HK1018719A1 - Electronic component and semiconductor device, method for manufacturing and mounting thereof, and circuit board and electronic equipment - Google Patents

Electronic component and semiconductor device, method for manufacturing and mounting thereof, and circuit board and electronic equipment

Info

Publication number
HK1018719A1
HK1018719A1 HK99103769A HK99103769A HK1018719A1 HK 1018719 A1 HK1018719 A1 HK 1018719A1 HK 99103769 A HK99103769 A HK 99103769A HK 99103769 A HK99103769 A HK 99103769A HK 1018719 A1 HK1018719 A1 HK 1018719A1
Authority
HK
Hong Kong
Prior art keywords
mounting
manufacturing
circuit board
semiconductor device
electronic component
Prior art date
Application number
HK99103769A
Other languages
English (en)
Inventor
Nobuaki Hashimoto
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of HK1018719A1 publication Critical patent/HK1018719A1/xx

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Classifications

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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
HK99103769A 1996-12-04 1999-08-31 Electronic component and semiconductor device, method for manufacturing and mounting thereof, and circuit board and electronic equipment HK1018719A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP33904596 1996-12-04
JP35688096 1996-12-26
JP9144997 1997-03-26
PCT/JP1997/004437 WO1998025297A1 (fr) 1996-12-04 1997-12-04 Element electronique et dispositif a semiconducteur, procede de fabrication et de montage dudit dispositif, plaquette de circuit et materiel electronique

Publications (1)

Publication Number Publication Date
HK1018719A1 true HK1018719A1 (en) 1999-12-30

Family

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Application Number Title Priority Date Filing Date
HK99103769A HK1018719A1 (en) 1996-12-04 1999-08-31 Electronic component and semiconductor device, method for manufacturing and mounting thereof, and circuit board and electronic equipment

Country Status (8)

Country Link
US (8) US6475896B1 (zh)
JP (1) JP4895054B2 (zh)
KR (2) KR100549844B1 (zh)
CN (2) CN1519896A (zh)
AU (1) AU5136398A (zh)
HK (1) HK1018719A1 (zh)
TW (1) TW480636B (zh)
WO (1) WO1998025297A1 (zh)

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US7049686B2 (en) 2006-05-23
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CN1227721C (zh) 2005-11-16
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US20090181521A1 (en) 2009-07-16
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US8115284B2 (en) 2012-02-14
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US6730589B2 (en) 2004-05-04
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US7470979B2 (en) 2008-12-30

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