DE60033610D1 - Verfahren zur Züchtung einkristallinen GaN und Verfahren zur Herstellung eines Substrates aus einkristallinem GaN und danach hergestelltes Substrat - Google Patents

Verfahren zur Züchtung einkristallinen GaN und Verfahren zur Herstellung eines Substrates aus einkristallinem GaN und danach hergestelltes Substrat

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Publication number
DE60033610D1
DE60033610D1 DE60033610T DE60033610T DE60033610D1 DE 60033610 D1 DE60033610 D1 DE 60033610D1 DE 60033610 T DE60033610 T DE 60033610T DE 60033610 T DE60033610 T DE 60033610T DE 60033610 D1 DE60033610 D1 DE 60033610D1
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DE
Germany
Prior art keywords
substrate
monocrystalline gan
manufacturing
growing
produced thereafter
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60033610T
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English (en)
Other versions
DE60033610T2 (de
Inventor
Kensaku Motoki
Takuji Okahisa
Naoki Matsumoto
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Sumitomo Electric Industries Ltd
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Sumitomo Electric Industries Ltd
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Publication of DE60033610D1 publication Critical patent/DE60033610D1/de
Publication of DE60033610T2 publication Critical patent/DE60033610T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
    • C30B29/406Gallium nitride
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
    • H01L33/0062Processes for devices with an active region comprising only III-V compounds
    • H01L33/0075Processes for devices with an active region comprising only III-V compounds comprising nitride compounds

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Led Devices (AREA)
  • Semiconductor Lasers (AREA)
DE60033610T 1999-09-28 2000-09-27 Verfahren zur Züchtung einkristallinen GaN und Verfahren zur Herstellung eines Substrates aus einkristallinem GaN und danach hergestelltes Substrat Expired - Lifetime DE60033610T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP27388299 1999-09-28
JP27388299A JP4145437B2 (ja) 1999-09-28 1999-09-28 単結晶GaNの結晶成長方法及び単結晶GaN基板の製造方法と単結晶GaN基板

Publications (2)

Publication Number Publication Date
DE60033610D1 true DE60033610D1 (de) 2007-04-12
DE60033610T2 DE60033610T2 (de) 2007-06-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE60033610T Expired - Lifetime DE60033610T2 (de) 1999-09-28 2000-09-27 Verfahren zur Züchtung einkristallinen GaN und Verfahren zur Herstellung eines Substrates aus einkristallinem GaN und danach hergestelltes Substrat

Country Status (8)

Country Link
US (1) US6468347B1 (de)
EP (3) EP1088914B1 (de)
JP (1) JP4145437B2 (de)
KR (1) KR100404865B1 (de)
CN (3) CN1908251B (de)
DE (1) DE60033610T2 (de)
HK (1) HK1094484A1 (de)
TW (1) TW508836B (de)

Families Citing this family (193)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW428331B (en) * 1998-05-28 2001-04-01 Sumitomo Electric Industries Gallium nitride single crystal substrate and method of producing the same
