DE60228378D1 - Verfahren zur Züchtung einkristallinen GaN und Verfahren zur Herstellung eines Substrates aus einkristallinem GaN und danach hergestelltes Substrat - Google Patents

Verfahren zur Züchtung einkristallinen GaN und Verfahren zur Herstellung eines Substrates aus einkristallinem GaN und danach hergestelltes Substrat

Info

Publication number
DE60228378D1
DE60228378D1 DE60228378T DE60228378T DE60228378D1 DE 60228378 D1 DE60228378 D1 DE 60228378D1 DE 60228378 T DE60228378 T DE 60228378T DE 60228378 T DE60228378 T DE 60228378T DE 60228378 D1 DE60228378 D1 DE 60228378D1
Authority
DE
Germany
Prior art keywords
substrate
monocrystalline gan
manufacturing
growing
produced thereafter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60228378T
Other languages
English (en)
Inventor
Kensaku Motoki
Ryu Hirota
Takuji Okahisa
Seiji Nakahata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Application granted granted Critical
Publication of DE60228378D1 publication Critical patent/DE60228378D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
    • C30B29/406Gallium nitride
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B23/00Single-crystal growth by condensing evaporated or sublimed materials
    • C30B23/002Controlling or regulating
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Led Devices (AREA)
  • Semiconductor Lasers (AREA)
  • Recrystallisation Techniques (AREA)
DE60228378T 2001-10-09 2002-10-08 Verfahren zur Züchtung einkristallinen GaN und Verfahren zur Herstellung eines Substrates aus einkristallinem GaN und danach hergestelltes Substrat Expired - Lifetime DE60228378D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001311018 2001-10-09
JP2002269387A JP3801125B2 (ja) 2001-10-09 2002-09-17 単結晶窒化ガリウム基板と単結晶窒化ガリウムの結晶成長方法および単結晶窒化ガリウム基板の製造方法

Publications (1)

Publication Number Publication Date
DE60228378D1 true DE60228378D1 (de) 2008-10-02

Family

ID=26623803

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60236900T Expired - Lifetime DE60236900D1 (de) 2001-10-09 2002-10-08 Einkristallines GaN-Substrat und damit hergestellte Laserdiode
DE60228378T Expired - Lifetime DE60228378D1 (de) 2001-10-09 2002-10-08 Verfahren zur Züchtung einkristallinen GaN und Verfahren zur Herstellung eines Substrates aus einkristallinem GaN und danach hergestelltes Substrat

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE60236900T Expired - Lifetime DE60236900D1 (de) 2001-10-09 2002-10-08 Einkristallines GaN-Substrat und damit hergestellte Laserdiode

Country Status (8)

Country Link
US (4) US7087114B2 (de)
EP (3) EP1995796B1 (de)
JP (1) JP3801125B2 (de)
KR (1) KR100523619B1 (de)
CN (1) CN100435268C (de)
CA (2) CA2406347C (de)
DE (2) DE60236900D1 (de)
TW (1) TWI234293B (de)

