JP4988202B2 - 工作物の支持及び熱処理の方法とシステム - Google Patents

工作物の支持及び熱処理の方法とシステム Download PDF

Info

Publication number
JP4988202B2
JP4988202B2 JP2005502515A JP2005502515A JP4988202B2 JP 4988202 B2 JP4988202 B2 JP 4988202B2 JP 2005502515 A JP2005502515 A JP 2005502515A JP 2005502515 A JP2005502515 A JP 2005502515A JP 4988202 B2 JP4988202 B2 JP 4988202B2
Authority
JP
Japan
Prior art keywords
workpiece
support
support member
wafer
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2005502515A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006511970A5 (enExample
JP2006511970A (ja
Inventor
カム、デビッド、マルコム
センペレ、ギヨーム
カルドジェルシク、リュボミル
スチュアート、グレゴリー
バンブロヴィク、ムラデン
トラン、ティム
ジェツ、セルギー
コマサ、トニー
ルドルフ、マーク
シベール、ジョセフ
Original Assignee
マトソン テクノロジー カナダ インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by マトソン テクノロジー カナダ インコーポレイテッド filed Critical マトソン テクノロジー カナダ インコーポレイテッド
Publication of JP2006511970A publication Critical patent/JP2006511970A/ja
Publication of JP2006511970A5 publication Critical patent/JP2006511970A5/ja
Application granted granted Critical
Publication of JP4988202B2 publication Critical patent/JP4988202B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
JP2005502515A 2002-12-20 2003-12-19 工作物の支持及び熱処理の方法とシステム Expired - Lifetime JP4988202B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US43467002P 2002-12-20 2002-12-20
US60/434,670 2002-12-20
US46865903P 2003-05-08 2003-05-08
US60/468,659 2003-05-08
PCT/CA2003/001959 WO2004057650A1 (en) 2002-12-20 2003-12-19 Methods and systems for supporting a workpiece and for heat-treating the workpiece

Publications (3)

Publication Number Publication Date
JP2006511970A JP2006511970A (ja) 2006-04-06
JP2006511970A5 JP2006511970A5 (enExample) 2007-02-08
JP4988202B2 true JP4988202B2 (ja) 2012-08-01

Family

ID=32685329

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005502515A Expired - Lifetime JP4988202B2 (ja) 2002-12-20 2003-12-19 工作物の支持及び熱処理の方法とシステム

Country Status (7)

Country Link
US (2) US9627244B2 (enExample)
JP (1) JP4988202B2 (enExample)
KR (2) KR20120045040A (enExample)
CN (1) CN1729554B (enExample)
AU (1) AU2003287837A1 (enExample)
DE (1) DE10393962B4 (enExample)
WO (1) WO2004057650A1 (enExample)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7445382B2 (en) 2001-12-26 2008-11-04 Mattson Technology Canada, Inc. Temperature measurement and heat-treating methods and system
US9627244B2 (en) 2002-12-20 2017-04-18 Mattson Technology, Inc. Methods and systems for supporting a workpiece and for heat-treating the workpiece
JP5630935B2 (ja) 2003-12-19 2014-11-26 マトソン テクノロジー、インコーポレイテッド 工作物の熱誘起運動を抑制する機器及び装置
US7781947B2 (en) * 2004-02-12 2010-08-24 Mattson Technology Canada, Inc. Apparatus and methods for producing electromagnetic radiation
US7642205B2 (en) 2005-04-08 2010-01-05 Mattson Technology, Inc. Rapid thermal processing using energy transfer layers
US7745762B2 (en) * 2005-06-01 2010-06-29 Mattson Technology, Inc. Optimizing the thermal budget during a pulsed heating process
CN101288035B (zh) 2005-09-14 2013-06-19 马特森技术有限公司 可重复热处理的方法和设备
US7184657B1 (en) 2005-09-17 2007-02-27 Mattson Technology, Inc. Enhanced rapid thermal processing apparatus and method
US20080105201A1 (en) * 2006-11-03 2008-05-08 Applied Materials, Inc. Substrate support components having quartz contact tips
JP5967859B2 (ja) * 2006-11-15 2016-08-10 マトソン テクノロジー、インコーポレイテッド 熱処理中の被加工物を支持するシステムおよび方法
JP2010525581A (ja) * 2007-05-01 2010-07-22 マトソン テクノロジー カナダ インコーポレイテッド 照射パルス熱処理方法および装置
CN102089873A (zh) 2008-05-16 2011-06-08 加拿大马特森技术有限公司 工件破损防止方法及设备
US8186661B2 (en) * 2008-09-16 2012-05-29 Memc Electronic Materials, Inc. Wafer holder for supporting a semiconductor wafer during a thermal treatment process
JP5543123B2 (ja) * 2009-03-30 2014-07-09 大日本スクリーン製造株式会社 熱処理用サセプタおよび熱処理装置
JP5545090B2 (ja) * 2010-07-13 2014-07-09 株式会社Ｓｕｍｃｏ ウェーハ支持治具及び軸状部材並びにシリコンウェーハの熱処理方法
US9279727B2 (en) 2010-10-15 2016-03-08 Mattson Technology, Inc. Methods, apparatus and media for determining a shape of an irradiance pulse to which a workpiece is to be exposed
JP2014093420A (ja) * 2012-11-02 2014-05-19 Toyota Motor Corp ウェハを支持ディスクに接着する治具、および、それを用いた半導体装置の製造方法
JP5475900B1 (ja) * 2013-03-01 2014-04-16 坂口電熱株式会社 加熱装置
US9497803B2 (en) * 2014-02-03 2016-11-15 Plansee Se Supporting system for a heating element and heating system
JP6369297B2 (ja) * 2014-11-12 2018-08-08 株式会社Sumco 半導体ウェーハの支持方法及びその支持装置
KR102365819B1 (ko) 2015-07-17 2022-02-21 삼성전자주식회사 웨이퍼 클램핑 장치
WO2017030873A1 (en) 2015-08-14 2017-02-23 M Cubed Technologies, Inc. Wafer chuck featuring reduced friction support surface
US20170140975A1 (en) * 2015-11-17 2017-05-18 Semes Co., Ltd. Spin head, apparatus and method for treating a substrate including the spin head
JP6633199B2 (ja) * 2015-12-30 2020-01-22 マットソン テクノロジー インコーポレイテッドＭａｔｔｓｏｎ Ｔｅｃｈｎｏｌｏｇｙ， Ｉｎｃ． ミリ秒アニールシステムにおける基板支持
US20170361380A1 (en) * 2016-06-17 2017-12-21 Baker Hughes Incorporated Tail stock for a long vertically suspended workpiece that will experience heat expansion
US11193178B2 (en) 2017-08-16 2021-12-07 Beijing E-town Semiconductor Technology Co., Ltd. Thermal processing of closed shape workpieces
DE102018102766B4 (de) * 2018-02-07 2019-10-31 Uwe Beier Trägervorrichtung für ein flaches Substrat und Anordnung aus einer Handhabungsvorrichtung und einer solchen Trägervorrichtung
KR102425734B1 (ko) 2018-03-20 2022-07-28 매슨 테크놀로지 인크 열처리 시스템에서의 국부적인 가열을 위한 지지 플레이트
CN113471046B (zh) 2020-12-14 2023-06-20 北京屹唐半导体科技股份有限公司 具有等离子体处理系统和热处理系统的工件处理装置
US12352306B2 (en) 2020-12-28 2025-07-08 Beijing E-town Semiconductor Technology Co., Ltd. Workpiece support for a thermal processing system
USD1059311S1 (en) * 2021-08-13 2025-01-28 Asm Ip Holding B.V. Reaction chamber base plate
JP2023044180A (ja) 2021-09-17 2023-03-30 株式会社Ｓｃｒｅｅｎホールディングス 熱処理用サセプタ、および、熱処理装置