US6821805B1 (en) 1999-10-06 2004-11-23 Matsushita Electric Industrial Co., Ltd. Semiconductor device, semiconductor substrate, and manufacture method
JP3968968B2 (ja) * 2000-07-10 2007-08-29 住友電気工業株式会社 単結晶GaN基板の製造方法
WO2002043466A2 (en) 2000-11-30 2002-06-06 North Carolina State University Non-thermionic sputter material transport device, methods of use, and materials produced thereby
ATE528421T1 (de) 2000-11-30 2011-10-15 Univ North Carolina State Verfahren zur herstellung von gruppe-iii- metallnitrid-materialien
JP3988018B2 (ja) 2001-01-18 2007-10-10 ソニー株式会社 結晶膜、結晶基板および半導体装置
US8633093B2 (en) 2001-04-12 2014-01-21 Sumitomo Electric Industries Ltd. Oxygen doping method to gallium nitride single crystal substrate
US6773504B2 (en) * 2001-04-12 2004-08-10 Sumitomo Electric Industries, Ltd. Oxygen doping method to gallium nitride single crystal substrate and oxygen-doped N-type gallium nitride freestanding single crystal substrate
PL207400B1 (pl) 2001-06-06 2010-12-31 Ammono Społka Z Ograniczoną Odpowiedzialnością Sposób i urządzenie do otrzymywania objętościowego monokryształu azotku zawierającego gal
RU2296189C2 (ru) 2001-06-06 2007-03-27 АММОНО Сп.з о.о. Способ и устройство для получения объемного монокристаллического галлийсодержащего нитрида (варианты)
US6488767B1 (en) * 2001-06-08 2002-12-03 Advanced Technology Materials, Inc. High surface quality GaN wafer and method of fabricating same
JP4055503B2 (ja) 2001-07-24 2008-03-05 日亜化学工業株式会社 半導体発光素子
JP4244542B2 (ja) * 2001-08-28 2009-03-25 日亜化学工業株式会社 窒化ガリウム系化合物半導体発光素子及びその製造方法
JP3785970B2 (ja) * 2001-09-03 2006-06-14 日本電気株式会社 Iii族窒化物半導体素子の製造方法
JP3864870B2 (ja) 2001-09-19 2007-01-10 住友電気工業株式会社 単結晶窒化ガリウム基板およびその成長方法並びにその製造方法
US7105865B2 (en) 2001-09-19 2006-09-12 Sumitomo Electric Industries, Ltd. AlxInyGa1−x−yN mixture crystal substrate
JP4396649B2 (ja) * 2006-02-17 2010-01-13 住友電気工業株式会社 GaN結晶基板およびその製造方法
JP3801125B2 (ja) 2001-10-09 2006-07-26 住友電気工業株式会社 単結晶窒化ガリウム基板と単結晶窒化ガリウムの結晶成長方法および単結晶窒化ガリウム基板の製造方法
US7354477B2 (en) 2001-10-09 2008-04-08 Sumitomo Electric Industries, Ltd. Method of growing GaN crystal, method of producing single crystal GaN substrate, and single crystal GaN substrate
US7556687B2 (en) 2001-09-19 2009-07-07 Sumitomo Electric Industries, Ltd. Gallium nitride crystal substrate and method of producing same
CN100362672C (zh) * 2001-09-19 2008-01-16 住友电气工业株式会社 单晶氮化镓基板及其生长方法与制造方法
US7473315B2 (en) 2001-10-09 2009-01-06 Sumitomo Electric Industries, Ltd. AlxInyGa1-x-yN mixture crystal substrate, method of growing AlxInyGa1-x-yN mixture crystal substrate and method of producing AlxInyGa1-x-yN mixture crystal substrate
JP4290358B2 (ja) * 2001-10-12 2009-07-01 住友電気工業株式会社 半導体発光素子の製造方法
JP4920152B2 (ja) * 2001-10-12 2012-04-18 住友電気工業株式会社 構造基板の製造方法および半導体素子の製造方法
PL214287B1 (pl) 2001-10-26 2013-07-31 Ammono Spolka Z Ograniczona Odpowiedzialnoscia Struktura urzadzenia emitujacego swiatlo z monokrystaliczna objetosciowa warstwa azotku
HUP0401882A3 (en) 2001-10-26 2005-11-28 Nichia Corp Anan Shi Substrate for epitaxy
US7498608B2 (en) 2001-10-29 2009-03-03 Sharp Kabushiki Kaisha Nitride-composite semiconductor laser element, its manufacturing method, and semiconductor optical device
