|
US8067067B2
(en)
*
|
2002-02-14 |
2011-11-29 |
Applied Materials, Inc. |
Clean, dense yttrium oxide coating protecting semiconductor processing apparatus
|
|
US20080213496A1
(en)
*
|
2002-02-14 |
2008-09-04 |
Applied Materials, Inc. |
Method of coating semiconductor processing apparatus with protective yttrium-containing coatings
|
|
US20080264564A1
(en)
|
2007-04-27 |
2008-10-30 |
Applied Materials, Inc. |
Method of reducing the erosion rate of semiconductor processing apparatus exposed to halogen-containing plasmas
|
|
US6780787B2
(en)
*
|
2002-03-21 |
2004-08-24 |
Lam Research Corporation |
Low contamination components for semiconductor processing apparatus and methods for making components
|
|
DE10229379A1
(de)
*
|
2002-06-26 |
2004-01-29 |
Schering Ag |
EG-VEGF Rezeptor Antagonisten
|
|
JP2006516822A
(ja)
*
|
2003-01-27 |
2006-07-06 |
東京エレクトロン株式会社 |
改良された固定ハードウェアのための方法及び装置
|
|
US20040182315A1
(en)
|
2003-03-17 |
2004-09-23 |
Tokyo Electron Limited |
Reduced maintenance chemical oxide removal (COR) processing system
|
|
US7220497B2
(en)
*
|
2003-12-18 |
2007-05-22 |
Lam Research Corporation |
Yttria-coated ceramic components of semiconductor material processing apparatuses and methods of manufacturing the components
|
|
US20060027923A1
(en)
*
|
2004-08-09 |
2006-02-09 |
Tania Bhatia |
Coating process to enable electrophoretic deposition
|
|
US7119032B2
(en)
|
2004-08-23 |
2006-10-10 |
Air Products And Chemicals, Inc. |
Method to protect internal components of semiconductor processing equipment using layered superlattice materials
|
|
JP2006186306A
(ja)
*
|
2004-09-30 |
2006-07-13 |
Toshiba Ceramics Co Ltd |
ガス拡散プレートおよびその製造方法
|
|
US20060180569A1
(en)
*
|
2005-02-15 |
2006-08-17 |
Chang Hsi-Ming |
Method of manufacturing step contact window of flat display panel
|
|
US7480974B2
(en)
*
|
2005-02-15 |
2009-01-27 |
Lam Research Corporation |
Methods of making gas distribution members for plasma processing apparatuses
|
|
US7972703B2
(en)
*
|
2005-03-03 |
2011-07-05 |
Ferrotec (Usa) Corporation |
Baffle wafers and randomly oriented polycrystalline silicon used therefor
|
|
US20060213617A1
(en)
*
|
2005-03-25 |
2006-09-28 |
Fink Steven T |
Load bearing insulator in vacuum etch chambers
|
|
CN101218376A
(zh)
*
|
2005-06-17 |
2008-07-09 |
国立大学法人东北大学 |
金属构件的保护膜构造及采用该保护膜构造的金属零件、半导体或平板显示器制造装置
|
|
JP5028755B2
(ja)
*
|
2005-06-23 |
2012-09-19 |
東京エレクトロン株式会社 |
半導体処理装置の表面処理方法
|
|
JP2007036197A
(ja)
*
|
2005-06-23 |
2007-02-08 |
Tokyo Electron Ltd |
半導体製造装置の構成部材及び半導体製造装置
|
|
JP5040119B2
(ja)
*
|
2006-02-22 |
2012-10-03 |
東京エレクトロン株式会社 |
耐環境部材、半導体製造装置及び耐環境部材の製造方法
|
|
JP4818659B2
(ja)
*
|
2005-08-08 |
2011-11-16 |
いすゞ自動車株式会社 |
内燃機関の燃焼室用摺動部材及びその製造方法
|
|
US20070079936A1
(en)
*
|
2005-09-29 |
2007-04-12 |
Applied Materials, Inc. |
Bonded multi-layer RF window
|
|
US7968205B2
(en)
*
|
2005-10-21 |
2011-06-28 |
Shin-Etsu Chemical Co., Ltd. |
Corrosion resistant multilayer member
|
|
KR101332206B1
(ko)
*
|
2005-12-02 |
2013-11-25 |
롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. |
반도체 처리 방법
|
|
KR100792365B1
(ko)
*
|
2006-06-30 |
2008-01-09 |
주식회사 하이닉스반도체 |
반도체 소자의 리세스 게이트 제조 방법
|
|
US20080029032A1
(en)
*
|
2006-08-01 |
2008-02-07 |
Sun Jennifer Y |
Substrate support with protective layer for plasma resistance
|
|
US10242888B2
(en)
|
2007-04-27 |
2019-03-26 |
Applied Materials, Inc. |
Semiconductor processing apparatus with a ceramic-comprising surface which exhibits fracture toughness and halogen plasma resistance
|
|
US7696117B2
(en)
*
|
2007-04-27 |
2010-04-13 |
Applied Materials, Inc. |
Method and apparatus which reduce the erosion rate of surfaces exposed to halogen-containing plasmas
|
|
US10622194B2
(en)
|
2007-04-27 |
2020-04-14 |
Applied Materials, Inc. |
Bulk sintered solid solution ceramic which exhibits fracture toughness and halogen plasma resistance
|
|
US8367227B2
(en)
*
|
2007-08-02 |
2013-02-05 |
Applied Materials, Inc. |
Plasma-resistant ceramics with controlled electrical resistivity
|
|
KR101645043B1
(ko)
*
|
2007-10-31 |
2016-08-02 |
램 리써치 코포레이션 |
