回路をレジスト露光現像、エッチング工程により形成して最終的にコンデンサを内蔵した多層配線基板を得た。
<Nano MFCシートの作製>
パルプファイバースラリーをホモジナイザーで50回裁断化した後、更にグラインダーで30回解繊(磨砕ないし融砕)したNano MFC(平均繊維径50nm)を水に0.2重量%の割合で分散させ、その分散液をガラスフィルターで濾過して成膜し、これを55℃で乾燥して厚さ70μmのシートを作製した。
(1)基板の曲げ弾性率が低い場合には、薄型にしていくと、パッケージ製造工程あるいは部品搭載時にたわみが発生し易くなり、作業性、信頼性が著しく低下する。本実施例のように曲げ弾性率が高い場合は薄型にしてもたわみ量が少なく、高密度実装、低コスト化に貢献できる。
(2)両面実装だけでなく、片面実装の形態でも高弾性率の場合、反りの発生が少なく様々な実装形態を取ることが可能となる。
(3)高強度の特性を有する基板は数多くの部品を搭載することができ、さらに温度サイクル、熱衝撃、高温放置など様々な信頼性試験でもクラック等の欠陥の発生を防ぐことができる。
Claims (11)
- 平均繊維径が4〜200nmの繊維とマトリクス材料とを含有し、該マトリクス材料が、ビニル系樹脂、重縮合系樹脂、重付加系樹脂、付加縮合系樹脂、開環重合系樹脂からなる群から選ばれる合成高分子であり、50μm厚換算における波長400〜700nmの光線透過率が60%以上である繊維強化複合材料よりなる透明基板であることを特徴とする、配線基板。
- 該繊維がセルロース繊維であることを特徴とする、請求項1に記載の配線基板。
- 該セルロース繊維がバクテリアセルロースであることを特徴とする、請求項2に記載の配線基板。
- 該セルロース繊維が植物から分離されたものであることを特徴とする、請求項2に記載の配線基板。
- 該セルロース繊維がミクロフィブリル化セルロース繊維を更に磨砕処理してなることを特徴とする、請求項2に記載の配線基板。
- 該セルロース繊維が化学修飾及び/又は物理修飾されていることを特徴とする、請求項2ないし5のいずれか一項に記載の配線基板。
- 該セルロース繊維がアセチル化されていることを特徴とする、請求項6に記載の配線基板。
- 該繊維強化複合材料中の該繊維の含有率が10重量%以上であることを特徴とする、請求項1ないし7のいずれか一項に記載の配線基板。
- 該透明基板と、該透明基板上に形成された配線回路とを有することを特徴とする、請求項1ないし8のいずれか一項に記載の配線基板。
- 受動素子を内蔵することを特徴とする、請求項9に記載の配線基板。
- 半導体チップが搭載されていることを特徴とする、請求項9に記載の配線基板。
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Cited By (1)
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WO2021241409A1 (ja) | 2020-05-25 | 2021-12-02 | 富士フイルム株式会社 | 組成物、シート状成形体、人工皮革およびシート状成形体の製造方法 |
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CN1832985A (zh) | 2006-09-13 |
US7691473B2 (en) | 2010-04-06 |
EP1650253A4 (en) | 2006-09-27 |
US20060182941A1 (en) | 2006-08-17 |
CN101831193B (zh) | 2012-01-11 |
JP5170153B2 (ja) | 2013-03-27 |
EP1650253A1 (en) | 2006-04-26 |
KR20120088678A (ko) | 2012-08-08 |
DE602004027498D1 (de) | 2010-07-15 |
CN1832985B (zh) | 2010-10-20 |
CN101831193A (zh) | 2010-09-15 |
US20090123726A1 (en) | 2009-05-14 |
KR101309567B1 (ko) | 2013-09-25 |
JP2010180416A (ja) | 2010-08-19 |
TWI365884B (ja) | 2012-06-11 |
WO2005012404A1 (ja) | 2005-02-10 |
KR20060052961A (ko) | 2006-05-19 |
EP1650253B1 (en) | 2010-06-02 |
TW200516085A (en) | 2005-05-16 |
JP2011001559A (ja) | 2011-01-06 |
US7455901B2 (en) | 2008-11-25 |
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