Families Citing this family (198)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7105865B2 (en) 2001-09-19 2006-09-12 Sumitomo Electric Industries, Ltd. AlxInyGa1−x−yN mixture crystal substrate
JP3801125B2 (ja) * 2001-10-09 2006-07-26 住友電気工業株式会社 単結晶窒化ガリウム基板と単結晶窒化ガリウムの結晶成長方法および単結晶窒化ガリウム基板の製造方法
US7556687B2 (en) 2001-09-19 2009-07-07 Sumitomo Electric Industries, Ltd. Gallium nitride crystal substrate and method of producing same
US7473315B2 (en) * 2001-10-09 2009-01-06 Sumitomo Electric Industries, Ltd. AlxInyGa1-x-yN mixture crystal substrate, method of growing AlxInyGa1-x-yN mixture crystal substrate and method of producing AlxInyGa1-x-yN mixture crystal substrate
JP4920152B2 (ja) * 2001-10-12 2012-04-18 住友電気工業株式会社 構造基板の製造方法および半導体素子の製造方法
US6812496B2 (en) * 2002-01-10 2004-11-02 Sharp Kabushiki Kaisha Group III nitride semiconductor laser device
US20030198301A1 (en) * 2002-01-30 2003-10-23 Kazutaka Terashima Method of epitaxial lateral overgrowth
FR2838820B1 (fr) * 2002-04-17 2006-03-17 Sagem Procede pour constituer un resonateur mecanique a structure vibrante monolithique plane usinee dans un materiau cristallin, et resonateur ainsi constitue
JP3997827B2 (ja) * 2002-04-30 2007-10-24 住友電気工業株式会社 窒化ガリウム成長用基板及び窒化ガリウム成長用基板の製造方法並びに窒化ガリウム基板の製造方法
US7372077B2 (en) * 2003-02-07 2008-05-13 Sanyo Electric Co., Ltd. Semiconductor device
US7462882B2 (en) 2003-04-24 2008-12-09 Sharp Kabushiki Kaisha Nitride semiconductor light-emitting device, method of fabricating it, and semiconductor optical apparatus
JP4518746B2 (ja) * 2003-05-06 2010-08-04 住友電気工業株式会社 GaN基板
JP3913194B2 (ja) * 2003-05-30 2007-05-09 シャープ株式会社 窒化物半導体発光素子
JP4342853B2 (ja) * 2003-07-01 2009-10-14 独立行政法人科学技術振興機構 基板上への窒化物薄膜の成長方法及び窒化物薄膜装置
JP4390640B2 (ja) * 2003-07-31 2009-12-24 シャープ株式会社 窒化物半導体レーザ素子、窒化物半導体発光素子、窒化物半導体ウェハおよびそれらの製造方法
JP2005064188A (ja) * 2003-08-11 2005-03-10 Sumitomo Electric Ind Ltd 基板の回収方法および再生方法、ならびに半導体ウエハの製造方法
JP3841092B2 (ja) 2003-08-26 2006-11-01 住友電気工業株式会社 発光装置
WO2005022620A1 (ja) * 2003-08-29 2005-03-10 Nec Corporation 窒化物半導体基板およびそれを用いた窒化物半導体素子
US7323256B2 (en) * 2003-11-13 2008-01-29 Cree, Inc. Large area, uniformly low dislocation density GaN substrate and process for making the same
JP2005191530A (ja) 2003-12-03 2005-07-14 Sumitomo Electric Ind Ltd 発光装置
KR101156146B1 (ko) 2003-12-09 2012-06-18 재팬 사이언스 앤드 테크놀로지 에이젼시 질소면의 표면상의 구조물 제조를 통한 고효율 3족 질화물계 발광다이오드
US7622318B2 (en) 2004-03-30 2009-11-24 Sony Corporation Method for producing structured substrate, structured substrate, method for producing semiconductor light emitting device, semiconductor light emitting device, method for producing semiconductor device, semiconductor device, method for producing device, and device
JP5013661B2 (ja) * 2004-03-31 2012-08-29 三洋電機株式会社 窒化物系半導体素子の製造方法及び窒化物系半導体素子
US7408199B2 (en) 2004-04-02 2008-08-05 Nichia Corporation Nitride semiconductor laser device and nitride semiconductor device
JP4822674B2 (ja) * 2004-04-30 2011-11-24 パナソニック株式会社 窒化物半導体素子およびその製造方法
JP4322187B2 (ja) * 2004-08-19 2009-08-26 シャープ株式会社 窒化物半導体発光素子
JP4543894B2 (ja) * 2004-11-17 2010-09-15 住友電気工業株式会社 エピタキシャルウエハを作製する方法
JP4543898B2 (ja) * 2004-11-22 2010-09-15 住友電気工業株式会社 窒化物半導体素子を製造する方法および窒化物半導体素子
JP2006193348A (ja) * 2005-01-11 2006-07-27 Sumitomo Electric Ind Ltd Iii族窒化物半導体基板およびその製造方法
JP2006294698A (ja) * 2005-04-06 2006-10-26 Sumitomo Electric Ind Ltd 発光素子、発光素子の製造方法、およびGaN基板
KR20060127743A (ko) 2005-06-06 2006-12-13 스미토모덴키고교가부시키가이샤 질화물 반도체 기판과 그 제조 방법
JP5024722B2 (ja) * 2005-06-06 2012-09-12 住友電気工業株式会社 窒化物半導体基板とその製造方法
WO2007008394A1 (en) * 2005-07-11 2007-01-18 Cree, Inc. Laser diode orientation on mis-cut substrates
JP4656410B2 (ja) 2005-09-05 2011-03-23 住友電気工業株式会社 窒化物半導体デバイスの製造方法
JP2007073761A (ja) 2005-09-07 2007-03-22 Sumitomo Electric Ind Ltd 窒化物半導体基板及び窒化物半導体基板の加工方法
JP2007161536A (ja) 2005-12-14 2007-06-28 Sumitomo Electric Ind Ltd AlxGayIn1−x−yN結晶基板、半導体デバイスおよびその製造方法
US7691732B2 (en) 2008-06-18 2010-04-06 Sumitomo Electric Industries, Ltd. Manufacturing method of nitride substrate, nitride substrate, and nitride-based semiconductor device
JP2007191321A (ja) * 2006-01-17 2007-08-02 Sumitomo Electric Ind Ltd 窒化物基板の製造方法と窒化物基板及び窒化物系半導体デバイス
KR20090008321A (ko) 2006-04-28 2009-01-21 스미토모덴키고교가부시키가이샤 질화갈륨 결정을 제작하는 방법 및 질화갈륨 웨이퍼
TW200806829A (en) * 2006-07-20 2008-02-01 Univ Nat Central Method for producing single crystal gallium nitride substrate
JP2008066355A (ja) * 2006-09-05 2008-03-21 Sumitomo Electric Ind Ltd 3族窒化物基板の製造方法、3族窒化物基板、エピタキシャル層付き3族窒化物基板、3族窒化物デバイス、エピタキシャル層付き3族窒化物基板の製造方法、および3族窒化物デバイスの製造方法。