Family Cites Families (312)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2981819A (en) 1961-04-25 Heater construction for kiln or other apparatus
USRE24296E (en) 1957-03-26 Apparatus for infra-red cooking
US1587023A (en) 1922-02-17 1926-06-01 Mecky Company A Multiple-reflector single-unit combined toaster and cooker
NL246576A (enExample) 1954-05-18 1900-01-01
NL251614A (enExample) 1959-05-28 1900-01-01
US3108173A (en) 1960-07-22 1963-10-22 Lakeshire Products Inc Infra-red heating apparatus
US3160517A (en) 1961-11-13 1964-12-08 Union Carbide Corp Method of depositing metals and metallic compounds throughout the pores of a porous body
US3213827A (en) 1962-03-13 1965-10-26 Union Carbide Corp Apparatus for gas plating bulk material to metallize the same
US3240915A (en) 1962-09-19 1966-03-15 Fostoria Corp Infra-red heater
US3227065A (en) 1963-06-07 1966-01-04 Alan L Litman Waterless egg cooker
US3239651A (en) 1963-08-21 1966-03-08 Ekco Products Company Heating unit
US3502516A (en) 1964-11-06 1970-03-24 Siemens Ag Method for producing pure semiconductor material for electronic purposes
US3460510A (en) 1966-05-12 1969-08-12 Dow Corning Large volume semiconductor coating reactor
US3627590A (en) 1968-12-02 1971-12-14 Western Electric Co Method for heat treatment of workpieces
DE1900116C3 (de) 1969-01-02 1978-10-19 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum Herstellen hxxochreiner, aus Silicium bestehender einkristalliner Schichten
US3610613A (en) 1969-03-17 1971-10-05 Worden Quartz Products Inc Quartz holder for supporting wafers
US3692572A (en) 1969-08-12 1972-09-19 Wolfgang Strehlow Epitaxial film process and products thereof
US3623712A (en) 1969-10-15 1971-11-30 Applied Materials Tech Epitaxial radiation heated reactor and process
US3700850A (en) 1970-09-04 1972-10-24 Western Electric Co Method for detecting the amount of material removed by a laser
US3913872A (en) 1973-01-18 1975-10-21 Bell & Howell Co Light tunnel for uniformly illuminating an object
US3836751A (en) 1973-07-26 1974-09-17 Applied Materials Inc Temperature controlled profiling heater
GB1485908A (en) 1974-05-21 1977-09-14 Nath G Apparatus for applying light radiation
US4027185A (en) 1974-06-13 1977-05-31 Canadian Patents And Development Limited High intensity radiation source
US4151008A (en) 1974-11-15 1979-04-24 Spire Corporation Method involving pulsed light processing of semiconductor devices
US4081313A (en) 1975-01-24 1978-03-28 Applied Materials, Inc. Process for preparing semiconductor wafers with substantially no crystallographic slip
US4041278A (en) 1975-05-19 1977-08-09 General Electric Company Heating apparatus for temperature gradient zone melting
US4115163A (en) 1976-01-08 1978-09-19 Yulia Ivanovna Gorina Method of growing epitaxial semiconductor films utilizing radiant heating
CA1095387A (en) 1976-02-17 1981-02-10 Conrad M. Banas Skin melting
US4224096A (en) 1976-03-25 1980-09-23 W. R. Grace & Co. Laser sealing of thermoplastic material
US4097226A (en) 1976-10-26 1978-06-27 General Electric Company Furnace for practising temperature gradient zone melting
US4101759A (en) 1976-10-26 1978-07-18 General Electric Company Semiconductor body heater
JPS54103174A (en) 1978-01-31 1979-08-14 Tokyo Shibaura Electric Co Cooking instrument
JPS583478B2 (ja) 1978-03-03 1983-01-21 株式会社日立製作所 レ−ザ加熱方法および装置
US4164643A (en) 1978-03-06 1979-08-14 Dewitt David P Energy-efficient bi-radiant oven system
FR2435818A1 (fr) 1978-09-08 1980-04-04 Ibm France Procede pour accroitre l'effet de piegeage interne des corps semi-conducteurs
JPS55115327A (en) 1979-02-28 1980-09-05 Chiyou Lsi Gijutsu Kenkyu Kumiai Manufacturing method of semiconductor device
JPS5648128A (en) 1979-09-27 1981-05-01 Pioneer Electronic Corp Heating treatment
US4370175A (en) 1979-12-03 1983-01-25 Bernard B. Katz Method of annealing implanted semiconductors by lasers
JPS56100412A (en) 1979-12-17 1981-08-12 Sony Corp Manufacture of semiconductor device
US4306731A (en) 1979-12-21 1981-12-22 Varian Associates, Inc. Wafer support assembly
JPS56100426A (en) 1980-01-14 1981-08-12 Ushio Inc Device and method for annealing
US4356384A (en) 1980-03-03 1982-10-26 Arnon Gat Method and means for heat treating semiconductor material using high intensity CW lamps
US4331485A (en) 1980-03-03 1982-05-25 Arnon Gat Method for heat treating semiconductor material using high intensity CW lamps
JPS56142630A (en) 1980-04-09 1981-11-07 Fujitsu Ltd Manufacture of semiconductor device
US4308078A (en) 1980-06-06 1981-12-29 Cook Melvin S Method of producing single-crystal semiconductor films by laser treatment
JPS5750427A (en) 1980-09-12 1982-03-24 Ushio Inc Annealing device and annealing method
JPS5780729A (en) 1980-11-10 1982-05-20 Tokyo Denki Daigaku Annealing device for semiconductor
JPS57208146A (en) 1981-06-17 1982-12-21 Nec Corp Forming method for insulating film to compound semiconductor
US4379727A (en) 1981-07-08 1983-04-12 International Business Machines Corporation Method of laser annealing of subsurface ion implanted regions
US4431459A (en) 1981-07-17 1984-02-14 National Semiconductor Corporation Fabrication of MOSFETs by laser annealing through anti-reflective coating
US4421048A (en) 1981-10-22 1983-12-20 The United States Of America As Represented By The Secretary Of The Navy Situ incineration/detoxification system for antifouling coatings
JPS5870536A (ja) 1981-10-22 1983-04-27 Fujitsu Ltd レ−ザアニ−ル方法
JPS58106836A (ja) 1981-12-18 1983-06-25 Hitachi Ltd レ−ザ−アニ−ル装置
US4457359A (en) * 1982-05-25 1984-07-03 Varian Associates, Inc. Apparatus for gas-assisted, solid-to-solid thermal transfer with a semiconductor wafer
JPS59928A (ja) 1982-06-25 1984-01-06 Ushio Inc 光加熱装置
FR2532783A1 (fr) 1982-09-07 1984-03-09 Vu Duy Phach Machine de traitement thermique pour semiconducteurs
JPS5959876A (ja) 1982-09-30 1984-04-05 Ushio Inc 光照射炉の運転方法
JPS5977289A (ja) 1982-10-26 1984-05-02 ウシオ電機株式会社 光照射炉
GB2136937A (en) 1983-03-18 1984-09-26 Philips Electronic Associated A furnace for rapidly heating semiconductor bodies
JPS59193024A (ja) 1983-03-29 1984-11-01 Ushio Inc 閃光照射装置
