|
JP5202050B2
(ja)
*
|
2008-03-14 |
2013-06-05 |
東京エレクトロン株式会社 |
シャワーヘッド及び基板処理装置
|
|
FR2930561B1
(fr)
*
|
2008-04-28 |
2011-01-14 |
Altatech Semiconductor |
Dispositif et procede de traitement chimique en phase vapeur.
|
|
KR20110025185A
(ko)
*
|
2008-05-28 |
2011-03-09 |
아익스트론 아게 |
열 구배 보강 화학 기상 증착
|
|
US20110070370A1
(en)
|
2008-05-28 |
2011-03-24 |
Aixtron Ag |
Thermal gradient enhanced chemical vapour deposition (tge-cvd)
|
|
JP2010016225A
(ja)
*
|
2008-07-04 |
2010-01-21 |
Tokyo Electron Ltd |
温度調節機構および温度調節機構を用いた半導体製造装置
|
|
JP5231117B2
(ja)
|
2008-07-24 |
2013-07-10 |
株式会社ニューフレアテクノロジー |
成膜装置および成膜方法
|
|
JP5106331B2
(ja)
|
2008-09-16 |
2012-12-26 |
東京エレクトロン株式会社 |
基板載置台の降温方法、コンピュータ読み取り可能な記憶媒体および基板処理システム
|
|
US10378106B2
(en)
|
2008-11-14 |
2019-08-13 |
Asm Ip Holding B.V. |
Method of forming insulation film by modified PEALD
|
|
US8931431B2
(en)
|
2009-03-25 |
2015-01-13 |
The Regents Of The University Of Michigan |
Nozzle geometry for organic vapor jet printing
|
|
US9394608B2
(en)
|
2009-04-06 |
2016-07-19 |
Asm America, Inc. |
Semiconductor processing reactor and components thereof
|
|
US8802201B2
(en)
|
2009-08-14 |
2014-08-12 |
Asm America, Inc. |
Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species
|
|
KR101108879B1
(ko)
*
|
2009-08-31 |
2012-01-30 |
주식회사 원익아이피에스 |
가스분사장치 및 이를 이용한 기판처리장치
|
|
US20110061812A1
(en)
*
|
2009-09-11 |
2011-03-17 |
Applied Materials, Inc. |
Apparatus and Methods for Cyclical Oxidation and Etching
|
|
US20110065276A1
(en)
*
|
2009-09-11 |
2011-03-17 |
Applied Materials, Inc. |
Apparatus and Methods for Cyclical Oxidation and Etching
|
|
US20110061810A1
(en)
*
|
2009-09-11 |
2011-03-17 |
Applied Materials, Inc. |
Apparatus and Methods for Cyclical Oxidation and Etching
|
|
JP5323628B2
(ja)
*
|
2009-09-17 |
2013-10-23 |
東京エレクトロン株式会社 |
プラズマ処理装置
|
|
WO2011044451A2
(en)
*
|
2009-10-09 |
2011-04-14 |
Applied Materials, Inc. |
Multi-gas centrally cooled showerhead design
|
|
JP2011168881A
(ja)
*
|
2010-01-25 |
2011-09-01 |
Hitachi Kokusai Electric Inc |
半導体装置の製造方法及び基板処理装置
|
|
JP5409413B2
(ja)
*
|
2010-01-26 |
2014-02-05 |
日本パイオニクス株式会社 |
Ｉｉｉ族窒化物半導体の気相成長装置
|
|
US9441295B2
(en)
*
|
2010-05-14 |
2016-09-13 |
Solarcity Corporation |
Multi-channel gas-delivery system
|
|
JP5982758B2
(ja)
*
|
2011-02-23 |
2016-08-31 |
東京エレクトロン株式会社 |
マイクロ波照射装置
|
|
US20120225203A1
(en)
*
|
2011-03-01 |
2012-09-06 |
Applied Materials, Inc. |
Apparatus and Process for Atomic Layer Deposition
|
|
US9312155B2
(en)
|
2011-06-06 |
2016-04-12 |
Asm Japan K.K. |
High-throughput semiconductor-processing apparatus equipped with multiple dual-chamber modules
|
|
US10364496B2
(en)
|
2011-06-27 |
2019-07-30 |
Asm Ip Holding B.V. |
Dual section module having shared and unshared mass flow controllers
|
|
US10854498B2
(en)
|
2011-07-15 |
2020-12-01 |
Asm Ip Holding B.V. |
Wafer-supporting device and method for producing same
|
|
US20130023129A1
(en)
|
2011-07-20 |
2013-01-24 |
Asm America, Inc. |
Pressure transmitter for a semiconductor processing environment
|
|
CN103014669B
(zh)
*
|
2011-09-23 |
2014-11-26 |
理想能源设备(上海)有限公司 |
化学气相沉积装置
|
|
CN103014667B
(zh)
*
|
2011-09-23 |
2015-07-01 |
理想能源设备(上海)有限公司 |
化学气相沉积装置
|
|
CN103014665B
(zh)
*
|
2011-09-23 |
2015-02-18 |
理想能源设备(上海)有限公司 |
金属有机化合物化学气相沉积装置及其气体输送方法
|
|
CN103014668B
(zh)
*
|
2011-09-23 |
2014-12-24 |
理想能源设备(上海)有限公司 |
化学气相沉积装置
|
|
CN103014666B
(zh)
*
|
2011-09-23 |
2014-11-26 |
理想能源设备(上海)有限公司 |
化学气相沉积装置
|
|
US9017481B1
(en)
|
2011-10-28 |
2015-04-28 |
Asm America, Inc. |
Process feed management for semiconductor substrate processing
|
|
JP6038618B2
(ja)
*
|
2011-12-15 |
2016-12-07 |
株式会社ニューフレアテクノロジー |
成膜装置および成膜方法
|
|
KR101327458B1
(ko)
*
|
2012-01-10 |
2013-11-08 |
주식회사 유진테크 |
냉각 방식의 샤워헤드 및 이를 구비하는 기판 처리 장치
|
|
CN103388132B
(zh)
*
|
2012-05-11 |
2015-11-25 |
中微半导体设备(上海)有限公司 |
气体喷淋头、其制造方法及薄膜生长反应器
|
|
US9659799B2
(en)
|
2012-08-28 |
2017-05-23 |
Asm Ip Holding B.V. |
Systems and methods for dynamic semiconductor process scheduling
|
|
US9021985B2
(en)
|
2012-09-12 |
2015-05-05 |
Asm Ip Holdings B.V. |
Process gas management for an inductively-coupled plasma deposition reactor
|
|
US9132436B2
(en)
*
|
2012-09-21 |
2015-09-15 |
Applied Materials, Inc. |
Chemical control features in wafer process equipment
|
|
US10714315B2
(en)
*
|
2012-10-12 |
2020-07-14 |
Asm Ip Holdings B.V. |
Semiconductor reaction chamber showerhead
|
|
US20160376700A1
(en)
|
2013-02-01 |
2016-12-29 |
Asm Ip Holding B.V. |
System for treatment of deposition reactor
|
|
JP6377642B2
(ja)
*
|
2013-02-06 |
2018-08-22 |
アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ |
ガス注入装置及びその装置を組み込む基板プロセスチャンバ
|
|
US9484191B2
(en)
|
2013-03-08 |
2016-11-01 |
Asm Ip Holding B.V. |
Pulsed remote plasma method and system
|
|
US9589770B2
(en)
|
2013-03-08 |
2017-03-07 |
Asm Ip Holding B.V. |
Method and systems for in-situ formation of intermediate reactive species
|
|
JP2013110440A
(ja)
*
|
2013-03-11 |
2013-06-06 |
Tokyo Electron Ltd |
電極ユニット及び基板処理装置
|
|
TWI627305B
(zh)
*
|
2013-03-15 |
2018-06-21 |
應用材料股份有限公司 |
用於轉盤處理室之具有剛性板的大氣蓋
|
|
JP2014192372A
(ja)
*
|
2013-03-27 |
2014-10-06 |
Tokyo Electron Ltd |
マイクロ波加熱処理装置
|
|
KR101467195B1
(ko)
*
|
2013-05-14 |
2014-12-01 |
주식회사 아바코 |
가스 분사기 및 이를 포함하는 박막 증착 장치
|
|
KR101526505B1
(ko)
*
|
2013-06-20 |
2015-06-09 |
피에스케이 주식회사 |
냉각 유닛 및 이를 이용한 냉각 방법, 기판 처리 장치 및 이를 이용한 기판 처리 방법
|
|
JP6180208B2
(ja)
*
|
2013-07-08 |
2017-08-16 |
株式会社ニューフレアテクノロジー |
気相成長装置および気相成長方法
|
|
US9240412B2
(en)
|
2013-09-27 |
2016-01-19 |
Asm Ip Holding B.V. |
Semiconductor structure and device and methods of forming same using selective epitaxial process
|
|
KR20150055227A
(ko)
*
|
2013-11-13 |
2015-05-21 |
삼성전자주식회사 |
샤워 헤드 및 이를 포함하는 기판 처리 장치
|
|
JP6135475B2
(ja)
*
|
2013-11-20 |
2017-05-31 |
東京エレクトロン株式会社 |
ガス供給装置、成膜装置、ガス供給方法及び記憶媒体
|
|
JP5971870B2
(ja)
|
2013-11-29 |
2016-08-17 |
株式会社日立国際電気 |
基板処理装置、半導体装置の製造方法及び記録媒体
|
|
JP5726281B1
(ja)
*
|
2013-12-27 |
2015-05-27 |
株式会社日立国際電気 |
基板処理装置及び半導体装置の製造方法
|
|
JP6123688B2
(ja)
*
|
2014-01-29 |
2017-05-10 |
東京エレクトロン株式会社 |
成膜装置
|
|
US10683571B2
(en)
|
2014-02-25 |
2020-06-16 |
Asm Ip Holding B.V. |
Gas supply manifold and method of supplying gases to chamber using same
|
|
US10167557B2
(en)
|
2014-03-18 |
2019-01-01 |
Asm Ip Holding B.V. |
Gas distribution system, reactor including the system, and methods of using the same
|
|
US11015245B2
(en)
|
2014-03-19 |
2021-05-25 |
Asm Ip Holding B.V. |
