JP5095412B2 - LiCoO2の堆積 - Google Patents
LiCoO2の堆積 Download PDFInfo
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Description
本出願は、Hongmei ZhangおよびRichard E.Demarayにより2005年2月8日に出願された仮出願第60/651,363号ならびに同発明者らにより2004年12月8日に出願された仮出願第60/634,818号(それぞれ、それらの全体が参照により本明細書に組み入れられるものとする)に基づく優先権を主張する。
1. 発明の分野
本発明は、薄膜固体電池に関し、特定的には、電池を製造するためにLiCoO2の膜および層を堆積することに関する。
固体薄膜電池は、典型的には、膜が協同して電圧を発生するように基材上に薄膜をスタッキングすることにより形成される。薄膜としては、典型的には、電流コレクター、カソード、アノード、および電解質が挙げられる。薄膜は、スパッタリングや電気メッキをはじめとするいくつかの堆積プロセスを利用して堆積可能である。本出願に好適な基板は、慣例的には、LiCoO2膜を結晶化させるために空気中で最大約2時間にわたり少なくとも700℃までの少なくとも1つの高温アニールプロセスに耐えることのできる高温材料である。そのような基板は、適切な構造特性および材料特性を有する任意の好適な材料、たとえば、半導体ウェーハ、金属シート(たとえばチタンもしくはジルコニウムのシート)、セラミックス(たとえばアルミナ)、またはLiCoO2の存在下における後続の高温処理に耐えることのできる他の材料でありうる。これらの材料は、これらの温度サイクル時、電池に利用されるほとんどの材料との有意な界面反応を起こす可能性がある。
本発明によれば、パルスdc物理気相堆積プロセスによるLiCoO2層の堆積が提供される。そのような堆積により、所望の<101>方位を有するLiCoO2の結晶性層の低温高堆積速度堆積を提供することが可能である。堆積のいくつかの実施形態は、固体再充電可能Li電池のカソード層として利用しうるLiCoO2膜の高速度堆積の必要性に対処するものである。本発明に係るプロセスの実施形態によれば、LiCoO2層を結晶化させるために慣例的に必要とされる高温(>700℃)アニール工程を省略することが可能である。
本発明の実施形態によれば、LiCoO2膜は、パルスdc物理気相堆積(PVD)プロセスにより基板上に堆積される。Kimらの文献などとは対照的に、本発明のいくつかの実施形態に係るLiCoO2膜は、金属核生成下側膜やバリヤー下側膜を用いることなく堆積時約220℃程度の低い基板温度で基板上に堆積された結晶性LiCoO2膜を提供する。堆積されたままの状態の結晶性LiCoO2膜は、アニールすることにより非常に高い結晶性の状態に容易に熟成することが可能である。そのほか、貴金属膜上に位置決めした場合、堆積されたままの状態の結晶性膜は、さらに大きく低減された温度、たとえば、700℃ではなく400〜500℃程度の低い温度でアニールして、より低温の基板上で固体電池の堆積、アニール、および作製を提供することが可能である。
Claims (16)
- 反応器内に基板を配置することと、
アルゴンおよび酸素を含むガス状混合物を該反応器内に通して流動させることと、
該基板に対向するように位置決めされた、約3kΩ〜10kΩの抵抗率を有する、LiおよびCoの酸化物、LiおよびCoの金属添加物ならびにNi、SiまたはNbの少なくとも1種のドーパントで形成された稠密化導電性セラミックターゲットに、正電圧と負電圧との間で振動するパルスDC電力を印加することと、
該基板にRFバイアス電力を印加することと、
約100kHzの消去帯域幅を有する狭帯域消去フィルターで、パルスDC電力を稠密化導電性ターゲットに透過させることと、
を含むLiCoO2層の堆積方法であって、
LiCoO2の結晶性層が該基板上に堆積される、上記方法。 - 前記結晶性層が<101>方位である、請求項1に記載の方法。
- 前記結晶性層が<003>方位である、請求項1に記載の方法。
- 前記結晶性層の粒子サイズが約750Å〜約1700Åである、請求項1に記載の方法。
- 前記基板が、シリコン、ポリマー、ガラス、セラミックス、および金属で構成された集合から選ばれる材料である、請求項1に記載の方法。
- 前記基板を約200℃の温度に予備加熱することをさらに含む、請求項1に記載の方法。
- 前記基板が低温基板である、請求項1に記載の方法。
- 前記低温基板が、ガラス、プラスチック、および金属箔を含む一連の基板のうちの1つである、請求項7に記載の方法。
- 前記基板上に酸化物層を形成することをさらに含む、請求項1に記載の方法。
- 前記酸化物層が二酸化シリコン層である、請求項9に記載の方法。
- 前記結晶性層が毎時約1μm超の速度で堆積される、請求項2に記載の方法。
- 前記基板上に金属層を堆積することをさらに含む、請求項1に記載の方法。
- 前記金属層がイリジウムである、請求項12に記載の方法。
- 前記結晶性層を低熱収支でアニールすることをさらに含む、請求項1に記載の方法。
- 前記LiCoO2層を約500℃以下の温度でアニールすることをさらに含む、請求項12に記載の方法。
- 前記LiCoO2層を約400℃以下の温度でアニールすることをさらに含む、請求項12に記載の方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US63481804P | 2004-12-08 | 2004-12-08 | |
US60/634,818 | 2004-12-08 | ||
US65136305P | 2005-02-08 | 2005-02-08 | |
US60/651,363 | 2005-02-08 | ||
PCT/US2005/044781 WO2006063308A2 (en) | 2004-12-08 | 2005-12-07 | DEPOSITION OF LICoO2 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007218906A Division JP5129530B2 (ja) | 2007-08-24 | 2007-08-24 | LiCoO2の堆積 |
Publications (2)
Publication Number | Publication Date |
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JP2008523567A JP2008523567A (ja) | 2008-07-03 |
JP5095412B2 true JP5095412B2 (ja) | 2012-12-12 |
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Application Number | Title | Priority Date | Filing Date |
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JP2007545692A Expired - Fee Related JP5095412B2 (ja) | 2004-12-08 | 2005-12-07 | LiCoO2の堆積 |
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US (3) | US8636876B2 (ja) |
EP (1) | EP1825545B1 (ja) |
JP (1) | JP5095412B2 (ja) |
KR (2) | KR101127370B1 (ja) |
CN (1) | CN101931097B (ja) |
AT (1) | ATE447777T1 (ja) |
DE (1) | DE602005017512D1 (ja) |
TW (2) | TWI331634B (ja) |
WO (1) | WO2006063308A2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8636876B2 (en) | 2004-12-08 | 2014-01-28 | R. Ernest Demaray | Deposition of LiCoO2 |
US8728285B2 (en) | 2003-05-23 | 2014-05-20 | Demaray, Llc | Transparent conductive oxides |
Families Citing this family (76)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7378356B2 (en) | 2002-03-16 | 2008-05-27 | Springworks, Llc | Biased pulse DC reactive sputtering of oxide films |
US6884327B2 (en) * | 2002-03-16 | 2005-04-26 | Tao Pan | Mode size converter for a planar waveguide |
US20030175142A1 (en) * | 2002-03-16 | 2003-09-18 | Vassiliki Milonopoulou | Rare-earth pre-alloyed PVD targets for dielectric planar applications |
US8404376B2 (en) * | 2002-08-09 | 2013-03-26 | Infinite Power Solutions, Inc. | Metal film encapsulation |
US8394522B2 (en) | 2002-08-09 | 2013-03-12 | Infinite Power Solutions, Inc. | Robust metal film encapsulation |
US20070264564A1 (en) * | 2006-03-16 | 2007-11-15 | Infinite Power Solutions, Inc. | Thin film battery on an integrated circuit or circuit board and method thereof |
US8445130B2 (en) | 2002-08-09 | 2013-05-21 | Infinite Power Solutions, Inc. | Hybrid thin-film battery |
US8431264B2 (en) | 2002-08-09 | 2013-04-30 | Infinite Power Solutions, Inc. | Hybrid thin-film battery |
US9793523B2 (en) | 2002-08-09 | 2017-10-17 | Sapurast Research Llc | Electrochemical apparatus with barrier layer protected substrate |
US7826702B2 (en) | 2002-08-27 | 2010-11-02 | Springworks, Llc | Optically coupling into highly uniform waveguides |
US7205662B2 (en) * | 2003-02-27 | 2007-04-17 | Symmorphix, Inc. | Dielectric barrier layer films |
US7238628B2 (en) * | 2003-05-23 | 2007-07-03 | Symmorphix, Inc. | Energy conversion and storage films and devices by physical vapor deposition of titanium and titanium oxides and sub-oxides |
US7959769B2 (en) | 2004-12-08 | 2011-06-14 | Infinite Power Solutions, Inc. | Deposition of LiCoO2 |
US7846579B2 (en) | 2005-03-25 | 2010-12-07 | Victor Krasnov | Thin film battery with protective packaging |
US8679674B2 (en) | 2005-03-25 | 2014-03-25 | Front Edge Technology, Inc. | Battery with protective packaging |
US7838133B2 (en) | 2005-09-02 | 2010-11-23 | Springworks, Llc | Deposition of perovskite and other compound ceramic films for dielectric applications |
US8197781B2 (en) | 2006-11-07 | 2012-06-12 | Infinite Power Solutions, Inc. | Sputtering target of Li3PO4 and method for producing same |
US7862627B2 (en) * | 2007-04-27 | 2011-01-04 | Front Edge Technology, Inc. | Thin film battery substrate cutting and fabrication process |
JP2009009897A (ja) * | 2007-06-29 | 2009-01-15 | Sumitomo Electric Ind Ltd | 全固体薄膜電池、その製造方法およびその製造装置 |
WO2009014394A2 (en) * | 2007-07-25 | 2009-01-29 | Nuricell, Inc. | Method for depositing ceramic thin film by sputtering using non-conductive target |
US8628645B2 (en) * | 2007-09-04 | 2014-01-14 | Front Edge Technology, Inc. | Manufacturing method for thin film battery |
EP2225406A4 (en) | 2007-12-21 | 2012-12-05 | Infinite Power Solutions Inc | PROCEDURE FOR SPUTTER TARGETS FOR ELECTROLYTE FILMS |
CN101911367B (zh) | 2008-01-11 | 2015-02-25 | 无穷动力解决方案股份有限公司 | 用于薄膜电池及其他器件的薄膜包封 |
JP2009187682A (ja) * | 2008-02-01 | 2009-08-20 | Ulvac Japan Ltd | カソード電極の製造方法及び薄膜固体リチウムイオン2次電池の製造方法 |
JP5396717B2 (ja) * | 2008-02-12 | 2014-01-22 | 住友電気工業株式会社 | リチウム電池、リチウム電池用正極およびその製造方法 |
JP2009199920A (ja) * | 2008-02-22 | 2009-09-03 | Sumitomo Electric Ind Ltd | リチウム電池 |
US9136569B2 (en) | 2008-05-21 | 2015-09-15 | Applied Materials, Inc. | Microwave rapid thermal processing of electrochemical devices |
US8568571B2 (en) * | 2008-05-21 | 2013-10-29 | Applied Materials, Inc. | Thin film batteries and methods for manufacturing same |
CN102119454B (zh) | 2008-08-11 | 2014-07-30 | 无穷动力解决方案股份有限公司 | 具有用于电磁能量收集的一体收集器表面的能量设备及其方法 |
EP2369665A4 (en) * | 2008-12-24 | 2013-11-20 | Ngk Insulators Ltd | PLATE-SHAPED PARTICLES FOR A POSITIVE ELECTRODE-ACTIVE MATERIAL OF LITHIUM SECONDARY BATTERIES, MATERIALS AND LITHIUM SECONDARY BATTERIES |
JP4703786B2 (ja) | 2008-12-24 | 2011-06-15 | 日本碍子株式会社 | リチウム二次電池の正極活物質用の板状粒子、及び同物質膜、並びにリチウム二次電池 |
WO2010074314A1 (ja) * | 2008-12-24 | 2010-07-01 | 日本碍子株式会社 | リチウム二次電池の正極活物質用の板状粒子、リチウム二次電池の正極活物質膜、これらの製造方法、リチウム二次電池の正極活物質の製造方法、及びリチウム二次電池 |
JP4755727B2 (ja) * | 2008-12-24 | 2011-08-24 | 日本碍子株式会社 | リチウム二次電池の正極活物質用の板状粒子、及び同物質膜、並びにリチウム二次電池 |
WO2010074304A1 (ja) * | 2008-12-24 | 2010-07-01 | 日本碍子株式会社 | リチウム二次電池の正極活物質用の板状粒子、リチウム二次電池の正極活物質膜、これらの製造方法、リチウム二次電池の正極活物質の製造方法、及びリチウム二次電池 |
EP2369660A4 (en) * | 2008-12-24 | 2013-11-20 | Ngk Insulators Ltd | PLATE-LIKE PARTICLES FOR POSITIVE ELECTRODE ACTIVE MATERIAL OF LITHIUM SECONDARY BATTERIES, FILMS THEREOF, AND LITHIUM SECONDARY BATTERIES |
JP5247570B2 (ja) * | 2009-04-14 | 2013-07-24 | 株式会社アルバック | 薄膜リチウム二次電池製造装置及び薄膜リチウム二次電池製造方法 |
US20100291431A1 (en) * | 2009-05-13 | 2010-11-18 | Front Edge Technology, Inc. | Thin film battery with protective packaging |
FR2946462B1 (fr) * | 2009-06-09 | 2011-07-01 | Commissariat Energie Atomique | Procede de realisation d'au moins un microcomposant avec un masque unique |
US8502494B2 (en) * | 2009-08-28 | 2013-08-06 | Front Edge Technology, Inc. | Battery charging apparatus and method |
KR101792287B1 (ko) | 2009-09-01 | 2017-10-31 | 사푸라스트 리써치 엘엘씨 | 집적된 박막 배터리를 갖는 인쇄 회로 보드 |
US8464419B2 (en) * | 2009-09-22 | 2013-06-18 | Applied Materials, Inc. | Methods of and factories for thin-film battery manufacturing |
US8580332B2 (en) * | 2009-09-22 | 2013-11-12 | Applied Materials, Inc. | Thin-film battery methods for complexity reduction |
JP2013528912A (ja) | 2010-06-07 | 2013-07-11 | インフィニット パワー ソリューションズ, インコーポレイテッド | 再充電可能高密度電気化学素子 |
US8404001B2 (en) * | 2011-04-15 | 2013-03-26 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing positive electrode and power storage device |
JP5825883B2 (ja) * | 2011-06-30 | 2015-12-02 | 株式会社アルバック | 薄膜リチウム二次電池形成装置 |
US9905838B2 (en) * | 2011-08-30 | 2018-02-27 | Gs Yuasa International Ltd. | Electrode and method of manufacturing the same |
US8865340B2 (en) | 2011-10-20 | 2014-10-21 | Front Edge Technology Inc. | Thin film battery packaging formed by localized heating |
EP2584629B1 (en) * | 2011-10-21 | 2014-10-01 | BlackBerry Limited | Recessed tab for higher energy density and thinner batteries |
US10446828B2 (en) | 2011-10-21 | 2019-10-15 | Blackberry Limited | Recessed tab for higher energy density and thinner batteries |
US9142840B2 (en) | 2011-10-21 | 2015-09-22 | Blackberry Limited | Method of reducing tabbing volume required for external connections |
US9887429B2 (en) | 2011-12-21 | 2018-02-06 | Front Edge Technology Inc. | Laminated lithium battery |
US8864954B2 (en) | 2011-12-23 | 2014-10-21 | Front Edge Technology Inc. | Sputtering lithium-containing material with multiple targets |
US9257695B2 (en) | 2012-03-29 | 2016-02-09 | Front Edge Technology, Inc. | Localized heat treatment of battery component films |
US9077000B2 (en) | 2012-03-29 | 2015-07-07 | Front Edge Technology, Inc. | Thin film battery and localized heat treatment |
CN104396081B (zh) * | 2012-06-26 | 2017-05-10 | 应用材料公司 | 电化学装置的微波快速热处理 |
TW201404902A (zh) * | 2012-07-26 | 2014-02-01 | Applied Materials Inc | 以低溫退火進行之電化學裝置製造製程 |
US9159964B2 (en) | 2012-09-25 | 2015-10-13 | Front Edge Technology, Inc. | Solid state battery having mismatched battery cells |
US8753724B2 (en) | 2012-09-26 | 2014-06-17 | Front Edge Technology Inc. | Plasma deposition on a partially formed battery through a mesh screen |
JP6015297B2 (ja) * | 2012-09-26 | 2016-10-26 | 富士通株式会社 | リチウムイオン二次電池 |
US9356320B2 (en) | 2012-10-15 | 2016-05-31 | Front Edge Technology Inc. | Lithium battery having low leakage anode |
US9881775B2 (en) | 2013-06-26 | 2018-01-30 | Itn Energy Systems, Inc. | Waveform for improved energy control of sputtered species |
WO2015029290A1 (ja) * | 2013-08-29 | 2015-03-05 | パナソニックIpマネジメント株式会社 | 全固体リチウム二次電池 |
WO2016037126A1 (en) * | 2014-09-04 | 2016-03-10 | Applejack 199 L.P. | Wearable devices |
US9455437B2 (en) | 2014-10-08 | 2016-09-27 | Intermolecular, Inc. | Solid-state batteries utilizing template layers for electrode formation and methods for forming the same |
US9627709B2 (en) * | 2014-10-15 | 2017-04-18 | Sakti3, Inc. | Amorphous cathode material for battery device |
US10008739B2 (en) | 2015-02-23 | 2018-06-26 | Front Edge Technology, Inc. | Solid-state lithium battery with electrolyte |
CN106252589A (zh) * | 2015-06-12 | 2016-12-21 | 联想(北京)有限公司 | 一种柔性电池及柔性电池组 |
US10141564B2 (en) * | 2016-03-31 | 2018-11-27 | GM Global Technology Operations LLC | Lithium titanate structures for lithium ion batteries formed using element selective sputtering |
CN107488832B (zh) * | 2016-06-12 | 2019-11-29 | 北京北方华创微电子装备有限公司 | 沉积设备以及物理气相沉积腔室 |
JP6486410B2 (ja) * | 2016-07-12 | 2019-03-20 | ウォニク アイピーエス カンパニー リミテッド | 基板処理システム及び基板処理方法 |
EP3327837A1 (en) * | 2016-11-23 | 2018-05-30 | Eidgenössische Materialprüfungs- und Forschungsanstalt EMPA | Li-ion based electrochemical energy storage cell |
US10581109B2 (en) | 2017-03-30 | 2020-03-03 | International Business Machines Corporation | Fabrication method of all solid-state thin-film battery |
US10622680B2 (en) | 2017-04-06 | 2020-04-14 | International Business Machines Corporation | High charge rate, large capacity, solid-state battery |