플라즈마 프로세싱 챔버, 플라즈마 프로세싱 콤포넌트 및 플라즈마 식각 챔버 프로세싱 콤포넌트 제조 방법
|
|
KR20090093819A
(ko)
*
|
2008-02-28 |
2009-09-02 |
코바렌트 마테리얼 가부시키가이샤 |
플라즈마 처리 장치에 이용되는 소결체 및 부재
|
|
KR101060606B1
(ko)
|
2008-08-21 |
2011-08-31 |
서울대학교산학협력단 |
박막증착방법
|
|
JP5235596B2
(ja)
*
|
2008-10-15 |
2013-07-10 |
東京エレクトロン株式会社 |
Ｓｉエッチング方法
|
|
US8206829B2
(en)
*
|
2008-11-10 |
2012-06-26 |
Applied Materials, Inc. |
Plasma resistant coatings for plasma chamber components
|
|
US9394608B2
(en)
|
2009-04-06 |
2016-07-19 |
Asm America, Inc. |
Semiconductor processing reactor and components thereof
|
|
US20110135915A1
(en)
*
|
2009-11-25 |
2011-06-09 |
Greene, Tweed Of Delaware, Inc. |
Methods of Coating Substrate With Plasma Resistant Coatings and Related Coated Substrates
|
|
US20110220285A1
(en)
*
|
2010-02-12 |
2011-09-15 |
Morgan Advanced Ceramics, Inc. |
Methods and systems for texturing ceramic components
|
|
US20120196139A1
(en)
*
|
2010-07-14 |
2012-08-02 |
Christopher Petorak |
Thermal spray composite coatings for semiconductor applications
|
|
US20120177908A1
(en)
*
|
2010-07-14 |
2012-07-12 |
Christopher Petorak |
Thermal spray coatings for semiconductor applications
|
|
US20130023129A1
(en)
|
2011-07-20 |
2013-01-24 |
Asm America, Inc. |
Pressure transmitter for a semiconductor processing environment
|
|
CN102260856A
(zh)
*
|
2011-07-26 |
2011-11-30 |
中微半导体设备(上海)有限公司 |
抗刻蚀层、半导体处理装置及制作方法
|
|
US10276410B2
(en)
*
|
2011-11-25 |
2019-04-30 |
Nhk Spring Co., Ltd. |
Substrate support device
|
|
JP6034156B2
(ja)
*
|
2011-12-05 |
2016-11-30 |
東京エレクトロン株式会社 |
プラズマ処理装置及びプラズマ処理方法
|
|
CN104508180A
(zh)
*
|
2012-07-27 |
2015-04-08 |
应用材料公司 |
粗糙化的基板支撑件
|
|
US10714315B2
(en)
|
2012-10-12 |
2020-07-14 |
Asm Ip Holdings B.V. |
Semiconductor reaction chamber showerhead
|
|
CN103794458B
(zh)
*
|
2012-10-29 |
2016-12-21 |
中微半导体设备(上海)有限公司 |
用于等离子体处理腔室内部的部件及制造方法
|
|
US9916998B2
(en)
|
2012-12-04 |
2018-03-13 |
Applied Materials, Inc. |
Substrate support assembly having a plasma resistant protective layer
|
|
US9685356B2
(en)
|
2012-12-11 |
2017-06-20 |
Applied Materials, Inc. |
Substrate support assembly having metal bonded protective layer
|
|
JP6071514B2
(ja)
*
|
2012-12-12 |
2017-02-01 |
東京エレクトロン株式会社 |
静電チャックの改質方法及びプラズマ処理装置
|
|
US10177014B2
(en)
|
2012-12-14 |
2019-01-08 |
Applied Materials, Inc. |
Thermal radiation barrier for substrate processing chamber components
|
|
US9385018B2
(en)
|
2013-01-07 |
2016-07-05 |
Samsung Austin Semiconductor, L.P. |
Semiconductor manufacturing equipment with trace elements for improved defect tracing and methods of manufacture
|
|
US20160376700A1
(en)
|
2013-02-01 |
2016-12-29 |
Asm Ip Holding B.V. |
System for treatment of deposition reactor
|
|
US9449797B2
(en)
|
2013-05-07 |
2016-09-20 |
Lam Research Corporation |
Component of a plasma processing apparatus having a protective in situ formed layer on a plasma exposed surface
|
|
SG11201508512PA
(en)
*
|
2013-05-23 |
2015-12-30 |
Applied Materials Inc |
A coated liner assembly for a semiconductor processing chamber
|
|
US20140357092A1
(en)
*
|
2013-06-04 |
2014-12-04 |
Lam Research Corporation |
Chamber wall of a plasma processing apparatus including a flowing protective liquid layer
|
|
WO2015061616A1
(en)
|
2013-10-24 |
2015-04-30 |
Surmet Corporation |
High purity polycrystalline aluminum oxynitride bodies
|
|
US11015244B2
(en)
*
|
2013-12-30 |
2021-05-25 |
Advanced Material Solutions, Llc |
Radiation shielding for a CVD reactor
|
|
US9657397B2
(en)
*
|
2013-12-31 |
2017-05-23 |
Lam Research Ag |
Apparatus for treating surfaces of wafer-shaped articles
|
|
US11015245B2
(en)
|
2014-03-19 |
2021-05-25 |
Asm Ip Holding B.V. |
Gas-phase reactor and system having exhaust plenum and components thereof
|
|
US9580360B2
(en)
*
|
2014-04-07 |
2017-02-28 |
Lam Research Corporation |
Monolithic ceramic component of gas delivery system and method of making and use thereof
|
|
US9869013B2
(en)
*
|
2014-04-25 |
2018-01-16 |
Applied Materials, Inc. |
Ion assisted deposition top coat of rare-earth oxide
|
|
CN105304519A
(zh)
*
|
2014-07-11 |
2016-02-03 |
北京北方微电子基地设备工艺研究中心有限责任公司 |
