JP2009266887A5 - - Google Patents
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- Publication number
- JP2009266887A5 JP2009266887A5 JP2008111444A JP2008111444A JP2009266887A5 JP 2009266887 A5 JP2009266887 A5 JP 2009266887A5 JP 2008111444 A JP2008111444 A JP 2008111444A JP 2008111444 A JP2008111444 A JP 2008111444A JP 2009266887 A5 JP2009266887 A5 JP 2009266887A5
- Authority
- JP
- Japan
- Prior art keywords
- window
- flange
- flange portion
- receives
- manufacturing apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008111444A JP5110649B2 (ja) | 2008-04-22 | 2008-04-22 | 半導体製造装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008111444A JP5110649B2 (ja) | 2008-04-22 | 2008-04-22 | 半導体製造装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009266887A JP2009266887A (ja) | 2009-11-12 |
| JP2009266887A5 true JP2009266887A5 (enExample) | 2011-05-12 |
| JP5110649B2 JP5110649B2 (ja) | 2012-12-26 |
Family
ID=41392394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008111444A Active JP5110649B2 (ja) | 2008-04-22 | 2008-04-22 | 半導体製造装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5110649B2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013229494A (ja) * | 2012-04-26 | 2013-11-07 | Sharp Corp | 半導体成長装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62219912A (ja) * | 1986-03-20 | 1987-09-28 | Toshiba Mach Co Ltd | プラズマｃｖｄ装置 |
| JP2884556B2 (ja) * | 1994-06-10 | 1999-04-19 | 信越石英株式会社 | 枚葉式ウェーハ熱処理装置 |
| US6406543B1 (en) * | 1998-07-23 | 2002-06-18 | Applied Materials, Inc. | Infra-red transparent thermal reactor cover member |
| JP2003124206A (ja) * | 2001-10-18 | 2003-04-25 | Tokyo Electron Ltd | 熱処理装置 |
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2008
- 2008-04-22 JP JP2008111444A patent/JP5110649B2/ja active Active