CN108232320A (zh) * | 2018-02-08 | 2018-06-29 | 天津瑞晟晖能科技有限公司 | 全固态薄膜锂离子电池的制备方法及全固态薄膜锂离子电池 |
CN111176046B (zh) * | 2018-11-12 | 2021-04-16 | 中国科学院上海硅酸盐研究所 | 一种钴酸锂薄膜及其制备方法和应用 |
GB2588944B (en) * | 2019-11-15 | 2022-08-17 | Dyson Technology Ltd | Method of forming crystalline layer, method of forming a battery half cell |
Family Cites Families (695)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US712316A (en) | 1899-10-26 | 1902-10-28 | Francois Loppe | Electric accumulator. |
US2970180A (en) * | 1959-06-17 | 1961-01-31 | Union Carbide Corp | Alkaline deferred action cell |
US3309302A (en) * | 1963-10-07 | 1967-03-14 | Varian Associates | Method of preparing an electron tube including sputtering a suboxide of titanium on dielectric components thereof |
US3616403A (en) | 1968-10-25 | 1971-10-26 | Ibm | Prevention of inversion of p-type semiconductor material during rf sputtering of quartz |
GB1365492A (en) * | 1971-02-05 | 1974-09-04 | Triplex Safety Glass Co | Metal oxide films |
US3790432A (en) | 1971-12-30 | 1974-02-05 | Nasa | Reinforced polyquinoxaline gasket and method of preparing the same |
US3797091A (en) * | 1972-05-15 | 1974-03-19 | Du Pont | Terminal applicator |
US3850604A (en) | 1972-12-11 | 1974-11-26 | Gte Laboratories Inc | Preparation of chalcogenide glass sputtering targets |
US4111523A (en) | 1973-07-23 | 1978-09-05 | Bell Telephone Laboratories, Incorporated | Thin film optical waveguide |
US3939008A (en) * | 1975-02-10 | 1976-02-17 | Exxon Research And Engineering Company | Use of perovskites and perovskite-related compounds as battery cathodes |
US4099091A (en) | 1976-07-28 | 1978-07-04 | Matsushita Electric Industrial Co., Ltd. | Electroluminescent panel including an electrically conductive layer between two electroluminescent layers |
US4127424A (en) | 1976-12-06 | 1978-11-28 | Ses, Incorporated | Photovoltaic cell array |
US4082569A (en) | 1977-02-22 | 1978-04-04 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Solar cell collector |
DE2849294C3 (de) | 1977-11-22 | 1982-03-04 | Asahi Kasei Kogyo K.K., Osaka | Dünne Metall-Halogen-Zelle und Verfahren zu ihrer Herstellung |
IE49121B1 (en) | 1978-12-11 | 1985-08-07 | Triplex Safety Glass Co | Producing glass sheets of required curved shape |
US4318938A (en) | 1979-05-29 | 1982-03-09 | The University Of Delaware | Method for the continuous manufacture of thin film solar cells |
US4442144A (en) | 1980-11-17 | 1984-04-10 | International Business Machines Corporation | Method for forming a coating on a substrate |
US5055704A (en) | 1984-07-23 | 1991-10-08 | Sgs-Thomson Microelectronics, Inc. | Integrated circuit package with battery housing |
US4664993A (en) | 1981-08-24 | 1987-05-12 | Polaroid Corporation | Laminar batteries and methods of making the same |
US4756717A (en) | 1981-08-24 | 1988-07-12 | Polaroid Corporation | Laminar batteries and methods of making the same |
JPS58216476A (ja) | 1982-06-11 | 1983-12-16 | Hitachi Ltd | 光発電蓄電装置 |
JPS5950027A (ja) * | 1982-09-13 | 1984-03-22 | Hitachi Ltd | 二硫化チタン薄膜およびその形成法 |
US4518661A (en) | 1982-09-28 | 1985-05-21 | Rippere Ralph E | Consolidation of wires by chemical deposition and products resulting therefrom |
US4437966A (en) * | 1982-09-30 | 1984-03-20 | Gte Products Corporation | Sputtering cathode apparatus |
JPS59217964A (ja) | 1983-05-26 | 1984-12-08 | Hitachi Ltd | 薄膜電池の正極構造 |
JPS59227090A (ja) | 1983-06-06 | 1984-12-20 | Hitachi Ltd | 不揮発性メモリ装置 |
DE3345659A1 (de) | 1983-06-16 | 1984-12-20 | Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V., 3400 Göttingen | Keramikkoerper aus zirkoniumdioxid (zro(pfeil abwaerts)2(pfeil abwaerts)) und verfahren zu seiner herstellung |
AU573631B2 (en) | 1983-10-17 | 1988-06-16 | Tosoh Corporation | High strength zirconia type sintered body |
DE3417732A1 (de) | 1984-05-12 | 1986-07-10 | Leybold-Heraeus GmbH, 5000 Köln | Verfahren zum aufbringen von siliziumhaltigen schichten auf substraten durch katodenzerstaeubung und zerstaeubungskatode zur durchfuehrung des verfahrens |
GB8414878D0 (en) | 1984-06-11 | 1984-07-18 | Gen Electric Co Plc | Integrated optical waveguides |
JPH06101335B2 (ja) | 1984-11-26 | 1994-12-12 | 株式会社日立製作所 | 全固体リチウム電池 |
US4785459A (en) | 1985-05-01 | 1988-11-15 | Baer Thomas M | High efficiency mode matched solid state laser with transverse pumping |
KR910000273B1 (ko) | 1985-05-09 | 1991-01-23 | 마쯔시다덴기산교 가부시기가이샤 | 플라즈마 처리장치 |
US4710940A (en) | 1985-10-01 | 1987-12-01 | California Institute Of Technology | Method and apparatus for efficient operation of optically pumped laser |
US5173271A (en) | 1985-12-04 | 1992-12-22 | Massachusetts Institute Of Technology | Enhanced radiative zone-melting recrystallization method and apparatus |
US5296089A (en) * | 1985-12-04 | 1994-03-22 | Massachusetts Institute Of Technology | Enhanced radiative zone-melting recrystallization method and apparatus |
US4964877A (en) | 1986-01-14 | 1990-10-23 | Wilson Greatbatch Ltd. | Non-aqueous lithium battery |
JPS62266732A (ja) * | 1986-05-15 | 1987-11-19 | Tohoku Metal Ind Ltd | 垂直磁気記録媒体の製造方法 |
US4668593A (en) | 1986-08-29 | 1987-05-26 | Eltron Research, Inc. | Solvated electron lithium electrode for high energy density battery |
US4977007A (en) | 1986-09-19 | 1990-12-11 | Matsushita Electrical Indust. Co. | Solid electrochemical element and production process therefor |
US5292393A (en) * | 1986-12-19 | 1994-03-08 | Applied Materials, Inc. | Multichamber integrated process system |
US4740431A (en) | 1986-12-22 | 1988-04-26 | Spice Corporation | Integrated solar cell and battery |
US4728588A (en) | 1987-06-01 | 1988-03-01 | The Dow Chemical Company | Secondary battery |
US4865428A (en) | 1987-08-21 | 1989-09-12 | Corrigan Dennis A | Electrooptical device |
JP2692816B2 (ja) | 1987-11-13 | 1997-12-17 | 株式会社きもと | 薄型一次電池 |
US4826743A (en) | 1987-12-16 | 1989-05-02 | General Motors Corporation | Solid-state lithium battery |
US5141603A (en) | 1988-03-28 | 1992-08-25 | The United States Of America As Represented By The Secretary Of The Air Force | Capacitor method for improved oxide dielectric |
US4878094A (en) | 1988-03-30 | 1989-10-31 | Minko Balkanski | Self-powered electronic component and manufacturing method therefor |
US4915810A (en) | 1988-04-25 | 1990-04-10 | Unisys Corporation | Target source for ion beam sputter deposition |
US4903326A (en) * | 1988-04-27 | 1990-02-20 | Motorola, Inc. | Detachable battery pack with a built-in broadband antenna |
US5096852A (en) | 1988-06-02 | 1992-03-17 | Burr-Brown Corporation | Method of making plastic encapsulated multichip hybrid integrated circuits |
JP2501118B2 (ja) | 1988-06-17 | 1996-05-29 | 忠弘 大見 | 半導体装置の製造方法 |
US5403680A (en) | 1988-08-30 | 1995-04-04 | Osaka Gas Company, Ltd. | Photolithographic and electron beam lithographic fabrication of micron and submicron three-dimensional arrays of electronically conductive polymers |
FR2638764B1 (fr) | 1988-11-04 | 1993-05-07 | Centre Nat Rech Scient | Element composite comportant une couche en chalcogenure ou oxychalcogenure de titane, utilisable en particulier comme electrode positive dans une cellule electrochimique en couches minces |
JPH02133599A (ja) | 1988-11-11 | 1990-05-22 | Agency Of Ind Science & Technol | 酸化イリジウム膜の製造方法 |
US5006737A (en) | 1989-04-24 | 1991-04-09 | Motorola Inc. | Transformerless semiconductor AC switch having internal biasing means |
US5100821A (en) * | 1989-04-24 | 1992-03-31 | Motorola, Inc. | Semiconductor AC switch |
US5217828A (en) | 1989-05-01 | 1993-06-08 | Brother Kogyo Kabushiki Kaisha | Flexible thin film cell including packaging material |
US5540742A (en) | 1989-05-01 | 1996-07-30 | Brother Kogyo Kabushiki Kaisha | Method of fabricating thin film cells and printed circuit boards containing thin film cells using a screen printing process |
JP2808660B2 (ja) | 1989-05-01 | 1998-10-08 | ブラザー工業株式会社 | 薄膜電池内蔵プリント基板の製造方法 |
US5221891A (en) | 1989-07-31 | 1993-06-22 | Intermatic Incorporated | Control circuit for a solar-powered rechargeable power source and load |
US5119269A (en) | 1989-08-23 | 1992-06-02 | Seiko Epson Corporation | Semiconductor with a battery unit |
US5792550A (en) | 1989-10-24 | 1998-08-11 | Flex Products, Inc. | Barrier film having high colorless transparency and method |
JP2758948B2 (ja) | 1989-12-15 | 1998-05-28 | キヤノン株式会社 | 薄膜形成方法 |
DE4022090A1 (de) | 1989-12-18 | 1991-06-20 | Forschungszentrum Juelich Gmbh | Elektro-optisches bauelement und verfahren zu dessen herstellung |
US5124782A (en) | 1990-01-26 | 1992-06-23 | Sgs-Thomson Microelectronics, Inc. | Integrated circuit package with molded cell |
US5252194A (en) | 1990-01-26 | 1993-10-12 | Varian Associates, Inc. | Rotating sputtering apparatus for selected erosion |
US5169408A (en) | 1990-01-26 | 1992-12-08 | Fsi International, Inc. | Apparatus for wafer processing with in situ rinse |
US5196374A (en) | 1990-01-26 | 1993-03-23 | Sgs-Thomson Microelectronics, Inc. | Integrated circuit package with molded cell |
US5085904A (en) * | 1990-04-20 | 1992-02-04 | E. I. Du Pont De Nemours And Company | Barrier materials useful for packaging |
US5306569A (en) | 1990-06-15 | 1994-04-26 | Hitachi Metals, Ltd. | Titanium-tungsten target material and manufacturing method thereof |
JP2755471B2 (ja) | 1990-06-29 | 1998-05-20 | 日立電線株式会社 | 希土類元素添加光導波路及びその製造方法 |
US5645626A (en) | 1990-08-10 | 1997-07-08 | Bend Research, Inc. | Composite hydrogen separation element and module |
US5225288A (en) | 1990-08-10 | 1993-07-06 | E. I. Du Pont De Nemours And Company | Solvent blockers and multilayer barrier coatings for thin films |
US5147985A (en) | 1990-08-14 | 1992-09-15 | The Scabbard Corporation | Sheet batteries as substrate for electronic circuit |
US5110694A (en) | 1990-10-11 | 1992-05-05 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Secondary Li battery incorporating 12-Crown-4 ether |
US5110696A (en) * | 1990-11-09 | 1992-05-05 | Bell Communications Research | Rechargeable lithiated thin film intercalation electrode battery |
US5273608A (en) | 1990-11-29 | 1993-12-28 | United Solar Systems Corporation | Method of encapsulating a photovoltaic device |
US5493177A (en) | 1990-12-03 | 1996-02-20 | The Regents Of The University Of California | Sealed micromachined vacuum and gas filled devices |
US5057385A (en) | 1990-12-14 | 1991-10-15 | Hope Henry F | Battery packaging construction |
NL9002844A (nl) | 1990-12-21 | 1992-07-16 | Philips Nv | Systeem omvattende een apparaat en een cassette, alsmede een apparaat en een cassette geschikt voor toepassing in een dergelijk systeem. |
CA2056139C (en) | 1991-01-31 | 2000-08-01 | John C. Bailey | Electrochromic thin film state-of-charge detector for on-the-cell application |
US5227264A (en) | 1991-02-14 | 1993-07-13 | Hydro-Quebec | Device for packaging a lithium battery |
US6110531A (en) | 1991-02-25 | 2000-08-29 | Symetrix Corporation | Method and apparatus for preparing integrated circuit thin films by chemical vapor deposition |
US5180645A (en) | 1991-03-01 | 1993-01-19 | Motorola, Inc. | Integral solid state embedded power supply |
US5119460A (en) | 1991-04-25 | 1992-06-02 | At&T Bell Laboratories | Erbium-doped planar optical device |
US5200029A (en) | 1991-04-25 | 1993-04-06 | At&T Bell Laboratories | Method of making a planar optical amplifier |
US5107538A (en) | 1991-06-06 | 1992-04-21 | At&T Bell Laboratories | Optical waveguide system comprising a rare-earth Si-based optical device |
US5208121A (en) | 1991-06-18 | 1993-05-04 | Wisconsin Alumni Research Foundation | Battery utilizing ceramic membranes |
US5187564A (en) | 1991-07-26 | 1993-02-16 | Sgs-Thomson Microelectronics, Inc. | Application of laminated interconnect media between a laminated power source and semiconductor devices |
US5153710A (en) | 1991-07-26 | 1992-10-06 | Sgs-Thomson Microelectronics, Inc. | Integrated circuit package with laminated backup cell |
US5171413A (en) | 1991-09-16 | 1992-12-15 | Tufts University | Methods for manufacturing solid state ionic devices |
US5196041A (en) * | 1991-09-17 | 1993-03-23 | The Charles Stark Draper Laboratory, Inc. | Method of forming an optical channel waveguide by gettering |
US5355089A (en) | 1992-07-22 | 1994-10-11 | Duracell Inc. | Moisture barrier for battery with electrochemical tester |
JP2755844B2 (ja) | 1991-09-30 | 1998-05-25 | シャープ株式会社 | プラスチック基板液晶表示素子 |
US5702829A (en) | 1991-10-14 | 1997-12-30 | Commissariat A L'energie Atomique | Multilayer material, anti-erosion and anti-abrasion coating incorporating said multilayer material |
US5401595A (en) | 1991-12-06 | 1995-03-28 | Yuasa Corporation | Film type battery and layer-built film type battery |
ES2103030T3 (es) * | 1991-12-11 | 1997-08-16 | Mobil Oil Corp | Pelicula de barrera de alta calidad. |