US7901960B2 (en) * 2006-10-19 2011-03-08 Sumitomo Electric Industries, Ltd. Group III nitride substrate, epitaxial layer-provided substrate, methods of manufacturing the same, and method of manufacturing semiconductor device
US8458262B2 (en) * 2006-12-22 2013-06-04 At&T Mobility Ii Llc Filtering spam messages across a communication network
JP4259591B2 (ja) * 2007-01-16 2009-04-30 住友電気工業株式会社 Iii族窒化物結晶の製造方法、iii族窒化物結晶基板およびiii族窒化物半導体デバイス
JP2008300541A (ja) 2007-05-30 2008-12-11 Sumitomo Electric Ind Ltd 半導体発光素子及びそれに用いる素子形成用基板
JP5118392B2 (ja) * 2007-06-08 2013-01-16 ローム株式会社 半導体発光素子およびその製造方法
EP2003696B1 (de) 2007-06-14 2012-02-29 Sumitomo Electric Industries, Ltd. GaN-Substrat, Substrat mit Epitaxialschicht, Halbleiterbauelement sowie Verfahren zur Herstellung eines GaN-Substrats
TWI415292B (zh) * 2007-07-04 2013-11-11 Univ Nat Chiao Tung Light emitting element having a nanometer stripe structure and a method of manufacturing the same
JP5245305B2 (ja) * 2007-07-06 2013-07-24 サンケン電気株式会社 電界効果半導体装置及びその製造方法
JP5041902B2 (ja) * 2007-07-24 2012-10-03 三洋電機株式会社 半導体レーザ素子
JP5022136B2 (ja) 2007-08-06 2012-09-12 三洋電機株式会社 半導体素子の製造方法および半導体素子
JP4869179B2 (ja) * 2007-08-10 2012-02-08 三洋電機株式会社 半導体基板およびその製造方法
JP4985533B2 (ja) * 2007-10-24 2012-07-25 住友電気工業株式会社 半絶縁性窒化物半導体基板の製造方法
CA2641016A1 (en) 2007-10-24 2009-04-24 Sumitomo Electric Industries, Ltd. Semi-insulating nitride semiconductor substrate and method of manufacturing the same, nitride semiconductor epitaxial substrate, and field-effect transistor
JP2009126723A (ja) * 2007-11-20 2009-06-11 Sumitomo Electric Ind Ltd Iii族窒化物半導体結晶の成長方法、iii族窒化物半導体結晶基板の製造方法およびiii族窒化物半導体結晶基板
JP5053893B2 (ja) 2008-03-07 2012-10-24 住友電気工業株式会社 窒化物半導体レーザを作製する方法
JP2009280482A (ja) 2008-04-25 2009-12-03 Sumitomo Electric Ind Ltd Iii族窒化物単結晶自立基板およびそれを用いた半導体デバイスの製造方法
JP2009272380A (ja) 2008-05-01 2009-11-19 Sumitomo Electric Ind Ltd Iii族窒化物結晶およびその表面処理方法、iii族窒化物積層体およびその製造方法、ならびにiii族窒化物半導体デバイスおよびその製造方法
US8871024B2 (en) 2008-06-05 2014-10-28 Soraa, Inc. High pressure apparatus and method for nitride crystal growth
US9157167B1 (en) 2008-06-05 2015-10-13 Soraa, Inc. High pressure apparatus and method for nitride crystal growth
US8097081B2 (en) * 2008-06-05 2012-01-17 Soraa, Inc. High pressure apparatus and method for nitride crystal growth
US8847249B2 (en) 2008-06-16 2014-09-30 Soraa, Inc. Solid-state optical device having enhanced indium content in active regions
US8303710B2 (en) * 2008-06-18 2012-11-06 Soraa, Inc. High pressure apparatus and method for nitride crystal growth
JP2010037185A (ja) * 2008-07-07 2010-02-18 Sumitomo Electric Ind Ltd GaN結晶基板およびその製造方法、半導体エピタキシャル層付GaN結晶基板、ならびに半導体デバイスおよびその製造方法
US8767787B1 (en) 2008-07-14 2014-07-01 Soraa Laser Diode, Inc. Integrated laser diodes with quality facets on GaN substrates
US8805134B1 (en) 2012-02-17 2014-08-12 Soraa Laser Diode, Inc. Methods and apparatus for photonic integration in non-polar and semi-polar oriented wave-guided optical devices
JP2010042976A (ja) * 2008-07-16 2010-02-25 Sumitomo Electric Ind Ltd GaN結晶の成長方法
WO2010017148A1 (en) 2008-08-04 2010-02-11 Soraa, Inc. White light devices using non-polar or semipolar gallium containing materials and phosphors
US8284810B1 (en) * 2008-08-04 2012-10-09 Soraa, Inc. Solid state laser device using a selected crystal orientation in non-polar or semi-polar GaN containing materials and methods
US8021481B2 (en) 2008-08-07 2011-09-20 Soraa, Inc. Process and apparatus for large-scale manufacturing of bulk monocrystalline gallium-containing nitride
US8430958B2 (en) 2008-08-07 2013-04-30 Soraa, Inc. Apparatus and method for seed crystal utilization in large-scale manufacturing of gallium nitride
US8323405B2 (en) * 2008-08-07 2012-12-04 Soraa, Inc. Process and apparatus for growing a crystalline gallium-containing nitride using an azide mineralizer
US20100031873A1 (en) * 2008-08-07 2010-02-11 Soraa, Inc. Basket process and apparatus for crystalline gallium-containing nitride
US8979999B2 (en) 2008-08-07 2015-03-17 Soraa, Inc. Process for large-scale ammonothermal manufacturing of gallium nitride boules
US10036099B2 (en) 2008-08-07 2018-07-31 Slt Technologies, Inc. Process for large-scale ammonothermal manufacturing of gallium nitride boules
US8148801B2 (en) 2008-08-25 2012-04-03 Soraa, Inc. Nitride crystal with removable surface layer and methods of manufacture
JP5104830B2 (ja) 2008-09-08 2012-12-19 住友電気工業株式会社 基板