TW561526B (en) * 2001-12-21 2003-11-11 Aixtron Ag Method for depositing III-V semiconductor layers on a non-III-V substrate
US8545629B2 (en) 2001-12-24 2013-10-01 Crystal Is, Inc. Method and apparatus for producing large, single-crystals of aluminum nitride
US20060005763A1 (en) * 2001-12-24 2006-01-12 Crystal Is, Inc. Method and apparatus for producing large, single-crystals of aluminum nitride
US7638346B2 (en) 2001-12-24 2009-12-29 Crystal Is, Inc. Nitride semiconductor heterostructures and related methods
US6812496B2 (en) * 2002-01-10 2004-11-02 Sharp Kabushiki Kaisha Group III nitride semiconductor laser device
US6890785B2 (en) * 2002-02-27 2005-05-10 Sony Corporation Nitride semiconductor, semiconductor device, and manufacturing methods for the same
JP2003282447A (ja) * 2002-03-20 2003-10-03 Fuji Photo Film Co Ltd 半導体素子用基板の製造方法および半導体素子用基板ならびに半導体素子
US6791120B2 (en) * 2002-03-26 2004-09-14 Sanyo Electric Co., Ltd. Nitride-based semiconductor device and method of fabricating the same
JP2005530334A (ja) * 2002-04-30 2005-10-06 クリー・インコーポレーテッド 高電圧スイッチング素子およびそれを形成するためのプロセス
US20060138431A1 (en) 2002-05-17 2006-06-29 Robert Dwilinski Light emitting device structure having nitride bulk single crystal layer
AU2002354467A1 (en) 2002-05-17 2003-12-02 Ammono Sp.Zo.O. Light emitting element structure having nitride bulk single crystal layer
US7335262B2 (en) 2002-05-17 2008-02-26 Ammono Sp. Z O.O. Apparatus for obtaining a bulk single crystal using supercritical ammonia
JP4443097B2 (ja) * 2002-06-20 2010-03-31 ソニー株式会社 GaN系半導体素子の作製方法
FR2842832B1 (fr) * 2002-07-24 2006-01-20 Lumilog Procede de realisation par epitaxie en phase vapeur d'un film de nitrure de gallium a faible densite de defaut
EP1581675B1 (de) 2002-12-11 2009-10-14 AMMONO Sp. z o.o. Schabloneartiges substrat und verfahren zu seiner herstellung
AU2003285767A1 (en) 2002-12-11 2004-06-30 Ammono Sp. Z O.O. Process for obtaining bulk monocrystalline gallium-containing nitride
US7372077B2 (en) 2003-02-07 2008-05-13 Sanyo Electric Co., Ltd. Semiconductor device
JP4085986B2 (ja) 2003-04-01 2008-05-14 ソニー株式会社 電池
JP3916584B2 (ja) 2003-04-24 2007-05-16 シャープ株式会社 窒化物半導体レーザ装置
US7462882B2 (en) 2003-04-24 2008-12-09 Sharp Kabushiki Kaisha Nitride semiconductor light-emitting device, method of fabricating it, and semiconductor optical apparatus
KR100550491B1 (ko) 2003-05-06 2006-02-09 스미토모덴키고교가부시키가이샤 질화물 반도체 기판 및 질화물 반도체 기판의 가공 방법
JP3913194B2 (ja) * 2003-05-30 2007-05-09 シャープ株式会社 窒化物半導体発光素子
JP4229005B2 (ja) 2003-06-26 2009-02-25 住友電気工業株式会社 GaN基板及びその製造方法、並びに窒化物半導体素子
JP4276020B2 (ja) 2003-08-01 2009-06-10 豊田合成株式会社 Iii族窒化物系化合物半導体の製造方法
WO2005018008A1 (ja) 2003-08-19 2005-02-24 Nichia Corporation 半導体素子
JP2005112641A (ja) 2003-10-03 2005-04-28 Sumitomo Electric Ind Ltd 窒化物半導体基板および窒化物半導体基板の製造方法
US20070018284A1 (en) * 2003-10-27 2007-01-25 Sumitomo Electric Industries, Ltd. Gallium nitride semiconductor substrate and process for producing the same
JP4232605B2 (ja) * 2003-10-30 2009-03-04 住友電気工業株式会社 窒化物半導体基板の製造方法と窒化物半導体基板
JP2005136200A (ja) * 2003-10-30 2005-05-26 Univ Nagoya 窒化物半導体結晶層の作製方法、窒化物半導体結晶層、及び窒化物半導体結晶層作製用の基材
