HK1041102A1 - 集成電路片、集成電路、印刷電路版及電子儀器 - Google Patents

集成電路片、集成電路、印刷電路版及電子儀器

Info

Publication number
HK1041102A1
HK1041102A1 HK02101860.3A HK02101860A HK1041102A1 HK 1041102 A1 HK1041102 A1 HK 1041102A1 HK 02101860 A HK02101860 A HK 02101860A HK 1041102 A1 HK1041102 A1 HK 1041102A1
Authority
HK
Hong Kong
Prior art keywords
integrated circuit
printed
electronic device
chip
circuit board
Prior art date
Application number
HK02101860.3A
Other languages
English (en)
Inventor
Kawai Eiji
Original Assignee
Sony Computer Entertainment Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Computer Entertainment Inc filed Critical Sony Computer Entertainment Inc
Publication of HK1041102A1 publication Critical patent/HK1041102A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0207—Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Tests Of Electronic Circuits (AREA)
HK02101860.3A 1998-11-20 2002-03-11 集成電路片、集成電路、印刷電路版及電子儀器 HK1041102A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP33138498 1998-11-20
PCT/JP1999/006480 WO2000031799A1 (fr) 1998-11-20 1999-11-19 Microcircuit integre, circuit integre, carte a circuits imprimes et dispositif electronique

Publications (1)

Publication Number Publication Date
HK1041102A1 true HK1041102A1 (zh) 2002-06-28

Family

ID=18243096

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02101860.3A HK1041102A1 (zh) 1998-11-20 2002-03-11 集成電路片、集成電路、印刷電路版及電子儀器

Country Status (10)

Country Link
US (2) US6469396B1 (zh)
EP (1) EP1150355A4 (zh)
KR (1) KR20010080509A (zh)
CN (1) CN1155089C (zh)
AU (1) AU1184400A (zh)
BR (1) BR9915509A (zh)
CA (1) CA2351417A1 (zh)
HK (1) HK1041102A1 (zh)
TW (1) TW442945B (zh)
WO (1) WO2000031799A1 (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10123758B4 (de) * 2001-05-16 2008-04-03 Texas Instruments Deutschland Gmbh Multi-Chip-Modul mit mehreren integrierten Halbleiterschaltungen
JP2003098221A (ja) * 2001-09-25 2003-04-03 Mitsubishi Electric Corp 半導体装置、半導体装置の試験方法及び半導体装置の試験装置
JP4034120B2 (ja) * 2002-05-28 2008-01-16 Ｎｅｃエレクトロニクス株式会社 半導体装置
US6781218B1 (en) * 2003-03-04 2004-08-24 Nptest, Inc. Method and apparatus for accessing internal nodes of an integrated circuit using IC package substrate
CN100485404C (zh) * 2003-05-21 2009-05-06 爱德万测试株式会社 试验装置及测试模块
US7214886B2 (en) * 2003-11-25 2007-05-08 International Business Machines Corporation High performance chip carrier substrate
US20050248028A1 (en) * 2004-05-05 2005-11-10 Cheng-Yen Huang Chip-packaging with bonding options connected to a package substrate
US7531852B2 (en) * 2004-06-14 2009-05-12 Denso Corporation Electronic unit with a substrate where an electronic circuit is fabricated
CN100464413C (zh) * 2004-12-24 2009-02-25 北京中星微电子有限公司 实现芯片管脚功能互换的电路及芯片
JP5264135B2 (ja) * 2006-11-09 2013-08-14 パナソニック株式会社 半導体集積回路及びマルチチップモジュール
JP5141121B2 (ja) * 2006-11-29 2013-02-13 セイコーエプソン株式会社 パターン形成方法、液滴吐出装置及び回路基板
US8197055B2 (en) * 2006-11-29 2012-06-12 Seiko Epson Corporation Patterning method, droplet discharging device and circuit board
CN101206179B (zh) * 2006-12-22 2010-08-11 中芯国际集成电路制造(上海)有限公司 光发射显微镜样品
EP2242095B1 (en) * 2007-12-28 2021-05-19 Socionext Inc. Semiconductor device and its manufacturing method
JP5239766B2 (ja) * 2008-11-14 2013-07-17 富士通セミコンダクター株式会社 レイアウト設計方法
EP2421041A4 (en) * 2009-04-15 2013-06-26 Olympus Medical Systems Corp SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
KR101097247B1 (ko) * 2009-10-26 2011-12-21 삼성에스디아이 주식회사 전자 회로 모듈 및 그 제조 방법
TW201134317A (en) * 2010-03-29 2011-10-01 Hon Hai Prec Ind Co Ltd Pins assignment for circuit board
US9500700B1 (en) * 2013-11-15 2016-11-22 Xilinx, Inc. Circuits for and methods of testing the operation of an input/output port
TWI639847B (zh) * 2017-06-27 2018-11-01 Powerchip Technology Corporation 積體電路晶片及其檢查方法
JP6400795B1 (ja) * 2017-06-29 2018-10-03 タイコエレクトロニクスジャパン合同会社 印刷回路基板