US7976630B2 (en) 2008-09-11 2011-07-12 Soraa, Inc. Large-area seed for ammonothermal growth of bulk gallium nitride and method of manufacture
US8354679B1 (en) 2008-10-02 2013-01-15 Soraa, Inc. Microcavity light emitting diode method of manufacture
US8455894B1 (en) 2008-10-17 2013-06-04 Soraa, Inc. Photonic-crystal light emitting diode and method of manufacture
CN102239283A (zh) * 2008-12-02 2011-11-09 住友电气工业株式会社 生长氮化镓晶体的方法和制造氮化镓晶体的方法
US8987156B2 (en) 2008-12-12 2015-03-24 Soraa, Inc. Polycrystalline group III metal nitride with getter and method of making
US8878230B2 (en) 2010-03-11 2014-11-04 Soraa, Inc. Semi-insulating group III metal nitride and method of manufacture
USRE47114E1 (en) 2008-12-12 2018-11-06 Slt Technologies, Inc. Polycrystalline group III metal nitride with getter and method of making
US8461071B2 (en) 2008-12-12 2013-06-11 Soraa, Inc. Polycrystalline group III metal nitride with getter and method of making
US9543392B1 (en) 2008-12-12 2017-01-10 Soraa, Inc. Transparent group III metal nitride and method of manufacture
CN101504961B (zh) * 2008-12-16 2010-08-11 华中科技大学 面发射多色发光二极管及其制造方法
JP4333820B1 (ja) * 2009-01-19 2009-09-16 住友電気工業株式会社 化合物半導体基板
JP2009117875A (ja) * 2009-02-23 2009-05-28 Sharp Corp 窒化物半導体発光素子の製造方法
US8247886B1 (en) 2009-03-09 2012-08-21 Soraa, Inc. Polarization direction of optical devices using selected spatial configurations
US8299473B1 (en) 2009-04-07 2012-10-30 Soraa, Inc. Polarized white light devices using non-polar or semipolar gallium containing materials and transparent phosphors
US9531164B2 (en) * 2009-04-13 2016-12-27 Soraa Laser Diode, Inc. Optical device structure using GaN substrates for laser applications
US8837545B2 (en) 2009-04-13 2014-09-16 Soraa Laser Diode, Inc. Optical device structure using GaN substrates and growth structures for laser applications
US8634442B1 (en) 2009-04-13 2014-01-21 Soraa Laser Diode, Inc. Optical device structure using GaN substrates for laser applications
US8306081B1 (en) 2009-05-27 2012-11-06 Soraa, Inc. High indium containing InGaN substrates for long wavelength optical devices
US8791499B1 (en) 2009-05-27 2014-07-29 Soraa, Inc. GaN containing optical devices and method with ESD stability
JP4786730B2 (ja) * 2009-05-28 2011-10-05 シャープ株式会社 電界効果型トランジスタおよびその製造方法
US8509275B1 (en) 2009-05-29 2013-08-13 Soraa, Inc. Gallium nitride based laser dazzling device and method
US10108079B2 (en) 2009-05-29 2018-10-23 Soraa Laser Diode, Inc. Laser light source for a vehicle
US9800017B1 (en) 2009-05-29 2017-10-24 Soraa Laser Diode, Inc. Laser device and method for a vehicle
US8427590B2 (en) 2009-05-29 2013-04-23 Soraa, Inc. Laser based display method and system
US9250044B1 (en) 2009-05-29 2016-02-02 Soraa Laser Diode, Inc. Gallium and nitrogen containing laser diode dazzling devices and methods of use
US8247887B1 (en) 2009-05-29 2012-08-21 Soraa, Inc. Method and surface morphology of non-polar gallium nitride containing substrates
US9829780B2 (en) 2009-05-29 2017-11-28 Soraa Laser Diode, Inc. Laser light source for a vehicle
US9000466B1 (en) 2010-08-23 2015-04-07 Soraa, Inc. Methods and devices for light extraction from a group III-nitride volumetric LED using surface and sidewall roughening
US8750342B1 (en) 2011-09-09 2014-06-10 Soraa Laser Diode, Inc. Laser diodes with scribe structures
US8933644B2 (en) 2009-09-18 2015-01-13 Soraa, Inc. LED lamps with improved quality of light
US9583678B2 (en) 2009-09-18 2017-02-28 Soraa, Inc. High-performance LED fabrication
US9293667B2 (en) 2010-08-19 2016-03-22 Soraa, Inc. System and method for selected pump LEDs with multiple phosphors
US8435347B2 (en) 2009-09-29 2013-05-07 Soraa, Inc. High pressure apparatus with stackable rings
US9175418B2 (en) 2009-10-09 2015-11-03 Soraa, Inc. Method for synthesis of high quality large area bulk gallium based crystals
US8905588B2 (en) 2010-02-03 2014-12-09 Sorra, Inc. System and method for providing color light sources in proximity to predetermined wavelength conversion structures
US8740413B1 (en) 2010-02-03 2014-06-03 Soraa, Inc. System and method for providing color light sources in proximity to predetermined wavelength conversion structures
US10147850B1 (en) 2010-02-03 2018-12-04 Soraa, Inc. System and method for providing color light sources in proximity to predetermined wavelength conversion structures
US20110215348A1 (en) * 2010-02-03 2011-09-08 Soraa, Inc. Reflection Mode Package for Optical Devices Using Gallium and Nitrogen Containing Materials
JP5146697B2 (ja) * 2010-03-08 2013-02-20 住友電気工業株式会社 窒化物半導体