JPH06145975A (ja) | 1992-03-20 | 1994-05-27 | Komag Inc | 炭素フィルムをスパタリングする方法及びその製造物 |
US5287427A (en) * | 1992-05-05 | 1994-02-15 | At&T Bell Laboratories | Method of making an article comprising an optical component, and article comprising the component |
US6144916A (en) | 1992-05-15 | 2000-11-07 | Micron Communications, Inc. | Itinerary monitoring system for storing a plurality of itinerary data points |
US5497140A (en) | 1992-08-12 | 1996-03-05 | Micron Technology, Inc. | Electrically powered postage stamp or mailing or shipping label operative with radio frequency (RF) communication |
SE9201585L (sv) | 1992-05-19 | 1993-11-01 | Gustavsson Magnus Peter M | Elektriskt uppvärmt plagg eller liknande |
US6045652A (en) | 1992-06-17 | 2000-04-04 | Micron Communications, Inc. | Method of manufacturing an enclosed transceiver |
US6741178B1 (en) | 1992-06-17 | 2004-05-25 | Micron Technology, Inc | Electrically powered postage stamp or mailing or shipping label operative with radio frequency (RF) communication |
US5776278A (en) | 1992-06-17 | 1998-07-07 | Micron Communications, Inc. | Method of manufacturing an enclosed transceiver |
US5326652A (en) | 1993-01-25 | 1994-07-05 | Micron Semiconductor, Inc. | Battery package and method using flexible polymer films having a deposited layer of an inorganic material |
DE4319878A1 (de) | 1992-06-17 | 1993-12-23 | Micron Technology Inc | Hochfrequenz-Identifikationseinrichtung (HFID) und Verfahren zu ihrer Herstellung |
US5779839A (en) | 1992-06-17 | 1998-07-14 | Micron Communications, Inc. | Method of manufacturing an enclosed transceiver |
US5338625A (en) | 1992-07-29 | 1994-08-16 | Martin Marietta Energy Systems, Inc. | Thin film battery and method for making same |
US7158031B2 (en) | 1992-08-12 | 2007-01-02 | Micron Technology, Inc. | Thin, flexible, RFID label and system for use |
JP3214910B2 (ja) * | 1992-08-18 | 2001-10-02 | 富士通株式会社 | 平面導波路型光増幅器の製造方法 |
US5538796A (en) | 1992-10-13 | 1996-07-23 | General Electric Company | Thermal barrier coating system having no bond coat |
US5597661A (en) * | 1992-10-23 | 1997-01-28 | Showa Denko K.K. | Solid polymer electrolyte, battery and solid-state electric double layer capacitor using the same as well as processes for the manufacture thereof |
JP3231900B2 (ja) | 1992-10-28 | 2001-11-26 | 株式会社アルバック | 成膜装置 |
US5326653A (en) | 1992-10-29 | 1994-07-05 | Valence Technology, Inc. | Battery unit with reinforced current collector tabs and method of making a battery unit having strengthened current collector tabs |
US5942089A (en) | 1996-04-22 | 1999-08-24 | Northwestern University | Method for sputtering compounds on a substrate |
US5789071A (en) | 1992-11-09 | 1998-08-04 | Northwestern University | Multilayer oxide coatings |
JP3214107B2 (ja) | 1992-11-09 | 2001-10-02 | 富士電機株式会社 | 電池搭載集積回路装置 |
JPH06158308A (ja) | 1992-11-24 | 1994-06-07 | Hitachi Metals Ltd | インジウム・スズ酸化物膜用スパッタリング用ターゲットおよびその製造方法 |
US5279624A (en) | 1992-11-27 | 1994-01-18 | Gould Inc. | Solder sealed solid electrolyte cell housed within a ceramic frame and the method for producing it |
US5307240A (en) | 1992-12-02 | 1994-04-26 | Intel Corporation | Chiplid, multichip semiconductor package design concept |
US6022458A (en) | 1992-12-07 | 2000-02-08 | Canon Kabushiki Kaisha | Method of production of a semiconductor substrate |
AU669754B2 (en) | 1992-12-18 | 1996-06-20 | Becton Dickinson & Company | Barrier coating |
US5303319A (en) | 1992-12-28 | 1994-04-12 | Honeywell Inc. | Ion-beam deposited multilayer waveguides and resonators |
SE500725C2 (sv) | 1992-12-29 | 1994-08-15 | Volvo Ab | Anordning vid paneler för farkoster |
US5427669A (en) | 1992-12-30 | 1995-06-27 | Advanced Energy Industries, Inc. | Thin film DC plasma processing system |
US5718813A (en) * | 1992-12-30 | 1998-02-17 | Advanced Energy Industries, Inc. | Enhanced reactive DC sputtering system |
US5547780A (en) | 1993-01-18 | 1996-08-20 | Yuasa Corporation | Battery precursor and a battery |
US5300461A (en) | 1993-01-25 | 1994-04-05 | Intel Corporation | Process for fabricating sealed semiconductor chip using silicon nitride passivation film |
US5338624A (en) | 1993-02-08 | 1994-08-16 | Globe-Union Inc. | Thermal management of rechargeable batteries |
JPH06279185A (ja) * | 1993-03-25 | 1994-10-04 | Canon Inc | ダイヤモンド結晶およびダイヤモンド結晶膜の形成方法 |
US5613995A (en) * | 1993-04-23 | 1997-03-25 | Lucent Technologies Inc. | Method for making planar optical waveguides |
US5665490A (en) | 1993-06-03 | 1997-09-09 | Showa Denko K.K. | Solid polymer electrolyte, battery and solid-state electric double layer capacitor using the same as well as processes for the manufacture thereof |
SG46607A1 (en) | 1993-07-28 | 1998-02-20 | Asahi Glass Co Ltd | Method of an apparatus for sputtering |
JP3684593B2 (ja) * | 1993-07-28 | 2005-08-17 | 旭硝子株式会社 | スパッタリング方法およびその装置 |
US5499207A (en) * | 1993-08-06 | 1996-03-12 | Hitachi, Ltd. | Semiconductor memory device having improved isolation between electrodes, and process for fabricating the same |
US5360686A (en) | 1993-08-20 | 1994-11-01 | The United States Of America As Represented By The National Aeronautics And Space Administration | Thin composite solid electrolyte film for lithium batteries |
US5599355A (en) * | 1993-08-20 | 1997-02-04 | Nagasubramanian; Ganesan | Method for forming thin composite solid electrolyte film for lithium batteries |
JP2642849B2 (ja) | 1993-08-24 | 1997-08-20 | 株式会社フロンテック | 薄膜の製造方法および製造装置 |
US5478456A (en) | 1993-10-01 | 1995-12-26 | Minnesota Mining And Manufacturing Company | Sputtering target |
US5314765A (en) | 1993-10-14 | 1994-05-24 | Martin Marietta Energy Systems, Inc. | Protective lithium ion conducting ceramic coating for lithium metal anodes and associate method |
DE69430230T2 (de) | 1993-10-14 | 2002-10-31 | Neuralsystems Corp | Verfahren und Vorrichtung zur Herstellung eines Einkristallinen dünnen Films |
US5411537A (en) | 1993-10-29 | 1995-05-02 | Intermedics, Inc. | Rechargeable biomedical battery powered devices with recharging and control system therefor |
US5445856A (en) | 1993-11-10 | 1995-08-29 | Chaloner-Gill; Benjamin | Protective multilayer laminate for covering an electrochemical device |
US5738731A (en) | 1993-11-19 | 1998-04-14 | Mega Chips Corporation | Photovoltaic device |
US5512387A (en) | 1993-11-19 | 1996-04-30 | Ovonic Battery Company, Inc. | Thin-film, solid state battery employing an electrically insulating, ion conducting electrolyte material |
US5985485A (en) | 1993-11-19 | 1999-11-16 | Ovshinsky; Stanford R. | Solid state battery having a disordered hydrogenated carbon negative electrode |
US5433835B1 (en) * | 1993-11-24 | 1997-05-20 | Applied Materials Inc | Sputtering device and target with cover to hold cooling fluid |
US5487822A (en) | 1993-11-24 | 1996-01-30 | Applied Materials, Inc. | Integrated sputtering target assembly |
WO1996023085A1 (en) | 1995-01-25 | 1996-08-01 | Applied Komatsu Technology, Inc. | Autoclave bonding of sputtering target assembly |
US5387482A (en) | 1993-11-26 | 1995-02-07 | Motorola, Inc. | Multilayered electrolyte and electrochemical cells used same |
US5654984A (en) | 1993-12-03 | 1997-08-05 | Silicon Systems, Inc. | Signal modulation across capacitors |
US5419982A (en) | 1993-12-06 | 1995-05-30 | Valence Technology, Inc. | Corner tab termination for flat-cell batteries |
US5569520A (en) | 1994-01-12 | 1996-10-29 | Martin Marietta Energy Systems, Inc. | Rechargeable lithium battery for use in applications requiring a low to high power output |
US5961672A (en) | 1994-02-16 | 1999-10-05 | Moltech Corporation | Stabilized anode for lithium-polymer batteries |
US5561004A (en) | 1994-02-25 | 1996-10-01 | Bates; John B. | Packaging material for thin film lithium batteries |
US5464706A (en) | 1994-03-02 | 1995-11-07 | Dasgupta; Sankar | Current collector for lithium ion battery |
US6408402B1 (en) * | 1994-03-22 | 2002-06-18 | Hyperchip Inc. | Efficient direct replacement cell fault tolerant architecture |
US5475528A (en) | 1994-03-25 | 1995-12-12 | Corning Incorporated | Optical signal amplifier glasses |
US5470396A (en) | 1994-04-12 | 1995-11-28 | Amoco Corporation | Solar cell module package and method for its preparation |
US5805223A (en) | 1994-05-25 | 1998-09-08 | Canon Kk | Image encoding apparatus having an intrapicture encoding mode and interpicture encoding mode |
US5411592A (en) | 1994-06-06 | 1995-05-02 | Ovonic Battery Company, Inc. | Apparatus for deposition of thin-film, solid state batteries |
JP3947575B2 (ja) | 1994-06-10 | 2007-07-25 | Hoya株式会社 | 導電性酸化物およびそれを用いた電極 |
JP3017538B2 (ja) | 1994-06-13 | 2000-03-13 | 三井化学株式会社 | リチウムイオン伝導性ガラス薄膜を用いた薄型炭酸ガスセンサ |
US5472795A (en) | 1994-06-27 | 1995-12-05 | Board Of Regents Of The University Of The University Of Wisconsin System, On Behalf Of The University Of Wisconsin-Milwaukee | Multilayer nanolaminates containing polycrystalline zirconia |
WO1996000996A1 (en) | 1994-06-30 | 1996-01-11 | The Whitaker Corporation | Planar hybrid optical amplifier |
US5457569A (en) | 1994-06-30 | 1995-10-10 | At&T Ipm Corp. | Semiconductor amplifier or laser having integrated lens |
JP3407409B2 (ja) * | 1994-07-27 | 2003-05-19 | 富士通株式会社 | 高誘電率薄膜の製造方法 |
US6181283B1 (en) * | 1994-08-01 | 2001-01-30 | Rangestar Wireless, Inc. | Selectively removable combination battery and antenna assembly for a telecommunication device |
US5504041A (en) | 1994-08-01 | 1996-04-02 | Texas Instruments Incorporated | Conductive exotic-nitride barrier layer for high-dielectric-constant materials |
US5445906A (en) | 1994-08-03 | 1995-08-29 | Martin Marietta Energy Systems, Inc. | Method and system for constructing a rechargeable battery and battery structures formed with the method |
US5458995A (en) | 1994-08-12 | 1995-10-17 | The United States Of America As Represented By The Secretary Of The Army | Solid state electrochemical cell including lithium iodide as an electrolyte additive |
US5483613A (en) * | 1994-08-16 | 1996-01-09 | At&T Corp. | Optical device with substrate and waveguide structure having thermal matching interfaces |
US5909346A (en) | 1994-08-26 | 1999-06-01 | Aiwa Research & Development, Inc. | Thin magnetic film including multiple geometry gap structures on a common substrate |
US5437692A (en) | 1994-11-02 | 1995-08-01 | Dasgupta; Sankar | Method for forming an electrode-electrolyte assembly |
US5498489A (en) | 1995-04-14 | 1996-03-12 | Dasgupta; Sankar | Rechargeable non-aqueous lithium battery having stacked electrochemical cells |
JPH08148709A (ja) | 1994-11-15 | 1996-06-07 | Mitsubishi Electric Corp | 薄型太陽電池の製造方法及び薄型太陽電池の製造装置 |
US7162392B2 (en) | 1994-11-21 | 2007-01-09 | Phatrat Technology, Inc. | Sport performance systems for measuring athletic performance, and associated methods |
US6025094A (en) | 1994-11-23 | 2000-02-15 | Polyplus Battery Company, Inc. | Protective coatings for negative electrodes |
US5515387A (en) | 1994-12-12 | 1996-05-07 | Trw Inc. | Signal independent pulse code modulation data enhancer and associated method |
US6204111B1 (en) * | 1994-12-28 | 2001-03-20 | Matsushita Electronics Corporation | Fabrication method of capacitor for integrated circuit |
CN1075243C (zh) | 1994-12-28 | 2001-11-21 | 松下电器产业株式会社 | 集成电路用电容元件及其制造方法 |
US5555342A (en) | 1995-01-17 | 1996-09-10 | Lucent Technologies Inc. | Planar waveguide and a process for its fabrication |
US5607789A (en) * | 1995-01-23 | 1997-03-04 | Duracell Inc. | Light transparent multilayer moisture barrier for electrochemical cell tester and cell employing same |
US5755831A (en) | 1995-02-22 | 1998-05-26 | Micron Communications, Inc. | Method of forming a button-type battery and a button-type battery with improved separator construction |
US6444750B1 (en) | 1995-03-06 | 2002-09-03 | Exxonmobil Oil Corp. | PVOH-based coating solutions |
NL1000138C2 (nl) | 1995-04-13 | 1996-10-15 | Od & Me Bv | Inrichtingen voor het bewerken van een substraat alsmede werkwijze geschikt voor toepassing bij dergelijke inrichtingen. |
US5612153A (en) | 1995-04-13 | 1997-03-18 | Valence Technology, Inc. | Battery mask from radiation curable and thermoplastic materials |
JPH10509773A (ja) | 1995-04-25 | 1998-09-22 | ザ ビーオーシー グループ インコーポレイテッド | 基板上に誘電体層を形成するためのスパッタリング装置及び方法 |
US5771562A (en) | 1995-05-02 | 1998-06-30 | Motorola, Inc. | Passivation of organic devices |
WO1996036746A1 (fr) | 1995-05-18 | 1996-11-21 | Asahi Glass Company Ltd. | Procede de production d'une cible de pulverisation |
US5645960A (en) | 1995-05-19 | 1997-07-08 | The United States Of America As Represented By The Secretary Of The Air Force | Thin film lithium polymer battery |
US5601952A (en) * | 1995-05-24 | 1997-02-11 | Dasgupta; Sankar | Lithium-Manganese oxide electrode for a rechargeable lithium battery |