JPS59211221A (ja) 1983-05-17 1984-11-30 Nippon Denso Co Ltd イオン注入した半導体の熱処理方法
US4539431A (en) 1983-06-06 1985-09-03 Sera Solar Corporation Pulse anneal method for solar cell
US5231595A (en) 1983-06-06 1993-07-27 Minolta Camera Kabushiki Kaisha Pyrometer
US4550684A (en) 1983-08-11 1985-11-05 Genus, Inc. Cooled optical window for semiconductor wafer heating
KR910004158B1 (en) 1983-08-15 1991-06-22 Sinagawa Sirotenga Co Ltd Thermal deformation measuring system of ceranics and the like
US5350899A (en) 1992-04-15 1994-09-27 Hiroichi Ishikawa Semiconductor wafer temperature determination by optical measurement of wafer expansion in processing apparatus chamber
US4649261A (en) 1984-02-28 1987-03-10 Tamarack Scientific Co., Inc. Apparatus for heating semiconductor wafers in order to achieve annealing, silicide formation, reflow of glass passivation layers, etc.
US4698486A (en) 1984-02-28 1987-10-06 Tamarack Scientific Co., Inc. Method of heating semiconductor wafers in order to achieve annealing, silicide formation, reflow of glass passivation layers, etc.
US4560420A (en) 1984-06-13 1985-12-24 At&T Technologies, Inc. Method for reducing temperature variations across a semiconductor wafer during heating
US4649241A (en) 1984-11-09 1987-03-10 Siemens-Allis, Inc. Solenoid actuated high speed, high current making switch with a movable contact ring
CA1239437A (en) 1984-12-24 1988-07-19 Vortek Industries Ltd. High intensity radiation method and apparatus having improved liquid vortex flow
US4682594A (en) 1985-03-11 1987-07-28 Mcm Laboratories, Inc. Probe-and-fire lasers
HU198339B (en) 1985-05-10 1989-09-28 Budapesti Mueszaki Egyetem Method and measuring probe for simultaneous local detection of thermophysical characteristics, first of all, of thermal conductivity and coefficient of temperature distribution
US4661177A (en) 1985-10-08 1987-04-28 Varian Associates, Inc. Method for doping semiconductor wafers by rapid thermal processing of solid planar diffusion sources
FR2594529B1 (fr) 1986-02-19 1990-01-26 Bertin & Cie Appareil pour traitements thermiques de pieces minces, telles que des plaquettes de silicium
US4890245A (en) * 1986-09-22 1989-12-26 Nikon Corporation Method for measuring temperature of semiconductor substrate and apparatus therefor
US4751193A (en) 1986-10-09 1988-06-14 Q-Dot, Inc. Method of making SOI recrystallized layers by short spatially uniform light pulses
US5514885A (en) 1986-10-09 1996-05-07 Myrick; James J. SOI methods and apparatus
US4794619A (en) 1986-12-05 1988-12-27 Conax Buffalo Corporation Optical fiber temperature sensor
US4755654A (en) 1987-03-26 1988-07-05 Crowley John L Semiconductor wafer heating chamber
US4787551A (en) 1987-05-04 1988-11-29 Stanford University Method of welding thermocouples to silicon wafers for temperature monitoring in rapid thermal processing
US4818327A (en) 1987-07-16 1989-04-04 Texas Instruments Incorporated Wafer processing apparatus
US4826269A (en) 1987-10-16 1989-05-02 Spectra Diode Laboratories, Inc. Diode laser arrangement forming bright image
DE3739862A1 (de) 1987-11-25 1989-06-08 Bosch Gmbh Robert Werkstueckbearbeitungsvorrichtung
US4851358A (en) 1988-02-11 1989-07-25 Dns Electronic Materials, Inc. Semiconductor wafer fabrication with improved control of internal gettering sites using rapid thermal annealing
US4857689A (en) 1988-03-23 1989-08-15 High Temperature Engineering Corporation Rapid thermal furnace for semiconductor processing
JP2605090B2 (ja) 1988-03-28 1997-04-30 東京エレクトロン株式会社 ビームアニール装置
JPH01268120A (ja) 1988-04-20 1989-10-25 Fujitsu Ltd 半導体装置用ウェハの温度測定方法
US5188458A (en) 1988-04-27 1993-02-23 A G Processing Technologies, Inc. Pyrometer apparatus and method
US4981815A (en) 1988-05-09 1991-01-01 Siemens Aktiengesellschaft Method for rapidly thermally processing a semiconductor wafer by irradiation using semicircular or parabolic reflectors
KR0155545B1 (ko) 1988-06-27 1998-12-01 고다까 토시오 기판의 열처리 장치
KR960013995B1 (ko) 1988-07-15 1996-10-11 도오교오 에레구토론 가부시끼가이샤 반도체 웨이퍼 기판의 표면온도 측정 방법 및 열처리 장치
US4956538A (en) 1988-09-09 1990-09-11 Texas Instruments, Incorporated Method and apparatus for real-time wafer temperature measurement using infrared pyrometry in advanced lamp-heated rapid thermal processors
US4891499A (en) 1988-09-09 1990-01-02 Texas Instruments Incorporated Method and apparatus for real-time wafer temperature uniformity control and slip-free heating in lamp heated single-wafer rapid thermal processing systems
US4937490A (en) 1988-12-19 1990-06-26 Vortek Industries Ltd. High intensity radiation apparatus and fluid recirculating system therefor
DE3926859A1 (de) 1988-12-30 1990-07-05 Fraunhofer Ges Forschung Verfahren und vorrichtung zum bearbeiten von werkstuecken mit laserstrahlung
EP0598410B1 (en) 1989-02-14 2001-05-23 Seiko Epson Corporation A method of manufacturing a semiconductor device
US4959244A (en) 1989-03-27 1990-09-25 General Electric Company Temperature measurement and control for photohermal processes
US5249142A (en) * 1989-03-31 1993-09-28 Tokyo Electron Kyushu Limited Indirect temperature-measurement of films formed on semiconductor wafers
US4984902A (en) 1989-04-13 1991-01-15 Peak Systems, Inc. Apparatus and method for compensating for errors in temperature measurement of semiconductor wafers during rapid thermal processing
US5011794A (en) 1989-05-01 1991-04-30 At&T Bell Laboratories Procedure for rapid thermal annealing of implanted semiconductors
JP3190653B2 (ja) 1989-05-09 2001-07-23 ソニー株式会社 アニール方法およびアニール装置
US5002630A (en) 1989-06-06 1991-03-26 Rapro Technology Method for high temperature thermal processing with reduced convective heat loss
JP2923008B2 (ja) 1989-12-11 1999-07-26 株式会社日立製作所 成膜方法及び成膜装置
US5155337A (en) 1989-12-21 1992-10-13 North Carolina State University Method and apparatus for controlling rapid thermal processing systems
US5282017A (en) 1990-01-05 1994-01-25 Quantum Logic Corporation Reflectance probe
US5155336A (en) 1990-01-19 1992-10-13 Applied Materials, Inc. Rapid thermal heating apparatus and method