KR101039988B1 (ko) * 2010-03-09 2011-06-09 엘지이노텍 주식회사 발광 소자 및 그 제조방법
US8451876B1 (en) 2010-05-17 2013-05-28 Soraa, Inc. Method and system for providing bidirectional light sources with broad spectrum
US9564320B2 (en) 2010-06-18 2017-02-07 Soraa, Inc. Large area nitride crystal and method for making it
US8313964B2 (en) 2010-06-18 2012-11-20 Soraa, Inc. Singulation method and resulting device of thick gallium and nitrogen containing substrates
US8293551B2 (en) 2010-06-18 2012-10-23 Soraa, Inc. Gallium and nitrogen containing triangular or diamond-shaped configuration for optical devices
US9450143B2 (en) 2010-06-18 2016-09-20 Soraa, Inc. Gallium and nitrogen containing triangular or diamond-shaped configuration for optical devices
JP2012033708A (ja) * 2010-07-30 2012-02-16 Sumitomo Electric Ind Ltd 半導体装置の製造方法
US8729559B2 (en) 2010-10-13 2014-05-20 Soraa, Inc. Method of making bulk InGaN substrates and devices thereon
US8816319B1 (en) 2010-11-05 2014-08-26 Soraa Laser Diode, Inc. Method of strain engineering and related optical device using a gallium and nitrogen containing active region
US9048170B2 (en) 2010-11-09 2015-06-02 Soraa Laser Diode, Inc. Method of fabricating optical devices using laser treatment
US8110484B1 (en) 2010-11-19 2012-02-07 Sumitomo Electric Industries, Ltd. Conductive nitride semiconductor substrate and method for producing the same
WO2012090572A1 (ja) * 2010-12-27 2012-07-05 住友電気工業株式会社 炭化珪素基板、半導体装置、炭化珪素基板の製造方法、および半導体装置の製造方法
US9025635B2 (en) 2011-01-24 2015-05-05 Soraa Laser Diode, Inc. Laser package having multiple emitters configured on a support member
US9595813B2 (en) 2011-01-24 2017-03-14 Soraa Laser Diode, Inc. Laser package having multiple emitters configured on a substrate member
US8786053B2 (en) 2011-01-24 2014-07-22 Soraa, Inc. Gallium-nitride-on-handle substrate materials and devices and method of manufacture
US9093820B1 (en) 2011-01-25 2015-07-28 Soraa Laser Diode, Inc. Method and structure for laser devices using optical blocking regions
JP5632322B2 (ja) * 2011-03-31 2014-11-26 古河機械金属株式会社 窒化ガリウム系半導体の製造方法、及び、基板の製造方法
US9287684B2 (en) 2011-04-04 2016-03-15 Soraa Laser Diode, Inc. Laser package having multiple emitters with color wheel
TWI425666B (zh) * 2011-04-27 2014-02-01 Univ Nat Central Growth of semi - polarized nitrides
JP2012253123A (ja) * 2011-06-01 2012-12-20 Sumitomo Electric Ind Ltd Iii族窒化物半導体発光素子
CN102220640B (zh) * 2011-06-09 2013-03-27 青岛铝镓光电半导体有限公司 氮化镓单晶的制备方法
CN102299055A (zh) * 2011-06-13 2011-12-28 协鑫光电科技(张家港)有限公司 于蓝宝石衬底表面制作纳米球的方法
JP2013014450A (ja) 2011-07-01 2013-01-24 Hitachi Cable Ltd 窒化物半導体エピタキシャル基板及び窒化物半導体デバイス
US8492185B1 (en) 2011-07-14 2013-07-23 Soraa, Inc. Large area nonpolar or semipolar gallium and nitrogen containing substrate and resulting devices
US8686431B2 (en) 2011-08-22 2014-04-01 Soraa, Inc. Gallium and nitrogen containing trilateral configuration for optical devices
US8971370B1 (en) 2011-10-13 2015-03-03 Soraa Laser Diode, Inc. Laser devices using a semipolar plane
WO2013058352A1 (ja) * 2011-10-21 2013-04-25 三菱化学株式会社 Iii族窒化物半導体結晶
US9694158B2 (en) 2011-10-21 2017-07-04 Ahmad Mohamad Slim Torque for incrementally advancing a catheter during right heart catheterization
US10029955B1 (en) 2011-10-24 2018-07-24 Slt Technologies, Inc. Capsule for high pressure, high temperature processing of materials and methods of use
US8482104B2 (en) 2012-01-09 2013-07-09 Soraa, Inc. Method for growth of indium-containing nitride films
KR20130081956A (ko) * 2012-01-10 2013-07-18 삼성전자주식회사 질화물 반도체층 성장 방법
US9020003B1 (en) 2012-03-14 2015-04-28 Soraa Laser Diode, Inc. Group III-nitride laser diode grown on a semi-polar orientation of gallium and nitrogen containing substrates
JP5811009B2 (ja) * 2012-03-30 2015-11-11 豊田合成株式会社 Iii族窒化物半導体の製造方法及びiii族窒化物半導体
US10559939B1 (en) 2012-04-05 2020-02-11 Soraa Laser Diode, Inc. Facet on a gallium and nitrogen containing laser diode
US9800016B1 (en) 2012-04-05 2017-10-24 Soraa Laser Diode, Inc. Facet on a gallium and nitrogen containing laser diode
US9343871B1 (en) 2012-04-05 2016-05-17 Soraa Laser Diode, Inc. Facet on a gallium and nitrogen containing laser diode
US10145026B2 (en) * 2012-06-04 2018-12-04 Slt Technologies, Inc. Process for large-scale ammonothermal manufacturing of semipolar gallium nitride boules
US9099843B1 (en) 2012-07-19 2015-08-04 Soraa Laser Diode, Inc. High operating temperature laser diodes
US8971368B1 (en) 2012-08-16 2015-03-03 Soraa Laser Diode, Inc. Laser devices having a gallium and nitrogen containing semipolar surface orientation