内衬、内衬的制备方法及反应腔室
|
|
US10858737B2
(en)
|
2014-07-28 |
2020-12-08 |
Asm Ip Holding B.V. |
Showerhead assembly and components thereof
|
|
KR101465640B1
(ko)
*
|
2014-08-08 |
2014-11-28 |
주식회사 펨빅스 |
불화알루미늄 생성방지막이 형성된 ｃｖｄ 공정챔버 부품
|
|
US10941490B2
(en)
|
2014-10-07 |
2021-03-09 |
Asm Ip Holding B.V. |
Multiple temperature range susceptor, assembly, reactor and system including the susceptor, and methods of using the same
|
|
EP3460093A3
(en)
|
2015-02-13 |
2019-06-19 |
Entegris, Inc. |
Coatings for enhancement of properties and performance of substrate articles and apparatus
|
|
US10276355B2
(en)
|
2015-03-12 |
2019-04-30 |
Asm Ip Holding B.V. |
Multi-zone reactor, system including the reactor, and method of using the same
|
|
US20160358749A1
(en)
*
|
2015-06-04 |
2016-12-08 |
Lam Research Corporation |
Plasma etching device with plasma etch resistant coating
|
|
GB201511282D0
(en)
*
|
2015-06-26 |
2015-08-12 |
Spts Technologies Ltd |
Plasma etching apparatus
|
|
US10458018B2
(en)
|
2015-06-26 |
2019-10-29 |
Asm Ip Holding B.V. |
Structures including metal carbide material, devices including the structures, and methods of forming same
|
|
US20170040146A1
(en)
*
|
2015-08-03 |
2017-02-09 |
Lam Research Corporation |
Plasma etching device with plasma etch resistant coating
|
|
US10211308B2
(en)
|
2015-10-21 |
2019-02-19 |
Asm Ip Holding B.V. |
NbMC layers
|
|
US10020218B2
(en)
|
2015-11-17 |
2018-07-10 |
Applied Materials, Inc. |
Substrate support assembly with deposited surface features
|
|
US11139308B2
(en)
|
2015-12-29 |
2021-10-05 |
Asm Ip Holding B.V. |
Atomic layer deposition of III-V compounds to form V-NAND devices
|
|
US10529554B2
(en)
|
2016-02-19 |
2020-01-07 |
Asm Ip Holding B.V. |
Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches
|
|
US10343920B2
(en)
|
2016-03-18 |
2019-07-09 |
Asm Ip Holding B.V. |
Aligned carbon nanotubes
|
|
US10388492B2
(en)
*
|
2016-04-14 |
2019-08-20 |
Fm Industries, Inc. |
Coated semiconductor processing members having chlorine and fluorine plasma erosion resistance and complex oxide coatings therefor
|
|
US10190213B2
(en)
|
2016-04-21 |
2019-01-29 |
Asm Ip Holding B.V. |
Deposition of metal borides
|
|
US10367080B2
(en)
|
2016-05-02 |
2019-07-30 |
Asm Ip Holding B.V. |
Method of forming a germanium oxynitride film
|
|
US11453943B2
(en)
|
2016-05-25 |
2022-09-27 |
Asm Ip Holding B.V. |
Method for forming carbon-containing silicon/metal oxide or nitride film by ALD using silicon precursor and hydrocarbon precursor
|
|
US9859151B1
(en)
|
2016-07-08 |
2018-01-02 |
Asm Ip Holding B.V. |
Selective film deposition method to form air gaps
|
|
US10612137B2
(en)
|
2016-07-08 |
2020-04-07 |
Asm Ip Holdings B.V. |
Organic reactants for atomic layer deposition
|
|
KR102532607B1
(ko)
|
2016-07-28 |
2023-05-15 |
에이에스엠 아이피 홀딩 비.브이. |
기판 가공 장치 및 그 동작 방법
|
|
US9887082B1
(en)
|
2016-07-28 |
2018-02-06 |
Asm Ip Holding B.V. |
Method and apparatus for filling a gap
|
|
US9812320B1
(en)
|
2016-07-28 |
2017-11-07 |
Asm Ip Holding B.V. |
Method and apparatus for filling a gap
|
|
US10643826B2
(en)
|
2016-10-26 |
2020-05-05 |
Asm Ip Holdings B.V. |
Methods for thermally calibrating reaction chambers
|
|
US11532757B2
(en)
|
2016-10-27 |
2022-12-20 |
Asm Ip Holding B.V. |
Deposition of charge trapping layers
|
|
US10714350B2
(en)
|
2016-11-01 |
2020-07-14 |
ASM IP Holdings, B.V. |
Methods for forming a transition metal niobium nitride film on a substrate by atomic layer deposition and related semiconductor device structures
|
|
KR102546317B1
(ko)
|
2016-11-15 |
2023-06-21 |
에이에스엠 아이피 홀딩 비.브이. |
기체 공급 유닛 및 이를 포함하는 기판 처리 장치
|
|
KR102762543B1
(ko)
|
2016-12-14 |
2025-02-05 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
|
US11447861B2
(en)
|
2016-12-15 |
2022-09-20 |
Asm Ip Holding B.V. |
Sequential infiltration synthesis apparatus and a method of forming a patterned structure
|
|
US11581186B2
(en)
|
2016-12-15 |
2023-02-14 |
Asm Ip Holding B.V. |
Sequential infiltration synthesis apparatus
|
|
KR102700194B1
(ko)
|
2016-12-19 |
2024-08-28 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