Gas-phase reactor and system having exhaust plenum and components thereof
|
|
FR3018825B1
(fr)
*
|
2014-03-21 |
2017-09-01 |
Altatech Semiconductor |
Procede de depot en phase gazeuse
|
|
SG10201810178TA
(en)
|
2014-05-16 |
2018-12-28 |
Applied Materials Inc |
Showerhead design
|
|
US9911579B2
(en)
|
2014-07-03 |
2018-03-06 |
Applied Materials, Inc. |
Showerhead having a detachable high resistivity gas distribution plate
|
|
US10858737B2
(en)
|
2014-07-28 |
2020-12-08 |
Asm Ip Holding B.V. |
Showerhead assembly and components thereof
|
|
US9890456B2
(en)
|
2014-08-21 |
2018-02-13 |
Asm Ip Holding B.V. |
Method and system for in situ formation of gas-phase compounds
|
|
US10407771B2
(en)
*
|
2014-10-06 |
2019-09-10 |
Applied Materials, Inc. |
Atomic layer deposition chamber with thermal lid
|
|
US9657845B2
(en)
|
2014-10-07 |
2017-05-23 |
Asm Ip Holding B.V. |
Variable conductance gas distribution apparatus and method
|
|
US10941490B2
(en)
|
2014-10-07 |
2021-03-09 |
Asm Ip Holding B.V. |
Multiple temperature range susceptor, assembly, reactor and system including the susceptor, and methods of using the same
|
|
KR102263121B1
(ko)
|
2014-12-22 |
2021-06-09 |
에이에스엠 아이피 홀딩 비.브이. |
반도체 소자 및 그 제조 방법
|
|
US10529542B2
(en)
|
2015-03-11 |
2020-01-07 |
Asm Ip Holdings B.V. |
Cross-flow reactor and method
|
|
US10276355B2
(en)
|
2015-03-12 |
2019-04-30 |
Asm Ip Holding B.V. |
Multi-zone reactor, system including the reactor, and method of using the same
|
|
JP6193284B2
(ja)
*
|
2015-03-18 |
2017-09-06 |
株式会社東芝 |
流路構造、吸排気部材、及び処理装置
|
|
CN104789943A
(zh)
*
|
2015-04-01 |
2015-07-22 |
沈阳拓荆科技有限公司 |
控温型双气体通道均匀喷气喷淋板
|
|
US9972740B2
(en)
|
2015-06-07 |
2018-05-15 |
Tesla, Inc. |
Chemical vapor deposition tool and process for fabrication of photovoltaic structures
|
|
US10458018B2
(en)
|
2015-06-26 |
2019-10-29 |
Asm Ip Holding B.V. |
Structures including metal carbide material, devices including the structures, and methods of forming same
|
|
US10600673B2
(en)
|
2015-07-07 |
2020-03-24 |
Asm Ip Holding B.V. |
Magnetic susceptor to baseplate seal
|
|
US10083836B2
(en)
|
2015-07-24 |
2018-09-25 |
Asm Ip Holding B.V. |
Formation of boron-doped titanium metal films with high work function
|
|
US20170029948A1
(en)
*
|
2015-07-28 |
2017-02-02 |
Asm Ip Holding B.V. |
Methods and apparatuses for temperature-indexed thin film deposition
|
|
US11421321B2
(en)
|
2015-07-28 |
2022-08-23 |
Asm Ip Holding B.V. |
Apparatuses for thin film deposition
|
|
US10204790B2
(en)
|
2015-07-28 |
2019-02-12 |
Asm Ip Holding B.V. |
Methods for thin film deposition
|
|
US9960072B2
(en)
|
2015-09-29 |
2018-05-01 |
Asm Ip Holding B.V. |
Variable adjustment for precise matching of multiple chamber cavity housings
|
|
US10211308B2
(en)
|
2015-10-21 |
2019-02-19 |
Asm Ip Holding B.V. |
NbMC layers
|
|
US10322384B2
(en)
|
2015-11-09 |
2019-06-18 |
Asm Ip Holding B.V. |
Counter flow mixer for process chamber
|
|
US11139308B2
(en)
|
2015-12-29 |
2021-10-05 |
Asm Ip Holding B.V. |
Atomic layer deposition of III-V compounds to form V-NAND devices
|
|
US10529554B2
(en)
|
2016-02-19 |
2020-01-07 |
Asm Ip Holding B.V. |
Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches
|
|
US10468251B2
(en)
|
2016-02-19 |
2019-11-05 |
Asm Ip Holding B.V. |
Method for forming spacers using silicon nitride film for spacer-defined multiple patterning
|
|
US10501866B2
(en)
|
2016-03-09 |
2019-12-10 |
Asm Ip Holding B.V. |
Gas distribution apparatus for improved film uniformity in an epitaxial system
|
|
US10343920B2
(en)
|
2016-03-18 |
2019-07-09 |
Asm Ip Holding B.V. |
Aligned carbon nanotubes
|
|
US9892913B2
(en)
|
2016-03-24 |
2018-02-13 |
Asm Ip Holding B.V. |
Radial and thickness control via biased multi-port injection settings
|
|
US10865475B2
(en)
|
2016-04-21 |
2020-12-15 |
Asm Ip Holding B.V. |
Deposition of metal borides and silicides
|
|
US10190213B2
(en)
|
2016-04-21 |
2019-01-29 |
Asm Ip Holding B.V. |
Deposition of metal borides
|
|
US10367080B2
(en)
|
2016-05-02 |
2019-07-30 |
Asm Ip Holding B.V. |
Method of forming a germanium oxynitride film
|
|
US10032628B2
(en)
|
2016-05-02 |
2018-07-24 |
Asm Ip Holding B.V. |
Source/drain performance through conformal solid state doping
|
|
KR102592471B1
(ko)
|
2016-05-17 |
2023-10-20 |
에이에스엠 아이피 홀딩 비.브이. |
금속 배선 형성 방법 및 이를 이용한 반도체 장치의 제조 방법
|
|
US9748434B1
(en)
|
2016-05-24 |
2017-08-29 |
Tesla, Inc. |
Systems, method and apparatus for curing conductive paste
|
|
US11453943B2
(en)
|
2016-05-25 |
2022-09-27 |
Asm Ip Holding B.V. |
Method for forming carbon-containing silicon/metal oxide or nitride film by ALD using silicon precursor and hydrocarbon precursor
|
|
EP3255173B1
(de)
*
|
2016-06-06 |
2018-11-21 |
Meyer Burger (Germany) AG |
Fluidtemperierter gasverteiler in schichtbauweise
|
|
JP6696322B2
(ja)
*
|
2016-06-24 |
2020-05-20 |
東京エレクトロン株式会社 |
ガス処理装置、ガス処理方法及び記憶媒体
|
|
US10388509B2
(en)
|
2016-06-28 |
2019-08-20 |
Asm Ip Holding B.V. |
Formation of epitaxial layers via dislocation filtering
|
|
US9859151B1
(en)
|
2016-07-08 |
2018-01-02 |
Asm Ip Holding B.V. |
Selective film deposition method to form air gaps
|
|
US10612137B2
(en)
|
2016-07-08 |
2020-04-07 |
Asm Ip Holdings B.V. |
Organic reactants for atomic layer deposition
|
|
US10714385B2
(en)
|
2016-07-19 |
2020-07-14 |
Asm Ip Holding B.V. |
Selective deposition of tungsten
|
|
KR102354490B1
(ko)
|
2016-07-27 |
2022-01-21 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 방법
|
|
US10395919B2
(en)
|
2016-07-28 |
2019-08-27 |
Asm Ip Holding B.V. |
Method and apparatus for filling a gap
|
|
KR102532607B1
(ko)
|
2016-07-28 |
2023-05-15 |
에이에스엠 아이피 홀딩 비.브이. |
기판 가공 장치 및 그 동작 방법
|
|
US9887082B1
(en)
|
2016-07-28 |
2018-02-06 |
Asm Ip Holding B.V. |
Method and apparatus for filling a gap
|
|
US9812320B1
(en)
|
2016-07-28 |
2017-11-07 |
Asm Ip Holding B.V. |
Method and apparatus for filling a gap
|
|
US9954136B2
(en)
|
2016-08-03 |
2018-04-24 |
Tesla, Inc. |
Cassette optimized for an inline annealing system
|
|
US10410943B2
(en)
|
2016-10-13 |
2019-09-10 |
Asm Ip Holding B.V. |
Method for passivating a surface of a semiconductor and related systems
|
|
US10643826B2
(en)
|
2016-10-26 |
2020-05-05 |
Asm Ip Holdings B.V. |
Methods for thermally calibrating reaction chambers
|
|
US11532757B2
(en)
|
2016-10-27 |
2022-12-20 |
Asm Ip Holding B.V. |
Deposition of charge trapping layers
|
|
US10115856B2
(en)
|
2016-10-31 |
2018-10-30 |
Tesla, Inc. |