US6016383A (en) 1990-01-19 2000-01-18 Applied Materials, Inc. Rapid thermal heating apparatus and method including an infrared camera to measure substrate temperature
JPH0693440B2 (ja) 1990-01-19 1994-11-16 ジー スクウェアード セミコンダクター コーポレイション 急速加熱装置及び方法
DE4004295A1 (de) 1990-02-13 1991-08-14 Karl Heess Gmbh & Co Verfahren und vorrichtung zum haerten von werkstuecken mittels presswerkzeugen
US5073698A (en) 1990-03-23 1991-12-17 Peak Systems, Inc. Method for selectively heating a film on a substrate
US5310260A (en) 1990-04-10 1994-05-10 Luxtron Corporation Non-contact optical techniques for measuring surface conditions
US5271084A (en) 1990-05-23 1993-12-14 Interuniversitair Micro Elektronica Centrum Vzw Method and device for measuring temperature radiation using a pyrometer wherein compensation lamps are used
AU649707B2 (en) 1990-08-01 1994-06-02 Diomed Limited High power light source
US5258824A (en) 1990-08-09 1993-11-02 Applied Materials, Inc. In-situ measurement of a thin film deposited on a wafer
JPH04152518A (ja) 1990-10-16 1992-05-26 Toshiba Corp 半導体装置の製造方法
US5317429A (en) 1990-11-28 1994-05-31 Fujitsu Limited Trilayer nematic liquid crystal optical switching device
US5293216A (en) 1990-12-31 1994-03-08 Texas Instruments Incorporated Sensor for semiconductor device manufacturing process control
JPH04243123A (ja) 1991-01-17 1992-08-31 Mitsubishi Electric Corp 半導体製造装置
JPH06318558A (ja) 1991-02-26 1994-11-15 Hitachi Vlsi Eng Corp ランプアニール装置
DE4109956A1 (de) 1991-03-26 1992-10-01 Siemens Ag Verfahren zum kurzzeittempern einer halbleiterscheibe durch bestrahlung
JPH04355911A (ja) 1991-03-27 1992-12-09 Fujitsu Ltd 半導体装置の製造装置
US5446825A (en) 1991-04-24 1995-08-29 Texas Instruments Incorporated High performance multi-zone illuminator module for semiconductor wafer processing
LU87933A1 (fr) * 1991-05-02 1992-12-15 Europ Communities Procede et dispositif d'etalonnage d'un pyrometre optique et plaquettes etalons correspondantes
US5255286A (en) 1991-05-17 1993-10-19 Texas Instruments Incorporated Multi-point pyrometry with real-time surface emissivity compensation
US5317656A (en) 1991-05-17 1994-05-31 Texas Instruments Incorporated Fiber optic network for multi-point emissivity-compensated semiconductor wafer pyrometry
US5508934A (en) 1991-05-17 1996-04-16 Texas Instruments Incorporated Multi-point semiconductor wafer fabrication process temperature control system
US5436172A (en) 1991-05-20 1995-07-25 Texas Instruments Incorporated Real-time multi-zone semiconductor wafer temperature and process uniformity control system
US5213985A (en) * 1991-05-22 1993-05-25 Bell Communications Research, Inc. Temperature measurement in a processing chamber using in-situ monitoring of photoluminescence
JP3466633B2 (ja) 1991-06-12 2003-11-17 ソニー株式会社 多結晶半導体層のアニール方法
US5359693A (en) 1991-07-15 1994-10-25 Ast Elektronik Gmbh Method and apparatus for a rapid thermal processing of delicate components
DE4223133A1 (de) 1991-07-15 1993-01-21 T Elektronik Gmbh As Verfahren und vorrichtung fuer die schnelle thermische behandlung empfindlicher bauelemente
US5815396A (en) * 1991-08-12 1998-09-29 Hitachi, Ltd. Vacuum processing device and film forming device and method using same
JP3334162B2 (ja) 1992-02-17 2002-10-15 株式会社日立製作所 真空処理装置及びそれを用いた成膜装置と成膜方法
FR2682253A1 (fr) 1991-10-07 1993-04-09 Commissariat Energie Atomique Sole chauffante destinee a assurer le chauffage d'un objet dispose a sa surface et reacteur de traitement chimique muni de ladite sole.
US5446824A (en) 1991-10-11 1995-08-29 Texas Instruments Lamp-heated chuck for uniform wafer processing
US5387557A (en) 1991-10-23 1995-02-07 F. T. L. Co., Ltd. Method for manufacturing semiconductor devices using heat-treatment vertical reactor with temperature zones
US5196353A (en) 1992-01-03 1993-03-23 Micron Technology, Inc. Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer
US5336641A (en) 1992-03-17 1994-08-09 Aktis Corporation Rapid thermal annealing using thermally conductive overcoat
US5272017A (en) * 1992-04-03 1993-12-21 General Motors Corporation Membrane-electrode assemblies for electrochemical cells
US5268989A (en) 1992-04-16 1993-12-07 Texas Instruments Incorporated Multi zone illuminator with embeded process control sensors and light interference elimination circuit
US5364186A (en) 1992-04-28 1994-11-15 Luxtron Corporation Apparatus and method for monitoring a temperature using a thermally fused composite ceramic blackbody temperature probe
US5313044A (en) 1992-04-28 1994-05-17 Duke University Method and apparatus for real-time wafer temperature and thin film growth measurement and control in a lamp-heated rapid thermal processor
GB9214380D0 (en) 1992-07-07 1992-08-19 Sev Furnaces Ltd Radiation transmitting apparatus
JP3202362B2 (ja) 1992-07-21 2001-08-27 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP3211394B2 (ja) 1992-08-13 2001-09-25 ソニー株式会社 半導体装置の製造方法
US5418885A (en) 1992-12-29 1995-05-23 North Carolina State University Three-zone rapid thermal processing system utilizing wafer edge heating means
DE69312894T2 (de) 1992-12-29 1998-02-12 Philips Electronics Nv Pyrometer mit Emissionsmesser
US5325180A (en) 1992-12-31 1994-06-28 International Business Machines Corporation Apparatus for identifying and distinguishing temperature and system induced measuring errors
US5326173A (en) 1993-01-11 1994-07-05 Alcan International Limited Apparatus and method for remote temperature measurement
US5444217A (en) 1993-01-21 1995-08-22 Moore Epitaxial Inc. Rapid thermal processing apparatus for processing semiconductor wafers
US5580388A (en) 1993-01-21 1996-12-03 Moore Epitaxial, Inc. Multi-layer susceptor for rapid thermal process reactors
US5308161A (en) 1993-02-11 1994-05-03 Quantum Logic Corporation Pyrometer apparatus for use in rapid thermal processing of semiconductor wafers
JP2824003B2 (ja) 1993-02-16 1998-11-11 大日本スクリーン製造株式会社 基板の温度測定装置
US5350236A (en) 1993-03-08 1994-09-27 Micron Semiconductor, Inc. Method for repeatable temperature measurement using surface reflectivity
US5305417A (en) 1993-03-26 1994-04-19 Texas Instruments Incorporated Apparatus and method for determining wafer temperature using pyrometry