|
CN109923092B
(zh)
*
|
2016-12-20 |
2022-04-01 |
三井金属矿业株式会社 |
稀土氟氧化物烧结体以及其制造方法
|
|
US10269558B2
(en)
|
2016-12-22 |
2019-04-23 |
Asm Ip Holding B.V. |
Method of forming a structure on a substrate
|
|
US10867788B2
(en)
|
2016-12-28 |
2020-12-15 |
Asm Ip Holding B.V. |
Method of forming a structure on a substrate
|
|
US11390950B2
(en)
|
2017-01-10 |
2022-07-19 |
Asm Ip Holding B.V. |
Reactor system and method to reduce residue buildup during a film deposition process
|
|
KR20180093814A
(ko)
*
|
2017-02-14 |
2018-08-22 |
에스케이씨솔믹스 주식회사 |
보론카바이드를 포함하는 플라즈마 처리장치 및 그 제조방법
|
|
US10468261B2
(en)
|
2017-02-15 |
2019-11-05 |
Asm Ip Holding B.V. |
Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures
|
|
US10529563B2
(en)
|
2017-03-29 |
2020-01-07 |
Asm Ip Holdings B.V. |
Method for forming doped metal oxide films on a substrate by cyclical deposition and related semiconductor device structures
|
|
KR102457289B1
(ko)
|
2017-04-25 |
2022-10-21 |
에이에스엠 아이피 홀딩 비.브이. |
박막 증착 방법 및 반도체 장치의 제조 방법
|
|
US10770286B2
(en)
|
2017-05-08 |
2020-09-08 |
Asm Ip Holdings B.V. |
Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures
|
|
US10892156B2
(en)
|
2017-05-08 |
2021-01-12 |
Asm Ip Holding B.V. |
Methods for forming a silicon nitride film on a substrate and related semiconductor device structures
|
|
US10886123B2
(en)
|
2017-06-02 |
2021-01-05 |
Asm Ip Holding B.V. |
Methods for forming low temperature semiconductor layers and related semiconductor device structures
|
|
US12040200B2
(en)
|
2017-06-20 |
2024-07-16 |
Asm Ip Holding B.V. |
Semiconductor processing apparatus and methods for calibrating a semiconductor processing apparatus
|
|
US11306395B2
(en)
|
2017-06-28 |
2022-04-19 |
Asm Ip Holding B.V. |
Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus
|
|
TWI794238B
(zh)
|
2017-07-13 |
2023-03-01 |
荷蘭商Ａｓｍ智慧財產控股公司 |
於單一加工腔室中自半導體膜移除氧化物及碳之裝置及方法
|
|
KR20190009245A
(ko)
|
2017-07-18 |
2019-01-28 |
에이에스엠 아이피 홀딩 비.브이. |
반도체 소자 구조물 형성 방법 및 관련된 반도체 소자 구조물
|
|
US11374112B2
(en)
|
2017-07-19 |
2022-06-28 |
Asm Ip Holding B.V. |
Method for depositing a group IV semiconductor and related semiconductor device structures
|
|
US10541333B2
(en)
|
2017-07-19 |
2020-01-21 |
Asm Ip Holding B.V. |
Method for depositing a group IV semiconductor and related semiconductor device structures
|
|
US11018002B2
(en)
|
2017-07-19 |
2021-05-25 |
Asm Ip Holding B.V. |
Method for selectively depositing a Group IV semiconductor and related semiconductor device structures
|
|
US10590535B2
(en)
|
2017-07-26 |
2020-03-17 |
Asm Ip Holdings B.V. |
Chemical treatment, deposition and/or infiltration apparatus and method for using the same
|
|
TWI815813B
(zh)
|
2017-08-04 |
2023-09-21 |
荷蘭商Ａｓｍ智慧財產控股公司 |
用於分配反應腔內氣體的噴頭總成
|
|
US10692741B2
(en)
|
2017-08-08 |
2020-06-23 |
Asm Ip Holdings B.V. |
Radiation shield
|
|
US10770336B2
(en)
|
2017-08-08 |
2020-09-08 |
Asm Ip Holding B.V. |
Substrate lift mechanism and reactor including same
|
|
US11139191B2
(en)
|
2017-08-09 |
2021-10-05 |
Asm Ip Holding B.V. |
Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
|
|
US11769682B2
(en)
|
2017-08-09 |
2023-09-26 |
Asm Ip Holding B.V. |
Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
|
|
CN109423606A
(zh)
*
|
2017-08-24 |
2019-03-05 |
中微半导体设备(上海)有限公司 |
聚焦环及其耐腐蚀防护方法
|
|
US11830730B2
(en)
|
2017-08-29 |
2023-11-28 |
Asm Ip Holding B.V. |
Layer forming method and apparatus
|
|
US11295980B2
(en)
|
2017-08-30 |
2022-04-05 |
Asm Ip Holding B.V. |
Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures
|
|
KR102491945B1
(ko)
|
2017-08-30 |
2023-01-26 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
|
US11056344B2
(en)
|
2017-08-30 |
2021-07-06 |
Asm Ip Holding B.V. |
Layer forming method
|
|
KR102401446B1
(ko)
|
2017-08-31 |
2022-05-24 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
|
KR102630301B1
(ko)
|
2017-09-21 |
2024-01-29 |
에이에스엠 아이피 홀딩 비.브이. |
침투성 재료의 순차 침투 합성 방법 처리 및 이를 이용하여 형성된 구조물 및 장치
|
|
US10844484B2
(en)
|
2017-09-22 |
2020-11-24 |
Asm Ip Holding B.V. |
Apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