System and method for curing conductive paste using induction heating
|
|
US10435790B2
(en)
|
2016-11-01 |
2019-10-08 |
Asm Ip Holding B.V. |
Method of subatmospheric plasma-enhanced ALD using capacitively coupled electrodes with narrow gap
|
|
US10643904B2
(en)
|
2016-11-01 |
2020-05-05 |
Asm Ip Holdings B.V. |
Methods for forming a semiconductor device and related semiconductor device structures
|
|
US10714350B2
(en)
|
2016-11-01 |
2020-07-14 |
ASM IP Holdings, B.V. |
Methods for forming a transition metal niobium nitride film on a substrate by atomic layer deposition and related semiconductor device structures
|
|
US10229833B2
(en)
|
2016-11-01 |
2019-03-12 |
Asm Ip Holding B.V. |
Methods for forming a transition metal nitride film on a substrate by atomic layer deposition and related semiconductor device structures
|
|
WO2018083989A1
(ja)
*
|
2016-11-02 |
2018-05-11 |
東京エレクトロン株式会社 |
シャワーヘッド及び基板処理装置
|
|
US10134757B2
(en)
|
2016-11-07 |
2018-11-20 |
Asm Ip Holding B.V. |
Method of processing a substrate and a device manufactured by using the method
|
|
KR102546317B1
(ko)
|
2016-11-15 |
2023-06-21 |
에이에스엠 아이피 홀딩 비.브이. |
기체 공급 유닛 및 이를 포함하는 기판 처리 장치
|
|
US10340135B2
(en)
|
2016-11-28 |
2019-07-02 |
Asm Ip Holding B.V. |
Method of topologically restricted plasma-enhanced cyclic deposition of silicon or metal nitride
|
|
KR102762543B1
(ko)
|
2016-12-14 |
2025-02-05 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
|
US11581186B2
(en)
|
2016-12-15 |
2023-02-14 |
Asm Ip Holding B.V. |
Sequential infiltration synthesis apparatus
|
|
US11447861B2
(en)
|
2016-12-15 |
2022-09-20 |
Asm Ip Holding B.V. |
Sequential infiltration synthesis apparatus and a method of forming a patterned structure
|
|
KR102700194B1
(ko)
|
2016-12-19 |
2024-08-28 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
|
US10269558B2
(en)
|
2016-12-22 |
2019-04-23 |
Asm Ip Holding B.V. |
Method of forming a structure on a substrate
|
|
US10867788B2
(en)
|
2016-12-28 |
2020-12-15 |
Asm Ip Holding B.V. |
Method of forming a structure on a substrate
|
|
US11390950B2
(en)
|
2017-01-10 |
2022-07-19 |
Asm Ip Holding B.V. |
Reactor system and method to reduce residue buildup during a film deposition process
|
|
US10655221B2
(en)
|
2017-02-09 |
2020-05-19 |
Asm Ip Holding B.V. |
Method for depositing oxide film by thermal ALD and PEALD
|
|
US10468261B2
(en)
|
2017-02-15 |
2019-11-05 |
Asm Ip Holding B.V. |
Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures
|
|
US10283353B2
(en)
|
2017-03-29 |
2019-05-07 |
Asm Ip Holding B.V. |
Method of reforming insulating film deposited on substrate with recess pattern
|
|
KR102096700B1
(ko)
*
|
2017-03-29 |
2020-04-02 |
도쿄엘렉트론가부시키가이샤 |
기판 처리 장치 및 기판 처리 방법
|
|
US10529563B2
(en)
|
2017-03-29 |
2020-01-07 |
Asm Ip Holdings B.V. |
Method for forming doped metal oxide films on a substrate by cyclical deposition and related semiconductor device structures
|
|
KR102457289B1
(ko)
|
2017-04-25 |
2022-10-21 |
에이에스엠 아이피 홀딩 비.브이. |
박막 증착 방법 및 반도체 장치의 제조 방법
|
|
US10892156B2
(en)
|
2017-05-08 |
2021-01-12 |
Asm Ip Holding B.V. |
Methods for forming a silicon nitride film on a substrate and related semiconductor device structures
|
|
US10446393B2
(en)
|
2017-05-08 |
2019-10-15 |
Asm Ip Holding B.V. |
Methods for forming silicon-containing epitaxial layers and related semiconductor device structures
|
|
US10770286B2
(en)
|
2017-05-08 |
2020-09-08 |
Asm Ip Holdings B.V. |
Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures
|
|
US10504742B2
(en)
|
2017-05-31 |
2019-12-10 |
Asm Ip Holding B.V. |
Method of atomic layer etching using hydrogen plasma
|
|
US10886123B2
(en)
|
2017-06-02 |
2021-01-05 |
Asm Ip Holding B.V. |
Methods for forming low temperature semiconductor layers and related semiconductor device structures
|
|
US12040200B2
(en)
|
2017-06-20 |
2024-07-16 |
Asm Ip Holding B.V. |
Semiconductor processing apparatus and methods for calibrating a semiconductor processing apparatus
|
|
US11306395B2
(en)
|
2017-06-28 |
2022-04-19 |
Asm Ip Holding B.V. |
Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus
|
|
US10685834B2
(en)
|
2017-07-05 |
2020-06-16 |
Asm Ip Holdings B.V. |
Methods for forming a silicon germanium tin layer and related semiconductor device structures
|
|
KR20190009245A
(ko)
|
2017-07-18 |
2019-01-28 |
에이에스엠 아이피 홀딩 비.브이. |
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|
|
US10541333B2
(en)
|
2017-07-19 |
2020-01-21 |
Asm Ip Holding B.V. |
Method for depositing a group IV semiconductor and related semiconductor device structures
|
|
US11374112B2
(en)
|
2017-07-19 |
2022-06-28 |
Asm Ip Holding B.V. |
Method for depositing a group IV semiconductor and related semiconductor device structures
|
|
US11018002B2
(en)
|
2017-07-19 |
2021-05-25 |
Asm Ip Holding B.V. |
Method for selectively depositing a Group IV semiconductor and related semiconductor device structures
|
|
US10605530B2
(en)
|
2017-07-26 |
2020-03-31 |
Asm Ip Holding B.V. |
Assembly of a liner and a flange for a vertical furnace as well as the liner and the vertical furnace
|
|
US10590535B2
(en)
|
2017-07-26 |
2020-03-17 |
Asm Ip Holdings B.V. |
Chemical treatment, deposition and/or infiltration apparatus and method for using the same
|
|
US10312055B2
(en)
|
2017-07-26 |
2019-06-04 |
Asm Ip Holding B.V. |
Method of depositing film by PEALD using negative bias
|
|
TWI815813B
(zh)
|
2017-08-04 |
2023-09-21 |
荷蘭商Ａｓｍ智慧財產控股公司 |
用於分配反應腔內氣體的噴頭總成
|
|
US10770336B2
(en)
|
2017-08-08 |
2020-09-08 |
Asm Ip Holding B.V. |
Substrate lift mechanism and reactor including same
|
|
US10692741B2
(en)
|
2017-08-08 |
2020-06-23 |
Asm Ip Holdings B.V. |
Radiation shield
|
|
US11769682B2
(en)
|
2017-08-09 |
2023-09-26 |
Asm Ip Holding B.V. |
Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
|
|
US11139191B2
(en)
|
2017-08-09 |
2021-10-05 |
Asm Ip Holding B.V. |
Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
|
|
US10249524B2
(en)
|
2017-08-09 |
2019-04-02 |
Asm Ip Holding B.V. |
Cassette holder assembly for a substrate cassette and holding member for use in such assembly
|
|
US10236177B1
(en)
|
2017-08-22 |
2019-03-19 |
ASM IP Holding B.V.. |
Methods for depositing a doped germanium tin semiconductor and related semiconductor device structures
|
|
USD900036S1
(en)
|
2017-08-24 |
2020-10-27 |
Asm Ip Holding B.V. |
Heater electrical connector and adapter
|
|
US11830730B2
(en)
|
2017-08-29 |
2023-11-28 |
Asm Ip Holding B.V. |