US9978904B2 (en) * 2012-10-16 2018-05-22 Soraa, Inc. Indium gallium nitride light emitting devices
US9761763B2 (en) 2012-12-21 2017-09-12 Soraa, Inc. Dense-luminescent-materials-coated violet LEDs
US9312446B2 (en) * 2013-05-31 2016-04-12 Ngk Insulators, Ltd. Gallium nitride self-supported substrate, light-emitting device and manufacturing method therefor
JP6020357B2 (ja) 2013-05-31 2016-11-02 豊田合成株式会社 Iii族窒化物半導体の製造方法及びiii族窒化物半導体
US9419189B1 (en) 2013-11-04 2016-08-16 Soraa, Inc. Small LED source with high brightness and high efficiency
JP6384851B2 (ja) * 2014-03-03 2018-09-05 国立大学法人大阪大学 Iii族窒化物結晶の製造方法、iii族窒化物結晶、半導体装置およびiii族窒化物結晶製造装置
CN103862584B (zh) * 2014-04-04 2015-09-30 常州时创能源科技有限公司 太阳能电池用单晶硅圆棒的开方工艺及应用
CN105098015A (zh) * 2014-05-23 2015-11-25 惠州比亚迪实业有限公司 半导体层表面粗化方法及具有表面粗化的led结构形成方法
JP6344987B2 (ja) * 2014-06-11 2018-06-20 日本碍子株式会社 13族元素窒化物結晶層および機能素子
JP6405767B2 (ja) 2014-07-24 2018-10-17 住友電気工業株式会社 窒化ガリウム基板
JP6269368B2 (ja) * 2014-07-24 2018-01-31 住友電気工業株式会社 窒化ガリウム基板
US9246311B1 (en) 2014-11-06 2016-01-26 Soraa Laser Diode, Inc. Method of manufacture for an ultraviolet laser diode
CN107002283B (zh) 2014-12-01 2020-01-10 日本碍子株式会社 13族元素氮化物结晶基板及功能元件
WO2016093033A1 (ja) 2014-12-11 2016-06-16 日本碍子株式会社 13族元素窒化物結晶層および機能素子
JP6001124B2 (ja) * 2015-04-07 2016-10-05 住友化学株式会社 窒化物半導体エピタキシャル基板の製造方法、及び窒化物半導体デバイスの製造方法
CN106548972B (zh) * 2015-09-18 2019-02-26 胡兵 一种将半导体衬底主体与其上功能层进行分离的方法
US9787963B2 (en) 2015-10-08 2017-10-10 Soraa Laser Diode, Inc. Laser lighting having selective resolution
WO2017098756A1 (ja) 2015-12-11 2017-06-15 日本碍子株式会社 13族元素窒化物結晶基板および機能素子
JP6290321B2 (ja) * 2016-07-22 2018-03-07 住友化学株式会社 窒化物半導体エピタキシャル基板の製造方法、及び窒化物半導体デバイスの製造方法
FR3056825B1 (fr) * 2016-09-29 2019-04-26 Soitec Structure comprenant des ilots semi-conducteurs monocristallins, procede de fabrication d'une telle structure
US10693032B2 (en) * 2016-09-30 2020-06-23 Toyoda Gosei Co., Ltd. Method for producing Group III nitride semiconductor, seed substrate and Group III nitride semiconductor crystal
US10174438B2 (en) 2017-03-30 2019-01-08 Slt Technologies, Inc. Apparatus for high pressure reaction
CN107068813B (zh) * 2017-03-31 2019-03-08 西安电子科技大学 基于c面Al2O3衬底的c面Ⅲ族氮化物的发光二极管
CN107134512B (zh) * 2017-03-31 2019-03-08 西安电子科技大学 基于c面Al2O3衬底的N面Ⅲ族氮化物的发光二极管
CN107068812B (zh) * 2017-03-31 2019-02-19 西安电子科技大学 基于c面SiC衬底的c面Ⅲ族氮化物的发光二极管
DE102017108435A1 (de) * 2017-04-20 2018-10-25 Osram Opto Semiconductors Gmbh Halbleiterlaserdiode und Verfahren zur Herstellung einer Halbleiterlaserdiode
US10771155B2 (en) 2017-09-28 2020-09-08 Soraa Laser Diode, Inc. Intelligent visible light with a gallium and nitrogen containing laser source
US10222474B1 (en) 2017-12-13 2019-03-05 Soraa Laser Diode, Inc. Lidar systems including a gallium and nitrogen containing laser light source
US10551728B1 (en) 2018-04-10 2020-02-04 Soraa Laser Diode, Inc. Structured phosphors for dynamic lighting
JP7106217B2 (ja) * 2018-08-22 2022-07-26 株式会社ディスコ ファセット領域の検出方法及び検出装置
JP6657459B1 (ja) * 2018-12-14 2020-03-04 株式会社サイオクス 窒化物半導体基板の製造方法、および窒化物半導体基板
US11239637B2 (en) 2018-12-21 2022-02-01 Kyocera Sld Laser, Inc. Fiber delivered laser induced white light system
US11421843B2 (en) 2018-12-21 2022-08-23 Kyocera Sld Laser, Inc. Fiber-delivered laser-induced dynamic light system
US11466384B2 (en) 2019-01-08 2022-10-11 Slt Technologies, Inc. Method of forming a high quality group-III metal nitride boule or wafer using a patterned substrate
US11414782B2 (en) 2019-01-13 2022-08-16 Bing Hu Method of separating a film from a main body of a crystalline object
US11884202B2 (en) 2019-01-18 2024-01-30 Kyocera Sld Laser, Inc. Laser-based fiber-coupled white light system
US12000552B2 (en) 2019-01-18 2024-06-04 Kyocera Sld Laser, Inc. Laser-based fiber-coupled white light system for a vehicle
US12038396B2 (en) * 2019-11-01 2024-07-16 Mitsubishi Electric Corporation Crystal defect observation method for compound semiconductor
US11721549B2 (en) 2020-02-11 2023-08-08 Slt Technologies, Inc. Large area group III nitride crystals and substrates, methods of making, and methods of use
CN115104174A (zh) 2020-02-11 2022-09-23 Slt科技公司 改进的iii族氮化物衬底、制备方法和使用方法
US12091771B2 (en) 2020-02-11 2024-09-17 Slt Technologies, Inc. Large area group III nitride crystals and substrates, methods of making, and methods of use
JP6971415B1 (ja) * 2020-12-29 2021-11-24 京セラ株式会社 半導体基板、半導体基板の製造方法、半導体基板の製造装置、電子部品および電子機器
JP6986645B1 (ja) * 2020-12-29 2021-12-22 京セラ株式会社 半導体基板、半導体デバイス、電子機器