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US3905094A (en) * 1972-01-10 1975-09-16 Displaytek Corp Thermal display module
US4220917A (en) * 1978-07-31 1980-09-02 International Business Machines Corporation Test circuitry for module interconnection network
US4386389A (en) * 1981-09-08 1983-05-31 Mostek Corporation Single layer burn-in tape for integrated circuit
JPS58161336A (ja) * 1982-03-19 1983-09-24 Hitachi Ltd 半導体集積回路装置
JPS6262552A (ja) 1985-09-12 1987-03-19 Nec Corp 大規模集積回路
JPS63244853A (ja) * 1987-03-31 1988-10-12 Nec Corp 半導体集積回路装置
JPS63310155A (ja) * 1987-06-12 1988-12-19 Seiko Instr & Electronics Ltd 半導体集積回路装置
JPH01198051A (ja) 1988-02-03 1989-08-09 Tokyo Electron Ltd 半導体集積回路
JP2901156B2 (ja) * 1990-08-31 1999-06-07 三菱電機株式会社 半導体集積回路装置
JPH05198637A (ja) * 1992-01-23 1993-08-06 Mitsubishi Electric Corp 半導体集積回路及びそのテスト方法
US5453991A (en) * 1992-03-18 1995-09-26 Kabushiki Kaisha Toshiba Integrated circuit device with internal inspection circuitry
JPH07122701A (ja) 1993-10-21 1995-05-12 Hitachi Ltd 半導体装置およびその製造方法ならびにｐｇａ用リードフレーム
US5969538A (en) * 1996-10-31 1999-10-19 Texas Instruments Incorporated Semiconductor wafer with interconnect between dies for testing and a process of testing
JP3565991B2 (ja) * 1996-06-26 2004-09-15 株式会社ルネサステクノロジ 半導体集積回路および半導体集積回路の製造方法
TW432669B (en) * 1997-04-25 2001-05-01 Sharp Kk Semiconductor integrated circuit device capable of achieving reductions in chip area and consumption power
JP2998702B2 (ja) 1997-06-13 2000-01-11 日本電気株式会社 半導体集積回路
JP4014708B2 (ja) * 1997-08-21 2007-11-28 株式会社ルネサステクノロジ 半導体集積回路装置の設計方法
JP2001274323A (ja) * 2000-03-24 2001-10-05 Hitachi Ltd 半導体装置とそれを搭載した半導体モジュール、および半導体装置の製造方法

Also Published As

Publication number Publication date
US20020153538A1 (en) 2002-10-24
CN1155089C (zh) 2004-06-23
EP1150355A4 (en) 2003-09-10
US6469396B1 (en) 2002-10-22
BR9915509A (pt) 2001-11-13
TW442945B (en) 2001-06-23
WO2000031799A1 (fr) 2000-06-02
EP1150355A1 (en) 2001-10-31
AU1184400A (en) 2000-06-13
CA2351417A1 (en) 2000-06-02
KR20010080509A (ko) 2001-08-22
US6548910B2 (en) 2003-04-15
CN1326592A (zh) 2001-12-12

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