US5305416A (en) 1993-04-02 1994-04-19 At&T Bell Laboratories Semiconductor processing technique, including pyrometric measurement of radiantly heated bodies
JPH06295915A (ja) 1993-04-09 1994-10-21 F T L:Kk 半導体装置の製造装置及び半導体装置の製造方法
US5347128A (en) 1993-04-19 1994-09-13 Vigyan, Inc. Directional emittance surface measurement system and process
US5738165A (en) * 1993-05-07 1998-04-14 Nikon Corporation Substrate holding apparatus
US5501637A (en) 1993-08-10 1996-03-26 Texas Instruments Incorporated Temperature sensor and method
JPH0758041A (ja) 1993-08-20 1995-03-03 Toshiba Ceramics Co Ltd サセプタ
JP3004846B2 (ja) 1993-08-20 2000-01-31 東芝セラミックス株式会社 気相成長装置用サセプタ
TW266230B (enExample) 1993-09-09 1995-12-21 Tokyo Electron Co Ltd
US5388909A (en) * 1993-09-16 1995-02-14 Johnson; Shane R. Optical apparatus and method for measuring temperature of a substrate material with a temperature dependent band gap
US5427733A (en) 1993-10-20 1995-06-27 United Technologies Corporation Method for performing temperature-controlled laser sintering
US5650082A (en) 1993-10-29 1997-07-22 Applied Materials, Inc. Profiled substrate heating
US5467220A (en) * 1994-02-18 1995-11-14 Applied Materials, Inc. Method and apparatus for improving semiconductor wafer surface temperature uniformity
JPH07245274A (ja) 1994-03-02 1995-09-19 Tokyo Electron Ltd 熱処理装置
KR100255961B1 (ko) * 1994-03-11 2000-05-01 아끼구사 나오유끼 물리량 측정방법 및 장치, 반도체 장치의 제조방법과 파장측정방법 및 장치
US5431700A (en) 1994-03-30 1995-07-11 Fsi International, Inc. Vertical multi-process bake/chill apparatus
DE4414391C2 (de) 1994-04-26 2001-02-01 Steag Rtp Systems Gmbh Verfahren für wellenvektorselektive Pyrometrie in Schnellheizsystemen
US5654904A (en) 1994-05-18 1997-08-05 Micron Technology, Inc. Control and 3-dimensional simulation model of temperature variations in a rapid thermal processing machine
US5561612A (en) 1994-05-18 1996-10-01 Micron Technology, Inc. Control and 3-dimensional simulation model of temperature variations in a rapid thermal processing machine
KR100327086B1 (ko) 1994-06-15 2002-03-06 구사마 사부로 박막 반도체 장치의 제조방법, 박막 반도체 장치,액정표시장치 및 전자기기
CA2126481C (en) * 1994-06-22 2001-03-27 Andreas Mandelis Non-contact photothermal method for measuring thermal diffusivity and electronic defect properties of solids
US5436443A (en) 1994-07-06 1995-07-25 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Polaradiometric pyrometer in which the parallel and perpendicular components of radiation reflected from an unpolarized light source are equalized with the thermal radiation emitted from a measured object to determine its true temperature
JPH0845922A (ja) 1994-07-29 1996-02-16 Fujitsu Ltd ウェーハ処理方法およびウェーハ処理装置
JPH0855810A (ja) 1994-08-16 1996-02-27 Nec Kyushu Ltd 拡散炉
US5561735A (en) 1994-08-30 1996-10-01 Vortek Industries Ltd. Rapid thermal processing apparatus and method
US5683180A (en) * 1994-09-13 1997-11-04 Hughes Aircraft Company Method for temperature measurement of semiconducting substrates having optically opaque overlayers
US5604592A (en) 1994-09-19 1997-02-18 Textron Defense Systems, Division Of Avco Corporation Laser ultrasonics-based material analysis system and method using matched filter processing
JP3440579B2 (ja) 1994-10-05 2003-08-25 ソニー株式会社 加熱処理方法
DE69530801T2 (de) 1994-10-17 2004-03-11 Varian Semiconductor Equipment Associates Inc., Gloucester Montageelement und methode zum klemmen eines flachen, dünnen und leitfähigen werkstückes
US5601366A (en) 1994-10-25 1997-02-11 Texas Instruments Incorporated Method for temperature measurement in rapid thermal process systems
US5738440A (en) 1994-12-23 1998-04-14 International Business Machines Corp. Combined emissivity and radiance measurement for the determination of the temperature of a radiant object
US5517359A (en) 1995-01-23 1996-05-14 Gelbart; Daniel Apparatus for imaging light from a laser diode onto a multi-channel linear light valve
EP0727928B1 (en) 1995-02-18 1996-09-18 Hewlett-Packard GmbH Electronic assembly having improved thermal characteristics
JP3568271B2 (ja) 1995-03-27 2004-09-22 株式会社超高温材料研究所 レーザフラッシュ法を用いた熱定数の測定方法及びその装置
DE19513749B4 (de) 1995-04-11 2004-07-01 Infineon Technologies Ag Verfahren und Vorrichtung zur Bestimmung des Emissionsfaktors von Halbleitermaterialien durch Bestrahlung mit elektromagnetischen Wellen
US5715361A (en) 1995-04-13 1998-02-03 Cvc Products, Inc. Rapid thermal processing high-performance multizone illuminator for wafer backside heating
US5830277A (en) 1995-05-26 1998-11-03 Mattson Technology, Inc. Thermal processing system with supplemental resistive heater and shielded optical pyrometry
US5597237A (en) 1995-05-30 1997-01-28 Quantum Logic Corp Apparatus for measuring the emissivity of a semiconductor wafer
US6066516A (en) 1995-06-26 2000-05-23 Seiko Epson Corporation Method for forming crystalline semiconductor layers, a method for fabricating thin film transistors, and method for fabricating solar cells and active matrix liquid crystal devices
US5971565A (en) 1995-10-20 1999-10-26 Regents Of The University Of California Lamp system with conditioned water coolant and diffuse reflector of polytetrafluorethylene(PTFE)
JPH09126913A (ja) 1995-10-30 1997-05-16 Hitachi Ltd 応力測定装置および半導体製造装置
US6051483A (en) 1996-11-12 2000-04-18 International Business Machines Corporation Formation of ultra-shallow semiconductor junction using microwave annealing
US5809211A (en) 1995-12-11 1998-09-15 Applied Materials, Inc. Ramping susceptor-wafer temperature using a single temperature input
JP3586031B2 (ja) 1996-03-27 2004-11-10 株式会社東芝 サセプタおよび熱処理装置および熱処理方法
JPH09293684A (ja) * 1996-04-25 1997-11-11 Toshiba Corp 熱処理用治具
JPH1050629A (ja) * 1996-05-30 1998-02-20 Nippon Steel Corp 半導体基板の製造方法及びその装置
US6183565B1 (en) 1997-07-08 2001-02-06 Asm International N.V Method and apparatus for supporting a semiconductor wafer during processing
US6108490A (en) 1996-07-11 2000-08-22 Cvc, Inc. Multizone illuminator for rapid thermal processing with improved spatial resolution
US5937142A (en) 1996-07-11 1999-08-10 Cvc Products, Inc. Multi-zone illuminator for rapid thermal processing