US7323256B2 (en) * 2003-11-13 2008-01-29 Cree, Inc. Large area, uniformly low dislocation density GaN substrate and process for making the same
JP2005191530A (ja) * 2003-12-03 2005-07-14 Sumitomo Electric Ind Ltd 発光装置
JP2005209803A (ja) * 2004-01-21 2005-08-04 Sumitomo Electric Ind Ltd GaN結晶基板の製造方法
JP3888374B2 (ja) * 2004-03-17 2007-02-28 住友電気工業株式会社 GaN単結晶基板の製造方法
US7622318B2 (en) 2004-03-30 2009-11-24 Sony Corporation Method for producing structured substrate, structured substrate, method for producing semiconductor light emitting device, semiconductor light emitting device, method for producing semiconductor device, semiconductor device, method for producing device, and device
ATE527571T1 (de) * 2004-04-15 2011-10-15 Univ Boston Optische bauelemente mit texturierten halbleiterschichten
US8035113B2 (en) * 2004-04-15 2011-10-11 The Trustees Of Boston University Optical devices featuring textured semiconductor layers
KR100718188B1 (ko) * 2004-05-07 2007-05-15 삼성코닝 주식회사 비극성 a면 질화물 반도체 단결정 기판 및 이의 제조방법
JP5015417B2 (ja) * 2004-06-09 2012-08-29 住友電気工業株式会社 GaN結晶の製造方法
US8398767B2 (en) 2004-06-11 2013-03-19 Ammono S.A. Bulk mono-crystalline gallium-containing nitride and its application
JP4720125B2 (ja) * 2004-08-10 2011-07-13 日立電線株式会社 Iii−v族窒化物系半導体基板及びその製造方法並びにiii−v族窒化物系半導体
WO2006038713A1 (en) * 2004-10-07 2006-04-13 Showa Denko K.K. Production method for semiconductor device
TWI254470B (en) * 2005-05-04 2006-05-01 Genesis Photonics Inc Gallium nitride-based semiconductor growing method
US7288125B1 (en) 2004-11-03 2007-10-30 Ron Williams Crystal growing kit and method
JP4543894B2 (ja) * 2004-11-17 2010-09-15 住友電気工業株式会社 エピタキシャルウエハを作製する方法
JP4525309B2 (ja) * 2004-11-19 2010-08-18 日立電線株式会社 Iii−v族窒化物系半導体基板の評価方法
JP4543898B2 (ja) * 2004-11-22 2010-09-15 住友電気工業株式会社 窒化物半導体素子を製造する方法および窒化物半導体素子
KR100728533B1 (ko) * 2004-11-23 2007-06-15 삼성코닝 주식회사 질화갈륨 단결정 후막 및 이의 제조방법
PL371405A1 (pl) 2004-11-26 2006-05-29 Ammono Sp.Z O.O. Sposób wytwarzania objętościowych monokryształów metodą wzrostu na zarodku
JP4854275B2 (ja) * 2004-12-08 2012-01-18 シャープ株式会社 窒化物半導体発光素子およびその製造方法
FI20045482A0 (fi) * 2004-12-14 2004-12-14 Optogan Oy Matalamman dislokaatiotiheyden omaava puolijohdesubstraatti, ja menetelmä sen valmistamiseksi
JP2006193348A (ja) 2005-01-11 2006-07-27 Sumitomo Electric Ind Ltd Iii族窒化物半導体基板およびその製造方法
JP4849296B2 (ja) 2005-04-11 2012-01-11 日立電線株式会社 GaN基板
CN100438109C (zh) * 2005-05-16 2008-11-26 索尼株式会社 发光二极管、集成发光二极管、其制法、生长方法、光源单元装置、背光装置、显示器和电子器件
JP2006332240A (ja) 2005-05-25 2006-12-07 Sanyo Electric Co Ltd 窒化物半導体発光素子の製造方法
KR20060127743A (ko) 2005-06-06 2006-12-13 스미토모덴키고교가부시키가이샤 질화물 반도체 기판과 그 제조 방법
WO2007023722A1 (ja) * 2005-08-25 2007-03-01 Sumitomo Electric Industries, Ltd. GaxIn1-xN(0≦x≦1)結晶の製造方法、GaxIn1-xN(0≦x≦1)結晶基板、GaN結晶の製造方法、GaN結晶基板および製品
KR100707166B1 (ko) * 2005-10-12 2007-04-13 삼성코닝 주식회사 GaN 기판의 제조방법
US8425858B2 (en) * 2005-10-14 2013-04-23 Morpho Detection, Inc. Detection apparatus and associated method
JP5454647B2 (ja) * 2005-10-28 2014-03-26 日亜化学工業株式会社 窒化物半導体基板の製造方法、窒化物半導体基板及び発光素子
JP5140962B2 (ja) * 2005-10-28 2013-02-13 日亜化学工業株式会社 窒化物半導体基板の製造方法
CA2627880A1 (en) * 2005-10-31 2007-05-10 Trustees Of Boston University Optical devices featuring textured semiconductor layers