Layer forming method and apparatus
|
|
US11295980B2
(en)
|
2017-08-30 |
2022-04-05 |
Asm Ip Holding B.V. |
Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures
|
|
US11056344B2
(en)
|
2017-08-30 |
2021-07-06 |
Asm Ip Holding B.V. |
Layer forming method
|
|
KR102491945B1
(ko)
|
2017-08-30 |
2023-01-26 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
|
KR102401446B1
(ko)
|
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2022-05-24 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
|
US10607895B2
(en)
|
2017-09-18 |
2020-03-31 |
Asm Ip Holdings B.V. |
Method for forming a semiconductor device structure comprising a gate fill metal
|
|
KR102630301B1
(ko)
|
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2024-01-29 |
에이에스엠 아이피 홀딩 비.브이. |
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|
|
US10844484B2
(en)
|
2017-09-22 |
2020-11-24 |
Asm Ip Holding B.V. |
Apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
|
|
US10658205B2
(en)
|
2017-09-28 |
2020-05-19 |
Asm Ip Holdings B.V. |
Chemical dispensing apparatus and methods for dispensing a chemical to a reaction chamber
|
|
US10403504B2
(en)
|
2017-10-05 |
2019-09-03 |
Asm Ip Holding B.V. |
Method for selectively depositing a metallic film on a substrate
|
|
US10319588B2
(en)
|
2017-10-10 |
2019-06-11 |
Asm Ip Holding B.V. |
Method for depositing a metal chalcogenide on a substrate by cyclical deposition
|
|
US10923344B2
(en)
|
2017-10-30 |
2021-02-16 |
Asm Ip Holding B.V. |
Methods for forming a semiconductor structure and related semiconductor structures
|
|
KR102443047B1
(ko)
|
2017-11-16 |
2022-09-14 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치 방법 및 그에 의해 제조된 장치
|
|
US10910262B2
(en)
|
2017-11-16 |
2021-02-02 |
Asm Ip Holding B.V. |
Method of selectively depositing a capping layer structure on a semiconductor device structure
|
|
US11022879B2
(en)
|
2017-11-24 |
2021-06-01 |
Asm Ip Holding B.V. |
Method of forming an enhanced unexposed photoresist layer
|
|
CN111344522B
(zh)
|
2017-11-27 |
2022-04-12 |
阿斯莫Ip控股公司 |
包括洁净迷你环境的装置
|
|
US11127617B2
(en)
|
2017-11-27 |
2021-09-21 |
Asm Ip Holding B.V. |
Storage device for storing wafer cassettes for use with a batch furnace
|
|
US10290508B1
(en)
|
2017-12-05 |
2019-05-14 |
Asm Ip Holding B.V. |
Method for forming vertical spacers for spacer-defined patterning
|
|
US10872771B2
(en)
|
2018-01-16 |
2020-12-22 |
Asm Ip Holding B. V. |
Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures
|
|
KR102695659B1
(ko)
|
2018-01-19 |
2024-08-14 |
에이에스엠 아이피 홀딩 비.브이. |
플라즈마 보조 증착에 의해 갭 충진 층을 증착하는 방법
|
|
TWI852426B
(zh)
|
2018-01-19 |
2024-08-11 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
沈積方法
|
|
USD903477S1
(en)
|
2018-01-24 |
2020-12-01 |
Asm Ip Holdings B.V. |
Metal clamp
|
|
US11018047B2
(en)
|
2018-01-25 |
2021-05-25 |
Asm Ip Holding B.V. |
Hybrid lift pin
|
|
USD880437S1
(en)
|
2018-02-01 |
2020-04-07 |
Asm Ip Holding B.V. |
Gas supply plate for semiconductor manufacturing apparatus
|
|
US10535516B2
(en)
|
2018-02-01 |
2020-01-14 |
Asm Ip Holdings B.V. |
Method for depositing a semiconductor structure on a surface of a substrate and related semiconductor structures
|
|
US11081345B2
(en)
|
2018-02-06 |
2021-08-03 |
Asm Ip Holding B.V. |
Method of post-deposition treatment for silicon oxide film
|
|
US10896820B2
(en)
|
2018-02-14 |
2021-01-19 |
Asm Ip Holding B.V. |
Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process
|
|
EP3737779A1
(en)
|
2018-02-14 |
2020-11-18 |
ASM IP Holding B.V. |
A method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process
|
|
US10731249B2
(en)
|
2018-02-15 |
2020-08-04 |
Asm Ip Holding B.V. |
Method of forming a transition metal containing film on a substrate by a cyclical deposition process, a method for supplying a transition metal halide compound to a reaction chamber, and related vapor deposition apparatus
|
|
KR102636427B1
(ko)
|
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2024-02-13 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 방법 및 장치
|
|
US10658181B2
(en)
|
2018-02-20 |
2020-05-19 |
Asm Ip Holding B.V. |
Method of spacer-defined direct patterning in semiconductor fabrication
|
|
US10975470B2
(en)
|
2018-02-23 |
2021-04-13 |
Asm Ip Holding B.V. |
Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment
|
|
US11473195B2
(en)
|
2018-03-01 |
2022-10-18 |
Asm Ip Holding B.V. |
Semiconductor processing apparatus and a method for processing a substrate
|
|
US11629406B2
(en)
|
2018-03-09 |
2023-04-18 |
Asm Ip Holding B.V. |
Semiconductor processing apparatus comprising one or more pyrometers for measuring a temperature of a substrate during transfer of the substrate
|
|
US11114283B2
(en)
|
2018-03-16 |
2021-09-07 |
Asm Ip Holding B.V. |
Reactor, system including the reactor, and methods of manufacturing and using same
|
|
KR102646467B1
(ko)
|
2018-03-27 |
2024-03-11 |
에이에스엠 아이피 홀딩 비.브이. |
기판 상에 전극을 형성하는 방법 및 전극을 포함하는 반도체 소자 구조
|
|
US10510536B2
(en)
|
2018-03-29 |
2019-12-17 |
Asm Ip Holding B.V. |
Method of depositing a co-doped polysilicon film on a surface of a substrate within a reaction chamber
|
|
US11230766B2
(en)
|
2018-03-29 |
2022-01-25 |
Asm Ip Holding B.V. |
Substrate processing apparatus and method
|
|
US11088002B2
(en)
|
2018-03-29 |
2021-08-10 |
Asm Ip Holding B.V. |
Substrate rack and a substrate processing system and method
|
|
KR102501472B1
(ko)
|
2018-03-30 |
2023-02-20 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 방법
|
|
KR102600229B1
(ko)
|
2018-04-09 |
2023-11-10 |
에이에스엠 아이피 홀딩 비.브이. |
기판 지지 장치, 이를 포함하는 기판 처리 장치 및 기판 처리 방법
|
|
JP7093667B2
(ja)
*
|
2018-04-11 |
2022-06-30 |
東京エレクトロン株式会社 |
成膜装置及び成膜方法
|
|
US12025484B2
(en)
|
2018-05-08 |
2024-07-02 |
Asm Ip Holding B.V. |
Thin film forming method
|
|
TWI811348B
(zh)
|
2018-05-08 |
2023-08-11 |
荷蘭商Ａｓｍ 智慧財產控股公司 |
藉由循環沉積製程於基板上沉積氧化物膜之方法及相關裝置結構
|
|
US12272527B2
(en)
|
2018-05-09 |
2025-04-08 |
Asm Ip Holding B.V. |
Apparatus for use with hydrogen radicals and method of using same
|
|
TWI879056B
(zh)
|
2018-05-11 |
2025-04-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
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|
|
KR102596988B1
(ko)
|
2018-05-28 |
2023-10-31 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 방법 및 그에 의해 제조된 장치
|
|
TWI840362B
(zh)
|
2018-06-04 |
2024-05-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
水氣降低的晶圓處置腔室
|
|
US11718913B2
(en)
|
2018-06-04 |
2023-08-08 |