US5756369A (en) 1996-07-11 1998-05-26 Lsi Logic Corporation Rapid thermal processing using a narrowband infrared source and feedback
US6536131B2 (en) 1996-07-15 2003-03-25 Semitool, Inc. Wafer handling system
US5802099A (en) 1996-08-26 1998-09-01 Moore Epitaxial, Inc. Method for measuring substrate temperature in radiant heated reactors
US5805507A (en) 1996-10-01 1998-09-08 Microchip Technology Incorporated Voltage reference generator for EPROM memory array
JP3198259B2 (ja) 1996-10-02 2001-08-13 東芝キヤリア株式会社 冷媒加熱式冷暖房機の室外ユニット
US6033478A (en) 1996-11-05 2000-03-07 Applied Materials, Inc. Wafer support with improved temperature control
US5963840A (en) 1996-11-13 1999-10-05 Applied Materials, Inc. Methods for depositing premetal dielectric layer at sub-atmospheric and high temperature conditions
US5908307A (en) 1997-01-31 1999-06-01 Ultratech Stepper, Inc. Fabrication method for reduced-dimension FET devices
US5944422A (en) 1997-07-11 1999-08-31 A. G. Associates (Israel) Ltd. Apparatus for measuring the processing temperature of workpieces particularly semiconductor wafers
US5960158A (en) 1997-07-11 1999-09-28 Ag Associates Apparatus and method for filtering light in a thermal processing chamber
US5998768A (en) 1997-08-07 1999-12-07 Massachusetts Institute Of Technology Active thermal control of surfaces by steering heating beam in response to sensed thermal radiation
US5814365A (en) 1997-08-15 1998-09-29 Micro C Technologies, Inc. Reactor and method of processing a semiconductor substate
US5841110A (en) 1997-08-27 1998-11-24 Steag-Ast Gmbh Method and apparatus for improved temperature control in rapid thermal processing (RTP) systems
KR100442666B1 (ko) 1997-08-30 2004-09-18 삼성전자주식회사 교환기시스템에 사용되는 다이랙트 인워드 앤 아웃고잉회로에서의 접속 오동작 방지를 위한 장치
JPH1197371A (ja) 1997-09-18 1999-04-09 Tokyo Electron Ltd 熱処理装置
US6235438B1 (en) * 1997-10-07 2001-05-22 Nikon Corporation Projection exposure method and apparatus
DE19748088A1 (de) * 1997-10-30 1999-05-12 Wacker Siltronic Halbleitermat Verfahren und Vorrichtung zum Erkennen einer Fehllage einer Halbleiterscheibe
KR100660416B1 (ko) 1997-11-03 2006-12-22 에이에스엠 아메리카, 인코포레이티드 개량된 저질량 웨이퍼 지지 시스템
US6005226A (en) 1997-11-24 1999-12-21 Steag-Rtp Systems Rapid thermal processing (RTP) system with gas driven rotating substrate
US6222990B1 (en) * 1997-12-03 2001-04-24 Steag Rtp Systems Heating element for heating the edges of wafers in thermal processing chambers
WO1999041777A1 (en) 1998-02-13 1999-08-19 Seiko Epson Corporation Method of producing semiconductor device and heat treating apparatus
US6183130B1 (en) * 1998-02-20 2001-02-06 Applied Materials, Inc. Apparatus for substrate temperature measurement using a reflecting cavity and detector
US6056434A (en) 1998-03-12 2000-05-02 Steag Rtp Systems, Inc. Apparatus and method for determining the temperature of objects in thermal processing chambers
US6541287B2 (en) * 1998-03-19 2003-04-01 Kabushiki Kaisha Toshiba Temperature measuring method and apparatus, measuring method for the thickness of the formed film, measuring apparatus for the thickness of the formed film thermometer for wafers
DE19821007A1 (de) * 1998-05-11 1999-11-25 Steag Rtp Systems Gmbh Verfahren und Vorrichtung zum thermischen Behandeln von Substraten
US6146504A (en) * 1998-05-21 2000-11-14 Applied Materials, Inc. Substrate support and lift apparatus and method
US6113056A (en) 1998-08-04 2000-09-05 Micrion Corporation Workpiece vibration damper
JP3907842B2 (ja) 1998-08-11 2007-04-18 大日本スクリーン製造株式会社 基板熱処理装置
US6217034B1 (en) * 1998-09-24 2001-04-17 Kla-Tencor Corporation Edge handling wafer chuck
JP4056148B2 (ja) 1998-10-09 2008-03-05 東京エレクトロン株式会社 放射温度計を用いた温度測定方法
US6645356B1 (en) * 1998-12-07 2003-11-11 Semitool, Inc. Methods and apparatus for processing the surface of a microelectronic workpiece
US6771895B2 (en) * 1999-01-06 2004-08-03 Mattson Technology, Inc. Heating device for heating semiconductor wafers in thermal processing chambers
US6183127B1 (en) 1999-03-29 2001-02-06 Eaton Corporation System and method for the real time determination of the in situ emissivity of a workpiece during processing
WO2000058700A1 (fr) 1999-03-30 2000-10-05 Tokyo Electron Limited Systeme de mesure de temperature
US6293696B1 (en) 1999-05-03 2001-09-25 Steag Rtp Systems, Inc. System and process for calibrating pyrometers in thermal processing chambers
US6303411B1 (en) 1999-05-03 2001-10-16 Vortek Industries Ltd. Spatially resolved temperature measurement and irradiance control
US6303917B1 (en) 1999-05-14 2001-10-16 Ultratech Stepper, Inc. Radiant energy monitoring apparatuses including a calibration operation and related methods
JP2000323487A (ja) 1999-05-14 2000-11-24 Tokyo Electron Ltd 枚葉式熱処理装置
US6349270B1 (en) 1999-05-27 2002-02-19 Emcore Corporation Method and apparatus for measuring the temperature of objects on a fast moving holder
CA2310883A1 (en) 1999-06-07 2000-12-07 Norman L. Arrison Method and apparatus for fracturing brittle materials by thermal stressing
US6406545B2 (en) 1999-07-27 2002-06-18 Kabushiki Kaisha Toshiba Semiconductor workpiece processing apparatus and method
US6196532B1 (en) 1999-08-27 2001-03-06 Applied Materials, Inc. 3 point vacuum chuck with non-resilient support members
US6561796B1 (en) 1999-09-07 2003-05-13 Novellus Systems, Inc. Method of semiconductor wafer heating to prevent bowing
US6564166B1 (en) * 1999-10-27 2003-05-13 Georgia Tech Research Corporation Projection moiré method and apparatus for dynamic measuring of thermal induced warpage
JP2001141657A (ja) * 1999-10-29 2001-05-25 Internatl Business Mach Corp <Ibm> マクロ検査用照明装置、マクロ検査装置及び該方法
JP4592849B2 (ja) 1999-10-29 2010-12-08 アプライド マテリアルズ インコーポレイテッド 半導体製造装置
US6621199B1 (en) 2000-01-21 2003-09-16 Vortek Industries Ltd. High intensity electromagnetic radiation apparatus and method
DE10003639C2 (de) 2000-01-28 2003-06-18 Steag Rtp Systems Gmbh Vorrichtung zum thermischen Behandeln von Substraten
US6494371B1 (en) 2000-03-09 2002-12-17 Coherent, Inc. Diode-laser light projector for illuminating a linear array of light modulators