CN100425743C (zh) * 2005-11-15 2008-10-15 中国科学院物理研究所 一种采用新型助熔剂熔盐法生长氮化镓单晶的方法
EP1960570A2 (de) 2005-11-28 2008-08-27 Crystal Is, Inc. Grosse aluminiumnitridkristalle mit reduzierten defekten und herstellungsverfahren dafür
CN101331249B (zh) * 2005-12-02 2012-12-19 晶体公司 掺杂的氮化铝晶体及其制造方法
JP4696886B2 (ja) * 2005-12-08 2011-06-08 日立電線株式会社 自立した窒化ガリウム単結晶基板の製造方法、および窒化物半導体素子の製造方法
WO2008048303A2 (en) * 2005-12-12 2008-04-24 Kyma Technologies, Inc. Group iii nitride articles and methods for making same
JP2007161536A (ja) 2005-12-14 2007-06-28 Sumitomo Electric Ind Ltd AlxGayIn1−x−yN結晶基板、半導体デバイスおよびその製造方法
KR100695118B1 (ko) * 2005-12-27 2007-03-14 삼성코닝 주식회사 다중-프리스탠딩 GaN 웨이퍼의 제조방법
US7691732B2 (en) 2008-06-18 2010-04-06 Sumitomo Electric Industries, Ltd. Manufacturing method of nitride substrate, nitride substrate, and nitride-based semiconductor device
JP4647525B2 (ja) * 2006-03-20 2011-03-09 日本碍子株式会社 Iii族窒化物結晶の製造方法
US9034103B2 (en) 2006-03-30 2015-05-19 Crystal Is, Inc. Aluminum nitride bulk crystals having high transparency to ultraviolet light and methods of forming them
EP2918708B1 (de) 2006-03-30 2019-10-30 Crystal Is, Inc. Verfahren zum Glühen eines Aluminiumnitrid-Wafers
US8357243B2 (en) 2008-06-12 2013-01-22 Sixpoint Materials, Inc. Method for testing group III-nitride wafers and group III-nitride wafers with test data
US8728234B2 (en) 2008-06-04 2014-05-20 Sixpoint Materials, Inc. Methods for producing improved crystallinity group III-nitride crystals from initial group III-nitride seed by ammonothermal growth
US8236267B2 (en) 2008-06-04 2012-08-07 Sixpoint Materials, Inc. High-pressure vessel for growing group III nitride crystals and method of growing group III nitride crystals using high-pressure vessel and group III nitride crystal
US8764903B2 (en) 2009-05-05 2014-07-01 Sixpoint Materials, Inc. Growth reactor for gallium-nitride crystals using ammonia and hydrogen chloride
TWI334164B (en) * 2006-06-07 2010-12-01 Ind Tech Res Inst Method of manufacturing nitride semiconductor substrate and composite material substrate
US8293012B2 (en) 2006-06-20 2012-10-23 Sumitomo Electric Industries, Ltd. Method for growing AlxGa1-xN crystal, and AlxGa1-xN crystal substrate
JP5045232B2 (ja) * 2006-06-20 2012-10-10 住友電気工業株式会社 AlxGa1−xN結晶の成長方法
US8778078B2 (en) * 2006-08-09 2014-07-15 Freiberger Compound Materials Gmbh Process for the manufacture of a doped III-N bulk crystal and a free-standing III-N substrate, and doped III-N bulk crystal and free-standing III-N substrate as such
JP2008066355A (ja) * 2006-09-05 2008-03-21 Sumitomo Electric Ind Ltd 3族窒化物基板の製造方法、3族窒化物基板、エピタキシャル層付き3族窒化物基板、3族窒化物デバイス、エピタキシャル層付き3族窒化物基板の製造方法、および3族窒化物デバイスの製造方法。
CN101522962A (zh) * 2006-10-16 2009-09-02 三菱化学株式会社 氮化物半导体的制造方法、结晶生长速度增加剂、氮化物单晶、晶片及器件
US8557681B2 (en) * 2006-10-30 2013-10-15 International Rectifier Corporation III-nitride wafer fabrication
KR101262226B1 (ko) * 2006-10-31 2013-05-15 삼성전자주식회사 반도체 발광 소자의 제조방법
JP5332168B2 (ja) 2006-11-17 2013-11-06 住友電気工業株式会社 Iii族窒化物結晶の製造方法
US9064706B2 (en) 2006-11-17 2015-06-23 Sumitomo Electric Industries, Ltd. Composite of III-nitride crystal on laterally stacked substrates