Asm Ip Holding B.V. |
Gas distribution system and reactor system including same
|
|
US11286562B2
(en)
|
2018-06-08 |
2022-03-29 |
Asm Ip Holding B.V. |
Gas-phase chemical reactor and method of using same
|
|
US10797133B2
(en)
|
2018-06-21 |
2020-10-06 |
Asm Ip Holding B.V. |
Method for depositing a phosphorus doped silicon arsenide film and related semiconductor device structures
|
|
KR102568797B1
(ko)
|
2018-06-21 |
2023-08-21 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 시스템
|
|
TWI871083B
(zh)
|
2018-06-27 |
2025-01-21 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
用於形成含金屬材料之循環沉積製程
|
|
JP7515411B2
(ja)
|
2018-06-27 |
2024-07-12 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
金属含有材料ならびに金属含有材料を含む膜および構造体を形成するための周期的堆積方法
|
|
US10612136B2
(en)
|
2018-06-29 |
2020-04-07 |
ASM IP Holding, B.V. |
Temperature-controlled flange and reactor system including same
|
|
KR102686758B1
(ko)
|
2018-06-29 |
2024-07-18 |
에이에스엠 아이피 홀딩 비.브이. |
박막 증착 방법 및 반도체 장치의 제조 방법
|
|
US10388513B1
(en)
|
2018-07-03 |
2019-08-20 |
Asm Ip Holding B.V. |
Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
|
|
US10755922B2
(en)
|
2018-07-03 |
2020-08-25 |
Asm Ip Holding B.V. |
Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
|
|
US10767789B2
(en)
|
2018-07-16 |
2020-09-08 |
Asm Ip Holding B.V. |
Diaphragm valves, valve components, and methods for forming valve components
|
|
US10483099B1
(en)
|
2018-07-26 |
2019-11-19 |
Asm Ip Holding B.V. |
Method for forming thermally stable organosilicon polymer film
|
|
US11053591B2
(en)
|
2018-08-06 |
2021-07-06 |
Asm Ip Holding B.V. |
Multi-port gas injection system and reactor system including same
|
|
JP6715894B2
(ja)
*
|
2018-08-07 |
2020-07-01 |
株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ |
半導体装置の製造方法、基板処理装置およびプログラム
|
|
US10883175B2
(en)
|
2018-08-09 |
2021-01-05 |
Asm Ip Holding B.V. |
Vertical furnace for processing substrates and a liner for use therein
|
|
US10829852B2
(en)
|
2018-08-16 |
2020-11-10 |
Asm Ip Holding B.V. |
Gas distribution device for a wafer processing apparatus
|
|
US11430674B2
(en)
|
2018-08-22 |
2022-08-30 |
Asm Ip Holding B.V. |
Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
|
|
KR102707956B1
(ko)
|
2018-09-11 |
2024-09-19 |
에이에스엠 아이피 홀딩 비.브이. |
박막 증착 방법
|
|
US11024523B2
(en)
|
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Substrate processing apparatus and method
|
|
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(en)
|
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|
|
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(zh)
|
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|
|
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|
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|
|
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(ko)
|
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|
|
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(en)
|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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(en)
|
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|
|
US10381219B1
(en)
|
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Asm Ip Holding B.V. |
Methods for forming a silicon nitride film
|
|
US12378665B2
(en)
|
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High temperature coatings for a preclean and etch apparatus and related methods
|
|
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(en)
|
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|
|
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(ko)
|
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에이에스엠 아이피 홀딩 비.브이. |
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|
|
US11572620B2
(en)
|
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Methods for selectively depositing an amorphous silicon film on a substrate
|
|
US11031242B2
(en)
|
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|
|
US10818758B2
(en)
|
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2020-10-27 |
Asm Ip Holding B.V. |
Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures
|
|
US10847366B2
(en)
|
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2020-11-24 |
Asm Ip Holding B.V. |
Methods for depositing a transition metal chalcogenide film on a substrate by a cyclical deposition process
|
|
US10559458B1
(en)
|
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2020-02-11 |
Asm Ip Holding B.V. |
Method of forming oxynitride film
|
|
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(en)
|
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|
|
US11217444B2
(en)
|
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|
|
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(ko)
|
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에이에스엠 아이피 홀딩 비.브이. |
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|
|
US11158513B2
(en)
|
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Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures
|
|
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(zh)
|
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|
|
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(ja)
*
|
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|
|
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(zh)
|
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|
|
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(ko)
|
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|
|
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(zh)
|
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|
|
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(ko)
|
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|
|
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|
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|
|
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(zh)
|
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|
|
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|
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|
|
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|
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|
|
US11742198B2
(en)
|
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|
|
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(ko)
|
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에이에스엠 아이피 홀딩 비.브이. |
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|