|
|
WO2019067950A1
(en)
*
|
2017-09-28 |
2019-04-04 |
Maxterial, Inc. |
ARTICLES COMPRISING SURFACE COATINGS AND METHODS OF PRODUCING THE SAME
|
|
US10658205B2
(en)
|
2017-09-28 |
2020-05-19 |
Asm Ip Holdings B.V. |
Chemical dispensing apparatus and methods for dispensing a chemical to a reaction chamber
|
|
US10403504B2
(en)
|
2017-10-05 |
2019-09-03 |
Asm Ip Holding B.V. |
Method for selectively depositing a metallic film on a substrate
|
|
US10923344B2
(en)
|
2017-10-30 |
2021-02-16 |
Asm Ip Holding B.V. |
Methods for forming a semiconductor structure and related semiconductor structures
|
|
US10910262B2
(en)
|
2017-11-16 |
2021-02-02 |
Asm Ip Holding B.V. |
Method of selectively depositing a capping layer structure on a semiconductor device structure
|
|
KR102188366B1
(ko)
|
2017-11-21 |
2020-12-08 |
와틀로 일렉트릭 매뉴팩츄어링 컴파니 |
세라믹 받침대에서 사용하기 위한 이중 목적 비아
|
|
US11022879B2
(en)
|
2017-11-24 |
2021-06-01 |
Asm Ip Holding B.V. |
Method of forming an enhanced unexposed photoresist layer
|
|
WO2019103613A1
(en)
|
2017-11-27 |
2019-05-31 |
Asm Ip Holding B.V. |
A storage device for storing wafer cassettes for use with a batch furnace
|
|
TWI791689B
(zh)
|
2017-11-27 |
2023-02-11 |
荷蘭商Ａｓｍ智慧財產控股私人有限公司 |
包括潔淨迷你環境之裝置
|
|
US20210225616A1
(en)
*
|
2018-01-08 |
2021-07-22 |
Lam Research Corporation |
Components and Processes for Managing Plasma Process Byproduct Materials
|
|
US10872771B2
(en)
|
2018-01-16 |
2020-12-22 |
Asm Ip Holding B. V. |
Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures
|
|
US11482412B2
(en)
|
2018-01-19 |
2022-10-25 |
Asm Ip Holding B.V. |
Method for depositing a gap-fill layer by plasma-assisted deposition
|
|
TWI799494B
(zh)
|
2018-01-19 |
2023-04-21 |
荷蘭商Ａｓｍ 智慧財產控股公司 |
沈積方法
|
|
US11018047B2
(en)
|
2018-01-25 |
2021-05-25 |
Asm Ip Holding B.V. |
Hybrid lift pin
|
|
USD880437S1
(en)
|
2018-02-01 |
2020-04-07 |
Asm Ip Holding B.V. |
Gas supply plate for semiconductor manufacturing apparatus
|
|
US11081345B2
(en)
|
2018-02-06 |
2021-08-03 |
Asm Ip Holding B.V. |
Method of post-deposition treatment for silicon oxide film
|
|
WO2019158960A1
(en)
|
2018-02-14 |
2019-08-22 |
Asm Ip Holding B.V. |
A method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process
|
|
US10896820B2
(en)
|
2018-02-14 |
2021-01-19 |
Asm Ip Holding B.V. |
Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process
|
|
US10731249B2
(en)
|
2018-02-15 |
2020-08-04 |
Asm Ip Holding B.V. |
Method of forming a transition metal containing film on a substrate by a cyclical deposition process, a method for supplying a transition metal halide compound to a reaction chamber, and related vapor deposition apparatus
|
|
KR102636427B1
(ko)
|
2018-02-20 |
2024-02-13 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 방법 및 장치
|
|
US10975470B2
(en)
|
2018-02-23 |
2021-04-13 |
Asm Ip Holding B.V. |
Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment
|
|
US11473195B2
(en)
|
2018-03-01 |
2022-10-18 |
Asm Ip Holding B.V. |
Semiconductor processing apparatus and a method for processing a substrate
|
|
US11629406B2
(en)
|
2018-03-09 |
2023-04-18 |
Asm Ip Holding B.V. |
Semiconductor processing apparatus comprising one or more pyrometers for measuring a temperature of a substrate during transfer of the substrate
|
|
US11114283B2
(en)
*
|
2018-03-16 |
2021-09-07 |
Asm Ip Holding B.V. |
Reactor, system including the reactor, and methods of manufacturing and using same
|
|
KR102646467B1
(ko)
|
2018-03-27 |
2024-03-11 |
에이에스엠 아이피 홀딩 비.브이. |
기판 상에 전극을 형성하는 방법 및 전극을 포함하는 반도체 소자 구조
|
|
US11088002B2
(en)
|
2018-03-29 |
2021-08-10 |
Asm Ip Holding B.V. |
Substrate rack and a substrate processing system and method
|
|
US11230766B2
(en)
|
2018-03-29 |
2022-01-25 |
Asm Ip Holding B.V. |
Substrate processing apparatus and method
|
|
KR102501472B1
(ko)
|
2018-03-30 |
2023-02-20 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 방법
|
|
KR102600229B1
(ko)
|
2018-04-09 |
2023-11-10 |
에이에스엠 아이피 홀딩 비.브이. |
기판 지지 장치, 이를 포함하는 기판 처리 장치 및 기판 처리 방법
|
|
TWI843623B
(zh)
|
2018-05-08 |