JP2008127252A (ja) * 2006-11-22 2008-06-05 Hitachi Cable Ltd 窒化物半導体インゴット及びこれから得られる窒化物半導体基板並びに窒化物半導体インゴットの製造方法
ATE546568T1 (de) * 2006-12-08 2012-03-15 Saint Gobain Cristaux & Detecteurs Verfahren zur herstellung eines nitrid- einkristalls durch epitaktisches aufwachsen auf ein substrat unter verhinderung von wachstum an den substraträndern
JP5125098B2 (ja) * 2006-12-26 2013-01-23 信越半導体株式会社 窒化物半導体自立基板の製造方法
JP4259591B2 (ja) * 2007-01-16 2009-04-30 住友電気工業株式会社 Iii族窒化物結晶の製造方法、iii族窒化物結晶基板およびiii族窒化物半導体デバイス
US9771666B2 (en) 2007-01-17 2017-09-26 Crystal Is, Inc. Defect reduction in seeded aluminum nitride crystal growth
WO2008088838A1 (en) 2007-01-17 2008-07-24 Crystal Is, Inc. Defect reduction in seeded aluminum nitride crystal growth
US8080833B2 (en) 2007-01-26 2011-12-20 Crystal Is, Inc. Thick pseudomorphic nitride epitaxial layers
JP5730484B2 (ja) 2007-01-26 2015-06-10 クリスタル アイエス インコーポレイテッド 厚みのある擬似格子整合型の窒化物エピタキシャル層
US8157914B1 (en) 2007-02-07 2012-04-17 Chien-Min Sung Substrate surface modifications for compositional gradation of crystalline materials and associated products
JP5165264B2 (ja) 2007-03-22 2013-03-21 浜松ホトニクス株式会社 窒化物半導体基板
US8088220B2 (en) * 2007-05-24 2012-01-03 Crystal Is, Inc. Deep-eutectic melt growth of nitride crystals
JP4964027B2 (ja) * 2007-05-28 2012-06-27 三洋電機株式会社 窒化物系半導体レーザ素子の作製方法
JP4964026B2 (ja) * 2007-05-28 2012-06-27 三洋電機株式会社 窒化物系半導体レーザ素子の作製方法
US7799600B2 (en) * 2007-05-31 2010-09-21 Chien-Min Sung Doped diamond LED devices and associated methods
JP4645622B2 (ja) 2007-06-01 2011-03-09 住友電気工業株式会社 GaN結晶の成長方法
EP2171748A1 (de) * 2007-07-26 2010-04-07 S.O.I.Tec Silicon on Insulator Technologies Epitaktische verfahren und damit gezüchtete templates
JP4810517B2 (ja) * 2007-09-10 2011-11-09 日本電気株式会社 Iii−v族窒化物系半導体基板
CA2641016A1 (en) 2007-10-24 2009-04-24 Sumitomo Electric Industries, Ltd. Semi-insulating nitride semiconductor substrate and method of manufacturing the same, nitride semiconductor epitaxial substrate, and field-effect transistor
JP5018423B2 (ja) 2007-11-20 2012-09-05 住友電気工業株式会社 Iii族窒化物半導体結晶基板および半導体デバイス
CN101452980B (zh) * 2007-11-30 2012-03-21 展晶科技(深圳)有限公司 三族氮化合物半导体发光二极管的制造方法
JP4786634B2 (ja) * 2007-12-14 2011-10-05 住友電気工業株式会社 窒化物系化合物半導体素子及びその作製方法
TWI487817B (zh) 2008-02-25 2015-06-11 Sixpoint Materials Inc 用於製造第iii族氮化物晶圓之方法及第iii族氮化物晶圓
US8592800B2 (en) * 2008-03-07 2013-11-26 Trustees Of Boston University Optical devices featuring nonpolar textured semiconductor layers
JP5031674B2 (ja) * 2008-06-09 2012-09-19 シャープ株式会社 窒化物半導体レーザ素子および窒化物半導体レーザ素子の製造方法
JP5075020B2 (ja) * 2008-06-09 2012-11-14 シャープ株式会社 窒化物半導体レーザ素子および窒化物半導体レーザ素子の製造方法
JP4802220B2 (ja) * 2008-06-20 2011-10-26 住友電気工業株式会社 半導体素子の製造方法
WO2010060034A1 (en) 2008-11-24 2010-05-27 Sixpoint Materials, Inc. METHODS FOR PRODUCING GaN NUTRIENT FOR AMMONOTHERMAL GROWTH
TW201029073A (en) * 2009-01-21 2010-08-01 Univ Nat Chunghsing Epitaxial wafer with low surface defect density
US8313967B1 (en) * 2009-01-21 2012-11-20 Stc.Unm Cubic phase, nitrogen-based compound semiconductor films epitaxially grown on a grooved Si <001> substrate