|
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(ko)
|
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|
|
JP7520868B2
(ja)
*
|
2019-03-11 |
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|
|
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(ko)
|
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에이에스엠 아이피 홀딩 비.브이. |
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|
|
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(ko)
|
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|
|
US11447864B2
(en)
|
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|
|
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(ko)
|
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|
|
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|
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|
|
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(ko)
|
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|
|
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(ko)
|
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|
|
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(ja)
|
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|
|
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|
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|
|
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(en)
|
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|
|
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|
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|
|
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|
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|
|
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(en)
|
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|
|
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(ko)
|
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에이에스엠 아이피 홀딩 비.브이. |
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|
|
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(ko)
|
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|
|
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(ko)
|
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|
|
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(en)
|
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|
|
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(en)
|
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|
|
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(ko)
|
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|
|
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(ko)
*
|
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|
|
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|
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|
|
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(zh)
|
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|
|
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(ko)
|
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에이에스엠 아이피 홀딩 비.브이. |
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|
|
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(ko)
|
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|
|
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(ko)
|
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|
|
US11643724B2
(en)
|
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Asm Ip Holding B.V. |
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|
|
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(zh)
|
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|
|
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(zh)
|
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|
|
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(zh)
|
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|
|
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(ko)
|
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에이에스엠 아이피 홀딩 비.브이. |
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|
|
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(zh)
|
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|
|
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(zh)
|
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|
|
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(en)
|
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2023-02-21 |
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|
|
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(en)
|
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2023-02-21 |
Asm Ip Holding B.V. |
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|
|
US11227782B2
(en)
|
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2022-01-18 |
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|
|
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(ko)
|
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2021-02-18 |
에이에스엠 아이피 홀딩 비.브이. |
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|
|
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(ko)
|
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에이에스엠 아이피 홀딩 비.브이. |
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|
|
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(en)
|
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2022-10-04 |
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|
|
USD965044S1
(en)
|
2019-08-19 |
2022-09-27 |
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|
|
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(ja)
|
2019-08-21 |
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|
|
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(ko)
|
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2021-03-05 |
에이에스엠 아이피 홀딩 비.브이. |
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|
|
USD949319S1
(en)
|
2019-08-22 |
2022-04-19 |
Asm Ip Holding B.V. |
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|
|
USD930782S1
(en)
|
2019-08-22 |
2021-09-14 |
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Gas distributor
|
|
USD940837S1
(en)
|
2019-08-22 |
2022-01-11 |
Asm Ip Holding B.V. |
Electrode
|
|
USD979506S1
(en)
|
2019-08-22 |
2023-02-28 |
Asm Ip Holding B.V. |
Insulator
|
|
KR20210024420A
(ko)
|
2019-08-23 |
2021-03-05 |
에이에스엠 아이피 홀딩 비.브이. |
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|
|
US11286558B2
(en)
|
2019-08-23 |
2022-03-29 |
Asm Ip Holding B.V. |
