JP2009524242A5 - - Google Patents
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- JP2009524242A5 JP2009524242A5 JP2008551316A JP2008551316A JP2009524242A5 JP 2009524242 A5 JP2009524242 A5 JP 2009524242A5 JP 2008551316 A JP2008551316 A JP 2008551316A JP 2008551316 A JP2008551316 A JP 2008551316A JP 2009524242 A5 JP2009524242 A5 JP 2009524242A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- opening
- protective layer
- forming
- gate electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000010410 layer Substances 0.000 claims 126
- 239000011241 protective layer Substances 0.000 claims 64
- 238000000034 method Methods 0.000 claims 31
- 230000004888 barrier function Effects 0.000 claims 24
- 150000004767 nitrides Chemical class 0.000 claims 15
- 238000000059 patterning Methods 0.000 claims 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 10
- 229910052581 Si3N4 Inorganic materials 0.000 claims 5
- 235000012239 silicon dioxide Nutrition 0.000 claims 5
- 239000000377 silicon dioxide Substances 0.000 claims 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 5
- 238000005530 etching Methods 0.000 claims 3
- 230000000149 penetrating effect Effects 0.000 claims 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 2
- 239000003989 dielectric material Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 238000002161 passivation Methods 0.000 claims 2
- 238000000137 annealing Methods 0.000 claims 1
- 238000004380 ashing Methods 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 238000001312 dry etching Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 229920002120 photoresistant polymer Polymers 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/333,726 US7592211B2 (en) | 2006-01-17 | 2006-01-17 | Methods of fabricating transistors including supported gate electrodes |
| US11/333,726 | 2006-01-17 | ||
| US11/493,069 US7709269B2 (en) | 2006-01-17 | 2006-07-26 | Methods of fabricating transistors including dielectrically-supported gate electrodes |
| US11/493,069 | 2006-07-26 | ||
| PCT/US2007/001045 WO2007084465A1 (en) | 2006-01-17 | 2007-01-16 | Methods of fabricating transistors including supported gate electrodes and related devices |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012237917A Division JP5805608B2 (ja) | 2006-01-17 | 2012-10-29 | 支持されたゲート電極を備えるトランジスタの作製方法およびそれに関連するデバイス |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009524242A JP2009524242A (ja) | 2009-06-25 |
| JP2009524242A5 true JP2009524242A5 (enExample) | 2012-03-22 |
| JP5203220B2 JP5203220B2 (ja) | 2013-06-05 |
Family
ID=38057295
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008551316A Active JP5203220B2 (ja) | 2006-01-17 | 2007-01-16 | 支持されたゲート電極を備えるトランジスタの作製方法およびそれに関連するデバイス |
| JP2012237917A Active JP5805608B2 (ja) | 2006-01-17 | 2012-10-29 | 支持されたゲート電極を備えるトランジスタの作製方法およびそれに関連するデバイス |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012237917A Active JP5805608B2 (ja) | 2006-01-17 | 2012-10-29 | 支持されたゲート電極を備えるトランジスタの作製方法およびそれに関連するデバイス |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US7709269B2 (enExample) |
| EP (1) | EP1974373B1 (enExample) |
| JP (2) | JP5203220B2 (enExample) |
| CA (1) | CA2634068C (enExample) |
| WO (1) | WO2007084465A1 (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9318593B2 (en) | 2014-07-21 | 2016-04-19 | Transphorm Inc. | Forming enhancement mode III-nitride devices |
| US9536967B2 (en) | 2014-12-16 | 2017-01-03 | Transphorm Inc. | Recessed ohmic contacts in a III-N device |
| US9536966B2 (en) | 2014-12-16 | 2017-01-03 | Transphorm Inc. | Gate structures for III-N devices |
| US9590060B2 (en) | 2013-03-13 | 2017-03-07 | Transphorm Inc. | Enhancement-mode III-nitride devices |
Families Citing this family (176)
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| WO2006080109A1 (ja) * | 2005-01-25 | 2006-08-03 | Fujitsu Limited | Mis構造を有する半導体装置及びその製造方法 |
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| US7855401B2 (en) * | 2005-06-29 | 2010-12-21 | Cree, Inc. | Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides |
| US9040398B2 (en) * | 2006-05-16 | 2015-05-26 | Cree, Inc. | Method of fabricating seminconductor devices including self aligned refractory contacts |
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| US9525052B2 (en) | 2007-01-10 | 2016-12-20 | Infineon Technologies Americas Corp. | Active area shaping of III-nitride devices utilizing a field plate defined by a dielectric body |
| US9318592B2 (en) | 2007-01-10 | 2016-04-19 | Infineon Technologies Americas Corp. | Active area shaping of III-nitride devices utilizing a source-side field plate and a wider drain-side field plate |
| US8987784B2 (en) | 2007-01-10 | 2015-03-24 | International Rectifier Corporation | Active area shaping of III-nitride devices utilizing multiple dielectric materials |
| US8946778B2 (en) | 2007-01-10 | 2015-02-03 | International Rectifier Corporation | Active area shaping of III-nitride devices utilizing steps of source-side and drain-side field plates |
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| JP5345328B2 (ja) * | 2008-02-22 | 2013-11-20 | 住友電工デバイス・イノベーション株式会社 | 半導体装置の製造方法 |
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| KR101714812B1 (ko) * | 2009-09-10 | 2017-03-22 | 더 리젠츠 오브 더 유니버시티 오브 미시간 | 에피택셜 리프트오프를 이용한 플렉시블 광기전 디바이스의 제조 방법 및 에피택셜 성장에 사용되는 성장 기판의 무결성의 보존 방법 |
| JP5625336B2 (ja) * | 2009-11-30 | 2014-11-19 | サンケン電気株式会社 | 半導体装置 |
| US8389977B2 (en) | 2009-12-10 | 2013-03-05 | Transphorm Inc. | Reverse side engineered III-nitride devices |
| US9378965B2 (en) * | 2009-12-10 | 2016-06-28 | Infineon Technologies Americas Corp. | Highly conductive source/drain contacts in III-nitride transistors |
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| JP5725749B2 (ja) * | 2010-07-28 | 2015-05-27 | 住友電工デバイス・イノベーション株式会社 | 半導体装置の製造方法 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9590060B2 (en) | 2013-03-13 | 2017-03-07 | Transphorm Inc. | Enhancement-mode III-nitride devices |
| US9318593B2 (en) | 2014-07-21 | 2016-04-19 | Transphorm Inc. | Forming enhancement mode III-nitride devices |
| US9536967B2 (en) | 2014-12-16 | 2017-01-03 | Transphorm Inc. | Recessed ohmic contacts in a III-N device |
| US9536966B2 (en) | 2014-12-16 | 2017-01-03 | Transphorm Inc. | Gate structures for III-N devices |
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