US6531681B1 (en) 2000-03-27 2003-03-11 Ultratech Stepper, Inc. Apparatus having line source of radiant energy for exposing a substrate
US6376806B2 (en) 2000-05-09 2002-04-23 Woo Sik Yoo Flash anneal
TW556283B (en) 2000-05-26 2003-10-01 Nisshin Spinning Silicon/graphite composite ring for supporting silicon wafer, and dry etching apparatus equipped with the same
DE20016145U1 (de) * 2000-09-18 2001-01-18 Schott Glas, 55122 Mainz Kochfeld mit mindestens einem atmosphärischen Gasbrenner
US6610968B1 (en) 2000-09-27 2003-08-26 Axcelis Technologies System and method for controlling movement of a workpiece in a thermal processing system
JP3430258B2 (ja) * 2000-10-17 2003-07-28 独立行政法人産業技術総合研究所 熱拡散率と界面熱抵抗の測定方法
JP2002134592A (ja) 2000-10-19 2002-05-10 Tokyo Ohka Kogyo Co Ltd 熱処理装置および熱処理方法
WO2002047123A1 (en) 2000-12-04 2002-06-13 Vortek Industries Ltd. Heat-treating methods and systems
US6594446B2 (en) 2000-12-04 2003-07-15 Vortek Industries Ltd. Heat-treating methods and systems
US6970644B2 (en) * 2000-12-21 2005-11-29 Mattson Technology, Inc. Heating configuration for use in thermal processing chambers
US6634882B2 (en) 2000-12-22 2003-10-21 Asm America, Inc. Susceptor pocket profile to improve process performance
JP2006170616A (ja) 2001-03-06 2006-06-29 Tokyo Electron Ltd 温度計測方法及び装置、半導体熱処理装置
US6529686B2 (en) * 2001-06-06 2003-03-04 Fsi International, Inc. Heating member for combination heating and chilling apparatus, and methods
US6669783B2 (en) 2001-06-28 2003-12-30 Lam Research Corporation High temperature electrostatic chuck
JP3639546B2 (ja) * 2001-07-25 2005-04-20 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
JP3798674B2 (ja) 2001-10-29 2006-07-19 大日本スクリーン製造株式会社 熱処理装置および熱処理方法
US7071714B2 (en) 2001-11-02 2006-07-04 Formfactor, Inc. Method and system for compensating for thermally induced motion of probe cards
TWI242815B (en) 2001-12-13 2005-11-01 Ushio Electric Inc Method for thermal processing semiconductor wafer
JP4029613B2 (ja) * 2001-12-25 2008-01-09 ウシオ電機株式会社 閃光放射装置および光加熱装置
US7445382B2 (en) 2001-12-26 2008-11-04 Mattson Technology Canada, Inc. Temperature measurement and heat-treating methods and system
TW526580B (en) 2002-01-24 2003-04-01 Taiwan Semiconductor Mfg Semiconductor wafer transmission system combined with temperature control apparatus
US6998580B2 (en) 2002-03-28 2006-02-14 Dainippon Screen Mfg. Co., Ltd. Thermal processing apparatus and thermal processing method
US6849831B2 (en) 2002-03-29 2005-02-01 Mattson Technology, Inc. Pulsed processing semiconductor heating methods using combinations of heating sources
US7005601B2 (en) 2002-04-18 2006-02-28 Applied Materials, Inc. Thermal flux processing by scanning
US6987240B2 (en) 2002-04-18 2006-01-17 Applied Materials, Inc. Thermal flux processing by scanning
US7070660B2 (en) 2002-05-03 2006-07-04 Asm America, Inc. Wafer holder with stiffening rib
US7143005B2 (en) * 2002-05-06 2006-11-28 Veeco Instruments Inc. Image reconstruction method
US6885815B2 (en) 2002-07-17 2005-04-26 Dainippon Screen Mfg. Co., Ltd. Thermal processing apparatus performing irradiating a substrate with light
US6887317B2 (en) * 2002-09-10 2005-05-03 Applied Materials, Inc. Reduced friction lift pin
JP4090313B2 (ja) 2002-09-11 2008-05-28 大日本スクリーン製造株式会社 基板保持装置および基板処理装置
JP4272445B2 (ja) 2003-02-10 2009-06-03 大日本スクリーン製造株式会社 熱処理装置
JP4216055B2 (ja) 2002-11-28 2009-01-28 大日本スクリーン製造株式会社 熱処理装置
US7062161B2 (en) 2002-11-28 2006-06-13 Dainippon Screen Mfg. Co., Ltd. Photoirradiation thermal processing apparatus and thermal processing susceptor employed therefor
JP4121929B2 (ja) 2003-10-08 2008-07-23 大日本スクリーン製造株式会社 熱処理方法および熱処理装置
JP4121840B2 (ja) 2002-12-05 2008-07-23 大日本スクリーン製造株式会社 熱処理装置および熱処理方法
KR100549452B1 (ko) 2002-12-05 2006-02-06 다이닛뽕스크린 세이조오 가부시키가이샤 광조사형 열처리장치 및 방법
US9627244B2 (en) 2002-12-20 2017-04-18 Mattson Technology, Inc. Methods and systems for supporting a workpiece and for heat-treating the workpiece
JP4675579B2 (ja) 2003-06-30 2011-04-27 大日本スクリーン製造株式会社 光エネルギー吸収比率の測定方法、光エネルギー吸収比率の測定装置および熱処理装置
JP4618705B2 (ja) 2003-09-18 2011-01-26 大日本スクリーン製造株式会社 熱処理装置
JP2005101215A (ja) 2003-09-24 2005-04-14 Dainippon Screen Mfg Co Ltd 熱処理装置
EP1671087A4 (en) 2003-09-24 2006-11-29 Squared Thermal Technologies L IMPULSE FORMING NETWORK AND IMPULSE GENERATOR
US6855916B1 (en) 2003-12-10 2005-02-15 Axcelis Technologies, Inc. Wafer temperature trajectory control method for high temperature ramp rate applications using dynamic predictive thermal modeling
JP5630935B2 (ja) 2003-12-19 2014-11-26 マトソン テクノロジー、インコーポレイテッド 工作物の熱誘起運動を抑制する機器及び装置
JP4024764B2 (ja) 2004-01-20 2007-12-19 松下電器産業株式会社 光照射熱処理方法および光照射熱処理装置
US7781947B2 (en) 2004-02-12 2010-08-24 Mattson Technology Canada, Inc. Apparatus and methods for producing electromagnetic radiation
JP5074039B2 (ja) 2004-02-12 2012-11-14 マトソン テクノロジー カナダ インコーポレイテッド 高強度の電磁放射線発生装置及び発生方法
US20050284371A1 (en) 2004-06-29 2005-12-29 Mcfadden Robert S Deposition apparatus for providing uniform low-k dielectric
JP4841854B2 (ja) 2005-03-30 2011-12-21 大日本スクリーン製造株式会社 熱処理装置
US7642205B2 (en) * 2005-04-08 2010-01-05 Mattson Technology, Inc. Rapid thermal processing using energy transfer layers
JP2006351871A (ja) 2005-06-16 2006-12-28 Toshiba Corp 熱処理装置、熱処理方法および半導体装置の製造方法
JP4841873B2 (ja) 2005-06-23 2011-12-21 大日本スクリーン製造株式会社 熱処理用サセプタおよび熱処理装置
CN101288035B (zh) * 2005-09-14 2013-06-19 马特森技术有限公司 可重复热处理的方法和设备
US7184657B1 (en) 2005-09-17 2007-02-27 Mattson Technology, Inc. Enhanced rapid thermal processing apparatus and method
JP4781901B2 (ja) * 2006-05-08 2011-09-28 東京エレクトロン株式会社 熱処理方法，プログラム及び熱処理装置
JP4699283B2 (ja) * 2006-05-23 2011-06-08 東京エレクトロン株式会社 熱処理板の温度制御方法、プログラム及び熱処理板の温度制御装置
JP5967859B2 (ja) 2006-11-15 2016-08-10 マトソン テクノロジー、インコーポレイテッド 熱処理中の被加工物を支持するシステムおよび方法
KR100877102B1 (ko) * 2007-05-28 2009-01-09 주식회사 하이닉스반도체 열처리 장치 및 이를 이용한 열처리 방법
US7700467B2 (en) * 2007-10-15 2010-04-20 Texas Instruments Incorporated Methodology of implementing ultra high temperature (UHT) anneal in fabricating devices that contain sige
US8073316B2 (en) * 2008-01-31 2011-12-06 Kabushiki Kaisha Toshiba Oven for semiconductor wafer