Methods for depositing a molybdenum nitride film on a surface of a substrate by a cyclical deposition process and related semiconductor device structures including a molybdenum nitride film
|
|
KR102806450B1
(ko)
|
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2025-05-12 |
에이에스엠 아이피 홀딩 비.브이. |
희생 캡핑 층을 이용한 선택적 증착 방법
|
|
KR102733104B1
(ko)
|
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2024-11-22 |
에이에스엠 아이피 홀딩 비.브이. |
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|
|
US12469693B2
(en)
|
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2025-11-11 |
Asm Ip Holding B.V. |
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|
|
US11562901B2
(en)
|
2019-09-25 |
2023-01-24 |
Asm Ip Holding B.V. |
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|
|
CN112593212B
(zh)
|
2019-10-02 |
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|
|
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(ko)
|
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에이에스엠 아이피 홀딩 비.브이. |
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|
|
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(zh)
|
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|
|
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(zh)
|
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|
|
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(ko)
|
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에이에스엠 아이피 홀딩 비.브이. |
포토레지스트 하부층을 형성하기 위한 방법 및 이를 포함한 구조체
|
|
US12009241B2
(en)
|
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Vertical batch furnace assembly with detector to detect cassette
|
|
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(zh)
|
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|
|
US11637014B2
(en)
|
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Methods for selective deposition of doped semiconductor material
|
|
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(ko)
|
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|
|
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(ko)
|
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|
|
US11646205B2
(en)
|
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Asm Ip Holding B.V. |
Methods of selectively forming n-type doped material on a surface, systems for selectively forming n-type doped material, and structures formed using same
|
|
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(ko)
|
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|
|
US11501968B2
(en)
|
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|
|
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(ko)
|
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|
|
US11450529B2
(en)
|
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Asm Ip Holding B.V. |
Methods for selectively forming a target film on a substrate comprising a first dielectric surface and a second metallic surface
|
|
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(zh)
|
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|
|
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(zh)
|
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|
|
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(zh)
|
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|
|
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(ja)
|
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基板処理装置、基板処理方法
|
|
KR20210070898A
(ko)
*
|
2019-12-04 |
2021-06-15 |
에이에스엠 아이피 홀딩 비.브이. |
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|
|
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(ja)
|
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|
|
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(ko)
|
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|
|
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(zh)
|
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|
|
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(ja)
|
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|
|
US11993847B2
(en)
|
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Asm Ip Holding B.V. |
Injector
|
|
KR102882467B1
(ko)
|
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에이에스엠 아이피 홀딩 비.브이. |
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|
|
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(ko)
|
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|
|
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(zh)
|
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|
|
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(zh)
|
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|
|
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(ko)
|
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|
|
US11776846B2
(en)
|
2020-02-07 |
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Asm Ip Holding B.V. |
Methods for depositing gap filling fluids and related systems and devices
|
|
TW202146691A
(zh)
|
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|
|
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(ko)
|
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|
|
US11781243B2
(en)
|
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Asm Ip Holding B.V. |
Method for depositing low temperature phosphorous-doped silicon
|
|
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(zh)
|
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|
|
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(ko)
|
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에이에스엠 아이피 홀딩 비.브이. |
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|
|
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(ko)
|
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에이에스엠 아이피 홀딩 비.브이. |
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|
|
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(ko)
|
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|
|
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(ko)
|
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타겟 토폴로지 프로파일을 갖는 층 구조를 제조하기 위한 방법
|
|
US12173404B2
(en)
|
2020-03-17 |
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Asm Ip Holding B.V. |
Method of depositing epitaxial material, structure formed using the method, and system for performing the method
|
|
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(ko)
|
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에이에스엠 아이피 홀딩 비.브이. |
박막 형성 방법
|
|