2024-05-21 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
藉由循環沉積製程於基板上沉積氧化物膜之方法及相關裝置結構
|
|
US12025484B2
(en)
|
2018-05-08 |
2024-07-02 |
Asm Ip Holding B.V. |
Thin film forming method
|
|
US12272527B2
(en)
|
2018-05-09 |
2025-04-08 |
Asm Ip Holding B.V. |
Apparatus for use with hydrogen radicals and method of using same
|
|
KR20190129718A
(ko)
|
2018-05-11 |
2019-11-20 |
에이에스엠 아이피 홀딩 비.브이. |
기판 상에 피도핑 금속 탄화물 막을 형성하는 방법 및 관련 반도체 소자 구조
|
|
KR102596988B1
(ko)
|
2018-05-28 |
2023-10-31 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 방법 및 그에 의해 제조된 장치
|
|
CN110540424B
(zh)
*
|
2018-05-29 |
2021-12-21 |
山东工业陶瓷研究设计院有限公司 |
一种氧化锆陶瓷注射成型用喂料及其制备方法
|
|
US11718913B2
(en)
|
2018-06-04 |
2023-08-08 |
Asm Ip Holding B.V. |
Gas distribution system and reactor system including same
|
|
TWI840362B
(zh)
|
2018-06-04 |
2024-05-01 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
水氣降低的晶圓處置腔室
|
|
US11286562B2
(en)
|
2018-06-08 |
2022-03-29 |
Asm Ip Holding B.V. |
Gas-phase chemical reactor and method of using same
|
|
CN112236839B
(zh)
*
|
2018-06-14 |
2025-01-03 |
应用材料公司 |
具保护性涂层的处理腔室的处理配件
|
|
US10797133B2
(en)
|
2018-06-21 |
2020-10-06 |
Asm Ip Holding B.V. |
Method for depositing a phosphorus doped silicon arsenide film and related semiconductor device structures
|
|
KR102568797B1
(ko)
|
2018-06-21 |
2023-08-21 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 시스템
|
|
WO2020003000A1
(en)
|
2018-06-27 |
2020-01-02 |
Asm Ip Holding B.V. |
Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material
|
|
KR20250134000A
(ko)
|
2018-06-27 |
2025-09-09 |
에이에스엠 아이피 홀딩 비.브이. |
금속 함유 재료를 형성하기 위한 주기적 증착 방법 및 금속 함유 재료를 포함하는 필름 및 구조체
|
|
US10612136B2
(en)
|
2018-06-29 |
2020-04-07 |
ASM IP Holding, B.V. |
Temperature-controlled flange and reactor system including same
|
|
KR102686758B1
(ko)
|
2018-06-29 |
2024-07-18 |
에이에스엠 아이피 홀딩 비.브이. |
박막 증착 방법 및 반도체 장치의 제조 방법
|
|
US10388513B1
(en)
|
2018-07-03 |
2019-08-20 |
Asm Ip Holding B.V. |
Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
|
|
US10755922B2
(en)
|
2018-07-03 |
2020-08-25 |
Asm Ip Holding B.V. |
Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
|
|
US11667575B2
(en)
*
|
2018-07-18 |
2023-06-06 |
Applied Materials, Inc. |
Erosion resistant metal oxide coatings
|
|
US20200024735A1
(en)
*
|
2018-07-18 |
2020-01-23 |
Applied Materials, Inc. |
Erosion resistant metal fluoride coatings deposited by atomic layer deposition
|
|
US11053591B2
(en)
|
2018-08-06 |
2021-07-06 |
Asm Ip Holding B.V. |
Multi-port gas injection system and reactor system including same
|
|
US10883175B2
(en)
|
2018-08-09 |
2021-01-05 |
Asm Ip Holding B.V. |
Vertical furnace for processing substrates and a liner for use therein
|
|
US11430674B2
(en)
|
2018-08-22 |
2022-08-30 |
Asm Ip Holding B.V. |
Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
|
|
US11024523B2
(en)
|
2018-09-11 |
2021-06-01 |
Asm Ip Holding B.V. |
Substrate processing apparatus and method
|
|
KR102707956B1
(ko)
|
2018-09-11 |
2024-09-19 |
에이에스엠 아이피 홀딩 비.브이. |
박막 증착 방법
|
|
US11049751B2
(en)
|
2018-09-14 |
2021-06-29 |
Asm Ip Holding B.V. |
Cassette supply system to store and handle cassettes and processing apparatus equipped therewith
|
|
CN110970344B
(zh)
|
2018-10-01 |
2024-10-25 |
Asmip控股有限公司 |
衬底保持设备、包含所述设备的系统及其使用方法
|
|
US11232963B2
(en)
|
2018-10-03 |
2022-01-25 |
Asm Ip Holding B.V. |
Substrate processing apparatus and method
|
|
KR102592699B1
(ko)
|
2018-10-08 |
2023-10-23 |
에이에스엠 아이피 홀딩 비.브이. |
기판 지지 유닛 및 이를 포함하는 박막 증착 장치와 기판 처리 장치
|
|
KR102605121B1
(ko)
|
2018-10-19 |
2023-11-23 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치 및 기판 처리 방법
|
|
KR102546322B1
(ko)
|
2018-10-19 |
2023-06-21 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치 및 기판 처리 방법
|
|
USD948463S1
(en)
|
2018-10-24 |
2022-04-12 |
Asm Ip Holding B.V. |
Susceptor for semiconductor substrate supporting apparatus
|
|
US12378665B2
(en)
|
2018-10-26 |
2025-08-05 |
Asm Ip Holding B.V. |
High temperature coatings for a preclean and etch apparatus and related methods
|
|
US11087997B2
(en)
|
2018-10-31 |
2021-08-10 |
Asm Ip Holding B.V. |
