TWI895115B - 顯示裝置 - Google Patents
顯示裝置Info
- Publication number
- TWI895115B TWI895115B TW113135706A TW113135706A TWI895115B TW I895115 B TWI895115 B TW I895115B TW 113135706 A TW113135706 A TW 113135706A TW 113135706 A TW113135706 A TW 113135706A TW I895115 B TWI895115 B TW I895115B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- oxide
- oxide semiconductor
- insulating layer
- film
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
- H10D30/6713—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
- H10D30/6756—Amorphous oxide semiconductors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
- H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
- H10D64/512—Disposition of the gate electrodes, e.g. buried gates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/62—Electrodes ohmically coupled to a semiconductor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
- H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/451—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by the compositions or shapes of the interlayer dielectrics
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/481—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs integrated with passive devices, e.g. auxiliary capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/6737—Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/6737—Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
- H10D30/6739—Conductor-insulator-semiconductor electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6741—Group IV materials, e.g. germanium or silicon carbide
- H10D30/6743—Silicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1216—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
Landscapes
- Thin Film Transistor (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
- Electrodes Of Semiconductors (AREA)
- Physical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009204801 | 2009-09-04 | ||
| JP2009-204801 | 2009-09-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202527716A TW202527716A (zh) | 2025-07-01 |
| TWI895115B true TWI895115B (zh) | 2025-08-21 |
Family
ID=43647003
Family Applications (10)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099128876A TWI524536B (zh) | 2009-09-04 | 2010-08-27 | 電晶體和顯示裝置 |
| TW112100910A TW202320349A (zh) | 2009-09-04 | 2010-08-27 | 顯示裝置 |
| TW104141712A TWI575758B (zh) | 2009-09-04 | 2010-08-27 | 電晶體和顯示裝置 |
| TW112148579A TWI890230B (zh) | 2009-09-04 | 2010-08-27 | 顯示裝置 |
| TW110142081A TW202211326A (zh) | 2009-09-04 | 2010-08-27 | 電晶體和顯示裝置 |
| TW108131728A TWI700836B (zh) | 2009-09-04 | 2010-08-27 | 電晶體和顯示裝置 |
| TW109123593A TWI747375B (zh) | 2009-09-04 | 2010-08-27 | 電晶體和顯示裝置 |
| TW105143626A TWI633673B (zh) | 2009-09-04 | 2010-08-27 | 電晶體和顯示裝置 |
| TW106135950A TW201804623A (zh) | 2009-09-04 | 2010-08-27 | 電晶體和顯示裝置 |
| TW113135706A TWI895115B (zh) | 2009-09-04 | 2010-08-27 | 顯示裝置 |
Family Applications Before (9)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099128876A TWI524536B (zh) | 2009-09-04 | 2010-08-27 | 電晶體和顯示裝置 |
| TW112100910A TW202320349A (zh) | 2009-09-04 | 2010-08-27 | 顯示裝置 |
| TW104141712A TWI575758B (zh) | 2009-09-04 | 2010-08-27 | 電晶體和顯示裝置 |
| TW112148579A TWI890230B (zh) | 2009-09-04 | 2010-08-27 | 顯示裝置 |
| TW110142081A TW202211326A (zh) | 2009-09-04 | 2010-08-27 | 電晶體和顯示裝置 |
| TW108131728A TWI700836B (zh) | 2009-09-04 | 2010-08-27 | 電晶體和顯示裝置 |
| TW109123593A TWI747375B (zh) | 2009-09-04 | 2010-08-27 | 電晶體和顯示裝置 |
| TW105143626A TWI633673B (zh) | 2009-09-04 | 2010-08-27 | 電晶體和顯示裝置 |
| TW106135950A TW201804623A (zh) | 2009-09-04 | 2010-08-27 | 電晶體和顯示裝置 |
Country Status (4)
| Country | Link |
|---|---|
| US (12) | US8389989B2 (enExample) |
| JP (11) | JP5649378B2 (enExample) |
| TW (10) | TWI524536B (enExample) |
| WO (1) | WO2011027656A1 (enExample) |
Families Citing this family (50)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5663214B2 (ja) * | 2009-07-03 | 2015-02-04 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| WO2011027701A1 (en) * | 2009-09-04 | 2011-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and method for manufacturing the same |
| WO2011027656A1 (en) * | 2009-09-04 | 2011-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Transistor and display device |