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS649008A (en) 1987-07-02 1989-01-12 Bridgestone Corp All-weather type pneumatic tire
JPH0864791A (ja) * 1994-08-23 1996-03-08 Matsushita Electric Ind Co Ltd エピタキシャル成長方法
US5693963A (en) * 1994-09-19 1997-12-02 Kabushiki Kaisha Toshiba Compound semiconductor device with nitride
JPH09298300A (ja) 1996-03-05 1997-11-18 Sony Corp 半導体装置の製造方法
JPH109008A (ja) 1996-06-20 1998-01-13 Mazda Motor Corp エンジンの制御装置
JPH10102546A (ja) 1996-09-30 1998-04-21 Yutani Heavy Ind Ltd 建設機械の油圧回路
JPH10112438A (ja) 1996-10-04 1998-04-28 Sony Corp p型窒化物系III−V族化合物半導体の成長方法
JP3139445B2 (ja) * 1997-03-13 2001-02-26 日本電気株式会社 GaN系半導体の成長方法およびGaN系半導体膜
JP3496512B2 (ja) * 1997-06-30 2004-02-16 日亜化学工業株式会社 窒化物半導体素子
EP1041610B1 (de) * 1997-10-30 2010-12-15 Sumitomo Electric Industries, Ltd. Gan einkristall-substrat und herstellungsmethode
US6091085A (en) * 1998-02-19 2000-07-18 Agilent Technologies, Inc. GaN LEDs with improved output coupling efficiency
US6265289B1 (en) * 1998-06-10 2001-07-24 North Carolina State University Methods of fabricating gallium nitride semiconductor layers by lateral growth from sidewalls into trenches, and gallium nitride semiconductor structures fabricated thereby
JP3788041B2 (ja) * 1998-06-30 2006-06-21 住友電気工業株式会社 GaN単結晶基板の製造方法
TW417315B (en) * 1998-06-18 2001-01-01 Sumitomo Electric Industries GaN single crystal substrate and its manufacture method of the same
JP3788037B2 (ja) * 1998-06-18 2006-06-21 住友電気工業株式会社 GaN単結晶基板
US6252261B1 (en) * 1998-09-30 2001-06-26 Nec Corporation GaN crystal film, a group III element nitride semiconductor wafer and a manufacturing process therefor
US6265322B1 (en) * 1999-09-21 2001-07-24 Agere Systems Guardian Corp. Selective growth process for group III-nitride-based semiconductors
JP4145437B2 (ja) 1999-09-28 2008-09-03 住友電気工業株式会社 単結晶GaNの結晶成長方法及び単結晶GaN基板の製造方法と単結晶GaN基板
US6812053B1 (en) * 1999-10-14 2004-11-02 Cree, Inc. Single step pendeo- and lateral epitaxial overgrowth of Group III-nitride epitaxial layers with Group III-nitride buffer layer and resulting structures
US6447604B1 (en) * 2000-03-13 2002-09-10 Advanced Technology Materials, Inc. Method for achieving improved epitaxy quality (surface texture and defect density) on free-standing (aluminum, indium, gallium) nitride ((al,in,ga)n) substrates for opto-electronic and electronic devices
JP2002314205A (ja) * 2001-04-19 2002-10-25 Sharp Corp 窒化物半導体発光素子ならびにそれを用いた光学装置および発光装置
US7303630B2 (en) 2003-11-05 2007-12-04 Sumitomo Electric Industries, Ltd. Method of growing GaN crystal, method of producing single crystal GaN substrate, and single crystal GaN substrate
JP3801125B2 (ja) * 2001-10-09 2006-07-26 住友電気工業株式会社 単結晶窒化ガリウム基板と単結晶窒化ガリウムの結晶成長方法および単結晶窒化ガリウム基板の製造方法
US7354477B2 (en) * 2001-10-09 2008-04-08 Sumitomo Electric Industries, Ltd. Method of growing GaN crystal, method of producing single crystal GaN substrate, and single crystal GaN substrate
JP3864870B2 (ja) * 2001-09-19 2007-01-10 住友電気工業株式会社 単結晶窒化ガリウム基板およびその成長方法並びにその製造方法
JP2003327497A (ja) * 2002-05-13 2003-11-19 Sumitomo Electric Ind Ltd GaN単結晶基板、窒化物系半導体エピタキシャル基板、窒化物系半導体素子及びその製造方法
WO2005018008A1 (ja) * 2003-08-19 2005-02-24 Nichia Corporation 半導体素子
JP2006193348A (ja) 2005-01-11 2006-07-27 Sumitomo Electric Ind Ltd Iii族窒化物半導体基板およびその製造方法
JP5082363B2 (ja) * 2005-12-28 2012-11-28 マツダ株式会社 エアバッグユニットを備えた車両用シート