US5622652A (en) | 1995-06-07 | 1997-04-22 | Img Group Limited | Electrically-conductive liquid for directly printing an electrical circuit component onto a substrate, and a method for making such a liquid |
US6265652B1 (en) | 1995-06-15 | 2001-07-24 | Kanegafuchi Kagaku Kogyo Kabushiki Kabushiki Kaisha | Integrated thin-film solar battery and method of manufacturing the same |
KR100342189B1 (ko) | 1995-07-12 | 2002-11-30 | 삼성전자 주식회사 | 휘발성복합체를사용한희토류원소첨가광섬유제조방법 |
US6459418B1 (en) | 1995-07-20 | 2002-10-01 | E Ink Corporation | Displays combining active and non-active inks |
US6639578B1 (en) | 1995-07-20 | 2003-10-28 | E Ink Corporation | Flexible displays |
US6118426A (en) | 1995-07-20 | 2000-09-12 | E Ink Corporation | Transducers and indicators having printed displays |
US5677784A (en) | 1995-07-24 | 1997-10-14 | Ellis D. Harris Sr. Family Trust | Array of pellicle optical gates |
JPH0949077A (ja) * | 1995-08-09 | 1997-02-18 | Ulvac Japan Ltd | Dcスパッタリング装置 |
ATE204029T1 (de) | 1995-08-18 | 2001-08-15 | Heraeus Gmbh W C | Target für die kathodenzerstäubung und verfahren zur herstellung eines solchen targets |
US5563979A (en) | 1995-08-31 | 1996-10-08 | Lucent Technologies Inc. | Erbium-doped planar optical device |
US5582935A (en) | 1995-09-28 | 1996-12-10 | Dasgupta; Sankar | Composite electrode for a lithium battery |
US5689522A (en) | 1995-10-02 | 1997-11-18 | The Regents Of The University Of California | High efficiency 2 micrometer laser utilizing wing-pumped Tm3+ and a laser diode array end-pumping architecture |
US5716736A (en) | 1995-10-06 | 1998-02-10 | Midwest Research Institute | Solid lithium-ion electrolyte |
US5616933A (en) | 1995-10-16 | 1997-04-01 | Sony Corporation | Nitride encapsulated thin film transistor fabrication technique |
US5719976A (en) * | 1995-10-24 | 1998-02-17 | Lucent Technologies, Inc. | Optimized waveguide structure |
JP3298799B2 (ja) | 1995-11-22 | 2002-07-08 | ルーセント テクノロジーズ インコーポレイテッド | クラッディングポンプファイバとその製造方法 |
US5686360A (en) | 1995-11-30 | 1997-11-11 | Motorola | Passivation of organic devices |
US5811177A (en) | 1995-11-30 | 1998-09-22 | Motorola, Inc. | Passivation of electroluminescent organic devices |
US5644207A (en) | 1995-12-11 | 1997-07-01 | The Johns Hopkins University | Integrated power source |
US6608464B1 (en) | 1995-12-11 | 2003-08-19 | The Johns Hopkins University | Integrated power source layered with thin film rechargeable batteries, charger, and charge-control |
US5897522A (en) | 1995-12-20 | 1999-04-27 | Power Paper Ltd. | Flexible thin layer open electrochemical cell and applications of same |
US5955161A (en) | 1996-01-30 | 1999-09-21 | Becton Dickinson And Company | Blood collection tube assembly |
US5637418A (en) | 1996-02-08 | 1997-06-10 | Motorola, Inc. | Package for a flat electrochemical device |
US5721067A (en) | 1996-02-22 | 1998-02-24 | Jacobs; James K. | Rechargeable lithium battery having improved reversible capacity |
US5972516A (en) | 1996-02-29 | 1999-10-26 | Kyocera Corporation | Method for manufacturing optical waveguide using siloxane polymer, and optoelectronic hybrid substrate using the optical waveguide |
US5845990A (en) | 1996-03-11 | 1998-12-08 | Hilite Systems, L.L.C. | High signal lights for automotive vehicles |
JP2810013B2 (ja) * | 1996-03-14 | 1998-10-15 | 株式会社東芝 | 酸化物薄膜の形成方法および酸化物薄膜 |
WO1997035044A1 (en) | 1996-03-22 | 1997-09-25 | Materials Research Corporation | Method and apparatus for rf diode sputtering |
US5930584A (en) | 1996-04-10 | 1999-07-27 | United Microelectronics Corp. | Process for fabricating low leakage current electrode for LPCVD titanium oxide films |
JPH1010675A (ja) | 1996-04-22 | 1998-01-16 | Fuji Photo Film Co Ltd | 記録材料 |
JP3346167B2 (ja) * | 1996-05-27 | 2002-11-18 | 三菱マテリアル株式会社 | 高強度誘電体スパッタリングターゲットおよびその製造方法並びに膜 |
WO1997047695A1 (en) | 1996-06-12 | 1997-12-18 | Hoechst Trespaphan Gmbh | Transparent barrier coatings exhibiting reduced thin film interference |
EP0814529A1 (fr) | 1996-06-19 | 1997-12-29 | Koninklijke Philips Electronics N.V. | Carte mince comprenant un accumulateur plat et des contacts |
US5948464A (en) | 1996-06-19 | 1999-09-07 | Imra America, Inc. | Process of manufacturing porous separator for electrochemical power supply |
US5761234A (en) | 1996-07-09 | 1998-06-02 | Sdl, Inc. | High power, reliable optical fiber pumping system with high redundancy for use in lightwave communication systems |
US5731661A (en) * | 1996-07-15 | 1998-03-24 | Motorola, Inc. | Passivation of electroluminescent organic devices |
US5855744A (en) * | 1996-07-19 | 1999-01-05 | Applied Komatsu Technology, Inc. | Non-planar magnet tracking during magnetron sputtering |
US5693956A (en) | 1996-07-29 | 1997-12-02 | Motorola | Inverted oleds on hard plastic substrate |
JPH1056145A (ja) | 1996-08-07 | 1998-02-24 | Hitachi Ltd | 半導体集積回路装置の製造方法 |
JP3825843B2 (ja) | 1996-09-12 | 2006-09-27 | キヤノン株式会社 | 太陽電池モジュール |
WO1998016960A2 (en) | 1996-10-11 | 1998-04-23 | Massachusetts Institute Of Technology | Polymer electrolyte, intercalation compounds and electrodes for batteries |
US6007945A (en) | 1996-10-15 | 1999-12-28 | Electrofuel Inc. | Negative electrode for a rechargeable lithium battery comprising a solid solution of titanium dioxide and tin dioxide |
JP3631341B2 (ja) * | 1996-10-18 | 2005-03-23 | Tdk株式会社 | 積層型複合機能素子およびその製造方法 |
US5841931A (en) | 1996-11-26 | 1998-11-24 | Massachusetts Institute Of Technology | Methods of forming polycrystalline semiconductor waveguides for optoelectronic integrated circuits, and devices formed thereby |
US5783333A (en) | 1996-11-27 | 1998-07-21 | Polystor Corporation | Lithium nickel cobalt oxides for positive electrodes |
EP0883137B1 (en) | 1996-12-11 | 2006-03-22 | Tonen Chemical Corporation | Thin aprotic electrolyte film, immobilized liquid film conductor, and polymer cell |
US6144795A (en) * | 1996-12-13 | 2000-11-07 | Corning Incorporated | Hybrid organic-inorganic planar optical waveguide device |
US6289209B1 (en) * | 1996-12-18 | 2001-09-11 | Micron Technology, Inc. | Wireless communication system, radio frequency communications system, wireless communications method, radio frequency communications method |
US5842118A (en) * | 1996-12-18 | 1998-11-24 | Micron Communications, Inc. | Communication system including diversity antenna queuing |
JPH10195649A (ja) * | 1996-12-27 | 1998-07-28 | Sony Corp | マグネトロンスパッタ装置および半導体装置の製造方法 |
US5705293A (en) * | 1997-01-09 | 1998-01-06 | Lockheed Martin Energy Research Corporation | Solid state thin film battery having a high temperature lithium alloy anode |
US5882812A (en) | 1997-01-14 | 1999-03-16 | Polyplus Battery Company, Inc. | Overcharge protection systems for rechargeable batteries |
US5790489A (en) | 1997-01-21 | 1998-08-04 | Dell Usa, L.P. | Smart compact disk including a processor and a transmission element |
US5944964A (en) | 1997-02-13 | 1999-08-31 | Optical Coating Laboratory, Inc. | Methods and apparatus for preparing low net stress multilayer thin film coatings |
JPH10229201A (ja) | 1997-02-14 | 1998-08-25 | Sony Corp | 薄膜半導体装置の製造方法 |
JP3345878B2 (ja) | 1997-02-17 | 2002-11-18 | 株式会社デンソー | 電子回路装置の製造方法 |
US5847865A (en) | 1997-02-18 | 1998-12-08 | Regents Of The University Of Minnesota | Waveguide optical amplifier |
US5970393A (en) | 1997-02-25 | 1999-10-19 | Polytechnic University | Integrated micro-strip antenna apparatus and a system utilizing the same for wireless communications for sensing and actuation purposes |
JP3767151B2 (ja) | 1997-02-26 | 2006-04-19 | ソニー株式会社 | 薄型電池 |
JPH10302843A (ja) | 1997-02-28 | 1998-11-13 | Mitsubishi Electric Corp | 電池用接着剤及びそれを用いた電池とその製造法 |
JP3098204B2 (ja) | 1997-03-07 | 2000-10-16 | ティーディーケイ株式会社 | 光磁気記録用合金ターゲット、その製造方法およびその再生方法 |
US5952778A (en) | 1997-03-18 | 1999-09-14 | International Business Machines Corporation | Encapsulated organic light emitting device |
JPH10265948A (ja) | 1997-03-25 | 1998-10-06 | Rohm Co Ltd | 半導体装置用基板およびその製法 |
ATE199196T1 (de) | 1997-03-27 | 2001-02-15 | Tno | Erbiumdotierter planarer wellenleiter |
US6106933A (en) | 1997-04-03 | 2000-08-22 | Toray Industries, Inc. | Transparent gas barrier biaxially oriented polypropylene film, a laminate film, and a production method thereof |
US6242132B1 (en) | 1997-04-16 | 2001-06-05 | Ut-Battelle, Llc | Silicon-tin oxynitride glassy composition and use as anode for lithium-ion battery |
US5948215A (en) | 1997-04-21 | 1999-09-07 | Tokyo Electron Limited | Method and apparatus for ionized sputtering |
EP0875952B1 (fr) | 1997-04-23 | 2001-10-24 | Hydro-Quebec | Piles au lithium ultra-minces et à l'etat solide et procédé de fabrication |
US6394598B1 (en) | 1997-04-28 | 2002-05-28 | Binney & Smith Inc. | Ink jet marker |
US6422698B2 (en) | 1997-04-28 | 2002-07-23 | Binney & Smith Inc. | Ink jet marker |
US6329213B1 (en) | 1997-05-01 | 2001-12-11 | Micron Technology, Inc. | Methods for forming integrated circuits within substrates |
US5882721A (en) * | 1997-05-01 | 1999-03-16 | Imra America Inc | Process of manufacturing porous separator for electrochemical power supply |
JP3290375B2 (ja) * | 1997-05-12 | 2002-06-10 | 松下電器産業株式会社 | 有機電界発光素子 |
JP4326041B2 (ja) | 1997-05-15 | 2009-09-02 | エフエムシー・コーポレイション | ドープされた層間化合物およびその作製方法 |
US5895731A (en) | 1997-05-15 | 1999-04-20 | Nelson E. Smith | Thin-film lithium battery and process |
US5830330A (en) | 1997-05-22 | 1998-11-03 | Tokyo Electron Limited | Method and apparatus for low pressure sputtering |
US6000603A (en) | 1997-05-23 | 1999-12-14 | 3M Innovative Properties Company | Patterned array of metal balls and methods of making |
US5977582A (en) | 1997-05-23 | 1999-11-02 | Lucent Technologies Inc. | Capacitor comprising improved TaOx -based dielectric |
US6316563B2 (en) | 1997-05-27 | 2001-11-13 | Showa Denko K.K. | Thermopolymerizable composition and use thereof |
US6077106A (en) | 1997-06-05 | 2000-06-20 | Micron Communications, Inc. | Thin profile battery mounting contact for printed circuit boards |
CN1203462A (zh) | 1997-06-20 | 1998-12-30 | 索尼株式会社 | 电池 |
US5865860A (en) | 1997-06-20 | 1999-02-02 | Imra America, Inc. | Process for filling electrochemical cells with electrolyte |
US6051114A (en) | 1997-06-23 | 2000-04-18 | Applied Materials, Inc. | Use of pulsed-DC wafer bias for filling vias/trenches with metal in HDP physical vapor deposition |
US5831262A (en) | 1997-06-27 | 1998-11-03 | Lucent Technologies Inc. | Article comprising an optical fiber attached to a micromechanical device |
JP3813740B2 (ja) | 1997-07-11 | 2006-08-23 | Tdk株式会社 | 電子デバイス用基板 |
US5982144A (en) | 1997-07-14 | 1999-11-09 | Johnson Research & Development Company, Inc. | Rechargeable battery power supply overcharge protection circuit |
JP3335884B2 (ja) | 1997-07-16 | 2002-10-21 | 株式会社荏原製作所 | 腐食・防食解析方法 |
US5973913A (en) | 1997-08-12 | 1999-10-26 | Covalent Associates, Inc. | Nonaqueous electrical storage device |
KR100250855B1 (ko) | 1997-08-28 | 2000-04-01 | 손욱 | 하이브리드 폴리머 전해질, 그 제조 방법 및 이를 사용하여제조한 리튬 전지 |
US6252564B1 (en) | 1997-08-28 | 2001-06-26 | E Ink Corporation | Tiled displays |
JPH11111273A (ja) | 1997-09-29 | 1999-04-23 | Furukawa Battery Co Ltd:The | リチウム二次電池用極板の製造法及びリチウム二次電池 |
US5916704A (en) | 1997-10-10 | 1999-06-29 | Ultralife Batteries | Low pressure battery vent |
EP1027723B1 (en) | 1997-10-14 | 2009-06-17 | Patterning Technologies Limited | Method of forming an electric capacitor |
US6094292A (en) | 1997-10-15 | 2000-07-25 | Trustees Of Tufts College | Electrochromic window with high reflectivity modulation |
US6982132B1 (en) | 1997-10-15 | 2006-01-03 | Trustees Of Tufts College | Rechargeable thin film battery and method for making the same |
US6084285A (en) * | 1997-10-20 | 2000-07-04 | The Board Of Trustees Of The Leland Stanford Junior University | Lateral flux capacitor having fractal-shaped perimeters |
WO1999021128A1 (en) * | 1997-10-22 | 1999-04-29 | Cambridge Consultants Limited | Portable ic card |
US5948562A (en) | 1997-11-03 | 1999-09-07 | Motorola, Inc. | Energy storage device |
US6041734A (en) | 1997-12-01 | 2000-03-28 | Applied Materials, Inc. | Use of an asymmetric waveform to control ion bombardment during substrate processing |
US6052397A (en) | 1997-12-05 | 2000-04-18 | Sdl, Inc. | Laser diode device having a substantially circular light output beam and a method of forming a tapered section in a semiconductor device to provide for a reproducible mode profile of the output beam |
US5976327A (en) * | 1997-12-12 | 1999-11-02 | Applied Materials, Inc. | Step coverage and overhang improvement by pedestal bias voltage modulation |
US6120890A (en) | 1997-12-12 | 2000-09-19 | Seagate Technology, Inc. | Magnetic thin film medium comprising amorphous sealing layer for reduced lithium migration |
US6042965A (en) | 1997-12-12 | 2000-03-28 | Johnson Research & Development Company, Inc. | Unitary separator and electrode structure and method of manufacturing separator |