| KR20140054465A (ko) * | 2010-09-15 | 2014-05-08 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 표시 장치 |
| WO2012102281A1 (en) * | 2011-01-28 | 2012-08-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| CN103403850B (zh) * | 2011-03-01 | 2016-05-18 | 夏普株式会社 | 薄膜晶体管及其制造方法以及显示装置 |
| KR20120138074A (ko) * | 2011-06-14 | 2012-12-24 | 삼성디스플레이 주식회사 | 박막 트랜지스터, 및 박막 트랜지스터 표시판과 이들을 제조하는 방법 |
| WO2013042696A1 (en) * | 2011-09-23 | 2013-03-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| KR102071545B1 (ko) * | 2012-05-31 | 2020-01-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR20130136063A (ko) | 2012-06-04 | 2013-12-12 | 삼성디스플레이 주식회사 | 박막 트랜지스터, 이를 포함하는 박막 트랜지스터 표시판 및 그 제조 방법 |
| JP6134598B2 (ja) | 2012-08-02 | 2017-05-24 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| KR101991338B1 (ko) * | 2012-09-24 | 2019-06-20 | 엘지디스플레이 주식회사 | 박막트랜지스터 어레이 기판 및 그 제조방법 |
| KR102109166B1 (ko) | 2013-01-15 | 2020-05-12 | 삼성디스플레이 주식회사 | 박막 트랜지스터 및 이를 구비하는 표시 기판 |
| TWI615157B (zh) | 2013-02-06 | 2018-02-21 | 大塚製藥股份有限公司 | 包括不定形西洛他唑的固體分散劑 |
| KR102080065B1 (ko) | 2013-04-30 | 2020-04-07 | 엘지디스플레이 주식회사 | 박막 트랜지스터 어레이 기판 및 그 제조 방법 |
| JP6083053B2 (ja) * | 2013-05-29 | 2017-02-22 | 株式会社Joled | 薄膜トランジスタ装置とその製造方法、および表示装置 |
| JP6286988B2 (ja) * | 2013-09-26 | 2018-03-07 | 凸版印刷株式会社 | 薄膜トランジスタの製造方法 |
| KR102085099B1 (ko) * | 2013-10-15 | 2020-03-05 | 삼성디스플레이 주식회사 | 박막 트랜지스터 기판, 표시 장치 및 표시 장치의 제조 방법 |
| JP6506545B2 (ja) | 2013-12-27 | 2019-04-24 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| TWI560882B (en) | 2014-01-17 | 2016-12-01 | E Ink Holdings Inc | Semiconductor structure |
| JP6216668B2 (ja) * | 2014-03-17 | 2017-10-18 | 株式会社ジャパンディスプレイ | 表示装置の製造方法 |
| US9337030B2 (en) | 2014-03-26 | 2016-05-10 | Intermolecular, Inc. | Method to grow in-situ crystalline IGZO using co-sputtering targets |
| JP6722980B2 (ja) * | 2014-05-09 | 2020-07-15 | 株式会社半導体エネルギー研究所 | 表示装置および発光装置、並びに電子機器 |
| KR20150146409A (ko) * | 2014-06-20 | 2015-12-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치, 표시 장치, 입출력 장치, 및 전자 기기 |
| TWM493712U (zh) * | 2014-08-01 | 2015-01-11 | Superc Touch Corp | 具有遮罩功能的感應電極之生物辨識裝置 |
| CN104253159B (zh) * | 2014-08-19 | 2017-06-13 | 京东方科技集团股份有限公司 | 薄膜晶体管及制备方法、阵列基板及制备方法和显示装置 |
| JP6412791B2 (ja) | 2014-12-18 | 2018-10-24 | 株式会社ジャパンディスプレイ | 有機エレクトロルミネッセンス表示装置 |
| US9633710B2 (en) | 2015-01-23 | 2017-04-25 | Semiconductor Energy Laboratory Co., Ltd. | Method for operating semiconductor device |
| US10403646B2 (en) * | 2015-02-20 | 2019-09-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| KR102646460B1 (ko) * | 2015-07-24 | 2024-03-11 | 스미또모 가가꾸 가부시끼가이샤 | 조성물 및 표시 장치 |
| CN105046243B (zh) * | 2015-08-25 | 2019-12-20 | 业成光电(深圳)有限公司 | 显示装置 |
| US10340392B2 (en) * | 2015-09-24 | 2019-07-02 | Sharp Kabushiki Kaisha | Semiconductor device including mark portion and production method for same |
| JP6904730B2 (ja) | 2016-03-08 | 2021-07-21 | 株式会社半導体エネルギー研究所 | 撮像装置 |
| JP2018129430A (ja) * | 2017-02-09 | 2018-08-16 | 株式会社ジャパンディスプレイ | 半導体装置 |
| JP6844845B2 (ja) | 2017-05-31 | 2021-03-17 | 三国電子有限会社 | 表示装置 |
| TWI648581B (zh) * | 2018-01-24 | 2019-01-21 | 友達光電股份有限公司 | 畫素結構以及可切換顯示模式的驅動方法 |
| JP7190729B2 (ja) | 2018-08-31 | 2022-12-16 | 三国電子有限会社 | キャリア注入量制御電極を有する有機エレクトロルミネセンス素子 |
| JP7246681B2 (ja) | 2018-09-26 | 2023-03-28 | 三国電子有限会社 | トランジスタ及びトランジスタの製造方法、並びにトランジスタを含む表示装置 |
| JP7190740B2 (ja) | 2019-02-22 | 2022-12-16 | 三国電子有限会社 | エレクトロルミネセンス素子を有する表示装置 |
| TWI702457B (zh) * | 2019-04-23 | 2020-08-21 | 元太科技工業股份有限公司 | 反射式主動元件陣列基板及其製作方法與反射式顯示裝置及其製作方法 |
| US11379231B2 (en) | 2019-10-25 | 2022-07-05 | Semiconductor Energy Laboratory Co., Ltd. | Data processing system and operation method of data processing system |
| JP7444436B2 (ja) | 2020-02-05 | 2024-03-06 | 三国電子有限会社 | 液晶表示装置 |
| JP7387475B2 (ja) * | 2020-02-07 | 2023-11-28 | キオクシア株式会社 | 半導体装置及び半導体記憶装置 |
| TWI893073B (zh) | 2020-03-20 | 2025-08-11 | 日商半導體能源研究所股份有限公司 | 半導體裝置及半導體裝置的製造方法 |
| EP4191331B1 (en) | 2020-07-27 | 2025-08-27 | Sony Group Corporation | Imaging device for setting focus position |
| US11335775B2 (en) * | 2020-08-27 | 2022-05-17 | Micron Technology, Inc. | Integrated assemblies and methods of forming integrated assemblies |
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