EP2413350A4 (de) * 2009-03-27 2013-10-23 Dowa Holdings Co Ltd Substrat zur züchtung von gruppe-iii-nitrid-halbleitern, epitaktisches substrat für gruppe-iii-nitrid-halbleiter, gruppe-iii-nitrid-halbleiterelement, freitragendes substrat für gruppe-iii-nitrid-halbleiter und herstellungsverfahren dafür
JP5446622B2 (ja) 2009-06-29 2014-03-19 住友電気工業株式会社 Iii族窒化物結晶およびその製造方法
US8933644B2 (en) 2009-09-18 2015-01-13 Soraa, Inc. LED lamps with improved quality of light
US9293667B2 (en) 2010-08-19 2016-03-22 Soraa, Inc. System and method for selected pump LEDs with multiple phosphors
US8740413B1 (en) 2010-02-03 2014-06-03 Soraa, Inc. System and method for providing color light sources in proximity to predetermined wavelength conversion structures
US10147850B1 (en) 2010-02-03 2018-12-04 Soraa, Inc. System and method for providing color light sources in proximity to predetermined wavelength conversion structures
US20110215348A1 (en) * 2010-02-03 2011-09-08 Soraa, Inc. Reflection Mode Package for Optical Devices Using Gallium and Nitrogen Containing Materials
US8905588B2 (en) 2010-02-03 2014-12-09 Sorra, Inc. System and method for providing color light sources in proximity to predetermined wavelength conversion structures
KR101091181B1 (ko) 2010-02-22 2011-12-09 태현통상 주식회사 장식용 발광다이오드
JP5146697B2 (ja) * 2010-03-08 2013-02-20 住友電気工業株式会社 窒化物半導体
JP5304715B2 (ja) * 2010-04-09 2013-10-02 日立電線株式会社 Iii−v族窒化物系半導体基板
JP5527767B2 (ja) * 2010-06-01 2014-06-25 一般財団法人電力中央研究所 炭化珪素単結晶の製造方法
JP2011256082A (ja) * 2010-06-10 2011-12-22 Sumitomo Electric Ind Ltd GaN結晶自立基板およびその製造方法
CN105951177B (zh) 2010-06-30 2018-11-02 晶体公司 使用热梯度控制的大块氮化铝单晶的生长
JP2012033708A (ja) * 2010-07-30 2012-02-16 Sumitomo Electric Ind Ltd 半導体装置の製造方法
US8110484B1 (en) 2010-11-19 2012-02-07 Sumitomo Electric Industries, Ltd. Conductive nitride semiconductor substrate and method for producing the same
CN102169949B (zh) * 2011-02-25 2013-10-09 聚灿光电科技(苏州)有限公司 一种发光二极管基板及其制造方法
CN102140680A (zh) * 2011-05-10 2011-08-03 青岛铝镓光电半导体有限公司 氮化镓单晶的制备方法
JP2013033921A (ja) * 2011-06-30 2013-02-14 Mitsubishi Chemicals Corp 窒化物系発光ダイオード素子およびその製造方法
US8962359B2 (en) 2011-07-19 2015-02-24 Crystal Is, Inc. Photon extraction from nitride ultraviolet light-emitting devices
CN102286777B (zh) * 2011-08-26 2013-11-13 山东天岳先进材料科技有限公司 氢化物气相外延生长GaN单晶用的H3PO4腐蚀籽晶及其制备方法
CN102418143A (zh) * 2011-11-17 2012-04-18 山东大学 一种以H3PO4腐蚀衬底制备自剥离GaN单晶的方法
CN102437264B (zh) 2011-11-30 2013-11-06 李园 半导体结构及其形成方法
CN104956498B (zh) * 2013-01-31 2017-06-13 欧司朗光电半导体有限公司 半导体层序列和用于制造半导体层序列的方法
CN108511567A (zh) 2013-03-15 2018-09-07 晶体公司 与赝配电子和光电器件的平面接触
JP5685617B2 (ja) * 2013-03-29 2015-03-18 ▲さん▼圓光電股▲ふん▼有限公司 発光ダイオード装置の製造方法
KR102122366B1 (ko) * 2013-06-14 2020-06-12 삼성전자주식회사 질화물 반도체 박막 제조방법 및 이를 이용한 질화물 반도체 소자 제조방법
JP6185398B2 (ja) * 2014-01-31 2017-08-23 東京エレクトロン株式会社 窒化ガリウム系結晶の成長方法及び熱処理装置
US9142406B1 (en) * 2014-05-02 2015-09-22 Translucent, Inc. III-N material grown on ErAlN buffer on Si substrate
KR102203461B1 (ko) 2014-07-10 2021-01-18 삼성전자주식회사 나노 구조 반도체 발광 소자
JP6269368B2 (ja) * 2014-07-24 2018-01-31 住友電気工業株式会社 窒化ガリウム基板
EP3255181A4 (de) 2015-02-06 2018-01-10 Mitsubishi Chemical Corporation Gan-einkristall und verfahren zur herstellung des gan-einkristalls