US6045942A (en) | 1997-12-15 | 2000-04-04 | Avery Dennison Corporation | Low profile battery and method of making same |
US6019284A (en) | 1998-01-27 | 2000-02-01 | Viztec Inc. | Flexible chip card with display |
US6137671A (en) | 1998-01-29 | 2000-10-24 | Energenius, Inc. | Embedded energy storage device |
AU2233399A (en) | 1998-02-12 | 1999-08-30 | Acm Research, Inc. | Plating apparatus and method |
US6402795B1 (en) | 1998-02-18 | 2002-06-11 | Polyplus Battery Company, Inc. | Plating metal negative electrodes under protective coatings |
US6753108B1 (en) | 1998-02-24 | 2004-06-22 | Superior Micropowders, Llc | Energy devices and methods for the fabrication of energy devices |
US6223317B1 (en) | 1998-02-28 | 2001-04-24 | Micron Technology, Inc. | Bit synchronizers and methods of synchronizing and calculating error |
US6080508A (en) | 1998-03-06 | 2000-06-27 | Electrofuel Inc. | Packaging assembly for a lithium battery |
US6610440B1 (en) | 1998-03-10 | 2003-08-26 | Bipolar Technologies, Inc | Microscopic batteries for MEMS systems |
US6004660A (en) | 1998-03-12 | 1999-12-21 | E.I. Du Pont De Nemours And Company | Oxygen barrier composite film structure |
US5889383A (en) | 1998-04-03 | 1999-03-30 | Advanced Micro Devices, Inc. | System and method for charging batteries with ambient acoustic energy |
GB9808061D0 (en) | 1998-04-16 | 1998-06-17 | Cambridge Display Tech Ltd | Polymer devices |
US6563998B1 (en) | 1999-04-15 | 2003-05-13 | John Farah | Polished polymide substrate |
US6753114B2 (en) | 1998-04-20 | 2004-06-22 | Electrovaya Inc. | Composite electrolyte for a rechargeable lithium battery |
US6175075B1 (en) | 1998-04-21 | 2001-01-16 | Canon Kabushiki Kaisha | Solar cell module excelling in reliability |
US6169474B1 (en) * | 1998-04-23 | 2001-01-02 | Micron Technology, Inc. | Method of communications in a backscatter system, interrogator, and backscatter communications system |
US6459726B1 (en) | 1998-04-24 | 2002-10-01 | Micron Technology, Inc. | Backscatter interrogators, communication systems and backscatter communication methods |
US6324211B1 (en) | 1998-04-24 | 2001-11-27 | Micron Technology, Inc. | Interrogators communication systems communication methods and methods of processing a communication signal |
US6905578B1 (en) | 1998-04-27 | 2005-06-14 | Cvc Products, Inc. | Apparatus and method for multi-target physical-vapor deposition of a multi-layer material structure |
US6214061B1 (en) | 1998-05-01 | 2001-04-10 | Polyplus Battery Company, Inc. | Method for forming encapsulated lithium electrodes having glass protective layers |
US6420961B1 (en) | 1998-05-14 | 2002-07-16 | Micron Technology, Inc. | Wireless communication systems, interfacing devices, communication methods, methods of interfacing with an interrogator, and methods of operating an interrogator |
US6075973A (en) | 1998-05-18 | 2000-06-13 | Micron Technology, Inc. | Method of communications in a backscatter system, interrogator, and backscatter communications system |
US6115616A (en) | 1998-05-28 | 2000-09-05 | International Business Machines Corporation | Hand held telephone set with separable keyboard |
JP3126698B2 (ja) | 1998-06-02 | 2001-01-22 | 富士通株式会社 | スパッタ成膜方法、スパッタ成膜装置及び半導体装置の製造方法 |
US6093944A (en) | 1998-06-04 | 2000-07-25 | Lucent Technologies Inc. | Dielectric materials of amorphous compositions of TI-O2 doped with rare earth elements and devices employing same |
US7854684B1 (en) * | 1998-06-24 | 2010-12-21 | Samsung Electronics Co., Ltd. | Wearable device |
KR100287176B1 (ko) | 1998-06-25 | 2001-04-16 | 윤종용 | 고온산화를이용한반도체소자의커패시터형성방법 |
US6058233A (en) | 1998-06-30 | 2000-05-02 | Lucent Technologies Inc. | Waveguide array with improved efficiency for wavelength routers and star couplers in integrated optics |
GB9814123D0 (en) | 1998-07-01 | 1998-08-26 | British Gas Plc | Electrochemical fuel cell |
EP0969521A1 (de) | 1998-07-03 | 2000-01-05 | ISOVOLTAÖsterreichische IsolierstoffwerkeAktiengesellschaft | Fotovoltaischer Modul sowie ein Verfahren zu dessen Herstellung |
DE19831719A1 (de) * | 1998-07-15 | 2000-01-20 | Alcatel Sa | Verfahren zur Herstellung planarer Wellenleiterstrukturen sowie Wellenleiterstruktur |
US6358810B1 (en) * | 1998-07-28 | 2002-03-19 | Applied Materials, Inc. | Method for superior step coverage and interface control for high K dielectric capacitors and related electrodes |
US6146225A (en) | 1998-07-30 | 2000-11-14 | Agilent Technologies, Inc. | Transparent, flexible permeability barrier for organic electroluminescent devices |
US6129277A (en) | 1998-08-03 | 2000-10-10 | Privicon, Inc. | Card reader for transmission of data by sound |
US6579728B2 (en) | 1998-08-03 | 2003-06-17 | Privicom, Inc. | Fabrication of a high resolution, low profile credit card reader and card reader for transmission of data by sound |
US6160373A (en) | 1998-08-10 | 2000-12-12 | Dunn; James P. | Battery operated cableless external starting device and methods |
KR100305903B1 (ko) | 1998-08-21 | 2001-12-17 | 박호군 | 수직으로통합연결된박막형전지를구비하는전기및전자소자와그제작방법 |
JP2000067852A (ja) | 1998-08-21 | 2000-03-03 | Pioneer Electronic Corp | リチウム二次電池 |
JP3386756B2 (ja) | 1998-08-31 | 2003-03-17 | 松下電池工業株式会社 | 薄膜形成方法および薄膜形成装置 |
US6210832B1 (en) | 1998-09-01 | 2001-04-03 | Polyplus Battery Company, Inc. | Mixed ionic electronic conductor coatings for redox electrodes |
US6192222B1 (en) | 1998-09-03 | 2001-02-20 | Micron Technology, Inc. | Backscatter communication systems, interrogators, methods of communicating in a backscatter system, and backscatter communication methods |
JP4014737B2 (ja) | 1998-09-17 | 2007-11-28 | 昭和電工株式会社 | 熱重合性組成物及びその用途 |
US6236793B1 (en) | 1998-09-23 | 2001-05-22 | Molecular Optoelectronics Corporation | Optical channel waveguide amplifier |
US6362916B2 (en) | 1998-09-25 | 2002-03-26 | Fiver Laboratories | All fiber gain flattening optical filter |
US6159635A (en) | 1998-09-29 | 2000-12-12 | Electrofuel Inc. | Composite electrode including current collector |
KR100283954B1 (ko) | 1998-10-13 | 2001-03-02 | 윤종용 | 광증폭기용 광섬유 |
US7323634B2 (en) | 1998-10-14 | 2008-01-29 | Patterning Technologies Limited | Method of forming an electronic device |
KR100282487B1 (ko) | 1998-10-19 | 2001-02-15 | 윤종용 | 고유전 다층막을 이용한 셀 캐패시터 및 그 제조 방법 |
US6605228B1 (en) | 1998-10-19 | 2003-08-12 | Nhk Spring Co., Ltd. | Method for fabricating planar optical waveguide devices |
JP4126711B2 (ja) | 1998-10-23 | 2008-07-30 | ソニー株式会社 | 非水電解質電池 |
JP3830008B2 (ja) | 1998-10-30 | 2006-10-04 | ソニー株式会社 | 非水電解質電池 |
US6157765A (en) | 1998-11-03 | 2000-12-05 | Lucent Technologies | Planar waveguide optical amplifier |
KR100280705B1 (ko) | 1998-11-05 | 2001-03-02 | 김순택 | 리튬 이온 폴리머 전지용 전극 활물질 조성물 및 이를 이용한리튬 이온 폴리머 전지용 전극판의 제조방법 |
EP1049180A4 (en) | 1998-11-06 | 2004-08-11 | Japan Storage Battery Co Ltd | NON-AQUEOUS SECONDARY ELECTROLYTIC CELL |
EP1001666B1 (en) | 1998-11-09 | 2006-07-12 | Ballard Power Systems Inc. | Electrical contacting device for an electrochemical fuel cell |
US6117279A (en) | 1998-11-12 | 2000-09-12 | Tokyo Electron Limited | Method and apparatus for increasing the metal ion fraction in ionized physical vapor deposition |
US6384573B1 (en) | 1998-11-12 | 2002-05-07 | James Dunn | Compact lightweight auxiliary multifunctional reserve battery engine starting system (and methods) |
WO2000033409A1 (fr) | 1998-12-03 | 2000-06-08 | Sumitomo Electric Industries, Ltd. | Accumulateur au lithium |
US6268695B1 (en) | 1998-12-16 | 2001-07-31 | Battelle Memorial Institute | Environmental barrier material for organic light emitting device and method of making |
TW439308B (en) | 1998-12-16 | 2001-06-07 | Battelle Memorial Institute | Environmental barrier material for organic light emitting device and method of making |
JP2000188099A (ja) | 1998-12-22 | 2000-07-04 | Mitsubishi Chemicals Corp | 薄膜型電池の製造方法 |
US6599662B1 (en) | 1999-01-08 | 2003-07-29 | Massachusetts Institute Of Technology | Electroactive material for secondary batteries and methods of preparation |
GB9900396D0 (en) | 1999-01-08 | 1999-02-24 | Danionics As | Arrangements of electrochemical cells |
JP4074418B2 (ja) | 1999-01-11 | 2008-04-09 | 三菱化学株式会社 | 薄膜型リチウム二次電池 |
US6379835B1 (en) * | 1999-01-12 | 2002-04-30 | Morgan Adhesives Company | Method of making a thin film battery |
US6290822B1 (en) | 1999-01-26 | 2001-09-18 | Agere Systems Guardian Corp. | Sputtering method for forming dielectric films |
US6302939B1 (en) | 1999-02-01 | 2001-10-16 | Magnequench International, Inc. | Rare earth permanent magnet and method for making same |
US6306265B1 (en) | 1999-02-12 | 2001-10-23 | Applied Materials, Inc. | High-density plasma for ionized metal deposition capable of exciting a plasma wave |
EP1039552B1 (en) | 1999-02-25 | 2010-05-12 | Kaneka Corporation | Thin-film photoelectric conversion device and sputtering-deposition method |
US6210544B1 (en) | 1999-03-08 | 2001-04-03 | Alps Electric Co., Ltd. | Magnetic film forming method |
US6356764B1 (en) * | 1999-03-09 | 2002-03-12 | Micron Technology, Inc. | Wireless communication systems, interrogators and methods of communicating within a wireless communication system |
US6603391B1 (en) | 1999-03-09 | 2003-08-05 | Micron Technology, Inc. | Phase shifters, interrogators, methods of shifting a phase angle of a signal, and methods of operating an interrogator |
US6277520B1 (en) | 1999-03-19 | 2001-08-21 | Ntk Powerdex, Inc. | Thin lithium battery with slurry cathode |
US6280875B1 (en) | 1999-03-24 | 2001-08-28 | Teledyne Technologies Incorporated | Rechargeable battery structure with metal substrate |
DE69907866T2 (de) | 1999-03-25 | 2004-03-11 | Kaneka Corp. | Verfahren zum Herstellen von Dünnschicht-Solarzellen-Modulen |
US6160215A (en) | 1999-03-26 | 2000-12-12 | Curtin; Lawrence F. | Method of making photovoltaic device |
US6148503A (en) | 1999-03-31 | 2000-11-21 | Imra America, Inc. | Process of manufacturing porous separator for electrochemical power supply |
US6398824B1 (en) | 1999-04-02 | 2002-06-04 | Excellatron Solid State, Llc | Method for manufacturing a thin-film lithium battery by direct deposition of battery components on opposite sides of a current collector |
US6242129B1 (en) | 1999-04-02 | 2001-06-05 | Excellatron Solid State, Llc | Thin lithium film battery |
US6168884B1 (en) * | 1999-04-02 | 2001-01-02 | Lockheed Martin Energy Research Corporation | Battery with an in-situ activation plated lithium anode |
US6855441B1 (en) | 1999-04-14 | 2005-02-15 | Power Paper Ltd. | Functionally improved battery and method of making same |
IL145904A0 (en) | 1999-04-14 | 2002-07-25 | Power Paper Ltd | Functionally improved battery and method of making same |
US6416598B1 (en) | 1999-04-20 | 2002-07-09 | Reynolds Metals Company | Free machining aluminum alloy with high melting point machining constituent and method of use |
KR100296741B1 (ko) | 1999-05-11 | 2001-07-12 | 박호군 | 트렌치 구조를 갖는 전지 및 그 제조방법 |
JP3736205B2 (ja) | 1999-06-04 | 2006-01-18 | 三菱電機株式会社 | バッテリ蓄電装置 |
US6281142B1 (en) | 1999-06-04 | 2001-08-28 | Micron Technology, Inc. | Dielectric cure for reducing oxygen vacancies |
US6046081A (en) | 1999-06-10 | 2000-04-04 | United Microelectronics Corp. | Method for forming dielectric layer of capacitor |
US6133670A (en) | 1999-06-24 | 2000-10-17 | Sandia Corporation | Compact electrostatic comb actuator |
US6296741B1 (en) | 1999-06-25 | 2001-10-02 | International Business Machines Corporation | Method of making oxide barrier layer for a spin tunnel junction |
US6413676B1 (en) | 1999-06-28 | 2002-07-02 | Lithium Power Technologies, Inc. | Lithium ion polymer electrolytes |
JP2001020065A (ja) * | 1999-07-07 | 2001-01-23 | Hitachi Metals Ltd | スパッタリング用ターゲット及びその製造方法ならびに高融点金属粉末材料 |
JP2001021744A (ja) | 1999-07-07 | 2001-01-26 | Shin Etsu Chem Co Ltd | 光導波路基板の製造方法 |
JP2001025666A (ja) | 1999-07-14 | 2001-01-30 | Nippon Sheet Glass Co Ltd | 積層体およびその製造方法 |
US6290821B1 (en) | 1999-07-15 | 2001-09-18 | Seagate Technology Llc | Sputter deposition utilizing pulsed cathode and substrate bias power |
KR100456647B1 (ko) | 1999-08-05 | 2004-11-10 | 에스케이씨 주식회사 | 리튬 이온 폴리머 전지 |
US6249222B1 (en) | 1999-08-17 | 2001-06-19 | Lucent Technologies Inc. | Method and apparatus for generating color based alerting signals |
US6344795B1 (en) * | 1999-08-17 | 2002-02-05 | Lucent Technologies Inc. | Method and apparatus for generating temperature based alerting signals |
US6356230B1 (en) * | 1999-08-20 | 2002-03-12 | Micron Technology, Inc. | Interrogators, wireless communication systems, methods of operating an interrogator, methods of monitoring movement of a radio frequency identification device, methods of monitoring movement of a remote communication device and movement monitoring methods |