Substrate processing apparatus for processing substrates
|
|
KR102748291B1
(ko)
|
2018-11-02 |
2024-12-31 |
에이에스엠 아이피 홀딩 비.브이. |
기판 지지 유닛 및 이를 포함하는 기판 처리 장치
|
|
US11572620B2
(en)
|
2018-11-06 |
2023-02-07 |
Asm Ip Holding B.V. |
Methods for selectively depositing an amorphous silicon film on a substrate
|
|
US11031242B2
(en)
|
2018-11-07 |
2021-06-08 |
Asm Ip Holding B.V. |
Methods for depositing a boron doped silicon germanium film
|
|
US10847366B2
(en)
|
2018-11-16 |
2020-11-24 |
Asm Ip Holding B.V. |
Methods for depositing a transition metal chalcogenide film on a substrate by a cyclical deposition process
|
|
US10818758B2
(en)
|
2018-11-16 |
2020-10-27 |
Asm Ip Holding B.V. |
Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures
|
|
US12040199B2
(en)
|
2018-11-28 |
2024-07-16 |
Asm Ip Holding B.V. |
Substrate processing apparatus for processing substrates
|
|
US11217444B2
(en)
|
2018-11-30 |
2022-01-04 |
Asm Ip Holding B.V. |
Method for forming an ultraviolet radiation responsive metal oxide-containing film
|
|
KR102636428B1
(ko)
|
2018-12-04 |
2024-02-13 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치를 세정하는 방법
|
|
US11158513B2
(en)
|
2018-12-13 |
2021-10-26 |
Asm Ip Holding B.V. |
Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures
|
|
JP7504584B2
(ja)
|
2018-12-14 |
2024-06-24 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
窒化ガリウムの選択的堆積を用いてデバイス構造体を形成する方法及びそのためのシステム
|
|
CN111326470A
(zh)
*
|
2018-12-17 |
2020-06-23 |
夏泰鑫半导体(青岛)有限公司 |
静电夹盘及半导体设备
|
|
TWI866480B
(zh)
|
2019-01-17 |
2024-12-11 |
荷蘭商Ａｓｍ Ｉｐ 私人控股有限公司 |
藉由循環沈積製程於基板上形成含過渡金屬膜之方法
|
|
KR102727227B1
(ko)
|
2019-01-22 |
2024-11-07 |
에이에스엠 아이피 홀딩 비.브이. |
기판 처리 장치
|
|
CN111524788B
(zh)
|
2019-02-01 |
2023-11-24 |
Asm Ip私人控股有限公司 |
氧化硅的拓扑选择性膜形成的方法
|
|
TWI845607B
(zh)
|
2019-02-20 |
2024-06-21 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
用來填充形成於基材表面內之凹部的循環沉積方法及設備
|
|
KR102638425B1
(ko)
|
2019-02-20 |
2024-02-21 |
에이에스엠 아이피 홀딩 비.브이. |
기판 표면 내에 형성된 오목부를 충진하기 위한 방법 및 장치
|
|
TWI838458B
(zh)
|
2019-02-20 |
2024-04-11 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
用於3d nand應用中之插塞填充沉積之設備及方法
|
|
KR102626263B1
(ko)
|
2019-02-20 |
2024-01-16 |
에이에스엠 아이피 홀딩 비.브이. |
처리 단계를 포함하는 주기적 증착 방법 및 이를 위한 장치
|
|
TWI842826B
(zh)
|
2019-02-22 |
2024-05-21 |
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 |
基材處理設備及處理基材之方法
|
|
KR102782593B1
(ko)
|
2019-03-08 |
2025-03-14 |
에이에스엠 아이피 홀딩 비.브이. |
SiOC 층을 포함한 구조체 및 이의 형성 방법
|
|
US11742198B2
(en)
|
2019-03-08 |
2023-08-29 |
Asm Ip Holding B.V. |
Structure including SiOCN layer and method of forming same
|
|
KR102858005B1
(ko)
|
2019-03-08 |
2025-09-09 |
에이에스엠 아이피 홀딩 비.브이. |
실리콘 질화물 층을 선택적으로 증착하는 방법, 및 선택적으로 증착된 실리콘 질화물 층을 포함하는 구조체
|
|
JP2020167398A
(ja)
|
2019-03-28 |
2020-10-08 |
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
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|
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|
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|
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|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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(ko)
|
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|
|
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|
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|
|
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(en)
|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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(en)
|
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|
|
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(en)
|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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(en)
|
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|
|
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|
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|
|
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(en)
|
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|
|
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|
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|
|
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(zh)
|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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(ko)
|
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|
|
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|
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|
|
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(en)
|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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(en)
|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
|
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|
|
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(ko)
*
|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
US11996289B2
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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(zh)
|
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|
|
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|
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|
|
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(zh)
|
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|
|
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|
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|
|
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(en)
|
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|
|
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(ko)
|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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(en)
|
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Thin film deposition process
|
|
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(zh)
*
|
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|
|
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|
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|
|
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(ko)
|
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|
|
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(en)
|
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|
|
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(zh)
|
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|
|
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(en)
|
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|
|
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(zh)
|
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|
|
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|
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|
|
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(en)
|
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|
|
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|
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|
|
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(en)
|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
US12255053B2
(en)
|
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Methods and systems for depositing a layer
|
|
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(zh)
|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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(en)
|
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|
|
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(ja)
*
|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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|
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|
|
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(ja)
*
|
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Asm Ip Holding B.V. |
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Radiative heat windows and wafer support pads in vapor etch reactors
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(주)포인트엔지니어링 |
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Lam Research Corporation |
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嘉兴尚坤科技有限公司 |
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