US9666754B2 (en) 2015-05-27 2017-05-30 Samsung Electronics Co., Ltd. Method of manufacturing semiconductor substrate and substrate for semiconductor growth
US10087547B2 (en) * 2015-12-21 2018-10-02 The Regents Of The University Of California Growth of single crystal III-V semiconductors on amorphous substrates
CN106910806A (zh) * 2015-12-22 2017-06-30 锐捷科技股份有限公司 蓝宝石基板
KR20180069403A (ko) * 2016-12-15 2018-06-25 삼성전자주식회사 질화 갈륨 기판의 제조 방법
CN110230102B (zh) * 2018-03-05 2022-01-04 中国科学院苏州纳米技术与纳米仿生研究所 极低位错密度氮化镓单晶及其助熔剂法生长方法
CN110769975B (zh) * 2018-03-16 2022-04-08 安达满纳米奇精密宝石有限公司 金刚石晶体的研磨方法和金刚石晶体
JP6595678B1 (ja) * 2018-08-29 2019-10-23 株式会社サイオクス 窒化物半導体基板、窒化物半導体基板の製造方法および積層構造体
JP6595676B1 (ja) * 2018-08-29 2019-10-23 株式会社サイオクス 窒化物半導体基板の製造方法、窒化物半導体基板および積層構造体
JP6595677B1 (ja) * 2018-08-29 2019-10-23 株式会社サイオクス 窒化物半導体基板の製造方法、窒化物半導体基板および積層構造体
JP6595731B1 (ja) * 2018-10-26 2019-10-23 株式会社サイオクス 窒化物半導体基板の製造方法、窒化物半導体基板および積層構造体
JP6595689B1 (ja) * 2018-11-08 2019-10-23 株式会社サイオクス 窒化物半導体基板の製造方法、窒化物半導体基板および積層構造体
JP6657459B1 (ja) * 2018-12-14 2020-03-04 株式会社サイオクス 窒化物半導体基板の製造方法、および窒化物半導体基板
JP6646769B1 (ja) * 2019-02-01 2020-02-14 株式会社サイオクス 窒化物半導体基板、積層構造体、および窒化物半導体基板の製造方法
JP7339019B2 (ja) * 2019-05-20 2023-09-05 住友化学株式会社 窒化物半導体基板の製造方法
JP7339096B2 (ja) * 2019-09-25 2023-09-05 住友化学株式会社 窒化物半導体基板の製造方法および窒化物半導体基板
JP6795805B1 (ja) * 2020-05-15 2020-12-02 株式会社Cusic SiC積層体およびその製造方法ならびに半導体装置
WO2022059708A1 (ja) * 2020-09-15 2022-03-24 国立大学法人長岡技術科学大学 研磨状態解析予測プログラム、記憶装置、カソードルミネセンス装置、および研磨状態解析予測方法
CN112397571B (zh) * 2021-01-18 2021-04-23 苏州纳维科技有限公司 一种氮化镓衬底及半导体复合衬底
WO2023218558A1 (ja) * 2022-05-11 2023-11-16 住友電気工業株式会社 窒化ガリウム単結晶基板およびその製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5650198A (en) * 1995-08-18 1997-07-22 The Regents Of The University Of California Defect reduction in the growth of group III nitrides
JP3179346B2 (ja) * 1996-08-27 2001-06-25 松下電子工業株式会社 窒化ガリウム結晶の製造方法
JP3139445B2 (ja) * 1997-03-13 2001-02-26 日本電気株式会社 GaN系半導体の成長方法およびGaN系半導体膜
PL184902B1 (pl) * 1997-04-04 2003-01-31 Centrum Badan Wysokocisnieniowych Pan Sposób usuwania nierówności i obszarów silnie zdefektowanych z powierzchni kryształów i warstw epitaksjalnych GaN i Ga AL In N
EP2234142A1 (de) * 1997-04-11 2010-09-29 Nichia Corporation Nitridhalbleitersubstrat
FR2769924B1 (fr) * 1997-10-20 2000-03-10 Centre Nat Rech Scient Procede de realisation d'une couche epitaxiale de nitrure de gallium, couche epitaxiale de nitrure de gallium et composant optoelectronique muni d'une telle couche
US6091085A (en) * 1998-02-19 2000-07-18 Agilent Technologies, Inc. GaN LEDs with improved output coupling efficiency
TW417315B (en) * 1998-06-18 2001-01-01 Sumitomo Electric Industries GaN single crystal substrate and its manufacture method of the same
US6252261B1 (en) * 1998-09-30 2001-06-26 Nec Corporation GaN crystal film, a group III element nitride semiconductor wafer and a manufacturing process therefor
DE19929591A1 (de) * 1999-06-28 2001-01-04 Max Planck Gesellschaft Herstellung von epitaktischen GaN-Schichten auf Substraten

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