US6414626B1 (en) | 1999-08-20 | 2002-07-02 | Micron Technology, Inc. | Interrogators, wireless communication systems, methods of operating an interrogator, methods of operating a wireless communication system, and methods of determining range of a remote communication device |
US6645675B1 (en) | 1999-09-02 | 2003-11-11 | Lithium Power Technologies, Inc. | Solid polymer electrolytes |
US6664006B1 (en) | 1999-09-02 | 2003-12-16 | Lithium Power Technologies, Inc. | All-solid-state electrochemical device and method of manufacturing |
US6537428B1 (en) * | 1999-09-02 | 2003-03-25 | Veeco Instruments, Inc. | Stable high rate reactive sputtering |
US6392565B1 (en) | 1999-09-10 | 2002-05-21 | Eworldtrack, Inc. | Automobile tracking and anti-theft system |
US6528212B1 (en) | 1999-09-13 | 2003-03-04 | Sanyo Electric Co., Ltd. | Lithium battery |
US6344366B1 (en) | 1999-09-15 | 2002-02-05 | Lockheed Martin Energy Research Corporation | Fabrication of highly textured lithium cobalt oxide films by rapid thermal annealing |
US6296949B1 (en) | 1999-09-16 | 2001-10-02 | Ga-Tek Inc. | Copper coated polyimide with metallic protective layer |
JP4240679B2 (ja) | 1999-09-21 | 2009-03-18 | ソニー株式会社 | スパッタリング用ターゲットの製造方法 |
US6296967B1 (en) | 1999-09-24 | 2001-10-02 | Electrofuel Inc. | Lithium battery structure incorporating lithium pouch cells |
TW457767B (en) | 1999-09-27 | 2001-10-01 | Matsushita Electric Works Ltd | Photo response semiconductor switch having short circuit load protection |
US6368275B1 (en) | 1999-10-07 | 2002-04-09 | Acuson Corporation | Method and apparatus for diagnostic medical information gathering, hyperthermia treatment, or directed gene therapy |
DE19948839A1 (de) | 1999-10-11 | 2001-04-12 | Bps Alzenau Gmbh | Leitende transparente Schichten und Verfahren zu ihrer Herstellung |
US6500287B1 (en) | 1999-10-14 | 2002-12-31 | Forskarpatent I Uppsala Ab | Color-modifying treatment of thin films |
US7198832B2 (en) | 1999-10-25 | 2007-04-03 | Vitex Systems, Inc. | Method for edge sealing barrier films |
US6413645B1 (en) | 2000-04-20 | 2002-07-02 | Battelle Memorial Institute | Ultrabarrier substrates |
US6548912B1 (en) | 1999-10-25 | 2003-04-15 | Battelle Memorial Institute | Semicoductor passivation using barrier coatings |
US6866901B2 (en) | 1999-10-25 | 2005-03-15 | Vitex Systems, Inc. | Method for edge sealing barrier films |
US6573652B1 (en) | 1999-10-25 | 2003-06-03 | Battelle Memorial Institute | Encapsulated display devices |
US20070196682A1 (en) | 1999-10-25 | 2007-08-23 | Visser Robert J | Three dimensional multilayer barrier and method of making |
US6623861B2 (en) | 2001-04-16 | 2003-09-23 | Battelle Memorial Institute | Multilayer plastic substrates |
US6413284B1 (en) | 1999-11-01 | 2002-07-02 | Polyplus Battery Company | Encapsulated lithium alloy electrodes having barrier layers |
US6413285B1 (en) | 1999-11-01 | 2002-07-02 | Polyplus Battery Company | Layered arrangements of lithium electrodes |
US6271793B1 (en) | 1999-11-05 | 2001-08-07 | International Business Machines Corporation | Radio frequency (RF) transponder (Tag) with composite antenna |
CN1258830C (zh) | 1999-11-11 | 2006-06-07 | 皇家菲利浦电子有限公司 | 含凝胶电解质的锂电池 |
US6293688B1 (en) | 1999-11-12 | 2001-09-25 | Sparkolor Corporation | Tapered optical waveguide coupler |
JP3999424B2 (ja) | 1999-11-16 | 2007-10-31 | ローム株式会社 | 端子基板、端子基板を備えた電池パック、および端子基板の製造方法 |
US6733924B1 (en) | 1999-11-23 | 2004-05-11 | Moltech Corporation | Lithium anodes for electrochemical cells |
US6582481B1 (en) | 1999-11-23 | 2003-06-24 | Johnson Research & Development Company, Inc. | Method of producing lithium base cathodes |
US6210545B1 (en) | 1999-11-23 | 2001-04-03 | International Business Machines Corporation | Method for forming a perovskite thin film using a sputtering method with a fully oxidized perovskite target |
US6511516B1 (en) * | 2000-02-23 | 2003-01-28 | Johnson Research & Development Co., Inc. | Method and apparatus for producing lithium based cathodes |
US7247408B2 (en) | 1999-11-23 | 2007-07-24 | Sion Power Corporation | Lithium anodes for electrochemical cells |
US6797428B1 (en) | 1999-11-23 | 2004-09-28 | Moltech Corporation | Lithium anodes for electrochemical cells |
US6350353B2 (en) * | 1999-11-24 | 2002-02-26 | Applied Materials, Inc. | Alternate steps of IMP and sputtering process to improve sidewall coverage |
US6294288B1 (en) | 1999-12-01 | 2001-09-25 | Valence Technology, Inc. | Battery cell having notched layers |
CA2389347A1 (en) | 1999-12-02 | 2001-06-07 | Tony C. Kowalczyk | Photodefinition of optical devices |
US6344419B1 (en) * | 1999-12-03 | 2002-02-05 | Applied Materials, Inc. | Pulsed-mode RF bias for sidewall coverage improvement |
JP2001176464A (ja) | 1999-12-17 | 2001-06-29 | Sumitomo Electric Ind Ltd | 非水電解質電池 |
DE19961579A1 (de) * | 1999-12-21 | 2001-06-28 | Mann & Hummel Filter | Flüssigkeitsfilter mit einem Kühler |
US6426163B1 (en) | 1999-12-21 | 2002-07-30 | Alcatel | Electrochemical cell |
US6576546B2 (en) | 1999-12-22 | 2003-06-10 | Texas Instruments Incorporated | Method of enhancing adhesion of a conductive barrier layer to an underlying conductive plug and contact for ferroelectric applications |
US6534809B2 (en) | 1999-12-22 | 2003-03-18 | Agilent Technologies, Inc. | Hardmask designs for dry etching FeRAM capacitor stacks |
US6451177B1 (en) * | 2000-01-21 | 2002-09-17 | Applied Materials, Inc. | Vault shaped target and magnetron operable in two sputtering modes |
CN1307376A (zh) | 2000-01-27 | 2001-08-08 | 钟馨稼 | 一种可反复充放电的铬氟锂固体动力电池 |
US6372383B1 (en) | 2000-01-31 | 2002-04-16 | Korea Advanced Institute Of Science And Technology | Method for preparing electrodes for Ni/Metal hydride secondary cells using Cu |
US6271094B1 (en) | 2000-02-14 | 2001-08-07 | International Business Machines Corporation | Method of making MOSFET with high dielectric constant gate insulator and minimum overlap capacitance |
US6627056B2 (en) | 2000-02-16 | 2003-09-30 | Applied Materials, Inc. | Method and apparatus for ionized plasma deposition |
TW523615B (en) | 2000-02-17 | 2003-03-11 | L3 Optics Inc | Guided wave optical switch based on an active semiconductor amplifier and a passive optical component |
CN1152350C (zh) | 2000-02-18 | 2004-06-02 | 西帕克公司 | 识别和验证移动电子事务处理装置的持有者的方法和装置 |
EP1259992B1 (en) | 2000-02-23 | 2011-10-05 | SRI International | Biologically powered electroactive polymer generators |
TW584905B (en) * | 2000-02-25 | 2004-04-21 | Tokyo Electron Ltd | Method and apparatus for depositing films |
US6410471B2 (en) | 2000-03-07 | 2002-06-25 | Shin-Etsu Chemical Co., Ltd. | Method for preparation of sintered body of rare earth oxide |
KR20030028731A (ko) | 2000-03-09 | 2003-04-10 | 이조볼타외스터라이히세이졸리어스토프베르케아크티엔게젤샤프트 | 광전지 박막모듈을 제조하기 위한 공정 |
JP2001259494A (ja) | 2000-03-17 | 2001-09-25 | Matsushita Battery Industrial Co Ltd | 薄膜形成方法 |
AU5095601A (en) * | 2000-03-24 | 2001-10-08 | Cymbet Corp | Thin-film battery having ultra-thin electrolyte and associated method |
US6387563B1 (en) | 2000-03-28 | 2002-05-14 | Johnson Research & Development, Inc. | Method of producing a thin film battery having a protective packaging |
JP4106644B2 (ja) | 2000-04-04 | 2008-06-25 | ソニー株式会社 | 電池およびその製造方法 |
US6423106B1 (en) | 2000-04-05 | 2002-07-23 | Johnson Research & Development | Method of producing a thin film battery anode |
US6709778B2 (en) | 2000-04-10 | 2004-03-23 | Johnson Electro Mechanical Systems, Llc | Electrochemical conversion system |
GB2361244B (en) | 2000-04-14 | 2004-02-11 | Trikon Holdings Ltd | A method of depositing dielectric |
US6365319B1 (en) | 2000-04-20 | 2002-04-02 | Eastman Kodak Company | Self-contained imaging media comprising opaque laminated support |
US20010052752A1 (en) | 2000-04-25 | 2001-12-20 | Ghosh Amalkumar P. | Thin film encapsulation of organic light emitting diode devices |
KR100341407B1 (ko) | 2000-05-01 | 2002-06-22 | 윤덕용 | 플라즈마 처리에 의한 리튬전이금속 산화물 박막의 결정화방법 |
US6423776B1 (en) | 2000-05-02 | 2002-07-23 | Honeywell International Inc. | Oxygen scavenging high barrier polyamide compositions for packaging applications |
US6433465B1 (en) | 2000-05-02 | 2002-08-13 | The United States Of America As Represented By The Secretary Of The Navy | Energy-harvesting device using electrostrictive polymers |
US6261917B1 (en) | 2000-05-09 | 2001-07-17 | Chartered Semiconductor Manufacturing Ltd. | High-K MOM capacitor |
US6760520B1 (en) | 2000-05-09 | 2004-07-06 | Teralux Corporation | System and method for passively aligning and coupling optical devices |
DE10023459A1 (de) * | 2000-05-12 | 2001-11-15 | Balzers Process Systems Gmbh | Indium-Zinn-Oxid (ITO)-Schicht und Verfahren zur Herstellung derselben |
US6384473B1 (en) | 2000-05-16 | 2002-05-07 | Sandia Corporation | Microelectronic device package with an integral window |
JP4432206B2 (ja) | 2000-05-18 | 2010-03-17 | 株式会社ブリヂストン | 積層膜の形成方法 |
US6436156B1 (en) | 2000-05-25 | 2002-08-20 | The Gillette Company | Zinc/air cell |
EP1160900A3 (en) * | 2000-05-26 | 2007-12-12 | Kabushiki Kaisha Riken | Embossed current collector separator for electrochemical fuel cell |
US6284406B1 (en) | 2000-06-09 | 2001-09-04 | Ntk Powerdex, Inc. | IC card with thin battery |
US6524750B1 (en) * | 2000-06-17 | 2003-02-25 | Eveready Battery Company, Inc. | Doped titanium oxide additives |
US6432577B1 (en) | 2000-06-29 | 2002-08-13 | Sandia Corporation | Apparatus and method for fabricating a microbattery |
JP2002026173A (ja) | 2000-07-10 | 2002-01-25 | Fuji Photo Film Co Ltd | Ic装置、基板、およびic組付基板 |
US6524466B1 (en) * | 2000-07-18 | 2003-02-25 | Applied Semiconductor, Inc. | Method and system of preventing fouling and corrosion of biomedical devices and structures |
US20040247921A1 (en) | 2000-07-18 | 2004-12-09 | Dodsworth Robert S. | Etched dielectric film in hard disk drives |
JP3608507B2 (ja) | 2000-07-19 | 2005-01-12 | 住友電気工業株式会社 | アルカリ金属薄膜部材の製造方法 |
KR100336407B1 (ko) | 2000-07-19 | 2002-05-10 | 박호군 | 박막 전지를 위한 전해질용 리튬인산염 스퍼터링 타겟제조방법 |
US6402796B1 (en) | 2000-08-07 | 2002-06-11 | Excellatron Solid State, Llc | Method of producing a thin film battery |
US6506289B2 (en) * | 2000-08-07 | 2003-01-14 | Symmorphix, Inc. | Planar optical devices and methods for their manufacture |
US6538211B2 (en) | 2000-08-15 | 2003-03-25 | World Properties, Inc. | Multi-layer circuits and methods of manufacture thereof |
US6572173B2 (en) | 2000-08-28 | 2003-06-03 | Mueller Hermann-Frank | Sun shield for vehicles |
KR100387121B1 (ko) | 2000-08-31 | 2003-06-12 | 주식회사 애니셀 | 수직 방향으로 집적된 다층 박막전지 및 그의 제조방법 |
US6866963B2 (en) | 2000-09-04 | 2005-03-15 | Samsung Sdi Co., Ltd. | Cathode active material and lithium battery employing the same |
US7056620B2 (en) | 2000-09-07 | 2006-06-06 | Front Edge Technology, Inc. | Thin film battery and method of manufacture |
US6632563B1 (en) | 2000-09-07 | 2003-10-14 | Front Edge Technology, Inc. | Thin film battery and method of manufacture |
CN1516907A (zh) | 2000-09-14 | 2004-07-28 | ���Ͷ�����Ӧ�ü����о�Ժ | 电化学可活化的层或薄膜 |
US6628876B1 (en) | 2000-09-15 | 2003-09-30 | Triquint Technology Holding Co. | Method for making a planar waveguide |
TW448318B (en) | 2000-09-18 | 2001-08-01 | Nat Science Council | Erbium, Yttrium co-doped Titanium oxide thin film material for planar optical waveguide amplifier |
DE10165080B4 (de) * | 2000-09-20 | 2015-05-13 | Hitachi Metals, Ltd. | Siliciumnitrid-Pulver und -Sinterkörper sowie Verfahren zu deren Herstellung und Leiterplatte damit |
US6372098B1 (en) | 2000-09-28 | 2002-04-16 | The Boc Group, Inc. | High target utilization magnet array and associated methods |
US6637916B2 (en) | 2000-10-05 | 2003-10-28 | Muellner Hermann-Frank | Lamp for vehicles |
US6660660B2 (en) | 2000-10-10 | 2003-12-09 | Asm International, Nv. | Methods for making a dielectric stack in an integrated circuit |
JP4532713B2 (ja) | 2000-10-11 | 2010-08-25 | 東洋鋼鈑株式会社 | 多層金属積層フィルム及びその製造方法 |
KR100389655B1 (ko) | 2000-10-14 | 2003-06-27 | 삼성에스디아이 주식회사 | 우수한 사이클링 안정성과 높은 이온 전도도를 갖는리튬-이온 이차 박막 전지 |
US6622049B2 (en) | 2000-10-16 | 2003-09-16 | Remon Medical Technologies Ltd. | Miniature implantable illuminator for photodynamic therapy |
US20030044118A1 (en) | 2000-10-20 | 2003-03-06 | Phosistor Technologies, Inc. | Integrated planar composite coupling structures for bi-directional light beam transformation between a small mode size waveguide and a large mode size waveguide |
US6488822B1 (en) | 2000-10-20 | 2002-12-03 | Veecoleve, Inc. | Segmented-target ionized physical-vapor deposition apparatus and method of operation |
US6525976B1 (en) * | 2000-10-24 | 2003-02-25 | Excellatron Solid State, Llc | Systems and methods for reducing noise in mixed-mode integrated circuits |
US6413382B1 (en) | 2000-11-03 | 2002-07-02 | Applied Materials, Inc. | Pulsed sputtering with a small rotating magnetron |