Also Published As

Publication number Publication date
EP1304749B1 (de) 2008-08-20
US20080202409A1 (en) 2008-08-28
DE60236900D1 (de) 2010-08-12
EP1304749A1 (de) 2003-04-23
US20030145783A1 (en) 2003-08-07
JP3801125B2 (ja) 2006-07-26
JP2003183100A (ja) 2003-07-03
CN100435268C (zh) 2008-11-19
EP1995796B1 (de) 2010-06-30
US7087114B2 (en) 2006-08-08
EP2146384A1 (de) 2010-01-20
US7794543B2 (en) 2010-09-14
US7534310B2 (en) 2009-05-19
CA2406347A1 (en) 2003-04-09
CN1411035A (zh) 2003-04-16
CA2406347C (en) 2008-03-25
TWI234293B (en) 2005-06-11
US20060213429A1 (en) 2006-09-28
EP1995796A3 (de) 2009-02-18
EP1995796A2 (de) 2008-11-26
CA2670071A1 (en) 2003-04-09
KR100523619B1 (ko) 2005-10-24
KR20030030917A (ko) 2003-04-18
US20090071394A1 (en) 2009-03-19

Similar Documents

Publication Publication Date Title
DE60228378D1 (de) Verfahren zur Züchtung einkristallinen GaN und Verfahren zur Herstellung eines Substrates aus einkristallinem GaN und danach hergestelltes Substrat
DE60033610D1 (de) Verfahren zur Züchtung einkristallinen GaN und Verfahren zur Herstellung eines Substrates aus einkristallinem GaN und danach hergestelltes Substrat
DE60236396D1 (de) Einkristallines Substrat aus GaN, Verfahren zu ihrer Züchtung und zu ihrer Herstellung
DE60236470D1 (de) Halbleitersubstratvorrichtung und Verfahren zur Herstellung einer Halbleitervorrichtung
DE602004022002D1 (de) Verfahren zur Herstellung eines Galliumnitridsubstrats für Halbleiter und damit hergestelltes Substrats
DE60333559D1 (de) Substrat zum züchten von galliumnitrid, verfahren zur herstellung des substrats zum züchten von galliumnitrid und verfahren zur herstellung eines galliumnitridsubstrats
DE69937803D1 (de) Verfahren zur herstellung eines czochralski silizium wafers ohne sauerstoffniederschlag
DE60004722D1 (de) Verfahren zur Herstellung eines Gruppe III-Nitrid-Verbindungshalbleitersubstrats
DE602004014695D1 (de) Substrat-Haltesystem und Verfahren zur Herstellung einer Vorrichtung
DE602006003463D1 (de) Verfahren zur Herstellung von einkristallinem Diamantsubstrat und dadurch hergestelltes Substrat
DE69528611D1 (de) Verfahren zur Herstellung eines Halbleitersubstrates
DE69917752D1 (de) Verfahren zur herstellung eines pflanzenzuchtsubstrats aus mineralwolle, und damit erhaltenes substrat
DE69631233D1 (de) Verfahren zur Herstellung eines Halbleitersubstrats
DE50214957D1 (de) Verfahren zur Herstellung eines Trägermaterials für eine Spiegelschicht
DE60204502D1 (de) Polysiloxanharz und Verfahren zur Herstellung einer Zwischenschicht daraus für Wafer
DE60321734D1 (de) Verfahren zur Herstellung eines aus halbleitendem Siliziumkarbid-auf-Isolator Substrates (SOI) und Vorrichtung zur Durchführung des Verfahrens
DE60220112D1 (de) Verfahren und Zwischenprodukt zur Herstellung eines Tiegels aus Quarzglas
ATE522881T1 (de) Verfahren zur herstellung eines artikels mit mindestens einem siliziumchip
DE69923567D1 (de) Verfahren zur herstellung eines siliciumcarbidsinterkörpers
TWI317616B (en) Plant growing substrate and method of its manufacture
DE60211190D1 (de) Verfahren zur herstellung einer halbleiter-schichtstruktur und entsprechende struktur
DE50207724D1 (de) Verfahren zur Herstellung eines Halbleiterbauelementes sowie ein nach dem Verfahren hergestelltes Halbleiterbauelement
DE69919952D1 (de) Verfahren zur herstellung eines silizumeinkristalls und wafer aus siliziumeinkristall
DE60225135D1 (de) Verfahren zur herstellung eines halbleiterswafers
DE60230982D1 (de) Verfahren zur herstellung eines halbleiterbauelements

Legal Events

Date Code Title Description
8364 No opposition during term of opposition