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(zh)
|
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|
|
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(zh)
|
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|
|
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(ko)
|
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에이에스엠 아이피 홀딩 비.브이. |
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|
|
US11821078B2
(en)
|
2020-04-15 |
2023-11-21 |
Asm Ip Holding B.V. |
Method for forming precoat film and method for forming silicon-containing film
|
|
JP7678823B2
(ja)
*
|
2020-04-16 |
2025-05-16 |
ラム リサーチ コーポレーション |
ガス冷却を使用するシャワーヘッド熱管理
|
|
US11996289B2
(en)
|
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2024-05-28 |
Asm Ip Holding B.V. |
Methods of forming structures including silicon germanium and silicon layers, devices formed using the methods, and systems for performing the methods
|
|
TW202143328A
(zh)
|
2020-04-21 |
2021-11-16 |
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|
|
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(zh)
|
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|
|
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(zh)
|
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|
|
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(ko)
|
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|
|
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(ko)
|
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에이에스엠 아이피 홀딩 비.브이. |
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|
|
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(ko)
|
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|
|
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(ko)
|
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에이에스엠 아이피 홀딩 비.브이. |
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|
|
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(ko)
|
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|
|
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(ja)
|
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|
|
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(ja)
|
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|
|
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(ko)
|
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에이에스엠 아이피 홀딩 비.브이. |
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|
|
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(zh)
|
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|
|
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(zh)
|
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|
|
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(ko)
|
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|
|
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(ko)
|
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|
|
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(ko)
|
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|
|
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(zh)
|
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沉積含硼及鎵的矽鍺層之方法
|
|
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(zh)
|
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|
|
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(zh)
|
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2022-04-01 |
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|
|
CN115943228A
(zh)
*
|
2020-06-10 |
2023-04-07 |
朗姆研究公司 |
分割式喷头冷却板
|
|
TW202208659A
(zh)
|
2020-06-16 |
2022-03-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
沉積含硼之矽鍺層的方法
|
|
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(ko)
|
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2021-12-31 |
에이에스엠 아이피 홀딩 비.브이. |
실리콘이 구비된 층을 형성하는 방법
|
|
TWI873359B
(zh)
|
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2025-02-21 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
基板處理方法
|
|
TWI896694B
(zh)
|
2020-07-01 |
2025-09-11 |
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沉積方法、半導體結構、及沉積系統
|
|
KR102707957B1
(ko)
|
2020-07-08 |
2024-09-19 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 방법
|
|
KR20220010438A
(ko)
|
2020-07-17 |
2022-01-25 |
에이에스엠 아이피 홀딩 비.브이. |
포토리소그래피에 사용하기 위한 구조체 및 방법
|
|
KR20220011092A
(ko)
|
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2022-01-27 |
에이에스엠 아이피 홀딩 비.브이. |
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|
|
TWI878570B
(zh)
|
2020-07-20 |
2025-04-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
用於沉積鉬層之方法及系統
|
|
US12322591B2
(en)
|
2020-07-27 |
2025-06-03 |
Asm Ip Holding B.V. |
Thin film deposition process
|
|
KR20220021863A
(ko)
|
2020-08-14 |
2022-02-22 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 방법
|
|
US12040177B2
(en)
|
2020-08-18 |
2024-07-16 |
Asm Ip Holding B.V. |
Methods for forming a laminate film by cyclical plasma-enhanced deposition processes
|
|
TW202228863A
(zh)
|
2020-08-25 |
2022-08-01 |
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清潔基板的方法、選擇性沉積的方法、及反應器系統
|
|
US11725280B2
(en)
|
2020-08-26 |
2023-08-15 |
Asm Ip Holding B.V. |
Method for forming metal silicon oxide and metal silicon oxynitride layers
|
|
TW202229601A
(zh)
|
2020-08-27 |
2022-08-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
形成圖案化結構的方法、操控機械特性的方法、裝置結構、及基板處理系統
|
|
KR20220033997A
(ko)
|
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2022-03-17 |
에이에스엠 아이피 홀딩 비.브이. |
갭 충진 유체를 증착하기 위한 방법 그리고 이와 관련된 시스템 및 장치
|
|
USD990534S1
(en)
|
2020-09-11 |
2023-06-27 |
Asm Ip Holding B.V. |
Weighted lift pin
|
|
KR20220036866A
(ko)
|
2020-09-16 |
2022-03-23 |
에이에스엠 아이피 홀딩 비.브이. |
실리콘 산화물 증착 방법
|
|
JP2023541888A
(ja)
*
|
2020-09-17 |
2023-10-04 |
ラム リサーチ コーポレーション |
高温プロセス用の別々のフェースプレートを有するハイブリッドシャワーヘッド
|
|
US12451331B2
(en)
*
|
2020-09-22 |
2025-10-21 |
Applied Materials, Inc. |
Showerhead assembly with recursive gas channels
|
|
USD1012873S1
(en)
|
2020-09-24 |
2024-01-30 |
Asm Ip Holding B.V. |
Electrode for semiconductor processing apparatus
|
|
US20230383406A1
(en)
*
|
2020-09-25 |
2023-11-30 |
Lam Research Corporation |
Axially cooled metal showerheads for high temperature processes
|
|
TWI889903B
(zh)
|
2020-09-25 |
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|
|
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|
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|
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