Also Published As

Publication number Publication date
US9627244B2 (en) 2017-04-18
KR20050085856A (ko) 2005-08-29
CN1729554B (zh) 2014-05-07
KR20120045040A (ko) 2012-05-08
US20040178553A1 (en) 2004-09-16
KR101163682B1 (ko) 2012-07-09
US8434341B2 (en) 2013-05-07
US20120118867A1 (en) 2012-05-17
DE10393962B4 (de) 2019-03-14
JP2006511970A (ja) 2006-04-06
CN1729554A (zh) 2006-02-01
AU2003287837A1 (en) 2004-07-14
WO2004057650A1 (en) 2004-07-08
DE10393962T5 (de) 2006-03-02

Similar Documents

Publication Publication Date Title
JP4988202B2 (ja) 工作物の支持及び熱処理の方法とシステム
JP5630935B2 (ja) 工作物の熱誘起運動を抑制する機器及び装置
JP5967859B2 (ja) 熱処理中の被加工物を支持するシステムおよび方法
JP5031984B2 (ja) レーザー熱処理のための加熱チャック
CN108140597B (zh) 用于epi工艺的晶片加热的二极管激光器
JPH01319934A (ja) 電磁放射照射による半導体円板の急速熱処理方法
JP5611212B2 (ja) 基板のアニールにおける熱量の管理
KR101610269B1 (ko) 워크피스 파손 방지 방법 및 장치
JP5926142B2 (ja) 工作物の熱誘起運動を抑制する機器及び装置
TWI476858B (zh) 用於支撐工件及用於熱處理該工件的方法及系統
JP6376236B2 (ja) 加熱装置、半導体製造装置
US11621180B2 (en) Heating device
KR101670807B1 (ko) 고온 국부가열 방식의 서셉터 및 이를 갖는 히팅 장치
JP2003158315A (ja) レーザ発振器の保持構造
JPH0389307A (ja) 光学素子の保持台及び保持方法
KR20010017699A (ko) 웨이퍼 온도 측정장치
KR19980054352A (ko) 감광제의 열처리방법

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20061215

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20061215

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20090729

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100730

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20101101

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20101109

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20101130

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20101207

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20101210

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110812

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20111114

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20111121

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120208

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120228

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120307

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120330

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120426

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 4988202

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150511

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150511

Year of fee payment: 3

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R360 Written notification for declining of transfer of rights

Free format text: JAPANESE INTERMEDIATE CODE: R360

R371 Transfer withdrawn

Free format text: JAPANESE INTERMEDIATE CODE: R371

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313114

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term