US6863699B1 (en) | 2000-11-03 | 2005-03-08 | Front Edge Technology, Inc. | Sputter deposition of lithium phosphorous oxynitride material |
JP3812324B2 (ja) | 2000-11-06 | 2006-08-23 | 日本電気株式会社 | リチウム二次電池とその製造方法 |
US6494999B1 (en) | 2000-11-09 | 2002-12-17 | Honeywell International Inc. | Magnetron sputtering apparatus with an integral cooling and pressure relieving cathode |
DE60129196T2 (de) | 2000-11-18 | 2007-10-11 | Samsung SDI Co., Ltd., Suwon | Dünnschicht Anode für Lithium enthaltende Sekundärbatterie |
KR100389908B1 (ko) | 2000-11-18 | 2003-07-04 | 삼성에스디아이 주식회사 | 리튬 2차 전지용 음극 박막 |
US20020106297A1 (en) | 2000-12-01 | 2002-08-08 | Hitachi Metals, Ltd. | Co-base target and method of producing the same |
NL1016779C2 (nl) * | 2000-12-02 | 2002-06-04 | Cornelis Johannes Maria V Rijn | Matrijs, werkwijze voor het vervaardigen van precisieproducten met behulp van een matrijs, alsmede precisieproducten, in het bijzonder microzeven en membraanfilters, vervaardigd met een dergelijke matrijs. |
JP4461656B2 (ja) * | 2000-12-07 | 2010-05-12 | セイコーエプソン株式会社 | 光電変換素子 |
US20020091929A1 (en) | 2000-12-19 | 2002-07-11 | Jakob Ehrensvard | Secure digital signing of data |
US6444336B1 (en) | 2000-12-21 | 2002-09-03 | The Regents Of The University Of California | Thin film dielectric composite materials |
KR100863603B1 (ko) | 2000-12-21 | 2008-10-15 | 시온 파워 코퍼레이션 | 전기화학 셀용 리튬 애노드 |
JP2002203562A (ja) | 2000-12-28 | 2002-07-19 | Toshiba Corp | 非水電解質二次電池 |
US6620545B2 (en) | 2001-01-05 | 2003-09-16 | Visteon Global Technologies, Inc. | ETM based battery |
US6312274B1 (en) | 2001-01-12 | 2001-11-06 | Advanced Connectek Inc. | Electrical connector |
US6650000B2 (en) | 2001-01-16 | 2003-11-18 | International Business Machines Corporation | Apparatus and method for forming a battery in an integrated circuit |
US6533907B2 (en) * | 2001-01-19 | 2003-03-18 | Symmorphix, Inc. | Method of producing amorphous silicon for hard mask and waveguide applications |
US6673716B1 (en) * | 2001-01-30 | 2004-01-06 | Novellus Systems, Inc. | Control of the deposition temperature to reduce the via and contact resistance of Ti and TiN deposited using ionized PVD techniques |
US6558836B1 (en) | 2001-02-08 | 2003-05-06 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Structure of thin-film lithium microbatteries |
US6589299B2 (en) | 2001-02-13 | 2003-07-08 | 3M Innovative Properties Company | Method for making electrode |
US20020139662A1 (en) | 2001-02-21 | 2002-10-03 | Lee Brent W. | Thin-film deposition of low conductivity targets using cathodic ARC plasma process |
US20020164441A1 (en) | 2001-03-01 | 2002-11-07 | The University Of Chicago | Packaging for primary and secondary batteries |
JP2002258037A (ja) | 2001-03-05 | 2002-09-11 | Alps Electric Co Ltd | 積層膜を有する光フィルタおよびその製造方法 |
US6751241B2 (en) | 2001-09-27 | 2004-06-15 | Corning Incorporated | Multimode fiber laser gratings |
US7048400B2 (en) | 2001-03-22 | 2006-05-23 | Lumimove, Inc. | Integrated illumination system |
US7164206B2 (en) | 2001-03-28 | 2007-01-16 | Intel Corporation | Structure in a microelectronic device including a bi-layer for a diffusion barrier and an etch-stop layer |
US6797137B2 (en) | 2001-04-11 | 2004-09-28 | Heraeus, Inc. | Mechanically alloyed precious metal magnetic sputtering targets fabricated using rapidly solidfied alloy powders and elemental Pt metal |
US7595109B2 (en) | 2001-04-12 | 2009-09-29 | Eestor, Inc. | Electrical-energy-storage unit (EESU) utilizing ceramic and integrated-circuit technologies for replacement of electrochemical batteries |
US7914755B2 (en) | 2001-04-12 | 2011-03-29 | Eestor, Inc. | Method of preparing ceramic powders using chelate precursors |
US7033406B2 (en) | 2001-04-12 | 2006-04-25 | Eestor, Inc. | Electrical-energy-storage unit (EESU) utilizing ceramic and integrated-circuit technologies for replacement of electrochemical batteries |
US6677070B2 (en) | 2001-04-19 | 2004-01-13 | Hewlett-Packard Development Company, L.P. | Hybrid thin film/thick film solid oxide fuel cell and method of manufacturing the same |
US6782290B2 (en) | 2001-04-27 | 2004-08-24 | Medtronic, Inc. | Implantable medical device with rechargeable thin-film microbattery power source |
US7744735B2 (en) | 2001-05-04 | 2010-06-29 | Tokyo Electron Limited | Ionized PVD with sequential deposition and etching |
US6743488B2 (en) * | 2001-05-09 | 2004-06-01 | Cpfilms Inc. | Transparent conductive stratiform coating of indium tin oxide |
JP2002344115A (ja) | 2001-05-16 | 2002-11-29 | Matsushita Electric Ind Co Ltd | 成膜方法及びプリント基板の製造方法 |
US6650942B2 (en) | 2001-05-30 | 2003-11-18 | Medtronic, Inc. | Implantable medical device with dual cell power source |
US6517968B2 (en) | 2001-06-11 | 2003-02-11 | Excellatron Solid State, Llc | Thin lithium film battery |
US6752842B2 (en) | 2001-06-18 | 2004-06-22 | Power Paper Ltd. | Manufacture of flexible thin layer electrochemical cell |
JP3737389B2 (ja) | 2001-06-19 | 2006-01-18 | 京セラ株式会社 | バッテリー |
JP3929839B2 (ja) | 2001-06-28 | 2007-06-13 | 松下電器産業株式会社 | 電池及び電池パック |
US6768855B1 (en) | 2001-07-05 | 2004-07-27 | Sandia Corporation | Vertically-tapered optical waveguide and optical spot transformer formed therefrom |
US6549688B2 (en) | 2001-07-06 | 2003-04-15 | Redfern Integrated Optics Pty Ltd | Monolithically-integrated optical device and method of forming same |
US7469558B2 (en) | 2001-07-10 | 2008-12-30 | Springworks, Llc | As-deposited planar optical waveguides with low scattering loss and methods for their manufacture |
US20030029715A1 (en) * | 2001-07-25 | 2003-02-13 | Applied Materials, Inc. | An Apparatus For Annealing Substrates In Physical Vapor Deposition Systems |
US6758404B2 (en) * | 2001-08-03 | 2004-07-06 | General Instrument Corporation | Media cipher smart card |
US7335441B2 (en) | 2001-08-20 | 2008-02-26 | Power Paper Ltd. | Thin layer electrochemical cell with self-formed separator |
US7022431B2 (en) | 2001-08-20 | 2006-04-04 | Power Paper Ltd. | Thin layer electrochemical cell with self-formed separator |
US6500676B1 (en) | 2001-08-20 | 2002-12-31 | Honeywell International Inc. | Methods and apparatus for depositing magnetic films |
KR100382767B1 (ko) | 2001-08-25 | 2003-05-09 | 삼성에스디아이 주식회사 | 리튬 2차 전지용 음극 박막 및 그의 제조방법 |
US7242044B2 (en) | 2001-08-28 | 2007-07-10 | Tdk Corporation | Compositions for thin-film capacitance device, high-dielectric constant insulating film, thin-film capacitance device, and thin-film multilayer capacitor |
JP4775923B2 (ja) | 2001-08-30 | 2011-09-21 | キヤノン株式会社 | 弗化物の薄膜作成方法 |
EP1359636A1 (en) | 2001-09-03 | 2003-11-05 | Matsushita Electric Industrial Co., Ltd. | Method for manufacturing electrochemical device |
US7118825B2 (en) * | 2001-09-05 | 2006-10-10 | Omnitek Partners Llc | Conformal power supplies |
US6637906B2 (en) * | 2001-09-11 | 2003-10-28 | Recot, Inc. | Electroluminescent flexible film for product packaging |
TW560102B (en) | 2001-09-12 | 2003-11-01 | Itn Energy Systems Inc | Thin-film electrochemical devices on fibrous or ribbon-like substrates and methd for their manufacture and design |
WO2003022564A1 (en) | 2001-09-12 | 2003-03-20 | Itn Energy Systems, Inc. | Apparatus and method for the design and manufacture of multifunctional composite materials with power integration |
US6838209B2 (en) | 2001-09-21 | 2005-01-04 | Eveready Battery Company, Inc. | Flexible thin battery and method of manufacturing same |
US7115516B2 (en) | 2001-10-09 | 2006-10-03 | Applied Materials, Inc. | Method of depositing a material layer |
JP2003124491A (ja) | 2001-10-15 | 2003-04-25 | Sharp Corp | 薄膜太陽電池モジュール |
JP4015835B2 (ja) * | 2001-10-17 | 2007-11-28 | 松下電器産業株式会社 | 半導体記憶装置 |
FR2831318B1 (fr) | 2001-10-22 | 2006-06-09 | Commissariat Energie Atomique | Dispositif de stockage d'energie a recharge rapide, sous forme de films minces |
US6666982B2 (en) | 2001-10-22 | 2003-12-23 | Tokyo Electron Limited | Protection of dielectric window in inductively coupled plasma generation |
US6750156B2 (en) | 2001-10-24 | 2004-06-15 | Applied Materials, Inc. | Method and apparatus for forming an anti-reflective coating on a substrate |
KR100424637B1 (ko) | 2001-10-25 | 2004-03-24 | 삼성에스디아이 주식회사 | 리튬 이차 전지용 박막 전극 및 그 제조방법 |
JP3971911B2 (ja) * | 2001-10-29 | 2007-09-05 | 松下電器産業株式会社 | 固体リチウム二次電池およびその製造方法 |
US7404877B2 (en) | 2001-11-09 | 2008-07-29 | Springworks, Llc | Low temperature zirconia based thermal barrier layer by PVD |
US6805999B2 (en) | 2001-11-13 | 2004-10-19 | Midwest Research Institute | Buried anode lithium thin film battery and process for forming the same |
KR100425585B1 (ko) | 2001-11-22 | 2004-04-06 | 한국전자통신연구원 | 가교 고분자 보호박막을 갖춘 리튬 고분자 이차 전지 및그 제조 방법 |
US20030097858A1 (en) | 2001-11-26 | 2003-05-29 | Christof Strohhofer | Silver sensitized erbium ion doped planar waveguide amplifier |
US6830846B2 (en) | 2001-11-29 | 2004-12-14 | 3M Innovative Properties Company | Discontinuous cathode sheet halfcell web |
US20030109903A1 (en) | 2001-12-12 | 2003-06-12 | Epic Biosonics Inc. | Low profile subcutaneous enclosure |
US6683749B2 (en) * | 2001-12-19 | 2004-01-27 | Storage Technology Corporation | Magnetic transducer having inverted write element with zero delta in pole tip width |
US6737789B2 (en) | 2002-01-18 | 2004-05-18 | Leon J. Radziemski | Force activated, piezoelectric, electricity generation, storage, conditioning and supply apparatus and methods |
US20040081415A1 (en) | 2002-01-22 | 2004-04-29 | Demaray Richard E. | Planar optical waveguide amplifier with mode size converter |
US20030143853A1 (en) | 2002-01-31 | 2003-07-31 | Celii Francis G. | FeRAM capacitor stack etch |
JP3979859B2 (ja) * | 2002-02-07 | 2007-09-19 | 三洋電機株式会社 | リチウム二次電池用電極の製造方法 |
US20030152829A1 (en) | 2002-02-12 | 2003-08-14 | Ji-Guang Zhang | Thin lithium film battery |
JP3565207B2 (ja) | 2002-02-27 | 2004-09-15 | 日産自動車株式会社 | 電池パック |
US6713987B2 (en) | 2002-02-28 | 2004-03-30 | Front Edge Technology, Inc. | Rechargeable battery having permeable anode current collector |
US7081693B2 (en) | 2002-03-07 | 2006-07-25 | Microstrain, Inc. | Energy harvesting for wireless sensor operation and data transmission |
US6884327B2 (en) | 2002-03-16 | 2005-04-26 | Tao Pan | Mode size converter for a planar waveguide |
US20030174391A1 (en) | 2002-03-16 | 2003-09-18 | Tao Pan | Gain flattened optical amplifier |
US7378356B2 (en) | 2002-03-16 | 2008-05-27 | Springworks, Llc | Biased pulse DC reactive sputtering of oxide films |
US20030175142A1 (en) * | 2002-03-16 | 2003-09-18 | Vassiliki Milonopoulou | Rare-earth pre-alloyed PVD targets for dielectric planar applications |
US6885028B2 (en) | 2002-03-25 | 2005-04-26 | Sharp Kabushiki Kaisha | Transistor array and active-matrix substrate |
TWI283031B (en) | 2002-03-25 | 2007-06-21 | Epistar Corp | Method for integrating compound semiconductor with substrate of high thermal conductivity |
JP2003282142A (ja) | 2002-03-26 | 2003-10-03 | Matsushita Electric Ind Co Ltd | 薄膜積層体、薄膜電池、コンデンサ、及び薄膜積層体の製造方法と製造装置 |
US6792026B2 (en) | 2002-03-26 | 2004-09-14 | Joseph Reid Henrichs | Folded cavity solid-state laser |
KR100454092B1 (ko) | 2002-04-29 | 2004-10-26 | 광주과학기술원 | 급속 열처리법을 이용한 박막전지용 양극박막의 제조방법 |
DE10318187B4 (de) | 2002-05-02 | 2010-03-18 | Osram Opto Semiconductors Gmbh | Verkapselungsverfahren für organische Leuchtdiodenbauelemente |
US6949389B2 (en) | 2002-05-02 | 2005-09-27 | Osram Opto Semiconductors Gmbh | Encapsulation for organic light emitting diodes devices |
US6588836B1 (en) * | 2002-05-16 | 2003-07-08 | Albert Chong-Jen Lo | Chaise longue |
JP4043296B2 (ja) | 2002-06-13 | 2008-02-06 | 松下電器産業株式会社 | 全固体電池 |
US6700491B2 (en) | 2002-06-14 | 2004-03-02 | Sensormatic Electronics Corporation | Radio frequency identification tag with thin-film battery for antenna |
US7083270B2 (en) | 2002-06-20 | 2006-08-01 | Matsushita Electric Industrial Co., Ltd. | Piezoelectric element, ink jet head, angular velocity sensor, method for manufacturing the same, and ink jet recording apparatus |
US6780208B2 (en) | 2002-06-28 | 2004-08-24 | Hewlett-Packard Development Company, L.P. | Method of making printed battery structures |
US6818356B1 (en) | 2002-07-09 | 2004-11-16 | Oak Ridge Micro-Energy, Inc. | Thin film battery and electrolyte therefor |
US7410730B2 (en) | 2002-07-09 | 2008-08-12 | Oak Ridge Micro-Energy, Inc. | Thin film battery and electrolyte therefor |
US7362659B2 (en) * | 2002-07-11 | 2008-04-22 | Action Manufacturing Company | Low current microcontroller circuit |
US6835493B2 (en) | 2002-07-26 | 2004-12-28 | Excellatron Solid State, Llc | Thin film battery |
US6770176B2 (en) * | 2002-08-02 | 2004-08-03 | Itn Energy Systems. Inc. | Apparatus and method for fracture absorption layer |
JP2004071305A (ja) | 2002-08-05 | 2004-03-04 | Hitachi Maxell Ltd | 非水電解質二次電池 |
JP3729164B2 (ja) | 2002-08-05 | 2005-12-21 | 日産自動車株式会社 | 自動車用電池 |
US20070264564A1 (en) | 2006-03-16 | 2007-11-15 | Infinite Power Solutions, Inc. | Thin film battery on an integrated circuit or circuit board and method thereof |
US8236443B2 (en) | 2002-08-09 | 2012-08-07 | Infinite Power Solutions, Inc. | Metal film encapsulation |
US20080003496A1 (en) * | 2002-08-09 | 2008-01-03 | Neudecker Bernd J | Electrochemical apparatus with barrier layer protected substrate |
US8021778B2 (en) | 2002-08-09 | 2011-09-20 | Infinite Power Solutions, Inc. | Electrochemical apparatus with barrier layer protected substrate |
US8445130B2 (en) | 2002-08-09 | 2013-05-21 | Infinite Power Solutions, Inc. | Hybrid thin-film battery |
US6916679B2 (en) * | 2002-08-09 | 2005-07-12 | Infinite Power Solutions, Inc. | Methods of and device for encapsulation and termination of electronic devices |
US8431264B2 (en) | 2002-08-09 | 2013-04-30 | Infinite Power Solutions, Inc. | Hybrid thin-film battery |
US8394522B2 (en) | 2002-08-09 | 2013-03-12 | Infinite Power Solutions, Inc. | Robust metal film encapsulation |
KR20040017478A (ko) | 2002-08-21 | 2004-02-27 | 한국과학기술원 | 인쇄회로기판의 제조방법 및 다층 인쇄회로기판 |
US7826702B2 (en) | 2002-08-27 | 2010-11-02 | Springworks, Llc | Optically coupling into highly uniform waveguides |
US20040048157A1 (en) * | 2002-09-11 | 2004-03-11 | Neudecker Bernd J. | Lithium vanadium oxide thin-film battery |
US6994933B1 (en) | 2002-09-16 | 2006-02-07 | Oak Ridge Micro-Energy, Inc. | Long life thin film battery and method therefor |
US20040081860A1 (en) | 2002-10-29 | 2004-04-29 | Stmicroelectronics, Inc. | Thin-film battery equipment |
JP2004149849A (ja) | 2002-10-30 | 2004-05-27 | Hitachi Chem Co Ltd | 金属薄膜の形成方法及び電極付基板 |
US20040085002A1 (en) | 2002-11-05 | 2004-05-06 | Pearce Michael Baker | Method and apparatus for an incidental use piezoelectric energy source with thin-film battery |
JP2004158268A (ja) | 2002-11-06 | 2004-06-03 | Sony Corp | 成膜装置 |
JP2006505973A (ja) | 2002-11-07 | 2006-02-16 | フラクタス・ソシエダッド・アノニマ | 微小アンテナを含む集積回路パッケージ |
KR100682883B1 (ko) | 2002-11-27 | 2007-02-15 | 삼성전자주식회사 | 고체 전해질, 그의 제조방법 및 이를 채용한 리튬전지 및 박막전지 |
JP4777593B2 (ja) | 2002-11-29 | 2011-09-21 | 株式会社オハラ | リチウムイオン二次電池の製造方法 |
EP1431422B1 (de) | 2002-12-16 | 2006-12-13 | Basf Aktiengesellschaft | Verfahren zur Gewinnung von Lithium |
JP4072049B2 (ja) | 2002-12-25 | 2008-04-02 | 京セラ株式会社 | 燃料電池セル及び燃料電池 |
TWI261045B (en) | 2002-12-30 | 2006-09-01 | Ind Tech Res Inst | Composite nanofibers and their fabrications |
US6906436B2 (en) | 2003-01-02 | 2005-06-14 | Cymbet Corporation | Solid state activity-activated battery device and method |
US7067197B2 (en) | 2003-01-07 | 2006-06-27 | Cabot Corporation | Powder metallurgy sputtering targets and methods of producing same |
IL153895A (en) | 2003-01-12 | 2013-01-31 | Orion Solar Systems Ltd | Solar cell device |
KR100513726B1 (ko) | 2003-01-30 | 2005-09-08 | 삼성전자주식회사 | 고체 전해질, 이를 채용한 전지 및 그 고체 전해질의 제조방법 |
DE10304824A1 (de) | 2003-01-31 | 2004-08-12 | Varta Microbattery Gmbh | Dünne elektronische Chipkarte |
RU2241281C2 (ru) | 2003-02-10 | 2004-11-27 | Институт химии и химической технологии СО РАН | Способ получения тонких пленок кобальтата лития |
JP2004273436A (ja) | 2003-02-18 | 2004-09-30 | Matsushita Electric Ind Co Ltd | 全固体薄膜積層電池 |
US7205662B2 (en) * | 2003-02-27 | 2007-04-17 | Symmorphix, Inc. | Dielectric barrier layer films |
US6936407B2 (en) | 2003-02-28 | 2005-08-30 | Osram Opto Semiconductors Gmbh | Thin-film electronic device module |
KR100590376B1 (ko) | 2003-03-20 | 2006-06-19 | 마쯔시다덴기산교 가부시키가이샤 | 집합전지 |
CN1274052C (zh) | 2003-03-21 | 2006-09-06 | 比亚迪股份有限公司 | 锂离子二次电池的制造方法 |
US6845198B2 (en) | 2003-03-25 | 2005-01-18 | Sioptical, Inc. | High-speed silicon-based electro-optic modulator |
US6955986B2 (en) | 2003-03-27 | 2005-10-18 | Asm International N.V. | Atomic layer deposition methods for forming a multi-layer adhesion-barrier layer for integrated circuits |
US20070141468A1 (en) | 2003-04-03 | 2007-06-21 | Jeremy Barker | Electrodes Comprising Mixed Active Particles |
EP1632999B1 (en) | 2003-04-04 | 2011-03-30 | Panasonic Corporation | Battery mounted integrated circuit device |
WO2004093223A2 (en) | 2003-04-14 | 2004-10-28 | Massachusetts Institute Of Technology | Integrated thin film batteries on silicon integrated circuits |
KR100508945B1 (ko) | 2003-04-17 | 2005-08-17 | 삼성에스디아이 주식회사 | 리튬 전지용 음극, 그의 제조 방법 및 그를 포함하는 리튬전지 |
US7088031B2 (en) | 2003-04-22 | 2006-08-08 | Infinite Power Solutions, Inc. | Method and apparatus for an ambient energy battery or capacitor recharge system |
US7045246B2 (en) | 2003-04-22 | 2006-05-16 | The Aerospace Corporation | Integrated thin film battery and circuit module |
JP2004335192A (ja) * | 2003-05-02 | 2004-11-25 | Sony Corp | 正極の製造方法および電池の製造方法 |
US6936377B2 (en) | 2003-05-13 | 2005-08-30 | C. Glen Wensley | Card with embedded IC and electrochemical cell |
US8728285B2 (en) * | 2003-05-23 | 2014-05-20 | Demaray, Llc | Transparent conductive oxides |
US7238628B2 (en) | 2003-05-23 | 2007-07-03 | Symmorphix, Inc. | Energy conversion and storage films and devices by physical vapor deposition of titanium and titanium oxides and sub-oxides |
US6886240B2 (en) | 2003-07-11 | 2005-05-03 | Excellatron Solid State, Llc | Apparatus for producing thin-film electrolyte |
US6852139B2 (en) | 2003-07-11 | 2005-02-08 | Excellatron Solid State, Llc | System and method of producing thin-film electrolyte |
WO2005024091A1 (ja) | 2003-09-03 | 2005-03-17 | Nikko Materials Co., Ltd. | スパッタリング用ターゲット |
US20050070097A1 (en) | 2003-09-29 | 2005-03-31 | International Business Machines Corporation | Atomic laminates for diffusion barrier applications |
US7230321B2 (en) | 2003-10-13 | 2007-06-12 | Mccain Joseph | Integrated circuit package with laminated power cell having coplanar electrode |
US20050079418A1 (en) | 2003-10-14 | 2005-04-14 | 3M Innovative Properties Company | In-line deposition processes for thin film battery fabrication |
US7211351B2 (en) | 2003-10-16 | 2007-05-01 | Cymbet Corporation | Lithium/air batteries with LiPON as separator and protective barrier and method |
FR2861218B1 (fr) | 2003-10-16 | 2007-04-20 | Commissariat Energie Atomique | Couche et procede de protection de microbatteries par une bicouche ceramique-metal |
US20050105853A1 (en) | 2003-11-13 | 2005-05-19 | Ansheng Liu | Method and apparatus for dual tapering an optical waveguide |
US20050133361A1 (en) | 2003-12-12 | 2005-06-23 | Applied Materials, Inc. | Compensation of spacing between magnetron and sputter target |
EP1544917A1 (en) | 2003-12-15 | 2005-06-22 | Dialog Semiconductor GmbH | Integrated battery pack with lead frame connection |
JP2005196971A (ja) | 2003-12-26 | 2005-07-21 | Matsushita Electric Ind Co Ltd | リチウム二次電池用負極とその製造方法ならびにリチウム二次電池 |
KR20070024473A (ko) | 2004-01-06 | 2007-03-02 | 사임베트 코퍼레이션 | 층상 배리어구조와 그 형성방법 |
TWI302760B (en) | 2004-01-15 | 2008-11-01 | Lg Chemical Ltd | Electrochemical device comprising aliphatic nitrile compound |
JP3859645B2 (ja) | 2004-01-16 | 2006-12-20 | Necラミリオンエナジー株式会社 | フィルム外装電気デバイス |
US7968233B2 (en) | 2004-02-18 | 2011-06-28 | Solicore, Inc. | Lithium inks and electrodes and batteries made therefrom |
US7624499B2 (en) | 2004-02-26 | 2009-12-01 | Hei, Inc. | Flexible circuit having an integrally formed battery |
DE102004010892B3 (de) | 2004-03-06 | 2005-11-24 | Christian-Albrechts-Universität Zu Kiel | Chemisch stabiler fester Lithiumionenleiter |
JP4418262B2 (ja) | 2004-03-12 | 2010-02-17 | 三井造船株式会社 | 基板・マスク固定装置 |
US7340124B2 (en) | 2004-04-07 | 2008-03-04 | Avago Technologies Fiber Ip Pte Ltd | Optical switch using rare earth doped glass |
US7052741B2 (en) | 2004-05-18 | 2006-05-30 | The United States Of America As Represented By The Secretary Of The Navy | Method of fabricating a fibrous structure for use in electrochemical applications |
US20070263676A1 (en) | 2004-06-24 | 2007-11-15 | Koheras A/S | System Comprising a Low Phase Noise Waveguide Laser, a Method of Its Manufacturing and Its Use |
US7195950B2 (en) * | 2004-07-21 | 2007-03-27 | Hewlett-Packard Development Company, L.P. | Forming a plurality of thin-film devices |
US7645246B2 (en) | 2004-08-11 | 2010-01-12 | Omnitek Partners Llc | Method for generating power across a joint of the body during a locomotion cycle |
JP4892180B2 (ja) | 2004-08-20 | 2012-03-07 | セイコーインスツル株式会社 | 電気化学セル、その製造方法およびその外観検査方法 |
CN101073171B (zh) | 2004-12-08 | 2010-09-22 | 希莫菲克斯公司 | LiCoO2的沉积 |
US7959769B2 (en) | 2004-12-08 | 2011-06-14 | Infinite Power Solutions, Inc. | Deposition of LiCoO2 |
KR101127370B1 (ko) | 2004-12-08 | 2012-03-29 | 인피니트 파워 솔루션스, 인크. | LiCoO2의 증착 |
US7670724B1 (en) | 2005-01-05 | 2010-03-02 | The United States Of America As Represented By The Secretary Of The Army | Alkali-hydroxide modified poly-vinylidene fluoride/polyethylene oxide lithium-air battery |
US20060155545A1 (en) | 2005-01-11 | 2006-07-13 | Hosanna, Inc. | Multi-source powered audio playback system |
WO2006078866A2 (en) | 2005-01-19 | 2006-07-27 | Arizona Board Of Regents, Acting For And On Behalf Of Arizona State University | Electric current-producing device having sulfone-based electrolyte |
DE102005014427B4 (de) | 2005-03-24 | 2008-05-15 | Infineon Technologies Ag | Verfahren zum Verkapseln eines Halbleiterbauelements |
EP1713024A1 (en) | 2005-04-14 | 2006-10-18 | Ngk Spark Plug Co., Ltd. | A card, a method of manufacturing the card, and a thin type battery for the card |
US20060237543A1 (en) | 2005-04-20 | 2006-10-26 | Ngk Spark Plug Co., Ltd. | Card, manufacturing method of card, and thin type battery for card |
US8182661B2 (en) | 2005-07-27 | 2012-05-22 | Applied Materials, Inc. | Controllable target cooling |
US7400253B2 (en) | 2005-08-04 | 2008-07-15 | Mhcmos, Llc | Harvesting ambient radio frequency electromagnetic energy for powering wireless electronic devices, sensors and sensor networks and applications thereof |
CN101313426B (zh) | 2005-08-09 | 2012-12-12 | 波利普拉斯电池有限公司 | 用于被保护的活性金属阳极的适应性密封结构 |
US7838133B2 (en) | 2005-09-02 | 2010-11-23 | Springworks, Llc | Deposition of perovskite and other compound ceramic films for dielectric applications |
US7202825B2 (en) | 2005-09-15 | 2007-04-10 | Motorola, Inc. | Wireless communication device with integrated battery/antenna system |
US7345647B1 (en) | 2005-10-05 | 2008-03-18 | Sandia Corporation | Antenna structure with distributed strip |
DE102006009789B3 (de) | 2006-03-01 | 2007-10-04 | Infineon Technologies Ag | Verfahren zur Herstellung eines Halbleiterbauteils aus einer Verbundplatte mit Halbleiterchips und Kunststoffgehäusemasse |
US8155712B2 (en) | 2006-03-23 | 2012-04-10 | Sibeam, Inc. | Low power very high-data rate device |
DE102006025671B4 (de) | 2006-06-01 | 2011-12-15 | Infineon Technologies Ag | Verfahren zur Herstellung von dünnen integrierten Halbleitereinrichtungen |
JP4058456B2 (ja) | 2006-10-23 | 2008-03-12 | 富士通株式会社 | 情報処理装置用機能拡張装置 |
DE102006054309A1 (de) | 2006-11-17 | 2008-05-21 | Dieter Teckhaus | Batteriezelle mit Kontaktelementenanordnung |
JP4466668B2 (ja) | 2007-03-20 | 2010-05-26 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
US7915089B2 (en) | 2007-04-10 | 2011-03-29 | Infineon Technologies Ag | Encapsulation method |
DE102007030604A1 (de) | 2007-07-02 | 2009-01-08 | Weppner, Werner, Prof. Dr. | Ionenleiter mit Granatstruktur |
CN101911367B (zh) | 2008-01-11 | 2015-02-25 | 无穷动力解决方案股份有限公司 | 用于薄膜电池及其他器件的薄膜包封 |
CN102119454B (zh) * | 2008-08-11 | 2014-07-30 | 无穷动力解决方案股份有限公司 | 具有用于电磁能量收集的一体收集器表面的能量设备及其方法 |
US8389160B2 (en) | 2008-10-07 | 2013-03-05 | Envia Systems, Inc. | Positive electrode materials for lithium ion batteries having a high specific discharge capacity and processes for the synthesis of these materials |
-
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8728285B2 (en) | 2003-05-23 | 2014-05-20 | Demaray, Llc | Transparent conductive oxides |
US8636876B2 (en) | 2004-12-08 | 2014-01-28 | R. Ernest Demaray | Deposition of LiCoO2 |
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KR20070102761A (ko) | 2007-10-19 |
CN101931097B (zh) | 2012-11-21 |
DE602005017512D1 (de) | 2009-12-17 |
US20180331349A1 (en) | 2018-11-15 |
EP1825545A4 (en) | 2008-03-26 |
US9887414B2 (en) | 2018-02-06 |
WO2006063308A2 (en) | 2006-06-15 |
US20140102878A1 (en) | 2014-04-17 |
EP1825545A2 (en) | 2007-08-29 |
US8636876B2 (en) | 2014-01-28 |
WO2006063308A3 (en) | 2006-11-30 |
TWI331634B (en) | 2010-10-11 |
ATE447777T1 (de) | 2009-11-15 |
TW200808990A (en) | 2008-02-16 |
US20060134522A1 (en) | 2006-06-22 |
TWI346403B (en) | 2011-08-01 |
TW200635113A (en) | 2006-10-01 |
JP2008523567A (ja) | 2008-07-03 |
CN101931097A (zh) | 2010-12-29 |
KR101021536B1 (ko) | 2011-03-16 |
EP1825545B1 (en) | 2009-11-04 |
KR101127370B1 (ko) | 2012-03-29 |
KR20070086668A (ko) | 2007-08-27 |
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